JP5002291B2 - 解析装置、プログラム、欠陥検査装置、レビュー装置、解析システム及び解析方法 - Google Patents

解析装置、プログラム、欠陥検査装置、レビュー装置、解析システム及び解析方法 Download PDF

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Publication number
JP5002291B2
JP5002291B2 JP2007067849A JP2007067849A JP5002291B2 JP 5002291 B2 JP5002291 B2 JP 5002291B2 JP 2007067849 A JP2007067849 A JP 2007067849A JP 2007067849 A JP2007067849 A JP 2007067849A JP 5002291 B2 JP5002291 B2 JP 5002291B2
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defect
inspection
recipe
information
defects
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JP2008224638A5 (enExample
JP2008224638A (ja
Inventor
眞 小野
潤子 小西
知弘 船越
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Priority to JP2007067849A priority Critical patent/JP5002291B2/ja
Priority to TW097106828A priority patent/TWI411774B/zh
Priority to US12/039,255 priority patent/US8290241B2/en
Publication of JP2008224638A publication Critical patent/JP2008224638A/ja
Publication of JP2008224638A5 publication Critical patent/JP2008224638A5/ja
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/22—Matching criteria, e.g. proximity measures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/761—Proximity, similarity or dissimilarity measures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00—Indexing scheme relating to image or video recognition or understanding
    • G06V2201/06—Recognition of objects for industrial automation

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Data Mining & Analysis (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Databases & Information Systems (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Medical Informatics (AREA)
  • General Health & Medical Sciences (AREA)
  • Computing Systems (AREA)
  • Multimedia (AREA)
  • Health & Medical Sciences (AREA)
  • Software Systems (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2007067849A 2007-03-16 2007-03-16 解析装置、プログラム、欠陥検査装置、レビュー装置、解析システム及び解析方法 Active JP5002291B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007067849A JP5002291B2 (ja) 2007-03-16 2007-03-16 解析装置、プログラム、欠陥検査装置、レビュー装置、解析システム及び解析方法
TW097106828A TWI411774B (zh) 2007-03-16 2008-02-27 解析裝置、程式、缺陷檢測裝置、評估裝置、解析系統及解析方法
US12/039,255 US8290241B2 (en) 2007-03-16 2008-02-28 Analyzing apparatus, program, defect inspection apparatus, defect review apparatus, analysis system, and analysis method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007067849A JP5002291B2 (ja) 2007-03-16 2007-03-16 解析装置、プログラム、欠陥検査装置、レビュー装置、解析システム及び解析方法

Publications (3)

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JP2008224638A JP2008224638A (ja) 2008-09-25
JP2008224638A5 JP2008224638A5 (enExample) 2009-09-17
JP5002291B2 true JP5002291B2 (ja) 2012-08-15

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JP2007067849A Active JP5002291B2 (ja) 2007-03-16 2007-03-16 解析装置、プログラム、欠陥検査装置、レビュー装置、解析システム及び解析方法

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US (1) US8290241B2 (enExample)
JP (1) JP5002291B2 (enExample)
TW (1) TWI411774B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4629118B2 (ja) * 2008-03-03 2011-02-09 株式会社日立ハイテクノロジーズ 欠陥検査装置およびこの欠陥検査装置に用いるパラメータ調整方法。
JP2009272497A (ja) * 2008-05-08 2009-11-19 Hitachi High-Technologies Corp レシピパラメータ管理装置およびレシピパラメータ管理方法
JP5145116B2 (ja) * 2008-05-21 2013-02-13 株式会社日立ハイテクノロジーズ 表面欠陥データ表示管理装置および表面欠陥データ表示管理方法
JP5287178B2 (ja) * 2008-11-27 2013-09-11 富士通セミコンダクター株式会社 欠陥レビュー装置
US9418413B1 (en) * 2009-07-06 2016-08-16 Camtek Ltd. System and a method for automatic recipe validation and selection
TWI497623B (zh) * 2009-07-06 2015-08-21 Camtek Ltd 用於自動秘方驗證及選擇之系統及方法
US8224623B2 (en) * 2010-04-09 2012-07-17 Delphi Technologies, Inc. Method to determine a quality acceptance criterion using force signatures
JP5783953B2 (ja) * 2012-05-30 2015-09-24 株式会社日立ハイテクノロジーズ パターン評価装置およびパターン評価方法
JP6985210B2 (ja) * 2018-05-29 2021-12-22 株式会社 日立産業制御ソリューションズ 検査機能診断装置、検査機能診断方法及び検査機能診断プログラム
IL269566B (en) 2019-09-23 2021-04-29 Elbit Systems Electro Optics Elop Ltd Systems and methods for controlling light emission towards objects
JP7408516B2 (ja) * 2020-09-09 2024-01-05 株式会社東芝 欠陥管理装置、方法およびプログラム
US11846979B1 (en) * 2022-06-01 2023-12-19 Sas Institute, Inc. Anomaly detection and diagnostics based on multivariate analysis

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201946A (ja) * 1993-12-28 1995-08-04 Hitachi Ltd 半導体装置等の製造方法及びその装置並びに検査方法及びその装置
JP4077951B2 (ja) * 1998-01-14 2008-04-23 株式会社ルネサステクノロジ 欠陥解析方法、記録媒体及び工程管理方法
US6177287B1 (en) * 1998-09-28 2001-01-23 Advanced Micro Devices, Inc. Simplified inter database communication system
US6476913B1 (en) * 1998-11-30 2002-11-05 Hitachi, Ltd. Inspection method, apparatus and system for circuit pattern
US6539106B1 (en) * 1999-01-08 2003-03-25 Applied Materials, Inc. Feature-based defect detection
JP3784603B2 (ja) * 2000-03-02 2006-06-14 株式会社日立製作所 検査方法及びその装置並びに検査装置における検査条件設定方法
US6959251B2 (en) * 2002-08-23 2005-10-25 Kla-Tencor Technologies, Corporation Inspection system setup techniques
JP2004177139A (ja) * 2002-11-25 2004-06-24 Renesas Technology Corp 検査条件データ作成支援プログラム及び検査装置及び検査条件データ作成方法
JP4230838B2 (ja) * 2003-06-27 2009-02-25 株式会社日立ハイテクノロジーズ 欠陥検査装置における検査レシピ設定方法および欠陥検査方法
JP4599980B2 (ja) * 2003-10-15 2010-12-15 パナソニック株式会社 多層配線構造の不良解析方法および不良解析装置
JP4374303B2 (ja) * 2004-09-29 2009-12-02 株式会社日立ハイテクノロジーズ 検査方法及びその装置
JP4750444B2 (ja) * 2005-03-24 2011-08-17 株式会社日立ハイテクノロジーズ 外観検査方法及びその装置
JP2006310551A (ja) * 2005-04-28 2006-11-09 Hitachi High-Technologies Corp 検査支援システム、及び方法
JP4652917B2 (ja) * 2005-07-07 2011-03-16 株式会社日立ハイテクノロジーズ 欠陥データ処理方法、およびデータの処理装置

Also Published As

Publication number Publication date
TWI411774B (zh) 2013-10-11
US20080226153A1 (en) 2008-09-18
JP2008224638A (ja) 2008-09-25
TW200907336A (en) 2009-02-16
US8290241B2 (en) 2012-10-16

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