JP5026863B2 - Semiconductor device mounting device - Google Patents

Description

  The present invention relates to a semiconductor element mounting apparatus for mounting a semiconductor element on a workpiece such as a lead frame or a substrate that is intermittently fed while being heated.

A semiconductor device mounting apparatus of this type is disclosed in, for example, Patent Document 1 and the like, and heats a chute body to melt solder for bonding a semiconductor device to a workpiece, and oxidizes the workpiece, the semiconductor device, and the solder. In order to prevent this, the inside of the main body is hermetically sealed, filled with nitrogen gas or the like to expel oxygen, and the workpiece is transported in this sealed space. In such a conventional semiconductor element mounting apparatus, when the chute width is changed in order to produce a workpiece having different dimensions in the direction orthogonal to the workpiece conveyance direction, the heated chute body is temporarily attached. It was cooled and replaced with a new transport chute after cooling.
JP 2001-257216 A

  Therefore, when changing the chute width, the chute body that heats the workpiece must be cooled and replaced with a new transport chute, and the chute body must be reheated after this replacement, There was a problem that production efficiency was bad.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a semiconductor device mounting apparatus capable of improving the production efficiency when changing the chute width.

  Therefore, according to a first aspect of the present invention, there is provided a semiconductor element mounting apparatus for mounting a semiconductor element on a workpiece such as a lead frame or a substrate that is intermittently fed while being heated. A movable chute that is movable in a direction, and a fixed chute that is provided corresponding to the type of the workpiece having a different width in a direction orthogonal to the conveying direction and is placed on a chute body to restrict the movement of the movable chute A detachable spacer for determining the distance from the movable chute is provided.

  According to a second aspect of the present invention, there is provided a semiconductor element mounting apparatus for mounting a semiconductor element on a workpiece such as a lead frame or a substrate that is intermittently fed while being heated, in a direction orthogonal to a fixed chute and a transport direction for transporting the work. A movable chute that is movable and a fixed chute and a movable chute that are provided corresponding to the types of the workpieces having different widths in the direction orthogonal to the conveying direction and are placed on the chute body to restrict the movement of the movable chute. A detachable spacer for determining the distance between the movable chute and the spacer chute for fixing the movable chute together with the movable chute in a state where the movable chute is pushed and positioned in the fixed chute direction. Is provided.

  A third invention is characterized in that, in the first or second invention, a plurality of the spacers are detachably connected along the conveying direction of the workpiece.

  According to a fourth invention, in the first or second invention, the spacer supports the work lower surface.

  In a fifth aspect based on the second aspect, the spacer press includes a pressing portion for pressing the spacer against the chute main body, and the chute main body with the pressing portion pressing the spacer against the chute main body. A bolt holding recess for fixing the bolt to the spacer presser, and the bolt holding the bolt into the receiving recess is provided with an opening for rotating the bolt. It is characterized by that.

  According to the present invention, it is possible to provide a semiconductor device mounting apparatus capable of improving the production efficiency when changing the chute width.

  Hereinafter, a semiconductor device mounting apparatus will be described with reference to the accompanying drawings. FIG. 1 is a plan view of a semiconductor element mounting apparatus. Reference numeral 1 is a semiconductor element mounting apparatus. A predetermined work is performed on the workpiece 3 while intermittently feeding, and then the workpiece 3 is sent to a downstream device.

  The mounting apparatus 1 has a supply station I, a solder application station II, a mounting station III, and a discharge station IV from upstream.

  Hereinafter, the conveying device 5 for the workpiece 3 will be described with reference to FIG. The transfer device 5 includes a transfer chute main body (hereinafter referred to as “chute main body”) 6 having a U-shaped cross section with an open upper surface, and a fixed chute 7 provided at one end of the hollow chute main body 6. A movable chute 8 is provided at the other end of the chute body 6 so as to be movable with respect to the fixed chute 7, and a sealed space S that covers the upper surface opening of the chute body 6 and is a conveyance space for the workpiece 3 is formed. A chute lid 9 is provided, and a transparent opening / closing lid 10 is provided in an opening formed in the chute lid 9 so as to be opened and closed. Through this open / close lid 10, an operator can look inside the apparatus main body, for example, the state of application of wire solder or the state of mounting of semiconductor elements such as bare chips.

