TWM647914U - Magnetic component - Google Patents
Magnetic component Download PDFInfo
- Publication number
- TWM647914U TWM647914U TW112207218U TW112207218U TWM647914U TW M647914 U TWM647914 U TW M647914U TW 112207218 U TW112207218 U TW 112207218U TW 112207218 U TW112207218 U TW 112207218U TW M647914 U TWM647914 U TW M647914U
- Authority
- TW
- Taiwan
- Prior art keywords
- base
- circuit board
- magnetic component
- winding
- conductive layer
- Prior art date
Links
- 238000004804 winding Methods 0.000 claims abstract description 67
- 238000003780 insertion Methods 0.000 claims abstract description 31
- 230000037431 insertion Effects 0.000 claims abstract description 31
- 239000004020 conductor Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 3
- 230000004308 accommodation Effects 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 9
- 230000009977 dual effect Effects 0.000 description 8
- 230000000149 penetrating effect Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Landscapes
- Coils Or Transformers For Communication (AREA)
- Hard Magnetic Materials (AREA)
- Soft Magnetic Materials (AREA)
- Liquid Crystal (AREA)
Abstract
Description
本案係關於一種電子元件,尤指一種磁性組件,組配設置於一電路板時同時貼附以及貫穿電路板,並提供額外的電連接點及結構支撐的同時通用於不同製程,進而降低人力成本並確保電性連接的穩定性。This case is about an electronic component, specifically a magnetic component, which when assembled on a circuit board is attached to and penetrates the circuit board, and provides additional electrical connection points and structural support while being universally applicable to different processes, thereby reducing labor costs. And ensure the stability of the electrical connection.
現行的電子元件主要透過雙列直插封裝(Dual in-line package, DIP)或表面安裝技術(Surface-mount technology, SMT)的方式安裝到印刷電路板上。DIP是將電子元件的金屬接腳插入印刷電路板的穿孔進行電連接,因此可抵抗較強的外力而不致脫落,惟必須以人工方式擺放而耗費額外人力。SMT則是透過自動設備將電子元件擺放到印刷電路板上,並透過焊接方式與印刷電路板的表面電性連接,而可節省人力成本。Current electronic components are mainly mounted on printed circuit boards through dual in-line package (DIP) or surface-mount technology (SMT). DIP inserts the metal pins of electronic components into the through holes of the printed circuit board for electrical connection. Therefore, it can withstand strong external forces and will not fall off. However, it must be placed manually, which consumes extra manpower. SMT uses automatic equipment to place electronic components on printed circuit boards and electrically connect them to the surface of the printed circuit board through soldering, which can save labor costs.
然而,隨著對於電子設備功率需求的提高,其中設置的電子元件體積與重量也隨之增加。而電子設備於移動或傾斜時,僅透過SMT方式固定的大重量電子元件與印刷電路板表面之間的焊點容易產生斷裂甚至脫落,進而產生電子元件的失效的風險。However, as the power demand for electronic devices increases, the volume and weight of the electronic components installed therein also increase. When electronic equipment is moved or tilted, the solder joints between the heavy electronic components fixed only by SMT and the surface of the printed circuit board are prone to breakage or even fall off, thereby creating the risk of electronic component failure.
因此,實有必要提供一種磁性組件,組配設置於一電路板時同時貼附以及貫穿電路板,並提供額外的電連接點及結構支撐的同時通用於不同製程,進而降低人力成本並確保電性連接的穩定性,以解決習知技術之缺失。Therefore, it is necessary to provide a magnetic component that can be attached to and penetrate the circuit board when assembled and disposed on a circuit board, and can provide additional electrical connection points and structural support while being universally applicable to different manufacturing processes, thereby reducing labor costs and ensuring electrical power. The stability of sexual connection to solve the lack of conventional technology.
本案之目的在於提供一種磁性組件。其中磁性組件的導接件同時包括有貼附電路板表面之貼附部以及貫穿電路板表面之插置部,藉以通用於透過雙列直插封裝(Dual in-line package, DIP)或表面安裝技術(Surface-mount technology, SMT)而固定於電路板。磁性組件可例如先以SMT方式進行自動擺放,再以DIP方式進行插置部與電路板之連接,從而降低人力成本,同時提供額外的電連接點以及結構支撐而確保電性連接的穩定性。導接件包括有一連接部,使貼附部以及插置部得以一體成型而增加結構以及電連接之穩定性,且連接部例如包括有一彎折部,利於導接件於基座成型後簡單進行裝設以及拆卸,降低維護成本。貼附部以及插置部更例如分別與電路板之不同導電層連接,增加電路佈局之彈性。The purpose of this case is to provide a magnetic component. The lead of the magnetic component includes both an attachment part attached to the surface of the circuit board and an insertion part penetrating the surface of the circuit board, so that it can be commonly used for dual in-line package (DIP) or surface mounting. It is fixed on the circuit board using Surface-mount technology (SMT). Magnetic components can be automatically placed first, for example, using SMT, and then connected to the circuit board using DIP, thereby reducing labor costs and providing additional electrical connection points and structural support to ensure the stability of electrical connections. . The conductor includes a connecting part, so that the attachment part and the insertion part can be integrally formed to increase the stability of the structure and electrical connection. The connection part, for example, includes a bending part, which facilitates the easy installation of the conductor after the base is formed. Installation and disassembly reduce maintenance costs. For example, the attachment part and the insertion part are respectively connected to different conductive layers of the circuit board, thereby increasing the flexibility of the circuit layout.
