JP5141161B2 - Waste liquid treatment equipment - Google Patents

Description

  The present invention relates to a waste liquid treatment apparatus and a joint pipe for treating a waste liquid from a semiconductor manufacturing apparatus using a chemical solution. In particular, the present invention relates to a waste liquid treatment apparatus and a joint pipe that can suppress a reduction in the operating rate of a semiconductor manufacturing apparatus due to measures against clogging of pipes.

FIG. 12 is a schematic view for explaining the configuration of a conventional waste liquid treatment apparatus. The waste liquid treatment apparatus shown in this figure includes a waste liquid treatment tank 210 that treats waste liquid (for example, waste liquid containing hydrofluoric acid and phosphoric acid) discharged from a semiconductor manufacturing facility with a chemical liquid (for example, a slaked lime aqueous solution), A chemical solution circulation pipe 212 that takes out the chemical solution from the chemical solution tank 220 and circulates it outside and then returns it to the chemical solution tank 220. 214. A pump 212 a is attached to the chemical solution circulation pipe 212, and a valve 215 is provided in the chemical solution introduction pipe 214. The pump 212a is always operating, and the chemical solution is constantly circulated. Thereby, it can suppress to some extent that the component of a chemical | medical solution precipitates in the chemical | medical solution circulation pipe 212, and a pipe | tube is blocked. The valve 215 is opened when a chemical solution needs to be supplied to the waste liquid treatment tank 210, and is closed in other cases.
For example, Patent Document 1 describes the removal of fluoride ions from wastewater using a chemical solution containing a calcium source.

JP 2001-113284 A (second and third paragraphs)

  In the conventional configuration described above, if the waste liquid treatment device is used continuously for a long period of time, the chemical solution components will be deposited in the pipe through which the chemical liquid flows. It needs to be replaced. Since it is necessary to stop the waste liquid treatment apparatus for a long time in order to replace all the pipes, it is necessary to stop the semiconductor manufacturing equipment during the replacement work. As a result, the operating rate of the semiconductor manufacturing apparatus decreases.

  In addition, although deposits are also attached to the chemical solution supply port of the waste liquid treatment tank, the chemical solution supply port is integral with the waste liquid treatment layer and cannot be replaced, so the deposit attached to the chemical solution supply port must be removed. However, since it takes time to remove the precipitate, the operating rate of the semiconductor manufacturing apparatus decreases as a result.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a waste liquid treatment apparatus and a joint pipe that can suppress a reduction in the operating rate of a semiconductor manufacturing apparatus due to measures against clogging of pipes. is there.

In order to solve the above problems, a waste liquid treatment apparatus according to the present invention includes a waste liquid treatment tank for treating waste liquid,
A chemical tank holding the chemical,
A first chemical solution circulation path for returning the chemical solution held by the chemical solution tank to the chemical solution tank after being circulated outside the chemical solution tank;
A second chemical solution circulation path for returning the chemical solution held by the chemical solution tank to the chemical solution tank after circulating the chemical solution outside the chemical solution tank;
A first chemical solution introduction path connected to the first chemical solution circulation path and supplying the chemical liquid flowing through the first chemical solution circulation path to the waste liquid treatment tank;
A second chemical solution introduction path connected to the second chemical solution circulation path and supplying the chemical liquid flowing through the second chemical solution circulation path to the waste liquid treatment tank;
A cleaning liquid tank holding a cleaning liquid for cleaning the first and second chemical liquid circulation paths;
A first cleaning liquid supply path for introducing the cleaning liquid held by the cleaning liquid tank into the first chemical liquid circulation path;
A second cleaning liquid supply path for introducing the cleaning liquid held by the cleaning liquid tank into the second chemical liquid circulation path;
Connected to the first chemical liquid circulation path, connected to the first chemical liquid circulation path for discharging the cleaning liquid supplied to the first chemical liquid circulation path, and to the second chemical liquid circulation path, the second chemical liquid A second cleaning liquid discharge path for discharging the cleaning liquid supplied to the circulation path;
It comprises.

According to this waste liquid treatment apparatus, while the chemical liquid is being supplied from the second chemical liquid circulation path to the waste liquid treatment tank via the first chemical liquid introduction path, the first cleaning liquid supply path is used. The cleaning liquid can be introduced into the first chemical liquid circulation path to clean the first chemical liquid circulation path.
Further, while the chemical liquid is being supplied from the first chemical liquid circulation path to the waste liquid treatment tank via the second chemical liquid introduction path, the second chemical liquid circulation is performed using the second cleaning liquid introduction path. The cleaning liquid can be introduced into the path to clean the second chemical liquid circulation path.
For this reason, the part which needs replacement | exchange reduces, the time which stops operation | movement of a waste-liquid processing apparatus in the case of replacement | exchange becomes short, and can suppress that the operation rate of a semiconductor manufacturing apparatus falls as a result.

A waste liquid treatment apparatus according to the present invention includes a waste liquid treatment tank for treating a waste liquid,
A downstream end connected to the waste liquid treatment tank, and a supply pipe for supplying a chemical solution for treating the waste liquid into the waste liquid treatment tank;
A chemical tank holding the chemical,
A chemical extraction pipe whose upstream end is connected to the chemical tank;
A chemical return pipe whose downstream end is connected to the chemical tank;
A first chemical liquid circulation pipe having an upstream end connected to a downstream end of the chemical extraction pipe, and a downstream end connected to an upstream end of the chemical return pipe;
Provided in parallel with the first chemical liquid circulation pipe, the upstream end is connected to the downstream end of the chemical extraction pipe, and the downstream end is connected to the upstream end of the chemical return pipe A second chemical liquid circulation pipe to be connected;
A first chemical liquid introduction pipe having an upstream end connected to the first chemical circulation pipe and a downstream end connected to the supply pipe;
A second chemical liquid introduction pipe having an upstream end connected to the second chemical circulation pipe and a downstream end connected to the supply pipe;
A cleaning liquid tank for holding a cleaning liquid for cleaning the first and second chemical liquid circulation pipes and the first and second chemical liquid introduction pipes;
An upstream end of the cleaning liquid connected to the cleaning liquid tank;
The upstream end is connected to the downstream end of the cleaning liquid take-out pipe, and the downstream end is upstream of the connection with the first chemical introduction pipe in the first chemical circulation pipe. A first cleaning liquid supply pipe connected to the portion;
The upstream end is connected to the downstream end of the cleaning liquid extraction pipe, and the downstream end is upstream of the connection with the second chemical introduction pipe in the second chemical circulation pipe. A second cleaning liquid supply pipe connected to the portion;
An end on the upstream side is connected to a portion of the first chemical solution circulation pipe that is downstream of the connection portion with the first chemical solution introduction pipe, and the cleaning liquid supplied to the first chemical solution circulation pipe is discharged. An upstream end is connected to a portion of the second chemical liquid circulation pipe that is downstream of a branching portion of the second chemical liquid circulation pipe and the second chemical liquid introduction pipe, and the second chemical liquid circulation pipe A second cleaning liquid discharge pipe for discharging the cleaning liquid supplied to
A first valve provided in the first chemical liquid circulation pipe and positioned upstream from the connection with the first cleaning liquid supply pipe;
A second valve provided in the second chemical liquid circulation pipe and located upstream from the connection portion with the second cleaning liquid supply pipe;
A third valve provided in the first chemical circulation pipe and located downstream from the connection with the first cleaning liquid discharge pipe;
A fourth valve provided in the second chemical liquid circulation pipe and located on the downstream side of the connection with the second cleaning liquid discharge pipe;
A fifth valve provided in the first chemical solution introduction pipe;
A sixth valve provided in the second chemical liquid introduction pipe;
A seventh valve provided in the first cleaning liquid supply pipe;
An eighth valve provided in the second cleaning liquid supply pipe;
A ninth valve provided in the first cleaning liquid discharge pipe;
A tenth valve provided in the second cleaning liquid discharge pipe.

