JP4985667B2 - Substrate holding device - Google Patents

Description

  The present invention relates to a substrate holding device provided in a flip chip bonder or the like.

  A substrate holding device provided in a flip chip bonder or the like used in a semiconductor assembly process is formed by fixing a holder member made of a metal material on an upper surface of a base member in which a conduit (substrate suction conduit) is provided, A vacuum is generated in the substrate suction conduit, and the substrate on the holder member is vacuum-sucked through the holder internal conduit provided in the holder member so that the substrate can be sucked and fixed on the holder member. It has become. Since the pipe line in the holder is opened only at the position where the upper surface of the holder member jumps, when the size of the substrate to be held changes, it is necessary to replace the holder member with one corresponding to the size of the substrate. The holder member is detachably attached to the base member by a screw inserted through a screw hole provided around the upper surface. In addition, a holder member suction conduit having an opening on the upper surface of the base member is provided in the base member separately from the substrate suction conduit, and the holder member is vacuum-sucked to the base member side via the holder member suction conduit. There is also something like that.

Moreover, what comprised the holder member not with a metal material but with the porous material which has innumerable void | holes inside is also known (patent document 1). In such a substrate holding device, the substrate is vacuum-sucked through a porous portion of the holder member (a hole inside the holder member) connected to the opening on the upper surface of the base member of the substrate suction line. Can be adsorbed and fixed to the upper surface of the holder member. Since the holes in the holder member are distributed over the entire upper surface of the holder member, it can be fixed by suction if the substrate is the same size or smaller as the holder member, and it is necessary to replace the holder member according to the size of the substrate Therefore, the operator's workability can be improved.
Japanese Patent Laid-Open No. 9-36599

  Thus, even a holder member made of a porous material needs to be configured to be detachable from the base member due to the necessity of maintenance work, etc. The fixing method of the holder member to the base member is as described above. Thus, it can be said that the thing by the vacuum suction excellent in the workability | operativity of an operator is desirable. However, when the holder member is made of a porous material, the opening of the holder member suction conduit is in communication with the outside through a hole in the holder member, so the holder member is fixed to the base member with a large adsorption force. Can not do it. Although the purpose is to fix only the holder member, the holder member is porous so that the substrate is attracted to the substrate. For this reason, the holder member must be screwed to the base member, but in that case, the screw hole portion of the holder member becomes a non-suction area where the substrate cannot be sucked, and the space portion of the screw hole supports the substrate. Therefore, there is a problem that the size of the substrate that can be held is limited to a size smaller than the size of the holder member.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate holding device that can hold a substrate having the same size as the holder member while maintaining the advantages of the holder member made of a porous material.

The substrate holding apparatus according to claim 1 is installed on the upper surface of the base member, the holder member suction conduit and the substrate suction conduit that are provided inside the base member and open to the upper surface of the base member, respectively. A holder member made of a porous material, a sealing member that is provided on the lower surface of the holder member and seals the opening on the upper surface of the base member of the holder member suction conduit, and generates a vacuum in the holder member suction conduit A holder member suction means for vacuum-sucking the holder member toward the base member side, and a porous portion of the holder member that generates a vacuum in the substrate suction conduit and is connected to the opening on the upper surface of the base member of the substrate suction conduit. And a substrate suction means for vacuum-sucking the substrate placed on the upper surface of the holder member to the holder member side.

  In the present invention, a sealing member is provided on the lower surface (contact surface with the base member) of the holder member made of a porous material, and the opening of the holder member suction pipe provided in the base member is sealed with the sealing member. Therefore, the holder member can be fixed to the upper surface of the base member with a strong suction force by generating a vacuum in the holder member suction conduit and vacuum-sucking the holder member. Further, unlike the case where the holder member is screwed to the base member, the non-suction area does not occur on the upper surface of the holder member, and the entire upper surface of the holder member can be effectively used as the suction surface of the substrate. A substrate having the same size as the member can be held. On the other hand, for the substrate placed on the upper surface of the holder member, a porous portion of the holder member (inside the holder member) that generates a vacuum in the substrate suction conduit and is connected to the opening on the upper surface of the base member of the substrate suction conduit. The substrate can be fixed to the upper surface of the holder member by vacuum suction of the substrate through the holes. For this reason, according to the present invention, the substrate having the same size as the holder member is maintained while maintaining the advantage (the advantage that the holder member does not need to be replaced according to the size of the substrate) due to the holder member being made of a porous material. Can be held.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a main part of a flip chip bonder according to an embodiment of the present invention, FIG. 2 is a perspective view of a substrate holding device in the flip chip bonder according to an embodiment of the present invention, and FIG. FIG. 4 is an exploded perspective view of the substrate holding device in one embodiment of the present invention, and FIG. 5 is a lower part of a holder member constituting the substrate holding device in one embodiment of the present invention. FIGS. 6A, 6 </ b> B, and 6 </ b> C are views showing the configuration of the sealing member of the holder member that constitutes the substrate holding device according to the embodiment of the present invention.

