JP5082914B2 - Chip feeder - Google Patents

Description

The present invention relates to a chip supply device that supplies chips obtained by dividing a semiconductor wafer.

The chip supply device pushes up a chip attached to a stretchable wafer sheet from the lower side of the wafer sheet and adsorbs it with a nozzle from the upper side to peel the chip from the wafer sheet and supply it to a supply object such as a substrate. It is a device that performs the operation. Chips affixed to the wafer sheet are obtained by dicing a semiconductor wafer into pieces, and the distance between adjacent chips is narrow, making it difficult to peel off only one chip. An interval between chips is increased by applying tension to the sheet (see Patent Documents 1 and 2).
JP-A-2-231740 JP-A-5-29440

  Once the tension is applied to the wafer sheet, the elongation remains even if the tension is interrupted, and the wafer sheet is loosened inside the wafer ring that holds the outer periphery of the wafer sheet. Conventionally, when replacing a wafer sheet that has used up all the chips, the wafer sheet is detached from the chip supply device equipped with a tension ring that applies tension to the wafer sheet, and a new wafer sheet is mounted instead. When exchanging the wafer sheet in the above state, adjacent chips may come into contact with each other due to the slackness of the wafer sheet, and fragile edges and corners may be damaged. Another problem is that a wafer sheet is frequently replaced in a device such as a multi-chip bonder that mounts a wide variety of components on a substrate. It takes time to load and unload, and productivity is lowered.

Accordingly, an object of the present invention is to provide a chip supply device that prevents chip breakage and does not cause a decrease in productivity when a wafer sheet is replaced.

The chip supply apparatus according to claim 1 is a first table that supports a substrate on which chips of a chip supply pallet are mounted by a transfer head , and a second table that moves horizontally in the Y direction that is close to and away from the first table. A chip supply pallet comprising: a chip supply pallet comprising: a chip supply pallet comprising: a chip supply pallet; and a third table horizontally moving in the X direction close to and away from an open side surface of a magazine for storing the chip supply pallet. Is to attach a wafer sheet on which a semiconductor wafer separated into a plurality of chips is attached to a third table in a tensioned state , and the chip supply pallet contacts the wafer sheet from below. Fixing part for fixing the tension ring and the ring frame that holds the wafer sheet on the inside below the wafer sheet that is in contact with the tension ring Comprising: a first member having a fixed portion to be fixed to a predetermined position of the third table, the second member having a held portion that is held when transferring chip supply pallet, third table The first member is configured to be able to rotate and displace with respect to the second member fixed at a predetermined position , and the third table holds the held portion of the chip supply pallet stored in the magazine and is horizontal in the X direction. A pallet holding part for moving the chip supply pallet from the magazine by moving it, a rotary actuator for turning the fully drawn pallet holding part by 180 °, and a pallet holding part and a rotation actuator across an opening formed in the center of the third table Is moved in the X direction by a linear actuator and moved together with the pallet holder from the left and right in the X direction. A pallet fixing part for holding the let and fixing it on the third table was provided .

The chip supply apparatus according to claim 2 comprising a chip supply apparatus according to claim 1, provided with a limiting means for limiting the relative rotational displacement of the first member and the second member.

According to the chip supply device of the present invention, the wafer sheet can be transferred while maintaining a state in which a tension is applied to the wafer sheet, so that collision between chips attached to the wafer sheet can be prevented. Since there is no need for mounting / demounting, the waiting time for mounting work can be shortened.

  Embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of a chip supply apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the chip supply apparatus according to the embodiment of the present invention, and FIG. 3 is a view of a wafer sheet and a ring frame according to the embodiment of the present invention. 4 is a plan view of the chip supply pallet according to the embodiment of the present invention, FIG. 5 is a side view of the chip supply pallet according to the embodiment of the present invention, and FIG. 6 is a chip supply pallet according to the embodiment of the present invention. 7 is a rear view of the chip supply pallet according to the embodiment of the present invention, FIG. 8 is a plan view of the second member according to the embodiment of the present invention, and FIG. 9 is a magazine according to the embodiment of the present invention. FIG. 10 is a plan view of the first member according to the embodiment of the present invention, FIGS. 11 and 12 are explanatory diagrams showing a method of mounting the ring frame on the chip supply pallet, and FIG. 13 is a diagram of FIG. 14 is a cross-sectional view of the cross-sectional line 13, FIG. 15 is a cross-sectional view taken along the cross-sectional line 15 in FIG. 12, FIGS. 16, 17 and 18 are explanatory views showing a method of fixing the chip supply pallet at the pallet fixing portion, and FIG. FIG. 19B is a cross-sectional view of the cross-sectional line 19b of FIG. 17, FIG. 20 is a control configuration diagram for correcting the orientation of the chip in the chip supply apparatus according to the embodiment of the present invention, and FIGS. 25 is an operation explanatory view of the chip supply apparatus according to the embodiment of the present invention, and FIG. 26 is a perspective view of the multi-sided substrate.

  The configuration of the chip supply device will be described with reference to FIGS. The magazine 1 is a pallet storage section that includes a plurality of storage chambers 2 that are divided into upper and lower parts, and that stores chip supply pallets (hereinafter abbreviated as pallets) 3 one by one in each storage chamber 2. One side of the magazine 1 is open, from which the pallet 3 can be taken in and out. The lifting device 4 moves the magazine 1 up and down to position all the pallets 3 stored in the magazine 1 at a predetermined pallet replacement height.

  The chip bonder 5 includes a chip transfer device that mounts chips on the substrate 6 and a chip supply device that supplies chips to the chip transfer device. In the chip bonder 5, the chip supply device is arranged at a position facing the opened side surface of the magazine 1. The substrate 6 is supported by the first table 7 so as to be horizontally movable. The pallet 3 is supported by a second table 8 and a third table 9 that are movable in the orthogonal Y and X directions, respectively, so as to be horizontally movable. The second table 8 has a slider 12 that is slidably mounted on a rail 11 fixed to the base 10 and a rear surface side fixed. The base 10 is provided with a feed screw 13 with a motor 14 in which the extending direction of the rail 11 is the feed direction. A nut 15 screwed to the feed screw 13 is fixed to the back side of the second table 8. ing. With this configuration, the second table 8 moves horizontally in a direction (Y direction) that approaches and separates from the first table 7 by forward and reverse driving of the motor 14.

The third table 9 is located above the second table 8, and a slider 17 that is slidably mounted on a rail 16 fixed to the front surface side of the second table 8 and the back surface side are fixed. The second table 8 is provided with a feed screw 18 along with a motor 19 in which the extending direction of the rail 16 is the feed direction, and a nut 20 screwed to the feed screw 18 is fixed to the back side of the third table 9. Has been. With this configuration, the third table 9 moves horizontally in the direction (X direction) approaching and separating from the opened side surface of the magazine 1 by forward and reverse rotation of the motor 19.

  The pallet turning mechanism provided on the magazine 1 side of the third table 9 is composed of a rotary actuator 21 fixed to the third table 9 and a pallet holding portion 22 pivotally supported by the rotary actuator 21 so as to be horizontally turnable. The pallet holding part 22 can electromagnetically or mechanically hold the held part formed at the edge of the pallet 3. The pallet holding part 22 rotates horizontally while holding the supported part to change the orientation of the pallet 3.

The pallet fixing mechanism disposed on the side facing the pallet turning mechanism across the opening 9a formed in the center of the third table 9 is composed of a linear motion actuator fixed to the third table 9 and a pallet fixing portion 23. ing. The pallet fixing part 23 presses the fixed part formed at the edge facing the supported part of the pallet 3 and holds the pallet 3 from the left and right in the X direction together with the pallet holding part 22 on the third table 9. Fix in place.