According to this waste liquid treatment apparatus, while the chemical liquid is being supplied from the second chemical liquid circulation pipe to the waste liquid treatment tank via the first chemical liquid introduction pipe, the first cleaning liquid supply pipe is used. The cleaning liquid can be introduced into the first chemical liquid circulation pipe. Accordingly, each of the first chemical liquid circulation pipe between the first valve and the third valve and the first chemical liquid introduction pipe upstream of the fifth valve. The deposited deposit can be removed.
Further, while the chemical liquid is being supplied from the first chemical liquid circulation pipe to the waste liquid treatment tank via the second chemical liquid introduction pipe, the second chemical liquid circulation is performed using the second cleaning liquid introduction pipe. The cleaning liquid can be introduced into the tube. Accordingly, each of the second chemical liquid circulation pipe between the second valve and the fourth valve and the second chemical liquid introduction pipe upstream of the sixth valve. The deposited deposit can be removed.
Therefore, the parts that need to be replaced are the part between the upstream side of the first valve, the part of the second valve and the upstream side, the part of the third valve and the downstream side, and the fourth part. And a portion downstream of the fifth valve, a portion downstream of the fifth valve, and a portion downstream of the sixth valve. For this reason, in order to replace these parts, the time for stopping the operation of the waste liquid treatment apparatus is shortened, and as a result, it is possible to suppress a reduction in the operating rate of the semiconductor manufacturing apparatus.

A joint pipe connecting the supply pipe and the waste liquid treatment tank, and attached to the joint pipe, extending from the end of the joint pipe on the waste liquid treatment tank side into the waste liquid treatment tank, and a tip of the waste liquid treatment tank An insertion tube may be provided that is flush with the inner wall or located inside the waste liquid treatment tank from the inner wall.
In this case, precipitates do not adhere to the connection portion between the joints on the inner wall of the waste liquid treatment tank, and instead deposits adhere to the inner wall of the insertion tube. The insertion tube can be replaced by replacing the joint tube. Accordingly, it is possible to further suppress the time for stopping the operation of the waste liquid treatment apparatus due to the measures against clogging of the pipe, and to suppress the reduction in the operating rate of the semiconductor manufacturing apparatus.

Another waste liquid treatment apparatus according to the present invention includes a waste liquid treatment tank for treating waste liquid,
A first inlet and a second inlet that are provided in the waste liquid treatment tank and introduce a chemical for treating the waste liquid into the waste liquid treatment tank;
A chemical tank holding the chemical,
A first chemical liquid circulation pipe and a second chemical liquid circulation pipe which take out the chemical liquid held by the chemical liquid tank and circulate the outside and then return it to the chemical liquid tank;
A first chemical solution introduction pipe branched from the first chemical solution circulation pipe and supplying the chemical liquid to the first introduction port;
A second chemical solution introduction pipe branched from the second chemical solution circulation pipe and supplying the chemical liquid to the second introduction port;
A cleaning liquid tank for holding a cleaning liquid for cleaning the pipe through which the chemical liquid flows;
A first cleaning liquid supply pipe for supplying the cleaning liquid held by the cleaning liquid tank to the first chemical liquid circulation pipe from a portion upstream from a branching section with the first chemical liquid introduction pipe;
A second cleaning liquid supply pipe for supplying the cleaning liquid held by the cleaning liquid tank to the second chemical liquid circulation pipe from a portion upstream from a branch portion with the second chemical liquid introduction pipe;
A first cleaning liquid discharge pipe for discharging the cleaning liquid supplied to the first chemical liquid circulation pipe from a portion downstream from a branch portion with the first chemical liquid introduction pipe, and a supply to the second chemical liquid circulation pipe A second cleaning liquid discharge pipe for discharging the cleaned cleaning liquid from a portion downstream from a branching portion with the second chemical liquid introduction pipe;
A first valve provided in the first chemical liquid circulation pipe and positioned upstream from the connection with the first cleaning liquid supply pipe;
A second valve provided in the second chemical liquid circulation pipe and located upstream from the connection portion with the second cleaning liquid supply pipe;
A third valve provided in the first chemical circulation pipe and located downstream from the connection with the first cleaning liquid discharge pipe;
A fourth valve provided in the second chemical liquid circulation pipe and located on the downstream side of the connection with the second cleaning liquid discharge pipe;
A fifth valve provided in the first chemical solution introduction pipe;
A sixth valve provided in the second chemical liquid introduction pipe;
A seventh valve provided in the first cleaning liquid supply pipe;
An eighth valve provided in the second cleaning liquid supply pipe;
A ninth valve provided in the first cleaning liquid discharge pipe;
A tenth valve provided in the second cleaning liquid discharge pipe.

  According to this waste liquid processing apparatus, it is possible to suppress a reduction in the operating rate of the semiconductor manufacturing apparatus for the same reason as the above-described waste liquid processing apparatus.

A first joint pipe connecting the first inlet and the first chemical liquid inlet pipe;
A second joint pipe connecting the second inlet and the second chemical liquid inlet pipe;
Comprising
Each of the first joint pipe and the second joint pipe is attached to the joint pipe, extends from the end on the inlet side of the joint pipe into the inlet, and the tip is an inner wall of the waste liquid treatment tank And an insertion tube located inside the waste liquid treatment tank from the same wall or the inner wall.

  Each of the first joint pipe and the second joint pipe may have an eleventh valve. In this case, the first chemical liquid is opened by opening the fifth valve and closing the eleventh valve of the first joint pipe while supplying the cleaning liquid to the first chemical circulation pipe. Precipitates can be removed from all of the inlet tubes. Similarly, by opening the sixth valve and closing the eleventh valve of the second joint pipe while supplying the cleaning liquid to the second chemical circulation pipe, the second chemical liquid is closed. All of the inlet tube can be cleaned.

