JP2005100844A - Electronic part assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent moisture condensation on the substrate of an electronic part assembly without complicating a constitution or limiting the arrangement of an electronic part on the substrate. <P>SOLUTION: In the electronic part assembly 10 provided with the substrate 20 to which the electronic parts are assembled, a connector 30 which is assembled to the substrate 20 and constitutes the electric connection of an external device 60 and the electronic parts, an aperture 40a having nearly the same width as that of the substrate 20, and a case 40 which is formed with a guide groove 41 to guide both ends in the widthwise direction of the substrate 20 from the aperture 40a toward the depth and which houses the substrate 20, and a cover 50 which is formed with a connector aperture 50a and which is combined with the case 40 so as to occlude the aperture 40a while making the connector 30 exposed outside the case 40 via the connector aperture 50a, a stationary pin 31 is fixed to the connector 30, the stationary pin 31 is inserted through an assembling hole 20a formed at the substrate 20, the stationary pin 31 is soldered to the substrate 20, and thereby the connector 30 is assembled to the substrate 20. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component assembly in which a substrate on which an electronic component is assembled is housed in a case, and in particular, is combined with the case so as to close the opening of the case while exposing a connector disposed on the substrate. The present invention relates to an electronic component assembly including a cover.

  Conventionally, an electronic control device in an automobile or the like has been reduced in weight, and many circuits have been integrated in a high-density state.

  As the density of such circuits increases, there is a risk that a short circuit will occur between the wiring patterns on the substrate constituting the circuit. As one of the factors for short-circuiting the wiring pattern, for example, there is a short circuit due to migration.

  Here, the migration will be described. For example, as shown in FIG. 10, the conductors 71 and 72 connected to the land 75 a of the substrate 75 by the solder 73 are connected by the battery 74 in a state where moisture including an electrolyte due to a residue is interposed. When voltage is applied, an electrolysis reaction occurs. Then, the metal eluted from the anode-side conductor 71 is deposited in a dented state on the cathode-side conductor 72 (79). Such a phenomenon is called migration. When such a reaction proceeds, the insulation between the conductor 71 and the conductor 72 may be reduced.

  Therefore, as a means for preventing condensation that occurs on the surface of the substrate, which causes migration, for example, a technique described in Patent Document 1 described below is known.

In the electronic component assembly described in Patent Document 1, a dew condensation prevention plate is suspended from the inner ceiling surface of the case toward the upper surface of the substrate. The dew condensation prevention plate is configured to block a flow path of outside air blown to the electronic component. When the outside air hits the dew condensation prevention plate, dew condensation is generated on the dew condensation prevention plate by the water vapor contained in the outside air, so that the humidity of the outside air thereafter decreases. Therefore, even if the outside air once hitting the dew condensation prevention plate hits the substrate, it becomes difficult to form dew condensation on the substrate.
Japanese Patent Application Laid-Open No. 09-102679 (pages 2 to 3, see FIG. 1)

  By the way, normally, in the electronic component assembly, a connector is assembled to the board in order to electrically connect the external device and the electronic component. In order to expose the connector outside the case of the electronic component assembly, a structure in which an opening for the connector is provided in a cover assembled to the case is common.

  In many cases, a large number of capacitors for countermeasures against electric noise are arranged on the board in the vicinity of the connector. When this capacitor is a chip capacitor used in recent years, the distance between the electrodes is short, and migration is particularly likely to occur.

  For such a problem, the technique of the above-mentioned Patent Document 1 is not effective. In other words, when a large number of the above-mentioned chip capacitors that are vulnerable to condensation are arranged on the substrate, it is necessary to provide a condensation prevention plate so that all these chip capacitors are shielded from the outside air (so that the outside air is not directly exposed) The structure of the case becomes complicated, or the arrangement of the chip capacitors on the substrate is limited.

  Therefore, an object of the present invention is to prevent dew condensation on the substrate of the electronic component assembly without complicating the configuration or restricting the arrangement of the electronic component on the substrate.

