JP5106278B2 - Substrate cleaning apparatus, substrate cleaning method, and storage medium - Google Patents

Description

  The present invention relates to a substrate cleaning apparatus, a substrate cleaning method, and a storage medium for brush cleaning a peripheral portion including an end surface of a substrate.

  In a semiconductor device manufacturing process and a flat panel display (FPD) manufacturing process, a cleaning process is performed to remove particles, contamination, and the like adhering to a semiconductor wafer or glass substrate as a substrate to be processed. As a device for performing such a cleaning process, there is known a single wafer cleaning device that holds a substrate on a spin chuck and supplies a cleaning liquid to the surface of the wafer while the substrate is rotated to clean the surface of the wafer. ing.

  In the cleaning process of such a cleaning apparatus, the acid or alkali chemical used as the cleaning liquid remains on the periphery of the substrate in the course of the cleaning process, and is dried as it is to become a deposit or removed by cleaning. It occurs that the material redeposits on the periphery of the substrate. In the past, since the peripheral part of the substrate is not used as a product, no special measures have been taken against such deposits on the peripheral part of the substrate. Adverse effects caused by the adhering material attached to the substrate support arm or the like of the substrate transport mechanism have become apparent. As a technique for preventing such an adverse effect, a technique has been proposed in which a sponge-like brush is brought into contact with the peripheral edge of the substrate to remove deposits on the peripheral edge (for example, Patent Documents 1 and 2).

However, there are various attachment forms of the deposit on the peripheral edge of the substrate. For example, there are cases where the deposit mainly adheres to the peripheral edge of the back surface, and there are cases where the adherent adheres to the peripheral edge of both the back surface and the front surface. Yes, it is difficult to effectively remove deposits simply by bringing a sponge-like brush into contact therewith.
Japanese Utility Model Publication No. 5-79939 JP 2007-165794 A

The present invention has been made in view of such circumstances, and a substrate cleaning apparatus and a substrate cleaning capable of appropriately and effectively removing deposits adhered to a peripheral portion including an end surface of a substrate according to the adhesion state. It aims to provide a method.
Moreover, it aims at providing the storage medium which memorize | stored the program for implementing such a method.

In order to solve the above-mentioned problems, according to a first aspect of the present invention, there is provided a substrate cleaning apparatus for brush cleaning a peripheral portion including an end surface of a substrate, the substrate holding mechanism for rotatably holding the substrate, and the substrate holding A substrate rotating mechanism for rotating a substrate held by the mechanism, a cleaning liquid supply mechanism for supplying a cleaning liquid to the substrate held by the substrate holding mechanism, and a cleaning mechanism having a brush for cleaning a peripheral portion including the end face of the substrate The brush has a plurality of cleaning parts having different cleaning functions, selects an appropriate cleaning part according to the adhesion state of the deposit on the substrate, and the peripheral part including the end face of the substrate in the cleaning part The brush has a cylindrical small-diameter portion and a cylindrical large-diameter portion continuous to the small-diameter portion, and is a first cleaning portion that is a joint portion between the small-diameter portion and the large-diameter portion. And a notch formed in the peripheral surface of the large diameter portion. A peripheral surface of the small diameter portion abuts against an end surface of the substrate, and a connection surface of the large diameter portion with the small diameter portion is a back surface of the substrate or a second cleaning portion. The incision that contacts the peripheral edge of the surface, cleans the edge of the substrate and the peripheral edge of the back surface or the front surface of the substrate, and forms the second cleaning portion depends on the shape of the peripheral edge of the substrate to be cleaned The substrate cleaning is characterized in that the second cleaning section cleans the end surface of the substrate and the back surface and the peripheral edge of the surface with the peripheral edge of the substrate inserted into the notch. Providing equipment.

  In the first aspect, there is provided a control mechanism that selects an appropriate cleaning unit according to the adhesion state of the deposit on the substrate, and controls the position of the brush so as to clean the peripheral portion of the substrate with the selected cleaning unit. Furthermore, it can comprise.

