JP5035156B2 - Electronic device adapter and board mounting structure using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve measurement reliability by improving connection accuracy between a probe and a terminal, concerning an adapter for an electronic element for measuring a waveform by using the probe, and a substrate mounting structure using the adapter. <P>SOLUTION: This adapter 30A for the electronic element mounted to a substrate 25, and mounted to the electronic element 20 wherein the probe 40 is connected to a terminal 23 during measurement has an adapter body 31 having an element mounting part 32 for mounting the electronic element 20, a connection hole 34 formed at the adapter body 31 for connecting the probe 40 to the terminal 23, and a locking projection 35A for locking the adapter body 31 to the substrate 25 by being locked with the substrate 25. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to an electronic device adapter and a board mounting structure using the same, and more particularly to an electronic device adapter in which waveform measurement is performed using a probe and a board mounting structure using the same.

  For example, in a semiconductor device that supports high-frequency signals, an AC coupling capacitor is provided in order to remove DC component noise. Further, when performing waveform measurement on a semiconductor device provided with an AC coupling capacitor, the waveform measurement is performed via the AC coupling capacitor.

  As a method of measuring the waveform of a high-speed signal via the AC coupling capacitor, for example, a method of directly contacting a needle (probe) as disclosed in Patent Document 1 with an AC coupling capacitor, and AC This is a measurement method using an extremely short copper wire soldered to an electrode of a coupling capacitor. Each measuring method will be described with reference to FIGS.

  FIG. 1 shows a method of measuring a waveform by directly contacting an AC coupling capacitor 1 using a probe needle 10. FIG. 1A is a diagram showing a state in which waveform measurement is performed, and FIG. 1B is a plan view of the mounting state of the AC coupling capacitor 1 on the substrate 5.

  The AC coupling capacitor 1 has metal terminals 3 formed at both ends thereof. An electrode 6 is formed on the substrate 5 on which the AC coupling capacitor 1 is mounted, corresponding to the position where the metal terminal 3 is formed. The AC coupling capacitor 1 is mounted on the substrate 5 by soldering the metal terminal 3 to the electrode 6 with the solder 8.

  The AC coupling capacitor 1 has a length of about 1 mm in the longitudinal direction and a length of about 0.5 mm in the short direction, for example. The AC coupling capacitor 1 is connected to a high-frequency semiconductor device (not shown).

  In the waveform measurement using the probe needle 10, as shown in FIG. 1A, the probe needle 10 disposed in the probe main body 11 is brought into contact with the solder 8 soldered to the metal terminal 3 and the substrate 5. The method of measuring the waveform was taken.

On the other hand, FIG. 2 shows a method of performing waveform measurement using the copper wire 12. In this method, during waveform measurement, the solder 8 that joins the metal terminal 3 and the electrode 6 is melted, and the copper wire 12 is joined to the solder 8. And the probe main body 11 of the probe main body 11 was connected to the copper wire 12 extended from this solder 8, and the waveform measurement was performed by this.
JP 2001-053231 A

  However, in the method of measuring a waveform using the probe needle 10 shown in FIG. 1, various elements other than the AC coupling capacitor 1 are mounted on the substrate 5 on the substrate 5. There is a problem that it is difficult to bring the probe needle 10 into contact with the solder 8 accurately by increasing the density.

  Further, as described above, the shape of the AC coupling capacitor 1 is small, so that the area where the solder 8 is disposed is also narrow. For this reason, since the area (measurement point) with which the probe needle 10 is brought into contact is narrow and the probe main body 11 is not fixed, the probe needle 10 is detached from the solder 8 during measurement, and proper waveform measurement cannot be performed. There is also a point.

On the other hand, in the method for performing waveform measured by using the copper wire 12, a small order AC coupling copper wire 12 for the capacitor 1 are joined by solder 8, when an external force is applied to the copper wire 12, the There is a problem that the solder 8 is peeled off from the electrode 6 due to the stress, and the AC coupling capacitor 1 is detached from the substrate 5. Further, when the copper wire 12 becomes long, impedance changes occur, and there is a problem that the measurement waveform changes due to the influence of the copper wire 12.

  The present invention has been made in view of the above points, and provides an adapter for an electronic device that improves measurement reliability by increasing the connection accuracy between a probe and a terminal, and a board mounting structure using the same. With the goal.