本案另一目的在於提供一種磁性組件。其中磁性組件的導接件包括有貼附電路板表面之貼附部,且繞線包括有一出線端貫穿導接件以及電路板,藉以通用於透過雙列直插封裝(Dual in-line package, DIP)或表面安裝技術(Surface-mount technology, SMT)而固定於電路板。透過繞線之出線端直接貫穿電路板,除了提供額外的電連接點以及結構支撐,更減小導接件體積而實現緊湊的結構設計,增加電路板空間利用率。導接件之貼附部以及繞線之出線端亦可例如分別與電路板之不同導電層連接而增加電路佈局之彈性。Another purpose of this case is to provide a magnetic component. The conductor of the magnetic component includes an attachment portion that adheres to the surface of the circuit board, and the winding includes an outlet end that penetrates the conductor and the circuit board, so that it can be used through a dual in-line package (Dual in-line package). , DIP) or surface-mount technology (SMT) and fixed to the circuit board. By directly penetrating the circuit board through the outlet end of the winding, in addition to providing additional electrical connection points and structural support, it also reduces the size of the conductors to achieve a compact structural design and increase the utilization of circuit board space. The attachment portion of the conductive member and the outlet end of the winding can also be connected to different conductive layers of the circuit board respectively to increase the flexibility of the circuit layout.
為達前述目的,本案提供一種磁性組件。磁性組件組配設置於一電路板,且包括有一基座、一磁性元件以及一導接件。基座包括有彼此相對的一第一面以及一第二面。第二面面對於電路板之一第三面。磁性元件設置於基座且包括一繞線。導接件嵌設於基座且與繞線電連接,並包括有一貼附部以及一插置部。貼附部以及插置部彼此連接,貼附部位於基座之第二面以及電路板之第三面之間,插置部貫穿電路板之第三面。In order to achieve the aforementioned purpose, this case provides a magnetic component. The magnetic component is assembled on a circuit board and includes a base, a magnetic component and a conductor. The base includes a first side and a second side opposite to each other. The second side faces one of the third sides of the circuit board. The magnetic component is disposed on the base and includes a winding. The conductor is embedded in the base and electrically connected to the winding, and includes an attachment part and an insertion part. The attachment part and the insertion part are connected to each other, the attachment part is located between the second surface of the base and the third surface of the circuit board, and the insertion part penetrates the third surface of the circuit board.
於一實施例中,導接件包括至少二導接件,至少二導接件以基座之一中心軸對稱設置。In one embodiment, the guide member includes at least two guide members, and the at least two guide members are symmetrically arranged about a central axis of the base.
於一實施例中,基座包括一第一凸出部,鄰設於導接件,其中第一凸出部與導接件之間形成一間隙,繞線嵌設於間隙。In one embodiment, the base includes a first protruding part adjacent to the guide member, wherein a gap is formed between the first protrusion part and the guide member, and the winding is embedded in the gap.
於一實施例中,間隙具有一間隙寬度,繞線具有一繞線直徑,間隙寬度大於或等於繞線直徑。In one embodiment, the gap has a gap width, the winding has a winding diameter, and the gap width is greater than or equal to the winding diameter.
於一實施例中,基座包括一容置部,導接件包括一連接部,其中連接部連接貼附部以及插置部,且嵌設於基座之容置部。In one embodiment, the base includes a receiving part, and the guide member includes a connecting part, where the connecting part connects the attaching part and the inserting part, and is embedded in the receiving part of the base.
於一實施例中,導接件包括一第二凸出部,自連接部向外突伸,其中繞線纏繞第二凸出部以與導接件電連接。In one embodiment, the conductive member includes a second protruding portion protruding outward from the connecting portion, and the wire is wrapped around the second protruding portion to electrically connect with the conductive member.
於一實施例中,連接部包括一彎折部,具有一凹面,且凹面朝向容置部。In one embodiment, the connecting part includes a bent part with a concave surface, and the concave surface faces the receiving part.
於一實施例中,繞線係透過一焊接方式與導接件電連接。In one embodiment, the winding is electrically connected to the conductor through a welding method.
於一實施例中,導接件之貼附部以及插置部於一視向上彼此錯位設置,視向為基座之第一面朝向第二面之方向。In one embodiment, the attaching portion and the inserting portion of the guide member are offset from each other in a viewing direction, which is a direction in which the first surface of the base faces the second surface.
