JP5068025B2 - Method for producing stretched film - Google Patents

Description

  The present invention relates to a method for producing a film by stretch molding, and more particularly to a method for producing a film by stretch molding using polyethylene of a specific density range and a specific polyethylene wax as raw materials.

  Conventionally, polyethylene films obtained by stretch molding have been developed for various uses. In recent years, improvement in productivity of this stretch molding has been increasingly demanded. As a general method for improving productivity at the time of molding such as stretch molding, a method of molding by adding a molding aid is known. For example, a method of molding a thermoplastic resin by applying a molding aid such as oil or polyethylene wax has been studied (for example, Patent Documents 1 and 2).

However, even when a film such as polyethylene is stretched and molded using a conventional molding aid, the moldability itself tends to be improved, but the characteristics of the obtained film, for example, optical characteristics such as transparency, etc. In some cases, mechanical properties such as impact resistance may deteriorate, and even if it is used as a film, it may cause a problem depending on the application.
Japanese Patent Publication No. 5-80492 Special table 2003-528948 gazette

  An object of the present invention is to provide a method for producing a polyethylene film that improves productivity at the time of stretch molding and that does not impair optical properties such as transparency and mechanical properties such as impact resistance.

  The inventors of the present invention have studied the above problems, and when stretch molding is performed using polyethylene in a specific density range and a specific polyethylene wax as raw materials, the productivity is improved, and the film obtained is made of polyethylene itself. It has been found that optical properties such as transparency inherently possessed are not impaired, and that mechanical properties such as impact resistance are not impaired, and the present invention has been completed.

That is, the method for producing the film of the present invention comprises:
The density measured according to the density gradient tube method of JIS K7112 is 900 (kg / m ³ ) or more.
A density gradient of JIS K7112 and polyethylene having a MI in a range of less than 940 (kg / m ³ ), MI measured in a condition of 190 ° C. and a test load of 21.18 N according to JIS K7210 in a range of 0.01 to 100 g / 10 min. The density measured according to the tube method is in the range of 890 to 980 (kg / m ³ ), and the number average molecular weight (Mn) in terms of polyethylene measured by gel permeation chromatography (GPC) is in the range of 500 to 4,000. It is characterized in that a mixture containing polyethylene wax that satisfies the relationship represented by the following formula (I) is stretch-molded.
B ≦ 0.0075 × K (I)
(In the above formula (I), B is a content ratio (% by weight) of a component having a polyethylene conversion molecular weight of 20,000 or more in the polyethylene wax when measured by gel permeation chromatography, and K Is the melt viscosity (mPa · s) of the polyethylene wax at 140 ° C.)

The polyethylene wax preferably further satisfies the relationship represented by the following formula (II).
A ≦ 230 × K ^(-0.537) (II)
(In the above formula (II), A is a content ratio (% by weight) of a component in which the molecular weight in terms of polyethylene in the polyethylene wax is 1,000 or less when measured by gel permeation chromatography, and K Is the melt viscosity (mPa · s) of the polyethylene wax at 140 ° C.)

  According to the method for producing a film of the present invention, the productivity at the time of polyethylene stretch molding is excellent. Further, the polyethylene film obtained by stretch molding does not impair the optical properties such as transparency inherent in polyethylene itself, and also does not impair the mechanical properties such as impact resistance.

Hereinafter, the present invention will be described in detail.
First, the raw materials used for the stretch molding of the present invention will be described.
〔polyethylene〕
In the present invention, polyethylene means a homopolymer of ethylene or ethylene and a small amount of α-, having an MI measured in the range of 0.01 to 100 g / 10 min according to JIS K7210 at 190 ° C. and a test load of 21.18 N. A copolymer with olefin or a blend thereof.

The polyethylene used in the present invention has a density of 900 (kg / m ³ ) or more and 940 (k
There is no particular limitation as long as the polyethylene is in the range of less than g / m ³ ). For example, linear linear low density polyethylene, ultra-low density polyethylene, or a blend thereof can be mentioned.

In the present invention, the measurement conditions for the MI and density of polyethylene are as follows.
(MI)
The measurement was performed in accordance with JIS K7210 at 190 ° C. and a test load of 21.18 N.

(density)
It was measured according to the density gradient tube method of JIS K7112.
Further, as described above, the density of the polyethylene used in the present invention is 900 (kg / m ³ ) or more,
Although it is the range below 940 (kg / m < ³ >), Preferably it is the range of 900-930 (kg / m < ³ >).

When the density of polyethylene is in the above range, the resulting film is excellent in balance such as gloss, transparency, and blocking property.
Moreover, as MI (JIS K7210: 190 degreeC) of the said polyethylene, 0.1-5
. The range of 0 g / 10 min is preferable, and the range of 0.5 to 4.0 g / 10 min is more preferable. When the MI of polyethylene is in the above range, a film having an excellent balance between moldability and mechanical strength can be obtained.
The shape of the polyethylene is not particularly limited, but is usually pellet-shaped or tablet-shaped particles.

[Polyethylene wax]
In the present invention, the polyethylene wax means an ethylene homopolymer or ethylene and α-olefin having a polyethylene-equivalent number average molecular weight (Mn) measured by gel permeation chromatography (GPC) in the range of 500 to 4,000. Or a blend thereof. The polyethylene-converted number average molecular weight (Mn) of the polyethylene wax is determined from gel permeation chromatography (GPC) measurement under the following conditions.

(Number average molecular weight (Mn))
The number average molecular weight was determined from GPC measurement. The measurement was performed under the following conditions. The number average molecular weight was determined based on the following conversion method by creating a calibration curve using commercially available monodisperse standard polystyrene.
Apparatus: Gel permeation chromatograph Alliance GPC2000 (manufactured by Waters)
Solvent: o-dichlorobenzene column: TSKgel column (manufactured by Tosoh Corporation) x 4
Flow rate: 1.0 ml / min Sample: 0.15 mg / ml o-dichlorobenzene solution temperature: 140 ° C.
Molecular weight conversion: PE conversion / General calibration method

In addition, the coefficient of the Mark-Houwink viscosity formula shown below was used for calculation of general-purpose calibration.
Coefficient of polystyrene (PS): KPS = 1.38 × 10 ⁻⁴ , aPS = 0.70
Coefficient of polyethylene (PE): KPE = 0.06 × 10 ⁻⁴ , aPE = 0.70
When the polyethylene wax has the composition and molecular weight as described above, the productivity during molding tends to be improved.

The polyethylene wax used in the present invention has a density in the range of 890 to 980 (kg / m ³ ). The density of the polyethylene wax is a value measured by the density gradient tube method of JISK7112. When the density of the polyethylene wax is in the above range, the productivity during molding tends to be improved.

The polyethylene wax of the present invention is characterized in that there is a specific relationship represented by the following formula (I) between its molecular weight and melt viscosity.
B ≦ 0.0075 × K (I)
Here, in the formula (I), B is a content ratio (weight) of a component having a molecular weight in terms of polyethylene of 20,000 or more in the polyethylene wax when measured by gel permeation chromatography. %). K is the melt viscosity (mPa · s) at 140 ° C. of the polyethylene wax measured with a Brookfield (B type) viscometer.

  When polyethylene wax that satisfies the above formula (I) is used, the resulting film does not impair the optical properties such as transparency inherent in polyethylene, and also does not impair the mechanical properties such as impact resistance. There is a tendency.

  Normally, when polyethylene wax with a low melt viscosity is mixed with polyethylene and stretch-molded, the viscosity of the entire mixture decreases, so the maximum stretching stress tends to decrease, and the productivity during molding is improved. There is a tendency. However, even if the productivity is improved in this way, the resulting film sometimes loses optical properties such as transparency inherent in polyethylene and mechanical properties such as impact resistance.

As a result of the study by the present inventors, the molecular weight of the polyethylene wax used is 20,000 for the optical properties such as transparency and the mechanical properties such as impact resistance of the film obtained by stretch molding.
It has been found that the proportion of zero or more components is extremely important in relation to melt viscosity. Although the detailed mechanism is not clear, when the polyethylene wax and polyethylene are melt-kneaded, among the whole polyethylene wax, the component having a molecular weight of 20,000 or more has a specific melting behavior in the whole wax. From the viewpoint of the melt viscosity of the entire polyethylene wax, unless the component having a molecular weight of 20,000 or more is kept below a certain ratio, the polyethylene wax cannot be dispersed well in the polyethylene, and the optical properties of the final film It is estimated that the mechanical properties are also affected.

A polyethylene wax having a B value in the above range can be prepared using a metallocene catalyst. Among the metallocene catalysts, metallocene catalysts whose ligands are non-crosslinked are preferable. As such a metallocene catalyst, a metallocene compound represented by the general formula (1) described later can be exemplified.

Further, the B value can be controlled by the polymerization temperature. For example, when a polyethylene wax is produced by a metallocene catalyst described later, the polymerization temperature is usually in the range of 100 to 200 ° C., but from the viewpoint of producing the polyethylene wax having the B value described above, the polymerization temperature is preferably Is in the range of 100 to 180 ° C, more preferably in the range of 100 to 170 ° C.

The polyethylene wax of the present invention preferably further has a specific relationship represented by the following formula (II) between its molecular weight and melt viscosity.
A ≦ 230 × K ^(-0.537) (II)
Here, in the above formula (II), A represents the content ratio (weight) of the component having a molecular weight in terms of polyethylene of 1,000 or less in the polyethylene wax when measured by gel permeation chromatography. %). K is the melt viscosity (mPa · s) of the polyethylene wax at 140 ° C.

  When a polyethylene wax that satisfies the condition of the above formula (II) is used, the resulting film tends to maintain the mechanical properties such as impact resistance and optical properties such as transparency inherent in polyethylene, In addition, bleed out from the film surface tends to be reduced.

  As mentioned above, usually, when polyethylene wax with low melt viscosity is mixed with polyethylene and stretch molding, the viscosity of the entire mixture decreases, so the maximum stretching stress tends to decrease, and the productivity at the time of molding Tend to be improved. However, even if productivity can be improved, the resulting film may lose its inherent mechanical properties such as impact resistance and optical properties such as transparency, and the bleed out from the film surface. There was also a problem.

  As a result of the study by the present inventors, the ratio of the component having a molecular weight of 1,000 or less in the polyethylene wax used in the mechanical properties, optical properties, bleedout, etc. of the film obtained by stretch molding is the melt viscosity. It was found to be extremely important in relation to Although the detailed mechanism is not clear, when polyethylene wax and polyethylene are melt-kneaded, among the whole polyethylene wax, components having a molecular weight of 1,000 or less are easily melted and the melting behavior is unique among all the waxes. From the viewpoint of the melt viscosity of the entire polyethylene wax, if the component does not have a molecular weight of 1,000 or less, it will ooze out to the surface, possibly causing deterioration, etc., resulting in final film mechanical properties and optical properties. It is presumed to affect the characteristics and bleed out.

A polyethylene wax having an A value in the above range can be prepared using a metallocene catalyst. Among the metallocene catalysts, metallocene catalysts whose ligands are non-crosslinked are preferable. As such a metallocene catalyst, a metallocene compound represented by the general formula (1) described later can be exemplified.

Furthermore, the A value can be controlled by the polymerization temperature. For example, when a polyethylene wax is produced with a metallocene catalyst described later, the polymerization temperature is usually in the range of 100 to 200 ° C., but from the viewpoint of producing the polyethylene wax having the A value described above, the polymerization temperature is preferably Is in the range of 100 to 180 ° C, more preferably in the range of 100 to 170 ° C.

