JP5080907B2 - Method for producing double-sided metal foil-clad laminate - Google Patents

Method for producing double-sided metal foil-clad laminate Download PDF

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JP5080907B2
JP5080907B2 JP2007221848A JP2007221848A JP5080907B2 JP 5080907 B2 JP5080907 B2 JP 5080907B2 JP 2007221848 A JP2007221848 A JP 2007221848A JP 2007221848 A JP2007221848 A JP 2007221848A JP 5080907 B2 JP5080907 B2 JP 5080907B2
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metal foil
insulating sheet
sheet material
double
clad laminate
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JP2009051151A (en
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順一 帆足
正一 吉田
章 名木
一行 七海
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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本発明は、プリント配線板などの製造に用いられる両面金属箔張り積層板の製造方法に関するものである。   The present invention relates to a method for manufacturing a double-sided metal foil-clad laminate used for manufacturing printed wiring boards and the like.

従来より、絶縁層の両面に銅箔等の金属箔を設けた両面金属箔張り積層板であって、絶縁層を貫通するバンプによって両面の金属箔を電気的に接続するもの、所謂、バンプ接続金属箔張り積層板が提案されている(例えば、特許文献1参照)。このような両面金属箔張り積層板の製造は以下のようにして行われる。   Conventionally, a double-sided metal foil-clad laminate in which a metal foil such as a copper foil is provided on both sides of an insulating layer, wherein the metal foils on both sides are electrically connected by bumps penetrating the insulating layer, so-called bump connection A metal foil-clad laminate has been proposed (see, for example, Patent Document 1). Such a double-sided metal foil-clad laminate is manufactured as follows.

まず、金属箔2の上面に複数のバンプ1、1…を形成する。バンプ1は導電ペーストなどを印刷した後に半硬化状態にすることによって、円錐状などの先端(上端)が尖った形状に形成することができる。次に、バンプ1を形成した金属箔2の上面に絶縁シート材3を載置(ビルドアップ)して重ね合わせると共にバンプ1を絶縁シート材3に下側から突き刺して貫通させることによって、絶縁シート材3の上面にバンプ1の先端を突出させる。絶縁シート材3としては樹脂フィルムやプリプレグ(樹脂含浸基材)などを用いることができる。このようにしてバンプ1を形成した金属箔2と絶縁シート材3とを重ね合わせて重ね合わせ物20を形成し、図3(a)に示すように、複数個の重ね合わせ物20、20…を順次作製しつつ積載していく。ここで、上下に隣り合う重ね合わせ物20、20の間には合紙21が介在させている。合紙21は、バンプ1に割れや欠けなどの破損が発生しないように保護する目的及び金属箔2の下面にバンプ1や絶縁シート材3が直接接触しないようにして金属箔2への樹脂や導電性異物などの異物が付着しないようにするための紙である。尚、図3(a)では、積載した複数個の重ね合わせ物20、20…の一部を図示省略している。   First, a plurality of bumps 1, 1... Are formed on the upper surface of the metal foil 2. The bump 1 can be formed in a shape having a sharp tip (upper end) such as a conical shape by making a semi-cured state after printing a conductive paste or the like. Next, the insulating sheet material 3 is placed (build-up) on the upper surface of the metal foil 2 on which the bumps 1 are formed and overlapped, and the bumps 1 are pierced through the insulating sheet material 3 from below to penetrate the insulating sheet. The tip of the bump 1 is protruded from the upper surface of the material 3. As the insulating sheet material 3, a resin film, a prepreg (resin-impregnated base material), or the like can be used. In this way, the metal foil 2 on which the bumps 1 are formed and the insulating sheet material 3 are overlapped to form an overlap 20, and a plurality of overlaps 20, 20... Are stacked while being manufactured sequentially. Here, a slip sheet 21 is interposed between the stacked products 20 adjacent to each other vertically. The slip sheet 21 is used to protect the bump 1 from damage such as cracks and chips, and to prevent the bump 1 and the insulating sheet material 3 from directly contacting the lower surface of the metal foil 2. Paper for preventing foreign matter such as conductive foreign matter from adhering. In FIG. 3A, a part of the plurality of stacked objects 20, 20,.

