JP5120037B2 - Lead frame for lead exposed package - Google Patents
Lead frame for lead exposed package Download PDFInfo
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- JP5120037B2 JP5120037B2 JP2008102458A JP2008102458A JP5120037B2 JP 5120037 B2 JP5120037 B2 JP 5120037B2 JP 2008102458 A JP2008102458 A JP 2008102458A JP 2008102458 A JP2008102458 A JP 2008102458A JP 5120037 B2 JP5120037 B2 JP 5120037B2
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- 239000011347 resin Substances 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 31
- 238000000465 moulding Methods 0.000 claims description 14
- 238000004080 punching Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 238000007789 sealing Methods 0.000 description 12
- 230000002265 prevention Effects 0.000 description 10
- 238000007747 plating Methods 0.000 description 6
- 238000007665 sagging Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
Description
本発明は樹脂封止後にリードが露出しているタイプのリードフレームに関するものである。 The present invention relates to the type of lead frame which is read after the resin sealing are exposed.
ＱＦＮ（Ｑｕａｄ Ｆｌａｔ Ｎｏｎ−ｌｅａｄｅｄ ｐａｃｋａｇｅ）及びＳＯＮ（Ｓｍａｌｌ Ｏｕｔｌｉｎｅ Ｎｏｎ−ｌｅａｄｅｄ ｐａｃｋａｇｅ）などのリード露出型パッケージに用いられるリードフレームは、実装部であるリード裏面側が樹脂封止後に樹脂より露出していることが特徴である。樹脂より露出するリードに求められる機能としてモールド時のリードとモールド界面での樹脂バリ発生防止のために露出部リードエッジにダレが無いこと及び露出したリードが樹脂から抜け落ちる事を防止するためのひっかかり形状を有することが必須となっている。
これらのリードフレームをプレス加工で成形する際、リード部に潰し加工などを施すことにより、打ち抜き加工により発生するダレを修正し樹脂バリを防止するとともに潰し加工により樹脂に対する抜け止め引っかかり形状を施し樹脂からの脱落を防いでいる（例えば、特許文献１参照）。
Lead frames used in lead-exposed packages such as QFN (Quad Flat Non-leaded package) and SON (Small Outline Non-leaded package) must have the lead back side, which is the mounting part, exposed from the resin after sealing. Is a feature. As a function required for the lead exposed from the resin, there is no sag at the exposed part lead edge and prevention of the exposed lead from falling out of the resin to prevent the occurrence of resin burrs at the mold-lead interface. It is essential to have a shape.
When these lead frames are formed by press working, the lead part is crushed to correct the sag generated by punching to prevent resin burrs, and the crushed to give the resin a retaining catch shape. (See, for example, Patent Document 1).
又、通常リードフレームは、ボンディング性を確保するための銀めっきを施すが、ＱＦＮ及びＳＯＮなどのリード露出型のリードフレームは、そのパッケージサイズ、実装性、及び樹脂と銀めっきとの密着性の関係から、リード側面及び裏面への銀の付着は望ましくなく、リード露出型のリードフレームを成形加工する際は、リード形状を形成する前に必要な部分に銀めっきなどを施し、その後リード形状の成形工程を経る先めっき加工で作製される。 In general, the lead frame is subjected to silver plating to ensure bonding properties, but lead exposed type lead frames such as QFN and SON have a package size, mountability, and adhesion between the resin and the silver plating. For this reason, it is not desirable for silver to adhere to the side and back surfaces of the lead. When forming a lead-exposed lead frame, silver plating is applied to the necessary parts before forming the lead shape, and then the lead shape is removed. It is produced by a pre-plating process through a molding process.
従って、樹脂からリードが露出するリードフレームにおいては、銀めっきを施した後に打ち抜き加工を行い、且つ、樹脂からの脱落防止形状の形成、及び樹脂バリの因子である打ち抜きダレを修正する為の潰し加工が施されることとなる。
しかしながら、この潰し加工は、リーフドフレームのめっき面に傷や付着物などの損傷を与え易く、ボンディング性を維持することが困難であるという問題を抱えている。
そこで、本発明は、リード露出型パッケージの封止樹脂より露出するリードに求められる樹脂封止時のリードと樹脂界面での樹脂バリ発生防止及び露出したリードが樹脂からの脱落防止を達成しつつ、このようなボンディング性の劣化という問題点を解消するリード露出型パッケージ用リードフレームを提供するものである。
However, this crushing process has a problem that it is easy to damage the plated surface of the leaf frame, such as scratches and deposits, and it is difficult to maintain the bonding property.
Therefore, the present invention achieves prevention of resin burr generation at the lead-resin interface and prevention of falling off of the exposed lead from the resin, which is required for the lead exposed from the sealing resin of the lead-exposed package. , there is provided a lead exposed type package leadframe to solve the problems that such bonding degradation.