  In FIG. 1, the flip chip bonder 1 includes a substrate supply unit 3, a substrate transfer unit 4, a substrate positioning unit 5, a chip supply unit 6, a chip reversing unit 7, and a chip bonding unit 8 on a base 2.

  The substrate supply unit 3 transports the substrate PB in the horizontal direction and supplies it to a predetermined position by a pair of parallel substrate supply conveyors 3a.

  The substrate transfer unit 4 sucks the substrate PB supplied from the substrate supply unit 3 by the substrate suction unit 4b of the transfer head 4a, moves the transfer head 4a by the transfer head moving mechanism 4c, and moves the substrate PB. Transfer to the substrate positioning unit 5.

  The substrate positioning unit 5 moves relative to the base 2 in the Y-axis direction (one direction in the horizontal plane), and in the X-axis direction (in the horizontal plane orthogonal to the Y-axis direction) with respect to the Y-axis stage 5a. The substrate holding device 10 for holding the substrate PB transferred from the substrate supply unit 3 by the substrate transfer unit 4 is provided on the upper surface of the X axis stage 5b. Yes. The substrate positioning unit 5 moves the substrate PB held by the substrate holding device 10 in the Y-axis direction with respect to the base 2 of the Y-axis stage 5a and moves in the X-axis direction with respect to the Y-axis stage 5a of the X-axis stage 5b. And positioning at a predetermined position.

The chip supply unit 6 includes a Y-axis stage 6a that moves relative to the base 2 in the Y-axis direction and an X-axis stage 6b that moves relative to the Y-axis stage 6a in the X-axis direction. Is provided with a pallet table 6c. On the pallet table 6c, a pallet 6d on which the chip P to be bonded to the substrate PB is placed. The chip supply unit 6 moves the chip P in the pallet 6d in a predetermined direction by moving the Y-axis stage 6a in the Y-axis direction relative to the base 2 and moving the X-axis stage 6b in the X-axis direction relative to the Y-axis stage 6a. Position to position.

  The chip reversing unit 7 sucks the chip P supplied from the chip supply unit 6 by the chip sucking unit 7b of the reversing head 7a, and rotates the reversing head 7a around the Y axis to reverse the chip P front and back (in FIG. 1). Arrow A1). Then, the reversing head 7a is moved by the reversing head moving mechanism 7c to position the chip P at a predetermined position.

  The chip bonding unit 8 sucks the chip P, which is reversed by the chip reversing unit 7 and positioned at a predetermined position, by the sucking unit 8b of the bonding head 8a, and moves the bonding head 8a by the bonding head moving mechanism 8c. The chip P is moved above the substrate PB positioned by the substrate positioning unit 5. And the adsorption | suction part 8b is lowered | hung and the chip | tip P is joined to the target joining position on the board | substrate PB from upper direction.

  Next, the substrate holding device 10 will be described. 2, 3, and 4, the substrate holding device 10 includes a base member 11 and a holder member 12 installed on the upper surface 11 a of the base member 11.

  The base member 11 is made of a metal material and has a holder member suction pipe 21 therein (FIGS. 3 and 4). One end side of the holder member suction pipe 21 is an upper opening 21 a (see also FIG. 4) composed of an annular groove opened on the upper surface 11 a of the base member 11, and the other end side is a side of the base member 11. It becomes the side opening part 21b which opens in this. The side opening 21 b of the holder member suction pipe 21 is connected to an external pipe 22 provided outside the base portion 11.

  A substrate suction line 23 is also provided inside the base member 11 (FIG. 3). One end of the substrate suction line 23 is an upper opening 23 a that opens in the center of the upper surface 11 a of the base member 11, and the other end is a side opening 23 b that opens to the side of the base 11. It has become. The side opening 23 b of the substrate suction pipe 23 is connected to an external pipe 24 provided outside the base member 11.