於一實施例中,貼附部以及插置部為一體成型。In one embodiment, the attachment part and the insertion part are integrally formed.
於一實施例中,電路板包括一第一導電層以及一第二導電層,第一導電層位於電路板之第三面,第二導電層位於電路板之第三面以及相對的一第四面之間,其中貼附部與第一導電層電連接,插置部與第二導電層電連接。In one embodiment, the circuit board includes a first conductive layer and a second conductive layer. The first conductive layer is located on the third side of the circuit board. The second conductive layer is located on the third side of the circuit board and an opposite fourth side. Between the surfaces, the attachment part is electrically connected to the first conductive layer, and the insertion part is electrically connected to the second conductive layer.
為達前述目的,本案另提供一種磁性組件。磁性組件組配設置於一電路板,且包括有一基座、一磁性元件以及一導接件。基座包括有彼此相對的一第一面以及一第二面。第二面面對於電路板之一第三面。磁性元件設置於基座10且包括一繞線。導接件嵌設於基座且與繞線電連接,並包括有一貼附部。貼附部位於基座之第二面以及電路板之第三面之間,繞線之一出線端貫穿導接件和電路板之第三面。In order to achieve the aforementioned purpose, this case also provides a magnetic component. The magnetic component is assembled on a circuit board and includes a base, a magnetic component and a conductor. The base includes a first side and a second side opposite to each other. The second side faces one of the third sides of the circuit board. The magnetic component is disposed on the
於一實施例中,導接件包括至少二導接件,至少二導接件以基座之一中心軸對稱設置。In one embodiment, the guide member includes at least two guide members, and the at least two guide members are symmetrically arranged about a central axis of the base.
於一實施例中,繞線之出線端貫穿基座。In one embodiment, the outlet end of the winding wire passes through the base.
於一實施例中,導接件之貼附部以及繞線之出線端於一視向上彼此錯位設置,視向為基座之第一面朝向第二面之方向。In one embodiment, the attachment portion of the guide member and the outlet end of the winding are offset from each other in a viewing direction, with the viewing direction being the direction in which the first surface of the base faces the second surface.
於一實施例中,電路板包括一第一導電層以及一第二導電層,第一導電層位於電路板之第三面,第二導電層位於電路板之第三面以及相對的一第四面之間,其中導接件之貼附部與第一導電層電連接,繞線之出線端與第二導電層電連接。In one embodiment, the circuit board includes a first conductive layer and a second conductive layer. The first conductive layer is located on the third side of the circuit board. The second conductive layer is located on the third side of the circuit board and an opposite fourth side. Between the surfaces, the attached portion of the conductive member is electrically connected to the first conductive layer, and the outlet end of the winding wire is electrically connected to the second conductive layer.
體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化,其皆不脫離本案的範圍,且其中的說明及圖式在本質上係當作說明之用,而非用於限制本案。例如,若是本案以下的內容敘述將一第一特徵設置於一第二特徵之上或上方,即表示其包含了所設置的上述第一特徵與上述第二特徵是直接接觸的實施例,亦包含了尚可將附加特徵設置於上述第一特徵與上述第二特徵之間,而使上述第一特徵與上述第二特徵可能未直接接觸的實施例。另外,本案中不同實施例可能使用重複的參考符號及/或標記。這些重複的參考符號及/或標記是為了簡化與清晰的目的,並非用以限定各個實施例及/或所述外觀結構之間的關係。再者,為了方便描述圖式中一組件或特徵部件與另一(複數)組件或(複數)特徵部件的關係,可使用空間相關用語,例如「在…之下」、「下方」、「較下部」、「上方」、「較上部」及類似的用語等。除了圖式所繪示的方位之外,空間相關用語用以涵蓋使用或操作中的裝置的不同方位。所述裝置可以被定為其他方向(例如旋轉90度或者位於其他方向),而於所使用的空間相關用語可被相應地解讀。當將一組件被稱為與另一組件「連接」或「耦合」時,其可直接連接至或耦合至另一組件,或者可存在介入組件。儘管本案的廣義範圍的數值範圍及參數為近似值,但盡可能精確地在具體實例中陳述數值。另外,可理解的是,雖然「第一」、「第二」、「第三」等用詞可被用於申請專利範圍中以描述不同的組件,但這些組件並不應被這些用語所限制,在實施例中相應描述的這些組件是以不同的組件符號來表示。這些用語是為了分別不同組件,例如:第一組件可被稱為第二組件。同樣地,第二組件也可被稱為第一組件,而不會脫離實施例的範圍。說明書中的用語「及/或」包含了一或多個相關列出的項目的任何或全部組合。用語「大約」係指涉於本領域中具通常知識者公認可接受的標準誤差範圍內的平均值。