  The first chemical solution circulation pipe is provided between the connection portion with the first chemical solution introduction pipe and the connection portion with the first cleaning liquid supply pipe, or is located at the connection portion. 1 is provided in the second chemical liquid circulation pipe, and is located between or connected to the connection part between the second chemical liquid introduction pipe and the second cleaning liquid supply pipe. You may comprise the 2nd pump located in a part. In this case, both the chemical liquid and the cleaning liquid can be flowed into the first chemical liquid introduction pipe by only one first pump. Further, both the chemical liquid and the cleaning liquid can be caused to flow into the second chemical liquid introduction pipe with only one second pump.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram for explaining the configuration of the waste liquid treatment apparatus according to the first embodiment of the present invention. The waste liquid treatment apparatus shown in this figure is an apparatus for treating waste liquid discharged from a semiconductor manufacturing apparatus in a waste liquid treatment tank 30 using a chemical solution. When the waste liquid contains at least one of hydrofluoric acid and phosphoric acid, the chemical used for the treatment is an aqueous slaked lime solution. When the waste liquid is a stripping liquid for stripping the copper plating, the chemical liquid is an FeCl ₃ solution.

  The chemical solution is held in the chemical solution tank 10. A pipe 17 is connected to the chemical liquid supply port 13 of the chemical liquid tank 10 via a joint pipe 40, and the pipe 17 is branched to the chemical liquid circulation pipes 11 and 12. The chemical liquid circulation pipes 11 and 12 are, for example, 100 m or more, and the downstream end is connected to the pipe 18. The pipe 18 is connected to the chemical liquid return port 14 of the chemical liquid tank 10 through the joint pipe 40. The chemical circulation pipe 11 has a valve 51 in the vicinity of the upstream end portion and a valve 53 in the vicinity of the downstream end portion. Similarly, the chemical circulation pipe 12 has a valve 52 in the vicinity of the upstream end portion and a valve 54 in the vicinity of the downstream end portion. The length of piping from the chemical solution supply port 13 to the valves 51 and 52 is 2 m or less, and the length of piping from the valves 53 and 54 to the chemical solution return port 14 is 2 m or less, respectively.

  The chemical solution introduction pipe 15 is branched from the portion between the valves 51 and 53 in the chemical solution circulation pipe 11, and the chemical solution introduction pipe 16 is branched from the portion between the valves 52 and 54 in the chemical solution circulation pipe 12. doing. The chemical liquid introduction pipes 15 and 16 have downstream ends connected to the pipe 19a. The pipe 19 a is connected to the chemical liquid inlet 31 of the waste liquid treatment tank 30 through the joint pipe 40. The chemical solution introduction pipes 15 and 16 have valves 55 and 56, respectively. The length from the valves 55 and 56 to the chemical solution inlet 31 is 2 m or less, respectively.

In addition, the downstream end of the cleaning liquid supply pipe 23 is connected to the portion between the branch portion of the chemical solution circulation pipe 11 and the valve 51, specifically the portion immediately downstream of the valve 51. ing. Similarly, a downstream end portion of the cleaning liquid supply pipe 22 is connected to a portion between the branch portion of the chemical solution circulation pipe 12 with the chemical solution introduction pipe 16 and the valve 52, specifically, a portion immediately downstream of the valve 52. doing. The cleaning liquid supply pipes 22 and 23 have valves 58 and 57, respectively. The upstream end portions of the cleaning liquid supply pipes 22 and 23 are connected to the downstream end portion of the pipe 21. The upstream end of the pipe 21 is connected to the cleaning liquid supply port of the cleaning liquid tank 20. The cleaning liquid tank 20 holds cleaning liquid for cleaning piping (for example, the chemical liquid circulation pipes 11 and 12) through which the chemical liquid flows. When the chemical liquid retained in the chemical liquid tank 10 is a slaked lime aqueous solution or an FeCl ₃ solution, the cleaning liquid is hydrochloric acid. When each of the above tubes is a vinyl chloride tube, the concentration of hydrochloric acid is preferably 1% to 5%, for example.

  Further, a cleaning liquid discharge pipe 24 branches from a portion between the branch portion of the chemical solution circulation pipe 11 and the chemical solution introduction pipe 15 and the valve 53. Similarly, a cleaning liquid discharge pipe 25 branches from a portion between the branch portion of the chemical solution circulation pipe 12 and the chemical solution introduction pipe 16 and the valve 54. The length of the pipe to the branch part between the valves 53 and 54 and the chemical solution introduction pipes 15 and 16 is, for example, 300 m or less. The cleaning liquid discharge pipes 24 and 25 have valves 59 and 60, respectively. The downstream end portions of the cleaning liquid discharge pipes 24 and 25 are connected to the upstream end portion of the pipe 19b. The downstream end of the pipe 19 b is connected to the cleaning liquid return port of the cleaning liquid tank 20.

  Pumps 71 and 72 are attached to the chemical solution circulation pipes 11 and 12, respectively. The pump 71 is located on the downstream side of the connecting part of the chemical liquid circulation pipe 11 and the cleaning liquid supply pipe 23 or the connecting part. By disposing the pump 71 at such a position, it is possible to flow both the chemical liquid and the cleaning liquid into the chemical liquid circulation pipe 11 with a single pump. The pump 72 is also located on the downstream side of the connecting part of the chemical liquid circulation pipe 12 and the cleaning liquid supply pipe 22 or this connecting part. For this reason, it is possible to flow both the chemical liquid and the cleaning liquid into the chemical circulation pipe 12 with a single pump.

  The operations of the valves 51 to 60 and the pumps 71 and 72 are controlled by the control device 1.

  FIG. 2A is a cross-sectional view for explaining a connection structure between the chemical solution inlet 31 of the waste liquid treatment tank 30 and the pipe 19a. The chemical solution inlet 31 and the pipe 19 a are connected via a joint pipe 40. The joint pipe 40 is configured such that flanges 42 and 43 are provided at both ends of a stainless outer pipe 41, and an insertion pipe 44 is extended from the end of the outer pipe 41 on the side of the chemical liquid inlet 31 to the inside of the chemical liquid inlet 31. have. The insertion tube 44 is attached to the inner peripheral surface of the flange 43 of the outer tube 41 at the upstream end of the outer peripheral surface. The downstream end of the insertion tube 44 extends into the chemical solution inlet 31 and its tip 44a is flush with the inner wall 30a of the waste liquid treatment tank 30 or is located inside the waste liquid treatment tank 30 from the inner wall 30a. Yes. For this reason, the deposit 62 from the chemical solution does not adhere to the chemical solution inlet 31.

  As shown in FIG. 2B, when the joint pipe 40 is removed from the chemical solution introduction port 31, the insertion tube 44 is also drawn out from the chemical solution introduction port 31. And the deposit 62 can be removed by exchanging the joint pipe 40. For this reason, the time required to remove the precipitate 62 generated in the vicinity of the chemical solution inlet 31 is short.

  The connection structure between the chemical solution supply port 13 and the pipe 17 of the chemical liquid tank 10 and the connection structure between the chemical liquid return port 14 and the pipe 18 of the chemical liquid tank 10 are also the same as the connection structure of the chemical liquid inlet 31 and the pipe 19a of the waste liquid treatment tank 30. It is the same. For this reason, the time required for the removal of the deposit 62 in the vicinity of the chemical solution supply port 13 and the chemical solution return port 14 is also short.