  The holder member 12 is made of a porous material having countless pores inside. On the lower surface 12 a of the holder member 12 (contact surface with the upper surface 11 a of the base member 11), an annular groove portion 25 having a shape in which the upper opening 21 a of the holder member suction pipe 21 is turned upside down is arranged on the holder member suction pipe 21. The upper opening 21a is provided at a position facing vertically. And in this annular groove part 25, the sealing member 26 which seals the upper opening part 21a of the holder member suction conduit 21 in the state in which the holder member 12 was installed on the base member 11 is provided (FIG. 3 and FIG. 5).

  As shown in FIG. 6A, the sealing member 26 may be made of a solid material of paint 26a applied to the inner surface of the annular groove 25 of the holder member 12, or as shown in FIG. 6B. Thus, it may be made of the resin 26b filled in the annular groove 25. Alternatively, as shown in FIG. 6 (c), it may be composed of a metal member 26 c bonded to an adhesive 27 applied to the inner surface of the annular groove 25. An annular groove 25 is provided on the lower surface 12 a of the holder member 12 so as to face the upper opening 21 a of the holder member suction pipe 21 provided in the base member 11, and a sealing member 26 is provided in the annular groove 25. The reason is that the sealing member 26 does not interfere with the upper surface 11a of the base member 11.

  3 and 5, a groove-shaped air passage 28 that opens downward is provided on the lower surface 12 a of the holder member 12 so as to extend in the inner region of the annular groove portion 25. The air passage 28 is provided through a central portion of the lower surface 12 a of the holder member 12, and the holder member 12 is installed on the upper surface 11 a of the base member 11, so that the substrate suction conduit 23 provided in the base member 11 is provided. It communicates with the upper opening 23a.

  In FIG. 3, the external pipe line 22 connected to the holder member suction pipe line 21 is connected to the vacuum source 43 via the first vacuum pipe line 42a in which the first electromagnetic control valve 41a is interposed, and the flip chip bonder 1 is provided. By controlling the operation of the first electromagnetic control valve 41a from the control device 44, a vacuum is generated in the holder member suction line 21 via the first vacuum line 42a and the external line 22, and the holder member 12 is used as a base. Vacuum suction can be performed on the member 11 side.

  Further, in FIG. 3, the external conduit 24 connected to the substrate suction conduit 23 is connected to the vacuum source 43 via the second vacuum conduit 42b in which the second electromagnetic control valve 41b is interposed. 2 By controlling the operation of the electromagnetic control valve 41b, a vacuum is generated in the substrate suction line 23 (and in the air path 28 of the holder member 12) via the second vacuum line 42b and the external line 24. The substrate placed on the upper surface 12b of the holder member 12 through the porous portion of the holder member 12 connected to the upper opening 23a of the substrate suction conduit 23 (through innumerable holes inside the porous material). PB can be vacuum-sucked to the holder member 12 side. As described above, since the air passage 28 provided in the lower surface 12a of the holder member 12 is provided so as to expand in the inner region of the annular groove 25, the suction force of the substrate PB generated on the upper surface 12b of the holder member 12 is provided. Becomes uniform over a wide range of the upper surface 12 b of the holder member 12.

  That is, in the substrate holding device 10, the vacuum source 43, the first electromagnetic control valve 41 a and the control device 44 generate a vacuum in the holder member suction pipe 21 and vacuum-suck the holder member 12 toward the base member 11. The member suction portion 46 is configured, and the vacuum source 43, the second electromagnetic control valve 41b, and the control device 44 are formed of a porous portion of the holder member 12 (of the holder member 12) connected to the upper opening 23a of the substrate suction conduit 23. A substrate suction portion 47 is configured to vacuum-suck the substrate PB placed on the upper surface 12b of the holder member 12 to the holder member 12 side through an internal hole).

  As described above, the substrate holding device 10 includes the base member 11, the holder member suction conduit 21 and the substrate suction conduit 23 that are provided inside the base member 11 and open to the upper surface 11 a of the base member 11, and the base member 11. A holder member 12 made of a porous material installed on the upper surface 11a of the base plate and an opening (upper opening portion 21a) of the upper surface 11a of the base member 11 of the holder member suction pipe 21 provided on the lower surface 12a of the holder member 12 A sealing member 26 to be sealed; a holder member suction portion 46 as a holder member suction means for generating a vacuum in the holder member suction pipe 21 to vacuum-suck the holder member 12 toward the base member 11; and a substrate suction pipe A porous portion of the holder member 12 that generates a vacuum in the passage 23 and is connected to the opening (upper opening 23a) of the upper surface 11a of the base member 11 of the substrate suction pipe 23 Through and has become one with the substrate suction unit 47 as a substrate suction means for vacuum sucking the substrate placed PB on the upper surface 12b of the holder member 12 to the holder member 12 side.