  The technical means taken in the present invention to solve the above-mentioned problems are as described in claim 1, wherein a substrate on which an electronic component is assembled, and an external device and the electronic component assembled on the substrate. A connector that forms an electrical connection with the substrate, an opening having a width substantially the same as the width of the substrate, and a guide portion that guides both ends in the width direction of the substrate from the opening toward the back, An electronic component assembly including: a case for housing; a connector opening; a cover combined with the case so as to close the opening while exposing the connector to the outside of the case through the connector opening; A fixing pin is fixed to the connector, the fixing pin is inserted into an assembly hole formed in the substrate, and the fixing pin is soldered to the substrate, whereby the connector is connected to the substrate. In Is that where the structure is attached.

  Preferably, as described in claim 2, the fixing pin may be fixed to the connector by being press-fitted into a connecting hole provided in the connector.

  Preferably, as described in claim 3, a plurality of grooves extending in the axial direction may be formed on the surface of the fixing pin.

  According to the first aspect of the invention, first, in a state where the fixing pin is fixed to the connector, the fixing pin is inserted through the assembly hole formed in the substrate. That is, the connector on which the fixing pin is fixed is disposed on one surface of the substrate, and at the same time, the fixing pin is inserted through the assembly hole. Then, by passing solder from the other surface side of the substrate through the assembly hole from which the fixed pin protrudes, the fixed pin is soldered to the substrate, and the connector is assembled to the substrate.

  In other words, the procedure for assembling the connector to the board only requires soldering with the connector placed on the board, so that unnecessary stress is not applied to the connector and the board during assembly. ing.

  Therefore, the positional deviation between the connector and the board due to unnecessary stress during assembly of the connector and the board can be suppressed to a small level.

  In addition, after accommodating the board | substrate with which the connector was assembled | attached in the case, a cover is combined with a case so that an opening may be plugged up while exposing a connector from a connector opening. Since the misalignment is kept small, the size of the connector opening with respect to the connector can be designed tightly. That is, the gap between the connector opening and the connector can be reduced.

  As a result, the amount of outside air flowing into the case itself can be suppressed, and condensation on the substrate of the electronic component assembly can be prevented. That is, the electronic component assembly of the present invention does not prevent dew condensation on the premise that outside air enters the case as in the technique described in Patent Document 1 described above. That is, it is based on the idea of suppressing the inflow of outside air into the case itself. Therefore, it is not necessary to provide a dew condensation prevention plate in the case, the structure is simple, and the assembly position of the electronic component on the substrate is not limited.

  According to the invention of claim 2, the fixing pin is fixed to the connector by being press-fitted into the connecting hole provided in the connector. That is, the relative position between the fixed pin and the connector is uniquely determined by press-fitting the fixed pin into the connecting hole. Therefore, the positional deviation between the fixing pin and the connector can be suppressed small. As a result, the position shift between the connector and the substrate can be suppressed to a small level. As a result, as described above, the amount of outside air flowing into the case itself can be suppressed, and condensation on the substrate of the electronic component assembly can be prevented.

  According to the invention of claim 3, the bonding area between the fixing pin and the connector and between the fixing pin and the solder is increased, and the fixing strength between the fixing pin and the connector and between the fixing pin and the solder is increased.

  (First Embodiment) A first embodiment of the present invention will be described below with reference to FIGS.

  As shown in FIG. 6, an electronic component assembly 10 (electronic component assembly) according to the present invention includes a substrate 20 (substrate), a connector 30 (connector), a case 40 (case), and a cover 50 (cover). ).

  The substrate 20 is made of a glass epoxy resin and has a substantially rectangular shape as shown in FIG. The substrate 20 has an IC 21 (electronic component), a capacitor 22 (electronic component), a diode 23 (electronic component), a chip capacitor 24 (electronic component), etc., which are assembled by soldering on the surface (both sides). It is attached. The chip capacitor 24 is disposed in the vicinity of the connector 30 and is used as a measure against electric noise.

  The surface of the substrate 20 is provided with a conductor pattern (not shown) for electrically connecting the above electronic components. That is, an exposed conductor such as the lead 21a of the IC 21 or the conductor pattern exists on the surface of the substrate 20.

