JP5004538B2 - Thermally conductive moisture-curing adhesive and its construction method - Google Patents

Description

  The present invention relates to a heat conductive moisture curable adhesive having excellent heat conductivity used for bonding glass panels of plasma displays, heat sinks of electronic devices, and the like, at the time of product repair and at the end of the product life cycle. The present invention relates to a heat conductive moisture curable adhesive that can be easily disassembled later.

In recent years, members such as glass panels for plasma displays, substrates on which high-intensity LEDs are mounted, and high-performance CPUs are becoming hot, and electronic devices that require heat dissipation in some way are increasing.
In particular, in the case of a plasma display, if temperature unevenness occurs in the glass panel, it also affects the color unevenness of the screen, so it is necessary to quickly release heat. As a countermeasure, generally, a method of bonding a glass panel and an aluminum frame with a double-sided adhesive tape having thermal conductivity is used. In this way, the heat generated in the glass panel is released to the aluminum frame, thereby suppressing a local temperature increase in the glass panel, uniforming the temperature of the glass panel, and suppressing color unevenness of the screen.

  As the double-sided pressure-sensitive adhesive tape having the above heat conductivity, an acrylic pressure-sensitive adhesive containing a heat conductive filler such as alumina or aluminum hydroxide is generally used. As the double-sided pressure-sensitive adhesive tape having, one that has been previously crosslinked to support the load of the panel is used.

  When repairing the plasma display glass panel and aluminum frame bonded using the double-sided adhesive tape with thermal conductivity described above or when dismantling after the end of the product life cycle, increase the temperature to weaken the adhesive strength. However, it is difficult to disassemble the double-sided pressure-sensitive adhesive tape having thermal conductivity because it is crosslinked as described above.

In view of these problems, instead of the double-sided pressure-sensitive adhesive tape having the above-mentioned thermal conductivity, thermoplastic elasticity comprising a styrenic elastic polymer, a tackifier, a softening agent such as paraffinic oil, and a thermal conductive material such as alumina. An adhesive sheet formed into a sheet shape using a heat dissipating composition has been proposed (see Patent Document 1).
In addition, in order to bond more firmly, a sheet using a thermoplastic elastic heat-dissipating composition comprising a styrene thermoplastic elastomer, a softening agent such as paraffinic oil, and a heat conductive material such as aluminum hydroxide. In addition, an adhesive layer formed on the surface thereof and formed into a sheet shape has been proposed (see Patent Document 2).
On the other hand, there is a proposal for bonding a glass panel of a plasma display and an aluminum frame using a black adhesive for the purpose of heat dissipation by thermal radiation (see Patent Document 3).

JP 2000-290615 A JP 2004-146106 A Japanese Patent Laid-Open No. 10-198287

When using a sheet of heat conductive material with adhesive properties softened by using a softening agent such as paraffinic oil on styrene rubber as described above for bonding the glass panel and aluminum frame of the plasma display, The environment in which the display is used varies, and when it is used at a temperature of 40 ° C. or higher, the temperature of the glass panel may rise to about 80 ° C., and in the future, plasma will become higher in resolution. In the display, since the heat generation amount is expected to further increase, there is a concern that the temperature will be 100 ° C. or higher. In this case, since the heat conducting material sheet uses a softening agent such as paraffinic oil, There was a problem because the holding power was not sufficient.
In addition, since the heat conductive material sheet having these adhesive properties, including the double-sided adhesive tape having the heat conductivity, is previously formed into a sheet shape, the adhesive composition is selected from the cost and yield when forming the sheet. There was also a problem that the burden on the running cost of the user was increased compared to using it in-line. Moreover, it has been a problem because it is difficult to reuse the release paper and release film used for protecting the adhesive surface, and it becomes industrial waste as it is.
In addition, when alumina is used as a filler, the hardness of the alumina particles is so high that parts that come into contact with an adhesive composition such as a kneader or a gear pump during manufacturing or sheeting process. This is also a factor that increases the manufacturing cost.
Similarly, when aluminum hydroxide is used, there is a problem of wear, and the thermal conductivity of these fillers is low, so that, for example, a thermal conductivity of 0.8 W / m · K or more can be achieved. was difficult.
On the other hand, a method has been proposed to increase heat dissipation by heat radiation using a black hot melt adhesive, but heat resistance holding power, thermal conductivity, etc. are not considered, only the adhesive has been blackened Then, it was difficult to achieve the above problems.