  The fixed chute 7 has a surface 7A on which one side surface in the longitudinal direction of the workpiece 3 abuts and a surface 7B on which the workpiece 3 is placed continuously formed on the upper surface, and the chute body 6 having a U-shaped cross section. A plurality of bolts 40 are inserted through the insertion hole 7C and fixed to the chute body 6 with a predetermined interval in a state where the side surface is in contact with the recess forming side surface 6B.

  In the movable chute 8, a surface 8A on which the other side surface in the longitudinal direction of the workpiece 3 abuts and a surface 8B on which the workpiece 3 is placed are continuously formed on the upper surface. A narrow opening 8C and a head portion 41B of the bolt 41 for allowing the shaft portion 41A of the bolt 41 to be moved are provided so that the fixed chute 7 direction, that is, a direction perpendicular to the conveying direction of the workpiece 3 can be moved. A wide concave portion 8D for allowing movement is opened. Therefore, when the bolt 41 is loosened, the shaft portion 41A is guided to the opening 8C and the head portion 41B is guided along the recess 8D, and the movable chute 8 can move in the direction of the fixed chute 7, and when the bolt 41 is tightened, the head portion The movable chute 8 can be fixed to the chute body 6 such that 41B presses the bottom surface forming the recess 8D.

  A spacer 42 is provided for each type of workpiece 3 having a different width in the direction orthogonal to the conveyance direction of the workpiece 3, and the interval between the fixed chute 7 and the movable chute 8 is selected according to the type of the workpiece 3. The spacer 42 is used. The spacer 42 is movably mounted on the recess-forming bottom surface 6A of the chute body 6 and also supports the lower surface of the work 3 by placing the work 3 thereon. Although fixed with the said movable chute 8, it demonstrates in full detail below.

  First, the spacer 42 is cut away on the side surface close to the fixed chute 7 and the side surface close to the movable chute 8 to form a pressed portion 42A. The spacer pressing 43 is formed with a positioning portion 43A for positioning one side of the spacer 42 near the fixed chute 7 and a pressing portion 43B for pressing and fixing one pressed portion 42A via a bolt 44. Is done. Although one side of the spacer 42 near the fixed chute 7 is regulated by the positioning portion 43A of the spacer holder 43 to position the spacer holder 43, the present invention is not limited to this, but other position regulating members, for example, The position may be regulated by contacting a part of the fixed chute 7.

  Further, the movable chute 8 is formed with a positioning portion 8E for positioning the other side of the spacer 42 and a pressing portion 8F for pressing and fixing the other pressed portion 42A via the bolt 41. Further, as shown in FIG. 4, a protruding portion 42B having a step difference from the upper surface of the spacer is formed at the upstream end of the downstream spacer 42, and an engaging pin 46 is erected on the protruding portion 42B. A recess 42C into which the protrusion 42B is fitted is formed at the downstream end of the upstream spacer 42, and an engagement hole 42D with which the engagement pin 46 is engaged is formed in the recess 42C. A plurality of spacers 42 are detachably connected along the conveying direction of the workpiece 3 by engaging the engaging pin 46 with the engaging hole 42D from above and fitting the protruding portion 42B and the recessed portion 42C. (See FIG. 3).