  As the brush, those made of sponge-like resin can be suitably used. The cleaning mechanism includes a brush rotating mechanism for rotating the brush and an contacting / separating mechanism for contacting / separating the brush with respect to the substrate, and the brush rotated by the brush rotating mechanism removes the contacting / separating mechanism. The substrate can be brought into contact with the substrate rotated by the substrate rotating mechanism by the mechanism, and the peripheral portion including the end surface of the substrate can be cleaned in that state.

According to a second aspect of the present invention, there is provided a substrate cleaning method for brush cleaning a peripheral portion including an end surface of a substrate, wherein a brush having a plurality of cleaning portions having different cleaning functions is used, and the substrate adheres to the adhesion state of deposits. An appropriate cleaning part, and the cleaning part of the substrate is cleaned by the cleaning part , the brush has a cylindrical small diameter part and a cylindrical large diameter part continuous to the small diameter part, A first cleaning unit that is a joint between the small-diameter portion and the large-diameter portion; and a second cleaning unit that includes a notch formed on a peripheral surface of the large-diameter portion, and the first cleaning unit. The peripheral surface of the small-diameter portion is in contact with the end surface of the substrate, the connection surface of the large-diameter portion with the small-diameter portion is in contact with the back surface or the peripheral edge of the surface, and the end surface of the substrate and the substrate The rear surface or the peripheral edge of the front surface is cleaned, and the notches constituting the second cleaning portion are cleaned. In the second cleaning unit, the edge surface of the substrate, the back surface of the substrate, and the periphery of the surface are inserted in the state where the periphery of the substrate is inserted into the notch. It provides a substrate cleaning method characterized by washing.

  As the brush, those made of sponge-like resin can be suitably used. Further, it is preferable that the brush is brought into contact with a peripheral portion including an end surface of the substrate being rotated while the brush is rotated for cleaning.

According to a third aspect of the present invention, there is provided a storage medium that operates on a computer and stores a program for controlling the substrate cleaning apparatus, and the program is stored in the computer so that the substrate cleaning method is performed at the time of execution. Provided is a storage medium that controls the substrate cleaning apparatus .

  According to the present invention, when brush cleaning the peripheral portion including the end surface of the substrate, a brush having a plurality of cleaning portions having different cleaning functions is used, and an appropriate cleaning portion is selected according to the adhesion state of the deposit on the substrate. And since the peripheral part including the end surface of a board | substrate is wash | cleaned in the washing | cleaning part, the deposit | attachment adhering to the peripheral part containing the end surface of a board | substrate can be removed appropriately and effectively according to the adhesion condition.

  Embodiments of the present invention will be specifically described below with reference to the accompanying drawings. FIG. 1 is a schematic configuration diagram showing a wafer cleaning apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view of the inside thereof.

  This wafer cleaning apparatus 1 has a chamber 2, and a spin chuck 3 for adsorbing and holding a semiconductor wafer (hereinafter simply referred to as a wafer) W as a substrate to be cleaned by vacuum suction in a horizontal state. Is provided. The spin chuck 3 can be rotated by a motor 4 provided below the chamber 2 via a shaft 3a. A cup 5 is provided in the chamber 2 so as to cover the wafer W held by the spin chuck 3. An exhaust / drain pipe 6 for exhaust and drainage is provided at the bottom of the cup 5 so as to extend below the chamber 2. On the side wall of the chamber 2, a loading / unloading port 7 for loading / unloading the wafer W is provided. A fluid seal 8 is provided between the shaft 3 a and the bottom of the cup 5 and the bottom of the chamber 2.

  The wafer cleaning apparatus 1 further includes a cleaning liquid supply mechanism 10 for supplying a cleaning liquid and a cleaning mechanism 20 for brush cleaning the peripheral edge of the wafer W.

