JP5107281B2 - Electronic component, duplexer, communication module, communication apparatus, and electronic component manufacturing method - Google Patents

Description

  The disclosure of the present application relates to an electronic component, a duplexer, a communication module, a communication device, and a method for manufacturing the electronic component.

  As one of electronic components, a surface acoustic wave device (hereinafter referred to as a SAW device) is known. Surface acoustic wave devices are widely used in filter elements and oscillators of, for example, television receivers, video tape recorders, DVD (Digital Versatile Disk) recorders, mobile phones and the like.

  Currently, SAW devices are employed in various circuits that process radio signals in a frequency band of 45 MHz to 2 GHz, for example. Examples of circuits in which the SAW device is employed include a transmission band-pass filter, a reception band-pass filter, a local transmission filter, an antenna duplexer, an intermediate frequency filter, and an FM modulator. Further, there is a duplexer as a circuit including the reception filter and the transmission filter described above.

  FIG. 1 is a block diagram illustrating a schematic configuration of a duplexer. As illustrated in FIG. 1, the duplexer 102 includes a phase matching circuit 103, a reception filter 104, and a transmission filter 105. The duplexer 102 extracts a signal of only a predetermined frequency band from the reception signal input via the antenna 101 in the reception filter 104 and outputs the signal from the terminal 106. A transmission signal input via the terminal 107 is output from the antenna 101 via the transmission filter 105.

  In recent years, these signal processing devices have been reduced in size, and electronic components such as SAW devices used have been increasingly required to be downsized. In particular, surface-mounted and thin SAW devices have been required for portable electronic devices such as mobile phones.

  Patent Document 1 discloses a SAW device in which a package substrate, a SAW device chip, and a peripheral portion are brazed and sealed with a metal material such as solder.

  FIG. 2 is a cross-sectional view of the SAW device disclosed in Patent Document 1. As shown in FIG. In FIG. 2, the SAW device chip has an electrode 211 for exciting and receiving SAW on one main surface on the piezoelectric substrate 210. On the same main surface of the piezoelectric substrate 210, electrode pads 212 for inputting / outputting electric signals are arranged. Further, a sealing portion 203 is disposed on the outer peripheral surface of the SAW device chip.

  The package substrate 220 includes an external terminal 222, a pad portion 233 that is formed on the surface opposite to the external terminal 222 and electrically connected to the SAW device chip 210, and a sealing portion that faces the sealing portion 203 of the SAW device chip 210. 232.

  The external terminal 222 and the pad portion 233 are electrically connected by a through wiring 221 that penetrates the package substrate 220. The SAW device chip 210 and the package substrate 220 are so-called flip chip bonded via metal bumps 240.

  Further, in the region where the SAW device chip 210 and the package substrate 220 face each other, the vicinity of the outer peripheral edge of the SAW device chip 210 is hermetically sealed with a sealing solder 241.

  JP 2004-129193 A

  In the device chip disclosed in the patent document, since the device chip is covered with the exterior resin layer 250, the electromagnetic field is difficult to spread to the reception filter side, and the isolation of the transmission band does not deteriorate. However, since the electromagnetic field in the vicinity of the transmission filter remains widened, the transmission filter is affected by noise, which deteriorates the isolation of the reception band.

  An object of the present invention is to provide an electronic component, a duplexer, a communication module, a communication device, and a method for manufacturing the electronic component that improve the isolation characteristics of both the transmission filter and the reception filter.

  An electronic component disclosed in the present application is an electronic component that includes a substrate, a plurality of device chips mounted on the substrate, and a lid disposed so as to cover at least an upper portion of the device chip. The lid includes a conductive portion and an electrically insulated insulating portion, and the conductive portion covers at least a part of one of the plurality of device chips, and the insulating portion Covers at least a part of the other device chip among the plurality of device chips.