Some typical embodiments embodying the features and advantages of this case will be described in detail in the following description. It should be understood that this case can have various changes in different aspects without departing from the scope of this case, and the descriptions and drawings are essentially for illustrative purposes and are not used to limit this case. For example, if the following content of this case describes that a first feature is arranged on or above a second feature, it means that it includes the embodiment in which the above-mentioned first feature and the above-mentioned second feature are in direct contact, and also includes In this embodiment, additional features may be disposed between the first features and the second features, so that the first features and the second features may not be in direct contact. In addition, repeated reference symbols and/or labels may be used in different embodiments of this case. These repeated reference symbols and/or labels are for the purpose of simplicity and clarity, and are not used to limit the relationship between various embodiments and/or the described appearance structures. Furthermore, in order to conveniently describe the relationship between one component or feature part and another (plural) component or (plural) feature part in the drawings, spatially related terms may be used, such as "under", "below", "relative to". "Lower", "upper", "upper" and similar terms. Spatially relative terms are used to encompass different orientations of a device in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative terms used interpreted accordingly. When a component is referred to as being "connected" or "coupled" to another component, it can be directly connected or coupled to the other component or intervening components may be present. Although the broad numerical ranges and parameters set forth herein are approximations, the values are stated as precisely as possible in the specific examples. In addition, it is understood that although terms such as "first", "second" and "third" may be used in the scope of the patent application to describe different components, these components should not be limited by these terms. , the components described accordingly in the embodiments are represented by different component symbols. These terms are used to distinguish between different components, eg a first component may be referred to as a second component. Likewise, a second component could be termed a first component without departing from the scope of the embodiments. In this specification, the term "and/or" includes any or all combinations of one or more of the associated listed items. The term "approximately" refers to an average value within a standard error range generally accepted by those of ordinary skill in the art.
請參照第1A圖至第2B圖。第1A圖為本案第一實施例之磁性組件之立體結構圖。第1B圖為本案第一實施例之磁性組件於另一視角之立體結構圖。第2A圖為本案第一實施例之磁性組件及電路板之立體剖面圖。第2B圖為本案第一實施例之磁性組件及電路板之平面剖面圖。於本實施例中,磁性組件1組配設置於一電路板9,且包括有一基座10、一磁性元件20以及一導接件30。基座10包括有彼此相反設置的一第一面11以及一第二面12。第二面12朝向電路板9之一第三面91。磁性元件20設置於基座10且包括一繞線21。導接件30嵌設於基座10且與繞線21電連接,並包括有一貼附部31以及一插置部32。貼附部31以及插置部32彼此連接,貼附部31位於基座10之第二面12以及電路板9之第三面91之間,插置部32貫穿電路板9之第三面91。透過包括有貼附部31以及插置部32之導接件30,磁性組件1得以通用於透過雙列直插封裝(Dual in-line package, DIP)或表面安裝技術(Surface-mount technology, SMT)而固定於電路板9,且更可提供額外的電連接點以及結構支撐,同時降低人力成本並確保電性連接的穩定性。Please refer to Figure 1A to Figure 2B. Figure 1A is a three-dimensional structural view of the magnetic component of the first embodiment of the present invention. Figure 1B is a three-dimensional structural view of the magnetic component of the first embodiment of the present invention from another perspective. Figure 2A is a three-dimensional cross-sectional view of the magnetic component and circuit board of the first embodiment of the present invention. Figure 2B is a plan cross-sectional view of the magnetic component and circuit board of the first embodiment of the present invention. In this embodiment, the
