JP5143716B2 - Method for supplying moisture-curing hot melt adhesive - Google Patents

Description

The present invention relates to a supply how the moisture-curable hot melt adhesive which cures by moisture and chemical reactions in air.

As a conventional method for supplying a moisture-curable hot melt adhesive, the moisture-reactive hot melt adhesive in a moisture-proof bag is heated together with the moisture-proof bag to be in a molten state, and the moisture-reactive hot that has become a molten state is used. The lower part of the moisture-proof bag of the melt adhesive is cut on the heat-retaining tank, and the moisture-reactive hot-melt adhesive is stored in the heat-retaining tank while being kept warm. When adhering, a moisture-reactive hot melt adhesive stored in the heat retaining tank is supplied to the application head (for example, see Patent Document 1).
JP 2007-685 A

  The conventional method of supplying a moisture-curable hot melt adhesive as described above heats the solid moisture-curable hot melt adhesive (hereinafter referred to as an adhesive) together with the bag, and is simply packaged in a moisture-proof bag. Since the adhesive is melted in units of bags and the adhesive is melted more than necessary, the melted adhesive may remain in the heat retaining tank. The remaining adhesive may be cured by reacting with the air that enters when a new adhesive is supplied to the heat retaining tank. The cured adhesive narrows the space in the heat insulation tank part, and also clogs the inside of the hose and the pipe connecting the heat insulation tank part and the application head, and there is a possibility that the apparatus for supplying the adhesive may not be used. There are challenges.

The present invention has been made in view of these problems, it is an object of providing a supply how the moisture-curable hot-melt adhesive which can be used without waste by melting by an amount to be used There is to do.

In order to achieve this object, the method of supplying the moisture-curable hot melt adhesive of the present invention is partitioned by a heating plate that can heat and melt the solid moisture-curable hot melt adhesive. A solid adhesive containing portion formed on the upper side, and a molten adhesive containing portion for keeping the molten and moisture-curable hot melt adhesive formed on the lower side of the heating plate in a molten state. The heating plate communicates with a communication hole provided in the heating plate, and the heating plate and the molten adhesive container can be individually heated, and the packaging material to be airtightly wrapped is opened to expose a part. successively heated to melt a portion of the solid moisture-curable hot-melt adhesive was the exposed and placed on the heating plate from the site that has the exposed by abutting on the heating plate, From the communication hole to the molten adhesive container Off to the moisture-curable hot-melt adhesive wherein the melted, a method of supplying moisture-curable hot-melt adhesive and supplying to the adhesive discharge port for discharging to the site to be bonded.

  According to such a moisture curable hot melt adhesive, the solid moisture curable hot melt adhesive is heated and melted sequentially from the exposed part of the packaging material, which is hermetically packaged. The unexposed part is not heated and is kept in a packaged state in a solid state. For this reason, it is possible to melt as much as necessary for use, and the moisture-curable hot melt adhesive does not remain in a melted state without being packaged. Is not cured by contact with air, and can be prevented from being wasted.

In addition , when the exposed portion of the solid moisture-curable hot melt adhesive is melted by the heating plate, it flows into the molten adhesive container through the communication hole, so that the molten moisture-curable hot melt adhesive is melted. Can be quickly allowed to flow into the molten adhesive container without leaving the solid adhesive container on the side of the solid adhesive container.
In this moisture curing type hot melt adhesive supply method, the heating plate stops heating prior to the molten adhesive container, and the molten adhesive container includes the molten moisture curing hot It is desirable to stop heating after the melt adhesive is no longer discharged from the adhesive discharge port.

In this moisture curing type hot melt adhesive supply method, the packaging material is a thin film sheet laminated in multiple layers with an aluminum foil and a resin sheet, and the solid moisture curing type hot melt adhesive is It is desirable that the thin film sheet is vacuum packaged.
If the packaging material is made of resin sheet only, moisture may penetrate, but as mentioned above, the packaging material is a thin film sheet laminated in multiple layers with aluminum foil and resin sheet. It is hard to penetrate air and moisture, is strong and difficult to break, and easily deforms, so it is hard to damage during transportation and reliably blocks moisture, etc., solid moisture-curing hot melt adhesive It can be deformed according to the remaining amount of the agent.