  A duplexer disclosed in the present application includes a substrate, a reception filter chip mounted on the substrate and including a reception filter circuit, a transmission filter chip mounted on the substrate and including a transmission filter circuit, and the reception filter chip And a duplexer provided to cover at least the upper part of the transmission filter chip, wherein the lid includes a conductive portion and an insulating portion that is electrically insulated. The conductive part covers at least a part of the transmission filter chip, and the insulating part covers at least a part of the reception filter chip.

  An electronic component manufacturing method disclosed in the present application includes a step of mounting a plurality of device chips on a substrate, a step of laminating a photosensitive resin sheet on the plurality of device chips, and irradiating the photosensitive resin sheet with ultraviolet light. Removing a photosensitive resin sheet on one of the plurality of device chips, placing a sheet-like solder on the one device chip, heating and melting the solder, Covering the device chip with solder.

  According to the disclosure of the present application, the isolation characteristics in both the transmission band and the reception band can be improved.

Duplexer block diagram Sectional drawing of the electronic component currently disclosed by patent document 1 The perspective view of the electronic component concerning this Embodiment The characteristic view which shows the isolation characteristic in the electronic component concerning this Embodiment Plan view of duplexer used in simulation Cross section of duplexer used in simulation Cross section of duplexer used in simulation Cross section of duplexer used in simulation Characteristic diagram showing the relationship between the distance between the boundary position and the origin position and the difference in isolation from the boundary origin A perspective view of a conventional duplexer Characteristic diagram showing isolation characteristics of duplexer The figure which shows the manufacturing process of the electronic component concerning this Embodiment The figure which shows the manufacturing process of the electronic component concerning this Embodiment The figure which shows the manufacturing process of the electronic component concerning this Embodiment The figure which shows the manufacturing process of the electronic component concerning this Embodiment The figure which shows the manufacturing process of the electronic component concerning this Embodiment The figure which shows the manufacturing process of the electronic component concerning this Embodiment The figure which shows the manufacturing process of the electronic component concerning this Embodiment Communication module block diagram Block diagram of communication device

  The electronic component in the embodiment of the present invention can take the following aspects.

  That is, in the electronic component, the device chip includes a transmission filter chip and a reception filter chip, and a boundary portion between the conductive portion and the insulating portion is a surface of the surface of the transmission filter chip that faces the reception filter chip. It can be set as the structure distribute | arranged to the position which overlaps with a direction, or its vicinity.

  In the electronic component, the conductive portion can be formed of solder. By setting it as such a structure, the electronic component excellent in manufacturability is realizable.

  In the electronic component, the insulating part can be made of resin. By setting it as such a structure, the electronic component excellent in manufacturability is realizable.

(Embodiment)
[1. Configuration of electronic parts)
FIG. 3 is a perspective view of a duplexer that is an example of the electronic component of the present embodiment. In the present embodiment, a duplexer has been described as an example of an electronic component, but any electronic component including at least a plurality of filters may be used. For example, a dual filter including a plurality of reception filters may be used.

  As shown in FIG. 3, in the duplexer, a reception filter chip 2, a transmission filter chip 3, and a matching circuit chip 4 are mounted on a package substrate 1 by flip chip bonding. The reception filter chip 2, the transmission filter chip 3, and the matching circuit chip 4 are covered with a lid 5.

  The lid 5 has a metal part 5a and a resin part 5b. The metal part 5a is only required to be formed of a material having conductivity, and is formed of solder containing tin (Sn), silver (Ag), copper (Cu) or the like as a main component as in the present embodiment. It is preferable. The resin part 5b should just be formed with the nonconductor at least, and it is preferable to form with a polyimide resin or an epoxy resin. The metal part 5 a covers at least the upper part of the transmission filter chip 3. The metal part 5a is bonded to a ground pattern (not shown) formed on the package substrate 1 and is electrically grounded. The resin part 5 b covers at least the upper parts of the reception filter chip 2 and the matching circuit chip 4.

  Since the transmission filter chip 3 is covered with the grounded metal part 5a, the electromagnetic wave generated in the vicinity of the transmission filter chip 3 falls to the ground. Therefore, since electromagnetic waves do not stay around the transmission filter chip 3, it is possible to reduce isolation in the reception band (hereinafter referred to as Rx band).

