JP4986581B2 - 光素子用基板 - Google Patents
光素子用基板 Download PDFInfo
- Publication number
- JP4986581B2 JP4986581B2 JP2006307477A JP2006307477A JP4986581B2 JP 4986581 B2 JP4986581 B2 JP 4986581B2 JP 2006307477 A JP2006307477 A JP 2006307477A JP 2006307477 A JP2006307477 A JP 2006307477A JP 4986581 B2 JP4986581 B2 JP 4986581B2
- Authority
- JP
- Japan
- Prior art keywords
- optical element
- optical
- groove
- molded body
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Mechanical Coupling Of Light Guides (AREA)
- Optical Couplings Of Light Guides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006307477A JP4986581B2 (ja) | 2006-11-14 | 2006-11-14 | 光素子用基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006307477A JP4986581B2 (ja) | 2006-11-14 | 2006-11-14 | 光素子用基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008122741A JP2008122741A (ja) | 2008-05-29 |
| JP2008122741A5 JP2008122741A5 (https=) | 2011-07-07 |
| JP4986581B2 true JP4986581B2 (ja) | 2012-07-25 |
Family
ID=39507542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006307477A Expired - Fee Related JP4986581B2 (ja) | 2006-11-14 | 2006-11-14 | 光素子用基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4986581B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9036955B2 (en) * | 2011-01-25 | 2015-05-19 | Tyco Electronics Corporation | Optical interposer |
| US8818144B2 (en) | 2011-01-25 | 2014-08-26 | Tyco Electronics Corporation | Process for preparing an optical interposer for waveguides |
| JP2023551401A (ja) * | 2020-11-20 | 2023-12-08 | アヤー・ラブス・インコーポレーテッド | イーサネットスイッチのための低電力光入力/出力チップレット(TeraPHYe) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2977338B2 (ja) * | 1990-09-28 | 1999-11-15 | 株式会社東芝 | 半導体モジュール |
| US5345527A (en) * | 1993-09-03 | 1994-09-06 | Motorola, Inc. | Intelligent opto-bus with display |
| JPH0777634A (ja) * | 1993-09-09 | 1995-03-20 | Fujitsu Ltd | 光端末装置 |
| JP3064969B2 (ja) * | 1997-07-03 | 2000-07-12 | 日本電気株式会社 | 受光モジュールとその製造方法 |
| JP3775069B2 (ja) * | 1998-09-18 | 2006-05-17 | 住友電気工業株式会社 | 光受信モジュール |
| JP2001156381A (ja) * | 1999-11-30 | 2001-06-08 | Kyocera Corp | 光モジュール |
| JP2002357745A (ja) * | 2001-05-31 | 2002-12-13 | Kyocera Corp | 光モジュール |
| JP2004119493A (ja) * | 2002-09-24 | 2004-04-15 | Sumitomo Electric Ind Ltd | 光モジュール |
| US7306378B2 (en) * | 2004-05-06 | 2007-12-11 | Intel Corporation | Method and apparatus providing an electrical-optical coupler |
| JP2006084891A (ja) * | 2004-09-17 | 2006-03-30 | Fujikura Ltd | 光接続装置 |
-
2006
- 2006-11-14 JP JP2006307477A patent/JP4986581B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008122741A (ja) | 2008-05-29 |
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