  The polyethylene wax has a number average molecular weight (Mn) in the range of 500 to 4,000, preferably in the range of 600 to 3,800, and particularly preferably in the range of 700 to 3,500. When the number average molecular weight (Mn) of the polyethylene wax is in the above range, the dispersion of the polyethylene wax in the polyethylene tends to be better during molding. Moreover, since the tendency which the extrusion amount improves and the tendency which the load at the time of extrusion reduces becomes more remarkable, it exists in the tendency which productivity improves more. Furthermore, even when compared with a film obtained without adding polyethylene wax, the transparency and surface properties of the obtained film tend not to be impaired.

Mn of the polyethylene wax can be controlled by the polymerization temperature or the like. For example, when a polyethylene wax is produced with a metallocene catalyst described later, the polymerization temperature is usually in the range of 100 to 200 ° C., but from the viewpoint of producing a polyethylene wax having the above-mentioned preferred range of Mn, the polymerization temperature is , Preferably, it is the range of 100-180 degreeC, More preferably, it is the range of 100-170 degreeC.

The density of the polyethylene wax ^{(D (kg / m 3)} ) is in the range of 890~980 (kg / m ^3), more preferably in the range of ^{895~960 (kg / m 3),} 895~945
The range of (kg / m ³ ) is more preferable, and the range of 900 to 945 (kg / m ³ ) is particularly preferable. When the density (D) of the polyethylene wax is within the above range, the dispersion of the polyethylene wax in the polyethylene tends to be better during molding. Moreover, since the tendency which the extrusion amount improves and the tendency which the load at the time of extrusion reduces becomes more remarkable, it exists in the tendency which productivity improves more. Furthermore, even when compared with a film obtained without adding polyethylene wax, not only the optical properties of the resulting film are not impaired, but also the mechanical properties tend to be further impaired. In particular, when the density of the wax is in the range of 900 to 945 (kg / m ³ ), it is preferable in terms of excellent impact resistance as compared with a film to which no wax is added.

  The density of the polyethylene wax depends on the number average molecular weight (Mn) of the polyethylene wax when the polyethylene wax is a homopolymer of ethylene. For example, if the molecular weight of polyethylene wax is lowered, the density of the resulting polymer can be controlled low. When the polyethylene wax is a copolymer of ethylene and α-olefin, the density of the polyethylene wax depends on the number average molecular weight (Mn), and the amount of α-olefin used for ethylene during polymerization. , And its type. For example, when the amount of α-olefin used relative to ethylene is increased, the density of the resulting polymer can be lowered.

From the viewpoint of the density of the polyethylene wax, an ethylene homopolymer, a copolymer of ethylene and an α-olefin having 3 to 20 carbon atoms, or a mixture thereof is preferable.
The α-olefin used for producing the copolymer of ethylene and an α-olefin having 3 to 20 carbon atoms is preferably an α-olefin having 3 to 10 carbon atoms, and propylene, 1-butene, 1-pentene. 1-hexene, 4-methyl-1-pentene and 1-octene are more preferable, and propylene, 1-butene, 1-hexene and 4-methyl-1-pentene are particularly preferable.

It is preferable that the α-olefin used in the production of the copolymer of ethylene and α-olefin is in the range of 0 to 20 mol% with respect to all monomers used.
The density of the polyethylene wax can also be controlled by the polymerization temperature. For example, when a polyethylene wax is produced by a metallocene catalyst described later, the polymerization temperature is usually in the range of 100 to 200 ° C., but from the viewpoint of producing a polyethylene wax having a density in the preferred range described above, the polymerization temperature is , Preferably, it is the range of 100-180 degreeC, More preferably, it is the range of 100-170 degreeC.

The polyethylene wax used in the present invention is an ethylene homopolymer, a copolymer of ethylene and an α-olefin, or a mixture thereof as described above.
Such polyethylene wax is solid at normal temperature and becomes a low-viscosity liquid at 65 to 130 ° C.

Further, the polyethylene wax preferably has the crystallization temperature [Tc (° C.)] measured by a differential scanning calorimeter (DSC) and the density (D (kg / m ³ )) measured by the density gradient method. Formula (III) below
0.501 × D-366 ≧ Tc (III)
More preferably, the following formula (IIIa)
0.501 × D-366.5 ≧ Tc (IIIa)
More preferably, the following formula (IIIb)
0.501 × D-367 ≧ Tc (IIIb)
Satisfy the relationship.

  When the crystallization temperature (Tc) and the density (D) in the polyethylene wax satisfy the relationship of the above formula, the dispersibility of the polyethylene wax in polyethylene tends to be good.

  A polyethylene wax that satisfies the relationship of the above formula can be prepared using a metallocene catalyst. Among the metallocene catalysts, metallocene catalysts whose ligands are non-crosslinked are preferable. As such a metallocene catalyst, a metallocene compound represented by the general formula (1) described later can be exemplified.

  Furthermore, the polyethylene wax satisfying the relationship of the above formula can also be produced by controlling the polymerization temperature. For example, when a polyethylene wax is produced by a metallocene catalyst described later, the polymerization temperature is usually in the range of 100 to 200 ° C., but from the viewpoint of producing the polyethylene wax having the B value described above, the polymerization temperature is preferably Is in the range of 100 to 180 ° C, more preferably in the range of 100 to 170 ° C.

Suitable metallocene catalysts in the present invention include, for example,
(A) a metallocene compound of a transition metal selected from Group 4 of the periodic table, and (B) (b-1) an organoaluminum oxy compound,
(b-2) a compound that reacts with the bridged metallocene compound (A) to form an ion pair, and
(b-3) An olefin polymerization catalyst comprising at least one compound selected from organoaluminum compounds.

These will be described in detail below.
<Metalocene compounds>
(A) Metallocene compound of transition metal selected from Group 4 of the periodic table The metallocene compound forming the metallocene catalyst is a metallocene compound of transition metal selected from Group 4 of the periodic table. The compound represented by Formula (1) is mentioned.
M ¹ Lx (1)
Here, M ¹ is a transition metal selected from Group 4 of the periodic table, x is a valence of the transition metal M ¹ , and L is a ligand. Examples of the transition metal represented by M ¹ include zirconium, titanium, hafnium and the like. L is a ligand coordinated to the transition metal M ^1, and at least one of the ligands L is a ligand having a cyclopentadienyl skeleton, and the ligand having this cyclopentadienyl skeleton. The ligand may have a substituent. Examples of the ligand L having a cyclopentadienyl skeleton include a cyclopentadienyl group, a methylcyclopentadienyl group, an ethylcyclopentadienyl group, an n- or i-propylcyclopentadienyl group, n-, alkyl such as i-, sec- or t-butylcyclopentadienyl group, dimethylcyclopentadienyl group, methylpropylcyclopentadienyl group, methylbutylcyclopentadienyl group, methylbenzylcyclopentadienyl group, An alkyl-substituted cyclopentadienyl group; and an indenyl group, 4,5,6,7-tetrahydroindenyl group, a fluorenyl group, and the like. The hydrogen of the ligand having a cyclopentadienyl skeleton may be substituted with a halogen atom or a trialkylsilyl group.

  When the metallocene compound has two or more ligands having a cyclopentadienyl skeleton as the ligand L, the ligands having two cyclopentadienyl skeletons are ethylene, propylene. Or a substituted alkylene group such as isopropylidene or diphenylmethylene; a substituted silylene group such as a silylene group or a dimethylsilylene group, a diphenylsilylene group, or a methylphenylsilylene group.

Examples of ligands other than ligands having a cyclopentadienyl skeleton (ligands having no cyclopentadienyl skeleton) L include hydrocarbon groups having 1 to 12 carbon atoms, alkoxy groups, aryloxy groups, sulfones. Acid-containing group (—SO ₃ R ¹ ), halogen atom or hydrogen atom (where R ¹ is an alkyl group, an alkyl group substituted with a halogen atom, an aryl group, an aryl group substituted with a halogen atom, or an alkyl group) A substituted aryl group).

<Example 1 of metallocene compound>
When the metallocene compound represented by the general formula (1) has a transition metal valence of 4, for example, it is more specifically represented by the following general formula (2).
R ² _k R ³ _l R ⁴ _m R ⁵ _n M ¹ (2)
Here, M ¹ is a transition metal selected from Group 4 of the periodic table, R ² is a group (ligand) having a cyclopentadienyl skeleton, and R ³ , R ⁴ and R ⁵ are each independently cyclopentadienyl. A group (ligand) having or not having a skeleton. k is an integer of 1 or more, and k + l + m + n = 4.

Examples of metallocene compounds in which M ¹ is zirconium and contains at least two ligands having a cyclopentadienyl skeleton are given below. Bis (cyclopentadienyl) zirconium monochloride monohydride, bis (cyclopentadienyl) zirconium dichloride, bis (1-methyl-3-butylcyclopentadienyl) zirconium bis (trifluoromethanesulfonate), bis (1, 3-dimethylcyclopentadienyl) zirconium dichloride and the like.

Among the above compounds, compounds in which the 1,3-position substituted cyclopentadienyl group is replaced with a 1,2-position substituted cyclopentadienyl group can also be used.
Another example of the metallocene compound is R ² , R ³ , R ^{4 in the} general formula (2).
And at least two of R ⁵ , for example, R ² and R ³ are groups having a cyclopentadienyl skeleton (
A bridge type metallocene compound in which at least two groups are bonded via an alkylene group, a substituted alkylene group, a silylene group, a substituted silylene group, or the like. At this time, R ⁴ and R ⁵ are each independently the same as the ligand L other than the ligand having the cyclopentadienyl skeleton described above.

  Examples of such bridge-type metallocene compounds include ethylene bis (indenyl) dimethylzirconium, ethylenebis (indenyl) zirconium dichloride, isopropylidene (cyclopentadienyl-fluorenyl) zirconium dichloride, diphenylsilylene bis (indenyl) zirconium dichloride, methyl Examples include phenylsilylene bis (indenyl) zirconium dichloride.

<Example 2 of metallocene compound>
Moreover, as an example of a metallocene compound, the metallocene compound of Unexamined-Japanese-Patent No. 4-268307 represented by following General formula (3) is mentioned.

Here, M ¹ is a Group 4 transition metal of the periodic table, and specifically includes titanium, zirconium, and hafnium.
R ¹¹ and R ¹² may be the same or different from each other, and are a hydrogen atom; an alkyl group having 1 to 10 carbon atoms; an alkoxy group having 1 to 10 carbon atoms; an aryl group having 6 to 10 carbon atoms; Aryloxy group having 6 to 10 carbon atoms; alkenyl group having 2 to 10 carbon atoms; arylalkyl group having 7 to 40 carbon atoms; alkylaryl group having 7 to 40 carbon atoms; arylalkenyl group having 8 to 40 carbon atoms Or a halogen atom, and R ¹¹ and R ¹² are preferably chlorine atoms.

R ¹³ and R ¹⁴ may be the same or different from each other, and are a hydrogen atom; a halogen atom; an optionally halogenated alkyl group having 1 to 10 carbon atoms; an aryl group having 6 to 10 carbon atoms; (R ²⁰ ) ₂ , —SR ²⁰ , —OSi (R ²⁰ ) ₃ , —Si (R ²⁰ ) ₃ or —P (R ²⁰ ) ₂ groups. R ²⁰ is a halogen atom, preferably a chlorine atom; an alkyl group having 1 to 10 carbon atoms, preferably 1 to 3 carbon atoms; or an aryl group having 6 to 10 carbon atoms, preferably 6 to 8 carbon atoms. R ¹³ and R ¹⁴ are particularly preferably hydrogen atoms.

