JP4985667B2 - Substrate holding device - Google Patents

Substrate holding device Download PDF

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JP4985667B2
JP4985667B2 JP2009019150A JP2009019150A JP4985667B2 JP 4985667 B2 JP4985667 B2 JP 4985667B2 JP 2009019150 A JP2009019150 A JP 2009019150A JP 2009019150 A JP2009019150 A JP 2009019150A JP 4985667 B2 JP4985667 B2 JP 4985667B2
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holder
substrate
base
suction
vacuum
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JP2010177485A (en
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智昭 中西
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パナソニック株式会社
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本発明は、フリップチップボンダー等に備えられる基板保持装置に関するものである。   The present invention relates to a substrate holding device provided in a flip chip bonder or the like.

半導体組立工程で使用されるフリップチップボンダー等に備えられる基板保持装置は、内部に管路(基板吸引管路)が設けられたベース部材の上面に金属材料から成るホルダ部材が固定されて成り、基板吸引管路内に真空を発生させ、ホルダ部材の内部に設けられたホルダ内管路を介してホルダ部材上の基板を真空吸引することで、その基板をホルダ部材上に吸着固定できるようになっている。ホルダ内管路はホルダ部材の上面の飛び飛びの位置にしか開口していないことから、保持する基板のサイズが変わったときにはホルダ部材も基板のサイズに応じたものに交換する必要があり、このためホルダ部材は、上面の周囲に設けられたネジ穴から挿通したネジによってベース部材に着脱自在に取り付けられるようになっている。また、ベース部材内に基板吸引管路とは別個に、ベース部材の上面に開口を有するホルダ部材吸引管路を設け、このホルダ部材吸引管路を介してホルダ部材をベース部材側に真空吸引するようにしたものもある。   A substrate holding device provided in a flip chip bonder or the like used in a semiconductor assembly process is formed by fixing a holder member made of a metal material on an upper surface of a base member in which a conduit (substrate suction conduit) is provided, A vacuum is generated in the substrate suction conduit, and the substrate on the holder member is vacuum-sucked through the holder internal conduit provided in the holder member so that the substrate can be sucked and fixed on the holder member. It has become. Since the pipe line in the holder is opened only at the position where the upper surface of the holder member jumps, when the size of the substrate to be held changes, it is necessary to replace the holder member with one corresponding to the size of the substrate. The holder member is detachably attached to the base member by a screw inserted through a screw hole provided around the upper surface. In addition, a holder member suction conduit having an opening on the upper surface of the base member is provided in the base member separately from the substrate suction conduit, and the holder member is vacuum-sucked to the base member side via the holder member suction conduit. There is also something like that.

また、ホルダ部材を金属材料ではなく、内部に無数の空孔を有した多孔質材料により構成したものも知られている(特許文献1)。このような基板保持装置では、基板吸引管路のベース部材の上面の開口部と繋がるホルダ部材の多孔質部分(ホルダ部材の内部の空孔)を介して基板を真空吸引することで、その基板をホルダ部材の上面に吸着固定することができる。ホルダ部材の空孔はホルダ部材の上面の全面に分布しているので、ホルダ部材と同等のサイズ以下の基板であれば吸着固定させることができ、基板のサイズに応じてホルダ部材を交換する必要がないため、オペレータの作業性を向上させることができる。
特開平9−36599号公報
Moreover, what comprised the holder member not with a metal material but with the porous material which has innumerable void | holes inside is also known (patent document 1). In such a substrate holding device, the substrate is vacuum-sucked through a porous portion of the holder member (a hole inside the holder member) connected to the opening on the upper surface of the base member of the substrate suction line. Can be adsorbed and fixed to the upper surface of the holder member. Since the holes in the holder member are distributed over the entire upper surface of the holder member, it can be fixed by suction if the substrate is the same size or smaller as the holder member, and it is necessary to replace the holder member according to the size of the substrate Therefore, the operator's workability can be improved.
Japanese Patent Laid-Open No. 9-36599

このように多孔質材料から成るホルダ部材であっても、メンテナンス作業の必要等から、ベース部材に対して着脱自在な構成とする必要があり、ホルダ部材のベース部材への固定方法は、上記のようにオペレータの作業性に優れた真空吸引によるものが望ましいといえる。しかしながら、ホルダ部材が多孔質材料から成る場合、ホルダ部材吸引管路の開口部はホルダ部材内の空孔を介して外部に通じた状態となるため、大きな吸着力でホルダ部材をベース部材に固定することができない。また、本来はホルダ部材のみの固定が目的であるが、ホルダ部材が多孔質であるが故に基板まで吸着してしまうという不都合も生じる。このためホルダ部材はベース部材にネジ止めせざるを得ないが、そうすると、ホルダ部材のネジ穴の部分は基板を吸着することができない非吸引領域となり、また、ネジ穴の空間部分では基板を支持することもできないので、保持できる基板のサイズがホルダ部材のサイズよりも小さいものに制限されてしまうという問題が生じる。   Thus, even a holder member made of a porous material needs to be configured to be detachable from the base member due to the necessity of maintenance work, etc. The fixing method of the holder member to the base member is as described above. Thus, it can be said that the thing by the vacuum suction excellent in the workability | operativity of an operator is desirable. However, when the holder member is made of a porous material, the opening of the holder member suction conduit is in communication with the outside through a hole in the holder member, so the holder member is fixed to the base member with a large adsorption force. Can not do it. Although the purpose is to fix only the holder member, the holder member is porous so that the substrate is attracted to the substrate. For this reason, the holder member must be screwed to the base member, but in that case, the screw hole portion of the holder member becomes a non-suction area where the substrate cannot be sucked, and the space portion of the screw hole supports the substrate. Therefore, there is a problem that the size of the substrate that can be held is limited to a size smaller than the size of the holder member.