From the first aspect of the present invention, the above-described problem is an electronic element adapter that is mounted on a substrate and is mounted on an electronic element that is connected to a terminal portion at the time of measurement. An adapter body having an element mounting portion, a connection hole formed in the adapter body for connecting the probe to the terminal portion, and locking the adapter body to the substrate by engaging with the substrate possess a locking unit for the connecting hole, the probe can be solved by an electronic device adapter that is configured to function as a guide that is connected to the terminal portion.

In addition, from the second aspect of the present invention, the above-described problem is that an electronic element to which a probe is connected to a terminal portion during measurement is attached to an electronic element adapter, and the electronic element is mounted on the substrate using the electronic element adapter. A board mounting structure using an electronic element adapter to be mounted on the adapter, wherein the electronic element adapter has an element main body having an element mounting portion on which the electronic element is mounted, and the probe is connected to the terminal portion. A connection hole formed in the adapter main body so as to function as a guide for connecting the probe to the terminal portion and a protrusion protruding from the adapter main body are provided, and the substrate is engaged with the protrusion. An engagement portion and an electrode connected to the terminal portion are provided, and the projection portion engages with the engagement portion, whereby the terminal portion is connected to the electrode, and the electronic element It can be solved by a substrate mounting structure using an adapter for an electronic device wherein the electronic element is mounted on the substrate via an adapter.

  According to the present invention, since the electronic element is locked to the substrate via the electronic element adapter, the electronic element can be prevented from being displaced with respect to the substrate, and the probe can be accurately connected to the terminal. .

  Next, the best mode for carrying out the present invention will be described with reference to the drawings.

  3 to 5 are views for explaining an electronic element adapter 30A according to the first embodiment of the present invention and a board mounting structure using the same. In the present embodiment, an example in which an AC coupling capacitor 20 is used as an electronic element mounted on the electronic element adapter 30A will be described.

  FIG. 3 shows a state in which the electronic element adapter 30A is mounted on the substrate 25. FIG. 4 is a bottom view of the electronic element adapter 30A. Further, FIG. 5 is a diagram for explaining a method of measuring a waveform using the probe needle 40 via the AC coupling capacitor 20.

  First, the electronic element adapter 30A will be described mainly with reference to FIGS. The electronic element adapter 30A is formed of, for example, a resin such as epoxy, and roughly includes an adapter body 31, a probe guide 33, a locking protrusion 35A, and the like.

  The adapter main body 31 has a function of mounting the AC coupling capacitor 20 therein. The adapter body 31 has a shape corresponding to the shape of the electronic element to be mounted. In the present embodiment, since the AC coupling capacitor 20 is mounted as an electronic element, the adapter main body 31 has a rectangular shape corresponding to the shape of the AC coupling capacitor 20.

  The adapter main body 31 has a concave element mounting portion 32 formed therein, and has a bottomed shape with an open bottom surface (the lower side in FIG. 3 and the upper side in FIG. 4). The AC coupling capacitor 20 is mounted in the element mounting portion 32 through this opening. At this time, the method of fixing the AC coupling capacitor 20 to the adapter main body 31 may be fixed using an adhesive, fixed by press-fitting, or another fixing method.

  On the bottom surface side of the adapter main body 31, a locking projection 35A (corresponding to a locking portion described in claims) protrudes outward. In this embodiment, the locking protrusions 35A are formed so as to protrude from the substantially central position on both side surfaces of the adapter body 31 on the long side (detailed in FIG. 4). However, the formation position of the locking projection 35A is not limited to the position of the present embodiment, and it may be formed on the side surface of the adapter body 31 on the short side, and the number of formation is three or more. Also good.

  On the other hand, a probe guide 33 is provided on the surface side of the adapter main body 31 (the upper side in FIG. 3 and the lower side in FIG. 4). A connection hole 34 is formed inside the probe guide 33. The connection hole 34 is configured to pass through the adapter main body 31 through the surface-side wall and communicate with the element mounting portion 32 (see FIG. 5). ). Further, the shape of the connection hole 34 corresponds to the shape of the probe needle 40, and in this embodiment, it is a conical shape. As will be described later, when the waveform measurement is performed, the probe needle 40 is mounted in the connection hole 34.

