JP5154921B2 - シリコン上に集積された高周波オプトエレクトロニク変調器 - Google Patents
シリコン上に集積された高周波オプトエレクトロニク変調器 Download PDFInfo
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- JP5154921B2 JP5154921B2 JP2007505588A JP2007505588A JP5154921B2 JP 5154921 B2 JP5154921 B2 JP 5154921B2 JP 2007505588 A JP2007505588 A JP 2007505588A JP 2007505588 A JP2007505588 A JP 2007505588A JP 5154921 B2 JP5154921 B2 JP 5154921B2
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 57
- 239000010703 silicon Substances 0.000 title claims abstract description 57
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 230000003287 optical effect Effects 0.000 claims abstract description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 47
- 229910021332 silicide Inorganic materials 0.000 claims description 4
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 239000000969 carrier Substances 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 238000005516 engineering process Methods 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 13
- 230000008859 change Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 238000000151 deposition Methods 0.000 description 8
- 239000002019 doping agent Substances 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 239000012212 insulator Substances 0.000 description 7
- 238000004377 microelectronic Methods 0.000 description 7
- 230000004044 response Effects 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
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- 238000013461 design Methods 0.000 description 4
- 238000000407 epitaxy Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
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- 239000012141 concentrate Substances 0.000 description 3
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- 230000005669 field effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000000038 ultrahigh vacuum chemical vapour deposition Methods 0.000 description 2
- ZXEYZECDXFPJRJ-UHFFFAOYSA-N $l^{3}-silane;platinum Chemical compound [SiH3].[Pt] ZXEYZECDXFPJRJ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005685 electric field effect Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910021334 nickel silicide Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000004038 photonic crystal Substances 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910021339 platinum silicide Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/015—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements having potential barriers, e.g. having a PN or PIN junction
- G02F1/025—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements having potential barriers, e.g. having a PN or PIN junction in an optical waveguide structure
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/06—Materials and properties dopant
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Semiconductor Lasers (AREA)
- Optical Integrated Circuits (AREA)
Description
・R. L. Espinola et al., Fast and low-power thermooptic switch on silicon-on-insulator, IEEE Phot.Techn.Lett., vol.15, October 2003, page 1366;
・A. Sciuto et al., Design, fabrication, and testing of an integrated Si-based light modulator, Journ. Lightwave Techn., vol.21, January 2003, page228;
・A. Irace et al., All-silicon optoelectronic modulator with 1 GHz switching capabilities, Electronics Letters, vol.39, January 2003, page 232;