  The present invention has been made in view of the prior art as described above, and can be used, for example, for bonding a glass panel of a plasma display and an aluminum frame that require thermal conductivity, and has a heat resistance in a practical use temperature range. Has holding power, low running cost during mass production, has sufficient thermal conductivity to quickly diffuse the heat generation of the glass panel and move to the aluminum frame, and at the time of repair and after the end of product life cycle The object of the present invention is to provide a heat conductive moisture-curing adhesive having excellent heat conductivity that can be easily separated and disassembled by heating and melting.

  As a result of intensive studies to achieve the above object, the present inventor has obtained a prepolymer (A) having an isocyanate group terminal structure obtained by reacting a polymer diol (a-1) and a diisocyanate (a-2). And heat-conductive filler (B) as essential components, and the heat conductivity of the heat-conductive adhesive after moisture-curing is 0.8 W / m · in the range of 25 to 120 ° C. By using a heat-conducting moisture-curing adhesive that is K or higher, the heat conductivity is higher than that of a general heat-conducting double-sided adhesive tape that is generally used for bonding glass panels and aluminum frames of plasma displays. The present invention has also been found to have the advantage that it can be easily disassembled by heating at the time of repair or after the end of the product life cycle.

That is, the present invention includes [1] a prepolymer (A) having an isocyanate group terminal structure obtained by reacting a polymer diol (a-1) and a diisocyanate (a-2) and a heat conductive filler (B) as essential components. The heat conductive filler (B) is graphite, and its blending amount occupies 30 to 80% by weight, and the heat conductive moisture cured type after moisture curing. It is a heat conductive moisture curable adhesive having a thermal conductivity of 0.8 W / m · K or more in the range of 25 to 120 ° C.
The present invention also provides [2] the prepolymer (A) having an isocyanate group terminal structure which is solid at 25 ° C. and has a melt viscosity of 100 to 50,000 mPa · s at 120 ° C. ] The heat conductive moisture hardening type adhesive agent of description.
The present invention also [3] Po Rimmer diol (a-1) is a polyester diol of 1,6-hexanediol adipate polyester diol 1,4-butane diol, adipic acid, ethylene glycol adipate A polyester diol of 1,6-hexanediol / sebacic acid, a polyester diol of 1,4-butanediol / sebacic acid, a polyester diol of ethylene glycol / sebacic acid, and a number The heat conductive moisture curable adhesive according to the above [1] or [2] , wherein the average molecular weight is 1,000 to 5,000.
Moreover, this invention is described in any one of said [1] thru | or said [ 3 ] whose [ 4 ] diisocyanate (a-2) is one or more chosen from hexamethylene diisocyanate, diphenylmethane diisocyanate, and tolidine diisocyanate. This is a heat conductive moisture curable adhesive.
The present invention also provides [ 5 ] the heat conductive moisture-curable adhesive according to any one of [1] to [ 4 ] described above, which is heated and melted in the range of 100 to 150 ° C. and applied directly to the member. And it is the construction method of the heat conductive moisture hardening type adhesive agent which bonds another member in the state which reheated and apply | coated the applied adhesive to 100-150 degreeC.

According to the heat conductive moisture curable adhesive of the present invention, it has sufficient heat resistance holding force to hold a necessary load, and has higher heat conductivity than a commonly used heat conductive double-sided tape. At the same time, it is possible to provide a heat conductive moisture-curing adhesive having an advantage that it can be easily disassembled at the time of repair or after the end of the product life cycle.
Further, according to the construction method of the present invention, since the heat-melted adhesive is directly applied to the member, there is no need for a release paper or a release film for protection like a double-sided tape or a thermoplastic adhesive sheet. , Contribute to resource conservation and waste reduction.
In addition, according to the construction method of the present invention, since it is heated and melted for application and bonding, not only the adhesion to the member is good, but also it adheres to uneven members both during application and bonding. There are advantages.

Hereinafter, embodiments of the present invention will be specifically described.
As the polymer diol (a-1) used in the present invention, known and conventional ones such as polyester diol, polycaprolactone diol, polycarbonate diol, polytetramethylene ether glycol and polyethylene glycol can be used.

  The polymer diol (a-1) used in the present invention is solid at 25 ° C. in terms of rapid solidification and initial cohesion after the adhesive is heated and melted and applied to the member. preferable.

The polyester diol used in the present invention is obtained by esterifying a dicarboxylic acid and a glycol.
Examples of the dicarboxylic acid include known ones such as adipic acid, sebacic acid, succinic acid, phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, tetrahydrophthalic acid, tetrahydrophthalic anhydride, fumaric acid, maleic acid and the like.