R ¹⁵ and R ¹⁶ are the same as R ¹³ and R ¹⁴ except that they do not contain a hydrogen atom, and may be the same or different from each other, preferably the same. R ¹⁵ and R ¹⁶ are preferably an optionally halogenated alkyl group having 1 to 4 carbon atoms, specifically, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, trifluoromethyl and the like. Particularly preferred is methyl.

In the general formula (3), R ¹⁷ is selected from the following group.

= BR ²¹ , = AlR ²¹ , -Ge-, -Sn-, -O-, -S-, = SO, = SO ₂ , = N
R ²¹ , = CO, = PR ²¹ , = P (O) R ^{21 and the} like. M ² is silicon, germanium or tin,
Silicon or germanium is preferred. Here, R ²¹ , R ²² and R ²³ may be the same or different from each other, and are hydrogen atom; halogen atom; alkyl group having 1 to 10 carbon atoms; fluoroalkyl group having 1 to 10 carbon atoms; carbon atom An aryl group having 6 to 10 carbon atoms; a fluoroaryl group having 6 to 10 carbon atoms; an alkoxy group having 1 to 10 carbon atoms; an alkenyl group having 2 to 10 carbon atoms; an arylalkyl group having 7 to 40 carbon atoms; An arylalkenyl group having 8 to 40 carbon atoms; or an alkylaryl group having 7 to 40 carbon atoms. “R ²¹ and R ²² ” or “R ²¹ and R ²³ ” may form a ring together with the atoms to which they are bonded. R ¹⁷ may be = CR ²¹ R ²² , = SiR ²¹ R ²² , = GeR ²¹ R ²² , -O-, -S-, = SO, = PR ²¹ or = P (O) R ^21. preferable. R ¹⁸ and R ¹⁹ may be the same as or different from each other, and examples thereof include the same as R ²¹ . m and n may be the same or different and are each 0, 1 or 2, preferably 0 or 1, and m + n is 0, 1 or 2, preferably 0 or 1.

Examples of the metallocene compound represented by the general formula (3) include the following compounds. rac-ethylene (2-methyl-1-indenyl) ₂ -zirconium dichloride,
rac-dimethylsilylene (2-methyl-1-indenyl) ₂ -zirconium dichloride and the like. These metallocene compounds can be produced, for example, by the method described in JP-A-4-268307.

<Example 3 of metallocene compound>
Moreover, as a metallocene compound, the metallocene compound represented by following General formula (4) can also be used.

In Formula (4), M ³ represents a transition metal atom of Group 4 of the periodic table, and specifically, titanium, zirconium, hafnium, and the like. R ²⁴ and R ²⁵ may be the same or different and are each a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 20 carbon atoms, a halogenated hydrocarbon group having 1 to 20 carbon atoms, a silicon-containing group, oxygen A containing group, a sulfur-containing group, a nitrogen-containing group or a phosphorus-containing group; R ²⁴ is preferably a hydrocarbon group, and particularly preferably an alkyl group having 1 to 3 carbon atoms such as methyl, ethyl or propyl. R ²⁵ is preferably a hydrogen atom or a hydrocarbon group, particularly preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms such as methyl, ethyl or propyl. R ²⁶ , R ²⁷ , R ²⁸ and R ²⁹ may be the same or different from each other, and are a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 20 carbon atoms, or a halogenated hydrocarbon having 1 to 20 carbon atoms. Indicates a group. Among these, a hydrogen atom, a hydrocarbon group, or a halogenated hydrocarbon group is preferable. At least one of R ²⁶ and R ²⁷ , R ²⁷ and R ²⁸ , and R ²⁸ and R ²⁹ may form a monocyclic aromatic ring together with the carbon atoms to which they are bonded. Good. When there are two or more hydrocarbon groups or halogenated hydrocarbon groups other than the group forming the aromatic ring, they may be bonded to each other to form a ring. When R ²⁹ is a substituent other than an aromatic group, it is preferably a hydrogen atom. X ¹ and X ² may be the same or different from each other, and are a hydrogen atom, a halogen atom, or a carbon atom number of 1 to 1.
Y representing 20 hydrocarbon group, halogenated hydrocarbon group having 1 to 20 carbon atoms, oxygen atom-containing group or sulfur atom-containing group is a divalent hydrocarbon group having 1 to 20 carbon atoms, the number of carbon atoms 1-20 divalent halogenated hydrocarbon groups, divalent silicon-containing groups, divalent germanium-containing groups, divalent tin-containing groups, -O-, -CO-, -S-, -SO-, ^{_{-SO 2 -, - NR 30 -}} , -
^{P (R 30) -, -} P (O) (R 30) -, - BR 30 - or -AlR ³⁰ - (provided that, R ³⁰ is a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 20 carbon atoms, A halogenated hydrocarbon group having 1 to 20 carbon atoms).

In the formula (4), at least one pair of R ²⁶ and R ²⁷ , R ²⁷ and R ²⁸ , R ²⁸ and R ²⁹ is bonded to each other, and is coordinated to M ³ Examples of the ligand include those represented by the following formula.

(In the formula, Y is the same as that shown in the previous formula.)
<Example 4 of metallocene compound>
As the metallocene compound, a metallocene compound represented by the following general formula (5) can also be used.

In the formula (5), M ³ , R ²⁴ , R ²⁵ , R ²⁶ , R ²⁷ , R ²⁸ and R ²⁹ are the same as those in the general formula (4). Of R ²⁶ , R ²⁷ , R ²⁸ and R ²⁹ , two groups including R ²⁶ are preferably alkyl groups, and R ²⁶ and R ²⁸ , or R ²⁸ and R ²⁹ are alkyl groups. preferable. This alkyl group is preferably a secondary or tertiary alkyl group. The alkyl group may be substituted with a halogen atom or a silicon-containing group. Examples of the halogen atom and silicon-containing group include the substituents exemplified for R ²⁴ and R ²⁵ . Of R ²⁶ , R ²⁷ , R ²⁸ and R ²⁹ , the group other than the alkyl group is preferably a hydrogen atom. R ²⁶ , R ²⁷ , R ^28, and R ²⁹ may form a monocyclic ring or a polycyclic ring other than an aromatic ring by combining two groups selected from these groups. Examples of the halogen atom are the same as those described above for R ²⁴ and R ²⁵ . Examples of X ¹ , X ² and Y are the same as those described above.

Specific examples of the metallocene compound represented by the general formula (5) are shown below. rac-dimethylsilylene-bis (4,7-dimethyl-1-indenyl) zirconium dichloride, r
ac-dimethylsilylene-bis (2,4,7-trimethyl-1-indenyl) zirconium dichloride, rac-dimethylsilylene-bis (2,4,6-trimethyl-1-indenyl) zirconium dichloride, and the like.

  In these compounds, transition metal compounds in which zirconium metal is replaced with titanium metal or hafnium metal can also be used. The transition metal compound is usually used as a racemate, but can also be used in the R-type or S-type.

<Examples of metallocene compounds-5>
As the metallocene compound, a metallocene compound represented by the following general formula (6) can also be used.

In the formula (6), M ³ , R ²⁴ , X ¹ , X ² and Y are the same as those in the general formula (4). R ²⁴ is preferably a hydrocarbon group, particularly preferably an alkyl group having 1 to 4 carbon atoms such as methyl, ethyl, propyl or butyl. R ²⁵ represents an aryl group having 6 to 16 carbon atoms. R ²⁵ is preferably phenyl or naphthyl. The aryl group may be substituted with a halogen atom, a hydrocarbon group having 1 to 20 carbon atoms, or a halogenated hydrocarbon group having 1 to 20 carbon atoms. X ¹ and X ² are preferably a halogen atom or a hydrocarbon group having 1 to 20 carbon atoms.

  Specific examples of the metallocene compound represented by the general formula (6) are shown below. rac-dimethylsilylene-bis (4-phenyl-1-indenyl) zirconium dichloride, rac-dimethylsilylene-bis (2-methyl-4-phenyl-1-indenyl) zirconium dichloride, rac-dimethylsilylene-bis (2-methyl) -4- (α-naphthyl) -1-indenyl) zirconium dichloride, rac-dimethylsilylene-bis (2-methyl-4- (β-naphthyl) -1-indenyl) zirconium dichloride, rac-dimethylsilylene-bis (2 -Methyl-4- (1-anthryl) -1-indenyl) zirconium dichloride and the like. In these compounds, transition metal compounds in which zirconium metal is replaced with titanium metal or hafnium metal can also be used.

<Examples of metallocene compounds-6>
As the metallocene compound, a metallocene compound represented by the following general formula (7) can also be used.
LaM ⁴ X ³ ₂ (7)
Here, M ⁴ is a periodic table group 4 or lanthanide series metal. La is a derivative of a delocalized π bond group, and is a group imparting a constraining geometry to the metal M ⁴ active site. X ³ may be the same or different from each other, and is a hydrogen atom, a halogen atom, a hydrocarbon group having 20 or less carbon atoms, a silyl group containing 20 or less silicon, or a germanyl group containing 20 or less germanium.

  Among these compounds, a compound represented by the following formula (8) is preferable.

In the formula (8), M ⁴ is titanium, zirconium or hafnium. X ³ is the same as that described in the general formula (7). Cp is a substituted cyclopentadienyl group having a π bond to M ⁴ and having a substituent Z. Z is oxygen, sulfur, boron or an element belonging to Group 4 of the periodic table (for example, silicon, germanium or tin). Y is a ligand containing nitrogen, phosphorus, oxygen or sulfur, and Z and Y may form a condensed ring. Specific examples of the metallocene compound represented by the formula (8) are shown below. (Dimethyl (t-butylamide) (tetramethyl-η ⁵ -cyclopentadienyl) silane) titanium dichloride, ((t-butylamide) (tetramethyl-η ⁵ -cyclopentadienyl) -1,2-ethanediyl) titanium Dichloride etc. In the metallocene compound, a compound in which titanium is replaced with zirconium or hafnium can be exemplified.

<Examples of metallocene compounds-7>
Moreover, as a metallocene compound, the metallocene compound represented by following General formula (9) can also be used.

In formula (9), M ³ is a transition metal atom of Group 4 of the periodic table, specifically titanium, zirconium or hafnium, preferably zirconium. R ³¹ may be the same as or different from each other, and at least one of them is an aryl group having 11 to 20 carbon atoms, an arylalkyl group having 12 to 40 carbon atoms, an arylalkenyl group having 13 to 40 carbon atoms, carbon An alkylaryl group having 12 to 40 atoms or a silicon-containing group, or at least two adjacent groups among the groups represented by R ³¹ , together with the carbon atoms to which they are bonded, one or more aromatic rings Or an aliphatic ring is formed. In this case, the ring formed by R ^31, it is 4 to 20 carbon atoms in all including carbon atoms to which R ³¹ is bonded. Aryl group, arylalkyl group, arylalkenyl group, an alkylaryl group and an aromatic ring, R ³¹ other than R ³¹ that forms an aliphatic ring is a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms Or a silicon-containing group. R ³² may be the same as or different from each other, and may be a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or a carbon atom. An arylalkyl group having 7 to 40 carbon atoms, an arylalkenyl group having 8 to 40 carbon atoms, an alkylaryl group having 7 to 40 carbon atoms, a silicon-containing group, an oxygen-containing group, a sulfur-containing group, a nitrogen-containing group or a phosphorus-containing group It is. Further, at least two adjacent groups among the groups represented by R ³² may form one or more aromatic rings or aliphatic rings together with the carbon atoms to which they are bonded. In this case, the ring formed by R ³² has 4 to 20 carbon atoms in all including carbon atoms to which R ³² is bonded, an aromatic ring, other than R ³² that forms an aliphatic ring R ³² is a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or a silicon-containing group. The group in which the two groups represented by R ^{32 form} one or more aromatic rings or aliphatic rings includes an embodiment in which the fluorenyl group has a structure represented by the following formula.

