JP5006394B2 - 極疎水性表面加工方法 - Google Patents
極疎水性表面加工方法 Download PDFInfo
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 21
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- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 5
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F17/00—Multi-step processes for surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by subclass C21D or C22F or class C25
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/006—Nanostructures, e.g. using aluminium anodic oxidation templates [AAO]
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- ing And Chemical Polishing (AREA)
Description
本発明の他の目的は、前記極疎水性表面加工方法を通じて微細ホールを有する金属基材から負極複製することによって、極疎水性表面構造物を有する固体基材を提供することにある。
その結果、非ぬれ性高分子固体基材19の表面は金属基材13表面のマイクロメートル単位の凹凸15とナノメートル単位直径の突出柱19bを有することによって極疎水性の表面構造物を有する高分子固体基材19の形成が可能である。
まず、大きさ50mm×40mmの産業用アルミニウム(99.5%)試片を準備し、500メッシュ(つまり、50μm直径)サンド粒子を準備した後、圧縮空気を用いたノズルからこれらサンド粒子を前記アルミニウム試片に向かって噴射した。この時、圧縮空気の圧力は6kgf/cm2であり、サンドブラスティング段階は20回往復した。サンドプルラスティングが完了した後、アルミニウム試片をアセトンに10分間漬けて脱イオン水で濯いで洗浄した。
固体表面で水滴の接触角を測定するために表面分析器であるDSA-100(Kruss Co.)のsessile drop methodが使用され、これを通じて極疎水性ナノ構造物の表面を分析した。4mLの脱イオン水水滴の定常状態接触角を測定し、常温で1つの試片当たり最小5point異常の接触角を測定した。
図11は一般産業用アルミニウムとサンドブラスティング処理されたアルミニウム、そしてサンドブラスティングされた後に陽極酸化処理された多孔性アルミナの表面SEMイメージを示す。図11(a)は一般産業用アルミニウム表面を示し、図11(b)はサンドブラスティングされたアルミニウム表面のマイクロスケールの凹凸を示す。そして、図11(c)はサンドブラスティングされた後に陽極酸化処理された多孔性アルミナの表面を示す。この時、陽極酸化は0.3Mシュウ酸と40Vの定電圧、そして15℃下で4分間進められた。
図13は接触角測定結果を示すものであるが、図13(a)はサンドブラスティング処理されたテフロン複製体表面での接触角として135°を示し、図13(b)はサンドブラスティングされた後に陽極酸化処理されたテフロン複製体表面での接触角で165°を示す。テフロンの固有接触角が120°であるので、マイクロスケールとナノスケールの構造を同時に有するデュアルスケール構造物が表面の疎水性を向上したことが分かる。前記接触角は平均測定値を示し、誤差は2°以内である。
11 微細粒子
13、13b、13c 金属基材
13a 表面
14 陽極酸化部分
15 微細凸凹
15a 凸部
15b 凹部
17 極微細ホール
18 非ぬれ性高分子負極複製体
19 高分子固体基材
19a ベース
19b 突出柱
20 陽極酸化装置
21 本体
23 電解液
25 電源供給部
30 負極複製装置
32 非ぬれ性物質
33 受容部
35 冷却部
Claims (7)
- 粒子噴射器の噴射ノズルを金属基材の表面と対向するように位置させる段階;
前記粒子噴射器を駆動して微細粒子を前記金属基材の表面に噴射してマイクロスケールの微細凹凸を形成する段階;
前記金属基材を陽極酸化加工処理して、その表面に複数個のナノスケールの微細ホール(hole)からなる正極形状を有する陽極酸化部分を形成する段階;
前記金属基材を非ぬれ性高分子物質に浸漬して凝固させることで前記正極形状を有する陽極酸化部分に対応する負極形状の表面を有する負極複製体を形成する段階;及び
前記負極複製体から前記金属基材と陽極酸化物を湿式エッチングで除去してマイクロスケールの凹凸にナノスケールの突出柱が形成されたデュアルスケールの極疎水性表面構造物を形成する段階;
を含み、
前記微細ホールの縦横比は3乃至10の範囲に属するように形成し、
前記粒子噴射器に使用される粒子は直径が50乃至180μmの範囲に属し、
前記微細ホールの直径は35乃至200nmの範囲に属するように形成することを特徴とする極疎水性表面加工方法。 - 前記微細ホールの縦横比は5乃至7.5の範囲に属するように形成することを特徴とする、請求項1に記載の極疎水性表面加工方法。
- 前記非ぬれ性高分子物質はPTFE(ポリテトラフルオロエチレン)、FEP(フッ化エチレンプロピレン)及びPFA(パーフルオロアルコキシ)からなる群より選択された少なくともいずれか一つの物質であることを特徴とする、請求項1に記載の極疎水性表面加工方法。
- 前記金属基材はアルミニウム(Al)材質からなることを特徴とする、請求項1に記載の極疎水性表面加工方法。
- 前記金属基材は金属材料からなることを特徴とする、請求項1に記載の極疎水性表面加工方法。
- 前記粒子噴射器は砂粒子を噴射するサンドブラスター(sand blaster)であることを特徴とする、請求項1に記載の極疎水性表面加工方法。
- 前記粒子噴射器は微細金属球を噴射する粒子噴射器であることを特徴とする、請求項1に記載の極疎水性表面加工方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2006-0063101 | 2006-07-05 | ||
