JP5150639B2 - 励起性材料サンプルの電気的性質を検出するための装置及び方法 - Google Patents
励起性材料サンプルの電気的性質を検出するための装置及び方法 Download PDFInfo
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- JP5150639B2 JP5150639B2 JP2009535004A JP2009535004A JP5150639B2 JP 5150639 B2 JP5150639 B2 JP 5150639B2 JP 2009535004 A JP2009535004 A JP 2009535004A JP 2009535004 A JP2009535004 A JP 2009535004A JP 5150639 B2 JP5150639 B2 JP 5150639B2
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- 238000000034 method Methods 0.000 title claims description 11
- 239000000463 material Substances 0.000 title abstract description 15
- 230000005284 excitation Effects 0.000 claims abstract description 43
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 4
- 239000010703 silicon Substances 0.000 claims abstract description 4
- 238000001514 detection method Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 47
- 239000002800 charge carrier Substances 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 10
- 230000007547 defect Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 238000012876 topography Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/265—Contactless testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2648—Characterising semiconductor materials
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N22/00—Investigating or analysing materials by the use of microwaves or radio waves, i.e. electromagnetic waves with a wavelength of one millimetre or more
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/265—Contactless testing
- G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
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- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
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- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Description
Claims (8)
- シリコンウェハサンプルの電気的性質をトポグラフィ検出するための装置であって、
a.マイクロ波場を発生するための、マイクロ波源(6)と、
b.マイクロ波を伝達するようにマイクロ波源(6)に結合された共振システム(2)であって、
i.マイクロ波共振器、及び
ii.測定されるべきサンプルを備えて構成される、共振システム(2)と、
c.サンプルの、制御された電気的な励起のために当該サンプルの周りに配置された、少なくとも一つの励起源(3)と、
d.共振システム(2)の少なくとも一つの物理的パラメーターを測定するための、測定装置(5)とを備えて構成され、
e.前記マイクロ波共振器が、空洞(21)を備えた空洞共振器(20)であること、
f.前記空洞共振器(20)は一つの開口部(26)を備えており、当該開口部の外側且つ前面にサンプルが配置されることを特徴とする、装置。 - マイクロ波を吸収する誘電体(18)が、開口部(26)から離れたサンプルの側に配置されることを特徴とする、請求項1に記載の装置。
- マイクロ波反射体(19)が、開口部(26)から離れたサンプルの側に配置されることを特徴とする、請求項1又は2に記載の装置。
- 少なくとも一つの励起源(3)がパルス状に作動されることを特徴とする、請求項1〜3のいずれか一項に記載の装置。
- 幾つかの励起源(3)が設けられることを特徴とする、請求項1〜4のいずれか一項に記載の装置。
- 励起源(3)が連続して作動されることを特徴とする、請求項5に記載の装置。
- サンプルと空洞共振器(20)とが、中央縦軸(22)に垂直な面内で互いに移動可能であることを特徴とする、請求項1〜6のいずれか一項に記載の装置。
- シリコンウェハ(27)サンプルの、電気的性質のトポグラフィ検出をするための方法であって、以下の工程、
a.次のi〜ivを備える工程であって、
i.調整可能なマイクロ波源(6)と、
ii.マイクロ波源(6)と調整可能に結合された共振システム(2)であって、マイクロ波共振器とサンプルとを備えて構成される、共振システム(2)と、
iii.サンプルの周りに配置された、少なくとも一つの励起源(3)と、
iv.測定装置(5)とを備える工程と、
b.マイクロ波源(6)によって共振システム(2)内にマイクロ波場を発生する工程と、
c.マイクロ波場の振動数を、非励起状態のサンプルにおける共鳴システム(2)の共振振動数に合わせる工程と、
d.共鳴システム(2)の結合をマイクロ波源(6)に、当該結合が反射されないように合わせる工程と、
e.サンプルの局所的な励起工程と、
f.測定装置(5)による、共振システム(2)の少なくとも一つの物理的パラメーターの、励起によって誘発された変化を時間分解検出する工程とからなり、
g.前記マイクロ波共振器が、空洞(21)を備えた空洞共振器(20)であり、
h.前記空洞共振器(20)は一つの開口部(26)を備えており、当該開口部の外側且つ前面にサンプルが配置される、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006051577.3 | 2006-11-03 | ||
DE102006051577A DE102006051577B4 (de) | 2006-11-03 | 2006-11-03 | Vorrichtung und Verfahren zur Erfassung elektrischer Eigenschaften einer Probe aus einem anregbaren Material |
PCT/EP2007/008907 WO2008052648A1 (de) | 2006-11-03 | 2007-10-13 | Vorrichtung und verfahren zur erfassung elektrischer eigenschaften einer probe aus einem anregbaren material |
Publications (2)
Publication Number | Publication Date |
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JP2010508526A JP2010508526A (ja) | 2010-03-18 |
JP5150639B2 true JP5150639B2 (ja) | 2013-02-20 |
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JP2009535004A Expired - Fee Related JP5150639B2 (ja) | 2006-11-03 | 2007-10-13 | 励起性材料サンプルの電気的性質を検出するための装置及び方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8330472B2 (ja) |
EP (1) | EP2097761B1 (ja) |
JP (1) | JP5150639B2 (ja) |
KR (1) | KR101059042B1 (ja) |
AT (1) | ATE459006T1 (ja) |
DE (2) | DE102006051577B4 (ja) |
ES (1) | ES2338608T3 (ja) |
WO (1) | WO2008052648A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US8400166B2 (en) * | 2009-04-29 | 2013-03-19 | The Boeing Company | Non-destructive determination of electromagnetic properties |