R ³² is preferably a hydrogen atom or an alkyl group, and particularly preferably a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms such as methyl, ethyl or propyl. A suitable example of such a fluorenyl group having R ³² as a substituent is a 2,7-dialkyl-fluorenyl group. In this case, the 2,7-dialkyl alkyl group includes 1 to 1 carbon atoms. 5 alkyl groups. R ³¹ and R ³² may be the same as or different from each other. R ³³ and R ³⁴ may be the same as or different from each other, and are the same hydrogen atom, halogen atom, alkyl group having 1 to 10 carbon atoms, aryl group having 6 to 20 carbon atoms, and 2 to 2 carbon atoms. 10 alkenyl groups, arylalkyl groups having 7 to 40 carbon atoms, arylalkenyl groups having 8 to 40 carbon atoms, alkylaryl groups having 7 to 40 carbon atoms, silicon-containing groups, oxygen-containing groups, sulfur-containing groups, A nitrogen-containing group or a phosphorus-containing group. Of these, at least one of R ³³ and R ³⁴ is preferably an alkyl group having 1 to 3 carbon atoms. X ¹ and X ² may be the same or different and are each a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 20 carbon atoms, a halogenated hydrocarbon group having 1 to 20 carbon atoms, an oxygen-containing group, sulfur A conjugated diene residue formed from a containing group or a nitrogen-containing group, or X ¹ and X ² . As the conjugated diene residue formed from X ¹ and X ² , residues of 1,3-butadiene, 2,4-hexadiene, 1-phenyl-1,3-pentadiene and 1,4-diphenylbutadiene are preferable. These residues may be further substituted with a hydrocarbon group having 1 to 10 carbon atoms. X ¹ and X ² are preferably a halogen atom, a hydrocarbon group having 1 to 20 carbon atoms, or a sulfur-containing group. Y is a divalent hydrocarbon group having 1 to 20 carbon atoms, a divalent halogenated hydrocarbon group having 1 to 20 carbon atoms, a divalent silicon-containing group, a divalent germanium-containing group, a divalent Tin-containing group, —O—, —CO—, —S—, —SO—, —SO ₂ —, —N
^{R 35 -, - P (R} 35) -, - P (O) (R 35) -, - BR 35 - or -AlR ³⁵ - (provided that, R ³⁵ is a hydrogen atom, a halogen atom, carbon atom 20 And a halogenated hydrocarbon group having 1 to 20 carbon atoms). Among these divalent groups, those in which the shortest linking portion of -Y- is composed of one or two atoms are preferable. R ³⁵ is a halogen atom, a hydrocarbon group having 1 to 20 carbon atoms, or a halogenated hydrocarbon group having 1 to 20 carbon atoms. Y is preferably a divalent hydrocarbon group having 1 to 5 carbon atoms, a divalent silicon-containing group or a divalent germanium-containing group, more preferably a divalent silicon-containing group. Particularly preferred is silylene, alkylarylsilylene or arylsilylene.

<Examples of metallocene compounds-8>
As the metallocene compound, a metallocene compound represented by the following general formula (10) can also be used.

In formula (10), M ³ is a transition metal atom of Group 4 of the periodic table, specifically titanium, zirconium or hafnium, preferably zirconium. R ³⁶ may be the same as or different from each other, and includes a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and silicon-containing Group, oxygen-containing group, sulfur-containing group, nitrogen-containing group or phosphorus-containing group. The alkyl group and alkenyl group may be substituted with a halogen atom. Of these, R ³⁶ is preferably an alkyl group, an aryl group or a hydrogen atom, particularly a hydrocarbon group having 1 to 3 carbon atoms such as methyl, ethyl, n-propyl and i-propyl, phenyl, α-naphthyl. And an aryl group such as β-naphthyl or a hydrogen atom. R ³⁷ may be the same or different from each other, and may be a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or a carbon atom. An arylalkyl group having 7 to 40 carbon atoms, an arylalkenyl group having 8 to 40 carbon atoms, an alkylaryl group having 7 to 40 carbon atoms, a silicon-containing group, an oxygen-containing group, a sulfur-containing group, a nitrogen-containing group or a phosphorus-containing group It is. Note that the alkyl group, aryl group, alkenyl group, arylalkyl group, arylalkenyl group, and alkylaryl group may be substituted with halogen. Of these, R ³⁷ is preferably a hydrogen atom or an alkyl group, and particularly a hydrogen atom or a carbon atom having 1 to 4 carbon atoms such as methyl, ethyl, n-propyl, i-propyl, n-butyl, or tert-butyl. A hydrogen group is preferred. R ³⁶ and R ³⁷ may be the same as or different from each other. One of R ³⁸ and R ³⁹ is an alkyl group having 1 to 5 carbon atoms, and the other is a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkenyl group having 2 to 10 carbon atoms. A silicon-containing group, an oxygen-containing group, a sulfur-containing group, a nitrogen-containing group or a phosphorus-containing group. Among these, it is preferable that any one of R ³⁸ and R ³⁹ is an alkyl group having 1 to 3 carbon atoms such as methyl, ethyl, and propyl, and the other is a hydrogen atom. X ¹ and X ² may be the same or different and are each a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 20 carbon atoms, a halogenated hydrocarbon group having 1 to 20 carbon atoms, an oxygen-containing group, sulfur A conjugated diene residue formed from a containing group or a nitrogen-containing group, or X ¹ and X ² . Among these, a halogen atom or a hydrocarbon group having 1 to 20 carbon atoms is preferable. Y is a divalent hydrocarbon group having 1 to 20 carbon atoms, a divalent halogenated hydrocarbon group having 1 to 20 carbon atoms, a divalent silicon-containing group, a divalent germanium-containing group, a divalent tin-containing group, -O -, - CO -, - S -, - SO -, - SO 2 -, - NR 40 -, - P (R 40) -,
—P (O) (R ⁴⁰ ) —, —BR ⁴⁰ — or —AlR ⁴⁰ — (wherein R ⁴⁰ is a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 20 carbon atoms, or a group having 1 to 20 carbon atoms. A halogenated hydrocarbon group). Among these, Y is preferably a divalent hydrocarbon group having 1 to 5 carbon atoms, a divalent silicon-containing group, or a divalent germanium-containing group, and more preferably a divalent silicon-containing group. An alkylsilylene, an alkylarylsilylene or an arylsilylene is particularly preferable.

<Examples of metallocene compounds-9>
Further, as the metallocene compound, a metallocene compound represented by the following general formula (11) can also be used.

In the formula (11), Y is selected from carbon, silicon, germanium and tin atoms, M is Ti, Zr or Hf, and R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ and R ¹²
Are selected from hydrogen, a hydrocarbon group, and a silicon-containing group, and may be the same or different, and adjacent substituents from R ⁵ to R ¹² may be bonded to each other to form a ring, R ¹³ , R ¹⁴ is selected from a hydrocarbon group and a silicon-containing group, and may be the same or different, and R ¹³ and R ¹⁴ may be bonded to each other to form a ring. Q may be selected from a halogen, a hydrocarbon group, an anionic ligand, or a neutral ligand capable of coordinating with a lone electron pair in the same or different combination, and j is an integer of 1 to 4. )

  Hereinafter, after describing sequentially the cyclopentadienyl group, the fluorenyl group, the crosslinked part, and other characteristics that are the chemical structure characteristics of the bridged metallocene compound according to the present invention, a preferable bridged metallocene compound having these characteristics will be described. .

Cyclopentadienyl group The cyclopentadienyl group may or may not be substituted. The cyclopentadienyl group which may or may not be substituted means that R ¹ , R ² , R ³ and R ⁴ possessed by the cyclopentadienyl group moiety in the general formula (11) are all hydrogen atoms. Or any one or more of R ¹ , R ² , R ³ and R ⁴ is a hydrocarbon group (f1), preferably a hydrocarbon group having 1 to 20 carbon atoms (f1 ′), or silicon-containing It means a cyclopentadienyl group substituted by a group (f2), preferably a silicon-containing group (f2 ′) having a total carbon number of 1 to 20. When two or more of R ¹ , R ² , R ³ and R ⁴ are substituted, these substituents may be the same as or different from each other. Further, the hydrocarbon group having 1 to 20 carbon atoms in total is an alkyl, alkenyl, alkynyl, or aryl group composed of only carbon and hydrogen. These include those in which any two adjacent hydrogen atoms are simultaneously substituted to form an alicyclic or aromatic ring. The hydrocarbon group having 1 to 20 carbon atoms in total (f1 ′) includes, in addition to alkyl, alkenyl, alkynyl and aryl groups composed only of carbon and hydrogen, some of the hydrogen atoms directly connected to these carbon atoms are halogen atoms. , An oxygen-containing group, a nitrogen-containing group, a heteroatom-containing hydrocarbon group substituted with a silicon-containing group, or a group in which any two adjacent hydrogen atoms form an alicyclic group. Such a group (f1 ')
As methyl group, ethyl group, n-propyl group, allyl group, n-butyl group, n-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, n-nonyl group, linear hydrocarbon group such as n-decanyl group; isopropyl group, t-butyl group, amyl group, 3-methylpentyl group, 1,1-diethylpropyl group, 1,1-dimethylbutyl group, 1-methyl- Branched hydrocarbon groups such as 1-propylbutyl group, 1,1-propylbutyl group, 1,1-dimethyl-2-methylpropyl group, 1-methyl-1-isopropyl-2-methylpropyl group; cyclopentyl group, Cyclic saturated hydrocarbon groups such as cyclohexyl group, cycloheptyl group, cyclooctyl group, norbornyl group, adamantyl group; cyclic unsaturated hydrocarbon groups such as phenyl group, naphthyl group, biphenyl group, phenanthryl group, anthracenyl group and their nuclei Alkyl substitution A saturated hydrocarbon group substituted with an aryl group such as benzyl group or cumyl group; methoxy group, ethoxy group, phenoxy group, N-methylamino group, trifluoromethyl group, tribromomethyl group, pentafluoroethyl group, pentafluorophenyl And a heteroatom-containing hydrocarbon group such as a group.
The silicon-containing group (f2) is, for example, a group in which a ring carbon of a cyclopentadienyl group is directly covalently bonded to a silicon atom, and specifically an alkylsilyl group or an arylsilyl group. Examples of the silicon-containing group (f2 ′) having a total carbon number of 1 to 20 include a trimethylsilyl group and a triphenylsilyl group.