  The transfer head 25 is a chip transfer device for mounting chips supplied from the pallet 3 on the substrate 6. The transfer head 25 picks up the chip from the pallet 3 fixed on the third table 9 at the pickup position P1, and mounts the chip on the substrate 6 at the mounting position P2. Since the pick-up position P1 and the mounting position P2 are fixed, when picking up a chip from the pallet 3, the pallet 3 is horizontally moved by driving control of the two motors 14 and 19 to position an arbitrary chip at the pick-up position P1. . Similarly, an arbitrary chip mounting location on the substrate 6 is positioned at the mounting position P2 by the horizontal position control of the first table 7. A nozzle 26 that can move up and down is mounted on the transfer head 25. The nozzle 26 picks up a chip and mounts it on the substrate 6.

  The camera 27 is disposed on the vertical line of the pickup position P1. The camera 27 has an imaging field in the vertically lower side, and images the chip on the pallet 3. The chip pushing mechanism 28 projects a pin (not shown) upward from the ejector 29 on the vertical line of the pickup position P1, and pushes the chip on the pallet 3 toward the nozzle 26 from below. The chip push-up mechanism 28 is disposed in the opening 8 a of the second table 8. Further, an opening 9 a for allowing a pin protruding from the ejector 29 to pass therethrough is provided in the center of the third table 9.

  The configuration of the pallet will be described with reference to FIGS. FIG. 3 shows a ring frame holding a wafer sheet inside. The wafer sheet 30 is affixed with a semiconductor wafer separated into a plurality of chips 31 on an adhesive surface. The wafer sheet 30 is held by the ring frame 32 at a position surrounding the portion where the chip 31 is attached. The ring frame 32 is a rigid body having a circular opening on the inner side, and holds the wafer sheet 30 having flexibility and stretchability so as not to bend inward.

  4 to 7 are a plan view, a side view, a front view, and a rear view of the pallet (wafer sheet not mounted), respectively. The pallet 3 is configured such that the first member 33 and the second member 34 are stacked one above the other so that the first member 33 can be rotationally displaced with respect to the second member 34. Of these, only the second member is shown in FIG. The second member 34 is configured by mounting several parts on the basis of the main member 35. The main member 35 is a plate-like member having a circular opening at the center. A held portion 36 that is directly fixed by the pallet holding portion 22 disposed on the third table 9 is attached to the front portion of the main member 35. A fixed portion 37 that is directly fixed by the pallet fixing portion 23 and a lock mechanism 38 that restricts the relative rotational displacement of the first member 33 with respect to the second member 34 are provided at the rear portion. Further, slide portions 39 that serve as guides when the pallet 3 is taken in and out of the magazine 1 are formed on both sides. As shown in FIG. 9, the magazine 1 is divided into a plurality of storage chambers 2 in the vertical direction, and the pallet 3 has each slide chamber 2 in a state where a slide portion 39 is placed on a projection 40 formed on the inner wall of the magazine 1. One by one. Three rollers 41 are mounted on the upper portion of the main member 35 at positions surrounding the opening. These rollers 41 are rotatable about shafts 42 arranged at equal intervals from the opening center O1.

FIG. 10 shows only the first member. The first member 33 is configured by mounting several parts on the basis of the main member 50. The main member 50 is a plate-like member having a circular opening at the center. A hollow tension ring 51 having an outer diameter smaller than the inner diameter of the ring frame 32 is attached to the upper portion of the main member 50 at a predetermined height. The opening center O2 of the tension ring 51 is on the same vertical line as the opening center O3 of the main member 50. A larger-diameter annular member 52 is mounted on the outer peripheral side of the tension ring 51. A groove 53 is formed on the outer peripheral surface of the annular member 52 so as to be fitted to the outer periphery of the three rollers 41 mounted on the second member 34. As shown in FIGS. 4 to 7, the first member 33 is supported on the second member 34 only by the three rollers 41 fitted in the groove 53, and the centers O 1, O 2, which are located on the same circular straight line, The second member 34 can be rotationally displaced about O3 as the center of rotation.