・C. A. Barrios et al., Electrooptic modulation of silicon-on-insulator submicrometer-size waveguide devices, Journ. Lightwave Techn., vol.21, October 2003,page2332;および
・D. Marris et al., Design of a SiGe/Si quantum-well optical modulator, Journal of Selected Topics in Quantum Electronics,vol.9, May 2003,p.747。
・ 少量の電流を用い(逆バイアスダイオード)、従って低い熱放散を達成することを可能とする散逸による動作;
・ サブミクロン次元でのほぼ数ピコ秒程度の本質的に極めて高速である現象;
・ 自由キャリアの分布および光導波路のモード間の最適重なり、従ってより大きな感度;および
・ 相補形金属酸化膜半導体(CMOS)マイクロ電子集積回路の技術による最大適合性。
該活性領域は、N+型にドープまたはP+型にドープ(δドープ)された複数の極薄シリコン層により形成されており、N+ドープ領域およびP+ドープ領域の間に配置されており、これらN+ドープ領域およびP+ドープ領域はPINダイオードを形成し、該活性領域の両側に配置されていて該活性領域をバイアスすることを可能とすることを特徴とし、
更に、該オプトエレクトロニクス部品は、オールシリコンであり、キャリア散逸により動作することを特徴とする、
オプトエレクトロニクス部品を提供する。
・ P型ドーピング用のマスク、
・ n型ドーピング用のマスク、
・ シリカの蒸着、および
・ コンタクト部作製のための開口部(シリサイドおよび金属メッキを形成すること)。
Claims (9)
- SOI型基板中にリッジまたはリブ導波路と、活性領域とを含む、光信号を制御するためのオプトエレクトロニクス部品であって、
該活性領域は、すべてN+型にドープまたはすべてP+型にドープ(いずれもδドープ)された複数の極薄ドープシリコン層を含むシリコンにより形成されており、該活性領域はPINダイオードのN+ドープ領域およびP+ドープ領域の間に配置されており、該N+ドープ領域およびP+ドープ領域は該活性領域の両側に配置されていて該活性領域をバイアスすることを可能とすることを特徴とし、
更に、該オプトエレクトロニクス部品はキャリアの散逸による空乏化により動作し、該活性領域は全体が、シリコンおよびN+型またはP+型にドープされたシリコン中に形成されていることを特徴とする、
オプトエレクトロニクス部品。 - ドーピング面が基板に対して平行であることを特徴とする請求項1に記載のオプトエレクトロニクス部品。
- 上部電極が、マイクロ導波路のリッジまたはリブにより規定される活性領域に対して側面に沿って突き合わされることを特徴とする請求項2に記載のオプトエレクトロニクス部品。
- 第2電極が活性領域を超えて側方に延びる下部シリコンドープ層と接触することを特徴とする請求項2または3に記載のオプトエレクトロニクス部品。
- 二つの電極の少なくとも一つが、シリサイド層を介して(N+またはP+)ドープシリコン層と接触することを特徴とする請求項1〜4のいずれかに記載のオプトエレクトロニクス部品。
- ドーピング面が基板に対して垂直であることを特徴とする請求項1に記載のオプトエレクトロニクス部品。
- 極薄N+型ドープまたはP+型ドープ(いずれもδドーピング)されたシリコン層をエピタキシャル成長させることにより製造されることを特徴とする請求項1〜6のいずれかに記載のオプトエレクトロニクス部品。
- オプトエレクトロニク・スイッチの形成用の請求項1〜7のいずれかに記載のオプトエレクトロニクス部品。
- オプトエレクトロニク変調器の形成用の請求項1〜7のいずれかに記載のオプトエレクトロニクス部品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0450608A FR2868171B1 (fr) | 2004-03-29 | 2004-03-29 | Modulateur optoelectronique haute frequence integre sur silicium |
FR0450608 | 2004-03-29 | ||
PCT/FR2005/000748 WO2005093480A1 (fr) | 2004-03-29 | 2005-03-29 | Modulateur optoelectronique haute frequence integre sur silicium |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007531031A JP2007531031A (ja) | 2007-11-01 |
JP2007531031A5 JP2007531031A5 (ja) | 2008-03-27 |
JP5154921B2 true JP5154921B2 (ja) | 2013-02-27 |
Family
ID=34944281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007505588A Expired - Fee Related JP5154921B2 (ja) | 2004-03-29 | 2005-03-29 | シリコン上に集積された高周波オプトエレクトロニク変調器 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7657146B2 (ja) |
EP (1) | EP1730560B1 (ja) |
JP (1) | JP5154921B2 (ja) |
AT (1) | ATE384282T1 (ja) |
DE (1) | DE602005004392T2 (ja) |
FR (1) | FR2868171B1 (ja) |
WO (1) | WO2005093480A1 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5265929B2 (ja) * | 2008-01-10 | 2013-08-14 | Nttエレクトロニクス株式会社 | 半導体光変調器及び光変調装置 |
FR2935845B1 (fr) | 2008-09-05 | 2010-09-10 | Centre Nat Rech Scient | Cavite optique amplificatrice de type fabry-perot |
FR2937427B1 (fr) | 2008-10-17 | 2011-03-04 | Commissariat Energie Atomique | Procede de fabrication d'un modulateur electro-optique lateral sur silicium a zones implantees auto-alignees |
FR2943802B1 (fr) * | 2009-03-24 | 2011-09-30 | Univ Paris Sud | Modulateur optique a haut debit en semi-conducteur sur isolant |