次に、積載した複数個の重ね合わせ物20、20…を成形工程に搬送した後、図3(b)に示すように、合紙21を除去しながら一つの重ね合わせ物20を積載物から取り出す。この後、取り出した重ね合わせ物20の上にさらに他の金属箔5を載置(ビルドアップ)する。これにより、他の金属箔5が絶縁シート材3の上面に突出したバンプ1の先端に接触した状態で載置される。次に、図3(c)に示すように、金属箔2、5と絶縁シート材3の重ね合わせたものを上下二枚の成形プレート22、22の間に配置し、この後、加熱加圧成形して絶縁シート材3を硬化させることによって、絶縁シート材3から絶縁層を形成すると共に金属箔2、5を絶縁層に接着して一体化する。このようにして両面金属箔張り積層板を形成することができる。   Next, after the plurality of stacked products 20, 20... Are conveyed to the molding process, one superimposed product 20 is removed from the stacked product while removing the interleaf 21 as shown in FIG. Take out. Thereafter, another metal foil 5 is placed (build-up) on the taken-up stack 20. As a result, the other metal foil 5 is placed in contact with the tip of the bump 1 protruding from the upper surface of the insulating sheet material 3. Next, as shown in FIG. 3C, a superposition of the metal foils 2 and 5 and the insulating sheet material 3 is placed between the two upper and lower forming plates 22 and 22, and then heated and pressed. By forming and hardening the insulating sheet material 3, an insulating layer is formed from the insulating sheet material 3, and the metal foils 2 and 5 are bonded and integrated with the insulating layer. In this way, a double-sided metal foil-clad laminate can be formed.

一般に、上記のような両面金属箔張り積層板の製造工程において、金属箔2、5と絶縁シート材3とをビルドアップする時などの周囲の雰囲気は、極力、クリーン度が高い場所で行うことが理想である。しかし、上記のようにして製造される両面金属箔張り積層板には、バンプ1を形成した金属箔2の表面に打痕(凹み)による成形不良が発生することがあった。この打痕は絶縁シート材3から生じる樹脂粉などの異物6が原因で発生するものである。すなわち、絶縁シート材3の表面で発生した異物6が下側の合紙21の上に落下した後、成形工程への搬送時や成形工程でのハンドリング(作業)などで下側の金属箔2と下側の合紙21とが相互にずれ動くことによって、異物6が下側の金属箔2と下側の合紙21との間に入り込み、この状態で加熱加圧成形されることによって、金属箔2の表面(下面)に異物6が押さえ付けられて打痕が発生するのである。そして、このような打痕が発生すると、外観不良だけでなく、その後の回路パターン形成においてもパターン不良の原因にもなっていた。
特許第3251711号公報
In general, in the manufacturing process of the double-sided metal foil-clad laminate as described above, the ambient atmosphere such as when building up the metal foils 2 and 5 and the insulating sheet material 3 should be performed in a place where the cleanness is as high as possible. Is ideal. However, in the double-sided metal foil-clad laminate produced as described above, molding defects may occur due to dents (dents) on the surface of the metal foil 2 on which the bumps 1 are formed. This dent is caused by foreign matter 6 such as resin powder generated from the insulating sheet material 3. That is, after the foreign matter 6 generated on the surface of the insulating sheet material 3 falls on the lower interleaf paper 21, the lower metal foil 2 is conveyed during transportation to the molding process or handling (work) in the molding process. And the lower interleaving paper 21 are displaced from each other, so that the foreign matter 6 enters between the lower metal foil 2 and the lower interleaving paper 21 and is heated and pressed in this state. The foreign matter 6 is pressed against the surface (lower surface) of the metal foil 2 and a dent is generated. When such dents are generated, not only the appearance defect but also the pattern defect is caused in the subsequent circuit pattern formation.
Japanese Patent No. 3251711

本発明は上記の点に鑑みてなされたものであり、打痕の発生を少なくすることができる両面金属箔張り積層板の製造方法を提供することを目的とするものである。   This invention is made | formed in view of said point, and it aims at providing the manufacturing method of the double-sided metal foil clad laminated board which can reduce generation | occurrence | production of a dent.