  The cleaning liquid supply mechanism 10 includes a front surface side cleaning liquid nozzle 11 a provided above the cup 5 and a back surface side cleaning liquid nozzle 11 b provided on the back surface side of the wafer W held by the spin chuck 3. A front surface side cleaning liquid supply pipe 13a and a back surface side cleaning liquid supply pipe 13b are connected to the nozzle 11a and the back surface side cleaning liquid nozzle 11b, respectively. The other ends of the front surface side cleaning liquid supply pipe 13 a and the back surface side cleaning liquid supply pipe 13 b are connected to a common cleaning liquid supply source 12. Then, the cleaning liquid is supplied from the cleaning liquid supply source 12 to the vicinity of the center of the surface of the wafer W from the front surface side cleaning liquid nozzle 11a through the front surface side cleaning liquid supply pipe 13a, and from the back surface side cleaning liquid nozzle 11b to the wafer from the rear surface side cleaning liquid supply pipe 13b. A cleaning liquid is supplied to the back surface of W. Valves 14a and 14b are interposed in the front surface side cleaning liquid supply pipe 13a and the back surface side cleaning liquid supply pipe 13b, respectively. As the cleaning liquid, pure water, chemical liquid, or the like can be used.

  The cleaning mechanism 20 includes a brush 21 for cleaning the peripheral edge and the end surface of the wafer W, a rotation support member 22 that rotatably supports the brush 21, a rotation arm 25 for rotating the brush 21, and a rotation. A shaft portion 26 having a built-in rotating shaft serving as a rotating shaft of the moving arm 25, a rotating mechanism for rotating the rotating shaft to rotate the rotating arm 25, and an elevating mechanism for moving the rotating arm 25 up and down are incorporated. And a rotating / elevating part 27.

  FIG. 3 is a sectional view showing the cleaning mechanism in more detail. The rotation support member 22 has a cylindrical shape extending in the vertical direction, and a brush attachment portion 24 is provided at the center of the lower end portion thereof. A brush support shaft (not shown) extending in the vertical direction is provided at the center of the brush 21, and the brush support shaft is attached to the brush attachment portion 24.

  The rotating arm 25 has a horizontally extending rectangular tube shape, and a rotation support member 22 is rotatably provided at a tip portion thereof. In other words, the rotation support member 22 is rotatably supported by a pair of bearings 31 a and 31 b attached to the rotation arm 25. A pulley 32 is fitted around the center of the rotation support member 22, and a belt 33 is wound around the pulley 32. The belt 33 extends horizontally in the internal space of the rotating arm 25. In addition, a brush rotation motor 34 is provided inside the rotation arm 25 so as to be fixed to the bottom plate, and a pulley 35 is attached to a rotation shaft 34a of the brush rotation motor 34. The belt 33 is wound around the pulley 35. Therefore, by driving the motor 34, the rotation support member 22 is rotated via the belt 33, and the brush 21 is rotated accordingly.

  A vertically extending rotating shaft 38 is fixed to a base end portion of the rotating arm 25 by a pair of fixing members 39 provided on the upper and lower sides of the rotating arm 25. The rotating shaft 38 extends through the shaft portion 26 to the rotating / lifting portion 27.

  The rotating / elevating unit 27 includes a casing 41 that continues below the shaft unit 26, and a rotating mechanism 42 and an elevating mechanism 45 that are provided therein. The rotation mechanism 42 has a rotation motor 43, the rotation axis of which is connected to the lower end of the rotation shaft 38, and is fixed to the rotation shaft 38 by driving the rotation motor 43 to rotate. The rotating arm 25 is rotated. The elevating mechanism 45 includes a support member 46 that rotatably supports the rotating shaft 38 via a bearing 47, a ball screw 48 that extends vertically upward from the bottom of the housing 41, and is screwed with the support member 46, and a housing. A lifting motor 49 that is fixed to the bottom plate of the body 41 and rotates the ball screw 48, and a guide member 50 that is provided vertically in the housing 41 and guides the support member 46. That is, the elevating mechanism 45 elevates and lowers the rotating shaft 38 by the ball screw mechanism, and accordingly elevates the rotating arm 25. Then, the rotating arm 25 is rotated by the rotating mechanism 42 and the rotating arm 25 is moved up and down by the lifting mechanism 45 so that the brush 21 is pressed against the peripheral portion including the end surface of the wafer W with a desired pressing force. It has become.