  In addition, since the reception filter chip 2 and the matching circuit chip 4 are covered with the resin portion 5b, electromagnetic waves generated in the vicinity of the transmission filter chip 3 do not spread to the reception filter chip 2 side. Isolation) can be reduced.

  FIG. 4 shows the result of analyzing the duplexer shown in FIG. 3 by electromagnetic field simulation. In FIG. 4, the characteristic of the solid line is an analysis result in the duplexer shown in FIG. The characteristics of the alternate long and short dash line is an analysis result in a duplexer (see, for example, FIG. 3) including a lid formed only of metal. The characteristic of the broken line is an analysis result in a duplexer provided with a lid formed only of resin.

  As shown in FIG. 4, when the lid is made of only metal, the isolation in the Tx band is deteriorated. In addition, when the lid is made of only resin, the isolation in the Rx band is deteriorated. On the other hand, the transmission filter chip 3 is covered with the metal part 5a of the lid 5 and the reception filter chip 2 side is covered with the resin part 5b of the lid 5 so that both the Rx band and the Tx band are isolated. Can be reduced.

  Hereinafter, the relationship between the position of the boundary 7 (see FIG. 3) between the metal part 5a and the resin part 5b in the lid 5 and the isolation will be described. In the present embodiment, as shown in FIG. 3, the isolation characteristic at an arbitrary position where the boundary 7 is displaced in the direction indicated by the arrow A or B with the position coincident with the end 3a of the transmission filter chip 3 as the origin. Was measured using electromagnetic field simulation.

  FIG. 5 is a plan view of a duplexer model used for electromagnetic field simulation. In FIG. 5, illustration of the lid 5 is omitted. As shown in FIG. 5, the model used for the electromagnetic field simulation is that the outer dimension of the package substrate 1 is 2.0 mm long × 2.5 mm wide, and the outer dimension of the reception filter chip 2 is 0.78 mm long × 1.2 mm wide. The outer dimension of the transmission filter chip 3 is 1.6 mm long by 0.8 mm wide, and the outer dimension of the matching circuit chip 4 is 0.8 mm long by 1.2 mm wide. Each of the reception filter chip 2 and the transmission filter chip 3 has a thickness of 0.25 mm. The thickness of the matching circuit chip 4 is 0.25 mm. The interval between the reception filter chip 2 and the transmission filter chip 3 is 0.1 mm.

  6A to 6C are cross-sectional views of the duplexer model used in the electromagnetic field simulation, and show a cross-section of the ZZ portion in FIG. FIG. 6A is a duplexer in which the position of the boundary 7 is arranged in the vicinity of the end on the transmission filter chip 3 side. FIG. 6B is a duplexer in which the position of the boundary 7 is arranged at a position that coincides with the end 3 a of the transmission filter chip 3. FIG. 6C shows a duplexer in which the position of the boundary 7 is arranged in the vicinity of the end on the reception filter chip 2 side. In the present embodiment, the position of the boundary 7 shown in FIG. 6B is defined as the origin position.

  FIG. 7 shows the results of electromagnetic field simulations using the models shown in FIGS. 5 and 6A to 6C. In FIG. 7, the plotted black dots are the difference values between the Rx band isolation at an arbitrary position of the boundary 7 and the Rx band isolation when the boundary 7 is at the origin position. The plotted white point is a difference value between the Tx band isolation at an arbitrary position of the boundary 7 and the Tx band isolation when the boundary 7 is at the origin position. In FIG. 7, a positive distance D is the distance between the position of the boundary 7 and the origin position when the position of the boundary 7 is arranged on the side indicated by the arrow A from the origin position shown in FIG. 6B. The negative distance D is the distance between the position of the boundary 7 and the origin position when the position of the boundary 7 is arranged on the side indicated by the arrow B from the origin position shown in FIG. 6B.