Fluorenyl group The fluorenyl group may or may not be substituted. The fluorenyl group which may or may not be substituted is R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ and R ¹² possessed by the fluorenyl group moiety in the general formula (11). Are all hydrogen atoms, or at least one of R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ and R ¹² is a hydrocarbon group (f1), preferably Means a fluorenyl group substituted with a hydrocarbon group having 1 to 20 carbon atoms (f1 ′) or a silicon-containing group (f2), preferably a silicon-containing group having 1 to 20 carbon atoms (f2 ′) To do. When two or more of R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ and R ¹² are substituted, the substituents may be the same or different from each other. Good. Further, R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ and R ¹² may be bonded to each other to form a ring. In view of the ease of production of the catalyst, those in which R ⁶ and R ¹¹ and R ⁷ and R ¹⁰ are the same are preferably used.
A preferred group of the hydrocarbon group (f1) is the above-described hydrocarbon group (f1 ′) having a total carbon number of 1 to 20, and a preferable example of the silicon-containing group (f2) is the above-described total number of carbon atoms of 1 to 20. It is a silicon-containing group (f2 ′).

Covalent bond bridge The main chain part of the bond connecting the cyclopentadienyl group and the fluorenyl group is a divalent covalent bond containing one carbon, silicon, germanium and tin atom. The important point in the high-temperature solution polymerization of the present invention is that the bridging atom Y of the covalent bond bridging portion has R ¹³ and R ¹⁴ which may be the same or different from each other. A preferred group of the hydrocarbon group (f1) is the above-described hydrocarbon group (f1 ′) having a total carbon number of 1 to 20, and a preferable example of the silicon-containing group (f2) is the above-described total number of carbon atoms of 1 to 20. It is a silicon-containing group (f2 ′).

Other characteristics of the bridged metallocene compound In the general formula (11), Q is halogen, a hydrocarbon group having 1 to 10 carbon atoms, or a neutral, conjugated or nonconjugated diene having 10 or less carbon atoms, They are selected from the same or different combinations from anionic ligands or neutral ligands that can coordinate with a lone pair of electrons. Specific examples of the halogen are fluorine, chlorine, bromine and iodine, and specific examples of the hydrocarbon group are methyl, ethyl, n-propyl, isopropyl, 2-methylpropyl, 1,1-dimethylpropyl, 2, 2-dimethylpropyl, 1,1-diethylpropyl, 1-ethyl-1-methylpropyl, 1,1,2,2-tetramethylpropyl, sec-butyl, tert-butyl, 1,1-dimethylbutyl, 1, Examples include 1,3-trimethylbutyl, neopentyl, cyclohexylmethyl, cyclohexyl, 1-methyl-1-cyclohexyl and the like. Specific examples of neutral, conjugated or non-conjugated dienes having 10 or less carbon atoms include s-cis-
Or s- trans eta ⁴ -1,3-butadiene, s- cis - or s- trans eta ^{4-1,4-diphenyl-1,3-butadiene,} s- cis - or s- trans eta ⁴ - 3-methyl-1,3-pentadiene, s-cis- or s-trans-η ⁴ -1,4-dibenzyl-1,3-butadiene, s-cis- or s-trans-η ⁴ -2,4- Hexadiene, s-cis- or s-trans-η ⁴ -1,3-pentadiene, s-cis- or s-trans-η ⁴ -1,4-ditolyl-1,3-butadiene, s-cis- or s -Trans-η ⁴ -1,4-bis (trimethylsilyl) -1,3-butadiene and the like. Specific examples of the anionic ligand include alkoxy groups such as methoxy, tert-butoxy and phenoxy, carboxylate groups such as acetate and benzoate, and sulfonate groups such as mesylate and tosylate. Specific examples of neutral ligands that can be coordinated by a lone pair include organophosphorus compounds such as trimethylphosphine, triethylphosphine, triphenylphosphine, diphenylmethylphosphine, tetrahydrofuran, diethyl ether, dioxane, 1,2- And ethers such as dimethoxyethane. j is an integer of 1 to 4, and when j is 2 or more, Qs may be the same or different from each other.

<Example of metallocene compound-10>
Moreover, as a metallocene compound, the metallocene compound represented by the following general formula (12) can also be used.

In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ are hydrogen or a hydrocarbon group Selected from silicon-containing groups, which may be the same or different, and adjacent substituents from R ¹ to R ¹⁴ may be bonded to each other to form a ring, and M represents Ti, Zr
Or Hf, Y is a Group 14 atom, Q can be coordinated by halogen, hydrocarbon group, neutral having 10 or less carbon atoms, conjugated or non-conjugated diene, anionic ligand, and lone pair of electrons Selected from the group consisting of neutral ligands in the same or different combinations, n is an integer of 2 to 4, and j is an integer of 1 to 4.

  In the general formula (12), the hydrocarbon group is preferably an alkyl group having 1 to 20 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or 7 to 20 carbon atoms. And may contain one or more ring structures.

Specific examples thereof include methyl, ethyl, n-propyl, isopropyl, 2-methylpropyl, 1,1-dimethylpropyl, 2,2-dimethylpropyl, 1,1-diethylpropyl, 1-ethyl-1-
Methylpropyl, 1,1,2,2-tetramethylpropyl, sec-butyl, tert-butyl, 1,1-dimethylbutyl, 1,1,3-trimethylbutyl, neopentyl, cyclohexylmethyl, cyclohexyl, 1-methyl- 1-cyclohexyl, 1-adamantyl, 2-adamantyl, 2-methyl-2-adamantyl, menthyl, norbornyl, benzyl, 2-phenylethyl, 1-tetrahydronaphthyl, 1-methyl-1-tetrahydronaphthyl, phenyl, naphthyl, tolyl Etc.

  In the general formula (12), the silicon-containing hydrocarbon group is preferably an alkyl or arylsilyl group having 1 to 4 silicon atoms and 3 to 20 carbon atoms. Specific examples thereof include trimethylsilyl and tert-butyldimethyl. Examples thereof include silyl and triphenylsilyl.

In the present invention, R ¹ to R ^{14 in} the general formula (12) are selected from hydrogen, a hydrocarbon group, and a silicon-containing hydrocarbon group, and may be the same or different. Specific examples of preferred hydrocarbon groups and silicon-containing hydrocarbon groups include the same as those described above.

The adjacent substituents from R ¹ to R ¹⁴ on the cyclopentadienyl ring of the general formula (12) may be bonded to each other to form a ring.
M in the general formula (12) is a group 4 element of the periodic table, that is, zirconium, titanium or hafnium, preferably zirconium.

Y is a Group 14 atom, preferably a carbon atom or a silicon atom. n is an integer of 2 to 4, preferably 2 or 3, particularly preferably 2.
Q is the same or different combination from the group consisting of halogen, hydrocarbon group, neutral having 10 or less carbon atoms, conjugated or non-conjugated diene, anionic ligand and neutral ligand capable of coordinating with a lone pair. To be elected. When Q is a hydrocarbon group, it is more preferably a hydrocarbon group having 1 to 10 carbon atoms.

Specific examples of the halogen are fluorine, chlorine, bromine and iodine, and specific examples of the hydrocarbon group are methyl, ethyl, n-propyl, isopropyl, 2-methylpropyl, 1,1-dimethylpropyl, 2, 2-dimethylpropyl, 1,1-diethylpropyl, 1-ethyl-1-methylpropyl, 1,1,2,2-tetramethylpropyl, sec-butyl, tert-butyl, 1,1-dimethylbutyl, 1, Examples include 1,3-trimethylbutyl, neopentyl, cyclohexylmethyl, cyclohexyl, 1-methyl-1-cyclohexyl and the like. Neutral having 10 or less carbon atoms, and specific examples of the conjugated or non-conjugated dienes, s- cis - or s- trans eta ^{4-1,3-butadiene,} s- cis - or s- trans eta ⁴ - 1,4-diphenyl-1,3-butadiene, s-cis- or s-trans-η ⁴ -3-methyl-1,3-pentadiene, s-cis- or s-trans-η ⁴ -1,4- Dibenzyl-1,3-butadiene, s-cis- or s-trans-η ⁴ -2,4-hexadiene, s-cis- or s-trans-η ⁴ -1,3-pentadiene, s-cis- or s -Trans-η ⁴ -1,4-ditolyl-1,3-butadiene, s-cis- or s-trans-η ⁴ -1,4-bis (trimethylsilyl) -1,3-butadiene and the like. Specific examples of the anionic ligand include alkoxy groups such as methoxy, tert-butoxy and phenoxy, carboxylate groups such as acetate and benzoate, and sulfonate groups such as mesylate and tosylate. Specific examples of the neutral ligand that can coordinate with a lone electron pair include organic phosphorus compounds such as trimethylphosphine, triethylphosphine, triphenylphosphine, and diphenylmethylphosphine, or tetrahydrofuran, diethyl ether, dioxane, 1,2- And ethers such as dimethoxyethane. When j is an integer greater than or equal to 2, several Q may be the same or different.

In the formula (12), there are a plurality of Ys of 2 to 4, but the Ys may be the same as or different from each other. The plurality of R ¹³ and the plurality of R ¹⁴ bonded to Y may be the same as or different from each other. For example, a plurality of R ¹³ bonded to the same Y may be different from each other, or a plurality of R ¹³ bonded to different Y may be the same as each other. R ¹³ or R ¹⁴ may form a ring.

  Preferable examples of the Group 4 transition metal compound represented by the formula (12) include a compound represented by the following formula (13).

In formula (13), R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² are hydrogen atoms, hydrocarbon groups, silicon R ¹³ , R ¹⁴ , R ¹⁵ , and R ¹⁶ are each a hydrogen atom or a hydrocarbon group, n is an integer of 1 to 3, and n = 1 In some cases, R ¹ to R ¹⁶ are not hydrogen atoms and may be the same or different. Adjacent substituents from R ⁵ to R ¹² may combine with each other to form a ring, and R
¹³ and R ¹⁵ may be bonded to each other to form a ring, and R ¹³ and R ¹⁵ may be bonded to each other to form a ring, and at the same time, R ¹⁴ and R ¹⁶ may be bonded to each other to form a ring. , Y ¹ and Y ² are group 14 atoms which may be the same or different from each other, M is Ti, Zr or Hf, Q is a halogen, a hydrocarbon group, an anionic ligand or a lone pair of electrons You may choose from the neutral ligand which can be coordinated by the same or different combination, and j is an integer of 1-4.
Examples of such metallocene compounds such as Examples-9 and 10 are listed in JP-A No. 2004-175707, WO2001 / 027124, WO2004 / 029062, WO2004 / 083265, and the like.

The metallocene compounds described above are used alone or in combination of two or more. The metallocene compound may be diluted with a hydrocarbon or a halogenated hydrocarbon.
The catalyst component comprises (A) the bridged metallocene compound represented above, and (B) (b-1) an organoaluminum oxy compound, (b-2) reacts with the bridged metallocene compound (A) to form an ion pair. And at least one compound selected from (b-3) organoaluminum compounds.

Hereinafter, the component (B) will be specifically described.
<(B-1) Organoaluminum oxy compound>
As the (b-1) organoaluminum oxy compound used in the present invention, a conventionally known aluminoxane can be used as it is. Specifically, the following general formula (14)

  And / or general formula (15)

(Wherein R represents a hydrocarbon group having 1 to 10 carbon atoms, and n represents an integer of 2 or more). In particular, R is a methylaluminoxane in which methyl is a methyl group, and n is 3 More preferably, 10 or more are used. These aluminoxanes may be mixed with some organoaluminum compounds. A characteristic property in the high temperature solution polymerization of the present invention is that a benzene-insoluble organoaluminum oxy compound as exemplified in JP-A-2-78687 can also be applied. Further, organoaluminum oxy compounds described in JP-A-2-167305, aluminoxanes having two or more kinds of alkyl groups described in JP-A-2-24701, JP-A-3-103407, and the like It can be suitably used. The “benzene-insoluble” organoaluminum oxy compound used in the high-temperature solution polymerization of the present invention means that the Al component dissolved in benzene at 60 ° C. is usually 10% or less, preferably 5% or less, particularly preferably 5% or less. Is 2% or less, and is insoluble or hardly soluble in benzene.