本発明の両面金属箔張り積層板の製造方法は、上面にバンプ1を形成した金属箔2に絶縁シート材3を重ね合わせると共に前記バンプ1を前記絶縁シート材3に突き刺して貫通させることによって、前記絶縁シート材3の上面に前記バンプ1の先端を突出させた重ね合わせ物20を形成し、このバンプ1の先端に接触させるようにして他の金属箔5と前記絶縁シート材3とを重ね合わせ、この後、前記金属箔2、5と前記絶縁シート材3とを加圧成形して一体化する両面金属箔張り積層板の製造方法において、前記他の金属箔5と前記絶縁シート材3とを重ね合わせる前に、前記重ね合わせ物20の上下に合紙21、21を重ね合わせた状態で上下に反転し、その後、前記重ね合わせ物20から前記合紙21、21を除去することを特徴とするものである。 Method for producing both sides a metal foil-clad laminate of the present invention, by penetrating pierce the bumps 1 in the insulating sheet 3 causes the metal foil 2 formed with bumps 1 on the upper surface overlapping the insulating sheet 3 the formation of the insulating sheet 3 superposition product 20 is protruded the tip of the bump 1 on the upper surface, a so as to contact the tip of the bump 1 and another metal foil 5 and the insulating sheet 3 overlay, and thereafter, in the manufacturing method of the double-metal-foil-clad laminate to integrate the said insulating sheet member 3 and the metal foil 2, 5 by press molding, the insulating sheet material and said another metal foil 5 3 is overlapped with the interleaving papers 21 and 21 superimposed on the top and bottom of the superposed product 20 and then the interleaving papers 21 and 21 are removed from the superposed material 20. Features It is intended.

本発明の両面金属箔張り積層板の製造方法は、前記重ね合わせ物20の上下に合紙21、21を重ね合わせた状態で上下に反転した後、前記金属箔2の前記絶縁シート材3と重ね合わせていない方の面に付着する異物6を除去することが好ましいThe method of manufacturing both sides a metal foil-clad laminate of the present invention, after inverted vertically superposed state interleaves 21 and 21 and below the overlay object 20, the insulating sheet 3 of the metal foil 2 It is preferable to remove the foreign matter 6 adhering to the surface that is not superimposed.

本発明の両面金属箔張り積層板の製造方法は、前記異物6を粘着物7で捕捉して除去することが好ましいMethod for producing both sides a metal foil-clad laminate of the present invention is preferably removed by capturing the previous SL foreign matter 6 in slime 7.

本発明の両面金属箔張り積層板の製造方法は、前記異物6を前記粘着物7で捕捉して除去するにあたって、前記金属箔2にかかる圧力を0.1〜100kPaとすることが好ましいMethod for producing both sides a metal foil-clad laminate of the present invention, when the pre-Symbol foreign matter 6 is removed by capturing in the adhesive material 7, it is preferable to 0.1~100kPa the pressure applied to the metal foil 2 .

本発明の両面金属箔張り積層板の製造方法は、前記金属箔2の前記絶縁シート材3と重ね合わせていない方の面に付着する前記異物6を除去するにあたって、前記金属箔2の表面にプラズマ9を供給することが好ましいMethod for producing both sides a metal foil-clad laminate of the present invention, in order to remove the foreign matter 6 adhering to the surface of which is not superimposed with the dielectric sheet 3 before Symbol metal foil 2, the metal foil 2 It is preferable to supply plasma 9 to the surface.