  When the boundary 7 is arranged at the position shown in FIG. 6A (distance D from the origin position is 925 μm), the chip mounted on the package substrate 1 is covered with the resin portion 5b, so the periphery of the transmission filter chip 3 is The generated electromagnetic wave affects the reception filter chip 2. Therefore, as shown in FIG. 7, the isolation in the Rx band is greatly changed compared to the isolation in the Rx band at the origin position (+16.5 dB with respect to the isolation at the origin position). The isolation of the Tx band is almost equivalent to the isolation of the Tx band at the origin position.

  When the boundary 7 is disposed at the position shown in FIG. 6C (the distance D from the origin position is −1575 μm), the chip mounted on the package substrate 1 is covered with the metal part 5 a grounded via the package substrate 1. Because. The electromagnetic wave generated around the transmission filter chip 3 does not spread greatly. Therefore, as shown in FIG. 7, the isolation in the Rx band can be reduced compared to the isolation when the boundary 7 is arranged at the position shown in FIG. 6A (+8 dB with respect to the isolation at the origin position). The isolation in the Tx band is higher than the isolation when the boundary 7 is arranged at the position shown in FIG. 6A (+4.5 dB with respect to the isolation at the origin position).

  As shown in FIG. 7, the isolation in the Rx band is preferably lower than the isolation difference value (8 dB) when the boundary 7 is arranged at the position shown in FIG. 6C. Also, the isolation in the Tx band is preferably lower than the isolation difference value (+4.5 dB) when the boundary 7 is arranged at the position shown in FIG. 6C. Therefore, as shown in the broken line frame in FIG. 7, by setting the distance D between the position of the boundary 7 and the origin position in the range of −500 to 300 μm, the difference value of the isolation in the Rx band is suppressed to less than 8 dB, and Tx This is preferable because the difference value of the band isolation can be kept lower than +4.5 dB.

  As described above, the reception filter chip 2 and the matching circuit chip 4 are covered with the resin portion 5b, and the transmission filter chip 3 is covered with the metal portion 5a, thereby reducing isolation in both the Rx band and the Tx band. Can do.

  Further, by covering a part of the transmission filter chip 3 with the metal portion 5a (in this embodiment, 0 <D ≦ 300 μm), it is possible to reduce isolation in both the Rx band and the Tx band.

  Further, the entire transmission filter chip 3 and a part of the reception filter chip 2 and the matching circuit chip 4 are covered with the metal part 5a (in this embodiment, −500 μm ≦ D <0). And isolation in both the Tx band can be reduced.

(Comparative example)
FIG. 8 is a perspective view of a duplexer having an acoustic wave device using a conventional package structure. As shown in FIG. 8, the duplexer has a reception filter chip 302, a transmission filter chip 303, and a matching circuit chip 304 mounted on a ceramic substrate 301. Further, the duplexer is sealed with a lid 305 (a chain line in FIG. 8) disposed so as to cover the reception filter chip 302, the transmission filter chip 303, and the matching circuit chip 304. The lid 305 is made of resin or metal. The lid 305 is electrically grounded via the package substrate 220 when formed of metal.

  In the duplexer shown in FIG. 8, the isolation characteristic between the transmission terminal 107 and the reception terminal 106 of the duplexer may change depending on the material of the lid 305 covering the back surface of the device chip.

  FIG. 9 shows the isolation characteristics of a lid body made of resin and a lid body made of metal. In FIG. 9, the solid line shows the isolation characteristic when the lid is formed of resin, and the broken line shows the isolation characteristic when the lid is formed of metal. Also, the low frequency side shows the transmission band of the transmission filter (hereinafter referred to as Tx band), and the high frequency side shows the isolation characteristic of the reception filter pass band (hereinafter referred to as Rx band).

  As shown in FIG. 9, when the lid is made of metal, the isolation in the Tx band is deteriorated. Further, when the lid is formed of resin, the isolation in the Rx band is deteriorated. The cause of such deterioration of the isolation is due to the influence of noise caused by the electromagnetic field generated by the transmission filter.