  Next, the AC coupling capacitor 20 mounted on the electronic device adapter 30A having the above-described configuration will be described. The AC coupling capacitor 20 is provided to remove a DC component (DC block) of a high-frequency circuit (for example, a semiconductor device) (not shown), and has a configuration in which metal terminals 23 are formed on both sides of the main body 22. Has been.

  The metal terminal 23 protrudes from the bottom surface of the main body 22 and has a protrusion amount lower than the height of the locking protrusion 35A. In this embodiment, as shown in FIG. 4, a protruding electrode 24 is formed on the metal terminal 23. The protruding electrode 24 may be formed integrally with the metal terminal 23, or may be formed of sand or other conductive metal.

  Next, the substrate 25 on which the electronic device adapter 30A (AC coupling capacitor 20) having the above-described configuration is mounted will be described. The substrate 25 is a printed wiring board, and in addition to the AC coupling capacitor 20, a semiconductor device and various electronic components (not shown) are mounted with high density. In the present embodiment, a printed circuit board is taken as an example, but the present invention can be applied to other substrates (for example, a ceramic substrate, a flexible substrate, etc.).

  The substrate 25 has a configuration in which an electrode 26 and a concave portion 27 are provided in a mounting region (a region indicated by a one-dot chain line in FIG. 3) of the electronic element adapter 30A. The electrode 26 is formed by patterning copper, for example, and is formed at a position corresponding to the metal terminal 23 of the AC coupling capacitor 20. In FIG. 3, the electrode 26 is shown as a single unit, but in actuality, the electrode 26 is connected to a wiring pattern (not shown).

  Moreover, the recessed part 27 is formed in the position corresponding to the latching protrusion 35A formed in the adapter 30A for electronic elements. The depth of the recess 27 is set slightly larger than the protrusion amount of the locking protrusion 35A. The planar shape of the recess 27 is such that the locking projection 35A can be locked when the locking projection 35A is inserted. Specifically, the planar shape of the recess 27 is the same as or slightly smaller than the cross-sectional shape of the locking projection 35A.

  Next, a procedure for mounting the electronic element adapter 30A on the substrate 25 will be described.

  In order to mount the electronic device adapter 30A on the substrate 25, as shown in FIGS. 3 and 5A, the locking projection 35A and the recess 27 are positioned. Next, the electronic element adapter 30 </ b> A is moved downward toward the substrate 25, and the locking protrusion 35 </ b> A is inserted into the recess 27. As a result, the locking protrusion 35A is fitted into the recess 27, and the electronic element adapter 30A is locked to the substrate 25.

  FIG. 5B shows a state in which the electronic element adapter 30 </ b> A is mounted on the substrate 25. In this mounted state, the protruding electrode 24 formed on each metal terminal 23 of the AC coupling capacitor 20 is in contact with the electrode 26 and is electrically connected. In the present embodiment, the metal terminal 23 and the electrode 26 are not soldered, and the protruding electrode 24 comes into contact with the electrode 26 to achieve electrical connection. As described above, in the mounting structure according to the present embodiment, the metal terminal 23 and the electrode 26 are not soldered. However, since the locking protrusion 35A is locked to the recess 27, the metal terminal 23 and the electrode 26 are separated from each other. There is nothing like that, and connection reliability is maintained.

  Next, a method of performing waveform measurement via the AC coupling capacitor 20 mounted on the substrate 25 using the electronic element adapter 30A as described above will be described. In this embodiment, the probe needle 40 is used for waveform measurement. As described above, the probe guide 33 having the connection hole 34 is formed in the electronic element adapter 30A. Further, the connection hole 34 communicates with the element mounting portion 32, and this communication position corresponds to the position of the metal terminal 23 of the AC coupling capacitor 20 mounted on the element mounting portion 32.

  Therefore, when the probe needle 40 is inserted into the connection hole 34, the probe needle 40 is guided and advanced by the conical connection hole 34 formed corresponding to the shape. The tip of the probe needle 40 is configured to contact the metal terminal 23 when the probe needle 40 has advanced to a position where it engages with the connection hole 34. As a result, the probe needle 40 and the metal terminal 23 (AC coupling capacitor 20) are electrically connected, so that waveform measurement via the AC coupling capacitor 20 is possible.