  Further, four fixing members 54 are mounted on the upper portion of the main member 50 at positions surrounding the annular member 52. These fixing members 54 are rotationally displaced about shafts 55 that are equidistant from the opening center O3 and are arranged at equal intervals, thereby fixing the ring frame 32 to the pallet 3 and the ring frame 32 to the pallet 3. The position can be changed to a retracted position that does not interfere with the ring frame 32 in order to be attached and detached.

  Each fixing member 54 is provided with a lever 56 for hooking a finger or the like, and a person (operator) who attaches / detaches the ring frame 32 to / from the pallet 3 uses this lever 56 to change the posture of the fixing member 54. A member 58 in which a driven gear 57 is formed is mounted at the rear center of the main member 50 with the driven gear 57 protruding rearward. A dog 59 that protrudes further rearward than the driven gear 57 is attached to the member 58.

  A method of mounting the ring frame 32 on the pallet 3 will be described with reference to FIGS. The operator confirms that all the fixing members 54 are in the retracted posture, and holds the wafer sheet 30 in the tension ring 51 so that the circular inner periphery of the ring frame 32 and the circular tension ring 51 are in a concentric positional relationship. (FIG. 11), and the lever 56 is moved to change the posture of the fixing member 54 from the retracted posture to the fixed posture (FIG. 12). Through this series of operations, the ring frame 32 is fixed by the four fixing members 54 and mounted on the pallet 3.

  FIG. 13 shows a cross-sectional view of the cross-sectional line 13 in FIG. An inclined surface 54 a is provided at a location where the fixing member 54 contacts the ring frame 32. The inclined surface 54a is in contact with the ring frame 32 when the fixing member 54 changes its posture from the retracted posture to the fixed posture, and plays a role of pushing it downward along the inclination. When the fixing member 54 is changed to a fixed posture, the ring frame 32 is fixed below the upper end of the tension ring 51, and the wafer sheet 30 is stretched inside the tension ring 51 that contacts from below. Since the wafer sheet 30 is stretched, the distance between the chips 31 attached to the upper surface is widened, so that any chip can be easily picked up.

  FIG. 14 shows a cross-sectional view of the cross-sectional line 14 in FIG. The roller 41 mounted on the main member 35 of the second member is engaged with a groove formed on the outer peripheral surface of the annular member 52 to support the first member so that it can be rotationally displaced above the second member. doing. Since the stretched wafer sheet 30 is attached to the first member, it is possible to change the orientation of the chip attached to the wafer sheet 30 with respect to the second member. .

A regulating means for regulating the relative rotational displacement between the first member and the second member will be described with reference to FIG. FIG. 15 is a cross-sectional view taken along a cross-sectional line 15 in FIG. The main member 35 of the second member is formed with a hole 35a penetrating from the outer peripheral surface to the inner peripheral surface. A connecting member 38a longer than the entire length of the hole 35a is inserted into the hole 35a. An operating member 38b is attached to the outer peripheral surface side of the main member 35 of the connecting member 38a, and a driven member 38c is attached to the inner peripheral surface side. Yes. The driven member 38c has an upper end extended to a height facing the inner peripheral surface of the annular member 52, and a lock hole 52d formed in the vicinity of the upper end includes a lock pin 52a attached to the inner peripheral surface side of the annular member 52, Engageable. A compression spring 38e is interposed between the actuating member 38b and the main member 35, and the driven member 38c is urged toward the inner peripheral surface side of the annular member 52 by the elastic force of the compression spring 38e, The hole 38d is engaged with the lock pin 52a (FIG. 15A). In this state, when the first member tries to rotate with respect to the second member, the lock pin 52a comes into contact with the edge of the lock hole 38d and the rotational displacement is restricted.

  When canceling the restriction on the rotational displacement, when the operating member 38b is pressed against the main member 35 against the elastic force of the compression spring 38e, the driven member 38c moves in a direction away from the inner peripheral surface of the annular member 52. The engagement between the lock pin 52a and the lock hole 38d is released, and the relative rotational displacement between the first member and the second member is ensured.