本発明の両面金属箔張り積層板の製造方法は、前記金属箔2の前記絶縁シート材3と重ね合わせていない方の面に付着する前記異物6を除去するにあたって、前記金属箔2の表面に紫外線10を照射することが好ましいMethod for producing both sides a metal foil-clad laminate of the present invention, in order to remove the foreign matter 6 adhering to the surface of which is not superimposed with the dielectric sheet 3 before Symbol metal foil 2, the metal foil 2 It is preferable to irradiate the surface with ultraviolet rays 10.

本発明にあっては、前記他の金属箔5と前記絶縁シート材3とを重ね合わせる前に、前記重ね合わせ物20の上下に前記合紙21、21を重ね合わせた状態で上下に反転し、その後、前記重ね合わせ物20から前記合紙21、21を除去することによって、前記絶縁シート材3の表面に付着している前記異物6を前記合紙21の上に落下させて除去することができ、前記金属箔2、5の表面に前記異物6が付着しにくくなって、打痕の発生を少なくすることができるものである。 In the present onset Ming, inverted before superimposing said insulating sheet member 3 and the other metal foil 5, up and down in a state in which the superposed slip sheet 21, 21 above and below the overlay object 20 and, thereafter, by removing the interleaf paper 21 and 21 from the overlay object 20, the said foreign matter 6 adhering to the surface of the insulating sheet material 3 is dropped on the interleaf sheet 21 is removed by it can be said is foreign matter 6 is unlikely to adhere to the surface of the metal foil 2, 5, it is capable to reduce the occurrence of dents.

以下、本発明を実施するための最良の形態を説明する。   Hereinafter, the best mode for carrying out the present invention will be described.

まず、金属箔2の上面に複数のバンプ(突起物)1、1…を形成する。ここで、金属箔2として導電性のある任意の材質で任意の厚みのものを使用することができ、例えば、厚み8〜105μmの銅箔を用いることができる。バンプ1は銀ペーストなどの導電ペーストを印刷した後に半硬化状態にすることによって、円錐状などの先端(上端)が尖った形状に形成することができる。バンプ1の大きさや間隔などは任意に設定することができ、例えば、底面の直径が80〜300μmで、高さが80〜300μmに設定することができる。   First, a plurality of bumps (projections) 1, 1... Are formed on the upper surface of the metal foil 2. Here, as the metal foil 2, an arbitrary conductive material having an arbitrary thickness can be used. For example, a copper foil having a thickness of 8 to 105 μm can be used. The bump 1 can be formed in a shape having a pointed tip (upper end) such as a conical shape by printing a conductive paste such as a silver paste and then making it semi-cured. The size and interval of the bumps 1 can be arbitrarily set. For example, the diameter of the bottom surface can be set to 80 to 300 μm and the height can be set to 80 to 300 μm.

次に、バンプ1を形成した金属箔2の上面に絶縁シート材3を載置(ビルドアップ)して重ね合わせると共にバンプ1を絶縁シート材3に下側から突き刺して貫通させることによって、絶縁シート材3の上面にバンプ1の先端(上端)を突出させる。絶縁シート材3としては樹脂フィルムやプリプレグ(樹脂含浸基材)などを用いることができる。絶縁シート材3の樹脂としてはエポキシ樹脂やフェノール樹脂などの公知のものを用いることができ、プリプレグの基材としてはガラス不織布やガラス織布等の公知のものを用いることができる。また、絶縁シート材3の厚みも任意に設定することができ、例えば、20〜200μmにすることができる。また、バンプ1の先端は絶縁シート材3の上面から5〜20μm突出させるのが好ましい。このようにしてバンプ1を形成した金属箔2と絶縁シート材3とを重ね合わせて重ね合わせ物20を形成する。   Next, the insulating sheet material 3 is placed (build-up) on the upper surface of the metal foil 2 on which the bumps 1 are formed and overlapped, and the bumps 1 are pierced through the insulating sheet material 3 from below to penetrate the insulating sheet. The tip (upper end) of the bump 1 is protruded from the upper surface of the material 3. As the insulating sheet material 3, a resin film, a prepreg (resin-impregnated base material), or the like can be used. As the resin of the insulating sheet material 3, a known material such as an epoxy resin or a phenol resin can be used, and as the base material of the prepreg, a known material such as a glass nonwoven fabric or a glass woven fabric can be used. Moreover, the thickness of the insulating sheet material 3 can also be set arbitrarily, for example, can be 20-200 micrometers. Moreover, it is preferable to make the front-end | tip of bump 1 protrude 5-20 micrometers from the upper surface of the insulating sheet material 3. FIG. In this way, the metal foil 2 on which the bumps 1 are formed and the insulating sheet material 3 are overlapped to form an overlapped product 20.