  Examples of the organoaluminum oxy compound used in the present invention include modified methylaluminoxane as shown in the following (16).

(Here, R represents a hydrocarbon group having 1 to 10 carbon atoms, and m and n represent an integer of 2 or more.)
This modified methylaluminoxane is prepared using trimethylaluminum and an alkylaluminum other than trimethylaluminum. Such a compound [V] is generally called MMAO. Such MMAO can be prepared by the methods listed in US4960878 and US5041584. In addition, Tosoh Finechem Co., Ltd., etc., which are prepared using trimethylaluminum and triisobutylaluminum and whose R is an isobutyl group, are commercially produced under the names MMAO and TMAO. Such MMAO is an aluminoxane having improved solubility in various solvents and storage stability, and specifically, it is different from those insoluble or hardly soluble in benzene such as the above (14) and (15). It is soluble in aliphatic hydrocarbons and alicyclic hydrocarbons.

Further, the organoaluminum oxy compound used in the present invention includes the following general formula (1
An organoaluminum oxy compound containing boron represented by 7) can also be mentioned.

(In the formula, R ^c represents a hydrocarbon group having 1 to 10 carbon atoms. R ^d may be the same or different and each represents a hydrogen atom, a halogen atom or a hydrocarbon having 1 to 10 carbon atoms. Group.)
<(B-2) Compound that reacts with bridged metallocene compound (A) to form an ion pair>
Examples of the compound (b-2) that reacts with the bridged metallocene compound (A) to form an ion pair (hereinafter sometimes abbreviated as “ionic compound”) include JP-A-1-501950, Lewis acids and ionic properties described in 1-502036, JP-A-3-17905, JP-A-3-179006, JP-A-3-207703, JP-A-3-207704, USP5321106, etc. Examples thereof include compounds, borane compounds and carborane compounds. Furthermore, heteropoly compounds and isopoly compounds can also be mentioned.

  In the present invention, the ionic compound preferably employed is a compound represented by the following general formula (18).

In the formula, R ^{e +} includes H ⁺ , carbenium cation, oxonium cation, ammonium cation, phosphonium cation, cycloheptyltrienyl cation, ferrocenium cation having a transition metal, and the like. R ^{f to} R ⁱ may be the same as or different from each other, and are organic groups, preferably aryl groups.

  Specific examples of the carbenium cation include trisubstituted carbenium cations such as triphenylcarbenium cation, tris (methylphenyl) carbenium cation, and tris (dimethylphenyl) carbenium cation.

  Specific examples of the ammonium cation include trialkylammonium cations such as trimethylammonium cation, triethylammonium cation, tri (n-propyl) ammonium cation, triisopropylammonium cation, tri (n-butyl) ammonium cation, and triisobutylammonium cation. N, N-dimethylanilinium cation, N, N-diethylanilinium cation, N, N-2,4,6-pentamethylanilinium cation, N, N-dialkylanilinium cation, diisopropylammonium cation, dicyclohexyl And dialkyl ammonium cations such as ammonium cations.

  Specific examples of the phosphonium cation include triarylphosphonium cations such as triphenylphosphonium cation, tris (methylphenyl) phosphonium cation, and tris (dimethylphenyl) phosphonium cation.

Of these, Re ^{e +} is preferably a carbenium cation, an ammonium cation or the like, and particularly preferably a triphenylcarbenium cation, an N, N-dimethylanilinium cation or an N, N-diethylanilinium cation.

Specific examples of the carbenium salt include triphenylcarbenium tetraphenylborate, triphenylcarbeniumtetrakis (pentafluorophenyl) borate, triphenylcarbeniumtetrakis (3,5-ditrifluoromethylphenyl) borate, tris (4-methyl And phenyl) carbenium tetrakis (pentafluorophenyl) borate and tris (3,5-dimethylphenyl) carbenium tetrakis (pentafluorophenyl) borate.
Examples of ammonium salts include trialkyl-substituted ammonium salts, N, N-dialkylanilinium salts, dialkylammonium salts, and the like.

Specific examples of the trialkyl-substituted ammonium salt include triethylammonium tetraphenylborate, tripropylammonium tetraphenylborate, tri (n-
Butyl) ammonium tetraphenylborate, trimethylammonium tetrakis (p-tolyl) borate, trimethylammonium tetrakis (o-tolyl) borate, tri (n-butyl) ammonium tetrakis (pentafluorophenyl) borate, triethylammonium tetrakis (pentafluorophenyl) Borate, tripropylammonium tetrakis (
Pentafluorophenyl) borate, tripropylammonium tetrakis (2,4-dimethylphenyl) borate, tri (n-butyl) ammonium tetrakis (3,5-dimethylphenyl) borate, tri (n-butyl) ammonium tetrakis (4-tri Fluoromethylphenyl) borate, tri (n-butyl) ammonium tetrakis (3,5-ditrifluoromethylphenyl) borate, tri (n-butyl) ammonium tetrakis (o-tolyl) borate, dioctadecylmethylammonium tetraphenylborate, di Octadecylmethylammonium tetrakis (p-tolyl) borate, dioctadecylmethylammonium tetrakis (o-tolyl) borate, dioctadecylmethylammonium tetrakis (pentafluorophenyl) borate, dioctadecylmethylammonium tetrakis (2,4-dimethyl) Tilphenyl) borate, dioctadecylmethylammonium tetrakis (3,5-dimethylphenyl) borate, dioctadecylmethylammonium tetrakis (4-trifluoromethylphenyl) borate, dioctadecylmethylammonium tetrakis (3,5-ditrifluoromethylphenyl) borate And dioctadecylmethylammonium.

Specific examples of N, N-dialkylanilinium salts include N, N-dimethylanilinium tetraphenylborate, N, N-dimethylanilinium tetrakis (pentafluorophenyl) borate, N, N-dimethylanilinium tetrakis ( 3,5-ditrifluoromethylphenyl) borate, N, N-diethylanilinium tetraphenylborate, N, N-diethylanilinium tetrakis (pentafluorophenyl) borate, N, N-diethylanilinium tetrakis (3,5- Ditrifluoromethylphenyl) borate, N, N-2,4,6-pentamethylanilinium tetraphenylborate, N, N-2,4,6-pentamethylanilinium tetrakis (pentafluorophenyl) borate, etc. .

  Specific examples of the dialkylammonium salt include di (1-propyl) ammonium tetrakis (pentafluorophenyl) borate and dicyclohexylammonium tetraphenylborate.

In addition, ionic compounds disclosed by the present applicant (Japanese Patent Laid-Open No. 2004-51676) can also be used without limitation.
The ionic compound (b-2) as described above can be used as a mixture of two or more.

<(B-3) Organoaluminum compound>
Examples of the organoaluminum compound that forms the olefin polymerization catalyst (b-3) include, for example, an organoaluminum compound represented by the following general formula [X], a group 1 metal represented by the following general formula (19), and aluminum. Examples thereof include complex alkylated products.
R ^a _m Al (OR ^b ) _n H _p X _q ------ (19)
(In the formula, R ^a and R ^b may be the same or different from each other, each represents a hydrocarbon group having 1 to 15 carbon atoms, preferably 1 to 4 carbon atoms, X represents a halogen atom, and m represents 0. <M ≦ 3, n is 0 ≦ n <3, p is a number of 0 ≦ p <3, q is a number of 0 ≦ q <3, and m + n + p + q = 3). Specific examples of such compounds include tri-n-alkylaluminums such as trimethylaluminum, triethylaluminum, tri-n-butylaluminum, trihexylaluminum, trioctylaluminum; triisopropylaluminum, triisobutylaluminum, trisec-butylaluminum, Tri-tert-butylaluminum,
Tri-branched alkylaluminums such as tri-2-methylbutylaluminum, tri-3-methylhexylaluminum, tri-2-ethylhexylaluminum; tricycloalkylaluminums such as tricyclohexylaluminum and tricyclooctylaluminum; triphenylaluminum, tritolylaluminum, etc. triaryl aluminum; diisopropyl aluminum hydride, dialkylaluminum hydride such as diisobutylaluminum hydride; formula _{(iC 4 H 9) x Al} y (C 5 H 10) z ( wherein, x, y, z are positive numbers Yes, z ≦ 2x.)
Alkenyl aluminum alkoxide such as isobutylaluminum methoxide and isobutylaluminum ethoxide; Dialkylaluminum alkoxide such as dimethylaluminum methoxide, diethylaluminum ethoxide and dibutylaluminum butoxide; Alkyl aluminum sesquialkoxides such as ethoxide and butylaluminum sesquibutoxide; partially alkoxylated alkylaluminums having an average composition represented by the general formula R ^a _2.5 Al (OR ^b ) _{0.5 and the} like; diethylaluminum phenoxide and diethylaluminum Alkyl aluminum aryloxides such as (2,6-di-t-butyl-4-methylphenoxide); dimethylal Dialkylaluminum halides such as nium chloride, diethylaluminum chloride, dibutylaluminum chloride, diethylaluminum bromide, diisobutylaluminum chloride; alkylaluminum sesquichlorides such as ethylaluminum sesquichloride, butylaluminum sesquichloride, ethylaluminum sesquibromide; Partially halogenated alkylaluminums such as alkylaluminum dihalides; dialkylaluminum hydrides such as diethylaluminum hydride and dibutylaluminum hydride; alkylaluminum dihydrides such as ethylaluminum dihydride and propylaluminum dihydride and other partially Hydrogenated alk Aluminum; ethylaluminum ethoxy chloride, butyl aluminum butoxide cycloalkyl chloride, etc. partially alkoxylated and halogenated alkylaluminum such as ethylaluminum ethoxy bromide and the like.
M ² AlR ^a ₄ ----------- (20)
(In the formula, M ² represents Li, Na or K, and R ^a represents a hydrocarbon group having 1 to 15 carbon atoms, preferably 1 to 4 carbon atoms.)
A complex alkylated product of a group 1 metal and aluminum in the periodic table represented by: Examples of such a compound include LiAl (C ₂ H ₅ ) ₄ and LiAl (C ₇ H ₁₅ ) ₄ .

A compound similar to the compound represented by the general formula (20) can also be used, and examples thereof include an organoaluminum compound in which two or more aluminum compounds are bonded through a nitrogen atom. Specifically, as such a compound, (C ₂ H ₅ ) ₂ AlN (C ₂ H ₅ ) Al (C ₂ H ₅ ) ₂
And so on.
From the viewpoint of availability, trimethylaluminum and triisobutylaluminum are preferably used as the (b-3) organoaluminum compound.

<Polymerization>
The polyethylene wax used in the present invention can be obtained by homopolymerizing ethylene in a normal liquid phase or copolymerizing ethylene and an α-olefin in the presence of the metallocene catalyst. In the polymerization, the method of using each component and the order of addition are arbitrarily selected, and the following methods are exemplified.

[q1] A method of adding the component (A) alone to the polymerization vessel.
[q2] A method of adding the component (A) and the component (B) to the polymerization vessel in an arbitrary order.
In the method [q2], at least two or more of the catalyst components may be in contact with each other in advance. At this time, a hydrocarbon solvent is generally used, but an α-olefin may be used as a solvent. The monomers used here are as described above.