  A method of fixing the pallet to the chip supply device will be described with reference to FIGS. The pallet fixing part 23 is slidably mounted in the X direction on a rail 61 attached to the front surface side of the third table 9 via a slider 60 attached to the back surface side (see FIG. 1). The pallet fixing part 23 is movable in the X direction by the expansion and contraction of the rod 63 of the linear actuator 62 attached to the third table 9. The two fixing members 64 of the pallet fixing portion 23 are urged toward the pallet 3 by a compression spring 65. The fixing member 64 engages the two fixed portions 37 provided on the second member so as to be sandwiched from above and below, and fixes them from the rear of the pallet 3. At this time, the held portion 36 provided on the side opposite to the fixed portion 37 is held by the pallet holding portion 22, and the pallet 3 is fixed from the front by the pallet holding portion 22. When the pallet 3 is fixed, the pallet fixing part 23 continues to move after the fixing member 64 contacts the fixed part 37, and the fixing member 64 is pressed against the fixed part 37 using the elastic force of the compression spring 65. To.

  A method of imparting rotational displacement to the first member of the fixed pallet will be described with reference to FIG. The pallet fixing portion 23 includes a main driving gear 66 that meshes with the driven gear 57 of the first member when the pallet is fixed, a driving gear 67 that transmits rotation to the main driving gear 66, and a motor 68 that rotates the driving gear 67. Yes. A member 69 is provided on the pallet 3 side of the pallet fixing portion 23 at a position facing the operation member 38b. When the pallet is fixed, the member 69 abuts against the operation member 38b and is pushed in, thereby pushing the second member of the first member. It functions as a restriction releasing means for releasing the restriction of the rotational displacement with respect to the. Thus, when the restriction is released, the rotational driving force of the main driving gear 66 can be transmitted to the first member via the driven gear 57, and the first member can be rotationally displaced (see FIG. 10). . A main driving gear 66 that meshes with the driven gear 57, a driving gear 67 that transmits rotation to the main driving gear 66, and a motor 68 that rotates the driving gear 67 are pallet rotation driving force that applies a rotation driving force to the first member. Constructing means.

  In FIG. 10, a dog 59 is provided on the first member 33, and the dog 59 moves with the rotational displacement of the first member 33. The pallet fixing unit 23 is provided with a pair of dog sensors 70 that detect the dogs 59 and monitors the rotational displacement of the first member within a predetermined range.

  A control configuration for correcting the orientation of the chip will be described with reference to FIG. Since the operation of attaching the wafer sheet 30 with the chip attached to the pallet 3 is performed manually, there are many variations in the attachment position and angle for each pallet, and the pallet itself is fixed at the same predetermined position. However, the situation that the direction of the chip is different has occurred. Therefore, when the chip is picked up by the nozzle 26, the chip is first imaged by the camera 27, and the image data is sent to the image recognition unit 71 to confirm the position and orientation of the chip. The image recognizing unit 71 can confirm the orientation and position based on the image of a single chip, and can also confirm the position and orientation of each chip based on the image of a line formed between a plurality of chips. . The camera 27 and the image recognition unit 71 that confirms the orientation of the chip based on the image captured by the camera 27 constitutes a chip confirmation unit.

  The control unit 72 calculates the rotation angle of the first member necessary for correcting to the proper direction based on the position and orientation of the chip confirmed by the image recognition unit 71, and sends a command to the motor 68. When the dog sensor 70 detects the dog 59, the dog sensor 70 sends a detection signal to the control unit 72, and the control unit 72 receiving this sends a rotation stop command to the motor 68. Thereby, the overrun of the first member can be prevented.