A method for supplying such a moisture-curable hot melt adhesive, wherein the solid moisture-curable hot melt adhesive is pressed from above in a state of being placed in contact with the heating plate. It is desirable that the moisture-curable hot melt adhesive is extruded from the packaging material by melting the moisture-curable hot melt adhesive with the heating plate.
According to such a method of supplying the moisture curable hot melt adhesive, since the solid moisture curable hot melt adhesive is pressed from above in a state of being placed in contact with the heating plate. It is possible to sequentially melt the solid moisture-curing hot melt adhesive. Further, it is possible to maintain a gap between the heating plate and the solid moisture-curing hot melt adhesive.

In this method of supplying a moisture curable hot melt adhesive, it is desirable that an inert gas is supplied into the solid adhesive container.
According to such a supply method of the moisture curable hot melt adhesive, since the inert gas is supplied to the solid adhesive container, for example, a new moisture curable hot melt adhesive is bonded to the solid adhesive. Even when air enters the solid adhesive container, for example, when it is supplied to the agent container, the reaction between the moisture contained in the air and the moisture-curable hot melt adhesive can be suppressed and prevented from curing. Is possible.

In this method of supplying a moisture-curable hot melt adhesive, a portion of the heating plate that contacts the moisture-curable hot melt adhesive has a predetermined shape, and the packaging material has the predetermined shape. Preferably, the bottom member and the hollow peripheral member are joined to form a bag shape.
According to such a method of supplying a moisture curable hot melt adhesive, the moisture curable hot melt adhesive is packaged in a shape that matches the shape of the heating plate to which the moisture curable hot melt adhesive is heated. It is possible to supply.

In this moisture curing type hot melt adhesive supply method, the packaging material is filled with the moisture curing type hot melt adhesive having fluidity while being supported by the support member having the predetermined shape. It is desirable.
According to such a method of supplying a moisture curable hot melt adhesive, since the packaging material is supported by a support member having a predetermined shape, the moisture curable hot melt adhesive having fluidity is filled. The moisture curable hot melt adhesive filled in the packaging material is formed into a predetermined shape by the support member, and the moisture curable hot melt adhesive is supplied in a state suitable for the shape of the heating plate. It is possible.

In this moisture curing type hot melt adhesive supplying method, it is desirable that the predetermined shape is a circular shape.
According to such a supply method of the moisture curable hot melt adhesive, the heat from the heating plate acts almost evenly, so that the moisture curable hot melt adhesive is melted almost uniformly from the lower end side in a well-balanced manner. Is possible.

In this moisture curable hot melt adhesive supply method, it is preferable that the support member is a packaging material when the packaged moisture curable hot melt adhesive is conveyed.
According to such a method of supplying the moisture curable hot melt adhesive, since the support member also serves as the packaging material, the moisture curable hot melt packaged from the support member after packaging the moisture curable hot melt adhesive. It is not necessary to take out the melt adhesive, and it is not necessary to separately pack the packaged moisture-curable hot melt adhesive, and it can be transported as it is. For this reason, it is possible to improve the efficiency of work from manufacture to conveyance.

In this moisture curing type hot melt adhesive supplying method, it is preferable that the support member is made of cardboard or cardboard.
According to such a moisture curing type hot melt adhesive supply method, since the supporting member is cardboard or corrugated cardboard, it is inexpensive, can be used as a cushioning material and has higher rigidity than mere paper. .

According to the present invention, it is possible to provide a supply how amounts by melting can be used without waste moisture-curable hot-melt adhesive used.

Hereinafter will be described with reference to the drawings attached to supply how the moisture-curable hot-melt adhesive according to an embodiment of the present invention.

  First, an outline of an example of a supply device for a moisture curable hot melt adhesive (hereinafter referred to as an adhesive) suitable for the method for supplying a moisture curable hot melt adhesive according to the present invention will be described.

As shown in FIG. 1, the supply device 1 for the adhesive 5 according to the present embodiment has a cylindrical shape with an open top and a storage portion 10 having a bottom portion 10 a and a predetermined space for partitioning the storage portion 10 into two upper and lower spaces. A heating plate 20 having a circular shape as a shape, a disk-shaped jig plate 24 in contact with the lower surface side of the heating plate 20, and an opening 10 b opened at the upper portion of the housing portion 10. Nitrogen gas (N ₂ gas) as an inert gas communicated with the press portion 30 that is closed and movable in the vertical direction while maintaining airtightness, and the solid adhesive accommodating portion 16 that is the upper space in the accommodating portion 10. ) To the solid adhesive container 16, the exhaust part 38 for discharging the internal gas, and the molten adhesive container 18 serving as a lower space in the container 10. Contact for discharging the adhesive 5 to the site to be bonded. And an adhesive supply section 40 for supplying to an adhesive discharge port (not shown).