  3 and 4 are diagrams for explaining the operation of the waste liquid treatment apparatus shown in FIG. First, the control device 1 opens the valves 51 and 53 and operates the pump 71 as shown in FIG. As a result, the chemical liquid retained in the chemical liquid tank 10 circulates outside through the pipe 17, the chemical liquid circulation pipe 11, and the pipe 18 in this order, and then returns to the chemical liquid tank 10. Then, the control device 1 opens the valve 55 for a necessary time at a necessary timing. Thereby, a part of the chemical liquid flowing in the chemical liquid circulation pipe 11 is introduced into the waste liquid treatment tank 30 from the chemical liquid inlet 31 through the chemical liquid introduction pipe 15 and the pipe 19a.

  During the operation shown in FIG. 3A, deposits adhere to the inner walls of the pipe 17, the chemical circulation pipe 11, the pipe 18, the chemical introduction pipe 15, and the pipe 19a.

After operating the waste liquid treatment apparatus in the state of FIG. 3A for a certain time, the control apparatus 1 stops the pump 71 and closes the valves 51, 53, and 55.
Next, as shown in FIG. 3B, the control device 1 opens the valves 52 and 54 and operates the pump 72. Accordingly, the chemical liquid held in the chemical liquid tank 10 circulates outside by flowing through the pipe 17, the chemical liquid circulation pipe 12, and the pipe 18 in this order, and then returns to the chemical liquid tank 10. Then, the control device 1 opens the valve 56 for a necessary time at a necessary timing. Thereby, a part of the chemical liquid flowing in the chemical liquid circulation pipe 12 is introduced into the waste liquid treatment tank 30 from the chemical liquid introduction port 31 through the chemical liquid introduction pipe 16 and the pipe 19a.

  The control device 1 operates the pump 71 and opens the valves 57 and 59. Accordingly, the cleaning liquid held in the cleaning liquid tank 20 flows in this order in the cleaning liquid supply pipes 21 and 23, the chemical liquid circulation pipe 11, the cleaning liquid discharge pipe 24, and the pipe 19b, and then returned to the cleaning liquid tank 20. Thereby, the deposits adhering to the part between the pump 71 and the valve 53 in the chemical liquid circulation pipe 11 and the part upstream of the valve 55 in the chemical liquid introduction pipe 15 are removed by the cleaning liquid. Here, depending on the structure of the pump 71, the deposit adhered to the portion between the pump 71 and the valve 51 in the chemical solution circulation pipe 11 is also removed. As described above, since the chemical solution is supplied from the chemical solution circulation pipe 12 to the waste liquid treatment tank 30 even while the chemical solution circulation pipe 11 is being washed, it is not necessary to stop the semiconductor manufacturing apparatus.

  After operating the waste liquid treatment apparatus in the state of FIG. 3B for a certain time, the control apparatus 1 determines that the cleaning of the chemical liquid circulation pipe 11 has been completed, and the pump 71 is turned on as shown in FIG. Stop and close valves 57 and 59.

  During the operations shown in FIGS. 3B and 4A, deposits adhere to the inner walls of the pipe 17, the chemical circulation pipe 12, the pipe 18, the chemical introduction pipe 16, and the pipe 19a. I will do it.

Then, after operating the waste liquid treatment apparatus in the state of FIG. 4A for a certain time, the control apparatus 1 stops the pump 72 and closes the valves 52, 54, and 56.
Next, as shown in FIG. 4B, the control device 1 opens the valves 51 and 53 and operates the pump 71. Thereby, the chemical solution held in the chemical solution tank 10 flows in this order in the pipe 17, the chemical solution circulation pipe 11, and the pipe 18, and then returned to the chemical solution tank 10. Then, the control device 1 opens the valve 55 for a necessary time at a necessary timing. Thereby, a part of the chemical liquid flowing in the chemical liquid circulation pipe 11 is introduced into the waste liquid treatment tank 30 from the chemical liquid inlet 31 through the chemical liquid introduction pipe 15 and the pipe 19a.

  The control device 1 operates the pump 72 and opens the valves 58 and 60. Accordingly, the cleaning liquid held in the cleaning liquid tank 20 flows in this order in the pipes 21 and 22, the chemical liquid circulation pipe 12, the cleaning liquid discharge pipe 25, and the pipe 19 b, and then returned to the cleaning liquid tank 20. Thereby, the deposits adhering to the part between the pump 72 and the valve 54 in the chemical liquid circulation pipe 12 and the part upstream of the valve 56 in the chemical liquid introduction pipe 16 are removed by the cleaning liquid. Here, depending on the structure of the pump 72, the deposit adhered to the portion between the pump 72 and the valve 52 in the chemical solution circulation pipe 12 is also removed. As described above, since the chemical solution is supplied from the chemical solution circulation pipe 11 to the waste liquid treatment tank 30 even while the chemical solution circulation pipe 12 is being washed, it is not necessary to stop the semiconductor manufacturing apparatus.

  After operating the waste liquid treatment apparatus in the state of FIG. 4B for a certain time, the control apparatus 1 determines that the cleaning of the chemical liquid circulation pipe 12 has been completed, stops the pump 72 as shown in FIG. 58 and 60 are closed to return to the state of FIG.

  The portions between the pumps 71 and 72 and the chemical solution supply port 13, the portions between the valves 53 and 54 and the chemical solution return port 14, and the portions between the valves 55 and 56 and the chemical solution introduction port 31 are at a necessary timing. The pumps 71 and 72 are exchanged with the valves stopped and all valves closed. This exchange timing is, for example, between the operation shown in FIG. 3B and the operation shown in FIG. 4A, or between the operation shown in FIG. 4B and the operation shown in FIG. Since most of the chemical circulation pipes 11 and 12 do not need to be replaced, the work time required for replacement can be shortened. At this replacement timing, the joint pipe 40 shown in FIG. 2 is also replaced. Each replaced member (including the joint pipe 40) is cleaned with a cleaning liquid in a dedicated water tank and then reused. For this reason, there is no member discarded because of clogging with precipitates.

  As described above, according to the first embodiment of the present invention, while the chemical liquid is being supplied from the chemical liquid circulation pipe 12 to the waste liquid treatment tank 30, the portion between the pump 71 and the valve 53 in the chemical liquid circulation pipe 11 (or The deposits adhering to the upstream portion of the chemical liquid introduction pipe 15 and the upstream portion of the valve 55 are removed by the cleaning liquid. Further, while the chemical solution is being supplied from the chemical solution circulation pipe 11 to the waste liquid treatment tank 30, a portion of the chemical solution circulation tube 12 between the pump 72 and the valve 54 (or a portion between the valve 52 and the valve 54), and Deposits adhering to each of the portions of the chemical solution introduction pipe 16 upstream of the valve 56 are removed by the cleaning solution. Therefore, the parts that need to be replaced are the parts between the pumps 71 and 72 and the chemical liquid supply port 13, the parts between the valves 53 and 54 and the chemical liquid return port 14, and between the valves 55 and 56 and the chemical liquid inlet 31. It is limited to the part. For this reason, in order to exchange these parts, the time which stops operation | movement of a waste-liquid processing apparatus becomes short.