本発明では、図1(a)に示すように、複数個の重ね合わせ物20、20…を順次作製しつつ積載していくが、このとき、重ね合わせ物20と合紙21とを交互に積載するようにする。従って、上下に隣り合う重ね合わせ物20、20の間に合紙21が介在した状態で複数個の重ね合わせ物20、20…が積載されている。合紙21は、バンプ1に割れや欠けなどの破損が発生しないように保護する目的及び金属箔2の下面にバンプ1や絶縁シート材3が直接接触しないようにして金属箔2への樹脂や導電性異物などの異物が付着しないようにするための紙である。合紙21としては任意のものを用いることができるが、例えば、フィルムの上下面を無ジン紙で挟んで貼り合わせたもので、厚み100〜1000μmに形成されるものを用いるのが好ましい。尚、図1(a)(b)では、積載した複数個の重ね合わせ物20、20…の一部を図示省略している。   In the present invention, as shown in FIG. 1 (a), a plurality of superposed articles 20, 20... Are stacked while being sequentially produced. Try to load. Therefore, a plurality of stacked products 20, 20... Are stacked with the interleaf paper 21 interposed between the stacked products 20, 20 adjacent to each other in the vertical direction. The slip sheet 21 is used to protect the bump 1 from damage such as cracks and chips, and to prevent the bump 1 and the insulating sheet material 3 from directly contacting the lower surface of the metal foil 2. Paper for preventing foreign matter such as conductive foreign matter from adhering. Any material can be used as the interleaving paper 21. For example, it is preferable to use a film formed by sandwiching the upper and lower surfaces of the film with gin-free paper and having a thickness of 100 to 1000 μm. 1 (a) and 1 (b), a part of the plurality of stacked objects 20, 20,.