  The accommodating portion 10 has a cylindrical shape with an inner diameter of 280 mm to 290 mm, and one end of an adhesive supply portion 40 that supplies the adhesive discharge port is connected to the bottom portion 10a. Although the inside of the accommodating part 10 is one space, by providing the heating plate 20, the upper side of the heating plate 20 becomes the solid adhesive accommodating part 16, and the lower side of the heating plate 20 is connected with the molten adhesive accommodating part 18. Become.

  The heating plate 20 is disposed on the lower side of the housing portion 10 and includes a plurality of communication holes 22 that communicate the solid adhesive housing portion 16 formed on the upper side with the molten adhesive housing portion 18 formed on the lower side. Have. The communication hole 22 is a path through which the solid adhesive 5 placed on and in contact with the heating plate 20 in the solid adhesive container 16 melts and flows out to the molten adhesive container 18. An example of the communication hole 22 is a through hole having a diameter of 20 mm to 50 mm (most preferably 30 mm), and 10 to 15 (preferably 13) are formed in the heating plate 20.

  The disk-shaped jig plate 24 has an outer diameter substantially the same as that of the heating plate 20 and is not blocked by the adhesive 5 even if the solid adhesive 5 is placed on the heating plate 20. The communication hole 22 is formed so as to close the heating plate 20 on the lower side. That is, an opening (not shown) is provided in a portion of the plurality of communication holes 22 formed in the heating plate 20 that overlaps with the communication hole 22 closed by the solid adhesive 5. The part which overlaps with the communication hole 22 which is not blocked by the shaped adhesive 5 is formed flat. For this reason, when the solid adhesive 5 on the heating plate 20 is melted in a state where the heating plate 20 and the disk-shaped jig plate 24 are overlapped, the molten adhesive accommodating portion 18 passes through the communication hole 22. The adhesive 5 that has been melted and stored in the melted adhesive container 18 is prevented from flowing back to the solid adhesive container 16 side.

  The press part 30 is a disk-shaped member that closes the opening 10b at the top of the storage part 10, and is formed so that the outer peripheral part can move up and down in the storage part 10 while being in airtight contact with the inner periphery of the storage part 10. ing. A pressing force can be applied to the press part 30 from above to below, and the solid adhesive 5 placed on the heating plate 20 in the solid adhesive accommodating part 16 is applied from above. It is possible to press to press against the heating plate 20. Moreover, by removing the press part 30 from the accommodating part 10, the upper part of the solid adhesive accommodating part 16 is open | released and the solid adhesive 5 can be inserted.

The gas inflow portion 36 is inactivated for suppressing the reaction between the moisture contained in the air flowing into the solid adhesive accommodating portion 16 and the adhesive 5 when the press portion 30 is removed from the accommodating portion 10. For example, nitrogen (N ₂ ) gas is used as a gas to flow into the solid adhesive container 16.

  The exhaust unit 38 is a path for discharging the gas pushed out by the nitrogen gas flowing in from the gas inflow unit 36 or discharging the gas pushed out by the downward movement of the press unit 30.

  The adhesive supply unit 40 is connected to the supply device 1 and has an adhesive discharge port. For example, the adhesive supply unit 40 supplies the adhesive 5 to an adhesive application device that applies the adhesive 5 to an object to be bonded. It consists of pipes and hoses.

  In such an adhesive 5 supply device 1, the heating plate 20 is maintained at 80 ° C. to 110 ° C. (most preferably 95 ° C.), and the molten adhesive container 18 is 110 ° C. to 120 ° C. (most preferably 110 ° C.). ).

  The adhesive 5 used in the adhesive supply apparatus 1 is a solid moisture-curable hot melt in which a 2 to 3 kg adhesive is formed in a substantially cylindrical shape with a diameter of 40 mm to 60 mm (most preferably 50 mm). It is an adhesive. Since the diameter of the formed cylinder of the adhesive 5 is sufficiently smaller than the inner diameter of the accommodating part 10, it is possible to arrange a plurality of adhesives 5 in the solid adhesive accommodating part 16 at a time. . Such a solid adhesive 5 is vacuum-packaged with a packaging material 7 which is a thin film sheet 6 laminated in multiple layers with an aluminum foil and a resin sheet. The solid adhesive 5 may be packaged with a packaging material 7 that is the thin film sheet 6 filled with nitrogen gas. Here, as the moisture curable hot melt adhesive 5, for example, (1) Kreiberit Japan Co., Ltd. (adhesive manufactured by KLEIBERIT Inc., Germany), a moisture curable reactive urethane hot melt adhesive, trade name 707 .5 (VP9333 / 438) (2) Adhesive manufactured by Hitachi Chemical Co., Ltd., UV combined reactive hot melt adhesive, trade name Hybon 4882.