In the substrate holding apparatus 10 in the present embodiment, a sealing member 26 is provided on the lower surface 12a (contact surface with the base member 11) of the holder member 12 made of a porous material, and the holder member suction pipe provided on the base member 11 Since the opening portion (upper opening portion 21a) of the passage 21 is sealed by the sealing member 26, the holder member 12 is vacuum-sucked by generating a vacuum in the holder member suction pipe 21, whereby the holder The member 12 can be fixed to the upper surface 11a of the base member 11 with a strong adsorption force. Further, unlike the case where the holder member 12 is screwed to the base member 11, no non-suction area is generated on the upper surface 12b of the holder member 12, and the entire surface of the upper surface 12b of the holder member 12 is effectively used as the suction surface of the substrate PB. Therefore, the substrate PB having the same size as the holder member 12 can be held. In addition, since the vacuum in the upper opening 21a of the holder member suction pipe 21 does not act on the substrate PB, the upper opening 23a of the substrate suction pipe 23 is reliably controlled by on / off control (generation and extinction of vacuum). It is possible to turn on / off the adsorption of the substrate PB (attachment to and removal from the holder member 12).

  On the other hand, for the substrate PB placed on the upper surface 12 b of the holder member 12, a vacuum is generated in the substrate suction conduit 23, and an opening (upper surface opening 23 a) of the upper surface 11 a of the base member 11 of the substrate suction conduit 23. The substrate PB can be fixed to the upper surface 12b of the holder member 12 by vacuum-sucking the substrate PB through the porous portion of the holder member 12 connected to (a hole inside the holder member 12) (FIG. 1 and FIG. 1). (See FIG. 3). Therefore, according to the substrate holding device 10 of the present invention, while maintaining the advantage (the advantage that it is not necessary to replace the holder member 12 according to the size of the substrate PB) due to the holder member 12 being made of a porous material, The substrate PB having the same size as the holder member 12 can be held.

  Although the embodiments of the present invention have been described so far, the present invention is not limited to those shown in the above-described embodiments. For example, in the above-described embodiment, the sealing member 26 that seals the upper opening 21 a of the holder member suction pipe 21 provided in the base member 11 faces the upper opening 21 a of the holder member suction pipe 21. However, if the vacuum suction of the substrate PB through the porous material by the substrate suction line 23 is not hindered, the holder member suction line 21 of the holder member suction line 21 is provided. The sealing member 26 may be provided in a range beyond the portion facing the upper opening 21a. In the above-described embodiment, the substrate holding device 10 is provided in the flip chip bonder 1, but the substrate holding device 10 of the present invention is not limited to the flip chip bonder 1 and has a mechanism for holding the substrate. Can be applied to any device.

  Provided is a substrate holding device capable of holding a substrate having a size equivalent to that of a holder member while maintaining the advantages of the holder member made of a porous material.

The principal part perspective view of the flip chip bonder in one embodiment of this invention The perspective view of the board | substrate holding | maintenance apparatus in the flip chip bonder in one embodiment of this invention Sectional drawing of the board | substrate holding | maintenance apparatus in one embodiment of this invention 1 is an exploded perspective view of a substrate holding device according to an embodiment of the present invention. The lower perspective view of the holder member which comprises the board | substrate holding apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the structure of the sealing member of the holder member which comprises the substrate holding apparatus in one embodiment of this invention.

DESCRIPTION OF SYMBOLS 10 Substrate holding device 11 Base member 11a Upper surface of base member 12 Holder member 12a Lower surface of holder member 12b Upper surface of holder member 21 Holder member suction conduit 21a Upper opening (opening)
23 Substrate suction line 23a Upper opening (opening)
26 Sealing member 46 Holder member suction part (holder member suction means)
47 Substrate suction part (Substrate suction means)
PB substrate

Claims (1)

  A base member, a holder member suction conduit and a substrate suction conduit that are provided inside the base member and open to the upper surface of the base member, a holder member made of a porous material installed on the upper surface of the base member, and a holder A sealing member that is provided on the lower surface of the member and seals the opening on the upper surface of the base member of the holder member suction pipe, and a vacuum is generated in the holder member suction pipe to suck the holder member to the base member. A holder member suction means for generating a vacuum in the substrate suction conduit and placed on the upper surface of the holder member via a porous portion of the holder member connected to the opening on the upper surface of the base member of the substrate suction conduit A substrate holding apparatus comprising: a substrate suction unit that vacuum-sucks the substrate toward the holder member.

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