次に、複数個の重ね合わせ物20、20…を積載した状態で次工程の成形工程にコンベア等で搬送する。次に、図1(b)に示すように、複数個の重ね合わせ物20、20…の全体を合紙21、21…とともに積載した状態で上下に反転させる。この反転により、金属箔2の上に載置した絶縁シート材3の上面が下向きとなり、絶縁シート材3の上面に付着していた樹脂粉などの異物6が自重により下側の合紙21の上に落下して除去される。従って、金属箔2とその上側の合紙21との間に異物6が進入しにくくなって、異物6による打痕の発生を少なくすることができる。次に、図1(c)に示すように、一つの重ね合わせ物20を積載物から取り出すが、このとき、重ね合わせ物20の上下に合紙21、21を重ね合わせた状態で取り出す。次に、取り出した重ね合わせ物20から上側の合紙21を除去し、金属箔2の上面の光沢面(シャイニー面)を露出させる。次に、金属箔2の上面に付着した樹脂粉などの異物6を除去する。ここで、図1(d)に示すように、異物6を除去するにあたっては粘着物7で捕捉するようにする。粘着物7は異物6を粘着して除去しやすくするためのものであって、松脂のような粘着性のある物質を含有する布などを用いることができ、例えば、「タグラック」と称されるものを用いることができる。また、粘着物7で異物6を除去する場合、金属箔2の上面に付着した異物6を粘着物7で拭き取るようにするが、このときに金属箔2にかかる圧力を0.1〜100kPa(0.01〜1.0kgf/cm)にするのが好ましい。金属箔2にかかる圧力が0.1kPaより小さいと、異物6の除去が不十分になるおそれがあり、金属箔2にかかる圧力が100kPaより大きいと、バンプ1が割れて破損したり粘着物7が金属箔2に転写したりして外観不良が生じるおそれがある。このようにして異物6を金属箔2の表面から除去することによって、次工程において、異物6が金属箔2の表面に存在する状態で加圧成形されることが少なくなって、打痕の発生を少なくすることができる。 Next, in a state where a plurality of stacked products 20, 20... Are stacked, they are conveyed to the next molding process by a conveyor or the like. Next, as shown in FIG. 1 (b), the whole of the plurality of superposed articles 20, 20,... By this reversal, the upper surface of the insulating sheet material 3 placed on the metal foil 2 faces downward, and the foreign matter 6 such as resin powder adhered to the upper surface of the insulating sheet material 3 is caused by the weight of the lower interleaf 21. Dropped on top and removed. Therefore, it becomes difficult for the foreign material 6 to enter between the metal foil 2 and the interleaving paper 21 on the upper side, and the occurrence of dents due to the foreign material 6 can be reduced. Next, as shown in FIG. 1 (c), one superposed product 20 is taken out from the load. At this time, the interleaving papers 21 and 21 are taken out in a state of being superposed on the top and bottom of the superposed product 20. Next, the upper interleaf sheet 21 is removed from the superposed product 20 taken out, and the glossy surface (shiny surface) of the upper surface of the metal foil 2 is exposed. Next, the foreign matter 6 such as resin powder attached to the upper surface of the metal foil 2 is removed. Here, as shown in FIG. 1 (d), when removing the foreign material 6, it is captured by the adhesive 7. The adhesive 7 is for adhering the foreign matter 6 to make it easier to remove, and a cloth containing a sticky substance such as pine resin can be used. For example, it is called “tag rack”. Can be used. Moreover, when removing the foreign material 6 with the adhesive 7, the foreign material 6 adhering to the upper surface of the metal foil 2 is wiped off with the adhesive 7. At this time, the pressure applied to the metal foil 2 is 0.1 to 100 kPa ( 0.01 to 1.0 kgf / cm 2 ) is preferable. If the pressure applied to the metal foil 2 is less than 0.1 kPa, the removal of the foreign matter 6 may be insufficient. If the pressure applied to the metal foil 2 is greater than 100 kPa, the bumps 1 may be broken or damaged or the adhesive 7 May be transferred to the metal foil 2 to cause poor appearance. By removing the foreign matter 6 from the surface of the metal foil 2 in this way, in the next process, the foreign matter 6 is less likely to be pressure-formed in a state where it exists on the surface of the metal foil 2, and the occurrence of a dent is generated. Can be reduced.

上記のようにして重ね合わせ物20の金属箔2の表面から異物6を除去した後、この重ね合わせ物20から下側の合紙21を除去してバンプ1を露出させる。この後、重ね合わせ物20のバンプ1を形成した方の面に他の金属箔5を重ね合わせてビルドアップする。これにより、他の金属箔5が絶縁シート材3の下面に突出したバンプ1の先端に接触した状態で配置される。次に、図1(e)に示すように、金属箔2、5と絶縁シート材3の重ね合わせたものを上下二枚の成形プレート22、22の間に配置し、この後、加熱加圧成形して絶縁シート材3を硬化させることによって、絶縁シート材3から絶縁層を形成すると共に金属箔2、5を絶縁層に接着して一体化する。ここで、加熱加圧成形の条件は、絶縁シート材3の樹脂の種類や厚みなどに応じて適宜設定可能であるが、例えば、温度125〜190℃、圧力0.98〜10.3MPa、時間90〜120分とすることができる。このようにしてバンプ1により両面の金属箔2、5が電気的に接続された両面金属箔張り積層板を形成することができる。   After removing the foreign material 6 from the surface of the metal foil 2 of the superposed product 20 as described above, the lower interleaf 21 is removed from the superposed product 20 to expose the bumps 1. Thereafter, another metal foil 5 is superposed on the surface of the superposed product 20 on which the bump 1 is formed, and build-up is performed. Thereby, the other metal foil 5 is arranged in a state in contact with the tip of the bump 1 protruding from the lower surface of the insulating sheet material 3. Next, as shown in FIG. 1 (e), a superposition of the metal foils 2 and 5 and the insulating sheet material 3 is placed between the two upper and lower forming plates 22 and 22, and then heated and pressed. By forming and hardening the insulating sheet material 3, an insulating layer is formed from the insulating sheet material 3, and the metal foils 2 and 5 are bonded and integrated with the insulating layer. Here, the conditions of the heat and pressure molding can be appropriately set according to the type and thickness of the resin of the insulating sheet material 3, for example, temperature 125 to 190 ° C., pressure 0.98 to 10.3 MPa, time It can be 90-120 minutes. In this way, a double-sided metal foil-clad laminate in which the metal foils 2 and 5 on both sides are electrically connected by the bumps 1 can be formed.