  As shown in FIG. 2, the adhesive 5 suitable for the supply device 1 for the adhesive 5 is formed in a cylindrical shape as a hollow shape and a peripheral end portion of a circular bottom member 7a as a predetermined shape. The peripheral member 7b thus formed is joined to be filled into a cylindrical bag-like packaging material 7, and the upper surface and the lower surface are packaged in a substantially cylindrical shape having a substantially flat surface.

  The manufacturing method of the adhesive 5 packaged in this way is as follows. First, two wide thin film sheets 6 laminated in multiple layers with an aluminum foil and a resin sheet are stacked so that the aluminum foil faces each other. The both side portions are heat-sealed and cut at a predetermined length to form a hollow peripheral member 7b. At this time, when the hollow portion is widened and formed into a circular shape, the inner diameter thereof is formed so as to have a desired diameter as the adhesive 5 supplied to the housing portion 10.

  Next, a circular bottom member 7a formed of the thin film sheet 6 is placed on a columnar mold base 60 having a horizontal cross section that is circular (the predetermined shape of the present embodiment). For example, the mold base 60 is formed sufficiently smaller than the inner diameter of the solid adhesive container 16 so that a plurality of adhesives 5 can be arranged in the solid adhesive container 16, and the upper surface part is slightly curved. It is formed on a spherical surface. Further, the outer diameter of the bottom member 7 a is formed to be approximately the same as the outer diameter of the mold base 60.

  Next, the mold table 60 on which the bottom member 7a is placed is inserted into the hollow portion of the circumferential member 7b so as to cover the circumferential surface of the mold table 60 with the inner surface of the hollow portion. At this time, it arrange | positions so that the edge of one opening part 7c of the circumferential member 7b may be located above the bottom member 7a.

  In a state where the mold base 60 is inserted into the peripheral member 7b, the upper end portion of the peripheral member 7b is overlapped with the peripheral end portion 7d of the bottom member 7a while being bent inward over the entire periphery, and the bottom portion is heat sealed. The peripheral end 7d of the material 7a and the opening 7c of the peripheral member 7b are joined to form a cylindrical bag-like packaging material 7 (packaging material manufacturing process).

  The manufactured packaging material 7 is removed from the mold base 60, and is supported by the support member 62 so that the bottom member 7a faces down. Here, the support member 62 is a hollow cylindrical member having a circular horizontal cross section, and is formed of cardboard. Further, the inner diameter of the support member 62 is formed to be approximately the same as the outer diameter of the cylindrical packaging material 7 filled with the adhesive 5, and the outer peripheral surface of the packaging material 7 is the inner surface of the support member 62. The packaging material 7 is supported by the support member 62 by being stacked so as to be in contact with the peripheral surface.

  The adhesive 5 having fluidity that is heated and melted is poured into the opening 7c that is directed upward of the packaging material 7 supported by the support member 62, and a predetermined amount is filled (filling step). At this time, the packaging material 7 is pressed outward by the poured adhesive 5, and the outward spread is regulated by the support member 62 provided on the outside of the packaging material 7. It is formed into a cylindrical shape and filled into a cylindrical shape.

  After the packaging material 7 is filled with a predetermined amount of the adhesive 5, the packaging material 7 is sealed by heat sealing so that the packaging material 7 is hermetically sealed to complete the packaging 5. Material sealing process). The packaged adhesive 5 is naturally cooled and solidified while maintaining the state formed in the support member 62.

  Thereafter, the support member 62 used when the adhesive 5 is filled in the packaging material 7 is used as a packaging material for the packaged adhesive 5, and the packaged adhesive 5 is taken out from the support member 62. It is conveyed without.

  When the packaged adhesive 5 is disposed in the solid adhesive container 16 of the supply device 1, as shown in FIG. 3, a cylindrical outer frame jig 50 having upper and lower ends opened, A cylindrical press auxiliary member 56 that has an outer shape slightly smaller than the inner diameter of the frame jig 50 and is movable in the outer frame jig 50 is used.