US8548281B2 (en) * | 2009-09-08 | 2013-10-01 | Electronics And Telecommunications Research Institute | Electro-optic modulating device |
KR101453473B1 (ko) | 2009-09-08 | 2014-10-24 | 한국전자통신연구원 | 전기-광학 변조 소자 |
FR2950708B1 (fr) | 2009-09-29 | 2012-03-09 | Univ Paris Sud | Modulateur optique compact a haut debit en semi-conducteur sur isolant. |
JP5633224B2 (ja) * | 2010-07-22 | 2014-12-03 | 富士通株式会社 | 光半導体装置及びその駆動方法 |
JP5577909B2 (ja) * | 2010-07-22 | 2014-08-27 | 富士通株式会社 | 光半導体装置及びその製造方法 |
JP6209843B2 (ja) * | 2013-03-29 | 2017-10-11 | 住友電気工業株式会社 | 半導体変調器を作製する方法、半導体変調器 |
JP6236947B2 (ja) * | 2013-07-16 | 2017-11-29 | 住友電気工業株式会社 | 半導体光素子を製造する方法、および半導体光素子 |
US9766484B2 (en) * | 2014-01-24 | 2017-09-19 | Cisco Technology, Inc. | Electro-optical modulator using waveguides with overlapping ridges |
GB2566781B (en) * | 2015-11-12 | 2020-06-03 | Rockley Photonics Ltd | An optoelectronic component |
EP3507649B1 (en) * | 2016-09-01 | 2023-11-01 | Luxtera, Inc. | Method and system for a vertical junction high-speed phase modulator |
WO2018100157A1 (en) * | 2016-12-02 | 2018-06-07 | Rockley Photonics Limited | Waveguide optoelectronic device |
US9798166B1 (en) * | 2017-01-24 | 2017-10-24 | Mellanox Technologies Silicon Photonics Inc. | Attenuator with improved fabrication consistency |
US10739622B2 (en) * | 2018-12-28 | 2020-08-11 | Juniper Networks, Inc. | Integrated optoelectronic device with heater |
CN112201714A (zh) * | 2020-09-28 | 2021-01-08 | 三明学院 | 一种探测器及制作工艺 |
US20220357603A1 (en) * | 2021-05-06 | 2022-11-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Waveguide having doped pillar structures to improve modulator efficiency |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4974044A (en) * | 1989-04-21 | 1990-11-27 | At&T Bell Laboratories | Devices having asymmetric delta-doping |
US4997246A (en) * | 1989-12-21 | 1991-03-05 | International Business Machines Corporation | Silicon-based rib waveguide optical modulator |
EP1107044A1 (en) * | 1999-11-30 | 2001-06-13 | Hitachi Europe Limited | Photonic device |
JP2001274511A (ja) * | 2000-03-28 | 2001-10-05 | Toshiba Corp | 導波路型光素子 |
JP4547765B2 (ja) * | 2000-03-30 | 2010-09-22 | 三菱電機株式会社 | 光変調器及び光変調器付半導体レーザ装置、並びに光通信装置 |
JP4828018B2 (ja) * | 2000-11-06 | 2011-11-30 | 三菱電機株式会社 | 光変調器およびその製造方法並びに光半導体装置 |
WO2002069004A2 (en) | 2001-02-22 | 2002-09-06 | Bookham Technology Plc | Semiconductor optical waveguide device |
-
2004
- 2004-03-29 FR FR0450608A patent/FR2868171B1/fr not_active Expired - Fee Related
-
2005
- 2005-03-29 DE DE602005004392T patent/DE602005004392T2/de active Active
- 2005-03-29 WO PCT/FR2005/000748 patent/WO2005093480A1/fr active IP Right Grant
- 2005-03-29 US US11/547,550 patent/US7657146B2/en active Active
- 2005-03-29 AT AT05744257T patent/ATE384282T1/de not_active IP Right Cessation
- 2005-03-29 EP EP05744257A patent/EP1730560B1/fr not_active Not-in-force
- 2005-03-29 JP JP2007505588A patent/JP5154921B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2868171B1 (fr) | 2006-09-15 |
JP2007531031A (ja) | 2007-11-01 |
WO2005093480A1 (fr) | 2005-10-06 |
US7657146B2 (en) | 2010-02-02 |
ATE384282T1 (de) | 2008-02-15 |
US20080260320A1 (en) | 2008-10-23 |
DE602005004392D1 (de) | 2008-03-06 |
FR2868171A1 (fr) | 2005-09-30 |
EP1730560A1 (fr) | 2006-12-13 |
DE602005004392T2 (de) | 2009-01-15 |
EP1730560B1 (fr) | 2008-01-16 |
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