  That is, when the lid is made of metal, the electromagnetic field near the transmission filter is difficult to spread, the influence of noise is reduced, and the isolation in the Rx band is reduced. However, since the lid is made of metal, the back side of each chip has the same electric field, and the electromagnetic field spreads to the reception filter side. Accordingly, noise caused by the electromagnetic field affects the reception filter side, and the isolation in the Tx band is deteriorated.

  On the other hand, when the lid is made of resin, the electromagnetic field does not easily spread to the reception filter side, so that the isolation in the Tx band does not deteriorate. However, since the electromagnetic field in the vicinity of the transmission filter is still widened, the transmission filter is affected by noise, and the isolation in the Rx band is deteriorated.

[2. Manufacturing method of electronic components]
Hereinafter, a manufacturing method of a duplexer which is an example of the electronic component according to the present embodiment will be described.

  10A to 10G show a duplexer manufacturing process according to the present embodiment. 10A, FIG. 10B, FIG. 10D, FIG. 10E, and FIG. 10G, (a) shows a plan view, and (b) shows a cross-sectional view of the ZZ portion in (a).

  First, as shown in FIG. 10A, an electronic component is flip-chip bonded and mounted on a package substrate 1 formed of ceramic that can be multi-faced. The electronic components to be mounted are the reception filter chip 2, the transmission filter chip 3, and the matching circuit chip 4.

  Next, as shown in FIG. 10B, a photosensitive resin sheet 16 is laminated on the electronic component mounted on the package substrate 1.

  Next, as shown in FIG. 10C, the exposure mask sheet 11 is disposed on the photosensitive resin sheet 16. Next, ultraviolet light is irradiated from the upper part of the exposure mask sheet 11 toward the photosensitive resin sheet 16. At this time, the exposure mask sheet 11 is formed with an exposure pattern so that ultraviolet light is irradiated to the side of the transmission filter chip 3 in the photosensitive resin sheet 16. By performing the exposure and development processing, as shown in FIG. 10D, the reception filter chip 2, the matching circuit chip 4, and a part of the transmission filter chip 3 can be covered with resin.

  Next, as shown in FIG. 10E, the solder sheet 15 is laminated on the photosensitive resin sheet 16. Next, the heat-resistant polyimide sheet 12 is laminated on the solder sheet 15. The solder sheet 15 and the heat-resistant polyimide sheet 12 are laminated so as to cover at least the transmission filter chip 3 exposed through the photosensitive resin sheet 16. The solder sheet 15 is a sheet-like metal plate containing Sn, Ag, Cu or the like.

  Next, as shown in FIG. 10F, the entire package is heated while pressing the upper portion of the heat-resistant polyimide sheet 12 in the direction indicated by the arrow. The solder sheet 15 is dissolved by heating. The solder melted from the solder sheet 15 is filled in a portion of the transmission filter chip 3 that is not covered with the photosensitive resin sheet 16.

  Next, as shown in FIG. 10G, after the package substrate 1 is cooled, the heat-resistant polyimide sheet 12 is removed. Next, the package substrate 1 is diced into individual pieces. Through the above process, a duplexer in which the transmission filter chip 3 is mainly coated with metal (solder sheet 15) and the reception filter chip 2 and the matching circuit chip 4 are coated with resin (photosensitive resin sheet 16) is completed.

  In the above manufacturing process, the reception filter chip 2, the matching circuit chip 4, and a part of the transmission filter chip 3 are covered with the photosensitive resin, but only a part of the reception filter chip 2 and a part of the matching circuit chip 4 are covered. May be covered with a photosensitive resin, and the transmission filter chip 3 may be covered with a solder sheet 15.

[3. (Configuration of communication module)
FIG. 11 shows an example of a communication module including a duplexer having the structure of the electronic component according to the present embodiment. As shown in FIG. 11, the duplexer 62 includes a reception filter 62a and a transmission filter 62b. The reception filter 62a is connected to reception terminals 63a and 63b corresponding to, for example, balanced output. The transmission filter 62b is connected to the transmission terminal 65 via the power amplifier 64. Here, the duplexer 62 can be realized by a duplexer having the structure of the electronic component according to the present embodiment.