  Further, the downstream end of the insertion pipe 44 provided in the joint pipe 40 extends into the chemical liquid inlet 31, and the tip 44 a thereof is flush with the inner wall 30 a of the waste liquid treatment tank 30 or the waste liquid from the inner wall 30 a. It is located inside the processing tank 30. For this reason, the deposit 62 from the chemical liquid adheres to the insertion tube 44 and does not adhere to the chemical liquid inlet 31. For this reason, the deposit 62 in the vicinity of the chemical solution inlet 31 can be removed by exchanging the joint pipe 40. For this reason, the time required for the removal of the deposit 62 deposited in the vicinity of the chemical solution inlet 31 is shortened.

As a result, the time for stopping the operation of the waste liquid treatment apparatus is further shortened. The chemical liquid need not always be supplied to the waste liquid treatment tank 30. Therefore, it is not necessary to stop the operation of the semiconductor manufacturing apparatus, and a reduction in the operating rate of the semiconductor manufacturing apparatus is suppressed.
Further, there is no member discarded due to clogging due to precipitates. Accordingly, the running cost of the waste liquid treatment apparatus is reduced.

FIG. 5 is a schematic diagram for explaining the configuration of the waste liquid treatment apparatus according to the second embodiment of the present invention. The waste liquid treatment apparatus shown in the figure has the same configuration as the waste liquid treatment apparatus according to the first embodiment except for the following points. First, the chemical liquid tank 10 is provided with two chemical liquid supply ports 13a and 13b, and two chemical liquid return ports 14a and 14b. The waste liquid treatment tank 30 is provided with two chemical liquid inlets 31a and 31b. The upstream end portion of the chemical liquid circulation pipe 11 is connected to the chemical liquid supply port 13a via the joint pipe 40a, and the downstream end portion of the chemical liquid circulation pipe 11 is connected to the chemical liquid return port 14a via the joint pipe 40c. Connected to. The upstream end of the chemical liquid circulation pipe 12 is connected to the chemical liquid supply port 13b via the joint pipe 40b, and the downstream end of the chemical liquid circulation pipe 11 is connected to the chemical liquid return port 14b via the joint pipe 40d. Connected to. The downstream end portion of the chemical solution introduction pipe 15 is connected to the chemical solution introduction port 31a via the joint tube 40e, and the downstream end portion of the chemical solution introduction tube 16 is connected to the chemical solution introduction port 31b via the joint tube 40f. Connected to. The upstream ends of the cleaning liquid supply pipes 22 and 23 and the downstream ends of the cleaning liquid discharge pipes 24 and 25 are directly connected to the cleaning liquid tank 20, respectively. The joint pipes 40a, 40b, 40c, 40d, 40e, and 40f are the same as the joint pipe 40 shown in the first embodiment except that valves 51a, 52a, 53a, 54a, 55a, and 56a are provided. It is the same composition.
Hereinafter, the same components as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

6 and 7 are diagrams for explaining the operation of the waste liquid treatment apparatus shown in FIG. First, the control device 1 opens the valves 51, 51a, 53, 53a and operates the pump 71 as shown in FIG. Thus, the chemical liquid held in the chemical liquid tank 10 circulates outside by flowing through the chemical liquid circulation pipe 11, and then returned to the chemical liquid tank 10. Then, the control device 1 opens the valves 55 and 55a for a necessary time at a necessary timing. Thereby, a part of the chemical liquid flowing in the chemical liquid circulation pipe 11 is introduced into the waste liquid treatment tank 30 through the chemical liquid introduction pipe 15 from the chemical liquid inlet 31a.
During the operation shown in FIG. 6A, deposits adhere to the inner walls of the chemical circulation pipe 11 and the chemical introduction pipe 15.

After operating the waste liquid treatment apparatus in the state of FIG. 6A for a certain time, the control apparatus 1 stops the pump 71 and closes all the valves.
Then, as shown in FIG. 6B, the valves 52, 52a, 54, 54a are opened, and the pump 72 is operated. As a result, the chemical liquid held in the chemical liquid tank 10 flows through the chemical liquid circulation pipe 12 and then returned to the chemical liquid tank 10. Then, the control device 1 opens the valves 56 and 56a for a necessary time at a necessary timing. Thereby, a part of the chemical liquid flowing in the chemical liquid circulation pipe 12 is introduced into the waste liquid treatment tank 30 through the chemical liquid introduction pipe 16 from the chemical liquid inlet 31b.

  Further, the control device 1 operates the pump 71 and opens the valves 51, 53, 55, 57 and 59. As a result, the cleaning liquid held in the cleaning liquid tank 20 flows in this order through the cleaning liquid supply pipe 23, the chemical liquid circulation pipe 11, and the cleaning liquid discharge pipe 24, and then returned to the cleaning liquid tank 20. Thereby, the deposits attached to the chemical solution circulation pipe 11 and the joint pipe 40c on the upstream side of the valve 53a, and the chemical liquid introduction pipe 15 and the joint pipe 40e on the upstream side of the valve 55a are removed by the cleaning liquid. Is done. As described above, since the chemical solution is supplied from the chemical solution circulation pipe 12 to the waste liquid treatment tank 30 even while the chemical solution circulation pipe 11 and the like are being cleaned, it is not necessary to stop the semiconductor manufacturing apparatus.

  After operating the waste liquid treatment apparatus in the state of FIG. 6B for a certain time, the control apparatus 1 determines that the cleaning of the chemical liquid circulation pipe 11 and the like has been completed, and the pump 71 as shown in FIG. 7A. And the valves 51, 53, 55, 57, 59 are closed. And the joint pipes 40a, 40c, and 40e are replaced | exchanged as needed.

  During the operations shown in FIGS. 6B and 7A, deposits adhere to the inner walls of the chemical solution circulation pipe 12 and the chemical solution introduction pipe 16.

Then, after operating the waste liquid treatment apparatus in the state of FIG. 7A for a certain time, the control apparatus 1 stops the pump 72 and closes all the valves.
Then, as shown in FIG. 7B, the valves 51, 51a, 53, 53a are opened and the pump 71 is operated. As a result, the chemical liquid held in the chemical liquid tank 10 flows through the chemical liquid circulation pipe 11 and then returned to the chemical liquid tank 10. Then, the control device 1 opens the valves 55 and 55a for a necessary time at a necessary timing. Thereby, a part of the chemical liquid flowing in the chemical liquid circulation pipe 11 is introduced into the waste liquid treatment tank 30 through the chemical liquid introduction pipe 15 from the chemical liquid inlet 31a.