  The outer frame jig 50 covers the side periphery of the solid adhesive 5 wrapped in the packaging material 7 and has an inner diameter substantially the same as the outer shape of the packaged solid adhesive 5. For this reason, the packaged solid adhesive 5 is accommodated in the outer frame jig 50 in a state of being in close contact with the inner periphery of the outer frame jig 50. The outer frame jig 50 is used to prevent the packaging material 7 from being broken or the shape of the adhesive 5 from being collapsed when a pressing force is applied to the packaged solid adhesive 5 by the press unit 30. Is done.

The auxiliary pressing member 56 has substantially the same outer shape as the packaged solid adhesive 5 and is placed above the solid adhesive 5 accommodated in the outer frame jig 50. For this reason, when the solid adhesive 5 accommodated in the outer frame jig 50 is placed on the heating plate 20, the pressing force by the press unit 30 that presses from above is solid via the press auxiliary member 56. Acting on the adhesive 5.
And the supply method of the adhesive agent 5 supplies nitrogen gas in the solid adhesive agent accommodating part 16 first.

  Next, the lower end of the packaged adhesive 5, that is, the packaging material 7 on the lower surface 5 a that comes into contact with the heating plate 20 when being placed in the solid adhesive container 16 is removed, and as a part of the adhesive 5 The lower surface 5a is exposed.

  The solid adhesive 5 with the lower surface 5 a exposed is inserted into the outer frame jig 50, the press part 30 that closes the opening 10 b on the upper part of the accommodating part 10 is removed, and the adhesive 5 is accommodated on the heating plate 20. The outer frame jig 50 is placed. In the case of using a plurality of adhesives 5 at the same time, the adhesives 5 to be used are similarly opened on the heating plate 20 by opening the lower surface 5a and storing them in the outer frame jig 50.

  Then, press auxiliary members 56 are respectively arranged on the plurality of adhesives 5 placed on the heating plate 20, and the press auxiliary members 56 are pressed by the press unit 30. At this time, the pressing force (pressing pressure) is set to 1 to 2 bar (most preferably 1 bar).

  Thereafter, the heating plate 20 is heated to, for example, 95 ° C., and the molten adhesive container 18 is heated to 110 ° C., so that the solid adhesive 5 is sequentially melted and melted from the lower surface 5a exposed by the heat of the heating plate 20. Then, the adhesive 5 flows into the molten adhesive container 18 through the communication hole 22 and is supplied to the adhesive application device or the like through the adhesive supply unit 40.

  Further, when the heating of the heating plate 20 is stopped and the heating plate 20 is cooled, the melting of the adhesive 5 is stopped. At this time, the molten adhesive 5 remains in the molten adhesive container 18, but the molten adhesive 5 is used after that by keeping the molten adhesive container 18 in a heated state. It is possible. Moreover, if only heating of the heating plate 20 is stopped in advance before the bonding work is completed, it is possible to use the adhesive without leaving the adhesive 5 in the molten adhesive container 18 and finish the work. It is. At this time, the adhesive 5 remaining in the solid adhesive container 16 is naturally not melted, the lower surface 5a is in contact with the heating plate 20, and the portions other than the lower surface 5a remain packaged. Furthermore, since the inert adhesive gas is filled in the solid adhesive container 16, it can be stored as it is until the next use.

  In the above embodiment, the case where the solid adhesive 5 has an outer shape that is sufficiently smaller than the inner diameter of the housing portion 10 has been described. However, for example, the outer shape of the solid adhesive 5 is substantially the same as the inner diameter of the housing portion 10. In some cases, as shown in FIG. 4, the outer frame jig 50 and the pressing auxiliary member 56 may not be used.

  When the outer shape of the solid adhesive 5 is substantially the same as the inner diameter of the storage unit 10, the solid adhesive 5 is stored so as to be in close contact with the inner periphery of the storage unit 10. For this reason, it is not necessary to use the outer frame jig 50 and the press auxiliary member 56, and the adhesive 5 is directly pressed by the press unit 30. Further, since the communication holes 22 provided in the heating plate 20 are all closed by the solid adhesive 5, the disk-shaped jig plate 24 is not provided. At this time, the solid adhesive 5 used is 10 kg to 20 kg, the temperature of the heating plate 20 is maintained at 90 ° C. to 120 ° C. (most preferably 100 ° C.), and the inside of the molten adhesive accommodating portion 18 is maintained. The temperature is controlled to be maintained at 110 ° C. to 120 ° C. (most preferably 110 ° C.). Moreover, the pressing force (pressing force) by the press part 30 is set to 2-3 bar (most preferably 2 bar).