  In the connection process of the probe needle 40 to the metal terminal 23 described above, the electronic element adapter 30A is locked to the substrate 25 by fitting the locking protrusion 35A to the recess 27, so that the probe needle 40 is connected. When inserted into the hole 34, the electronic element adapter 30 </ b> A (AC coupling capacitor 20) does not move relative to the substrate 25. Since the connection hole 34 corresponds to the shape of the probe needle 40, the probe needle 40 is inserted into the electronic element adapter 30A with the connection hole 34 as a guide. Therefore, the connection process between the probe needle 40 and the metal terminal 23 can be performed accurately and reliably.

  The formation position of the connection hole 34 is selected on the upper surface of the electronic element adapter 30A. Therefore, even if other electronic components are mounted at high density around the mounting region where the electronic element adapter 30 </ b> A of the protruding electrode 24 is mounted, these electronic components are connected to the probe needle 40 and the metal terminal 23. There will be no obstacle to the connection. Therefore, even when electronic components are mounted on the substrate 25 with high density, the waveform measurement via the AC coupling capacitor 20 can be reliably performed.

  Furthermore, since the copper wire 12 (see FIG. 2) used in the conventional waveform measurement is not required, the AC coupling capacitor 20 can be prevented from being detached from the substrate 25 and the waveform deformation caused by the copper wire 12 can be generated. Can be suppressed.

  Next, second to fourth embodiments of the present invention will be described with reference to FIGS. 6 to 8, the same reference numerals are given to the components corresponding to those shown in FIGS. 3 to 5, and the description thereof is omitted.

  FIG. 6 shows a mounting structure of an electronic element adapter 30A according to the second embodiment of the present invention. In the mounting structure of the electronic element adapter 30A according to the first embodiment described above, the protruding electrode 24 is formed on the AC coupling capacitor 20, and the protruding electrode 24 is brought into contact with the electrode 26 without being soldered. The AC coupling capacitor 20 and the substrate 25 are electrically connected.

  On the other hand, in this embodiment, a connection member 29 is disposed on the metal terminal 23 and the connection member 29 and the electrode 26 are joined by solder 36. The connection member 29 is a conductive metal such as copper, and is fixed to the metal terminal 23 by soldering or the like. As in the present embodiment, by fixing the connection member 29 to which the metal terminal 23 is fixed to the electrode 26 by soldering, the electronic element adapter 30A and the substrate 25 can be more reliably locked.

  FIG. 7 shows a mounting structure of an electronic device adapter 30B according to the third embodiment of the present invention. The adapter for electronic elements 30A used in the first embodiment described above was made of resin. On the other hand, the electronic device adapter 30B used in this embodiment is made of metal.

  Further, an insulating film 38 is formed on the element mounting portion 32 formed on the adapter body 31 of the electronic element adapter 30B to prevent the AC coupling capacitor 20 from being electrically connected to the electronic element adapter 30B. is doing. An insulating film 38 is also formed on the surface of the connection hole 34 to prevent the probe needle 40 from being electrically connected to the electronic element adapter 30B, and the probe needle 40 is electrically connected only to the metal terminal 23. Configured to connect.

  In the present embodiment, the locking protrusion 35B provided integrally with the electronic element adapter 30B is formed longer than the locking protrusion 35A formed in the first embodiment. Correspondingly, a through hole 45 is formed in the substrate 25. The planar shape of the through hole 45 is larger than the cross-sectional shape of the locking projection 35B. Therefore, the insertion process of the locking protrusion 35B into the through hole 45 can be easily performed.

  Further, the length of the locking projection 35B is such that when the locking projection 35B is inserted into the through-hole 45 and the electronic device adapter 30B is mounted on the substrate 25, the tip portion protrudes from the back surface of the substrate 25. Yes. And the protrusion part and the board | substrate 25 are joined using the solder 39 from the back surface of the board | substrate 25 of the latching protrusion 35B. On the back surface of the substrate 25, lands (not shown) are formed around the through holes 45, and the locking projections 35B are soldered to the lands.

  In this way, the locking protrusion 35B is soldered to the substrate 25 using the solder 39, so that the electronic element adapter 30B can be reliably locked to the substrate 25. Further, by connecting the land formed on the substrate 25 to which the locking protrusion 35B is soldered to the ground, the electronic element adapter 30B can have a shielding effect. In this configuration, it is possible to prevent disturbance from entering through the AC coupling capacitor 20.