  That is, in order to convey the workpiece 3 having a different width in the direction orthogonal to the workpiece conveyance direction, the spacer 42 is used in which the distance between the fixed chute 7 and the movable chute 8 is selected according to the type of the workpiece 3. When the spacer 42 is taken out and another spacer 42 having a different width is newly installed, if the open / close lid 10 is opened and closed, oxygen flows into the sealed space S and causes oxidation of the work 3 and the like. Since it is necessary to make the opening / closing lid 10 small in order to prevent oxidation as much as possible, a plurality of small spacers 42 are connected as small spacers 42 instead of large spacers. In addition, in order to keep the oxygen concentration at the place where the solder application at the solder application station II and the mounting of the semiconductor element at the attachment station III are kept low, the opening for inserting and removing the work 3 is made as small as possible, and these places are At a distant position, the workpiece 3 needs to be taken in and out through an opening provided with the leftmost opening / closing lid 10 in FIG.

  Further, an elongated hole 12 through which the conveying pin 11 passes is formed in one end portion of the chute lid 9 along the conveying direction, and the elongated hole 12 is blocked by an elongated hole cover 13 slidably mounted on the upper surface of the chute lid 9. It is peeling off. A through hole 14 through which the conveying pin 11 passes is formed in the approximate center of the long hole cover 13.

  Hereinafter, the intermittent conveyance device 2 for the workpiece 3 will be described with reference to FIG. The intermittent conveying device 2 is provided inside and outside the sealed space S, and a transfer 15 provided along the fixed chute 7 and the movable chute 8 in the longitudinal direction of the chute body 6 along the conveying direction of the work 3, and both chutes. 7 and 8, a plurality of conveying pins 11 provided at predetermined intervals to the transfer 15 via a support member 16 in order to engage and move the feed holes 3 </ b> A of the workpieces 3, 8, and the transfer 15 7 and 8, a reciprocating drive source that reciprocates by one pitch of a predetermined length and a lift drive source that moves the transfer 15 up and down.

  Accordingly, after the transfer 15 is moved by the reciprocating drive source by a reciprocating drive source, the transfer 15 is lifted by the lifting drive source to release the engagement between the work 3 and the conveying pin 11, and the transfer by the reciprocating drive source. After 15 has returned for a predetermined distance, the transfer 15 is lowered by the raising / lowering drive source to engage the conveying pin 11 with the workpiece 3, and the workpiece 3 is intermittently conveyed.

  In FIG. 1, reference numeral 18 denotes a plurality of gas supply pipes for supplying nitrogen gas or a mixed gas of nitrogen and hydrogen into the sealed space S in order to prevent or reduce the oxidation of the work 3 in the sealed space S. Each gas supply pipe 18 is connected to a gas supply source (not shown) via each flow rate regulator.

  Further, in the supply station I, the solder application station II, and the mounting station III, an opening 19 is formed in the chute lid 9 and a shutter 21 that opens and closes the opening 19 by a cylinder 20 is provided. The coating station II has the same configuration.

  First, in the supply station I, the work 3 stored in alignment on the tray 23 stored in the tray storage unit 22 is taken out while the suction nozzle of the supply device is moved in the plane direction and the vertical direction by the drive source. Then, the shutter 21 is moved by the cylinder 20 and sequentially supplied onto both the chutes 7 and 8 through the openings. After the supply, the shutter 21 is moved to close the openings. Then, as described above, the work 3 on both the chutes 7 and 8 is intermittently fed one pitch at a time by the intermittent conveying device 2.

  In the next solder application station II, the shutter 21 is moved by the cylinder 20 and the wire solder as a bonding material is applied to the work 3 on both the chutes 7 and 8 through the openings by the solder application device. The shutter 21 is moved to close the opening. In addition, this solder application | coating apparatus is a structure which can be moved with a drive source in a plane direction and an up-down direction. The chute body 6 is provided with a heater block 25 in which a heater 24 is embedded, and the work 3 is heated via the chute body 6 to apply the wire solder while melting.

  In the next mounting station III, the suction nozzle 26 of the mounting device is moved in the plane direction and the vertical direction by the driving source, and the dicing bare chip or the like disposed on the wafer sheet 29 on the XY table 28 of the semiconductor supply device 27 is used. The semiconductor element 30 is adsorbed and taken out, and the shutter 21 is moved by the cylinder 20 to be mounted on the work 3 on both the chutes 7 and 8 through the openings via wire solder, and the shutter 21 is moved after mounting. To close the opening.