於本實施例中,磁性組件1包括有兩個導接件30,以基座10之一中心軸C對稱設置。兩個導接件30例如分別沿X軸方向平行設置,且導接件30例如與基座10透過埋入射出 (Insert molding)方式而一併成型。當然,本案導接件30之數量、位置以及組裝方式並不限於此,而可根據實際需求調整。於本實施例中,磁性元件20例如環繞中心軸C設置,且設置於基座10之第一面11。繞線21例如自磁性元件20之側面沿X軸方向導出,再沿Z軸方向延伸而分別電連接至兩個導接件30。於本實施例中,繞線21例如纏繞導接件30,且透過一焊接方式與導接件30電連接。導接件30之貼附部31以及插置部32更例如為一體成型,俾利於增加結構以及電連接之穩定性。於本實施例中,導接件30之貼附部31自基座之第二面12朝電路板9之第三面91暴露,以貼附於電路板9之第三面91。導接件30之插置部32例如透過通孔93而沿Z軸方向貫穿電路板9之第三面91以及第四面92,從而提供額外的電連接點以及結構支撐。於本實施例中,導接件30更包括一連接部33,連接貼附部31以及插置部32,且嵌設於基座10。於本實施例中,導接件30之貼附部31以及插置部32例如於一視向D1上彼此錯位設置,視向D1為基座10之第一面11朝向第二面12之方向。換言之,貼附部31以及插置部32是自基座10分離地導出,以與電路板9的不同區域連接。In this embodiment, the
於本實施例中,電路板9包括一第一導電層94以及一第二導電層95。第一導電層94位於電路板9之第三面91,第二導電層95位於電路板9之第三面91以及相對的一第四面92之間。貼附部31例如與第一導電層94電連接,插置部32與第二導電層95電連接。透過貼附部31以及插置部32分別與電路板9之不同導電層連接,可增加整體電路佈局之彈性。於其他實施例中,插置部32例如同時與複數個導電層電連接,本案並不限於此。In this embodiment, the
於本實施例中,基座10包括有一擋牆13,環繞磁性元件20之外圍設置,以防止電子元件之間的物理碰撞及減低電磁干擾。於本實施例中,擋牆13例如遮蔽磁性元件20之前方(X軸正向),且包括一頂面131遮蔽磁性元件20之上方(Z軸正向),而於磁性元件20的後方(X軸逆向)形成一第一開口14,俾利磁性元件20於組裝時沿X軸方向穿過第一開口14而設置於基座10之第一面11。於其他實施例中,本案之擋牆13例如以中心軸C為軸心環繞設置,進而遮蔽磁性元件20之側面且於磁性元件20上方(Z軸正向)形成第一開口14,使磁性元件20於組裝時沿Z軸方向穿過第一開口14而設置於基座10之第一面11。值得注意的是,本案擋牆13以及第一開口14之設置方式並不限於此,且不再贅述。於本實施例中,基座10更例如包括一第二開口15,設置於擋牆13之側面,以供繞線21自磁性元件20之側面沿X軸方向導出而分別電連接至兩個導接件30,本案並不限於此。In this embodiment, the
請參照第3A圖至第4圖。第3A圖為本案第二實施例之磁性組件之立體結構圖。第3B圖為本案第二實施例之磁性組件於另一視角之立體結構圖。第4圖為本案第二實施例之磁性組件之結構分解圖。於本實施例中,磁性組件1a與第1A圖至第2B圖所示之磁性組件1相似,且相同的元件標號代表相同的元件、結構與功能,於此不再贅述。於本實施例中,基座10a例如包括一容置部16,導接件30a包括一連接部33。連接部33連接貼附部31以及插置部32,且嵌設於基座10a之容置部16。於本實施例中,磁性組件1a例如包括兩個沿X軸方向平行設置之導接件30a,分別容置於基座10a之兩個容置部16。導接件30a之連接部33更包括一彎折部331,具有一凹面332,且凹面332朝向容置部16。彎折部331例如為一U型結構,且凹面332,即U型結構之開口沿Y軸方向朝向基座10a之容置部16,俾利於基座10a於成型後可與導接件30a簡單完成組裝及拆卸,降低維護成本。當然,本案基座10a、導接件30a、容置部16、連接部33以及彎折部331等元件之形式以及設置方式並不限於此,而可根據實際需求調整。Please refer to Figure 3A to Figure 4. Figure 3A is a three-dimensional structural view of the magnetic component of the second embodiment of the present invention. Figure 3B is a three-dimensional structural view of the magnetic component of the second embodiment of the present invention from another perspective. Figure 4 is an exploded view of the structure of the magnetic component of the second embodiment of the present invention. In this embodiment, the
請參照第5A圖至第6C圖。第5A圖為本案第三實施例之磁性組件之立體結構圖。第5B圖為本案第三實施例之磁性組件於另一視角之立體結構圖。第6A圖為本案第三實施例之磁性組件之立體剖面圖。第6B圖為本案第三實施例之磁性組件之平面剖面圖。第6C圖為第6B圖中區域A之放大圖。於本實施例中,磁性組件1b與第3A圖至第4圖所示之磁性組件1a相似,且相同的元件標號代表相同的元件、結構與功能,於此不再贅述。於本實施例中,基座10b包括一第一凸出部17,鄰設於導接件30b。第一凸出部17例如自基座10b沿X軸方向向外突伸而與導接件30b之間形成一間隙G,且繞線21嵌設於間隙G。於本實施例中,間隙G更具有一間隙寬度W1,繞線21具有一繞線直徑W2,且間隙寬度W1大於或等於繞線直徑W2。基座10b之第一凸出部17例如組配供自磁性元件20導出之繞線21纏繞,俾利於磁性組件1b之組裝。再者,纏繞於第一凸出部17之繞線21更可例如嵌設於第一凸出部17與導接件30b之間的間隙G,且間隙寬度W1與繞線直徑W2相等,使繞線21與導接件30b直接接觸且彼此干涉而形成電連接。當然,本案基座10b、第一凸出部17、繞線21以及導接件30b等元件之形式以及設置方式並不限於此,而可根據實際需求調整。Please refer to Figure 5A to Figure 6C. Figure 5A is a three-dimensional structural view of the magnetic component of the third embodiment of the present invention. Figure 5B is a three-dimensional structural view of the magnetic component of the third embodiment of the present invention from another perspective. Figure 6A is a three-dimensional cross-sectional view of the magnetic component of the third embodiment of the present invention. Figure 6B is a plan cross-sectional view of the magnetic component of the third embodiment of the present invention. Figure 6C is an enlarged view of area A in Figure 6B. In this embodiment, the