  The control device 1 operates the pump 72 and opens the valves 52, 54, 56, 58 and 60. As a result, the cleaning liquid retained in the cleaning liquid tank 20 flows through the chemical liquid circulation pipe 12 and then returned to the cleaning liquid tank 20. As a result, the deposits attached to the chemical solution circulation pipe 12 and the joint pipe 40d on the upstream side of the valve 54a, and the chemical liquid introduction pipe 16 and the joint pipe 40f on the upstream side of the valve 56a are removed by the cleaning liquid. Is done. As described above, since the chemical liquid is supplied from the chemical liquid circulation pipe 11 to the waste liquid treatment tank 30 even while the chemical liquid circulation pipe 12 and the like are being washed, it is not necessary to stop the semiconductor manufacturing apparatus.

  After operating the waste liquid treatment apparatus in the state of FIG. 7B for a certain time, the control apparatus 1 determines that the cleaning of the chemical liquid circulation pipe 12 and the like has been completed, stops the pump 71 as shown in FIG. The valves 52, 54, 56, 58 and 60 are closed to return to the state shown in FIG. And the joint pipes 40b, 40d, and 40f are replaced | exchanged as needed.

  FIG. 8A is a cross-sectional view for explaining a connection structure between the chemical solution introduction pipe 15 and the chemical solution introduction port 31a by the joint pipe 40e. As shown in FIG. 8A, the joint pipe 40e has a configuration in which a valve 55a is provided on the joint pipe 40e shown in the first embodiment. The valve 55 a is provided on the outer tube 41. Hereinafter, the same components as those of the joint pipe 40e in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. Further, while the operation shown in FIG. 6A is performed and the chemical solution is introduced into the waste liquid treatment tank 30 through the joint tube 40e, the precipitate 62 is formed on the inner wall of each of the outer tube 41 and the insertion tube 44. Adheres.

  FIG. 8B is a diagram for explaining the state of FIG. 7A, that is, the state of the joint pipe 40e, the chemical liquid introducing pipe 15, and the chemical liquid introducing port 31a after the chemical liquid introducing pipe 15 is cleaned using the cleaning liquid. It is sectional drawing. As shown in this figure, the deposit 62 is removed from the upstream side of the valve 55a in the chemical solution introduction pipe 15 and the outer pipe 41 of the joint pipe 40e. Then, by replacing the joint pipe 40e, it is possible to remove all the precipitates 62 that could not be removed with the cleaning liquid.

  The joint pipes 40a to 40d and 40f have the same configuration as the joint pipe 40e. For this reason, by replacing the joint pipe joint pipes 40a to 40d and 40f, all the precipitates 62 that could not be removed with the cleaning liquid. Can be removed. In addition, the used joint pipes 40a to 40f are washed with a washing liquid in a dedicated water tank and then reused.

As described above, according to the second embodiment of the present invention, while the chemical solution is being supplied from the chemical solution circulation pipe 12 to the waste liquid treatment tank 30, the deposits attached to the chemical solution circulation pipe 11 and the chemical solution introduction pipe 15 are removed from the cleaning liquid. Can be removed. Further, while supplying the chemical liquid from the chemical liquid circulation pipe 11 to the waste liquid treatment tank 30, the deposits attached to the chemical liquid circulation pipe 12 and the chemical liquid introduction pipe 16 can be removed by the cleaning liquid. Furthermore, by replacing the joint pipes 40a to 40f, it is possible to remove all precipitates that could not be removed with the cleaning liquid. The joint pipes 40a, 40c, and 40e can be replaced while the chemical liquid is supplied from the chemical liquid circulation pipe 12 to the waste liquid treatment tank 30, and the chemical liquid is supplied from the chemical liquid circulation pipe 11 to the waste liquid treatment tank 30. The joint pipes 40b, 40d, and 40f can be exchanged between them. Therefore, it is not necessary to stop the operation of the waste liquid treatment apparatus when removing the precipitates, and as a result, a reduction in the operating rate of the semiconductor manufacturing apparatus is suppressed.
Further, there is no member discarded due to clogging due to precipitates. Accordingly, the running cost of the waste liquid treatment apparatus is reduced.

  FIG. 9 is a schematic view for explaining the configuration of the waste liquid treatment apparatus according to the third embodiment of the present invention. The waste liquid processing apparatus shown in this figure is an apparatus for processing the waste liquid discharged from the semiconductor manufacturing apparatus 100. The waste liquid tank 110 that holds the waste liquid, and the waste liquid discharge pipes 101 and 102 that connect the semiconductor manufacturing apparatus 100 and the waste liquid tank 110 are provided. Have. Valves 121 and 122 are attached near the upstream end of the waste liquid discharge pipes 101 and 102, and valves 125 and 126 are attached near the downstream end of the waste liquid discharge pipes 101 and 102, respectively.

  A portion of the waste liquid discharge pipe 101 positioned between the valves 121 and 125, specifically, a part immediately downstream of the valve 121 is connected to the downstream end of the cleaning liquid supply pipe 131a. 101, the upstream end of the cleaning liquid discharge pipe 132a is connected to a portion located between the connecting portion of the cleaning liquid supply pipe 131a and the valve 125, specifically, a portion immediately upstream of the valve 125. . Similarly, a downstream end of the cleaning liquid supply pipe 131b is connected to a portion of the waste liquid discharge pipe 102 positioned between the valves 122 and 126, specifically, a portion immediately downstream of the valve 122, The upstream end portion of the cleaning liquid discharge pipe 132b is connected to a portion of the waste liquid discharge pipe 102 located between the connection portion with the cleaning liquid supply pipe 131b and the valve 126, specifically, a portion immediately upstream of the valve 126. Has been. The upstream ends of the cleaning liquid supply pipes 131a and 131b are connected to the cleaning liquid tank 130 via a pipe 131, and the downstream ends of the cleaning liquid discharge pipes 132a and 132b are connected to the cleaning liquid tank 130 via a pipe 132. Connected to. The cleaning liquid tank 130 holds a cleaning liquid for cleaning the waste liquid discharge pipes 101 and 102. When the waste liquid is organic waste water, the cleaning liquid is an alkaline aqueous solution.

  A pump 133 is attached to the pipe 131. Furthermore, the cleaning liquid supply pipes 131a and 131b are provided with valves 123 and 124, respectively, and the cleaning liquid discharge pipes 132a and 132b are provided with valves 127 and 128, respectively. The operation of each valve and pump 133 is controlled by the control device 103.

  FIGS. 10 and 11 are diagrams for explaining the operation of the waste liquid treatment apparatus shown in FIG. First, the control device 103 opens the valves 121 and 125 to discharge the waste liquid from the semiconductor manufacturing apparatus 100 to the waste liquid tank 110 via the waste liquid discharge pipe 101. At this time, deposits adhere to the inner wall of the waste liquid discharge pipe 101.