  The procedure for mounting the pallet on the chip bonder will be described with reference to FIGS. The pallet 3 to be mounted on the chip bonder 5 is stored in the magazine 1 with the held portion 36 facing the chip bonder 5 side. FIG. 23 shows a state in which the pallet holding part 22 faces the magazine 1 side by turning and horizontal movement (Y direction) of the second table 8 and is positioned in front of the held part 36. The height of the magazine 1 is adjusted by the lifting device 4 so that the pallet 3 is positioned at a predetermined pallet replacement height. Since no pallet is mounted on the chip bonder 5, the ejector 29 can be viewed from above the chip bonder 5 through the opening 9 a of the third table 9 and the opening 8 a of the second table 8.

  FIG. 22 shows a state in which the pallet holding part 22 is moved to the magazine 1 side by the horizontal movement (X direction) of the third table 9 and the held part 36 of the pallet 3 stored in the magazine 1 is held. When the pallet holding part 22 holds the held part 36, the third table 9 is now horizontally moved in the opposite direction (X direction) as shown in FIG. When the pallet 3 is completely pulled out from the magazine 1, as shown in FIG. 24, the pallet holding part 22 is turned 180 degrees to change the orientation of the pallet 3 so that it is positioned directly above the opening of the third table 9. Then, as shown in FIG. 25, the pallet fixing part 23 is moved to fix the pallet 3. Since the pallet 3 is fixed as described above, the lock is released, and the first member can be rotationally displaced with respect to the second member. Therefore, the wafer sheet 30 mounted on the first member. It is possible to freely change the direction of the chip 31 attached to the substrate.

  In FIG. 25, the plurality of chips 31 on the third table 9 are sequentially positioned at the pickup position P1 by the second table 8 and the third table 9 that horizontally move in directions orthogonal to each other (XY direction). The third table 9 has not only a function of positioning an arbitrary chip at the pickup position P1 of the chip bonder 5 in cooperation with the second table 8, but also a function of moving the pallet 3 in and out of the magazine 1 as described above. ing. The direction of the chip 31 positioned at the pickup position P1 is confirmed, and if there is a deviation from the proper direction, correction is performed. The corrected chip 31 is picked up from the wafer sheet 30 by the nozzle 26, moved to the mounting position P <b> 2 by the transfer head 25, and mounted on the substrate 6.

  FIG. 26 shows a detailed view of the substrate 6. The substrate 6 is a multi-sided substrate in which a plurality of small substrates are continuously arranged in a line. The substrate 6 is provided with a cutting line 6a for dividing the small substrate in advance, so that it can be easily divided in a later process. Four types of chips C1, C2, C3, and C4 are mounted on each small substrate. These four types of chips have a procedure in which the chip C1 is first mounted on all the small substrates, and then mounted on all the small substrates in the order of C2, C3, and C4. Since only one type of chip is attached to one wafer sheet 30, it is necessary to use four wafer sheets 30 when mounting the chip on the substrate 6. In the chip bonder 5, the wafer sheets 30 each having the chips C 1, C 2, C 3, and C 4 attached to the magazine 1 are mounted on the pallet 3 and stored, and the four pallets 3 are sequentially placed at predetermined positions on the third table 9. The chips C 1, C 2, C 3, C 4 are mounted on the substrate 6.

  The substrate 6 is a supply object to which the chip peeled from the wafer sheet 30 is supplied. However, the supply object in the chip supply device of the present invention is not limited to the substrate using the chip as a component, but a chip as a product. It may be a case for storage.

  Since the chip bonder 5 replaces the wafer sheet 30 while it is mounted on the pallet 3, the wafer sheet 30 is maintained in a tensioned state and remains on the wafer sheet 30 due to impact, vibration, etc. during the replacement. There is no collision between the chips. In addition, the replacement of the wafer sheet 30 is performed by interrupting the mounting operation. However, since the wafer sheet 30 is mounted on the pallet 3 in advance and does not require time for loading and unloading at the time of replacement, the waiting time for the mounting operation is reduced. It can be shortened.