  Polymerization methods include suspension polymerization in which polyethylene wax is polymerized in the presence of particles in a solvent such as hexane, gas phase polymerization in which no solvent is used, and polymerization wax at a polymerization temperature of 100 ° C. or higher. Solution polymerization that polymerizes in the coexistence or melted state is possible, and among these, solution polymerization is preferable in terms of both economy and quality.

The polymerization reaction may be performed by either a batch method or a continuous method. When the polymerization is carried out by a batch method, the above catalyst components are used in the concentrations described below.
When the olefin polymerization is carried out using the olefin polymerization catalyst as described above, the component (A) is usually 10 ⁻⁹ to 10 ⁻¹ mol, preferably 10 ⁻⁸ to 10 ⁻² mol per liter of reaction volume. It is used in such an amount that it becomes a mole.

Component (b-1) has a molar ratio [(b-1) / M] of component (b-1) to all transition metal atoms (M) in component (A) of usually 0.01 to 5, 000, preferably 0.05 to 2,000. In the component (b-2), the molar ratio [(b-2) / M] of the ionic compound in the component (b-2) and the total transition metal (M) in the component (A) is usually 0. 0.01 to 5,000, preferably 1 to 2,000. The component (b-3) has a molar ratio [(b-3) / M] of the component (b-3) and the transition metal atom (M) in the component (A) of usually 1-1.
The amount used is 0000, preferably 1 to 5000.

In the polymerization reaction, the temperature is usually 10 g of wax set on a filter, -20 to + 200 ° C., preferably 50 to 180 ° C., more preferably 70 to 170 ° C., and the pressure usually exceeds 0. It is performed under conditions of 8 MPa (80 kgf / cm ² , gauge pressure) or less, preferably more than 0 and 4.9 MPa (50 kgf / cm ² , gauge pressure) or less.

  In the polymerization, ethylene and the α-olefin used as needed are supplied to the polymerization system in such a proportion that the polyethylene wax having the specific composition described above can be obtained. In the polymerization, a molecular weight regulator such as hydrogen can be added.

When polymerized in this manner, the produced polymer is usually obtained as a polymerization solution containing the polymer, so that polyethylene wax can be obtained by processing in a conventional manner.
In the present invention, it is particularly preferable to use a catalyst containing the metallocene compound shown in <Example 1 of metallocene compound>.

When such a catalyst is used, a polyethylene wax having the above-described characteristics can be easily obtained.
The shape of the polyethylene wax of the present invention is not particularly limited, but is usually powder-like, pellet-like, or tablet-like particles.

[Other ingredients]
In the present invention, in addition to the polyethylene and the polyethylene wax, additives such as antioxidants, UV absorbers, light stabilizers, metal soaps, fillers, flame retardants, and the like are further used as necessary. May be used in addition to.

Examples of the stabilizer include antioxidants such as hindered phenol compounds, phosphite compounds, and thioether compounds;
UV absorbers such as benzotriazole compounds and benzophenone compounds;
Examples thereof include light stabilizers such as hindered amine compounds.

Examples of the metal soap include stearates such as magnesium stearate, calcium stearate, barium stearate, and zinc stearate.
Examples of the filler include calcium carbonate, titanium oxide, barium sulfate, talc, clay, and carbon black.

  Examples of the flame retardant include halogenated diphenyl ethers such as degabrom diphenyl ether and octabromodiphenyl ether, halogen compounds such as halogenated polycarbonates; antimony trioxide, antimony tetraoxide, antimony pentoxide, sodium pyroantimonate, aluminum hydroxide, etc. Inorganic compounds; phosphorus compounds and the like.

Moreover, a compound such as tetrafluoroethylene can be added as a flame retardant aid for preventing drip.
Examples of the antibacterial and antifungal agents include organic compounds such as imidazole compounds, thiazole compounds, nitrile compounds, haloalkyl compounds, and pyridine compounds;
Examples include inorganic substances such as silver, silver compounds, zinc compounds, copper compounds, and titanium compounds, and inorganic compounds.
Among these compounds, thermally stable silver and silver-based compounds are preferable.

As said silver type compound, silver salts, such as a silver complex, a fatty acid, and phosphoric acid, can be mentioned.
When silver and silver-based compounds are used as antibacterial and antifungal agents, these substances can be used in porous structures such as zeolite, silica gel, zirconium phosphate, calcium phosphate, hydrotalcite, hydroxyapatite, and calcium silicate. In some cases, it is used while being supported.
Examples of other additives include colorants, plasticizers, anti-aging agents, colorants, plasticizers, and oils.

[Raw material composition ratio]
The composition ratio of polyethylene and polyethylene wax used as a raw material of the present invention is not particularly limited as long as the properties of the obtained film are not impaired, but is usually 0.01 to 10 parts by weight with respect to 100 parts by weight of polyethylene. The range is preferably 0.1 to 5 parts by weight.

When polyethylene and polyethylene wax are used at a composition ratio in the above range, the effect of improving the fluidity at the time of stretch molding is great, and the molding speed is further improved and the productivity tends to be improved. Furthermore, the optical properties such as transparency inherent in polyethylene tend not to be impaired, and mechanical properties such as impact resistance tend not to be impaired. In addition, as compared with the case where stretch molding is performed without adding polyethylene wax, molding can be performed at a lower molding temperature, and the cooling time may be shortened. Furthermore, by lowering the molding temperature, it is possible not only to suppress the thermal deterioration of the resin and the resin strength, but also to suppress the scorching and black spots of the resin.

[Extension molding]
In the method for producing a film of the present invention, the raw material is stretch-molded.
There is no particular limitation on the stretch molding method. Examples of the stretch molding method include a uniaxial stretching method and a biaxial stretching method. Examples of the biaxial stretching method include a tenter method and a tube method.

  In the case of the tenter method, usually, a mixture containing the polyethylene of the present invention and polyethylene wax is melt-kneaded by an extruder and extruded from a T die, and the obtained melt-kneaded product is cooled and solidified on a casting drum, and then slowly. Introduced between the (front) drive roll and the speed (rear) drive roll, stretched to a predetermined magnification in the longitudinal direction, and then put the film stretched in the longitudinal direction into a tenter, holding both lateral ends A stretched film can be produced by further stretching in the transverse direction while heating. At that time, heat treatment may be performed for the purpose of fixing the molecular orientation of the film in the tenter. The means for obtaining an unstretched film is usually based on a T-die molding method, but an unstretched film may be obtained by other known methods.

  In the case of the tube method, usually, a mixture containing the polyethylene of the present invention and polyethylene wax is melt-kneaded with an extruder, the molten polymer is extruded from a ring die into a tube shape, rapidly cooled in a cooling tank, and then the tube shape. By heating the thing, introducing air into the inside and pressurizing, or reducing the outside of the tube, stretching in the transverse direction, applying tension in the longitudinal direction and stretching in the longitudinal direction, A stretched film can be produced.

  In the case of the uniaxial method, an unstretched film obtained by T-die molding or inflation molding is usually cooled and then introduced between a slow (front) driving roll and a fast (rear) driving roll. And a stretched film can be manufactured by extending | stretching to a predetermined magnification in the vertical direction. Furthermore, heat treatment may be further performed for the purpose of fixing the molecular orientation of the film.

  When producing by the tenter method using an extruder equipped with a T die, the temperature on the inlet side of the extruder is usually in the temperature range of 130 to 200 ° C, and the temperature on the outlet side of the extruder is 200 to 280 ° C. It is obtained by setting the temperature range and the die temperature in a temperature range of 200 to 260 ° C., extruding from a T-die so that the resin temperature is in the range of 200 to 260 ° C., and stretching to a desired aspect ratio.

  When manufacturing by a tube method, the temperature on the inlet side of the extruder is usually in a temperature range of 120 to 180 ° C, the temperature on the outlet side of the extruder is in a temperature range of 140 to 220 ° C, and the temperature of the die is 140 to 210 ° C. It is set by a temperature range of ° C., and is obtained by extruding from a ring die and stretching so as to have a desired aspect ratio so that the resin temperature is in a range of 140 to 210 ° C.

  When uniaxially stretching an unstretched film obtained by T-die molding, the temperature on the inlet side of the extruder is usually in the temperature range of 130 to 200 ° C, and the temperature on the outlet side of the extruder is in the temperature range of 200 to 280 ° C. The temperature of the die is set in a temperature range of 200 to 260 ° C., and is extruded from a T die so that the resin temperature is in a range of 200 to 260 ° C. and stretched to have a desired longitudinal magnification.

  When uniaxially stretching an unstretched film obtained by inflation molding, the temperature on the inlet side of the extruder is usually in a temperature range of 120 to 180 ° C, the temperature on the outlet side of the extruder is in a temperature range of 140 to 220 ° C, It is obtained by setting the die temperature in a temperature range of 140 to 210 ° C., extruding from a ring die so that the resin temperature is in a range of 140 to 210 ° C., and stretching to a desired longitudinal magnification.

  In the present invention, a film is obtained by the stretch molding described above. The film may be a single layer film or a multilayer film. A single layer film is obtained by the above-mentioned stretch molding. The multilayer film is obtained, for example, by melt-kneading the resin composition forming each layer of the film with separate extruders, pressing the melt-kneaded product into a die for co-extrusion, and further melting and kneading these through the slits of the die. It can manufacture by extruding a thing simultaneously and extending | stretching by the uniaxial stretching method mentioned above and the biaxial stretching method.

  In the multilayer film obtained by the present invention, at least one layer is formed from a resin composition using the above-described polyethylene and polyethylene wax as raw materials, but other thermoplastic resin compositions are used for the other layers. May be formed. As the above-mentioned melt-kneading and extrusion conditions for the other thermoplastic resin compositions, the extrusion molding conditions usually used for the thermoplastic resin can be applied.

EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited at all by these Examples.
In the following examples, the physical properties of polyethylene and polyethylene wax were measured as follows.

(Number average molecular weight (Mn))
The number average molecular weight (Mn) is obtained from GPC measurement. The measurement was performed under the following conditions. The number average molecular weight (Mn) was determined by preparing a calibration curve using commercially available monodisperse standard polystyrene and calculating the molecular weight based on the following conversion method.
Apparatus: Gel permeation chromatograph Alliance GPC2000 (manufactured by Waters)
Solvent: o-dichlorobenzene column: TSKgel column (manufactured by Tosoh Corporation) x 4
Flow rate: 1.0 ml / min Sample: 0.15 mg / mL o-dichlorobenzene solution temperature: 140 ° C.
Molecular weight conversion: PE conversion / general-purpose calibration method For the calculation of general-purpose calibration, the coefficient of the Mark-Houwink viscosity equation shown below was used.
Coefficient of polystyrene (PS): KPS = 1.38 × 10 ⁻⁴ , aPS = 0.70
Coefficient of polyethylene (PE): KPE = 0.06 × 10 ⁻⁴ , aPE = 0.70

(A value, B value)
From the GPC measurement results described above, the proportion of components having a molecular weight of 1,000 or less was determined by weight%, and was designated as A value. Further, from the measurement result of GPC, the ratio of the component having a molecular weight of 20,000 or more was determined by weight%, and the B value was obtained.

(Melt viscosity)
Measurements were made at 140 ° C. using a Brookfield viscometer.
(density)
It was measured according to the density gradient method of JIS K7112.