上記のような本発明の両面金属箔張り積層板の製造方法において、重ね合わせ物20から粘着物7による異物6の除去の後、重ね合わせ物20に他の金属箔5を重ね合わせる前に、図2に示すように、重ね合わせ物20の異物6の除去した金属箔2の表面にプラズマ9の供給や紫外線10の照射を行うことができる。これにより、プラズマ9や紫外線10で金属箔2の表面に付着している油分等の異物6を分解して除去することができ、油分等の異物6による成形不良を防止することができる。ここで、プラズマ9の供給と紫外線10の照射とはいずれか一方だけでもよく、また、両方を順次行うようにしてもよい。プラズマ9の供給の条件としては、例えば、真空度1.5PaでCOプラズマを用いた洗浄時間10分間とすることができ、紫外線10の照射の条件としては、例えば、紫外線ランプ300nm、300W×6個、10分間照射とすることができるが、これらに限定されるものではない。 In the manufacturing method of the double-sided metal foil-clad laminate of the present invention as described above, after removing the foreign matter 6 from the superposed product 20 by the adhesive 7, before superimposing another metal foil 5 on the superposed product 20, As shown in FIG. 2, it is possible to supply plasma 9 or irradiate ultraviolet rays 10 on the surface of the metal foil 2 from which the foreign matter 6 of the overlapped product 20 has been removed. Thereby, the foreign matter 6 such as oil adhering to the surface of the metal foil 2 can be decomposed and removed by the plasma 9 or the ultraviolet ray 10, and molding defects due to the foreign matter 6 such as oil can be prevented. Here, only one of the supply of the plasma 9 and the irradiation of the ultraviolet rays 10 may be performed, or both may be sequentially performed. The supply condition of the plasma 9 can be, for example, a cleaning time of 10 minutes using a CO 2 plasma at a vacuum degree of 1.5 Pa, and the irradiation conditions of the ultraviolet ray 10 are, for example, an ultraviolet lamp 300 nm, 300 W × The irradiation can be performed for 6, 10 minutes, but is not limited thereto.

そして、上記従来例の方法では、打痕による両面金属箔張り積層板の外観不良率が25%であったが、本発明では打痕による両面金属箔張り積層板の外観不良率が7%に減少した。   And in the method of the above conventional example, the appearance defect rate of the double-sided metal foil-clad laminate due to the dent is 25%, but in the present invention, the appearance failure rate of the double-sided metal foil-clad laminate is 7%. Diminished.

本発明の実施の形態の一例を示し、(a)〜(e)は概略図である。An example of embodiment of this invention is shown and (a)-(e) is schematic. 同上の他の実施の形態を示す概略図である。It is the schematic which shows other embodiment same as the above. 従来例を示し、(a)〜(c)は概略図である。A prior art example is shown, and (a) to (c) are schematic views.