  According to the moisture curing type hot melt adhesive supply method of the present embodiment, the exposed lower surface 5a is heated by opening the packaging material 7 in which the solid moisture curing type hot melt adhesive 5 is airtightly packaged. Therefore, the unexposed portion is not heated and remains in a solid packaged state. For this reason, it is possible to melt as much as necessary for use, and since the molten moisture-curing hot melt adhesive 5 does not remain, it is not cured by touching air and is consumed wastefully. Can be prevented.

  Further, when the exposed portion of the solid moisture-curable hot melt adhesive 5 is melted by the heating plate 20, it flows into the molten adhesive container 18 through the communication hole 22, so that the molten moisture-curable adhesive is melted. Without leaving the hot melt adhesive 5 on the solid adhesive container 16 side, it is possible to promptly flow into the molten adhesive container 18.

  Further, since the solid moisture-curing hot melt adhesive 5 is packaged in a packaging material 7 of a thin film sheet 6 laminated in a multilayer with an aluminum foil and a resin sheet, it is formed only of a resin sheet. Air and moisture do not penetrate like packaging materials, and it is strong and resistant to tearing, and is easily deformed. The moisture-curing hot melt adhesive 5 can be deformed according to the remaining amount.

  In addition, since the solid moisture-curable hot melt adhesive 5 is pressed from above in a state where it is placed in contact with the heating plate 20, the solid moisture-curable hot melt adhesive 5 is It can be melted sequentially. Further, it is possible to maintain a gap between the heating plate 20 and the solid moisture-curing hot melt adhesive 5.

In addition, since N ₂ gas as an inert gas is supplied to the solid adhesive container 16, for example, when supplying a new moisture-curable hot melt adhesive 5 to the solid adhesive container 16. Even if air enters the solid adhesive container 16, the reaction between the moisture contained in the air and the moisture-curing hot melt adhesive 5 can be suppressed and cured.

  Further, when the bottom member 7a of the packaging material 7 of the moisture curable hot melt adhesive 5 is matched to the shape of the heating plate 20 to be heated, the packaging material 7 is simply filled and packaged according to the shape of the heating plate 20. It is possible to supply the moisture curable hot melt adhesive 5 in a state.

  Further, in a state where it is supported by a support member 62 having a horizontal cross section of the same shape as the bottom member 7a of the cylindrical packaging material 7, the moisture-curable hot melt adhesive 5 having fluidity is filled and packaged. Since the moisture curable hot melt adhesive 5 is manufactured, the shape of the moisture curable hot melt adhesive 5 filled in the packaging material 7 is formed into a cylindrical shape by the support member 62. For this reason, it is possible to supply the moisture-curable hot-melt adhesive 5 in a state where it is packaged in a shape matched with the shape of the heating plate 20.

  Further, since the moisture curable hot melt adhesive 5 is cylindrical, the heat from the heating plate 20 acts almost evenly, and the moisture curable hot melt adhesive 5 can be melted in a well-balanced manner. .

  Further, since the support member 62 used in manufacturing the packaged moisture curable hot melt adhesive 5 becomes a packaging material when the packaged moisture curable hot melt adhesive 5 is conveyed, the moisture curable type is used. After the hot melt adhesive 5 is packaged, it can be transported as it is without being separately packed, and can be efficiently manufactured and transported. Further, since the support member 62 is made of corrugated cardboard, the support member 62 is inexpensive, has higher rigidity than mere paper, and can also serve as a buffer material.

  In the above embodiment, the shape of the solid adhesive 5 is a cylindrical shape. However, the shape is not limited to this, and may be, for example, a quadrangular prism shape or a triangular prism shape. In this case, it is necessary to change the shapes of the housing portion, the outer frame jig, the pressing auxiliary member, and the like according to the shape of the adhesive.

  Moreover, although the example which exposed the lower surface 5a was demonstrated when exposing a part of the packaged adhesive agent 5, it is not restricted to this. For example, when the solid adhesive container and the molten adhesive container are arranged in parallel in the horizontal direction and the heating plate is provided vertically, the heating plate is brought into contact with the side of the packaging material. A part may be exposed and pressed from the side.