請參照第7A圖至第7B圖。第7A圖為本案第四實施例之磁性組件之立體結構圖。第7B圖為本案第四實施例之磁性組件於另一視角之立體結構圖。於本實施例中,磁性組件1c與第3A圖至第4圖所示之磁性組件1a相似,且相同的元件標號代表相同的元件、結構與功能,於此不再贅述。於本實施例中,導接件30c包括一第二凸出部34,自連接部33向外突伸,且繞線21纏繞第二凸出部34以與導接件30c電連接。第二凸出部34例如自連接部33沿Z軸方向突伸,再沿X軸延伸,以利於自磁性元件20導出的繞線21進行纏繞。當然,本案第二凸出部34之形式以及設置方式並不限於此,而可根據實際需求調整。Please refer to Figure 7A to Figure 7B. Figure 7A is a three-dimensional structural view of the magnetic component of the fourth embodiment of the present invention. Figure 7B is a three-dimensional structural view of the magnetic component of the fourth embodiment of the present invention from another perspective. In this embodiment, the
請參照第8A圖至第10B圖。第8A圖為本案第五實施例之磁性組件之立體結構圖。第8B圖為本案第五實施例之磁性組件於另一視角之立體結構圖。第9圖為本案第五實施例之磁性組件之結構分解圖。第10A圖為本案第五實施例之磁性組件及電路板之立體剖面圖。第10B圖為本案第五實施例之磁性組件及電路板之平面剖面圖。於本實施例中,磁性組件1d與第1A圖至第2B圖所示之磁性組件1相似,且相同的元件標號代表相同的元件、結構與功能,於此不再贅述。於本實施例中,磁性組件1d組配設置於一電路板9d,且包括有一基座10d、一磁性元件20d以及一導接件30d。基座10d包括有彼此相對的一第一面11以及一第二面12。第二面12面對於電路板9d之一第三面91。磁性元件20d設置於基座10且包括一繞線21。導接件30d嵌設於基座10且與繞線21電連接,並包括有一貼附部31。貼附部31位於基座10之第二面12以及電路板9d之第三面91之間,繞線21之一出線端211貫穿導接件30d和電路板9d之第三面91。Please refer to Figure 8A to Figure 10B. Figure 8A is a three-dimensional structural view of the magnetic component of the fifth embodiment of the present invention. Figure 8B is a three-dimensional structural view of the magnetic component of the fifth embodiment of the present invention from another perspective. Figure 9 is an exploded view of the structure of the magnetic component of the fifth embodiment of the present invention. Figure 10A is a three-dimensional cross-sectional view of the magnetic component and circuit board of the fifth embodiment of the present invention. Figure 10B is a plan cross-sectional view of the magnetic component and circuit board of the fifth embodiment of the present invention. In this embodiment, the
於本實施例中,磁性組件1d包括有四個導接件30d ,以基座10d之一中心軸C對稱設置,且導接件30d例如與基座10透過埋入射出 (Insert molding)方式而一併成型。當然,本案導接件30d之數量、位置以及組裝方式並不限於此,而可根據實際需求調整。於本實施例中,繞線21之出線端211貫穿基座10d。繞線21之出線端211例如沿Z軸方向依序貫穿導接件30d、基座10d之第一面11以及第二面12,再例如透過通孔93d貫穿電路板9d之第三面91以及第四面92。藉由繞線21之出線端211貫穿導接件30d以及基座10d而由基座10d底部導出,更可實現了實現緊湊的結構設計而增加電路板空間利用率。於本實施例中,導接件30d之貼附部31以及繞線21之出線端211更例如於一視向D1上彼此錯位設置。視向D1為基座10d之第一面11朝向第二面12之方向。換言之,貼附部31以及繞線21之出線端211是自基座10d分離地導出,以與電路板9d的不同區域連接。於本實施例中,基座10d包括有一擋牆13d,環繞磁性元件20d之外圍設置,以防止電子元件之間的物理碰撞及減低電磁干擾。於本實施例中,擋牆13d例如沿X軸方向平行設置,以遮蔽磁性元件20d,本案並不限於此。In this embodiment, the
於本實施例中,電路板9d包括一第一導電層94d以及一第二導電層95d。第一導電層94d位於電路板9d之第三面91,第二導電層95d位於電路板9d之第三面91以及相對的一第四面92之間。導接件30d之貼附部31與第一導電層94d電連接,繞線21之出線端211與第二導電層95d電連接。透過導接件30d之貼附部31以及繞線21之出線端211分別與電路板9d之不同導電層連接,可增加整體電路佈局之彈性。於其他實施例中,繞線21之出線端211例如同時與複數個導電層電連接,本案並不限於此。In this embodiment, the
綜上所述,本案提供一種磁性組件。導接件同時包括有貼附電路板表面之貼附部以及貫穿電路板表面之插置部,藉以通用於透過雙列直插封裝(Dual in-line package, DIP)或表面安裝技術(Surface-mount technology, SMT)而固定於電路板。磁性組件可例如先以SMT方式進行自動擺放,再以DIP方式進行插置部與電路板之連接,從而降低人力成本,同時提供額外的電連接點以及結構支撐而確保電性連接的穩定性。導接件包括有一連接部,使貼附部以及插置部得以一體成型而增加結構以及電連接之穩定性,且連接部例如包括有一彎折部,利於導接件於基座成型後簡單進行裝設以及拆卸,降低維護成本。貼附部以及插置部更例如分別與電路板之不同導電層連接,增加電路佈局之彈性。磁性組件亦可透過繞線之出線端貫穿導接件以及電路板,藉以通用於透過雙列直插封裝(Dual in-line package, DIP)或表面安裝技術(Surface-mount technology, SMT)而固定於電路板。透過繞線之出線端直接貫穿電路板,除了提供額外的電連接點以及結構支撐,更減小導接件體積而實現緊湊的結構設計,增加電路板空間利用率。導接件之貼附部以及繞線之出線端亦可例如分別與電路板之不同導電層連接而增加電路佈局之彈性。