  As shown in FIGS. 1, 5, and 6, a connector 30 made of resin is assembled to the substrate 20. Details of the assembly structure of the connector 30 will be described later. The connector 30 has a lead pin 30a electrically connected to the electronic component on the substrate 20 via the conductor pattern (not shown), and further, an external device is connected by connecting a connector (not shown). 60 (shown in FIG. 6) is also electrically connected. That is, the connector 30 constitutes an electrical connection between the electronic component and the external device 60.

  The board 30 on which the connector 30 and the electronic components (IC 21, capacitor 22, diode 23, chip capacitor 24, etc.) are assembled is accommodated in a case 40 as shown in FIG.

  The case 40 is made of resin or metal and has a bag shape having an opening 40a (opening) (shown in FIG. 3) in one direction (the opposite direction to the y direction in the drawing). The opening 40a has substantially the same width (size in the x direction in the drawing) as the width of the substrate 20 (size in the x direction in the drawing).

  In the case 40, guide grooves 41 (guide portions) for guiding both ends in the width direction (the x direction in the drawing) of the substrate 20 from the opening 40a to the back (the vertical depth direction in FIG. 3 and the y direction in the drawing) are formed. Has been. That is, the two vertical walls 40b (shown in FIG. 3) erected on both sides in the width direction of the case 40 extend inward from the opening 40a (toward the direction away from the opening 40a). A pair of existing guide grooves 41 is formed. The substrate 20 is accommodated in the case 40 by being guided in the case 40 along the guide groove 41.

  The cover 50 is made of resin or metal. And as shown in FIG. 4, it is exhibiting the substantially rectangular shape, and it combines with the case 40 so that the opening 40a of the case 40 may be plugged up. The cover 50 includes a substantially rectangular connector opening 50a (connector opening). As shown in FIG. 6, when the cover 50 is combined with the case, the connector 30 is exposed to the outside of the case 40 through the connector opening 50a.

  A locking hole 40d is formed in the two horizontal walls 40c extending in the width direction of the case 40 slightly behind the opening 40a (position within the plate pressure range of the cover 50). That is, two locking holes 40d are formed in the upper horizontal wall 40c shown in FIG. 3 and two in the lower horizontal wall 40c shown in FIG. On the other hand, locking claws 50 c are formed on the two horizontal sides 50 b extending in the width direction of the cover 50. That is, the locking claw 50c is formed at two places on the upper horizontal side 50b shown in FIG. 4 and at two places on the lower horizontal side 50b shown in FIG. When the cover 50 and the case 40 are combined, the locking claw 50c is locked in the locking hole 40d.

  Here, the assembly procedure of the electronic component assembly 10 shown in FIG. 6 will be described. First, the connector 30 is assembled on the substrate 20. This assembly is performed by a fixing pin 31 (fixing pin) (shown in FIG. 7) and solder 32 (shown in FIG. 7). First, the fixing pin 31 is fixed to the connector 30 by being press-fitted into the connection hole 30 b (connection hole) provided in the connector 30. That is, a thick portion 30d is formed on the bottom wall 30c of the connector 30, and a connecting hole 30b is formed in the thick portion 30d. The diameter of the connection hole 30 b is set smaller than the diameter of the fixing pin 31. And the fixing pin 31 is press-fitted with respect to the connection hole 30b.

  On the other hand, an assembly hole 20a (shown in FIG. 7) is formed in the substrate 20. Then, with the fixing pin 31 fixed to the connector 30, the fixing pin 31 is inserted through the assembly hole 20a. That is, the connector 30 to which the fixing pin 31 is fixed is disposed on the upper surface 20b of the substrate 20 shown in FIG. 7, and the fixing pin 31 is inserted through the assembly hole 20a. The diameter of the assembly hole 20a is set larger than the diameter of the fixing pin 31. Then, the fixing pin 31 is soldered to the substrate 20 by passing the solder 32 through the assembly hole 20a from which the fixing pin 31 protrudes from the lower surface 20c side of the substrate 20 shown in FIG. That is, the fixed pin 31 fixed to the connector 30 is configured to be inserted through the assembly hole 20a, and the fixed pin 31 is soldered in the assembly hole 20a. With the above configuration, the connector 30 is assembled to the board 20. In this assembly, the lead pin 30a is also inserted into the connection hole 20d formed in the substrate 20 at the same time as the fixing pin 31 is inserted into the assembly hole 20a. The lead pins 30 a are also soldered to the substrate 20 with solder 32.