  As glycols, ethylene glycol, neopentyl glycol, 1,4-butanediol, methylpentanediol, 1,6-hexanediol, butylethylpropanediol, 1,9-nonanediol, ethylene oxide or propylene oxide addition of bisphenol A Examples of the known and conventional ones.

  The polymer diol (a-1) used in the present invention is a polyester diol of 1,6-hexanediol / adipic acid, a polyester diol of 1,4-butanediol / adipic acid, a polyester diol of ethylene glycol / adipic acid, 1 , 6-Hexanediol / Sebacic acid polyester diol, 1,4-Butanediol / Sebacic acid polyester diol, Ethylene glycol / Sebacic acid polyester diol, fast solidification and onset of initial cohesion Therefore, it is preferable.

  The number average molecular weight of the polymer diol (a-1) used in the present invention is desirably 1,000 to 5,000. When the number average molecular weight is less than 1,000, the solidifying property of the adhesive is inferior, and when it exceeds 5,000, the viscosity when the thermally conductive filler (B) is mixed is high and the workability is inferior. The number average molecular weight was calculated from the hydroxyl value and the acid value as shown in the Examples.

  The diisocyanate (a-2) used in the present invention is tolylene diisocyanate, hydrogenated tolylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, tolidine diisocyanate, naphthalene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, hydrogenated. Xylylene diisocyanate, phenylene diisocyanate and the like can be used.

  The diisocyanate (a-2) used in the present invention is preferable because diphenylmethane diisocyanate, tolidine diisocyanate, and hexamethylene diisocyanate are rapidly solidified by crystallization.

  The prepolymer (A) having an isocyanate group terminal structure used in the present invention needs to react with the polymer diol (a-1) and the diisocyanate (a-2). The ratio during the reaction is preferably such that the polymer diol (a-1): diisocyanate (a-2) is from 1: 1.2 to 1: 2.5 (molar ratio). If the diisocyanate (a-2) is less than 1: 1.2, the viscosity at the time of mixing the thermally conductive filler (B) is high and workability is poor, and if it is more than 1: 2.5, the moisture curability is poor. Become.

  The prepolymer (A) having an isocyanate group terminal structure used in the present invention is usually solid at 25 ° C. and preferably has a melt viscosity of 100 to 50,000 mPa · s at 120 ° C. If the melt viscosity at 120 ° C. is less than 100 mPa · s, the solidification rate at the time of cooling is slow, and if it exceeds 50,000 mPa · s, the viscosity at the time of mixing the thermally conductive filler (B) is high and the workability is inferior. .

  As the thermally conductive filler (B) used in the present invention, known and commonly used materials such as graphite, aluminum hydroxide, aluminum oxide, zinc oxide, aluminum nitride, and boron nitride can be used.

  The graphite used in the present invention is not particularly limited as long as it is granular, and various shapes can be used, for example, flaky graphite, scaly graphite, earthy graphite, artificial graphite, expanded graphite, expanded graphite, and the like. . These graphites can be used alone or in admixture of two or more.

  Among these graphites, artificial graphite is high in purity and has low ash content that causes wear of pumps and nozzles. Therefore, when applying heat melt coating using an applicator consisting of a melting tank, a heat retaining hose, and a coating nozzle. It can be used suitably.

  The shape of the graphite is not particularly limited, but if a graphite or needle-like or mixture thereof is used, the heat-resistant holding force and the fluidity during heat-melt application of the moisture-curing adhesive may be balanced. Moreover, the particles having such a shape are easy to come into contact with each other in the binder, and are preferable from the viewpoint of heat conduction.

  The DBP (dibutyl phthalate) oil absorption of graphite is usually 30 ml / 100 g to 200 ml / 100 g, preferably 50 ml / 100 g to 160 ml / 100 g, and more preferably 60 ml / 100 g to 140 ml / 100 g. When the DBP oil absorption is less than 30 ml / 100 g, the binder component does not mix well, and the initial holding power and heat-resistant holding power tend to decrease. When the DBP oil absorption exceeds 200 ml / 100 g, the heat conductive moisture curing with graphite is added. There is a tendency that the viscosity of the mold adhesive becomes high and the fluidity at the time of heat-melt application of the heat conductive moisture-curing adhesive decreases.

