JP4990794B2 - 熱制御流体自己組立 - Google Patents

熱制御流体自己組立 Download PDF

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Publication number
JP4990794B2
JP4990794B2 JP2007548426A JP2007548426A JP4990794B2 JP 4990794 B2 JP4990794 B2 JP 4990794B2 JP 2007548426 A JP2007548426 A JP 2007548426A JP 2007548426 A JP2007548426 A JP 2007548426A JP 4990794 B2 JP4990794 B2 JP 4990794B2
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support
fluid
cooling
assembly
microcomponent
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JP2008525206A (ja
JP2008525206A5 (https=
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ラビ シャルマ
チャールズ ピー ルシナン
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イーストマン コダック カンパニー
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00—Chemistry: analytical and immunological testing
    • Y10T436/25—Chemistry: analytical and immunological testing including sample preparation

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  • Physical Or Chemical Processes And Apparatus (AREA)
  • Micromachines (AREA)
JP2007548426A 2004-12-22 2005-12-20 熱制御流体自己組立 Expired - Fee Related JP4990794B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/021,120 2004-12-22
US11/021,120 US7687277B2 (en) 2004-12-22 2004-12-22 Thermally controlled fluidic self-assembly
PCT/US2005/046316 WO2006069137A1 (en) 2004-12-22 2005-12-20 Thermally controlled fluidic self-assembly

Publications (3)

Publication Number Publication Date
JP2008525206A JP2008525206A (ja) 2008-07-17
JP2008525206A5 JP2008525206A5 (https=) 2008-12-18
JP4990794B2 true JP4990794B2 (ja) 2012-08-01

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Family Applications (1)

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JP2007548426A Expired - Fee Related JP4990794B2 (ja) 2004-12-22 2005-12-20 熱制御流体自己組立

Country Status (5)

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US (2) US7687277B2 (https=)
EP (1) EP1829104B1 (https=)
JP (1) JP4990794B2 (https=)
DE (1) DE602005007633D1 (https=)
WO (1) WO2006069137A1 (https=)

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Also Published As

Publication number Publication date
US7687277B2 (en) 2010-03-30
JP2008525206A (ja) 2008-07-17
US20100122654A1 (en) 2010-05-20
EP1829104B1 (en) 2008-06-18
WO2006069137A1 (en) 2006-06-29
EP1829104A1 (en) 2007-09-05
US20060134799A1 (en) 2006-06-22
DE602005007633D1 (de) 2008-07-31

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