本発明はインナーリードに封止樹脂からの脱落を防止する形状を形成するため、インナーリードの側面部、特に打ち抜きダレ部に微細な成形加工を施すと共に、この成形加工により生じた余肉である変形部を移動させ、封止樹脂からの脱落防止形状を形成するものであります。この際、打ち抜きダレ部への微細な成形加工により、プレス成形による打ち抜きダレ部を除き、又、潰し加工を施さずに封止樹脂からの脱落防止形状を形成するため、リードフレームめっき面の損傷を抑えるものである。 In the present invention, in order to form a shape that prevents the inner lead from falling off from the sealing resin, the side surface portion of the inner lead , particularly the punched-out sagging portion, is subjected to a fine molding process, and the surplus generated by the molding process. The deformed part is moved to form a shape that prevents it from falling off the sealing resin. In this case, the lead frame plating surface is damaged by forming the punching sagging part by press molding without forming the punching sagging part by press molding and forming a shape that prevents the resin from falling off without crushing. It is what suppresses.
即ち、本発明は樹脂により封止されるリード露出型パッケージ用リードフレームの断面が四角形状のインナーリード側面部への成形加工により、インナーリードに生じる変形部を移動して、側面部に頂点を形成して断面が八角形状断面に形成され、その八角形状断面における上辺および下辺の端点である４つの頂点の内角が９０度より大きい八角形状断面のインナーリードを有することを特徴とするリード露出型パッケージ用リードフレームで、さらにそのインナーリードの八角形状断面における上辺及び下辺の端点である４つの頂点以外の頂点の内、２つの頂点の内角が１８０度を越える凹多角形の断面形状であることを特徴とするものである。 That is, according to the present invention , a lead frame for a lead-exposed package that is sealed with a resin moves a deformed portion generated in the inner lead by forming the side surface of the inner lead having a quadrangular cross section so that the apex is formed on the side surface. A lead exposed type comprising an inner lead having an octagonal cross section in which the cross section is formed into an octagonal cross section, and the inner angles of four vertices which are the end points of the upper side and the lower side in the octagonal cross section are greater than 90 degrees The lead frame for a package is a concave polygonal cross-sectional shape in which the inner angle of two vertices exceeds 180 degrees among the vertices other than the four vertices that are the end points of the upper and lower sides of the octagonal cross section of the inner lead. It is characterized by.
本発明によれば封止樹脂からのインナーリードの脱落を防止することが要求されるリードフレームのリード形成に際して、樹脂バリの原因となる打ち抜きによるダレ部を無くし、打ち抜きダレ部側及びバリ部側のどちらからでも、封止樹脂からの脱落を防止する形状を形成することができる。
又、潰し加工を必要としないために、従来と比較してリードフレーム、特にインナーリードのめっき面への損傷がなく、良好なボンディング性を発揮するものである。
According to the present invention, when forming a lead frame lead that is required to prevent the inner lead from falling off from the sealing resin, the sagging portion caused by punching that causes resin burrs is eliminated, and the punching sagging portion side and the burr portion side are eliminated. From either of these, it is possible to form a shape that prevents dropping from the sealing resin.
In addition, since the crushing process is not required, the lead frame, particularly the plated surface of the inner lead, is not damaged as compared with the conventional case, and a good bonding property is exhibited.
以下、図を用いて本発明を詳細に説明する。
図１は、リード露出型パッケージ用リードフレームのインナーリードの部分斜視図である。図２は、樹脂で封止された状態のインナーリードの部分断面図である。
図１及び図２において、１はインナーリード、２は脱落防止形状、１１はインナーリー
ド打ち抜き下面、１２はインナーリード打ち抜き上面、１３、１４は側面、１３ａ〜１３ｃ、１４ａ〜１４ｃは側面１３、１４を構成する３種類の面、２０は封止樹脂、ｗ０はインナーリード底面の幅、ｗ１はインナーリード上面の幅、ｗ２は左右側面間の最大幅を表している。
Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 is a partial perspective view of an inner lead of a lead frame for a lead-exposed package. FIG. 2 is a partial cross-sectional view of the inner lead in a state sealed with resin.
1 and 2, 1 is an inner lead, 2 is a drop-off preventing shape, 11 is an inner lead punched lower surface, 12 is an inner lead punched upper surface, 13, 14 are side surfaces, 13a to 13c, and 14a to 14c are side surfaces 13, 14 , 20 is the sealing resin, w0 is the width of the bottom surface of the inner lead, w1 is the width of the top surface of the inner lead, and w2 is the maximum width between the left and right side surfaces.