  Further, a push-up device having a push-up needle that pushes up the semiconductor element 30 from below is installed just below the point where the suction nozzle 26 descends. Then, the semiconductor element 30 is taken out by the suction nozzle 26 and mounted on the workpiece 3.

  An air curtain of an antioxidant gas such as nitrogen gas is formed above both chutes 7 and 8 in the post process of the mounting station III in order to prevent oxidation by rapid cooling of the work 3 on which the semiconductor element 30 has been mounted. Is done. The air curtain is formed in the sealed space S over the entire region in the direction orthogonal to the conveying direction, and blows an antioxidant gas onto the workpiece 3 from above the chutes 7 and 8 of the workpiece 3. For example, a plurality of holes are formed in the pipe 32 disposed above both the chutes 7 and 8, and the antioxidant gas is ejected from the hole of the pipe 32 through the gas supply valve 33 communicating with the gas supply source.

  At the last discharge station IV, the work 3 on which the semiconductor elements 30 on both the chutes 7 and 8 are mounted is taken out by a discharge and take-out device that moves in a plane direction and a vertical direction by a drive source, and is a tray 23 that is a storage device. Stored on top.

  As described above, the work 3 supplied to both the chutes 7 and 8 at the supply station I is intermittently fed one pitch at a time by the intermittent transfer device 2 while applying wire solder on the work 3, The semiconductor element 30 is mounted on the work 3 or the work 3 is taken out from both the chutes 7 and 8 and stored.

  Next, the workpiece width setup operation in the semiconductor element mounting apparatus will be described with reference to FIGS. First, with the semiconductor element mounting device 1 stopped, the opening / closing lid 10 is opened, and there is no work 3 on both the chutes 7, 8, so an opening provided with the opening / closing lid 10 or a dedicated opening / closing A tool is inserted into the sealed space S through the insertion hole 17A provided with the lid 17, and the bolts 41 and 44 are loosened (so as not to be pulled out) to move the movable chute 8 away from the fixed chute 7. The spacer 42 is taken out of the mounting apparatus 1.

  In this case, the opening / closing lid 10 is provided after the spacer 42 located at the most upstream is taken out while releasing the connection with the adjacent spacer 42, that is, while disengaging the engagement pin 46 and the engagement hole 42D. The adjacent spacer 42 is moved to a position directly below the formed opening, and the operation of taking out is repeated while releasing the connection with the adjacent spacer 42, and all the spacers 42 are taken out of the mounting apparatus 1.

  Thereafter, a spacer 42 having a different width corresponding to the workpiece 3 to be produced next is placed on the chute body 6 through the opening provided with the opening / closing lid 10, and the operator moves downstream, By repeating the operation of engaging and connecting the engagement holes 42D of the spacer 42 inserted in the sealed space S to the engagement pins 46 of the spacer 42 first placed, The spacer 42 is placed on the chute body 6.

  Then, the operator presses the movable chute 8 in the direction of the fixed chute 7 using the pushing rod 50 through the insertion hole 6 </ b> C opened in the front surface of the chute body 6. Then, each of the connected spacers 42 is positioned and positioned by the spacer presser 43 that is positioned by the fixed chute 7. That is, one side surface of each spacer 42 abuts on the positioning portion 43 </ b> A of the spacer presser 43, and the position of each spacer 42 is regulated by the spacer presser 43.

  As described above, the movable chute 8 can be reliably positioned at a position that matches the width of the workpiece 3 by using the spacer 42 having a size that matches the size of the workpiece 3. Moreover, since the movable chute 8 can be used together for positioning of the spacer 42, the positioning work can be simplified as compared with a mechanism for positioning the movable chute and the spacer separately.

  In this state, a tool is inserted into the sealed space S through the opening provided with the opening / closing lid 10 and the insertion hole 17A provided with the dedicated opening / closing lid 17, and each bolt 41, 44 is tightened. The pressed portion 42A of the spacer 42 is pressed by the pressing portion 43B of the spacer holder 43 and the pressing portion 8F of the movable chute 8, and the spacer holder 43 and the movable chute 8 are placed on the chute body 6 with the spacers 42 positioned. Fix it.

  For this reason, the spacer 42 can be brought into close contact with the upper surface of the chute body 6 as much as possible, and heat conduction from the chute body 6 heated by the heater 24 to the spacer 42 can be kept good.

  As shown in FIG. 5, the head of the bolt 44 is housed in the housing recess 43C, and the spacer retainer 43 is temporarily fixed or fixed to the chute body 6 with the bolt 44. The retaining plate 51, which is the retaining portion of the bolt 44 in which the insertion hole 51A is opened, may be fixed to improve the work width setup operation.

  That is, when the bolts 44 are loosened through the tool insertion holes 51A using the tool 52, the bolts 44 are lifted, and the retaining plate 51 and the spacer presser 43 are also lifted. Even if the pressing portion 43B of the spacer presser 43 and the pressed portion 42A of the spacer 42 are lightly baked because 24 is buried and becomes high temperature, a gap is formed by separating the pressing portion 43B and the pressed portion 42A. The spacer 42 can be reliably separated from the chute body 6.

  Alternatively, the retaining plate 51 and the spacer presser 43 may be formed integrally, a horizontal hole that is a bolt insertion opening may be formed in the spacer presser 43, and the bolt 44 may be inserted through the horizontal hole of the spacer presser 43.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of the mounting device of a semiconductor element. It is a longitudinal cross-sectional view of the mounting device of a semiconductor element. It is a top view of the mounting device of a semiconductor element in the state where a chute lid was removed. It is a partial sectional view of a spacer presser. It is a principal part enlarged view of the upper body which is pressing the spacer with a spacer presser.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor device mounting apparatus 2 Intermittent conveyance apparatus 3 Work piece 6 Chute body 7 Fixed chute 8 Movable chute 10 Opening / closing lid 41, 44 Bolt 42 Spacer 43 Spacer pressing 51 Retaining plate

Claims (5)

  In a semiconductor device mounting apparatus for mounting a semiconductor device on a workpiece such as a lead frame or a substrate that is intermittently fed while being heated, a fixed chute for transporting the workpiece and a movable chute movable in a direction perpendicular to the transport direction The detachment that is provided corresponding to the type of the workpiece having a different width in the direction orthogonal to the conveying direction and is placed on the chute body to regulate the movement of the movable chute to determine the interval between the fixed chute and the movable chute. A semiconductor device mounting apparatus comprising a spacer and a spacer.   In a semiconductor device mounting apparatus for mounting a semiconductor device on a workpiece such as a lead frame or a substrate that is intermittently fed while being heated, a fixed chute for transporting the workpiece and a movable chute movable in a direction perpendicular to the transport direction The detachment that is provided corresponding to the type of the workpiece having a different width in the direction orthogonal to the conveying direction and is placed on the chute body to regulate the movement of the movable chute to determine the interval between the fixed chute and the movable chute. And a spacer presser fixed to the chute body together with the movable chute in a state where the movable chute is pushed and positioned in the fixed chute direction. A semiconductor device mounting apparatus.   3. The semiconductor element mounting apparatus according to claim 1, wherein a plurality of the spacers are detachably connected along the conveying direction of the workpiece.   The semiconductor element mounting apparatus according to claim 1, wherein the spacer supports the lower surface of the workpiece.   The spacer press includes a pressing portion for pressing the spacer against the chute body, and a bolt receiving recess for fixing the spacer to the chute body while the pressing portion presses the spacer against the chute body. 3. The spacer presser according to claim 2, wherein a retaining portion for the bolt, in which an opening for rotating the bolt is opened in a state where the bolt is housed in the housing recess, is provided in the spacer presser. Semiconductor device mounting device.

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