To sum up, this case provides a magnetic component. The conductor includes both an attachment part attached to the surface of the circuit board and an insertion part penetrating the surface of the circuit board, so that it can be used through dual in-line package (Dual in-line package, DIP) or surface mounting technology (Surface- mount technology, SMT) and fixed on the circuit board. Magnetic components can be automatically placed first, for example, using SMT, and then connected to the circuit board using DIP, thereby reducing labor costs and providing additional electrical connection points and structural support to ensure the stability of electrical connections. . The conductor includes a connecting part, so that the attachment part and the insertion part can be integrally formed to increase the stability of the structure and electrical connection. The connection part, for example, includes a bending part, which facilitates the easy installation of the conductor after the base is formed. Installation and disassembly reduce maintenance costs. For example, the attachment part and the insertion part are respectively connected to different conductive layers of the circuit board, thereby increasing the flexibility of the circuit layout. The magnetic component can also penetrate the conductor and the circuit board through the outlet end of the wire, so that it can be installed through dual in-line package (DIP) or surface-mount technology (SMT). Fixed to the circuit board. By directly penetrating the circuit board through the outlet end of the winding, in addition to providing additional electrical connection points and structural support, it also reduces the size of the conductors to achieve a compact structural design and increase the utilization of circuit board space. The attachment portion of the conductive member and the outlet end of the winding can also be connected to different conductive layers of the circuit board respectively to increase the flexibility of the circuit layout.
本案得由熟習此技術之人士任施匠思而為諸般修飾,然皆不脫如附申請專利範圍所欲保護者。This case may be modified in various ways by those who are familiar with this technology, but none of them will deviate from the intended protection within the scope of the patent application.
1、1a、1b、1c、1d:磁性組件
10、10a、10b、10c、10d:基座
11:第一面
12:第二面
13、13d:擋牆
131:頂面
14:第一開口
15:第二開口
16:容置部
17:第一凸出部
20、20d:磁性元件
21:繞線
211:出線端
30、30a、30b、30c、30d:導接件
31:貼附部
32:插置部
33:連接部
331:彎折部
332:凹面
34:第二凸出部
9、9d:電路板
91:第三面
92:第四面
93、93d:通孔
94、94d:第一導電層
95、95d:第二導電層
A:區域
C:中心軸
G:間隙
D1:視向
W1:間隙寬度
W2:繞線直徑
X、Y、Z:軸
1, 1a, 1b, 1c, 1d:
第1A圖為本案第一實施例之磁性組件之立體結構圖。Figure 1A is a three-dimensional structural view of the magnetic component of the first embodiment of the present invention.
第1B圖為本案第一實施例之磁性組件於另一視角之立體結構圖。Figure 1B is a three-dimensional structural view of the magnetic component of the first embodiment of the present invention from another perspective.
第2A圖為本案第一實施例之磁性組件及電路板之立體剖面圖。Figure 2A is a three-dimensional cross-sectional view of the magnetic component and circuit board of the first embodiment of the present invention.
第2B圖為本案第一實施例之磁性組件及電路板之平面剖面圖。Figure 2B is a plan cross-sectional view of the magnetic component and circuit board of the first embodiment of the present invention.
第3A圖為本案第二實施例之磁性組件之立體結構圖。Figure 3A is a three-dimensional structural view of the magnetic component of the second embodiment of the present invention.
第3B圖為本案第二實施例之磁性組件於另一視角之立體結構圖。Figure 3B is a three-dimensional structural view of the magnetic component of the second embodiment of the present invention from another perspective.