  When performing a reception operation, the reception filter 62a passes only a signal in a predetermined frequency band among reception signals input via the antenna terminal 61, and outputs the signal from the reception terminals 63a and 63b to the outside. Further, when performing a transmission operation, the transmission filter 62b passes only a signal in a predetermined frequency band among transmission signals input from the transmission terminal 65 and amplified by the power amplifier 64, and outputs the signal from the antenna terminal 61 to the outside. To do.

  As described above, by providing the communication module with the duplexer having the structure of the electronic component according to the present embodiment, a communication module with improved isolation characteristics can be realized.

  The configuration of the communication module shown in FIG. 11 is an example, and the same effect can be obtained even when the electronic component of the present invention is mounted on a communication module of another form.

[4. Configuration of communication device]
FIG. 12 shows an RF block of a mobile phone terminal as an example of a duplexer having the structure of the electronic component according to the present embodiment or a communication device including the above-described communication module. The configuration shown in FIG. 12 shows the configuration of a mobile phone terminal that supports the GSM (Global System for Mobile Communications) communication system and the W-CDMA (Wideband Code Division Multiple Access) communication system. Further, the GSM communication system in the present embodiment corresponds to the 850 MHz band, 950 MHz band, 1.8 GHz band, and 1.9 GHz band. In addition to the configuration shown in FIG. 12, the mobile phone terminal includes a microphone, a speaker, a liquid crystal display, and the like, but the illustration is omitted because they are not necessary in the description of the present embodiment. Here, the duplexer 73 can be realized by a duplexer having the structure of the electronic component according to the present embodiment.

  First, the received signal input via the antenna 71 selects an LSI to be operated by the antenna switch circuit 72 depending on whether the communication method is W-CDMA or GSM. When the input received signal is compatible with the W-CDMA communication system, switching is performed so that the received signal is output to the duplexer 73. The reception signal input to the duplexer 73 is limited to a predetermined frequency band by the reception filter 73 a, and a balanced reception signal is output to the LNA 74. The LNA 74 amplifies the input received signal and outputs it to the LSI 76. The LSI 76 performs a demodulation process on the audio signal based on the input received signal, and controls the operation of each unit in the mobile phone terminal.

  On the other hand, when transmitting a signal, the LSI 76 generates a transmission signal. The generated transmission signal is amplified by the power amplifier 75 and input to the transmission filter 73b. The transmission filter 73b passes only a signal in a predetermined frequency band among input transmission signals. The transmission signal output from the transmission filter 73 b is output from the antenna 71 to the outside via the antenna switch circuit 72.

  In addition, when the received signal to be input is a signal corresponding to the GSM communication system, the antenna switch circuit 72 selects any one of the reception filters 77 to 80 according to the frequency band and outputs the received signal. To do. A reception signal whose band is limited by any one of the reception filters 77 to 80 is input to the LSI 83. The LSI 83 performs a demodulation process on the audio signal based on the input received signal, and controls the operation of each unit in the mobile phone terminal. On the other hand, when transmitting a signal, the LSI 83 generates a transmission signal. The generated transmission signal is amplified by the power amplifier 81 or 82 and output from the antenna 71 to the outside via the antenna switch circuit 72.

  By providing the communication device with a duplexer having the structure of the electronic component according to the present embodiment, or a communication module including such a duplexer, a communication device with improved isolation characteristics can be realized.

[5. Effects of the embodiment, etc.]
According to the electronic component according to the present embodiment, the transmission filter chip 3 is covered with the metal portion 5a, and the lid 5 that covers the reception filter chip 2 and the matching circuit chip 4 with the resin portion 5b is provided. Both band and Tx band isolation can be improved.