  FIG. 4 is an enlarged side view showing the brush 21. The brush 21 has a cylindrical small diameter portion 21a and a cylindrical large diameter portion 21b continuous below the small diameter portion 21a. And the joining part 21c of the small diameter part 21a and the large diameter part 21b functions as the 1st washing | cleaning part 21d. Further, a notch 21e having a wedge-shaped cross section is formed in the circumferential surface of the large diameter portion 21b along the circumferential direction, and the notch 21e functions as the second cleaning portion 21f. In the first cleaning unit 21d, the peripheral surface of the small diameter portion 21a abuts on the end surface of the wafer W, and the connection surface of the large diameter portion 21b with the small diameter portion 21a contacts the peripheral portion of the back surface of the wafer W, thereby The edge surface of the wafer W and the peripheral edge of the back surface of the wafer W can be cleaned. In the second cleaning unit 21f, the edge surface of the wafer W and the periphery of the back surface and front surface of the wafer W can be cleaned in a state where the periphery of the wafer W is inserted into the notch 21e.

  By forming the first cleaning unit 21d and the second cleaning unit 21f as described above, it is possible to perform the cleaning process by selecting either one according to the adhesion state of the deposit on the wafer W.

  Since the brush 21 is made of sponge-like resin, both the first cleaning unit 21d and the second cleaning unit 21f are used as the cleaning target portion of the wafer W when the cleaning liquid is supplied and swollen. It is easy to adhere and a high cleaning effect can be obtained. The angle of the notch 21e at this time can be appropriately set between 0 and 90 ° depending on a necessary cleaning function. Further, from the viewpoint of further improving the adhesion by improving the adhesion, it is preferable that the shape of the notch 21e is a shape corresponding to the peripheral portion of the wafer W. For example, as shown in the cross-sectional view of FIG. 5, by making the shape of the notch 21 e into a shape corresponding to the bevel B formed at the peripheral edge of the wafer W, the adhesion is further increased. However, in the case of FIG. 5, since it takes time to process the brush 21, the configuration as shown in FIG. 5 may be adopted when an effect of improving the cleaning performance commensurate with the time is obtained.

  The brush 21 is made of a sponge-like resin as described above, and polyvinyl alcohol (PVA) can be suitably used. Examples of other resins applicable to the brush 21 include polyethylene (PE).

  As shown in the block diagram of FIG. 6, the control unit 30 includes a controller 61, a user interface 62, and a storage unit 63. The controller 61 controls each component of the substrate cleaning apparatus 1, for example, the motor 4, the brush rotation motor 34, the rotation motor 43, and the lifting motor 49. The user interface 62 is connected to the controller 61 and includes a keyboard on which an operator inputs commands and the like to manage the wafer cleaning apparatus 1, a display that visualizes and displays the operation status of the wafer cleaning apparatus 1, and the like. . The storage unit 63 is also connected to the controller 61, and a control program for controlling the control target of each component of the wafer cleaning apparatus 1, a program for causing the wafer cleaning apparatus 1 to perform predetermined processing, that is, Processing recipe is stored. The processing recipe is stored in a storage medium in the storage unit 63. The storage medium may be a fixed medium such as a hard disk or a portable medium such as a CDROM, DVD, or flash memory. Moreover, you may make it transmit a recipe suitably from another apparatus via a dedicated line, for example. Then, the controller 61 calls and executes an arbitrary processing recipe from the storage unit 63 according to an instruction from the user interface 62 or the like as necessary, and thereby a predetermined process is performed under the control of the controller 61.