  Next, the electronic components (IC 21, capacitor 22, diode 23, chip capacitor 24, etc.) are assembled to the substrate 20 with solder 32. The assembly order of the connector 30 and the electronic component to the board 20 may be reversed.

  Then, the board 30 on which the connector 30 and the electronic components (IC 21, capacitor 22, diode 23, chip capacitor 24, etc.) are assembled is inserted into the case 40. In this case, the substrate 20 is guided along the guide groove 41 gradually in the back direction (in the y direction in the drawing) from the opening 40a with both ends in the width direction aligned with the position of the guide groove 41. 20 is accommodated in the case 40.

  Thereafter, the cover 50 is assembled in the opening 40 a of the case 40. In this case, the two locking claws 50c on the lower side of the cover 50 shown in FIG. 4 are locked with the two locking holes 40d on the lower side of the case 40 shown in FIG. Then, by pressing the two upper locking claws 50c shown in FIG. 4 or the entire cover 50 in the substantially y direction, the two upper locking claws 50c shown in FIG. Lock to the hole 40d.

  As described above, the procedure for assembling the connector 30 to the board 20 is only to solder the connector 30 on the board 20. That is, it is only necessary to insert the fixing pin 31 into the assembly hole 20a having a larger diameter and solder the fixing pin 31 to the substrate 20 in a state where the fixing pin 31 is fixed to the connector 30 in advance. Therefore, unnecessary stress is not applied to the connector 30 and the board 20 during assembly. Therefore, the positional deviation between the connector 30 and the board 20 due to unnecessary stress when the connector 30 and the board 20 are assembled can be suppressed to a small level.

  A comparison mode regarding this point will be described with reference to FIG. In the form of FIG. 8, the connector 80 is assembled to the board 81 by a tapping screw 82. That is, in this embodiment, the tapping screw 82 is inserted into the assembly hole 81c formed in the substrate 81 from the lower surface 81b side in FIG. Furthermore, the connector 80 is assembled to the substrate 81 by screwing the tapping screw 82 into the connection hole 80 a of the connector 80 and fixing the tapping screw 82 with the solder 84.

  However, in the comparative form shown in FIG. 8, the tapping screw 82 and the connector 80 are not fixed in advance, but are fixed when the connector 80 is assembled to the substrate 81. Further, since the tapping screw 82 is screwed into the connector 80 during assembly, stress is likely to be applied to the connector 80 or the substrate 81 during the screwing. Therefore, in the comparative form shown in FIG. 8, a positional deviation between the connector 80 and the board 81 is likely to occur due to unnecessary stress.

  In this regard, the electronic component assembly 10 of the present invention is less likely to be displaced between the connector 30 and the board 20 as described above, and is more suitable than the comparative embodiment.

  In the present embodiment (not the comparative embodiment), as described above, the connector 30 is exposed from the connector opening 50a after the board 20 to which the connector 30 is assembled is accommodated in the case 40. The cover 50 is combined with the case 40 so as to close the opening 40a. Here, in the electronic component assembly 10 of the present invention, since the positional deviation between the connector 30 and the board 20 is suppressed, the size of the connector opening 50a with respect to the connector 30 is designed to be tight (tight). be able to. That is, the gap between the connector opening 50a and the connector 30 can be reduced.

  As a result, even when the electronic component assembly 10 is placed in a high-temperature and high-humidity environment, for example, outside air (moisture is removed from the gap between the connector 30 and the connector opening 50a into the case 40. The inflow amount of the outside air) can be suppressed. Accordingly, it is possible to suppress the occurrence of dew condensation that occurs inside the case 40 and to effectively prevent the occurrence of migration. In other words, the electronic component assembly 10 of the present invention is based on the idea of suppressing the inflow of outside air into the case 40 itself, such as the IC 20, the capacitor 22, the diode 23, and the chip capacitor 24 on the substrate 20. The degree of freedom of the electronic component assembly position is not limited. Further, for example, when outside air flows into the case 40, a configuration for controlling the inflow direction (a configuration in which a wall is provided in the case 40) is not required, and the electronic component assembly 10 of the present invention is not necessary. Has a simple configuration.