(Melting point)
It measured using the differential scanning calorimeter (DSC) [DSC-20 (made by Seiko Denshi Kogyo Co., Ltd.)]. First, the measurement sample was once heated to 200 ° C. and held for 5 minutes, and then immediately cooled to room temperature. About 10 mg of this sample was subjected to DSC measurement in the temperature range from −20 ° C. to 200 ° C. under the temperature rising rate of 10 ° C./min. The endothermic peak value of the curve obtained from the measurement results was taken as the melting point.

(Crystallization temperature)
The crystallization temperature (Tc, ° C.) is 2 ° C. in accordance with ASTM D 3417-75.
/ Min.

(Synthesis of polyethylene wax (1))
Polyethylene wax (1) was synthesized using a metallocene catalyst as follows.
770 ml of hexane and 115 g of propylene were charged into a 2 L stainless steel autoclave sufficiently purged with nitrogen and kept at 25 ° C. Subsequently, after raising the temperature in the system to 150 ° C., 0.3 mmol of triisobutylaluminum, 0.04 mmol of dimethylanilinium tetrakis (pentafluorophenyl) borate, and bis (cyclopentadienyl) zirconium dichloride were added. Polymerization was initiated by press-fitting with 0.0005 mmol ethylene. Thereafter, by continuously supplying only ethylene, the total pressure was kept at 3.0 MPa (gauge pressure), and polymerization was carried out at 155 ° C. for 30 minutes.

After stopping the polymerization by adding a small amount of ethanol into the system, unreacted ethylene was purged. The obtained polymer solution was dried overnight at 100 ° C. under reduced pressure to obtain 46 g of polyethylene wax (1). The obtained polyethylene wax (1) has a number average molecular weight (Mn) of 800, a weight average molecular weight (Mw) of 1,500, a melt viscosity of 40 mPa · s, a density of 897 kg / m ³ , and a melting point of 78. It was 8 ° C. Moreover, A value was 31.7 weight% and B value was 0.01 weight%. The results are shown in Table 1.

(Synthesis of polyethylene wax (2))
Polyethylene wax (2) was synthesized as follows using a metallocene catalyst.
A stainless steel autoclave with an internal volume of 2 L, sufficiently purged with nitrogen and kept at 25 ° C., was charged with 930 ml of hexane and 35 g of propylene. Subsequently, after raising the temperature in the system to 150 ° C., 0.3 mmol of triisobutylaluminum, 0.04 mmol of dimethylanilinium tetrakis (pentafluorophenyl) borate, and bis (cyclopentadienyl) zirconium dichloride were added. Polymerization was initiated by press-fitting with 0.0005 mmol ethylene. Thereafter, by continuously supplying only ethylene, the total pressure was kept at 3.0 MPa (gauge pressure), and polymerization was carried out at 155 ° C. for 30 minutes.

After stopping the polymerization by adding a small amount of ethanol into the system, unreacted ethylene was purged. The obtained polymer solution was dried overnight at 100 ° C. under reduced pressure to obtain 40 g of polyethylene wax (2). The obtained polyethylene wax (2) has a number average molecular weight (Mn) of 1,300, a weight average molecular weight (Mw) of 3,300, a melt viscosity of 90 mPa · s, a density of 948 kg / m ³ and a melting point of It was 115.4 ° C. Moreover, A value was 19.8 weight% and B value was 0.3 weight%. The results are shown in Table 1.
The physical properties of the wax used in the present invention are summarized in Table 1.

In the following examples, film physical properties were measured as follows.
(transparency)
According to JIS K7105, the haze of the film formed into the same film thickness was measured.

(Extensible)
Using a film stretching machine (BIX-703, manufactured by Iwamoto Seisakusho Co., Ltd.), the maximum stress when uniaxially stretching the film was evaluated.

(Mechanical properties)
The mechanical properties were evaluated by impact resistance.
[Shock resistance]
Impact resistance was evaluated by film impact strength. The film impact strength was determined as follows.

  A film sample surface molded with the same film thickness mounted on the testing machine at a temperature condition of 23 ° C., with a hemispherical hammer with a tip diameter of 1.0 inch and a capacity of 3.0 J attached to a film impact tester manufactured by Toyo Seiki Seisakusho. The hemispherical hammer was punched at a right angle, and the energy required for breaking was measured. The value obtained by dividing the energy required for this breakage by the thickness of the film was taken as the film impact strength.

[Example 1]
Linear low-density polyethylene resin (Evolue SP2040; manufactured by Prime Polymer Co., Ltd., density = 918 (kg / m ³ ), MI = 3.8 g / 10 min) 100 parts by mass, metallocene polyethylene wax (Excellex 30200BT; Manufactured by Mitsui Chemicals, Inc., density: 913 (kg / m ³ ), Mn = 2,000, A value = 9.3 (% by weight), B value = 2.
2 (wt%), melt viscosity = 300 (mPa · s)) 2 parts by mass were mixed. Next, the cylinder temperature of a 20 mmφ single-screw extruder (manufactured by Tanaka Iron Works Co., Ltd.) with a T-die having a width of 240 mm was set to 190 ° C. and the die temperature was set to 200 ° C., and the resulting mixture was added to the extruder. It was melt-kneaded at a rotational speed of 67 rpm to obtain an unstretched film having a thickness of 100 μm from the T die. Furthermore, the obtained unstretched film was introduced into the film stretching machine (BIX-703 type, manufactured by Iwamoto Seisakusho Co., Ltd.), preheated at 100 ° C. × 2 min, a stretching speed of 10 mm / sec, and a stretching ratio of 3 times. The film was uniaxially stretched under conditions to produce a uniaxially stretched film. The resulting film was 30 μm thick. The maximum stress during stretching was 0.78 MPa, the film impact strength was 47.4 KJ / m, and the haze was 1.08%. The results are shown in Table 2.

[Example 2]
Polyethylene wax is a metallocene polyethylene wax (Excellex 48070BT; manufactured by Mitsui Chemicals, Inc., density = 902 (kg / m ³ ), Mn = 3,400, A value =
Stretch molding was performed in the same manner as in Example 1 except that 4.7 (% by weight), B value = 8.7 (% by weight), and melt viscosity = 1,350 (mPa · s). The results are shown in Table 2.

Example 3
Polyethylene wax is a metallocene polyethylene wax (Excellex 40800T; manufactured by Mitsui Chemicals, Inc., density = 980 (kg / m ³ ), Mn = 2,400, A value = 7.
. 4 (% by weight), B value = 4.5 (% by weight), and melt viscosity = 600 (mPa · s)). The results are shown in Table 2.

Example 4
Polyethylene wax (1) (density = 897 (kg / m ³ )),
Mn = 800, A value = 23.5 (wt%), B value = 0.01 (wt%), melt viscosity = 40
Except for changing to (mPa · s)), stretch molding was performed in the same manner as in Example 1. The results are shown in Table 2.

Example 5
Polyethylene wax (2) (density = 948 (kg / m ³ )),
Mn = 1,300, A value = 19.8 (wt%), B value = 0.3 (wt%), melt viscosity = 90 (mPa · s)) Then, stretch molding was performed. The results are shown in Table 2.

Example 6
Stretch molding was performed in the same manner as in Example 1 except that the amount of metallocene polyethylene wax (Excellex 30200BT; manufactured by Mitsui Chemicals, Inc.) was changed to 1 part by mass. The results are shown in Table 2.

Example 7
Stretch molding was performed in the same manner as in Example 1 except that the amount of metallocene polyethylene wax (Excellex 30200BT; manufactured by Mitsui Chemicals, Inc.) was changed to 5 parts by mass. The results are shown in Table 2.

[Comparative Example 1]
Linear low-density polyethylene resin (Evolu SP2040; Co., Ltd.) with a cylinder temperature of 190 ° C. and a die temperature of 200 ° C. of a 20 mmφ single-screw extruder (manufactured by Tanaka Iron Works Co., Ltd.) installed with a T die having a width of 240 mm ) (Manufactured by Prime Polymer Co., Ltd.) was added to the extruder and melt-kneaded at a rotational speed of 67 rpm to obtain an unstretched film having a thickness of 100 μm from the T die. Furthermore, the obtained unstretched film was introduced into the film stretching machine (BIX-703 type, manufactured by Iwamoto Seisakusho Co., Ltd.), preheated at 100 ° C. × 2 min, a stretching speed of 10 mm / sec, and a stretching ratio of 3 times. The film was uniaxially stretched under conditions to produce a uniaxially stretched film. The resulting film was 30 μm thick. The maximum stress during stretching was 0.88 MPa, the film impact strength was 47.1 KJ / m, and the haze was 1.22%. The results are shown in Table 2.

[Comparative Example 2]
Polyethylene wax is polyethylene wax (High Wax 420P; manufactured by Mitsui Chemicals, density = 930 (kg / m ³ ), Mn = 2,000, A value = 8.3 (% by weight), B value = 6
. 2 (% by weight), melt viscosity = 700 (mPa · s)) Except for the change, stretch molding was performed in the same manner as in Example 1. When compared with the stretched film of polyethylene alone in Comparative Example 1, the maximum stretching stress is decreased, and the productivity at the time of molding tends to be improved, but the film impact strength, that is, the impact resistance is decreased, Mechanical properties are impaired. Moreover, the haze is also increased and the optical properties are also impaired. The results are shown in Table 2.

[Comparative Example 3]
Polyethylene wax is polyethylene wax (A-C6; manufactured by Honeywell, density = 913 (kg / m ³ ), Mn = 1,800, A value = 6.5 (wt%), B value = 3.3 (wt%) ), Melt viscosity = 420 (mPa · s)) Except for the change, stretch molding was performed in the same manner as in Example 1. The results are shown in Table 2. When compared with the stretched film of polyethylene alone in Comparative Example 1, the maximum stretching stress is decreased, and the productivity at the time of molding tends to be improved, but the film impact strength, that is, the impact resistance is decreased, Mechanical properties are impaired. Moreover, the haze is also increased and the optical properties are also impaired. The results are shown in Table 2.

Claims (2)

The density measured according to the density gradient tube method of JIS K7112 is in the range of 900 (kg / m ³ ) or more and less than 940 (kg / m ³ ), and measured according to JIS K7210 at 190 ° C. and a test load of 21.18 N. Polyethylene with MI in the range of 0.01-100 g / 10 min and density measured in accordance with the density gradient tube method of JIS K7112 in the range of 890-980 (kg / m ³ ), gel permeation chromatography (GPC) The film is obtained by stretch-molding a mixture containing a polyethylene wax having a polyethylene-equivalent number average molecular weight (Mn) in the range of 500 to 4,000 and satisfying the relationship represented by the following formula (I). How to manufacture.
B ≦ 0.0075 × K (I)
(In the above formula (I), B is a content ratio (% by weight) of a component having a polyethylene conversion molecular weight of 20,000 or more in the polyethylene wax when measured by gel permeation chromatography, and K Is the melt viscosity (mPa · s) of the polyethylene wax at 140 ° C.) The method for producing a film by stretch molding according to claim 1, wherein the polyethylene wax further satisfies a relationship represented by the following formula (II).
A ≦ 230 × K ^(-0.537) (II)
(In the above formula (II), A is a content ratio (% by weight) of a component in which the molecular weight in terms of polyethylene in the polyethylene wax is 1,000 or less when measured by gel permeation chromatography, and K Is the melt viscosity (mPa · s) of the polyethylene wax at 140 ° C.)