The particle size of the graphite used in the present invention may be appropriately selected depending on the shape of the nozzle or die coater for applying the heat conductive moisture curable adhesive, the coating thickness of the roll coater, etc. However, from the viewpoint of thermal conductivity and fluidity at the time of heat-melt application of a moisture curable adhesive, the average particle diameter by analysis by ordinary laser diffraction is usually 0.5 to 250 μm, Preferably it is 1-200 micrometers, More preferably, it is 5-150 micrometers.
If the average particle size of graphite by laser diffraction method is less than 0.5μm, the viscosity of the heat conductive moisture curable adhesive containing graphite will be high and the fluidity of the heat conductive moisture curable adhesive during application will be reduced. In addition, the thermal conductivity tends to decrease, and if it exceeds 250 μm, the thermal conductivity is improved, but the initial holding force and the heat resistant holding force tend to be reduced.

The average aspect ratio of graphite used in the present invention is 1.2 to 20, preferably 1.5 to 10, and more preferably 2 to 5. When the average aspect ratio is less than 1.2, the heat conductivity of the moisture curable adhesive tends to be low, and the anisotropy of the heat conductivity tends to be small. On the other hand, when the average aspect ratio exceeds 20 and the anisotropy is large, the anisotropy increases, but the viscosity of the moisture curable adhesive increases, and the fluidity during heat-melt application tends to decrease.
Here, the average aspect ratio is an average value of the aspect ratio obtained from 50 graphite particle images randomly extracted by photographing graphite with an electron microscope, and the aspect ratio is the value of each graphite particle image. The ratio of the vertical length to the maximum length and the maximum length, that is, the aspect ratio = maximum length / maximum length The acicular degree of graphite obtained from the vertical length is shown.

  When the heat conductive filler (B) used in the present invention is graphite, the blending amount thereof needs to be 30 to 80% by weight, preferably 40 to 70% by weight. If the blending amount is less than 30% by weight, the obtained thermal conductivity is not sufficient, and if it exceeds 80% by weight, the fluidity as a moisture-curing adhesive tends to be low and sufficient workability tends not to be obtained. It is in.

In addition, when using the above heat-conductive moisture-curing adhesive for heat dissipation in applications where a slight temperature difference affects the performance such as image quality, such as in plasma displays, heat conduction is performed from the viewpoint of uniformity of the temperature of the glass panel. The heat conductivity of the moisture-curable adhesive is 0.8 W / m · K or more, more preferably 1.0 W / m · K or more.
Furthermore, it is preferable that the heat dissipation does not decrease even in a high temperature range, and in the future, in a plasma display with higher resolution, since the amount of heat generation is expected to increase further, there is a concern that the temperature of the glass panel temporarily becomes 100 ° C. or higher. Therefore, it is necessary to maintain 0.8 W / mK or more in the temperature range of 25 to 120 ° C.

  In the plasma display, the thermal conductivity of the coated surface of the glass panel is made higher in the surface direction than in the vertical direction, that is, the thermal conductivity of the adhesive is made more anisotropic. The surface temperature of the glass panel can be made uniform, which is preferable. If the above-described graphite having a high aspect ratio is used for the thermally conductive filler, the thermal conductivity can be made anisotropic.

  The heat conductive moisture curable adhesive may contain other substances as necessary within a range not deteriorating its performance. For example, flame retardants, dispersants, antioxidants, stabilizers, etc. These additives can also be blended.

  The heat conductive moisture curable adhesive of the present invention is directly applied to a member by heating and melting the adhesive in the range of 100 to 150 ° C. If this temperature is less than 100 ° C., the viscosity of the adhesive is high, it is difficult to apply uniformly, and the adhesion to the member becomes poor. Moreover, when this temperature exceeds 150 degreeC, it becomes inferior to stability of an adhesive agent and is not practical.

After the heat conductive moisture hardening type adhesive of this invention is apply | coated to a member, an other member is bonded together in the state which reheated the adhesive to 100-150 degreeC, and was made to fuse | melt. If this temperature is less than 100 ° C., a sufficient molten state cannot be obtained, so that it does not wet well with other members, resulting in poor adhesion. However, when the adhesive is heated to 50 ° C. or higher after being applied to the member, the adhesive will flow even if it does not show melting or meltability, and if other members can be bonded together, the temperature will be 50 ° C. or higher. You may reheat. Moreover, when this temperature exceeds 150 degreeC, much energy is required for a heating and it is not practical.
The pasting is preferably performed immediately after application, but the heat conductive moisture-curing adhesive can be reheated and pasted because the moisture-curing adhesive is not so advanced for several hours.