図１及び図２に示す本発明のインナーリードの脱落防止形状では、数１に示すインナーリード幅の関係を有している。この側面間最大幅：ｗ２がインナーリード打ち抜き下面の幅：ｗ０、或いはインナーリード打ち抜き上面の幅：ｗ１より大きいことにより、図２に示すようにインナーリード１が、封止樹脂２０による封止状態にある正規位置からずれて脱落するのを防ぐものであり、即ち、脱落防止形状２が、封止樹脂２０に対する楔となることで、インナーリード１が脱落防止形状２により封止樹脂２０に引っ掛かり脱落しない。 The inner lead drop-off preventing shape of the present invention shown in FIG. 1 and FIG. Since the maximum width between the side surfaces: w2 is larger than the width of the inner lead punched lower surface: w0 or the width of the inner lead punched upper surface: w1, the inner lead 1 is sealed with the sealing resin 20 as shown in FIG. In other words, the dropout prevention shape 2 becomes a wedge with respect to the sealing resin 20 so that the inner lead 1 is caught on the sealing resin 20 by the dropout prevention shape 2. Do not fall off.
この脱落防止形状２は、インナーリード１の側面１３、１４により構成されるもので、通常は左右対称形となっている。又、側面１３は、側面の構成面である面１３ａ、１３ｂ、１３ｃの３面、もう一方の側面１４は構成面の面１４ａ、１４ｂ、１４ｃの３面からなり、外側に向かって両凸形状になるように構成されている。
即ち、下記数１の関係を満たす側面形状であるなら、図１、２に示した形状以外のものであっても良い。
This drop-off preventing shape 2 is constituted by the side surfaces 13 and 14 of the inner lead 1 and is usually symmetrical. The side surface 13 is composed of three surfaces 13a, 13b, and 13c, which are constituent surfaces of the side surface, and the other side surface 14 is composed of three surfaces, that is, the constituent surfaces 14a, 14b, and 14c. It is configured to be.
In other words, any shape other than the shape shown in FIGS.
さらに、インナーリード１の断面は、図１、図３に示すように四角形状のインナーリード側面部への成形加工により、インナーリード１に生じる変形部を移動して、側面部に頂点を形成して断面が八角形状断面に形成され、その八角形状断面における上辺および下辺の端点である４つの頂点の内角が９０度より大きい八角形状断面であり、そのインナーリード１の八角形状断面における上辺及び下辺の端点である４つの頂点以外の頂点の内、対向する２つの頂点の内角が１８０度を越える凹多角形を採る八角形状断面である。Further, as shown in FIGS. 1 and 3, the cross section of the inner lead 1 is formed into a rectangular inner lead side surface by moving the deformed portion generated in the inner lead 1 to form a vertex on the side surface portion. The octagonal cross section is formed into an octagonal cross section, and the internal angles of the four vertices that are the end points of the upper side and the lower side in the octagonal cross section are octagonal cross sections larger than 90 degrees, and the upper side and the lower side in the octagonal cross section of the inner lead 1 Among the vertices other than the four vertices, which are the end points, the octagonal cross section takes a concave polygon in which the internal angles of two opposing vertices exceed 180 degrees.
次に、この脱落防止形状２の成形加工方法について、図３及び図４を用いて説明する。
図３は、脱落防止形状の成形工程図で、（ａ）、（ｂ）、（ｃ）、（ｄ）の順に成形加工されて脱落防止形状２がインナーリード１に形成される様子を示している。
図４は、そのとき用いるプレス金型の一例を示すもので、（ａ）は断面模式図、（ｂ）はプレス金型の説明図である。
図３において、１ａは打ち抜きダレ部、１ｂは変形部（余肉）、３０はプレス金型、３１はインナーリードの側面の打ち抜きダレ部に微細な成形加工を施す加工部、３２は、成形加工により生じた変形部（余肉）を樹脂からの脱落防止形状にする成形部、α、βはインナーリード側面を構成する各３面（１３ａ〜１３ｃ、１４ａ〜１４ｃ）を形成するための金型の構成角度（度）を示すもので、αは加工部、βは成形部が取りうる角度である。
Next, a method for forming the drop-off preventing shape 2 will be described with reference to FIGS.
FIG. 3 is a molding process diagram of the drop-off prevention shape, and shows a state in which the drop-off prevention shape 2 is formed on the inner lead 1 by molding in the order of (a), (b), (c), and (d). Yes.
FIG. 4 shows an example of a press die used at that time, where (a) is a schematic sectional view and (b) is an explanatory view of the press die.
