JP4986581B2 - 光素子用基板 - Google Patents

光素子用基板 Download PDF

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Publication number
JP4986581B2
JP4986581B2 JP2006307477A JP2006307477A JP4986581B2 JP 4986581 B2 JP4986581 B2 JP 4986581B2 JP 2006307477 A JP2006307477 A JP 2006307477A JP 2006307477 A JP2006307477 A JP 2006307477A JP 4986581 B2 JP4986581 B2 JP 4986581B2
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JP
Japan
Prior art keywords
optical element
optical
groove
molded body
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006307477A
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English (en)
Japanese (ja)
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JP2008122741A (ja
JP2008122741A5 (https=
Inventor
優 高木
俊和 堀尾
猛 大野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP2006307477A priority Critical patent/JP4986581B2/ja
Publication of JP2008122741A publication Critical patent/JP2008122741A/ja
Publication of JP2008122741A5 publication Critical patent/JP2008122741A5/ja
Application granted granted Critical
Publication of JP4986581B2 publication Critical patent/JP4986581B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Mechanical Coupling Of Light Guides (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2006307477A 2006-11-14 2006-11-14 光素子用基板 Expired - Fee Related JP4986581B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006307477A JP4986581B2 (ja) 2006-11-14 2006-11-14 光素子用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006307477A JP4986581B2 (ja) 2006-11-14 2006-11-14 光素子用基板

Publications (3)

Publication Number Publication Date
JP2008122741A JP2008122741A (ja) 2008-05-29
JP2008122741A5 JP2008122741A5 (https=) 2011-07-07
JP4986581B2 true JP4986581B2 (ja) 2012-07-25

Family

ID=39507542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006307477A Expired - Fee Related JP4986581B2 (ja) 2006-11-14 2006-11-14 光素子用基板

Country Status (1)

Country Link
JP (1) JP4986581B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9036955B2 (en) * 2011-01-25 2015-05-19 Tyco Electronics Corporation Optical interposer
US8818144B2 (en) 2011-01-25 2014-08-26 Tyco Electronics Corporation Process for preparing an optical interposer for waveguides
JP2023551401A (ja) * 2020-11-20 2023-12-08 アヤー・ラブス・インコーポレーテッド イーサネットスイッチのための低電力光入力/出力チップレット(TeraPHYe)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2977338B2 (ja) * 1990-09-28 1999-11-15 株式会社東芝 半導体モジュール
US5345527A (en) * 1993-09-03 1994-09-06 Motorola, Inc. Intelligent opto-bus with display
JPH0777634A (ja) * 1993-09-09 1995-03-20 Fujitsu Ltd 光端末装置
JP3064969B2 (ja) * 1997-07-03 2000-07-12 日本電気株式会社 受光モジュールとその製造方法
JP3775069B2 (ja) * 1998-09-18 2006-05-17 住友電気工業株式会社 光受信モジュール
JP2001156381A (ja) * 1999-11-30 2001-06-08 Kyocera Corp 光モジュール
JP2002357745A (ja) * 2001-05-31 2002-12-13 Kyocera Corp 光モジュール
JP2004119493A (ja) * 2002-09-24 2004-04-15 Sumitomo Electric Ind Ltd 光モジュール
US7306378B2 (en) * 2004-05-06 2007-12-11 Intel Corporation Method and apparatus providing an electrical-optical coupler
JP2006084891A (ja) * 2004-09-17 2006-03-30 Fujikura Ltd 光接続装置

Also Published As

Publication number Publication date
JP2008122741A (ja) 2008-05-29

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