JP5111181B2 - 蛍光体および発光装置 - Google Patents
蛍光体および発光装置 Download PDFInfo
- Publication number
- JP5111181B2 JP5111181B2 JP2008071420A JP2008071420A JP5111181B2 JP 5111181 B2 JP5111181 B2 JP 5111181B2 JP 2008071420 A JP2008071420 A JP 2008071420A JP 2008071420 A JP2008071420 A JP 2008071420A JP 5111181 B2 JP5111181 B2 JP 5111181B2
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- phosphor
- orange
- light
- light emitting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
3CaO + 3C + N2 → Ca3N2 + 3CO
さらに、付活剤または共付活剤の希土類元素源としては、酸化ユウロピウム(Eu2O3)、酸化ランタン(La2O3)、または酸化セリウム(CeO2)等を用いる。
2 発光素子としての半導体発光素子
3 蛍光体としての橙赤色蛍光体
Claims (3)
- 一般式がCa1−xAl1+nSi1−nN3−nOn:Eux,Laxyで表され、
xは、0.005≦x≦0.05で、
yは、0.05≦y≦0.8で、
nは、0<n≦0.5である
ことを特徴とした蛍光体。 - 一般式がCa1−xAl1+nSi1−nN3−nOn:Eux,Laxy,Cexzで表され、
xは、0.005≦x≦0.05で、
yは、0.05≦y≦0.8で、
zは、0<z≦0.2で、
nは、0<n≦0.5である
ことを特徴とした蛍光体。 - 請求項1または2記載の蛍光体と、
短波長領域の光を発する発光素子と
を具備したことを特徴とした発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008071420A JP5111181B2 (ja) | 2008-03-19 | 2008-03-19 | 蛍光体および発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008071420A JP5111181B2 (ja) | 2008-03-19 | 2008-03-19 | 蛍光体および発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009227714A JP2009227714A (ja) | 2009-10-08 |
JP5111181B2 true JP5111181B2 (ja) | 2012-12-26 |
Family
ID=41243494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008071420A Active JP5111181B2 (ja) | 2008-03-19 | 2008-03-19 | 蛍光体および発光装置 |
Country Status (1)
Country | Link |
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JP (1) | JP5111181B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011508001A (ja) * | 2007-12-19 | 2011-03-10 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 赤色発光SiAlONベース材料 |
KR101215300B1 (ko) * | 2011-03-29 | 2012-12-26 | 순천대학교 산학협력단 | 산질화물계 형광체 |
KR101717241B1 (ko) * | 2011-10-17 | 2017-03-16 | 그리렘 어드밴스드 머티리얼스 캄파니 리미티드 | 질화물 적색 발광재료, 그것을 포함한 발광체 및 발광소자 |
JP6222612B2 (ja) * | 2014-03-06 | 2017-11-01 | 地方独立行政法人神奈川県立産業技術総合研究所 | 透明蛍光サイアロンセラミックスおよびその製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3837588B2 (ja) * | 2003-11-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | 蛍光体と蛍光体を用いた発光器具 |
JP4892861B2 (ja) * | 2005-04-27 | 2012-03-07 | 日亜化学工業株式会社 | 窒化物蛍光体及びそれを用いた発光装置 |
-
2008
- 2008-03-19 JP JP2008071420A patent/JP5111181B2/ja active Active
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Publication number | Publication date |
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JP2009227714A (ja) | 2009-10-08 |
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