  The application method of the heat conductive moisture curable adhesive in the present invention is not particularly limited. For example, in the case of applying uniformly to a flat member such as a glass panel of a plasma display, a curtain coater or a roll coater. Etc. can be applied uniformly to the entire surface or part of the glass panel. In addition, when it is necessary to apply in a specific shape such as a dot shape, bead shape or spiral shape, an applicator consisting of a melting tank, a heat retaining hose, an application nozzle, etc. can be used to apply from a nozzle of any shape to the required site. can do.

  In the present invention, the moisture curable adhesive exhibits high holding power and thermal conductivity immediately after bonding, but for the purpose of further improving these, the bonded members may be heated and cured.

  Note that the moisture curable adhesive in the present invention has a releasability that has been pretreated in advance with a fluorine-based resin such as polytetrafluoroethylene, silicone, oligomer, or the like using a general method such as a die coater or a press. It can also be used after being applied to a certain plastic film or paper in an arbitrary shape and then transferred.

  The heat conductive moisture curable adhesive of the present invention can be separated and repaired by heating to 100 to 150 ° C. if it is before moisture curing (generally within several hours after bonding), Even after moisture curing, it can be easily separated and disassembled by heating at 180 to 350 ° C.

  Examples will be specifically described below, but the present invention is not limited to these examples. In the following, “parts” and “%” mean “parts by weight” and “% by weight” unless otherwise specified.

Example 1
In a flask equipped with a stirrer, thermometer, fractionator, moisture separator, reflux condenser, nitrogen inlet tube and vacuum apparatus, 1,348 parts of 1,6-hexanediol, 1,538 parts of adipic acid, tetrabutyl 0.05 parts of titanate was added, the temperature was raised to 230 ° C., dehydration condensation was performed at a reduced pressure of 20 mmHg for 12 hours, a hydroxyl value of 37, an acid value of 0.4, and a number average molecular weight of 3,000 (the number average molecular weight is the following ( The polyester diol of 1,6-hexanediol / adipic acid obtained from the formula (*) was obtained.
(formula*)
Number average molecular weight = 112,200 ÷ (hydroxyl value + acid value)
The effective number is the first two digits. Charge 1,000 parts of this polyester diol into a flask equipped with a stirrer, thermometer, reflux condenser and nitrogen inlet tube, and raise the temperature to 70 ° C while blowing nitrogen gas. After uniformly dissolving, 167 parts of diphenylmethane diisocyanate was added, the temperature was further raised to 105 ° C., and the temperature was kept for 2 hours. The NCO% was 2.3%, the white solid at room temperature 25 ° C., and the melt viscosity at 120 ° C. A prepolymer having an isocyanate group terminal structure of 6,800 mPa · s was obtained.
After preheating the heating kneader to 120 ° C., charging 500 parts of a prepolymer having an isocyanate group terminal structure and confirming that it was melted, graphite E015 (manufactured by Chuetsu Graphite Co., Ltd.) was used as the heat conductive filler (B). 500 parts of artificial graphite, an average particle diameter of about 135 μm by laser diffraction, and an average aspect ratio of 3.4) are added, and further mixed for 1 hour, defoamed for 10 minutes, and the amount of graphite is 50% by weight. A conductive moisture curable adhesive was obtained.

(Example 2)
In a flask equipped with a stirrer, thermometer, fractionator, water separator, reflux condenser, nitrogen inlet tube and vacuum apparatus, 1,103 parts of 1,6-hexanediol, 1,708 parts of sebacic acid, tetrabutyl 0.05 part titanate, heated to 230 ° C., dehydrated and condensed for 9 hours at a reduced pressure of 20 mmHg, 1,6-hexanediol / sebacin having a hydroxyl value of 37, an acid value of 0.2, and a number average molecular weight of 3,000 An acid polyester diol was obtained.
After 1,000 parts of this polyester diol was charged into a flask equipped with a stirrer, thermometer, reflux condenser and nitrogen inlet tube, the temperature of the system was raised to 70 ° C. while blowing nitrogen gas and dissolved uniformly, and then diphenylmethane Add 167 parts of diisocyanate, heat up to 105 ° C, hold for 2 hours, NCO% is 2.4%, white solid at room temperature 25 ° C, isocyanate group terminal with melt viscosity at 4,600 mPa · s at 120 ° C A prepolymer having a structure was obtained.
In the same manner as in Example 1, 700 parts of a prepolymer having an isocyanate group terminal structure and 300 parts of graphite E015 were blended to obtain a heat conductive moisture-curable adhesive having a blending amount of graphite of 30% by weight.