第4圖為本案第二實施例之磁性組件之結構分解圖。Figure 4 is an exploded view of the structure of the magnetic component of the second embodiment of the present invention.
第5A圖為本案第三實施例之磁性組件之立體結構圖。Figure 5A is a three-dimensional structural view of the magnetic component of the third embodiment of the present invention.
第5B圖為本案第三實施例之磁性組件於另一視角之立體結構圖。Figure 5B is a three-dimensional structural view of the magnetic component of the third embodiment of the present invention from another perspective.
第6A圖為本案第三實施例之磁性組件之立體剖面圖。Figure 6A is a three-dimensional cross-sectional view of the magnetic component of the third embodiment of the present invention.
第6B圖為本案第三實施例之磁性組件之平面剖面圖。Figure 6B is a plan cross-sectional view of the magnetic component of the third embodiment of the present invention.
第6C圖為第6B圖中區域A之放大圖。Figure 6C is an enlarged view of area A in Figure 6B.
第7A圖為本案第四實施例之磁性組件之立體結構圖。Figure 7A is a three-dimensional structural view of the magnetic component of the fourth embodiment of the present invention.
第7B圖為本案第四實施例之磁性組件於另一視角之立體結構圖。Figure 7B is a three-dimensional structural view of the magnetic component of the fourth embodiment of the present invention from another perspective.
第8A圖為本案第五實施例之磁性組件之立體結構圖。Figure 8A is a three-dimensional structural view of the magnetic component of the fifth embodiment of the present invention.
第8B圖為本案第五實施例之磁性組件於另一視角之立體結構圖。Figure 8B is a three-dimensional structural view of the magnetic component of the fifth embodiment of the present invention from another perspective.
第9圖為本案第五實施例之磁性組件之結構分解圖。Figure 9 is an exploded view of the structure of the magnetic component of the fifth embodiment of the present invention.
第10A圖為本案第五實施例之磁性組件及電路板之立體剖面圖。Figure 10A is a three-dimensional cross-sectional view of the magnetic component and circuit board of the fifth embodiment of the present invention.
第10B圖為本案第五實施例之磁性組件及電路板之平面剖面圖。Figure 10B is a plan cross-sectional view of the magnetic component and circuit board of the fifth embodiment of the present invention.
1:磁性組件 1: Magnetic components
10:基座 10: base
11:第一面
11:
12:第二面 12:Second side
13:擋牆 13: retaining wall
14:第一開口 14:First opening
15:第二開口 15:Second opening
20:磁性元件 20:Magnetic components
21:繞線 21: Winding
30:導接件 30: Guide parts
31:貼附部 31: Attachment Department
32:插置部 32: Insertion part
C:中心軸 C: central axis
D1:視向 D1: sight direction
X、Y、Z:軸 X, Y, Z: axis
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321498258.XU CN220367788U (en) | 2023-06-13 | 2023-06-13 | Magnetic assembly |
CN202321498258X | 2023-06-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM647914U true TWM647914U (en) | 2023-11-01 |
Family
ID=89513018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112207218U TWM647914U (en) | 2023-06-13 | 2023-07-11 | Magnetic component |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN220367788U (en) |
TW (1) | TWM647914U (en) |
-
2023
- 2023-06-13 CN CN202321498258.XU patent/CN220367788U/en active Active
- 2023-07-11 TW TW112207218U patent/TWM647914U/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN220367788U (en) | 2024-01-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1734617B1 (en) | Connector for printed wiring board | |
US5069641A (en) | Modular jack | |
EP1040739B1 (en) | Surface mount spring gasket and emi enclosure | |
KR100816619B1 (en) | Board mounted terminal construction | |
KR20020029770A (en) | Control device and soldering method | |
JP2020057788A (en) | Printed circuit board and motor including the same | |
US11569599B2 (en) | Connector and socket used for the same | |
EP1142067B1 (en) | Electrical connectors | |
US20010055194A1 (en) | Inverter capacitor module and inverter | |
TWM647914U (en) | Magnetic component | |
CN117156736A (en) | Electronic component | |
CN103765684A (en) | Assembly of plug connector and circuit board | |
US20190279808A1 (en) | Surface mounting coil device and electronic equipment | |
CN116526128A (en) | Inductive charging antenna structure and manufacturing method thereof, and wireless charging module | |
KR101133630B1 (en) | Receptacle connector improved in mounting structure | |
US8467194B2 (en) | AC adapter | |
CN221614318U (en) | Circuit board, power module and power system | |
US20240266105A1 (en) | Transformer assembly including copper stampings as secondary windings | |
JP2018166021A (en) | Connector, connector unit, and lighting fixture | |
JP4985852B2 (en) | Mounted electronic circuit module | |
JPS6240459Y2 (en) | ||
TWI475768B (en) | Electrical connector | |
JP2001284756A (en) | Electronic unit | |
JP2021099908A (en) | Board connector, electronic component unit, and wiring harness | |
JPS6127149Y2 (en) |