符号の説明Explanation of symbols

1 バンプ
2 金属箔
3 絶縁シート材
5 金属箔
6 異物
7 粘着物
9 プラズマ
10 紫外線
DESCRIPTION OF SYMBOLS 1 Bump 2 Metal foil 3 Insulating sheet material 5 Metal foil 6 Foreign material 7 Adhesive material 9 Plasma 10 Ultraviolet rays

Claims (6)

上面にバンプを形成した金属箔に絶縁シート材を重ね合わせると共に前記バンプを前記絶縁シート材に突き刺して貫通させることによって、前記絶縁シート材の上面に前記バンプの先端を突出させた重ね合わせ物を形成し、このバンプの先端に接触させるようにして他の金属箔と前記絶縁シート材とを重ね合わせ、この後、前記金属箔と前記絶縁シート材とを加圧成形して一体化する両面金属箔張り積層板の製造方法において、前記他の金属箔と前記絶縁シート材とを重ね合わせる前に、前記重ね合わせ物の上下に合紙を重ね合わせた状態で上下に反転し、その後、前記重ね合わせ物から前記合紙を除去することを特徴とする両面金属箔張り積層板の製造方法。 By penetrating pierce the bumps on the insulating sheet material causes the metal foil to form a bump on the top surface overlapping the insulating sheet material, said superposition product obtained by projecting the tip of the bump on the upper surface of the insulating sheet material formed, superimposed and with other metal foil the insulation sheet so as to contact with the tip of the bump, after this, double-metal for integrating said metal foil and said insulating sheet material by press molding the method of manufacturing a foil-clad laminate, prior to superimposing the other metal foil and said insulating sheet, inverted up and down in the stacked state interleaves and below the overlay was then said overlaid A method for producing a double-sided metal foil-clad laminate, wherein the slip sheet is removed from a laminate. 前記重ね合わせ物の上下に合紙を重ね合わせた状態で上下に反転した後、前記金属箔の前記絶縁シート材と重ね合わせていない方の面に付着する異物を除去することを特徴とする請求項1に記載の両面金属箔張り積層板の製造方法。 After reversed vertically superposed state interleaves and below the overlay material, claims and removing foreign matter adhering to the surface of which is not superimposed with the insulating sheet material of the metal foil Item 2. A method for producing a double-sided metal foil-clad laminate according to Item 1. 前記異物を粘着物で捕捉して除去することを特徴とする請求項2に記載の両面金属箔張り積層板の製造方法。   The method for producing a double-sided metal foil-clad laminate according to claim 2, wherein the foreign matter is captured and removed with an adhesive. 前記異物を前記粘着物で捕捉して除去するにあたって、前記金属箔にかかる圧力を0.1〜100kPaとすることを特徴とする請求項3に記載の両面金属箔張り積層板の製造方法。 When trapping and removing the foreign substance in the adhesive material, the method for producing the double-sided metal-foil-clad laminate according to claim 3, characterized in that the 0.1~100kPa the pressure applied to the metal foil. 前記金属箔の前記絶縁シート材と重ね合わせていない方の面に付着する前記異物を除去するにあたって、前記金属箔の表面にプラズマを供給することを特徴とする請求項2乃至4のいずれか1項に記載の両面金属箔張り積層板の製造方法。 When removing the foreign matter adhering to the surface of which is not superimposed with the insulating sheet material of the metal foil, any one of claims 2 to 4, characterized in that to supply the plasma to the surface of the metal foil 1 The manufacturing method of the double-sided metal foil clad laminated board as described in a term. 前記金属箔の前記絶縁シート材と重ね合わせていない方の面に付着する前記異物を除去するにあたって、前記金属箔の表面に紫外線を照射することを特徴とする請求項2乃至5のいずれか1項に記載の両面金属箔張り積層板の製造方法。 When removing the foreign matter adhering to the surface of the person who the not overlapped with insulating sheet material of the metal foil, any one of claims 2 to 5, wherein applying ultraviolet light to the surface of the metal foil 1 The manufacturing method of the double-sided metal foil clad laminated board as described in a term.
JP2007221848A 2007-08-28 2007-08-28 Method for producing double-sided metal foil-clad laminate Expired - Fee Related JP5080907B2 (en)

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