(Example 3)
A flask equipped with a stirrer, thermometer, fractionator, moisture separator, reflux condenser, nitrogen inlet tube and decompression device was charged with 799 parts of ethylene glycol, 2,078 parts of sebacic acid, and 0.05 parts of tetrabutyl titanate. The temperature was raised to 210 ° C., and dehydration condensation was carried out at a reduced pressure of 20 mmHg for 16 hours to obtain an ethylene glycol / sebacic acid polyester diol having a hydroxyl value of 111, an acid value of 0.3, and a number average molecular weight of 1,000.
The polyester diol was charged in a flask equipped with a stirrer, a thermometer, a reflux condenser and a nitrogen introduction tube, and the system was heated to 70 ° C. while blowing nitrogen gas. Add 302 parts of methylene diisocyanate, heat up to 105 ° C., keep it warm for 2 hours, NCO% is 4.9%, white solid at room temperature 25 ° C., isocyanate group terminal structure with melt viscosity at 120 ° C. of 530 mPa · s A prepolymer having was obtained.
In the same manner as in Example 1, 300 parts of a prepolymer having an isocyanate group terminal structure and 700 parts of AX-116 (manufactured by Micron Co., Ltd., spherical alumina, average particle diameter of 20 μm by laser diffraction) were blended. A heat conductive moisture-curable adhesive having a blending amount of 70% by weight was obtained.

Example 4
In a flask equipped with a stirrer, a thermometer, a fractionator, a water separator, a reflux condenser, a nitrogen introduction tube and a decompression device, 1164 parts of 1,4-butanediol, 1784 parts of adipic acid, tetrabutyl titanate 0.05 Charge part, heat up to 230 ° C., perform dehydration condensation for 9 hours at a reduced pressure of 20 mmHg, 1,4-butanediol adipic acid polyester diol having a hydroxyl value of 22, an acid value of 0.5, and a number average molecular weight of 5,000 Got.
After 1,000 parts of this polyester diol was charged into a flask equipped with a stirrer, thermometer, reflux condenser and nitrogen introduction tube, the temperature of the system was raised to 70 ° C. while blowing nitrogen gas and dissolved uniformly. Add 106 parts of diisocyanate, heat up to 105 ° C., hold for 2 hours, NCO% 1.5%, white solid at room temperature 25 ° C., end of isocyanate group with melt viscosity of 25,000 mPa · s at 120 ° C. A prepolymer having a structure was obtained.
In the same manner as in Example 1, 600 parts of a prepolymer having an isocyanate group terminal structure and 400 parts of graphite E015 were blended to obtain a heat conductive moisture-curable adhesive having a blending amount of graphite of 40% by weight.

(Example 5)
In a flask equipped with a stirrer, thermometer, fractionator, moisture separator, reflux condenser, nitrogen inlet tube and decompression device, 1,348 parts of 3-methyl-1,5-pentanediol, 1,538 adipic acid Parts, tetrabutyl titanate 0.05 parts, heated to 230 ° C., subjected to dehydration condensation at a reduced pressure of 20 mmHg for 9 hours, 2-methyl- having a hydroxyl value of 37, an acid value of 0.2, and a number average molecular weight of 3,000 A polyester diol of 1,5-pentanediol / adipic acid was obtained.
After 1,000 parts of this polyester diol was charged into a flask equipped with a stirrer, thermometer, reflux condenser and nitrogen inlet tube, the temperature of the system was raised to 70 ° C. while blowing nitrogen gas and dissolved uniformly, and then diphenylmethane 167 parts of diisocyanate was added, and the temperature was further raised to 105 ° C. and kept for 2 hours. The isocyanate group had an NCO% of 2.3%, a transparent water tank at room temperature of 25 ° C., and a melt viscosity at 120 ° C. of 4,300 mPa · s. A prepolymer having a terminal structure was obtained.
In the same manner as in Example 1, 500 parts of a prepolymer having an isocyanate group terminal structure and 500 parts of graphite E015 were blended to obtain a heat conductive moisture-curable adhesive having a blending amount of graphite of 50% by weight.