  FIG. 8 shows a mounting structure of an electronic device adapter 30C according to the fourth embodiment of the present invention. In the configuration formed in the first embodiment, the probe needle 40 is inserted into the connection hole 34 to be connected to the metal terminal 23 of the AC coupling capacitor 20.

  On the other hand, in this embodiment, the probe pin 44 is erected on the metal terminal 23 of the AC coupling capacitor 20 in advance, and the socket 43 provided in place of the probe needle 40 is attached thereto. is there. The socket 43 is configured to engage with and electrically connect to the probe pin 44.

  Further, since the outer shape of the socket 43 is cylindrical, a socket guide hole 37 corresponding to the shape of the socket 43 is formed in the probe guide 33. Then, in a state where the socket 43 is inserted and mounted in the socket guide hole 37, the probe pin 44 and the probe main body 41 are connected, and waveform measurement is possible.

  In this way, it is possible to use another connection structure in place of the probe needle 40 in waveform measurement. In this case, the electronic element adapter 30C is locked to the substrate 25 and its movement is restricted. The socket 43 and the probe pin 44 can be reliably connected.

  FIG. 9 shows an electronic device adapter 30D according to a fifth embodiment of the present invention. In the example shown in FIG. 8, the probe pin 44 is provided on the metal terminal 23, but in this embodiment, the probe pin 44 is configured to be fixed to the bottom 33 a of the probe socket 33.

Probe pins 44 This is a state where the AC coupling capacitor 20 is mounted on the adapter 30D for electronic devices, and is electrically connected structure for a metal terminal 23 of the AC coupling capacitor 20. With this configuration, it is possible to perform waveform measurement using the socket 43 without standing the probe pin 44 on the AC coupling capacitor 20.

  10 and 11 show an electronic element adapter 30E according to a sixth embodiment of the present invention and a mounting structure using the same. In each of the above-described embodiments, the AC coupling capacitor 20 is mounted on the electronic element adapters 30A to 30D, and the bottom surface of the AC coupling capacitor 20 is exposed from the electronic element adapters 30A to 30D. .

  On the other hand, in the electronic device adapter 30E according to the present embodiment, the AC coupling capacitor 20 is attached to the electronic device adapter 30E, and then the opening of the electronic device adapter 30E is closed by the cover 50. It is a thing. A through hole is formed at a position corresponding to the protruding electrode 24 of the lid 50, and the tip of the protruding electrode 24 is configured to protrude from the surface of the lid 50. Therefore, even if the electronic device adapter 30 </ b> E is provided with the lid 50, the protruding electrode 24 can be electrically connected to the electrode 26.

  By providing the lid portion 50 in this manner, the locking projection 35C can be formed at a position directly below the AC coupling capacitor 20. As a result, the number of concave portions 27 formed on the substrate 25 can be reduced, and the mounting area can be increased. Further, when the shape of the locking projection 35C is a cylindrical shape, the concave portion 27 (or the through hole 45) can be formed by drilling, and the concave portion 27 (or the through hole 45) can be easily formed. Become.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments described above, and various modifications can be made within the scope of the present invention described in the claims. It can be modified and changed.

  For example, in each of the embodiments described above, a configuration in which an AC coupling capacitor is attached to the element element adapter is shown. However, the electronic element to be attached to the element element adapter is not limited to the AC coupling capacitor. The present invention can be widely applied to other electronic elements.

  Further, the structure in which the electronic element is fixed in the electric element adapter or the electronic element can be attached to and detached from the electric element adapter.