In FIG. 3, 1a is a punching sag part, 1b is a deformed part (remaining thickness), 30 is a press die, 31 is a processing part that performs a fine molding process on the side part of the inner lead, and 32 is a molding process. Molded portion for forming the deformed portion (excess) generated by the above-described shape to prevent the resin from falling off, α and β are molds for forming each of the three surfaces (13a to 13c and 14a to 14c) constituting the inner lead side surface Is a processed portion, and β is an angle that can be taken by the molded portion.
図３に示すように、プレス成形により打ち抜かれたインナーリード１には打ち抜きダレ部１ａが存在し、この打ち抜きダレ部１ａをプレス金型３０の加工部３１により成形加工し、その結果生じた変形部１ｂ（余肉）が成形部３２に沿って図中の矢印（実線）のように移動して脱落防止形状２に成形される。なお、図３の矢印（破線）は、金型の動作方向を示している。 As shown in FIG. 3, the inner lead 1 punched by press molding has a punching sag portion 1 a, and this punching sag part 1 a is molded by the processing part 31 of the press die 30, and the resulting deformation The part 1b (remaining thickness) moves along the forming part 32 as indicated by the arrow (solid line) in the figure, and is formed into the drop-off preventing shape 2. In addition, the arrow (broken line) of FIG. 3 has shown the operation | movement direction of the metal mold | die.
図４は、本発明の脱落防止形状の形成に用いられるプレス金型の一例であるが、インナーリードの打ち抜きダレ部に対して微細な成形加工を施す加工部３１と、この加工部３１の成形加工により生じた変形部を脱落防止形状にする成形部３２を備えていることを特徴とするプレス金型である。
本発明のプレス金型は、これらの加工部３１及び成形部３２を備えていればどのような種類、形態の金型であっても良い。
FIG. 4 shows an example of a press die used for forming the drop-off preventing shape of the present invention. A processing part 31 for performing a fine forming process on the punching and sagging part of the inner lead, and molding of the processing part 31 are shown. It is a press die characterized by including a forming part 32 that makes a deformed part produced by processing a drop-off preventing shape.
The press die of the present invention may be a die of any kind and form as long as it includes these processed portion 31 and molded portion 32.
この加工部３１の構成角度αは９０〜１２０度の範囲において微細な成形加工を施すことができ、この構成角度αの範囲において、成形部３２の構成角度βは１００〜１５５度が脱落防止形状を形成するのに望ましい。 The forming angle 31 of the processed portion 31 can be finely formed in the range of 90 to 120 degrees. In the range of the forming angle α, the forming angle 32 of the forming portion 32 is 100 to 155 degrees. Desirable to form.
１ インナーリード
１ａ 打ち抜きダレ部
１ｂ 変形部
２ 脱落防止形状
１１ インナーリード打ち抜き下面
１２ インナーリード打ち抜き上面
１３ 側面
１３ａ、１３ｂ、１３ｃ 側面１３を構成する３面
１４ 側面
１４ａ、１４ｂ、１４ｃ 側面１４を構成する３面
２０ 封止樹脂
３０ プレス金型
３１ 加工部
３２ 成形部
DESCRIPTION OF SYMBOLS 1 Inner lead 1a Punching part 1b Deformation part 2 Fall-off prevention shape 11 Inner lead punching lower surface 12 Inner lead punching upper surface 13 Side surface 13a, 13b, 13c 3 side surface 14 which comprises the side surface 13 Side surface 14a, 14b, 14c Three surfaces 20 Sealing resin 30 Press mold 31 Processing part 32 Molding part
Claims (2)
前記八角形状断面における上辺および下辺の端点である４つの頂点の内角が９０度より大きい八角形状断面のインナーリードを有することを特徴とするリード露出型パッケージ用リードフレーム。 A lead frame for a lead-exposed package, comprising an inner lead having an octagonal cross section in which inner angles of four vertices which are end points of an upper side and a lower side in the octagonal cross section are larger than 90 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008102458A JP5120037B2 (en) | 2008-04-10 | 2008-04-10 | Lead frame for lead exposed package |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008102458A JP5120037B2 (en) | 2008-04-10 | 2008-04-10 | Lead frame for lead exposed package |
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| JP2009253201A JP2009253201A (en) | 2009-10-29 |
| JP2009253201A5 JP2009253201A5 (en) | 2010-07-08 |
| JP5120037B2 true JP5120037B2 (en) | 2013-01-16 |
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| JP3018542B2 (en) * | 1991-04-03 | 2000-03-13 | セイコーエプソン株式会社 | Lead frame and manufacturing method thereof |
| JP4372508B2 (en) * | 2003-10-06 | 2009-11-25 | ローム株式会社 | Lead frame manufacturing method, semiconductor device manufacturing method using the same, semiconductor device, and portable device and electronic device including the same |
| JP2006073570A (en) * | 2004-08-31 | 2006-03-16 | Renesas Technology Corp | Semiconductor device and its manufacturing method |
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