(Comparative Example 1)
After preheating the heating kneader to 180 ° C., 300 parts of Diana process oil NS-100 (manufactured by Idemitsu Kosan Co., Ltd., naphthenic process oil, 40 ° C. kinematic viscosity 102.7 mm ² / s) as a softening agent, styrene rubber 300 parts of Kraton G1650 (SEBS manufactured by Kraton Polymer Japan Co., Ltd., styrene / rubber ratio = 29/71 weight ratio), YS Polystar T145 (Yasuhara Chemical Co., Ltd. terpene phenol resin, softening point 145 ° C.) 400 And 10 parts of IRGANOX1010 (hindered phenol-based anti-aging agent manufactured by Ciba Specialty Chemicals Co., Ltd.) were mixed by heating for 4 hours, and after confirming that each material was melted, as graphite, E015 ( Man-made graphite manufactured by Chuetsu Graphite Co., Ltd., flat by laser diffraction Particle size of about 135 .mu.m, the average aspect ratio of 3.4) were 826 parts turned further 1 hour after mixing, subjected to 10 minutes of vacuum degassing, the amount of graphite to obtain a 45% by weight of a thermoplastic adhesive.

(Comparative Example 2)
The graphite of Comparative Example 1 was hydroxylated by the same method as Comparative Example 1 except that Heidilite H-42M (produced by Showa Denko KK, aluminum hydroxide, average particle diameter of about 1.1 μm by laser diffraction) was used. A thermoplastic pressure-sensitive adhesive having an aluminum content of 45% by weight was obtained.

(Comparative Example 3)
Except for the graphite of Comparative Example 1 being 1652 parts of AX-116 (manufactured by Micron Corp., spherical alumina, average particle diameter 20 μm by laser diffraction), the blending amount of spherical alumina is 62 wt. % Thermoplastic adhesive was obtained.

(Comparative Example 4)
1000 parts of Olivevine BPS5107-1 (manufactured by Toyo Ink Mfg. Co., Ltd., solid content 42%), an acrylic adhesive, 20 parts of Sumidur L-55E (polyisocyanate, solid content 55%) as a crosslinking agent, dilution solvent After adding 273 parts of methyl ethyl ketone and stirring well, 431 parts of AX-116 (manufactured by Micron Co., Ltd., spherical alumina, average particle diameter of 20 μm by laser diffraction) was added, and the mixture was stirred with a stirrer for 30 minutes.
Next, this solution was applied to a separator so that the thickness after drying was 1 mm, dried at room temperature 25 ° C. for 24 hours, and then dried at 40 ° C. for 2 hours to obtain a double-sided pressure-sensitive adhesive tape.

(Preparation of thermal conductive sheet for evaluation)
Originally, the moisture-curing adhesive in the present invention is applied to a necessary site from a nozzle of any shape using a roll coater or the like, using an applicator comprising a melting tank, a heat retaining hose, a coating nozzle, etc. However, both the heat-conductive moisture-curing adhesives of Examples 1 to 5 and the thermoplastic pressure-sensitive adhesives of Comparative Examples 1 to 3 are the double-sided pressure-sensitive adhesives of Comparative Example 4 for use in tests of various physical properties and the like. In order to compare in the same row as the tape, it was molded on a separator using a hot press at 120 ° C. so as to have a thickness of 1 mm. In addition, this test method does not limit the usage method of a moisture hardening type adhesive agent at all.

(Characteristic evaluation)
(A) Initial holding force Two aluminum plates having a width of 2.5 cm, a length of 10 cm, and a thickness of 0.5 mm are obtained by cutting a heat conductive sheet obtained by hot pressing into a width of 2.5 cm and a length of 2.5 cm. Are overlapped by 2.5 cm in width and 2.5 cm in length, and the moisture-curing adhesive sheet is pressed at 120 ° C, and the thermoplastic adhesive sheet and double-sided adhesive tape are pressed at 25 ° C. After two reciprocating pressure bondings, it was cooled to obtain a test piece. Immediately, the test piece was set at 25 ° C., a load of 20 g was applied in the shear direction, and the time until the load dropped was measured (maximum 24 hours).

(B) Heat resistant holding force A test piece was prepared in the same manner as the initial holding force. The moisture curable adhesive was further cured for one week at room temperature (25 ° C.). The test piece was set at 120 ° C., a load of 20 g was applied in the shear direction, and the time until the load dropped was measured (maximum 24 hours).

(C) Thermal conductivity The thermal conductive sheet obtained by hot pressing was punched into a circle with a diameter of 50 mm, and the thermal conductivity at 23 ° C. and 120 ° C. was measured according to ASTM E 1530. In the case of the moisture curable adhesive, it was cured at room temperature (25 ° C.) for one week before being punched and cured by moisture.

(D) Repair property The 1 mm thick heat conductive sheet obtained by hot pressing and the adhesive tape used as Comparative Example 4 were cut into a width of 2.5 cm and a length of 2.5 cm, and a width of 2.5 cm and a length of Moisture curable adhesive sheet is 120 ° C, thermoplastic adhesive sheet and double-sided adhesive tape so that two pieces of 10cm, 0.5mm thick aluminum plate overlap each other with 2.5cm width and 2.5cm length part Was pressure-bonded at room temperature (25 ° C.), then reciprocated twice with a 5 kg rubber roller and then cooled to obtain a test piece.
The obtained test piece was left in an atmosphere of 120 ° C. for 30 minutes and then taken out to room temperature (25 ° C.). Both ends of the test piece were immediately pulled with both hands wearing gloves to confirm separation (easy separation). What you can do is repairable afterwards). Two pieces of aluminum plate that were easily separated were evaluated as ○, and those that required a strong force for separation or those that were difficult to separate were evaluated as ×.

(E) Disassembling The 1 mm thick heat conductive sheet obtained by hot pressing and the adhesive tape used as Comparative Example 4 were cut into a width of 2.5 cm and a length of 2.5 cm, and a width of 2.5 cm and a length of Moisture curable adhesive sheet is 120 ° C, thermoplastic adhesive sheet and double-sided adhesive tape so that two pieces of 10cm, 0.5mm thick aluminum plate overlap each other with 2.5cm width and 2.5cm length part Was pressure-bonded at room temperature (25 ° C.), then cooled twice after being reciprocated with a 5 kg rubber roller, and a moisture-curing adhesive was further cured at room temperature (25 ° C.) for 1 week, and used as a test piece.
The obtained test piece was left in an atmosphere of 200 ° C. for 30 minutes and then taken out to room temperature (25 ° C.), and both ends of the test piece were immediately pulled with both hands wearing gloves to confirm the separability (easy separation). What you can do is easy to disassemble). Two pieces of aluminum plate that were easily separated were evaluated as ○, and those that required a strong force for separation or those that were difficult to separate were evaluated as ×.
The results of the above measurements obtained in Examples 1 to 5 and Comparative Examples 1 to 4 are shown together in Table 1 and Table 2 together with the formulation.

  As described above in the examples and comparative examples, according to the present invention, there is provided a heat conductive moisture curable adhesive that is excellent in initial holding power, heat resistant holding power, and thermal conductivity, and that can be repaired or disassembled by heating. It is clear that it is obtained.

  Because of the above advantages, the moisture-curable adhesive of the present invention can be used for bonding a glass panel and an aluminum frame of a plasma display. Furthermore, the moisture curable adhesive of the present invention has an excellent advantage that it can be easily repaired and disassembled as in the case of the thermoplastic pressure-sensitive adhesive sheet by heating regardless of the thermosetting resin. In addition, since the moisture curable adhesive of the present invention is applied directly to a member, industrial waste such as release paper and release film (separator) can be reduced, which is effective for resource protection and industrial waste reduction.

Claims (5)

A moisture curable adhesive comprising an isocyanate group-terminated prepolymer (A) obtained by reacting a polymer diol (a-1) and a diisocyanate (a-2) and a thermally conductive filler (B) as essential components. And the said heat conductive filler (B) is graphite, the compounding quantity occupies 30 to 80 weight% of the whole, and the heat conductivity of the heat conductive moisture hardening type adhesive after moisture hardening is 25. A thermally conductive moisture-curable adhesive that is 0.8 W / m · K or more in a range of ˜120 ° C.   The heat conductive moisture-curable adhesive according to claim 1, wherein the prepolymer (A) having an isocyanate group terminal structure is solid at 25 ° C and has a melt viscosity of 100 to 50,000 mPa · s at 120 ° C. The polymer diol (a-1) is 1,6-hexanediol / adipic acid polyester diol, 1,4-butanediol / adipic acid polyester diol, ethylene glycol / adipic acid polyester diol, 1,6-hexanediol -One or more selected from sebacic acid polyester diol, 1,4-butanediol, sebacic acid polyester diol, ethylene glycol sebacic acid polyester diol, and a number average molecular weight of 1,000 to 5,000 The heat-conductive moisture-curable adhesive according to claim 1 or 2 , wherein The heat conductive moisture-curable adhesive according to any one of claims 1 to 3 , wherein the diisocyanate (a-2) is one or more selected from hexamethylene diisocyanate, diphenylmethane diisocyanate, and tolidine diisocyanate. The heat conductive moisture curable adhesive according to any one of claims 1 to 4 is heated and melted in a range of 100 to 150 ° C and applied directly to a member, and the applied adhesive is applied to 100 to 150. A method for applying a heat conductive moisture-curing adhesive in which other members are bonded together in a state of being reheated to ° C and melted.