KR20060063101 | 2006-07-05 | ||
PCT/KR2007/003276 WO2008004828A1 (en) | 2006-07-05 | 2007-07-05 | Method for fabricating superh ydrophob ic surface and solid having superhydrophobic surface structure by the same method |
Publications (2)
Publication Number | Publication Date |
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JP2009542906A JP2009542906A (ja) | 2009-12-03 |
JP5006394B2 true JP5006394B2 (ja) | 2012-08-22 |
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Application Number | Title | Priority Date | Filing Date |
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JP2009517998A Active JP5006394B2 (ja) | 2006-07-05 | 2007-07-05 | 極疎水性表面加工方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100028615A1 (ja) |
EP (1) | EP2038452B1 (ja) |
JP (1) | JP5006394B2 (ja) |
KR (1) | KR100889619B1 (ja) |
CN (1) | CN101484612B (ja) |
WO (1) | WO2008004828A1 (ja) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100824712B1 (ko) * | 2006-09-21 | 2008-04-24 | 포항공과대학교 산학협력단 | 극소수성 표면 구조물을 갖는 고체기재의 가공방법 및 이를이용한 극소수성 유체 이송관 |
KR100961282B1 (ko) | 2008-03-14 | 2010-06-03 | 포항공과대학교 산학협력단 | 친수성 표면과 소수성 표면을 갖는 멤브레인의 제조방법 |
KR100927729B1 (ko) * | 2008-03-14 | 2009-11-18 | 포항공과대학교 산학협력단 | 담금법을 이용한 소수성 표면을 갖는 3차원 형상 구조물의제조방법 |
KR101033273B1 (ko) * | 2008-03-27 | 2011-05-09 | 서울대학교산학협력단 | 초소수성 폴리머 구조물의 제조 |
US11786036B2 (en) | 2008-06-27 | 2023-10-17 | Ssw Advanced Technologies, Llc | Spill containing refrigerator shelf assembly |
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EP2346678B1 (en) | 2008-10-07 | 2017-10-04 | Ross Technology Corporation | Spill resistant surfaces having hydrophobic and oleophobic borders |
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KR101045101B1 (ko) * | 2009-03-10 | 2011-06-29 | 포항공과대학교 산학협력단 | 극친수성 표면 가공 방법 및 이 방법에 의해 제조된 극친수성 표면을 가지는 금속 기재 |
US9074778B2 (en) | 2009-11-04 | 2015-07-07 | Ssw Holding Company, Inc. | Cooking appliance surfaces having spill containment pattern |
KR101219785B1 (ko) * | 2009-12-31 | 2013-01-10 | 한국생산기술연구원 | 바이오 필름 형성 방지용 기판 및 상기 기판의 제조 방법 |
CN101785629A (zh) * | 2010-03-02 | 2010-07-28 | 浙江大学 | 用于制备不粘锅的具有特定表面结构的材料 |
EP2547832A4 (en) | 2010-03-15 | 2016-03-16 | Ross Technology Corp | PISTON AND METHODS FOR PRODUCING HYDROPHOBIC SURFACES |
CN103261886B (zh) * | 2010-11-19 | 2015-08-19 | 韩国生产技术研究院 | 使用胶体纳米颗粒的用于防止生物膜形成的基板及其制备方法 |
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EP2038452B1 (en) | 2016-05-18 |
JP2009542906A (ja) | 2009-12-03 |
EP2038452A1 (en) | 2009-03-25 |
KR100889619B1 (ko) | 2009-03-20 |
US20100028615A1 (en) | 2010-02-04 |
KR20080004410A (ko) | 2008-01-09 |
WO2008004828A1 (en) | 2008-01-10 |
CN101484612B (zh) | 2011-06-15 |
EP2038452A4 (en) | 2012-10-03 |
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