Further, according to the electronic component according to the present embodiment, the isolation characteristics can be improved without changing the wiring layout of the package substrate. Generally, in order to improve the isolation characteristics between the transmission filter and the reception filter, a ground pattern may be formed between the transmission filter chip and the reception filter chip. However, a ceramic substrate used as a package substrate has a wiring pattern pre-fired, so the layout of the wiring pattern cannot be easily changed, and a ground pattern is newly provided between the transmission filter chip and the reception filter chip. Difficult to add to. Therefore, as in the present embodiment, by adopting a configuration in which the transmission filter chip 3 side is covered with a conductor, it is not necessary to newly add a ground pattern on the package substrate. Therefore, the isolation characteristic can be improved without changing the wiring layout of the package substrate. The metal part 5a in the lid 5 is electrically joined to the ground pattern of the package substrate 1. However, since the ground pattern for joining the lid 5 is conventionally provided, the configuration according to the present embodiment. Even if it is adopted, there is no need to add a new ground pattern,
Moreover, since the metal part 5a can be formed only by heating by forming the metal part 5a with solder, the productivity can be improved.

  Moreover, since the resin part 5b can be formed by the exposure process using an exposure mask by forming the resin part 5b with a polyimide resin or an epoxy resin, productivity can be improved.

  The reception filter chip 2, the transmission filter chip 3, and the matching circuit chip 4 in the present embodiment are examples of device chips in the present invention. The package substrate 1 in the present embodiment is an example of a substrate in the present invention. The lid 5 in the present embodiment is an example of the lid in the present invention. The metal part 5a in this Embodiment is an example of the conductor part in this invention. Resin portion 5b in the present embodiment is an example of an insulating portion in the present invention.

  The electronic component of the present invention is useful for an electronic component such as a surface acoustic wave device that can be used in filter elements and oscillators of various electronic devices. Moreover, it is useful for the manufacturing method of such an electronic component. Moreover, it is useful for a duplexer, a communication module, and a communication device in which such electronic components are mounted.

DESCRIPTION OF SYMBOLS 1 Package substrate 2 Reception filter chip 3 Transmission filter chip 4 Matching circuit chip 5 Lid 5a Metal part 5b Resin part

Claims (7)

A substrate,
Rutotomoni mounted on the substrate, a plurality of device chips including a transmission filter chip and the receiving filter chip,
An electronic component comprising a lid arranged to cover at least the upper part of the device chip,
The lid includes a conductive portion and an insulating portion formed of a non-conductor,
The conductive portion covers at least a part of the transmission filter chip , the insulating portion covers at least a part of the reception filter chip , and
An electronic component, wherein a boundary portion between the conductive portion and the insulating portion is disposed at a position overlapping the surface direction of the surface of the transmission filter chip facing the reception filter chip or in the vicinity thereof. The conductive portion is formed by solder, claim 1 Symbol mounting electronic components. The insulating portion is formed of a resin, 1 Symbol mounting electronic component of claim. A substrate,
A reception filter chip mounted on the substrate and provided with a reception filter circuit;
A transmission filter chip mounted on the substrate and provided with a transmission filter circuit;
A duplexer comprising a lid arranged to cover at least the upper part of the reception filter chip and the transmission filter chip,
The lid includes a conductive portion and an insulating portion formed of a non-conductor,
The conductive portion covers at least a part of the transmission filter chip, the insulating portion covers at least a part of the reception filter chip , and
The duplexer is arranged at a position where a boundary portion between the conductive portion and the insulating portion overlaps in a surface direction of a surface of the transmission filter chip facing the reception filter chip or in the vicinity thereof . The communication module provided with the electronic component as described in any one of Claims 1-3 , or the duplexer as described in Claim 4 . A communication device comprising the communication module according to claim 5 . Mounting a plurality of device chips including a transmission filter chip and a reception filter chip on a substrate;
Laminating a photosensitive resin sheet on the plurality of device chips;
Irradiating the photosensitive resin sheet with ultraviolet light, and removing the photosensitive resin sheet on the transmission filter chip among the plurality of device chips;
Arranging a sheet-like solder on the transmission filter chip ;
The solder is heated and melted, and a boundary portion between the solder and the photosensitive resin sheet is arranged at or near a position where the boundary of the surface of the transmission filter chip facing the reception filter chip overlaps. And a step of coating the transmission filter chip with solder.

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