  Moreover, in the electronic component assembly 10 of the present invention, the fixing pin 31 is fixed to the connector 30 by being press-fitted into the connecting hole 30b provided in the connector 30 as described above. That is, the relative position between the fixed pin 31 and the connector 30 is uniquely determined by press-fitting the fixed pin 31 into the connection hole 30b. Therefore, the positional deviation between the fixing pin 31 and the connector 30 can be suppressed to a small level. As a result, the position shift between the connector 30 and the substrate 20 can be suppressed small. As a result, as described above, the amount of outside air flowing into the case 40 itself can be suppressed, and condensation on the substrate 20 of the electronic component assembly 10 can be prevented.

  (Second Embodiment) The second embodiment will be described below with reference to FIG.

  In the present embodiment, the shape of the fixing pin 31 is different from that of the first embodiment. Since other configurations are common, description thereof is omitted.

  A plurality of grooves 31a extending in the axial direction (z direction in the drawing) are formed on the surface of the fixing pin 31 of the present embodiment. That is, the plurality of grooves 31 a are formed in the circumferential direction of the fixing pin 31 with a predetermined interval therebetween. In other words, the fixing pin 31 has a spline shape.

  According to the electronic component assembly 10 of the present exemplary embodiment, the fixing pin 31 bites into the connector 30 and the bonding area between the fixing pin 31 and the connector 30 and between the fixing pin 31 and the solder 32 increases. Therefore, the fixing strength between the fixing pin 31 and the connector 30 and between the fixing pin 31 and the solder 32 is increased. As a result, the fixing strength between the connector 30 and the substrate 20 is increased.

It is a top view of the board | substrate which comprises the electronic component assembly | attachment body of this invention (1st Embodiment). It is a top view of the case which comprises the electronic component assembly | attachment body of this invention (1st Embodiment). It is a front view of the case which comprises the electronic component assembly | attachment body of this invention (1st Embodiment). It is a front view of the cover which comprises the electronic component assembly | attachment body of this invention (1st Embodiment). It is a front view which shows the state in which the board | substrate which comprises the electronic component assembly | attachment body of this invention was accommodated in the case (1st Embodiment). It is a longitudinal cross-sectional view of the electronic component assembly of this invention (1st Embodiment). It is a longitudinal cross-sectional view which shows the detail of the assembly structure of the connector and board | substrate of the electronic component assembly body of this invention (1st Embodiment). It is a longitudinal cross-sectional view which shows the detail of the assembly | attachment structure of the connector of a comparison form, and a board | substrate. It is a longitudinal cross-sectional view which shows the detail of the assembly structure of the connector and board | substrate of the electronic component assembly | attachment body of this invention (2nd Embodiment). It is a figure for demonstrating migration.

Explanation of symbols

10. Electronic component assembly (electronic component assembly)
20 Substrate (Substrate)
20a Assembly hole (assembly hole)
21 IC (electronic parts)
22 Capacitors (electronic parts)
23 Diode (electronic component)
24 Chip capacitors (electronic components)
30 Connector (Connector)
30b Connection hole (connection hole)
31 Fixing pin (fixing pin)
31a Groove
40 cases
40a Opening (opening)
41 Guide groove (guide part)
50 Cover (Cover)
50a Connector opening (connector opening)

Claims (3)

A board on which electronic components are assembled;
A connector assembled to the substrate and constituting an electrical connection between an external device and the electronic component;
An opening having substantially the same width as the width of the substrate, a guide portion that guides both ends in the width direction of the substrate from the opening toward the back, and a case for housing the substrate;
A cover that is combined with the case so as to close the opening while the connector opening is provided and the connector is exposed to the outside of the case through the connector opening;
An electronic component assembly comprising
A fixing pin is fixed to the connector,
An electronic device characterized in that the connector is assembled to the board by inserting the fixing pin through an assembly hole formed in the board and soldering the fixing pin to the board. Parts assembly.   The electronic component assembly according to claim 1, wherein the fixing pin is fixed to the connector by being press-fitted into a connecting hole provided in the connector.   The electronic component assembly according to claim 1, wherein a plurality of axially extending grooves are formed on a surface of the fixing pin.

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