  After discharging the waste liquid in the state of FIG. 10A for a certain time, the control device 1 opens the valves 122 and 126 and closes the valves 121 and 125 as shown in FIG. 10B. Next, the control device 1 opens the valves 123 and 127 and operates the pump 133. As a result, the waste liquid is discharged from the semiconductor manufacturing apparatus 100 to the waste liquid tank 110 via the waste liquid discharge pipe 102. Further, the portion of the waste liquid discharge pipe 101 located between the valves 121 and 125 is cleaned with the cleaning liquid, and the deposits are removed.

  After a certain period of time has elapsed, as shown in FIG. 11A, the control device 1 determines that the cleaning of the waste liquid discharge pipe 101 has been completed, closes the valves 123 and 127, and stops the pump 133. If necessary, the upstream portion of the waste liquid discharge pipe 101 and the downstream portion of the valve 125 are replaced. During this time, the waste liquid is discharged from the semiconductor manufacturing apparatus 100 to the waste liquid tank 110 via the waste liquid discharge pipe 102.

  After a certain time has elapsed, as shown in FIG. 11B, the control device 1 opens the valves 121 and 125 and closes the valves 122 and 126. Then, the control device 1 opens the valves 124 and 128 and operates the pump 133. As a result, the waste liquid is discharged from the semiconductor manufacturing apparatus 100 to the waste liquid tank 110 via the waste liquid discharge pipe 101. Further, the portion located between the valves 122 and 126 in the waste liquid discharge pipe 102 is cleaned with the cleaning liquid, and the deposits are removed.

  After a certain period of time has elapsed, the control device 1 determines that the cleaning of the waste liquid discharge pipe 102 has been completed, closes the valves 124 and 128, and stops the pump 133, so that the waste liquid processing apparatus is in the state shown in FIG. Return to. Then, as necessary, the upstream portion of the waste liquid discharge pipe 102 and the downstream portion of the valve 126 are replaced. During this time, the waste liquid is discharged from the semiconductor manufacturing apparatus 100 to the waste liquid tank 110 via the waste liquid discharge pipe 101.

As described above, according to the third embodiment of the present invention, while the waste liquid discharge pipe 101 discharges the waste liquid, the portion located between the valves 122 and 126 in the waste liquid discharge pipe 102 is washed and attached. The kimono can be removed, and the portion of the waste liquid discharge pipe 102 upstream of the valve 122 and the portion downstream of the valve 126 can be replaced. Further, while the waste liquid discharge pipe 102 is discharging the waste liquid, the portion located between the valves 121 and 125 in the waste liquid discharge pipe 101 can be washed to remove the deposits, and the waste liquid discharge. A portion of the pipe 101 on the upstream side of the valve 121 and a portion on the downstream side of the valve 125 can be exchanged.
Therefore, it is not necessary to stop the operation of the semiconductor manufacturing apparatus when removing the deposits, and as a result, a reduction in the operating rate of the semiconductor manufacturing apparatus is suppressed.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

Schematic for demonstrating the structure of the waste-liquid processing apparatus which concerns on 1st Embodiment. (A) is sectional drawing for demonstrating the connection structure of the chemical | medical solution inlet 31 of the waste liquid processing tank 30, and the piping 19a, (B) is sectional drawing which shows the state which removed the joint pipe 40 from the chemical | medical solution inlet 31. (A), (B) is a figure for demonstrating operation | movement of the waste-liquid processing apparatus shown in FIG. (A), (B) is a figure for demonstrating operation | movement of the waste-liquid processing apparatus shown in FIG. Schematic for demonstrating the structure of the waste-liquid processing apparatus which concerns on 2nd Embodiment. (A), (B) is a figure for demonstrating operation | movement of the waste-liquid processing apparatus shown in FIG. (A), (B) is a figure for demonstrating operation | movement of the waste-liquid processing apparatus shown in FIG. (A) is sectional drawing for demonstrating the connection structure of the chemical | medical solution introduction pipe | tube 15 and the chemical | medical solution introduction port 31a by the joint pipe 40e, (B) is the joint pipe 40e after washing | cleaning, the chemical | medical solution introduction pipe 15, and the chemical | medical solution introduction port 31a. Sectional drawing for demonstrating a state. Schematic for demonstrating the structure of the waste-liquid processing apparatus which concerns on 3rd Embodiment. (A), (B) is a figure for demonstrating operation | movement of the waste-liquid processing apparatus shown in FIG. (A), (B) is a figure for demonstrating operation | movement of the waste-liquid processing apparatus shown in FIG. Schematic for demonstrating the structure of the conventional waste-liquid processing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,103 ... Control apparatus, 10,220 ... Chemical solution tank, 11, 12, 212 ... Chemical solution circulation pipe, 13, 13a, 13b ... Chemical solution supply port, 14, 14a, 14b ... Chemical solution return port, 15, 16, 214 ... Chemical solution introduction pipe, 17, 18, 19, 19a, 19b, 21, 131, 132 ... piping, 20, 130 ... cleaning liquid tank, 22, 23, 131a, 131b ... cleaning liquid supply pipe, 24, 25, 132a, 132b ... cleaning liquid Discharge pipe 30, 210 ... Waste liquid treatment tank, 30a ... Inner wall, 31, 31a, 31b ... Chemical solution inlet, 40, 40a-40f ... Joint pipe, 41 ... Outer pipe, 42, 43 ... Flange, 44 ... Insertion pipe, 44a ... tip 51-60, 51a-56a, 121-128, 215 ... valve, 71, 72, 133, 212a ... pump, 100 ... semiconductor manufacturing equipment, 101, 102 ... waste Discharge pipe, 110 ... waste tank

Claims (7)

