JP4990021B2 - High frequency transmission line - Google Patents

Description

  The present invention relates to a high-frequency transmission line for obtaining a structure applicable to a higher frequency in a vertical feeding circuit formed inside a dielectric substrate and realizing reduction of unnecessary radiation.

  The structure of a conventional high-frequency signal transmission line using a Ball Grid Array (BGA) connection is that one solder ball is a signal line conductor, and a plurality of solder balls arranged concentrically around the solder ball are ground conductors. By doing so, a pseudo coaxial line mode is propagated. In addition, in the dielectric substrate joined by the solder balls, a columnar metal conductor called a VIA hole is used as a signal line conductor, and a plurality of VIA holes arranged concentrically around the VIA hole are grounded. By using a conductor, a pseudo coaxial line mode is propagated, and high-frequency signals can be transmitted in the thickness direction of the substrate. Further, a high frequency signal transmitted in the substrate thickness direction is connected to a microstrip line, a coplanar line, a strip line or the like formed on the surface layer or the inner layer of the substrate, thereby enabling high frequency signal transmission to other circuits.

  In addition, the signal line conductor solder ball and the signal line conductor VIA hole are electrically connected, and the ground conductor solder ball and the ground conductor VIA hole are electrically connected, so that one of the substrates is connected. A high-frequency signal to be transmitted can be transmitted to the other substrate (see, for example, Non-Patent Document 1).

K. Varian, et al, “A 2-Bit RF MEMS Phase Shifter in a Thick-Film BGA Ceramic Package”, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 12, NO. 9, SEPTEMBER 2002 pp. 321-323

  However, in the conventional BGA connection portion, the diameter of the solder ball and the diameter of the VIA hole are often not equal. For example, when the diameter of the solder ball is larger than the diameter of the VIA hole, The diameter of the circular conductor pattern called a pad for mediating electrical connection needs to adopt a dimension corresponding to the diameter of the solder ball. In this case, the diameter of the VIA hole and the diameter of the pad are greatly different, and a large discontinuity occurs at the connection portion between the solder ball and the VIA hole. .

  Further, in the conversion part between the pseudo coaxial line formed by the VIA hole inside the substrate and the microstrip line, coplanar line, strip line, etc. formed on the surface layer or the inner layer of the substrate, unnecessary radiation is generated due to the discontinuity of the structure. Occur. If unnecessary electromagnetic field coupling occurs between other circuit terminals due to the above-described unnecessary radiation, circuit characteristics may be deteriorated, and a conversion unit that can reduce the amount of unnecessary radiation is desired.

  The present invention has been made to solve the above-described problems, improves the transmission characteristic deterioration due to discontinuity in the BGA connection portion, and further, the pseudo coaxial line and the microstrip line formed inside the substrate, An object of the present invention is to obtain a high-frequency transmission line that reduces unnecessary radiation in a conversion section with a coplanar line, a strip line, or the like.

The high-frequency transmission line according to the present invention includes a first dielectric substrate, a first ground conductor provided in an inner layer of the first dielectric substrate and having a first cutout portion, and the first dielectric. A second ground conductor provided on the surface of the substrate and having a second cut-out portion; and a first signal within the second cut-out portion and having no electrical connection with the second ground conductor. A conductor pattern for a line, and arranged in the vicinity of the first cut-out portion and the second cut-out portion inside the first dielectric substrate, and the first ground conductor and the second cut-out portion A plurality of grounding columnar conductors that are electrically connected to the grounding conductor, and provided on the inner layer or the surface layer of the first dielectric substrate on the opposite side across the first grounding conductor from the second grounding conductor, A strip conductor having an end near the first cut-out portion and extending in one direction; A first signal line columnar conductor which is provided inside the first dielectric substrate and electrically connects the strip conductor and the first signal line conductor pattern; The distance in the same direction as the extending direction of the strip conductor from the columnar conductor for use to the first cutout portion winding portion is from the first signal line columnar conductor to the first cutout portion turnover portion. A second dielectric substrate different from the first dielectric substrate, having a parallel capacitance element provided in a part of the strip conductor, which is shorter than the distance in the direction opposite to the extending direction of the strip conductor; wherein a third signal line conductor patterns formed on the second dielectric substrate surface, the second third further comprising a ground conductor formed on the dielectric substrate surface, said first signal line conductor A pattern and the third signal line conductor pattern; The second ground conductor and the third ground conductor are electrically connected via a second solder ball different from the first solder ball. The first signal line columnar conductor is provided so as to overlap the first solder ball in the axial direction, and from the center position in plan view of the first solder ball, the strip conductor It is characterized by being shifted in the stretching direction.

  According to the present invention, there is an effect of reducing deterioration in transmission characteristics that occurs as the frequency increases, and an effect of reducing unnecessary radiation to the outside of the transmission line.

Embodiment 1 FIG.
1-4 is a figure which shows the structure of the high frequency transmission line based on Embodiment 1 of this invention, FIG. 2 is sectional drawing about the AA 'line in FIG. 1, FIG. 3 is FIG. FIG. 4 is a cross-sectional view taken along the line CC ′ in FIG. 1.

  As shown in FIGS. 1 and 4, a solder ball mounting pad 102 and a strip conductor 103 as a signal line conductor pattern electrically connected to the pad 102 are provided on the surface of the dielectric substrate 101. In addition, a ground conductor pattern 105 that is electrically isolated from the strip conductor 103 is provided. A signal line solder ball 104 a is mounted on the pad 102, and a ground conductor solder ball 104 b is mounted on the ground conductor 105.

  As shown in FIGS. 1 to 3, a ground conductor pattern 111 having a signal line solder ball mounting pad 112 and a cut-out portion 118 is provided on the lower surface of the multilayer dielectric substrate 110. Further, a strip conductor 115 for signal lines is provided on the upper side surface of the multilayer dielectric substrate 110, and a ground conductor 117 having a cut-out portion 119 is provided on the inner layer of the multilayer dielectric substrate 110, respectively. A microstrip line is formed by the conductor 117.

  The ground conductor 117 and the ground conductor 111 are electrically connected by a grounding columnar conductor 116a called a VIA hole arranged so as to surround the cut-out portions 118 and 119. As in the example shown in FIG. 1, a conductor pattern 116b called a land may mediate for electrical connection between the grounding columnar conductors 116a. The strip conductor 115 and the pad 112 are electrically connected by a signal line columnar conductor 113a (collectively referred to as 113a1 to 113a3), and the signal line columnar conductor 113a is electrically connected to each other as shown in FIG. A conductor pattern 113b called a land may mediate for connection.

  As shown in FIGS. 1 to 4, the pad 102 provided on the dielectric substrate 101 and the pad 112 provided on the multilayer dielectric substrate 110 are electrically connected by a solder ball 104 a to be provided on the dielectric substrate 101. The ground conductor 105 and the ground conductor 111 provided on the multilayer dielectric substrate 110 are electrically connected by the solder balls 104b, so that a high-frequency signal transmitted through the dielectric substrate 101 is provided on the multilayer dielectric substrate 110. It is possible to transmit to the formed microstrip line.

  In this example, an example in which a microstrip line is formed on the multilayer dielectric substrate 110 has been described. However, other transmission line structures using strip conductors such as a strip line, a coplanar line, and an embedded microstrip line may be used. The example in which 104a and 104b are solder balls is shown, but the present invention is not limited to solder, and other materials may be used as long as they have conductivity such as a conductive adhesive. Moreover, although the hollow parts 119 and 118 have been described as being circular, the present invention is not limited to this, and an arbitrary shape may be used. In this example, a coplanar line is formed on the upper surface of the dielectric substrate 101. However, the present invention is not limited to the upper surface, and may be formed on the lower surface or the inner layer. A transmission line structure using other strip conductors. May be used.

  As shown in FIG. 1, with respect to the distance from the signal line columnar conductor 113a to the circumferential portion of the cut-out portion 119, the distance in the same direction as the extending direction of the strip conductor 115 is the distance in the opposite direction to the extending direction of the strip conductor 115. It is shorter than Thereby, the discontinuity around the connection portion between the pad 112 and the signal line columnar conductor 113a can be alleviated, and further, the series inductance component at the connection portion between the strip conductor 115 and the signal line columnar conductor 113a can be reduced. The effect of reducing the deterioration in transmission characteristics that occurs as the frequency increases can be obtained. Further, in the conventional pseudo coaxial line in which the grounding columnar conductors are arranged at equal distances from the signal line columnar conductors, the electromagnetic field distribution that is distributed almost evenly is obtained by the signal line columnar conductor 113a and the strip conductor 115. It can concentrate on the circumference | surroundings of the space | interval of the circumference | surroundings part of the hollow part 119 located in an extending | stretching direction, As a result, the effect of reducing the unnecessary radiation | emission to the exterior is also acquired.

  FIG. 5 shows a high-frequency transmission line using a conventional pseudo coaxial line in which grounding columnar conductors are arranged at equal distances from the signal line columnar conductor, and the first embodiment of the present invention shown in FIGS. The comparison figure of the radiation amount in the high frequency transmission line which concerns is shown. Radiation was obtained by electromagnetic field simulation using the finite element method. The frequency (Freq) range was 5 to 50 GHz. Here, the diameters and heights of the solder balls 104a and 104b are 0.95 mm and 0.5 mm, respectively, and the diameters of the signal line columnar conductor 113a and the grounding columnar conductor 116a are 0.132 mm.

  The dielectric substrate 101 has a relative dielectric constant of 4.4, the multilayer dielectric substrate 110 has a relative dielectric constant of 7.1, and the thickness dimensions of the substrate shown in FIG. 1 are h1 = 0.14 mm, h2 = 0. 49 mm. The diameters of the pad 112 and the cut-through portion 118 are 0.75 mm and 1.05 mm, respectively. In FIG. 5, the graph shown by the dotted line shows the radiation amount due to the structure in which the signal line columnar conductor 113a is arranged at the center of the pad 112, whereas the graph shown by the solid line shows the radiation amount shown in FIGS. The radiation amount by the high frequency transmission line which concerns on Embodiment 1 of invention is shown, and the radiation amount by the structure which the columnar conductor 113a for signal lines shifted 0.18 mm from the center of the pad 112 to the extending | stretching direction of the strip conductor 115 is shown. In the entire frequency band shown in FIG. 5, the high-frequency transmission line according to Embodiment 1 of the present invention shown in FIGS. 1 to 4 has an effect of reducing the radiation amount by about 1 dB to 2 dB as compared with the conventional structure. Recognize.

  As described above, in the high-frequency transmission line structure according to the first embodiment, the distance in the same direction as the extending direction of the strip conductor 115 from the signal line columnar conductor 113a to the cut-out portion 119 turns is the signal line columnar conductor. Since the distance from 113a to the piercing portion 119 is shorter than the distance in the direction opposite to the extending direction of the strip conductor 115, it has the effect of reducing the deterioration of transmission characteristics that occur as the frequency increases, and to the outside of the transmission line. The effect of reducing unnecessary radiation can be obtained.

Embodiment 2. FIG.
6 to 9 are views showing the structure of a high-frequency transmission line according to Embodiment 2 of the present invention. FIG. 7 is a sectional view taken along the line DD 'in FIG. 6, and FIG. FIG. 9 is a cross-sectional view taken along line FF ′ in FIG. 6.

  In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals. In the second embodiment, three signal line columnar conductors 113a are provided in the multilayer dielectric substrate 110 to electrically connect the strip conductor 115 and the pad 112 as the signal line conductor pattern. Of the three first signal line columnar conductors 113a, the distance from the signal line columnar conductor 113a closest to the surrounding portion of the first cut-out portion 119 to the turn portion of the first cut-out portion 119 is as follows. A feature is that the distance in the same direction as the extending direction of the strip conductor 115 is shorter than the distance in the direction opposite to the extending direction of the strip conductor 115.

  As shown in FIGS. 6 and 9, a solder ball mounting pad 102 and a strip conductor 103 electrically connected to the pad 102 are provided on the surface of the dielectric substrate 101, and the pad 102 and the strip conductor 103 are electrically connected to each other. A grounding conductor pattern 105 is provided. A signal line solder ball 104 a is mounted on the pad 102, and a ground conductor solder ball 104 b is mounted on the ground conductor 105.

  Also, as shown in FIGS. 6 to 8, a signal line solder ball mounting pad 112 and a ground conductor pattern 111 having a cut-out portion 118 are provided on the lower surface of the multilayer dielectric substrate 110. Further, a strip conductor 115 for signal lines is provided on the upper surface of the multilayer dielectric substrate 110, and a ground conductor 117 having a cut-out portion 119 is provided on the inner layer of the multilayer dielectric substrate 110. The strip conductor 115 and the ground conductor 117 are provided. Thus, a microstrip line is formed.

  The ground conductor 117 and the ground conductor 111 are electrically connected by a grounding columnar conductor 116a called a VIA hole arranged so as to surround the cut-out portions 118 and 119. As in the example shown in FIG. 6, a conductor pattern 116b called a land may mediate for electrical connection between the grounding columnar conductors 116a. The strip conductor 115 and the pad 112 are electrically connected by a signal line columnar conductor 113a, and a conductor called a land is used for electrical connection between the signal line columnar conductors 113a as shown in FIG. The pattern 113b may mediate. In this example, three signal line columnar conductors 113a are arranged in the same layer.

  As shown in FIG. 6 to FIG. 9, the pad 102 provided on the dielectric substrate 101 and the pad 112 provided on the multilayer dielectric substrate 110 are electrically connected by solder balls 104 a and provided on the dielectric substrate 101. The ground conductor 105 and the ground conductor 111 provided on the multilayer dielectric substrate 110 are electrically connected by the solder balls 104b, so that a high-frequency signal transmitted through the dielectric substrate 101 is provided on the multilayer dielectric substrate 110. It is possible to transmit to the formed microstrip line.

  In this example, an example in which a microstrip line is formed on the multilayer dielectric substrate 110 has been described. However, other transmission line structures using strip conductors such as a strip line, a coplanar line, and an embedded microstrip line may be used. The example in which 104a and 104b are solder balls is shown, but the present invention is not limited to solder, and other materials may be used as long as they have conductivity such as a conductive adhesive. Although the hollow parts 119 and 118 are described as being circular, the present invention is not limited to this, and an arbitrary shape may be used. In this example, a coplanar line is formed on the upper surface of the dielectric substrate 101. However, the present invention is not limited to the upper surface, and may be formed on the lower surface or the inner layer. A transmission line structure using other strip conductors. May be used.

  Furthermore, in this example, three signal line columnar conductors 113a are arranged in each layer, but a plurality of signal line columnar conductors 113a may be arranged in at least one layer, and the number of signals varies depending on the layer. You may use the columnar conductor 113a for lines.

  As shown in FIG. 6, in the signal line columnar conductor 113a, the extension direction of the strip conductor 115 with respect to the distance from the signal line columnar conductor closest to the winding part of the cutout part 119 to the looping part of the cutout part 119 The distance in the same direction is shorter than the distance in the direction opposite to the extending direction of the strip conductor 115. Further, by providing a plurality of signal line columnar conductors 113a arranged in each layer, a discontinuity with the pad 112 can be reduced. Thereby, the discontinuity around the connection portion between the pad 112 and the signal line columnar conductor 113a can be alleviated, and further, the series inductance component at the connection portion between the strip conductor 115 and the signal line columnar conductor 113a can be reduced. The effect of reducing the deterioration in transmission characteristics that occurs as the frequency increases can be obtained. Further, as in the first embodiment, the electromagnetic field distribution of the high-frequency signal to be transmitted can be concentrated around the interval between the peripheral portions of the cut-out portion 119 located in the extending direction of the signal line columnar conductor 113a and the strip conductor 115. As a result, an effect of reducing unnecessary radiation to the outside can also be obtained.

  As described above, in the high-frequency transmission line structure according to the second embodiment, among the plurality of signal line columnar conductors 113a, the signal line columnar conductor 113a closest to the winding part of the cutout part 119 Regarding the distance to the circuit portion, the distance in the same direction as the extending direction of the strip conductor 115 is shorter than the distance in the opposite direction to the extending direction of the strip conductor 115, and therefore, the transmission characteristics deteriorate as the frequency increases. As well as the effect of reducing unnecessary radiation to the outside of the transmission line.

Embodiment 3 FIG.
10 to 13 are diagrams showing the structure of a high-frequency transmission line according to Embodiment 3 of the present invention. FIG. 11 is a cross-sectional view taken along the line GG ′ in FIG. 10, and FIG. FIG. 13 is a cross-sectional view taken along the line II ′ in FIG. 10.

  In the third embodiment, the same components as those in the first and second embodiments are denoted by the same reference numerals. The third embodiment is characterized in that a stub 121 for obtaining a parallel capacitive element is provided in a part of the strip conductor 115.

  As shown in FIGS. 10 and 13, a solder ball mounting pad 102 and a strip conductor 103 electrically connected to the pad 102 are provided on the surface of the dielectric substrate 101, and the pad 102 and the strip conductor 103 are electrically connected to each other. A grounding conductor pattern 105 is provided. A signal line solder ball 104 a is mounted on the pad 102, and a ground conductor solder ball 104 b is mounted on the ground conductor 105.

  As shown in FIGS. 10 to 12, a signal line solder ball mounting pad 112 and a ground conductor pattern 111 having a cut-out portion 118 are provided on the lower surface of the multilayer dielectric substrate 110. Further, a strip conductor 115 for signal lines is provided on the upper surface of the multilayer dielectric substrate 110, and a ground conductor 117 having a cut-out portion 119 is provided on the inner layer of the multilayer dielectric substrate 110. The strip conductor 115 and the ground conductor 117 are provided. Thus, a microstrip line is formed. Further, a stub 121 for obtaining a parallel capacitive element is provided in a part of the strip conductor 115.

  The ground conductor 117 and the ground conductor 111 are electrically connected by a grounding columnar conductor 116a called a VIA hole arranged so as to surround the cut-out portions 118 and 119. As in the example shown in FIG. 10, a conductor pattern 116b called a land may mediate for electrical connection between the grounding columnar conductors 116a. The strip conductor 115 and the pad 112 are electrically connected by a signal line columnar conductor 113a. As in the example shown in FIG. 10, a conductor called a land is used for electrical connection between the signal line columnar conductors 113a. The pattern 113b may mediate.

  As shown in FIGS. 10 to 13, the pad 102 provided on the dielectric substrate 101 and the pad 112 provided on the multilayer dielectric substrate 110 are electrically connected by a solder ball 104 a to be provided on the dielectric substrate 101. The ground conductor 105 and the ground conductor 111 provided on the multilayer dielectric substrate 110 are electrically connected by the solder balls 104b, so that a high-frequency signal transmitted through the dielectric substrate 101 is provided on the multilayer dielectric substrate 110. It is possible to transmit to the formed microstrip line.

  In this example, an example in which a microstrip line is formed on the multilayer dielectric substrate 110 has been described. However, other transmission line structures using strip conductors such as a strip line, a coplanar line, and an embedded microstrip line may be used. The example in which 104a and 104b are solder balls is shown, but the present invention is not limited to solder, and other materials may be used as long as they have conductivity such as a conductive adhesive. Although the hollow parts 119 and 118 are described as being circular, the present invention is not limited to this, and an arbitrary shape may be used. In this example, a coplanar line is formed on the upper surface of the dielectric substrate 101. However, the present invention is not limited to the upper surface, and may be formed on the lower surface or the inner layer. A transmission line structure using other strip conductors. May be used. Furthermore, in this example, one signal line columnar conductor 113a is arranged in each layer, but a plurality of signal line columnar conductors 113a may be arranged in at least one layer, and the number of signals varies depending on the layer. You may use the columnar conductor 113a for lines.

  As shown in FIG. 10, with respect to the distance from the signal line columnar conductor 113a to the winding portion of the cut-out portion 119, the distance in the same direction as the extending direction of the strip conductor 115 is the distance in the opposite direction to the extending direction of the strip conductor 115. It is shorter than Thereby, the discontinuity around the connection portion between the pad 112 and the signal line columnar conductor 113a can be alleviated, and further, the series inductance component at the connection portion between the strip conductor 115 and the signal line columnar conductor 113a can be reduced. The effect of reducing the deterioration in transmission characteristics that occurs as the frequency increases can be obtained.

  Further, as in the first embodiment, the electromagnetic field distribution of the high-frequency signal to be transmitted can be concentrated around the interval between the peripheral portions of the cut-out portion 119 located in the extending direction of the signal line columnar conductor 113a and the strip conductor 115. As a result, an effect of reducing unnecessary radiation to the outside can also be obtained. Furthermore, since a stub 121 for obtaining a parallel capacitive element is provided in a part of the strip conductor 115, good transmission characteristics can be obtained in a specific frequency band by adjusting the shape and arrangement position of the stub 121. be able to.

  As described above, the high-frequency transmission line structure according to Embodiment 3 has the effect of reducing the deterioration of transmission characteristics that occur as the frequency increases, and the effect of reducing unnecessary radiation to the outside of the transmission line. Furthermore, by providing a stub 121 for obtaining a parallel capacitive element in a part of the strip conductor 115, good transmission characteristics can be obtained in a specific frequency band.

  In the first to third embodiments described above, as shown in FIGS. 1, 6 and 10, the signal line columnar conductor for electrically connecting the strip conductor 115 and the pad 112 as the signal line conductor pattern. 113a includes signal line columnar conductors 113a1, 113a2 and 113a3, and two conductor patterns 113b are positioned between them, and a three-layer structure is shown. The same effects as those of the first to third embodiments can be obtained.

It is a figure which shows the structure of the high frequency transmission line which concerns on Embodiment 1 of this invention. It is sectional drawing about the AA 'line in FIG. It is sectional drawing about the BB 'line in FIG. It is sectional drawing about the CC 'line | wire in FIG. It is a comparison figure of the radiation amount in the conventional high frequency transmission line and the high frequency transmission line which concerns on Embodiment 1 of this invention. It is a figure which shows the structure of the high frequency transmission line which concerns on Embodiment 2 of this invention. It is sectional drawing about the DD 'line in FIG. It is sectional drawing about the EE 'line in FIG. It is sectional drawing about the FF 'line in FIG. It is a figure which shows the structure of the high frequency transmission line which concerns on Embodiment 3 of this invention. It is sectional drawing about the GG 'line | wire in FIG. It is sectional drawing about the HH 'line in FIG. It is sectional drawing about the II 'line in FIG.

Explanation of symbols

  101 Dielectric Substrate (Second Dielectric Substrate), 103 Strip Conductor (Third Signal Line Conductor Pattern), 105 Ground Conductor Pattern (Third Ground Conductor), 110 Multilayer Dielectric Substrate (First Dielectric Substrate) Substrate), 111 ground conductor pattern (second ground conductor), 112 signal line solder ball mounting pad (first signal line conductor pattern), 113a signal line columnar conductor (first signal line columnar conductor) 113a1 Signal line columnar conductor (first signal line columnar conductor), 113a2 Signal line columnar conductor (third signal line columnar conductor), 113a3 Signal line columnar conductor (second signal line columnar conductor) Conductor), 113b conductor pattern, 115 signal line strip conductor, 116a grounding columnar conductor, 116b conductor pattern, 117 ground conductor (first ground conductor), 118 hollow Part (a second void part), 119 void part (first void part), 121 stub (parallel capacitance element).

Claims (4)

A first dielectric substrate;
A first ground conductor provided in the first dielectric substrate inner layer and having a first cutout;
A second ground conductor provided on a surface layer of the first dielectric substrate and having a second cut-out portion;
A first signal line conductor pattern that is inside the second cut-out portion and has no electrical connection with the second ground conductor;
The first grounding conductor and the second grounding conductor are electrically arranged inside the first dielectric substrate and arranged around the first cutout portion and the second cutout portion. A plurality of grounding columnar conductors connected to
Provided on the inner layer or surface layer of the first dielectric substrate on the opposite side across the first ground conductor from the second ground conductor, and has an end near the first cutout portion, and is unidirectional A strip conductor extending to
A first signal line columnar conductor that is inside the first dielectric substrate and electrically connects the strip conductor and the first signal line conductor pattern;
The distance in the same direction as the extending direction of the strip conductor from the first signal line columnar conductor to the first cut-out portion surrounding portion is the first signal line columnar conductor from the first cutout. Shorter than the distance in the direction opposite to the extending direction of the strip conductor to the through-around portion,
A part of the strip conductor is provided with a parallel capacitive element,
A second dielectric substrate different from the first dielectric substrate;
A third signal line conductor pattern formed on the surface of the second dielectric substrate;
And a third ground conductor formed on the surface of the second dielectric substrate,
The first signal line conductor pattern and the third signal line conductor pattern are electrically connected via a first solder ball,
The second ground conductor and the third ground conductor are electrically connected via a second solder ball different from the first solder ball,
The first signal line columnar conductor is provided so as to overlap the first solder ball in the axial direction, and from the center position in plan view of the first solder ball to the extending direction of the strip conductor. A high-frequency transmission line characterized by being shifted. A first dielectric substrate;
A first ground conductor provided in the first dielectric substrate inner layer and having a first cutout;
A second ground conductor provided on a surface layer of the first dielectric substrate and having a second cut-out portion;
A first signal line conductor pattern that is inside the second cut-out portion and has no electrical connection with the second ground conductor;
The first grounding conductor and the second grounding conductor are electrically arranged inside the first dielectric substrate and arranged around the first cutout portion and the second cutout portion. A plurality of grounding columnar conductors connected to
Provided on the inner layer or surface layer of the first dielectric substrate on the opposite side across the first ground conductor from the second ground conductor, and has an end near the first cutout portion, and is unidirectional A strip conductor extending to
A plurality of first signal line columnar conductors that are inside the first dielectric substrate and electrically connect the strip conductor and the first signal line conductor pattern;
Among the plurality of first signal line columnar conductors, the strip conductors have a distance from the signal line columnar conductor closest to the first cut-out portion surrounding portion to the first cutout portion turn-around portion. The distance in the same direction as the extending direction is shorter than the distance in the direction opposite to the extending direction of the strip conductor,
A part of the strip conductor is provided with a parallel capacitive element,
A second dielectric substrate different from the first dielectric substrate;
A third signal line conductor pattern formed on the surface of the second dielectric substrate;
And a third ground conductor formed on the surface of the second dielectric substrate,
The first signal line conductor pattern and the third signal line conductor pattern are electrically connected via a first solder ball,
The second ground conductor and the third ground conductor are electrically connected via a second solder ball different from the first solder ball,
The plurality of first signal line columnar conductors are provided so as to overlap the first solder balls in the axial direction, and at least one of the plurality of first signal line columnar conductors is the first conductors. 1. The signal line columnar conductor is arranged so as to be shifted from the center position of the first solder ball in plan view in the extending direction of the strip conductor. A first dielectric substrate;
A first ground conductor provided in the first dielectric substrate inner layer and having a first cutout;
A second ground conductor provided on a surface layer of the first dielectric substrate and having a second cut-out portion;
A first signal line conductor pattern that is inside the second cut-out portion and has no electrical connection with the second ground conductor;
The first grounding conductor and the second grounding conductor are electrically arranged inside the first dielectric substrate and arranged around the first cutout portion and the second cutout portion. A plurality of grounding columnar conductors connected to
Provided on the inner layer or surface layer of the first dielectric substrate on the opposite side across the first ground conductor from the second ground conductor, and has an end near the first cutout portion, and is unidirectional A strip conductor extending to
A second signal line conductor pattern located inside the first dielectric substrate and positioned between the strip conductor and the first signal line conductor pattern;
At least one first signal line columnar conductor in the first dielectric substrate that electrically connects the strip conductor and the second signal line conductor pattern;
At least one or more second signal line pillars that are inside the first dielectric substrate and electrically connect the second signal line conductor pattern and the first signal line conductor pattern. With conductor and
Of the at least one or more first signal line columnar conductors or the at least one or more second signal line columnar conductors, the signal line columnar conductor closest to the first cut-out portion surrounding portion. From the distance to the first cut-out portion surrounding portion, the distance in the same direction as the extending direction of the strip conductor is shorter than the distance in the direction opposite to the extending direction of the strip conductor,
A part of the strip conductor is provided with a parallel capacitive element,
A second dielectric substrate different from the first dielectric substrate;
A third signal line conductor pattern formed on the surface of the second dielectric substrate;
And a third ground conductor formed on the surface of the second dielectric substrate,
The first signal line conductor pattern and the third signal line conductor pattern are electrically connected via a first solder ball,
The second ground conductor and the third ground conductor are electrically connected via a second solder ball different from the first solder ball,
The first signal line columnar conductor is provided so as to overlap the first solder ball in the axial direction, and from the center position in plan view of the first solder ball to the extending direction of the strip conductor. A high-frequency transmission line characterized by being shifted. A first dielectric substrate;
A first ground conductor provided in the first dielectric substrate inner layer and having a first cutout;
A second ground conductor provided on a surface layer of the first dielectric substrate and having a second cut-out portion;
A first signal line conductor pattern that is inside the second cut-out portion and has no electrical connection with the second ground conductor;
The first grounding conductor and the second grounding conductor are electrically arranged inside the first dielectric substrate and arranged around the first cutout portion and the second cutout portion. A plurality of grounding columnar conductors connected to
Provided on the inner layer or surface layer of the first dielectric substrate on the opposite side across the first ground conductor from the second ground conductor, and has an end near the first cutout portion, and is unidirectional A strip conductor extending to
At least two or more second signal line conductor patterns located inside the first dielectric substrate and located between the strip conductor and the first signal line conductor pattern;
At least one first signal line columnar conductor in the first dielectric substrate that electrically connects the strip conductor and the second signal line conductor pattern;
At least one or more second signal line pillars that are inside the first dielectric substrate and electrically connect the second signal line conductor pattern and the first signal line conductor pattern. Conductors,
And at least one third signal line columnar conductor in the first dielectric substrate for electrically connecting the at least two second signal line conductor patterns to each other,
In any one of the at least one or more first signal line columnar conductors or the at least one or more second signal line columnar conductors or the at least one or more third signal line columnar conductors, With respect to the distance from the signal line columnar conductor closest to the first cut-out peripheral portion to the first cut-out peripheral portion, the distance in the same direction as the extending direction of the strip conductor is the strip conductor. Shorter than the distance in the direction opposite to the stretching direction,
A part of the strip conductor is provided with a parallel capacitive element,
A second dielectric substrate different from the first dielectric substrate;
A third signal line conductor pattern formed on the surface of the second dielectric substrate;
And a third ground conductor formed on the surface of the second dielectric substrate,
The first signal line conductor pattern and the third signal line conductor pattern are electrically connected via a first solder ball,
The second ground conductor and the third ground conductor are electrically connected via a second solder ball different from the first solder ball,
The first signal line columnar conductor is provided so as to overlap the first solder ball in the axial direction, and from the center position in plan view of the first solder ball to the extending direction of the strip conductor. A high-frequency transmission line characterized by being shifted.

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