The following additional notes are further disclosed with respect to the embodiment including the above examples.
(Appendix 1)
An electronic element adapter that is mounted on a substrate and attached to an electronic element that is connected to a terminal part at the time of measurement,
An adapter body having an element mounting portion on which the electronic element is mounted;
In order to connect the probe to the terminal portion, a connection hole formed in the adapter body,
An electronic device adapter having a locking portion for locking the adapter body to the substrate by engaging with the substrate.
(Appendix 2)
The electronic device adapter according to claim 1, wherein the locking portion is a protrusion protruding from the adapter body.
(Appendix 3)
The electronic element adapter according to appendix 1 or 2, wherein the connection hole is configured to function as a guide for connecting the probe to a terminal portion.
(Appendix 4)
The adapter for electronic elements according to appendix 1 or 2, wherein the adapter body and the locking part are made of metal, and an insulating film is formed on the inner surface of the element mounting part and the connection hole.
(Appendix 5)
A board mounting structure using an electronic element adapter in which an electronic element whose probe is connected to a terminal portion during measurement is attached to an electronic element adapter, and the electronic element is mounted on a substrate using the electronic element adapter. ,
An adapter body having an element mounting portion on which the electronic element is mounted on the electronic element adapter; a connection hole formed in the adapter body for connecting the probe to the terminal portion; and protruding from the adapter body Provided with a protruding portion,
Provided on the substrate is an engaging portion that engages with the protruding portion, and an electrode that is connected to the terminal portion,
Using the electronic element adapter in which the terminal part is connected to the electrode by engaging the protrusion with the engaging part, and the electronic element is mounted on the substrate via the electronic element adapter Board mounting structure.
(Appendix 6)
The board mounting structure using the adapter for electronic elements according to appendix 5, wherein the engaging portion is a concave portion.
(Appendix 7)
The board mounting structure using the adapter for electronic elements according to appendix 5, wherein the engaging portion is a through-hole through which the protruding portion passes.

FIG. 1 is a diagram for explaining a substrate mounting structure with an AC coupling capacitor as an example of the prior art (part 1). FIG. 2 is a diagram for explaining a substrate mounting structure through an AC coupling capacitor as an example of the prior art (part 2). FIG. 3 is a perspective view for explaining an electronic device adapter and a substrate mounting structure using the same according to the first embodiment of the present invention. FIG. 4 is a perspective view showing the back side of the electronic device adapter according to the first embodiment of the present invention. FIG. 5 is a cross-sectional view for explaining an electronic device adapter and a substrate mounting structure using the same according to the first embodiment of the present invention. FIG. 6 is a cross-sectional view for explaining an electronic device adapter according to a second embodiment of the present invention. FIG. 7 is a cross-sectional view for explaining an electronic device adapter according to a third embodiment of the present invention. FIG. 8 is a cross-sectional view for explaining an electronic device adapter according to a fourth embodiment of the present invention. FIG. 9 is a cross-sectional view for explaining an electronic device adapter according to a fifth embodiment of the present invention. FIG. 10 is a cross-sectional view for explaining an electronic device adapter according to a sixth embodiment of the present invention. FIG. 11 is a perspective view showing the back side of the electronic device adapter according to the sixth embodiment of the present invention.

Explanation of symbols

20 AC Coupling Capacitor 22 Main Body 23 Metal Terminal 24 Projected Electrode 25 Substrate 26 Electrode 27 Recessed Parts 30A-30E Adapter for Electronic Element 31 Adapter Main Body 32 Element Mounting Part 33 Probe Guide 34 Connection Holes 35A, 35B Locking Projections 36, 39 Solder 37 Socket guide hole 38 Insulating film 40 Probe needle 43 Socket 44 Probe pin 45 Through hole

Claims (3)

An electronic element adapter that is mounted on a substrate and attached to an electronic element that is connected to a terminal part at the time of measurement,
An adapter body having an element mounting portion on which the electronic element is mounted;
In order to connect the probe to the terminal portion, a connection hole formed in the adapter body,
Possess a locking portion for locking said adapter body to said substrate by said substrate engaging,
The connection hole is an adapter for an electronic element configured to function as a guide for connecting the probe to the terminal portion .   The electronic element adapter according to claim 1, wherein the locking portion is a protrusion protruding from the adapter body. A board mounting structure using an electronic element adapter in which an electronic element whose probe is connected to a terminal portion during measurement is attached to an electronic element adapter, and the electronic element is mounted on a substrate using the electronic element adapter. ,
An adapter main body having an element mounting portion on which the electronic element is mounted to the electronic element adapter, and the probe to connect to the terminal portion, so that the probe functions as a guide for connecting the probe to the terminal portion. Provided with a connection hole formed in the adapter body and a protrusion protruding from the adapter body,
Provided on the substrate is an engaging portion that engages with the protruding portion, and an electrode that is connected to the terminal portion,
Using the electronic element adapter in which the terminal part is connected to the electrode by engaging the protrusion with the engaging part, and the electronic element is mounted on the substrate via the electronic element adapter Board mounting structure.

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