JP5040538B2 - 電子部品の温度制御装置、電子部品の温度制御方法及びｉｃハンドラ - Google Patents

電子部品の温度制御装置、電子部品の温度制御方法及びｉｃハンドラ Download PDF

Info

Publication number
JP5040538B2
JP5040538B2 JP2007230657A JP2007230657A JP5040538B2 JP 5040538 B2 JP5040538 B2 JP 5040538B2 JP 2007230657 A JP2007230657 A JP 2007230657A JP 2007230657 A JP2007230657 A JP 2007230657A JP 5040538 B2 JP5040538 B2 JP 5040538B2
Authority
JP
Japan
Prior art keywords
electronic component
temperature
evaporator
heat conducting
conducting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007230657A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009063380A (ja
JP2009063380A5 (https=
Inventor
敏 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2007230657A priority Critical patent/JP5040538B2/ja
Publication of JP2009063380A publication Critical patent/JP2009063380A/ja
Publication of JP2009063380A5 publication Critical patent/JP2009063380A5/ja
Application granted granted Critical
Publication of JP5040538B2 publication Critical patent/JP5040538B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
JP2007230657A 2007-09-05 2007-09-05 電子部品の温度制御装置、電子部品の温度制御方法及びｉｃハンドラ Expired - Fee Related JP5040538B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007230657A JP5040538B2 (ja) 2007-09-05 2007-09-05 電子部品の温度制御装置、電子部品の温度制御方法及びｉｃハンドラ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007230657A JP5040538B2 (ja) 2007-09-05 2007-09-05 電子部品の温度制御装置、電子部品の温度制御方法及びｉｃハンドラ

Publications (3)

Publication Number Publication Date
JP2009063380A JP2009063380A (ja) 2009-03-26
JP2009063380A5 JP2009063380A5 (https=) 2010-10-21
JP5040538B2 true JP5040538B2 (ja) 2012-10-03

Family

ID=40558083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007230657A Expired - Fee Related JP5040538B2 (ja) 2007-09-05 2007-09-05 電子部品の温度制御装置、電子部品の温度制御方法及びｉｃハンドラ

Country Status (1)

Country Link
JP (1) JP5040538B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160064964A (ko) * 2014-11-28 2016-06-08 (주)테크윙 전자부품 테스트용 핸들러

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5175350B2 (ja) 2008-07-29 2013-04-03 アルプス電気株式会社 磁気検知装置
KR102058008B1 (ko) 2013-12-03 2019-12-20 해피재팬, 인크. 전자 디바이스의 핸들러
JP6507592B2 (ja) * 2014-11-27 2019-05-08 セイコーエプソン株式会社 電子部品搬送装置、電子部品検査装置および電子部品押圧装置
JP2016102684A (ja) * 2014-11-27 2016-06-02 セイコーエプソン株式会社 電子部品搬送装置、電子部品検査装置および電子部品押圧装置
JP6313452B2 (ja) * 2015-04-20 2018-04-18 エスゼット ディージェイアイ テクノロジー カンパニー リミテッドＳｚ Ｄｊｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ センサ動作を熱的に調節するシステム、方法および無人航空機
MY191597A (en) * 2017-11-27 2022-06-30 Mi Equipment M Sdn Bhd Stencil concept and inspection
CN115235282B (zh) * 2022-09-22 2022-12-02 四川恩巨实业有限公司 一种老化系统及其控制方法
TWI856845B (zh) * 2023-10-19 2024-09-21 鴻勁精密股份有限公司 具有溫度傳導裝置的壓接機構以及應用該壓接機構的測試分類設備

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0337875U (https=) * 1989-08-23 1991-04-12
JP3595150B2 (ja) * 1998-02-12 2004-12-02 株式会社小松製作所 温度制御装置および温度制御方法
JP3129417B2 (ja) * 1999-03-11 2001-01-29 三菱重工業株式会社 加熱冷却装置及び電気特性評価装置
JP2002043381A (ja) * 2000-07-19 2002-02-08 Tokyo Electron Ltd ウエハ温度制御装置
JP2005026296A (ja) * 2003-06-30 2005-01-27 Kowa Dennetsu Keiki:Kk ホットプレ−トユニット
JP4569343B2 (ja) * 2005-03-28 2010-10-27 ヤマハ株式会社 Ｉｃ搬送装置及びコンタクタ
JP4645373B2 (ja) * 2005-09-07 2011-03-09 セイコーエプソン株式会社 電子部品の温度制御装置並びにハンドラ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160064964A (ko) * 2014-11-28 2016-06-08 (주)테크윙 전자부품 테스트용 핸들러
KR102433967B1 (ko) 2014-11-28 2022-08-22 (주)테크윙 전자부품 테스트용 핸들러

Also Published As

Publication number Publication date
JP2009063380A (ja) 2009-03-26

Similar Documents

Publication Publication Date Title
JP5040538B2 (ja) 電子部品の温度制御装置、電子部品の温度制御方法及びｉｃハンドラ
KR100813139B1 (ko) 전자 부품의 온도 제어 장치 및 핸들러 장치
US6866094B2 (en) Temperature-controlled chuck with recovery of circulating temperature control fluid
JP2009250810A (ja) 電子部品の温度制御装置およびハンドラ装置
JP2009063380A5 (https=)
JP4645373B2 (ja) 電子部品の温度制御装置並びにハンドラ装置
JP5569563B2 (ja) 電子部品の検査装置
JP5109639B2 (ja) 電子部品の検査装置
JP2012185184A (ja) 電子部品の温度制御装置並びにハンドラ装置
JP5561320B2 (ja) 電子部品の検査装置
US10591366B2 (en) Temperature calibration system with separable cooling assembly
JP5004686B2 (ja) プローバおよびプローバのウエハチャック温度制御方法
EP3441709A1 (en) Temperature calibration system with a closed fluidic system
JP2008190895A (ja) 電子部品検査装置
JP5071531B2 (ja) 電子部品の温度制御装置並びにハンドラ装置
JP2009103550A (ja) 電子部品の温度制御装置及びｉｃハンドラ
CN111190448B (zh) 用于控制被测设备温度的控温系统及方法
JP4978653B2 (ja) 電子部品の温度制御装置並びにハンドラ装置
CN106645287B (zh) 中空玻璃结露检测装置
JP2012208132A (ja) 電子部品の温度制御装置並びにハンドラ装置
TW202603375A (zh) 半導體測試設備
WO2009157038A1 (ja) 電子部品検査装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100906

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100906

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120315

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120321

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120518

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120612

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120625

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150720

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees