JP5026403B2 - Substrate processing system - Google Patents

Description

  The present invention relates to a substrate processing system for performing a process such as a liquid process using a processing liquid, a gas process using a process gas, or a cleaning process or a thermal process on a substrate such as a semiconductor wafer. The present invention relates to a substrate processing system capable of increasing the number of processed substrates.

  Conventionally, various types of substrate processing systems are known for performing processing such as processing with a processing liquid, processing with a processing gas, processing with a processing gas, cleaning processing, thermal processing, and the like on a substrate such as a semiconductor wafer. It has been. Such a substrate processing system is provided with a plurality of substrate processing units for processing a substrate. Further, the substrate processing system is provided with a substrate storage unit for temporarily storing a substrate before being processed by the substrate processing unit and a substrate processed by the substrate processing unit. Then, the substrate transport apparatus transports the substrate before being processed by the substrate processing unit from the substrate housing unit to the substrate processing unit, or transports the substrate processed by the substrate processing unit from the substrate processing unit to the substrate housing unit. It is like that.

  Specifically, for example, Patent Document 1 discloses a substrate processing system provided with a plurality (specifically, four) of substrate processing units for cleaning a substrate such as a semiconductor wafer. In the substrate processing system disclosed in Patent Document 1, the substrate processing units are arranged in two stages in the vertical direction. Then, one substrate transport device alternately transports the substrates from the substrate container to the upper and lower two-stage substrate processing units, and also alternately transports the substrates from the upper and lower two-stage substrate processing units to the substrate container. It is supposed to be.

JP 2003-273058 A

  However, for example, in the substrate processing system as shown in Patent Document 1, when a substrate is transferred between each of the plurality of stages of substrate processing units and the substrate accommodating portion by a single substrate transfer device, the following problems are caused. There is. That is, this substrate transport apparatus alternately transports the substrate from the substrate housing unit to each substrate processing unit, and alternately transports the substrate from each substrate processing unit to the substrate housing unit. When the substrate processing system is to be processed, there is a problem in that the processing capacity of the substrate processing system is limited by the substrate transport time between the substrate storage unit and each substrate processing unit.

  The present invention has been made in consideration of such points, and an object of the present invention is to provide a substrate processing system capable of increasing the number of substrates processed per unit time.

A substrate processing system according to the present invention includes a mounting table on which a wafer storage pod capable of storing a plurality of substrates is mounted , a substrate processing unit for processing a substrate, a circulation belt, and a plurality of substrates in a vertical direction. a substrate receiving portion and a plurality of substrate housing mechanism for housing by spaced apart from each other, each substrate accommodating mechanism is attached to the endless belt, wherein each substrate accommodating mechanism by the circulating belt is moved A substrate housing portion that is movable, a drive portion that drives each substrate housing mechanism of the substrate housing portion, a wafer storage pod placed on the mounting table, and each substrate of the substrate housing portion a first substrate transport device for transporting the substrate between the accommodating mechanism, the second substrate transfer apparatus for transferring a substrate between each substrate accommodating mechanism of the substrate processing unit the substrate retainer And be prepared Each of the substrate accommodation mechanisms of the substrate accommodation unit includes a first substrate delivery position where the substrate is conveyed and taken out by the first substrate conveyance device, and a substrate is conveyed by the second substrate conveyance device. The drive unit is configured to be moved between second substrate delivery positions where the substrate is taken out.

  According to such a substrate processing system, a plurality of substrate accommodation mechanisms are provided, and each substrate accommodation mechanism conveys and takes out a substrate by the first substrate conveyance device and the second substrate conveyance device. Since each substrate transfer position is moved, one of the first substrate transfer device and the second substrate transfer device accesses the other substrate transfer mechanism while the other substrate transfer device accesses the other substrate transfer mechanism. The other substrate transfer device can access the substrate accommodation mechanism, and when a plurality of substrate transfer devices access the substrate accommodation mechanism, these substrate transfer devices are prevented from being congested. Can do. As a result, the first substrate transfer device and the second substrate transfer device can efficiently access the substrate accommodation mechanism, so that the substrate processing system increases the number of substrates processed per unit time. Will be able to.

  In the substrate processing system of the present invention, a plurality of the substrate processing units are provided, and each substrate processing unit is divided into a plurality of groups provided along the vertical direction, and the second The substrate transfer apparatus is provided in a plurality of stages in the vertical direction so as to correspond to the groups in the vertical direction, and each second substrate transfer apparatus includes a substrate processing unit and a substrate storage unit of the corresponding group. A substrate is transported to and from the substrate accommodation mechanism, and each substrate accommodation mechanism of the substrate accommodation unit receives a first substrate from which the substrate is conveyed or taken out by the first substrate conveyance device. A plurality of substrates are provided in the vertical direction in which the substrate is conveyed and taken out by each of the second substrate conveyance devices provided in a plurality of stages in the vertical direction. It is preferably adapted to be moved by the drive unit between the second substrate delivery position.

  According to such a substrate processing system, the substrate is transported or taken out by each substrate storage mechanism by the first substrate transport device or each second substrate transport device provided in a plurality of stages in the vertical direction. Since each substrate transfer position is moved, one of the first substrate transfer device and each of the second substrate transfer devices accesses the one substrate accommodation mechanism. Other substrate transfer devices can access other substrate storage mechanisms, and when multiple substrate transfer devices access the substrate storage mechanism, these substrate transfer devices are prevented from becoming congested. can do. As a result, the first substrate transfer device and each of the second substrate transfer devices can efficiently access the substrate accommodation mechanism.

  In the substrate processing system of this invention, it is preferable that the said drive part can reverse each board | substrate accommodation mechanism of the said board | substrate accommodating part in the up-down direction. Thereby, the installation of the substrate reversing mechanism for reversing the substrate can be omitted.

  In this case, each of the first substrate transport device and the second substrate transport device transports the substrate and takes out the substrate with respect to the substrate housing mechanism inverted in the vertical direction in the substrate housing portion. It is more preferable to be able to. As a result, the first substrate transport device and the second substrate transport device can transport the substrate in an inverted state.

  More preferably, each substrate accommodation mechanism of the substrate accommodation unit is circulated and moved by the drive unit along a preset circulation path.

  Each substrate accommodation mechanism of the substrate accommodation unit has a gripping mechanism for sandwiching a substrate accommodated in the substrate accommodation mechanism from above and below, and the drive unit inverts the substrate accommodation mechanism in the up and down direction. More preferably, the substrate accommodated in the substrate accommodation mechanism is sandwiched from above and below by the gripping mechanism. Accordingly, even when the substrate accommodation mechanism is inverted in the vertical direction, the substrate accommodated in the substrate accommodation mechanism can be prevented from being accidentally dropped from the substrate accommodation mechanism.

  In the substrate processing system of the present invention, each substrate accommodation mechanism of the substrate accommodation unit can change the interval between adjacent substrates among the plurality of substrates accommodated in the substrate accommodation mechanism, The distance between the substrates accommodated in the substrate accommodation mechanism when the substrate accommodation mechanism is at the first substrate delivery position and the substrate accommodation mechanism when the substrate accommodation mechanism is at the second substrate delivery position. It is preferable that the distance between the substrates to be formed is different.

  In this case, the distance between the substrates accommodated in the substrate accommodation mechanism when the substrate accommodation mechanism is in the first substrate delivery position is at least large enough to be accessible by the first substrate transfer apparatus. The distance between the substrates accommodated in the substrate accommodation mechanism when the substrate accommodation mechanism is in the second substrate delivery position is at least large enough to be accessed by the second substrate transport apparatus. It is more preferable.

  In the substrate processing system of the present invention, the first substrate transfer device has a plurality of forks for holding the substrate along the vertical direction, and transfers the substrate to each substrate storage mechanism of the substrate storage unit. It is preferable that a plurality of substrates be transported simultaneously by the forks when the substrates are taken out from the substrate accommodation mechanisms. This makes it possible to more efficiently perform the operation of transporting the substrate to the substrate housing portion and taking out the substrate from the substrate housing portion by the first substrate transport device, and processing the substrate per unit time. The number of sheets can be increased.

  According to the substrate processing system of the present invention, the first substrate transfer device and the second substrate transfer device can efficiently access the substrate accommodation mechanism, and therefore, the number of processed substrates per unit time. Can be more.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 to 9 are diagrams showing a wafer processing system according to the present embodiment. 1 is a top view showing the configuration of the wafer processing system in the present embodiment, and FIG. 2 is a side view of the wafer processing system shown in FIG. 3 is a side view of the wafer accommodating portion of the wafer processing system shown in FIG. 1 as viewed from the line B-B, and FIG. 4 is a side view of the wafer processing system shown in FIG. FIG. FIGS. 5A to 5C are schematic side views showing the configuration of the wafer storage mechanism provided in the wafer storage unit of the wafer processing system shown in FIG. 6 is a perspective view of a fixed stage of the wafer accommodating mechanism shown in FIG. 5, FIG. 7 is a perspective view of a moving stage of the wafer accommodating mechanism shown in FIG. 5, and FIG. 8 is shown in FIG. It is a perspective view of the holding | maintenance stage of a wafer accommodation mechanism. FIG. 9 is a perspective view showing the configuration of the first wafer transfer device in the wafer processing system shown in FIG.

  As shown in FIG. 1 and the like, the wafer processing system 10 according to the present embodiment includes a plurality of (specifically, 12) wafers for performing a cleaning process, a drying process, etc. Wafer processing units (SPIN) 40, a wafer storage unit 30 for temporarily storing a plurality of wafers W, and a plurality of (for example, 25) wafers W horizontally at predetermined intervals in the vertical direction. And a FOUP (Front Opening Unified Pod) 20 that can be accommodated in the state. Here, the twelve wafer processing units 40 are divided into three groups provided in the vertical direction, and four wafer processing units 40 are provided in each of the upper group, the middle group, and the lower group. It is provided one by one. More specifically, as shown in FIG. 1, FIG. 2 and FIG. 4 (particularly FIG. 2), in the upper group, the wafer processing units 40a are provided so that there are two upper and lower stages and two in each stage. In the middle group, the wafer processing units 40b are provided so that there are two upper and lower stages and two in each stage. Similarly, in the lower group, the wafer processing units 40c are provided so that there are two upper and lower stages and two in each stage.

  In the wafer processing system 10, a first wafer transfer device 50 is provided between the FOUP 20 and the wafer container 30. The first wafer transfer apparatus 50 transfers the wafer W before being processed by the wafer processing unit 40 from the FOUP 20 to the wafer storage unit 30 and also transfers the wafer W processed by the wafer processing unit 40 from the wafer storage unit 30. It is conveyed to the hoop 20.

  As shown in FIGS. 1 and 2, etc., the wafer processing system 10 includes three second wafer transfer devices 60a in the vertical direction so as to correspond to the upper group, the middle group, and the lower group. , 60b, and 60c are provided. More specifically, the upper second wafer transfer device 60 a is provided so as to correspond to the upper group, and the wafer W is transferred between each wafer processing unit 40 a and the wafer container 30 of the upper group. It is designed to be transported. The middle second wafer transfer device 60b is provided to correspond to the middle group, so that the wafer W is transferred between each wafer processing unit 40b of the middle group and the wafer container 30. It has become. The lower second wafer transfer device 60c is provided so as to correspond to the lower group, and the wafer W is transferred between each wafer processing unit 40c of the lower group and the wafer container 30. It has become.

  Hereinafter, each component of the wafer processing system 10 will be described in detail.

  As shown in FIGS. 1 and 4, the wafer processing system 10 is provided with a mounting table 25 on which four hoops 20 are mounted in parallel. Each hoop 20 can accommodate a plurality of, for example, 25 wafers W stacked in a vertically spaced manner.

  Next, the wafer container 30 will be described with reference to FIGS. 3 and 5 to 8. As shown in FIG. 3 and the like, the wafer container 30 has an endless circulation belt 36 stretched between a pair of upper and lower pulleys 34 and 35 and a plurality of wafer accommodation mechanisms 32 attached to the circulation belt 36. is doing. Here, one pulley (for example, the lower pulley 35) of the pair of upper and lower pulleys 34 and 35 is provided with a drive motor 38, and the pulley 35 is driven to rotate by the drive motor 38, whereby the circulation belt 36 is provided. Circulates counterclockwise in FIG. As shown in FIG. 3, the circulation belt 36 circulates and moves along a circulation path extending along the vertical direction (vertical direction).

  As shown in FIG. 1, the wafer accommodating portion 30 is composed of a right portion 30a and a left portion 30b as viewed from the first wafer transfer apparatus 50 side (as viewed from the left in FIG. 1). As shown in FIG. 3, the circulation belt 36 is circulated so that the circulation belt 36 moves upward in the right portion 30a and the circulation belt 36 moves downward in the left portion 30b. Here, when the wafer accommodation mechanism 32 attached to the circulation belt 36 is moved by the left portion 30b of the wafer accommodation portion 30, the wafer accommodation mechanism 32 is inverted in the vertical direction.

  As shown in FIG. 3, the respective wafer accommodation mechanisms 32 are provided at equal intervals along the circulation belt 36. Each wafer accommodation mechanism 32 accommodates a plurality of wafers W separated from each other in the vertical direction. A specific configuration of the wafer accommodation mechanism 32 will be described with reference to FIGS.

  As shown in FIG. 5, the wafer accommodating mechanism 32 includes a side plate member 32a extending in the up-down direction, a plurality of fixed stages 32b attached to the side plate member 32a so as to be orthogonal to the side plate member 32a, and each of the fixed stages 32b. A plurality of moving stages 32c provided above and a plurality of pressing stages 32e provided above each moving stage 32c are provided. Here, the wafer W can be placed on each fixed stage 32b and each movable stage 32c. Further, the wafer accommodation mechanism 32 is provided with a moving stage drive shaft 32d extending in the vertical direction and a holding stage drive shaft 32f extending in the vertical direction, and each moving stage 32c is attached to the moving stage drive shaft 32d. Each pressing stage 32e is attached to a pressing stage drive shaft 32f.

Hereinafter, each component of the wafer accommodation mechanism 32 will be described in detail.
A plurality of connecting members (not shown) are provided at equal intervals on the circulation belt 36 of the wafer storage unit 30, and the side plate member 32 a is opposite to the surface on which the stages 32 b, 32 c, and 32 e are provided. A surface (left surface in FIG. 5) is detachably attached to the connecting member.

  Each fixed stage 32b has a base end (left end in FIG. 5) attached to the side plate member 32a. Here, each fixed stage 32b is attached to the side plate member 32a so that the distance between the fixed stages 32b (the distance in the vertical direction in FIG. 5) is the same. FIG. 6 is a perspective view showing the configuration of each fixed stage 32b. As shown in FIGS. 5 and 6, a plurality of wafer holding guide pins 32g are provided on the upper surface (front surface) of the fixed stage 32b, and the wafer W is placed on each wafer holding guide pin 32g of the fixed stage 32b. Can be held in.

  Each moving stage 32c is provided above the corresponding fixed stage 32b. Here, each moving stage 32c is attached to the moving stage drive shaft 32d so that the distance between the moving stages 32c (the distance in the vertical direction in FIG. 5) is the same. Each moving stage 32c is moved in synchronism in the vertical direction by a moving stage drive shaft 32d. That is, when each moving stage 32c is moved in the vertical direction by the moving stage drive shaft 32d, the distance between the moving stages 32c does not change. FIG. 7 is a perspective view showing the configuration of each moving stage 32c. As shown in FIGS. 5 and 7, a plurality of wafer holding guide pins 32g are provided on the upper surface (front surface) of the moving stage 32c, and the wafer W is placed on each wafer holding guide pin 32g of the moving stage 32c. Can be held in. A plurality of wafer holding guide pins 32h are also provided on the lower surface (back surface) of the moving stage 32c.

  Each pressing stage 32e is provided above the corresponding moving stage 32c. Each presser stage 32e is attached to a presser stage drive shaft 32f, and each presser stage 32e is moved in synchronization with the presser stage drive shaft 32f in the vertical direction. That is, when each pressing stage 32e is moved in the vertical direction by the pressing stage drive shaft 32f, the distance between the pressing stages 32e does not change. FIG. 8 is a perspective view showing the configuration of each pressing stage 32e. As shown in FIGS. 5 and 8, a plurality of wafer holding guide pins 32h are provided on the lower surface (back surface) of the pressing stage 32e. Then, as shown in FIG. 5C, each pressing stage 32e is placed on the moving stage 32c facing the pressing stage 32e when the pressing stage 32e is moved downward by the pressing stage drive shaft 32f. W can be pressed from above. At this time, the wafer W is held by the wafer holding guide pins 32h provided on the lower surface of the pressing stage 32e.

  As described above, each wafer accommodation mechanism 32 is moved along the circulation movement of the circulation belt 36 by the drive motor 38 and the pair of pulleys 34 and 35. Here, the drive motor 38, the pair of pulleys 34 and 35, and the circulation belt 36 constitute a drive unit that drives each wafer accommodation mechanism 32. As shown in FIGS. 3 and 4, each of the wafer accommodation mechanisms 32 includes a first wafer transfer position P where the wafer W is transferred and taken out by the first wafer transfer device 50, and a plurality of wafer receiving mechanisms P in the vertical direction. Between the plurality of second wafer transfer positions Q, R, and S provided in the vertical direction in which the wafers W are transferred and taken out by the respective second wafer transfer devices 60a, 60b, and 60c provided in stages. It can be moved by the drive unit. The drive motor 38 intermittently circulates the circulation belt 36. When each wafer accommodation mechanism 32 reaches each wafer transfer position P, Q, R, S, the circulation belt 36 is temporarily moved. It is supposed to stop. While the circulation belt 36 is temporarily stopped, the first wafer transfer device 50 and each of the second wafer transfer devices 60a, 60b, 60c are in the wafer transfer positions P, Q, R, S. The wafer storage mechanism 32 is accessed. Instead of the circulation belt 36 being intermittently circulated by the drive motor 38, the circulation belt 36 is continuously circulated by the drive motor 38, and each wafer receiving mechanism 32 is moved to each wafer transfer position P, Q, The circulation belt 36 may be decelerated when approaching R and S. In this case, as compared with the case where the circulation belt 36 is circulated and moved intermittently, the wafer accommodation mechanisms 32 can be moved more rapidly as much as the circulation belt 36 is not stopped. Hereinafter, the first wafer transfer position P and the second transfer positions Q, R, and S will be described with reference to FIGS.

  As shown in FIG. 3, the first wafer transfer position P and the second transfer positions Q, R, and S are provided on the right side portion 30 a of the wafer accommodating portion 30. Then, the first wafer delivery position P, the second wafer delivery position S, the second wafer delivery position R, and the second wafer delivery position are sequentially arranged from below along the circulation belt 36 in the right side portion 30a of the wafer accommodating portion 30. Each Q is provided. As shown in FIG. 3, the first wafer transfer device 50 is configured to transfer the wafer W to the wafer accommodating mechanism 32 at the first wafer transfer position P and take out the wafer W. Further, the upper second wafer transfer device 60a is configured to transfer the wafer W to the wafer accommodation mechanism 32 at the second wafer transfer position Q and take out the wafer W.

  The middle second wafer transfer device 60b is configured to transfer the wafer W to the wafer accommodation mechanism 32 at the second wafer transfer position R and take out the wafer W. Further, the lower second wafer transfer device 60c is configured to transfer the wafer W to the wafer accommodation mechanism 32 at the second wafer transfer position S and take out the wafer W. In FIG. 3, the first wafer transfer device 50 and the second wafer transfer devices 60a, 60b, and 60c are indicated by two-dot chain lines for the sake of explanation, but each wafer indicated by these two-dot chain lines. The transfer apparatus is merely shown in FIG. 3 for the purpose of explanation. Actually, each wafer transfer apparatus does not access each wafer accommodating mechanism 32 from the right side of FIG. Each wafer storage mechanism 32 is accessed from the front or back of the wafer.

  As described above, the wafer transfer positions P, Q, R, and S corresponding to the first wafer transfer device 50 and the second wafer transfer devices 60a, 60b, and 60c are different from each other in the vertical direction. At least two of the first wafer transfer device 50 and each of the second wafer transfer devices 60a, 60b, 60c can access the unit 30 at the same time. As a result, it is possible to prevent a situation in which another apparatus cannot access the wafer container 30 and must wait while one apparatus accesses the wafer container 30. become.

  Each wafer storage mechanism 32 can change the interval between adjacent wafers W among the plurality of wafers W stored in the wafer storage mechanism 32. More specifically, in each wafer accommodation mechanism 32, the movement stage drive shaft 32d moves each movement stage 32c in the vertical direction, whereby the vertical interval of each wafer W in the wafer accommodation mechanism 32 is changed. It becomes.

  More specifically, when the wafer accommodation mechanism 32 is in the first wafer transfer position P, each moving stage 32c of the wafer accommodation mechanism 32 is in a position as shown in FIG. On the other hand, while the wafer accommodation mechanism 32 moves from the first delivery position P to the second delivery position S, the movable stage drive shaft 32d moves each of the movable stages 32c in synchronization with, for example, the upper side, thereby moving the wafer accommodation mechanism. When 32 is in the second wafer transfer position Q, each moving stage 32c of the wafer accommodation mechanism 32 is in a position as shown in FIG. As a result, the distance between each fixed stage 32b and each movable stage 32c changes from the size of the distance b shown in FIG. 5B to the size of the distance a shown in FIG. Between each of the second wafer transfer positions Q, R, and S, each moving stage 32c does not move, and the interval in the vertical direction of the wafer W is kept constant. That is, even when the wafer accommodation mechanism 32 is at the second wafer delivery position Q, R, each moving stage 32c of the wafer accommodation mechanism 32 is in a position as shown in FIG. Meanwhile, while the wafer accommodation mechanism 32 moves from the first delivery position P to the second delivery position S, the movable stage drive shaft 32d may move each movable stage 32c in synchronization downward. .

  Thereafter, when the wafer accommodation mechanism 32 moves from the right side portion 30a of the wafer accommodation portion 30 to the left side portion 30b and the wafer accommodation mechanism 32 is inverted in the vertical direction, the movable stage drive shaft 32d moves each movable stage 32c downward. The holding stage drive shaft 32f moves each holding stage 32e downward, and moves each wafer W between the fixed stage 32b and the moving stage 32c or between the moving stage 32c and the holding stage as shown in FIG. 5C. 32e. More specifically, when the wafer accommodation mechanism 32 is inverted in the vertical direction, each wafer W is placed on the wafer holding guide pins 32g provided on the front surface of the fixed stage 32b and the back surface of the moving stage 32c. Between the wafer holding guide pins 32h provided or between the wafer holding guide pins 32g provided on the front surface of the moving stage 32c and the wafer holding guide pins 32h provided on the back surface of the holding stage 32e. Will be held. As a result, even if the wafer accommodation mechanism 32 is inverted in the vertical direction, the wafer W accommodated in the wafer accommodation mechanism 32 does not fall from the wafer accommodation mechanism 32 by mistake. As described above, the adjacent fixed stage 32b and the moving stage 32c, and the adjacent moving stage 32c and the pressing stage 32e constitute a holding mechanism for holding the wafer W stored in the wafer storing mechanism 32 from above and below, respectively. Will be.

  After the wafer accommodation mechanism 32 is inverted in the vertical direction, the adjacent fixed stage 32b and the moving stage 32c, or the adjacent moving stage 32c and the pressing stage 32e are separated from the state shown in FIG. 5C. It may be. In this case, even if the wafer accommodation mechanism 32 is inverted in the vertical direction, the first wafer conveyance device 50 and the second wafer conveyance devices 60a, 60b, and 60c hold the wafer W with respect to the wafer accommodation mechanism 32. It can be transported and taken out. At this time, the wafer W transferred and taken out by the respective wafer transfer apparatuses 50, 60a, 60b, and 60c is inverted. In this case, the wafer W is held by wafer holding guide pins 32h provided on the back surface of the moving stage 32c and the holding stage 32e.

  Next, specific configurations of the first wafer transfer device 50 and the second wafer transfer devices 60a, 60b, and 60c will be described. First, the configuration of the first wafer transfer apparatus 50 will be described with reference to FIGS. 1, 4, and 9.

  As shown in FIGS. 4 and 9, the first wafer transfer device 50 includes a base member 51 that runs on a rail 56 that extends in the Y direction in FIG. 1, and an upper surface of the base member 51. And a vertical movement mechanism 52 capable of expanding and contracting. A base 55 is provided above the vertical movement mechanism 52, and a fork support member 53 is attached to the base 55. The fork support member 53 supports a pair of forks 54 a and 54 b for holding the wafer W.

  Further, the vertical movement mechanism 52 can rotate in the θ direction with respect to the base member 51 as shown in FIG. 9. That is, the base 55 is configured to be able to move in the Y direction and the Z direction and to rotate in the θ direction. A pair of forks 54 a and 54 b are arranged over the base 55. Each of the forks 54a and 54b is configured to hold the wafer W from the back surface (from below). The fork support member 53 has horizontal moving mechanisms 53a and 53b attached to the base ends of the pair of forks 54a and 54b, respectively. The horizontal moving mechanisms 53a and 53b are respectively connected to the forks 54a and 54b shown in FIG. It is designed to move forward and backward in the X direction.

  The second wafer transfer devices 60a, 60b, and 60c also have substantially the same configuration as the first wafer transfer device 50, respectively. More specifically, as shown in FIG. 1, the bases 65a, 65b, and 65c provided in the second wafer transfer devices 60a, 60b, and 60c can be rotated in the θ direction, respectively. Yes. The bases 65a, 65b, and 65c are provided with fork support members 63a, 63b, and 63c, respectively, and the fork support members 63a, 63b, and 63c support a pair of upper and lower forks 64a, 64b, and 64c, respectively. (See FIG. 2). Each of the pair of upper and lower forks 64a, 64b, 64c holds the wafer W from the back surface (from below). Further, the pair of upper and lower forks 64a, 64b, 64c can be moved forward and backward from the fork support members 63a, 63b, 63c in the direction of the arrows in FIGS. Of the pair of forks 64a, 64b, and 64c, the upper forks 64a, 64b, and 64c are used when the processed wafer W is transferred from the wafer processing units 40a, 40b, and 40c to the wafer storage unit 30, and the lower forks 64a, 64b, and 64c are used. The forks 64a, 64b, and 64c are used when the unprocessed wafer W is transported from the wafer container 30 to the wafer processing units 40a, 40b, and 40c.

  Each wafer processing unit 40 is formed of a spin type that processes the wafers W one by one in the processing chamber. The wafer W is rotated in the processing chamber while the wafer W is being processed by the processing liquid. A gas treatment with a treatment gas or a treatment such as a cleaning treatment or a thermal treatment is performed.

  Next, the operation of the wafer processing system 10 having such a configuration will be described.

  First, the FOUP 20 containing, for example, 25 wafers W to be processed is mounted on the mounting table 25. Next, a window opening / closing mechanism (not shown) provided in the FOUP 20 is opened, and the wafer W in the FOUP 20 can be taken out. Then, the first wafer transfer device 50 approaches the hoop 20, and the pair of forks 54 a and 54 b of the first wafer transfer device 50 lifts and holds the wafer W in the hoop 20. At this time, two wafers W adjacent in the vertical direction in the hoop 20 are simultaneously taken out by the pair of forks 54a and 54b.

  Next, the two wafers W respectively held by the forks 54 a and 54 b of the first wafer transfer apparatus 50 are transferred to the wafer storage mechanism 32 of the wafer storage unit 30. At this time, at the first wafer transfer position P shown in FIGS. 3 and 4, the wafer W is transferred from the forks 54a and 54b of the first wafer transfer device 50 to the fixed stage 32b and the moving stage 32c of each wafer accommodation mechanism 32. Are delivered at the same time. At this time, the wafer accommodation mechanism 32 is in the form as shown in FIG. Further, as described above, the circulation belt 36 is circulated and moved continuously or intermittently by the drive motor 38. While the circulation belt 36 is decelerated or temporarily stopped, the first belt At the wafer delivery position P, the wafer W is delivered from the first wafer transfer device 50 to the wafer accommodation mechanism 32.

  When the wafer W is transferred from the wafer container 30 to the respective wafer processing units 40a, 40b, 40c, the second wafer transfer devices 60a, 60b, 60c corresponding to the wafer processing units 40a, 40b, 40c The wafer W is taken out from the wafer accommodation mechanism 32 at the wafer transfer positions Q, R, and S of FIG. At this time, when the wafer W on the fixed stage 32b is taken out, each moving stage 32c is lifted by the moving stage drive shaft 32d, and the wafer accommodation mechanism 32 has an embodiment as shown in FIG. Thus, the interval between each fixed stage 32b and each moving stage 32c increases from the size of the interval b shown in FIG. 5B, and becomes the size of the interval a shown in FIG. On the other hand, when the wafer W on the moving stage 32c is taken out, each moving stage 32c is lowered by the moving stage drive shaft 32d, and the interval between each moving stage 32c and each holding stage 32e becomes large. Further, as described above, the circulation belt 36 is circulated and moved continuously or intermittently by the drive motor 38. While the circulation belt 36 is decelerated or temporarily stopped, the second belt 36 is circulated. The wafer W is transferred from the wafer accommodation mechanism 32 to the second wafer transfer devices 60a, 60b, and 60c at the wafer transfer positions Q, R, and S, respectively.

  Thereafter, the wafers W are transferred from the respective second wafer transfer devices 60a, 60b, 60c to the corresponding wafer processing units 40a, 40b, 40c, and the wafers W are processed in the processing chambers of the wafer processing units 40a, 40b, 40c. Various processes are performed.

  The wafers W processed by the respective wafer processing units 40a, 40b, and 40c are transferred to the wafer storage mechanism 32 of the wafer storage unit 30 by the corresponding second wafer transfer devices 60a, 60b, and 60c. At this time, the wafers are transferred from the second wafer transfer devices 60a, 60b, and 60c to the wafer storage mechanism 32 of the wafer storage unit 30 at the respective second wafer transfer positions Q, R, and S. At this time, when the wafer W is transferred onto the fixed stage 32b, each moving stage 32c is lifted by the moving stage drive shaft 32d, and the wafer accommodating mechanism 32 is as shown in FIG. The interval between each fixed stage 32b and each moving stage 32c is the size of the interval a shown in FIG. On the other hand, when the wafer W is transferred onto the moving stage 32c, each moving stage 32c is lowered by the moving stage drive shaft 32d, and the interval between each moving stage 32c and each pressing stage 32e is increased.

  The wafer storage mechanism 32 to which the wafer W is transferred from each of the second wafer transfer devices 60a, 60b, and 60c moves from the right side portion 30a to the left side portion 30b of the wafer storage portion 30 in a state where the wafer W is stored. The vertical direction is reversed. Here, when the wafer accommodation mechanism 32 is inverted in the vertical direction, the movable stage drive shaft 32d moves the movable stages 32c downward and the press stage drive shaft 32f moves the press stages 32e downward. As shown in FIG. 5C, each wafer W is sandwiched between the fixed stage 32b and the moving stage 32c and between the moving stage 32c and the holding stage 32e. As a result, even if the wafer accommodation mechanism 32 is inverted in the vertical direction, the wafer W accommodated in the wafer accommodation mechanism 32 does not fall from the wafer accommodation mechanism 32 by mistake.

  The first wafer transfer device 50 and the second wafer transfer devices 60a, 60b, and 60c transfer the wafer W to the wafer storage mechanism 32 in a state where the wafer storage mechanism 32 is inverted in the vertical direction. When the movable stage drive shaft 32d moves each movable stage 32c and the pressing stage drive shaft 32f moves each pressing stage 32e, the fixed stage 32b and the moving stage 32c adjacent to each other, or the adjacent movement. The stage 32c and the holding stage 32e are separated from each other. In this case, the wafer W is held by the wafer holding guide pins 32h provided on the back surface of the moving stage 32c and the holding stage 32e.

  Thereafter, when the wafer accommodation mechanism 32 reaches the first wafer transfer position P, the wafer accommodation mechanism 32 takes a form as shown in FIG. At the first wafer transfer position P, the first wafer transfer device 50 accesses the wafer storage mechanism 32 of the wafer storage unit 30 and takes out the wafer W from the wafer storage mechanism 32. More specifically, the first wafer transfer device 50 approaches the wafer storage mechanism 32 of the wafer storage unit 30 at the first wafer transfer position P, and a pair of forks 54a, 54b of the first wafer transfer device 50 is obtained. Lifts and holds the wafer W on the stationary stage 32b and the moving stage 32c of the wafer accommodation mechanism 32, respectively. Thereafter, the two wafers W respectively held on the forks 54 a and 54 b of the first wafer transfer device 50 are simultaneously transferred to the FOUP 20.

  In this way, a series of processes for the wafer W in the wafer processing system 10 is completed.

  In the wafer processing method as described above, after the unprocessed wafer W is taken out from the fixed stage 32b or the moving stage 32c of the wafer accommodating mechanism 32 by the second wafer transfer devices 60a, 60b, 60c, When the wafer W is processed by the wafer processing units 40a, 40b, and 40c and returned to the wafer accommodating mechanism 32 by the second wafer transfer devices 60a, 60b, and 60c, the fixed stage 32b and the moving stage 32c at the same position are returned. It may be returned to. Alternatively, the fixed stage on which the wafer W is not placed after the unprocessed wafer W is taken out from the fixed stage 32b of the wafer accommodating mechanism 32 or the moving stage 32c by the second wafer transfer devices 60a, 60b, 60c. The wafer W may be transferred from different second wafer transfer devices 60a, 60b, 60c with respect to 32b and the moving stage 32c.

  As described above, according to the wafer processing system 10 of the present embodiment, the wafer accommodating unit 30 is provided with a plurality of wafer accommodating mechanisms 32 that accommodate a plurality of wafers W separated from each other in the vertical direction. The wafer accommodation mechanism 32 is movable. Then, each wafer accommodating mechanism 32 is configured such that the wafer W is transferred by the first wafer transfer position P where the wafer W is transferred or taken out by the first wafer transfer device 50 and the second wafer transfer devices 60a, 60b, 60c. Is moved by a drive unit (drive motor 38, a pair of pulleys 34 and 35, and a circulation belt 36) between second wafer transfer positions Q, R, and S where the toner is transferred and taken out.

  For this reason, one of the first wafer transfer device 50 and the second wafer transfer device 60a, 60b, 60c accesses one wafer storage mechanism 32 while the other wafer storage mechanism 32 is accessed. On the other hand, it becomes possible for the other wafer transfer device to access, and it is possible to prevent these wafer transfer devices from becoming congested when a plurality of wafer transfer devices access the wafer accommodating mechanism 32. As a result, the first wafer transfer device 50 and the second wafer transfer devices 60a, 60b, and 60c can efficiently access the wafer accommodating mechanism 32, so that the wafer processing system 10 can perform unit time. The number of processed wafers W can be increased.

  In particular, in the present embodiment, a plurality of wafer processing units 40 are provided, and each wafer processing unit 40 has a plurality of groups (specifically, an upper group and a middle group) provided along the vertical direction. The second wafer transfer devices 60a, 60b, 60c are provided in a plurality of stages in the vertical direction so as to correspond to the groups in the vertical direction. Yes. The second wafer transfer positions Q, R, and S are vertically moved so that the wafer W is transferred and taken out by each of the second wafer transfer devices 60a, 60b, and 60c provided in a plurality of stages in the vertical direction. A plurality are provided in the direction. The wafer accommodating mechanism 32 of the wafer accommodating unit 30 is moved by the driving unit between the first wafer delivery position P and a plurality of second wafer delivery positions Q, R, and S provided in the vertical direction. It has become. For this reason, while one of the plurality of second wafer transfer devices 60a, 60b, 60c accesses one wafer storage mechanism 32, the other wafer storage mechanism 32 has another The second wafer transfer device can be accessed, and when the plurality of second wafer transfer devices access the wafer accommodating mechanism 32, the second wafer transfer device is prevented from being congested. can do. As a result, the plurality of second wafer transfer devices can efficiently access the wafer accommodation mechanism 32.

  In addition, the drive unit including the drive motor 38, the pair of pulleys 34 and 35, and the circulation belt 36 can reverse each wafer storage mechanism 32 of the wafer storage unit 30 in the vertical direction. Thereby, the installation of the wafer reversing mechanism for reversing the wafer W can be omitted.

  In this case, the first wafer transfer device 50 and the second wafer transfer devices 60a, 60b, and 60c each transfer the wafer W to the wafer storage mechanism 32 that is inverted in the vertical direction in the wafer storage unit 30. The wafer W can be taken out. Thus, the first wafer transfer device 50 and the second wafer transfer devices 60a, 60b, and 60c can transfer the wafer W in the inverted state.

  Further, the first wafer transfer device 50 has a plurality of (specifically, for example, two) forks 54 a and 54 b for holding the wafer W in the vertical direction, and the wafer W is placed in the wafer container 30. A plurality of (for example, two) wafers W are simultaneously transferred by the respective forks 54a and 54b when the wafers W are transferred or taken out from the wafer storage unit 30. As a result, the operation of transferring the wafer W to the wafer holder 30 and taking out the wafer W from the wafer holder 30 by the first wafer transfer device 50 can be performed more efficiently. The number of processed wafers W can be increased.

  The wafer processing system according to the present embodiment is not limited to the above aspect, and various changes can be made. For example, the wafer container is not limited to the structure shown in FIGS. As a wafer accommodating portion, a plurality of wafer accommodating mechanisms for accommodating a plurality of wafers W spaced apart from each other in the vertical direction are used. You can also Even when a wafer storage unit having another configuration is used, each wafer storage mechanism of the wafer storage unit includes a first wafer transfer position at which the wafer is transferred and taken out by the first wafer transfer device, and a first wafer transfer position. It is desirable that the wafer is moved between the second wafer transfer positions where the wafer is transferred or taken out by the two wafer transfer devices.

  Further, the wafer accommodation mechanism is not limited to the structure shown in FIGS. 5 to 8, particularly FIG. As the wafer accommodation mechanism, any other configuration can be used as long as it can accommodate a plurality of wafers W separated from each other in the vertical direction. Even in this case, the wafer accommodating mechanism can change the interval between adjacent wafers among the plurality of wafers accommodated in the wafer accommodating mechanism, and the wafer accommodating mechanism can change the first wafer delivery. The interval between the wafers accommodated in the wafer accommodation mechanism when in the position is different from the interval between the wafers accommodated in the wafer accommodation mechanism when the wafer accommodation mechanism is in the second wafer transfer position. It is more desirable.

It is a top view which shows the structure of the wafer processing system in one embodiment of this invention. It is a side view by the AA line arrow of the wafer processing system shown in FIG. It is a side view by the BB line arrow of the wafer accommodating part of the wafer processing system shown in FIG. It is a side view by the CC line arrow of the wafer processing system shown in FIG. (A)-(c) is a schematic side view which shows the structure of the wafer accommodating mechanism provided in the wafer accommodating part of the wafer processing system shown in FIG. FIG. 6 is a perspective view of a fixed stage of the wafer accommodation mechanism shown in FIG. 5. FIG. 6 is a perspective view of a moving stage of the wafer accommodation mechanism shown in FIG. 5. FIG. 6 is a perspective view of a holding stage of the wafer accommodation mechanism shown in FIG. 5. It is a perspective view which shows the structure of the 1st wafer conveyance apparatus in the wafer processing system shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Wafer processing system 20 Hoop 25 Mounting base 30 Wafer accommodating part 30a Right side part 30b Left side part 32 Wafer accommodating mechanism 32a Side plate member 32b Fixed stage 32c Moving stage 32d Moving stage drive shaft 32e Holding stage 32f Holding stage driving shaft 32g Wafer holding guide pin 32h Wafer holding guide pins 34, 35 Pulley 36 Circulating belt 38 Drive motor 40 Wafer processing unit 40a Upper wafer processing unit 40b Middle wafer processing unit 40c Lower wafer processing unit 50 First wafer transfer device 51 Base member 52 Vertical movement Mechanism 53 Fork support members 53a, 53b Horizontal movement mechanisms 54a, 54b Fork 55 Base 56 Rails 60a, 60b, 60c Second wafer transfer devices 63a, 63b, 63c Fork support Members 64a, 64b, 64c forks 65a, 65b, 65c base

Claims (9)

A mounting table on which a wafer storage pod capable of storing a plurality of substrates is mounted;
A substrate processing unit for processing a substrate;
And endless belt, a substrate receiving portion and a plurality of substrate housing mechanism for housing by spaced apart from each other a plurality of substrates in a vertical direction, each of the substrate accommodating mechanism is attached to said endless belt, said endless belt a substrate receiving portion, such as the respective substrate accommodating mechanism is movable by but moving,
A drive unit for driving each substrate housing mechanism of the substrate housing unit;
A first substrate transport device for transporting a substrate between the wafer storage pod placed on the mounting table and each substrate housing mechanism of the substrate housing portion;
A second substrate transport device for transporting a substrate between the substrate processing unit and each substrate housing mechanism of the substrate housing portion;
With
Each substrate accommodation mechanism of the substrate accommodation unit includes a first substrate delivery position where the substrate is conveyed or taken out by the first substrate carrying device, and a substrate is carried or taken out by the second substrate carrying device. The substrate processing system is configured to be moved by the driving unit between the second substrate transfer positions. A plurality of the substrate processing units are provided, and each substrate processing unit is divided into a plurality of groups provided along the vertical direction,
The second substrate transport apparatus is provided in a plurality of stages in the vertical direction so as to correspond to the groups in the vertical direction, and each second substrate transport apparatus includes the substrate processing unit and the substrate in the corresponding group The substrate is transported between each substrate accommodation mechanism of the accommodation unit,
Each of the substrate accommodation mechanisms of the substrate accommodation unit includes a first substrate delivery position where the substrate is conveyed and taken out by the first substrate conveyance device, and each of the second substrates provided in a plurality of stages in the vertical direction. 2. The drive unit is configured to be moved between a plurality of second substrate transfer positions provided in a vertical direction in which substrates are respectively transferred and taken out by a substrate transfer device. The substrate processing system as described.   The substrate processing system according to claim 1, wherein the driving unit is configured to be able to reverse each substrate accommodation mechanism of the substrate accommodation unit in the vertical direction.   The first substrate transport device and the second substrate transport device can transport the substrate and take out the substrate with respect to the substrate housing mechanism inverted in the vertical direction in the substrate housing portion, respectively. The substrate processing system according to claim 3, wherein:   5. The substrate processing system according to claim 3, wherein each substrate accommodation mechanism of the substrate accommodation unit is circulated and moved by the drive unit along a preset circulation path.   Each substrate accommodation mechanism of the substrate accommodation unit has a gripping mechanism for sandwiching a substrate accommodated in the substrate accommodation mechanism from above and below, and the driving unit reverses the substrate accommodation mechanism in the up and down direction. 6. The substrate processing system according to claim 3, wherein a substrate accommodated in the substrate accommodation mechanism is sometimes sandwiched from above and below by the gripping mechanism.   Each substrate accommodation mechanism of the substrate accommodation unit can change the interval between adjacent substrates among the plurality of substrates accommodated in the substrate accommodation mechanism. The interval between the substrates accommodated in the substrate accommodation mechanism when in the substrate delivery position is different from the interval between the substrates accommodated in the substrate accommodation mechanism when the substrate accommodation mechanism is in the second substrate delivery position. The substrate processing system according to claim 1, wherein the substrate processing system is configured as follows.   The interval between the substrates accommodated in the substrate accommodation mechanism when the substrate accommodation mechanism is in the first substrate delivery position is at least large enough to be accessible by the first substrate transfer device. The distance between the substrates accommodated in the substrate accommodation mechanism when the substrate accommodation mechanism is in the second substrate delivery position is at least large enough to be accessible by the second substrate transport apparatus. The substrate processing system according to claim 7.   The first substrate transport device has a plurality of forks for holding a substrate in the vertical direction, and transports the substrate to each substrate housing mechanism of the substrate housing portion and takes out the substrate from each substrate housing mechanism. 9. The substrate processing system according to claim 1, wherein a plurality of substrates are simultaneously transported by the respective forks when performing the process.

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