  Next, a processing operation for cleaning the wafer W by using the wafer cleaning apparatus 1 will be described.

  First, a predetermined brush 21 is attached to the rotation support member 22. Then, the wafer W is loaded into the chamber 2 with the brush 21 retracted outside the wafer W, and the wafer W is held by the spin chuck 3. At this time, for example, as shown in FIG. 5, a brush 21 having a shape corresponding to the shape of the peripheral edge of the wafer including the bevel B is used. When the brush 21 is in the retracted position, cleaning liquid is supplied to the brush 21 to prevent the brush 21 from drying. In this state, the motor 4 is driven to rotate the wafer W together with the spin chuck 3 at a predetermined number of revolutions, and while supplying the cleaning liquid from the cleaning liquid nozzle 11, the brush rotation motor 34 moves the brush 21 together with the brush support member 22. Rotate.

  Next, the height of the rotary arm 25 is adjusted by the elevating mechanism 45, and either the first cleaning unit 21 d or the second cleaning unit 21 f is placed on the wafer W according to the adhesion state of the deposit on the wafer W. Further, the rotating mechanism 25 is rotated toward the wafer W on the spin chuck 3 by the rotating mechanism 42 so that the peripheral portion including the end surface of the wafer W is moved to the first cleaning unit 21d and the second cleaning unit 21d. It is located in any one of the cleaning parts 21f. That is, in the case where deposits are mainly attached to the peripheral surface and the end surface of the back surface of the wafer W, the peripheral portion including the end surface of the wafer W is positioned in the first cleaning unit 21d, and the peripheral surface of the small diameter portion 12a is The end surface of the wafer W rotated by the rotating brush 21 while being brought into contact with the end surface of the wafer W and contacting the peripheral surface of the back surface of the wafer W with the connection surface of the large diameter portion 21b with the small diameter portion 21a. And the peripheral part of the back surface is cleaned. At this time, the supply of the cleaning liquid causes the brush 21 to swell, and the wafer W can be cleaned with water pressure. On the other hand, in the case where deposits adhere not only to the edge surface and back surface periphery of the wafer W but also to the surface periphery, the periphery including the end surface of the wafer W is inserted into the notch 21e and the second cleaning unit 21f. To be located. Since the brush existing in the second cleaning portion 21f has a shape corresponding to the shape of the peripheral portion of the wafer W including the bevel B, the peripheral portion and the end surface of the back surface and the front surface of the wafer W when swollen with the cleaning liquid. The edge of the rotating wafer W, the back surface, and the peripheral edge of the surface can be effectively cleaned by the rotating brush 21.

  The selection of the cleaning unit at this time may be performed based on data input in advance by the control unit 30, or the state of the adhered matter on the wafer W is detected by an appropriate detector each time, and the detection data is used. The control unit 30 may perform in real time.

  According to the present embodiment, in this way, a cleaning unit having a different cleaning function is selected according to the adhesion state of the deposit on the peripheral portion including the end surface of the wafer W, and the end surface of the wafer W is selected by the selected cleaning unit. Since the peripheral portion including the wafer is cleaned, the adhering matter adhering to the peripheral portion including the end face of the wafer W can be appropriately and effectively removed according to the attachment state.

  Note that the cleaning region can be changed when cleaning is performed by the second cleaning unit 21f. For example, as shown in the cross-sectional view of FIG. 7, if the diameter of the portion below the notch 21e is increased, the cleaning region of the back surface peripheral portion of the wafer W can be made wider than the cleaning region of the front surface peripheral portion. On the other hand, if the diameter of the portion above the notch 21e is increased, the cleaning region of the surface peripheral portion can be widened.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. For example, in the above-described embodiment, the brush 21 having the small-diameter portion 21a at the upper portion and the large-diameter portion 21b at the lower portion is used, and the bonding portion 21c is used as the first cleaning portion 21d to clean the end surface and the back surface peripheral portion of the wafer W. However, as shown in the side view of FIG. 8, a brush 21 'having an upper portion as a large diameter portion 21a' and a lower portion as a small diameter portion 21b 'is used, and these joint portions 21c' are first cleaned. You may make it wash | clean the end surface and surface peripheral part of the wafer W as part 21d '.