  Further, a pallet turning mechanism for changing the direction of the pallet 3 into the direction in which it is stored in the magazine 1 and the direction in which the pallet 3 is set in the chip bonder 5 is provided on the third table 9 constituting the positioning mechanism. By performing the replacement work, the entire chip bonder can be simplified and reduced in size as compared with the conventional method using only the linear motion mechanism. Moreover, since the pallet 3 can be swung and moved horizontally, the time required for pallet replacement can be shortened.

  The present invention is particularly useful in the field of multi-chip bonding in which a wide variety of chips are continuously mounted on a substrate.

The top view of the chip supply apparatus of embodiment of this invention The side view of the chip supply apparatus of embodiment of this invention The top view of the wafer sheet and ring frame of embodiment of this invention The top view of the chip supply pallet of embodiment of this invention Side view of a chip supply pallet according to an embodiment of the present invention The front view of the chip supply pallet of embodiment of this invention The rear view of the chip supply pallet of embodiment of this invention The top view of the 2nd member of an embodiment of the invention The internal structure figure of the magazine of embodiment of this invention The top view of the 1st member of an embodiment of the invention Explanatory drawing showing the method of mounting the ring frame on the chip supply pallet Explanatory drawing showing the method of mounting the ring frame on the chip supply pallet Sectional drawing of sectional line 13 of FIG. Sectional view of section line 14 in FIG. Sectional view of section line 15 in FIG. Explanatory drawing showing the method of fixing the chip supply pallet at the pallet fixing part Explanatory drawing showing the method of fixing the chip supply pallet at the pallet fixing part Explanatory drawing showing the method of fixing the chip supply pallet at the pallet fixing part (A) Sectional view of section line 19a in FIG. 17 (b) Sectional view of section line 19b in FIG. Control configuration diagram related to chip orientation correction in the chip supply apparatus according to the embodiment of the present invention Operation explanatory diagram of the chip supply device of the embodiment of the present invention Operation explanatory diagram of the chip supply device of the embodiment of the present invention Operation explanatory diagram of the chip supply device of the embodiment of the present invention Operation explanatory diagram of the chip supply device of the embodiment of the present invention Operation explanatory diagram of the chip supply device of the embodiment of the present invention Perspective view of multi-sided substrate

Explanation of symbols

3 Chip Supply Pallet 5 Chip Bonder 22 Pallet Holding Part 23 Pallet Fixing Part 30 Wafer Sheet 31 Chip 32 Ring Frame 33 First Member 34 Second Member 36 Holding Part 37 Fixed Part 38 Locking Mechanism 51 Tension Ring 54 Fixing Member

Claims (2)

A first table that supports a substrate on which chips of a chip supply pallet are mounted by a transfer head; a second table that moves horizontally in the Y direction that is close to and away from the first table; and a second table that is above the second table. A chip supply device comprising a third table horizontally moving in the X direction approaching and separating from an opened side surface of a magazine for storing a chip supply pallet;
The chip supply pallet is for mounting a wafer sheet on which a semiconductor wafer separated into a plurality of chips is attached to a third table in a tensioned state .
The chip supply pallet includes a tension ring that comes into contact with the wafer sheet from below, a first member having a fixing member that fixes a ring frame that holds the wafer sheet on the inside below the wafer sheet that comes into contact with the tension ring,
And a fixed portion to be fixed to a predetermined position of the third table, the second member having a held portion that is held when transferring chip supply pallet comprising,
The first member is configured to be rotationally displaceable with respect to the second member fixed at a predetermined position of the third table, and the third table holds the held portion of the chip supply pallet housed in the magazine. Pallet holding part that horizontally moves in the direction to draw the chip supply pallet from the magazine, a rotary actuator that turns the pallet holding part that is completely drawn out by 180 °, and a pallet holding part across the opening formed in the center of the third table And a pallet fixing part which is arranged at a position facing the rotary actuator and moves in the X direction by the linear actuator to hold the chip supply pallet from the left and right in the X direction and fix it on the third table together with the pallet holding part . A chip supply device . The chip supply device according to claim 1, further comprising a restriction unit that restricts relative rotational displacement between the first member and the second member.

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