A waste liquid treatment tank for treating the waste liquid;
A chemical tank holding the chemical,
A first chemical solution circulation path for returning the chemical solution held by the chemical solution tank to the chemical solution tank after being circulated outside the chemical solution tank;
A second chemical solution circulation path for returning the chemical solution held by the chemical solution tank to the chemical solution tank after circulating the chemical solution outside the chemical solution tank;
A first chemical solution introduction path connected to the first chemical solution circulation path and supplying the chemical liquid flowing through the first chemical solution circulation path to the waste liquid treatment tank;
A second chemical solution introduction path connected to the second chemical solution circulation path and supplying the chemical liquid flowing through the second chemical solution circulation path to the waste liquid treatment tank;
A cleaning liquid tank holding a cleaning liquid for cleaning the first and second chemical liquid circulation paths;
A first cleaning liquid supply path for introducing the cleaning liquid held by the cleaning liquid tank into the first chemical liquid circulation path;
A second cleaning liquid supply path for introducing the cleaning liquid held by the cleaning liquid tank into the second chemical liquid circulation path;
Connected to the first chemical liquid circulation path, connected to the first chemical liquid circulation path for discharging the cleaning liquid supplied to the first chemical liquid circulation path, and to the second chemical liquid circulation path, the second chemical liquid A second cleaning liquid discharge path for discharging the cleaning liquid supplied to the circulation path;
A waste liquid treatment apparatus comprising: A waste liquid treatment tank for treating the waste liquid;
A downstream end connected to the waste liquid treatment tank, and a supply pipe for supplying a chemical solution for treating the waste liquid into the waste liquid treatment tank;
A chemical tank holding the chemical,
A chemical extraction pipe whose upstream end is connected to the chemical tank;
A chemical return pipe whose downstream end is connected to the chemical tank;
A first chemical liquid circulation pipe having an upstream end connected to a downstream end of the chemical extraction pipe, and a downstream end connected to an upstream end of the chemical return pipe;
Provided in parallel with the first chemical liquid circulation pipe, the upstream end is connected to the downstream end of the chemical extraction pipe, and the downstream end is connected to the upstream end of the chemical return pipe A second chemical liquid circulation pipe to be connected;
A first chemical liquid introduction pipe having an upstream end connected to the first chemical circulation pipe and a downstream end connected to the supply pipe;
A second chemical liquid introduction pipe having an upstream end connected to the second chemical circulation pipe and a downstream end connected to the supply pipe;
A cleaning liquid tank for holding a cleaning liquid for cleaning the first and second chemical liquid circulation pipes and the first and second chemical liquid introduction pipes;
An upstream end of the cleaning liquid connected to the cleaning liquid tank;
The upstream end is connected to the downstream end of the cleaning liquid take-out pipe, and the downstream end is upstream of the connection with the first chemical introduction pipe in the first chemical circulation pipe. A first cleaning liquid supply pipe connected to the portion;
The upstream end is connected to the downstream end of the cleaning liquid extraction pipe, and the downstream end is upstream of the connection with the second chemical introduction pipe in the second chemical circulation pipe. A second cleaning liquid supply pipe connected to the portion;
An end on the upstream side is connected to a portion of the first chemical solution circulation pipe that is downstream of the connection portion with the first chemical solution introduction pipe, and the cleaning liquid supplied to the first chemical solution circulation pipe is discharged. An upstream end is connected to a portion of the second chemical liquid circulation pipe that is downstream of a branching portion of the second chemical liquid circulation pipe and the second chemical liquid introduction pipe, and the second chemical liquid circulation pipe A second cleaning liquid discharge pipe for discharging the cleaning liquid supplied to
A first valve provided in the first chemical liquid circulation pipe and positioned upstream from the connection with the first cleaning liquid supply pipe;
A second valve provided in the second chemical liquid circulation pipe and located upstream from the connection portion with the second cleaning liquid supply pipe;
A third valve provided in the first chemical circulation pipe and located downstream from the connection with the first cleaning liquid discharge pipe;
A fourth valve provided in the second chemical liquid circulation pipe and located on the downstream side of the connection with the second cleaning liquid discharge pipe;
A fifth valve provided in the first chemical solution introduction pipe;
A sixth valve provided in the second chemical liquid introduction pipe;
A seventh valve provided in the first cleaning liquid supply pipe;
An eighth valve provided in the second cleaning liquid supply pipe;
A ninth valve provided in the first cleaning liquid discharge pipe;
A tenth valve provided in the second cleaning liquid discharge pipe;
A waste liquid treatment apparatus comprising: A joint pipe connecting the supply pipe and the waste liquid treatment tank;
It is attached to the joint pipe, extends from the end of the joint pipe on the side of the waste liquid treatment tank into the waste liquid treatment tank, and the tip is flush with the inner wall of the waste liquid treatment tank or inside the waste liquid treatment tank from the inner wall. An insertion tube located;
The waste liquid processing apparatus of Claim 2 which comprises. A waste liquid treatment tank for treating the waste liquid;
A first inlet and a second inlet that are provided in the waste liquid treatment tank and introduce a chemical for treating the waste liquid into the waste liquid treatment tank;
A chemical tank holding the chemical,
A first chemical liquid circulation pipe and a second chemical liquid circulation pipe which take out the chemical liquid held by the chemical liquid tank and circulate the outside and then return it to the chemical liquid tank;
A first chemical solution introduction pipe branched from the first chemical solution circulation pipe and supplying the chemical liquid to the first introduction port;
A second chemical solution introduction pipe branched from the second chemical solution circulation pipe and supplying the chemical liquid to the second introduction port;
A cleaning liquid tank for holding a cleaning liquid for cleaning the pipe through which the chemical liquid flows;
A first cleaning liquid supply pipe for supplying the cleaning liquid held by the cleaning liquid tank to the first chemical liquid circulation pipe from a portion upstream from a branching section with the first chemical liquid introduction pipe;
A second cleaning liquid supply pipe for supplying the cleaning liquid held by the cleaning liquid tank to the second chemical liquid circulation pipe from a portion upstream from a branch portion with the second chemical liquid introduction pipe;
A first cleaning liquid discharge pipe for discharging the cleaning liquid supplied to the first chemical liquid circulation pipe from a portion downstream from a branch portion with the first chemical liquid introduction pipe, and a supply to the second chemical liquid circulation pipe A second cleaning liquid discharge pipe for discharging the cleaned cleaning liquid from a portion downstream from a branching portion with the second chemical liquid introduction pipe;
A first valve provided in the first chemical liquid circulation pipe and positioned upstream from the connection with the first cleaning liquid supply pipe;
A second valve provided in the second chemical liquid circulation pipe and located upstream from the connection portion with the second cleaning liquid supply pipe;
A third valve provided in the first chemical circulation pipe and located downstream from the connection with the first cleaning liquid discharge pipe;
A fourth valve provided in the second chemical liquid circulation pipe and located on the downstream side of the connection with the second cleaning liquid discharge pipe;
A fifth valve provided in the first chemical solution introduction pipe;
A sixth valve provided in the second chemical liquid introduction pipe;
A seventh valve provided in the first cleaning liquid supply pipe;
An eighth valve provided in the second cleaning liquid supply pipe;
A ninth valve provided in the first cleaning liquid discharge pipe;
A tenth valve provided in the second cleaning liquid discharge pipe;
A waste liquid treatment apparatus comprising: A first joint pipe attached to the first inlet;
A second joint pipe attached to the second introduction port;
Comprising
The first joint pipe and the second joint pipe are respectively
It is attached to the joint pipe, and extends from the end on the inlet side of the joint pipe into the inlet,
An insertion tube whose tip is flush with the inner wall of the waste liquid treatment tank or located inside the waste liquid treatment tank from the inner wall;
The waste-liquid processing apparatus of Claim 4 which has these. The waste liquid treatment apparatus according to claim 5, wherein each of the first joint pipe and the second joint pipe has an eleventh valve. The first chemical solution circulation pipe is provided between the connection portion with the first chemical solution introduction pipe and the connection portion with the first cleaning liquid supply pipe, or is located at the connection portion. 1 pump,
The second chemical solution circulation pipe is provided between the connection part with the second chemical liquid introduction pipe and the connection part with the second cleaning liquid supply pipe, or is located at the connection part. 2 pumps,
The waste-liquid processing apparatus as described in any one of Claims 1-6 which comprises these.

Images