  Further, the number of cleaning parts is not limited to two, and may be three or more. For example, as shown in the side view of FIG. 9, a small diameter part 21a ″ is further provided below the large diameter part 21b, A brush 21 ″ that cleans the edge surface and the peripheral edge of the back surface of the wafer W may be used by using the joint portion 21g between the portion 21b and the small diameter portion 21a ″ as the third cleaning portion 21h.

  In addition to these examples, the shape of the brush, the form of the cleaning section, and the number of cleaning sections are arbitrary, and can be set as appropriate according to the cleaning function to be obtained.

  Furthermore, in the above embodiment, only the cleaning mechanism for cleaning the edge surface and the back surface peripheral edge of the wafer has been described, but an appropriate cleaning mechanism for cleaning the surface of the wafer may be provided. In this case, the brush 21 in the above embodiment is also used for cleaning the wafer surface. As shown in FIG. 10A, the brush 21 is rotated in the opposite direction to the wafer W while rotating the wafer W, and the cleaning liquid is supplied. While cleaning the surface of the wafer W with the lower surface of the brush 21, and then rotating the wafer W and the brush 21, the first cleaning section 21d or FIG. 10 (c) as shown in FIG. ), The peripheral portion including the end face of the wafer W may be cleaned by the second cleaning unit 21f.

  Furthermore, the present invention can be applied not only to the apparatus of the above embodiment, but also to a cleaning apparatus that cleans the front and back surfaces of the wafer or an apparatus that cleans the back surface of the wafer.

  Furthermore, in the above-described embodiment, the case where a semiconductor wafer is applied as the substrate to be processed has been described. However, the present invention is not limited to this. For example, a flat panel display device substrate represented by a glass substrate for a liquid crystal display device, and the like. It can also be applied to other substrates.

1 is a schematic configuration diagram showing a substrate cleaning apparatus according to an embodiment of the present invention. The top view which shows the inside of the board | substrate cleaning apparatus which concerns on one Embodiment of this invention. Sectional drawing which shows the cleaning mechanism provided in the board | substrate cleaning apparatus which concerns on one Embodiment of this invention further in detail. The side view which expands and shows the brush of the cleaning mechanism provided in the board | substrate cleaning apparatus which concerns on one Embodiment of this invention. Sectional drawing which shows the preferable example of the 2nd washing | cleaning part of the brush shown in FIG. The block diagram which shows the structure of the control part provided in the substrate cleaning apparatus which concerns on one Embodiment of this invention. Sectional drawing which shows the other example of the 2nd washing | cleaning part of the brush shown in FIG. The side view which expands and shows the other structural example of a brush. The side view which expands and shows the further another structural example of a brush. The figure which shows the example which cleans the wafer surface and a wafer peripheral part with a brush.

Explanation of symbols

1: Wafer cleaning device (substrate cleaning device)
2; Chamber 3; Spin chuck 4; Motor 5; Cup 6; Exhaust / drain tube 7; Loading / unloading port 10; Cleaning liquid supply mechanism 11a; Front side cleaning liquid nozzle 11b; Back side cleaning liquid nozzle 12; Cleaning liquid supply source 20; 21, 21 ′, 21 ″; brush 21a; small diameter portion 21b; large diameter portion 21c; joint portion 21d; first cleaning portion 21e; cut 21f; second cleaning portion 22; ; Shaft portion 27; rotation / lifting portion 30; control portion 61; controller 62; user interface 63; storage portion W; semiconductor wafer (substrate)

Claims (8)