US9601651B2 (en) * | 2013-06-21 | 2017-03-21 | Muehlbauer GmbH & Co. KG | Method and apparatus for manufacturing a solar module strand and a solar module strand of flexible solar cells |
GB2528667A (en) * | 2014-07-25 | 2016-02-03 | Sec Dep For Business Innovation & Skills | Measurement technique for thin-film characterization |
GB201618380D0 (en) * | 2016-10-31 | 2016-12-14 | Heriot-Watt Univ | Sensor system for detection of material properties |
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FR2334266A1 (fr) * | 1975-12-05 | 1977-07-01 | Cgr Mev | Dispositif d'alimentation hyperfrequence a frequence controlee pour accelerateur lineaire utilisant des sections acceleratrices a ondes stationnaires |
US4296215A (en) | 1978-07-27 | 1981-10-20 | Ici Americas Inc. | Method to thicken dissolved thermoset resins |
US4286215A (en) | 1979-05-18 | 1981-08-25 | Bell Telephone Laboratories, Incorporated | Method and apparatus for the contactless monitoring carrier lifetime in semiconductor materials |
DE3407850A1 (de) | 1984-02-29 | 1985-09-05 | Hahn-Meitner-Institut für Kernforschung Berlin GmbH, 1000 Berlin | Mikrowellen-messverfahren und -messapparatur zur kontaktlosen und zerstoerungsfreien untersuchung photoempfindlicher materialien |
HU196262B (en) * | 1986-03-17 | 1988-10-28 | Mta Mueszaki Fiz Kutato Inteze | Method for testing electrically active impuritles in semiconductor materials and structures and measuring arrangement for implementing method |
JPS63145951A (ja) * | 1986-12-09 | 1988-06-18 | Daipoole:Kk | 糸状材料の物性量測定装置 |
US5138255A (en) | 1989-03-20 | 1992-08-11 | Semitex Co., Ltd. | Method and apparatus for measuring lifetime of semiconductor material including waveguide tuning means |
HUT63497A (en) | 1990-12-17 | 1993-08-30 | Semilab Felvezetoe Fiz Lab Rt | Method and apparatus for measuring minority charge carrier in semiconductor material |
JP3121938B2 (ja) * | 1992-05-14 | 2001-01-09 | 株式会社神戸製鋼所 | 半導体ウエハの少数キャリアのライフタイム測定装置 |
JPH07105427B2 (ja) | 1992-10-19 | 1995-11-13 | 学校法人幾徳学園 | 半導体材料のライフタイム評価方法とその装置 |
JP3124413B2 (ja) * | 1993-06-17 | 2001-01-15 | 株式会社神戸製鋼所 | 半導体ウエハの少数キャリアのライフタイム測定装置 |
US7550963B1 (en) * | 1996-09-20 | 2009-06-23 | The Regents Of The University Of California | Analytical scanning evanescent microwave microscope and control stage |
JPH11312719A (ja) | 1997-10-10 | 1999-11-09 | Komatsu Electronic Metals Co Ltd | Czシリコンウェハ中の鉄汚染の検出方法 |
US6100703A (en) * | 1998-07-08 | 2000-08-08 | Yissum Research Development Company Of The University Of Jerusalum | Polarization-sensitive near-field microwave microscope |
JP4518680B2 (ja) | 2001-01-30 | 2010-08-04 | 京セラ株式会社 | 誘電定数測定法 |
DE10297055T5 (de) * | 2001-07-25 | 2004-07-29 | MCW Research Foundation, Inc., Milwaukee | Hohlraum für EPR Spektroskopie, aufweisend ein axial gleichförmiges Feld |
JP2007519000A (ja) * | 2004-01-26 | 2007-07-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | オンチップ磁気共鳴分光法のための方法及びデバイス |
JP2006196621A (ja) * | 2005-01-12 | 2006-07-27 | Sharp Corp | ライフタイム測定装置およびライフタイム測定方法 |
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2006
- 2006-11-03 DE DE102006051577A patent/DE102006051577B4/de not_active Expired - Fee Related
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2007
- 2007-10-13 DE DE502007002968T patent/DE502007002968D1/de active Active
- 2007-10-13 EP EP07818978A patent/EP2097761B1/de not_active Not-in-force
- 2007-10-13 KR KR1020097011497A patent/KR101059042B1/ko not_active IP Right Cessation
- 2007-10-13 WO PCT/EP2007/008907 patent/WO2008052648A1/de active Application Filing
- 2007-10-13 JP JP2009535004A patent/JP5150639B2/ja not_active Expired - Fee Related
- 2007-10-13 US US12/513,200 patent/US8330472B2/en active Active
- 2007-10-13 AT AT07818978T patent/ATE459006T1/de active
- 2007-10-13 ES ES07818978T patent/ES2338608T3/es active Active
Also Published As
Publication number | Publication date |
---|---|
WO2008052648A1 (de) | 2008-05-08 |
US20100141271A1 (en) | 2010-06-10 |
KR101059042B1 (ko) | 2011-08-24 |
KR20090092791A (ko) | 2009-09-01 |
US8330472B2 (en) | 2012-12-11 |
DE502007002968D1 (de) | 2010-04-08 |
ES2338608T3 (es) | 2010-05-10 |
EP2097761A1 (de) | 2009-09-09 |
EP2097761B1 (de) | 2010-02-24 |
DE102006051577B4 (de) | 2011-07-21 |
JP2010508526A (ja) | 2010-03-18 |
DE102006051577A1 (de) | 2008-05-08 |
ATE459006T1 (de) | 2010-03-15 |
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