  Moreover, the said embodiment is for making an understanding of this invention easy, and is not for limiting and interpreting this invention. The present invention can be changed and improved without departing from the gist thereof, and it is needless to say that the present invention includes equivalents thereof.

It is a figure for demonstrating an example of the supply method of the moisture hardening type hot melt adhesive which concerns on this invention. It is a figure for demonstrating an example of the manufacturing method of the packaged moisture hardening type hot melt adhesive which concerns on this invention. It is a figure for demonstrating the state of the moisture hardening type hot-melt-adhesive fuse | melted in a solid adhesive agent accommodating part. It is a figure for demonstrating the modification of the supply method of the moisture hardening type hot melt adhesive which concerns on this invention.

Explanation of symbols

1 adhesive supply device, 5 adhesive, 5a bottom surface, 6 thin film sheet,
7 packaging material, 7a bottom member, 7b peripheral member, 7c opening, 7d peripheral end,
10 accommodating portion, 16 solid adhesive accommodating portion, 18 molten adhesive accommodating portion,
20 heating plate, 22 communication hole, 62 support member

Claims (10)

A solid adhesive container formed on the upper side of the heating plate that is partitioned by a heating plate capable of heating and melting a solid moisture-curable hot melt adhesive, and formed on the lower side of the heating plate. A molten adhesive container for maintaining the molten moisture curable hot melt adhesive in a molten state, and communicated with a communication hole provided in the heating plate;
The heating plate and the molten adhesive container can be heated individually,
It is brought into contact with the heating plate portion which has the exposed and placed on the heating plate to the solid moisture-curable hot-melt adhesive to expose part opened packaging material for packaging in an airtight To sequentially heat and melt the exposed portion from the exposed portion, and to discharge the molten moisture-curable hot melt adhesive flowing into the molten adhesive container from the communication hole to the portion to be bonded. A method for supplying a moisture-curable hot-melt adhesive, characterized in that it is supplied to an adhesive discharge port.   It is a supply method of the moisture hardening type hot melt adhesive according to claim 1,
  The heating plate stops heating before the molten adhesive container,
  The method for supplying a moisture curable hot melt adhesive, wherein the molten adhesive container stops heating after the melted moisture curable hot melt adhesive is no longer discharged from the adhesive discharge port. . It is a supply method of the moisture hardening type hot melt adhesive according to claim 1 or 2,
The packaging material is a thin film sheet laminated in multiple layers with an aluminum foil and a resin sheet, and the solid moisture-curing hot melt adhesive is vacuum packaged with the thin film sheet. To supply moisture-curing hot melt adhesive. A preceding claims the method of supplying the moisture-curable hot-melt adhesive according to claim 3,
The solid moisture curable hot melt adhesive is pressed from above in a state of being placed in contact with the heating plate, and the moisture curable hot melt adhesive is applied to the heating plate. A method for supplying a moisture curable hot melt adhesive, wherein the moisture curable hot melt adhesive is extruded from the packaging material by being melted. A preceding claims the method of supplying the moisture-curable hot-melt adhesive according to claim 4,
A method for supplying a moisture-curable hot melt adhesive, wherein an inert gas is supplied into the solid adhesive container. A preceding claims the method of supplying the moisture-curable hot-melt adhesive according to claim 5,
The portion of the heating plate that comes into contact with the moisture-curable hot melt adhesive has a predetermined shape,
The method of supplying a moisture-curable hot melt adhesive, wherein the packaging material is formed into a bag shape by joining the bottom member having a predetermined shape and a hollow peripheral member. It is a supply method of the moisture hardening type hot-melt-adhesive of Claim 6, Comprising:
The packaging material is filled with the moisture-curable hot melt adhesive having fluidity in a state where the packaging material is supported by the support member having the predetermined shape. . It is a supply method of the moisture hardening type hot melt adhesive according to claim 6 or 7,
The method for supplying a moisture-curable hot melt adhesive, wherein the predetermined shape is a circular shape. A method for supplying the moisture-curable hot melt adhesive according to claim 7 or 8,
The method of supplying a moisture curable hot melt adhesive, wherein the support member is a packaging material when the packaged moisture curable hot melt adhesive is conveyed. A method for supplying a moisture-curable hot melt adhesive according to any one of claims 7 to 9,
The method for supplying a moisture-curable hot melt adhesive, wherein the support member is made of cardboard or cardboard.

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