A substrate cleaning apparatus for brush cleaning a peripheral portion including an end face of a substrate,
A substrate holding mechanism for rotatably holding the substrate;
A substrate rotation mechanism for rotating the substrate held by the substrate holding mechanism;
A cleaning liquid supply mechanism for supplying a cleaning liquid to the substrate held by the substrate holding mechanism;
A cleaning mechanism having a brush for cleaning the peripheral portion including the end face of the substrate,
The brush has a plurality of cleaning units having different cleaning functions, selects an appropriate cleaning unit according to the adhesion state of the deposit on the substrate, and cleans the peripheral portion including the end face of the substrate in the cleaning unit ,
The brush has a cylindrical small-diameter portion and a cylindrical large-diameter portion continuous to the small-diameter portion, and a first cleaning portion that is a joint portion between the small-diameter portion and the large-diameter portion; A second cleaning part made of a cut formed in the peripheral surface of the diameter part,
In the first cleaning section, the peripheral surface of the small diameter portion is in contact with the end surface of the substrate, and the connection surface of the large diameter portion with the small diameter portion is in contact with the back surface or the peripheral edge portion of the substrate, Clean the edge and the back or front edge of the substrate,
The notch constituting the second cleaning unit has a shape corresponding to the shape of the peripheral edge of the substrate to be cleaned, and the second cleaning unit has the peripheral edge of the substrate inserted into the notch. A substrate cleaning apparatus for cleaning an end surface of a substrate and a peripheral portion of a back surface and a front surface of the substrate .   It further comprises a control mechanism for selecting an appropriate cleaning unit according to the adhesion state of the deposit on the substrate and controlling the position of the brush so as to clean the peripheral portion of the substrate with the selected cleaning unit. The substrate cleaning apparatus according to claim 1. The brush substrate cleaning apparatus according to claim 1 or claim 2, characterized in that it consists of a sponge-like resin. The cleaning mechanism includes a brush rotating mechanism that rotates the brush, and an contacting / separating mechanism that contacts and separates the brush from the substrate, and the brush rotated by the brush rotating mechanism is moved by the contacting / separating mechanism. in contact with the substrate being rotated by the substrate rotation mechanism, substrate cleaning according to any one of claims 1 to 3, characterized in that to clean the peripheral edge portion including an end face of the substrate in this state apparatus. A substrate cleaning method for brush cleaning a peripheral portion including an end face of a substrate,
Using a brush having a plurality of cleaning parts having different cleaning functions, selecting an appropriate cleaning part according to the adhesion state of the deposit on the substrate, and cleaning the cleaning part of the substrate in the cleaning part ,
The brush has a cylindrical small-diameter portion and a cylindrical large-diameter portion continuous to the small-diameter portion, and a first cleaning portion that is a joint portion between the small-diameter portion and the large-diameter portion; A second cleaning part made of a cut formed in the peripheral surface of the diameter part,
In the first cleaning section, the peripheral surface of the small diameter portion is in contact with the end surface of the substrate, and the connection surface of the large diameter portion with the small diameter portion is in contact with the back surface or the peripheral edge portion of the substrate, Clean the edge and the back or front edge of the substrate,
The notch constituting the second cleaning unit has a shape corresponding to the shape of the peripheral edge of the substrate to be cleaned, and the second cleaning unit has the peripheral edge of the substrate inserted into the notch. A substrate cleaning method , comprising: cleaning an end surface of a substrate and a peripheral portion of a back surface and a front surface of the substrate . The substrate cleaning method according to claim 5 , wherein the brush is made of a sponge-like resin. The substrate cleaning method according to claim 5 , wherein the cleaning is performed by bringing the brush into contact with a peripheral portion including an end surface of the substrate being rotated while rotating the brush. 8. A storage medium that operates on a computer and stores a program for controlling a substrate cleaning apparatus, wherein the program executes the substrate cleaning method according to claim 5 at the time of execution. A storage medium that controls the substrate cleaning apparatus .

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