そこで本発明は、ホルダ部材が多孔質材料から成ることによる利点を維持しつつ、ホルダ部材と同等のサイズの基板を保持することができるようにした基板保持装置を提供することを目的とする。   SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate holding device that can hold a substrate having the same size as the holder member while maintaining the advantages of the holder member made of a porous material.

請求項1に記載の基板保持装置は、ベース部材と、ベース部材の内部に設けられてそれぞれベース部材の上面に開口するホルダ部材吸引管路及び基板吸引管路と、ベース部材の上面に設置された多孔質材料から成るホルダ部材と、ホルダ部材の下面に設けられてホル
ダ部材吸引管路のベース部材の上面の開口部を封止する封止部材と、ホルダ部材吸引管路内に真空を発生させてホルダ部材をベース部材側に真空吸引するホルダ部材吸引手段と、基板吸引管路内に真空を発生させ、基板吸引管路のベース部材の上面の開口部と繋がるホルダ部材の多孔質部分を介してホルダ部材の上面に載置された基板をホルダ部材側に真空吸引する基板吸引手段とを備えた。
The substrate holding apparatus according to claim 1 is installed on the upper surface of the base member, the holder member suction conduit and the substrate suction conduit that are provided inside the base member and open to the upper surface of the base member, respectively. A holder member made of a porous material, a sealing member that is provided on the lower surface of the holder member and seals the opening on the upper surface of the base member of the holder member suction conduit, and generates a vacuum in the holder member suction conduit A holder member suction means for vacuum-sucking the holder member toward the base member side, and a porous portion of the holder member that generates a vacuum in the substrate suction conduit and is connected to the opening on the upper surface of the base member of the substrate suction conduit. And a substrate suction means for vacuum-sucking the substrate placed on the upper surface of the holder member to the holder member side.

本発明では、多孔質材料から成るホルダ部材の下面(ベース部材との接触面)に封止部材を設け、ベース部材に設けられたホルダ部材吸引管路の開口部を封止部材によって封止するようにしているので、ホルダ部材吸引管路内に真空を発生させてホルダ部材を真空吸引することにより、ホルダ部材を強固な吸着力でベース部材の上面に固定することができる。また、ホルダ部材がベース部材にネジ止めされる場合と異なり、非吸引領域がホルダ部材の上面に生じず、ホルダ部材の上面の全面を基板の吸着面として有効に利用することができるので、ホルダ部材と同等のサイズの基板を保持することができる。一方、ホルダ部材の上面に載置した基板については、基板吸引管路内に真空を発生させ、基板吸引管路のベース部材の上面の開口部と繋がるホルダ部材の多孔質部分(ホルダ部材の内部の空孔)を介して基板を真空吸引することにより、その基板をホルダ部材の上面に固定することができる。このため本発明によれば、ホルダ部材が多孔質材料から成ることによる利点(基板のサイズに応じてホルダ部材を交換する必要がないといった利点)を維持しつつ、ホルダ部材と同等のサイズの基板を保持することができる。   In the present invention, a sealing member is provided on the lower surface (contact surface with the base member) of the holder member made of a porous material, and the opening of the holder member suction pipe provided in the base member is sealed with the sealing member. Therefore, the holder member can be fixed to the upper surface of the base member with a strong suction force by generating a vacuum in the holder member suction conduit and vacuum-sucking the holder member. Further, unlike the case where the holder member is screwed to the base member, the non-suction area does not occur on the upper surface of the holder member, and the entire upper surface of the holder member can be effectively used as the suction surface of the substrate. A substrate having the same size as the member can be held. On the other hand, for the substrate placed on the upper surface of the holder member, a porous portion of the holder member (inside the holder member) that generates a vacuum in the substrate suction conduit and is connected to the opening on the upper surface of the base member of the substrate suction conduit. The substrate can be fixed to the upper surface of the holder member by vacuum suction of the substrate through the holes. For this reason, according to the present invention, the substrate having the same size as the holder member is maintained while maintaining the advantage (the advantage that the holder member does not need to be replaced according to the size of the substrate) due to the holder member being made of a porous material. Can be held.

以下、図面を参照して本発明の実施の形態について説明する。図1は本発明の一実施の形態におけるフリップチップボンダーの要部斜視図、図2は本発明の一実施の形態におけるフリップチップボンダーにおける基板保持装置の斜視図、図3は本発明の一実施の形態における基板保持装置の断面図、図4は本発明の一実施の形態における基板保持装置の分解斜視図、図5は本発明の一実施の形態における基板保持装置を構成するホルダ部材の下方斜視図、図6(a),(b),(c)は本発明の一実施の形態における基板保持装置を構成するホルダ部材の封止部材の構成を示す図である。   Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a main part of a flip chip bonder according to an embodiment of the present invention, FIG. 2 is a perspective view of a substrate holding device in the flip chip bonder according to an embodiment of the present invention, and FIG. FIG. 4 is an exploded perspective view of the substrate holding device in one embodiment of the present invention, and FIG. 5 is a lower part of a holder member constituting the substrate holding device in one embodiment of the present invention. FIGS. 6A, 6 </ b> B, and 6 </ b> C are views showing the configuration of the sealing member of the holder member that constitutes the substrate holding device according to the embodiment of the present invention.

図1において、フリップチップボンダー1は、基台2上に基板供給部3、基板移載部4、基板位置決め部5、チップ供給部6、チップ反転部7及びチップ接合部8を備えている。   In FIG. 1, the flip chip bonder 1 includes a substrate supply unit 3, a substrate transfer unit 4, a substrate positioning unit 5, a chip supply unit 6, a chip reversing unit 7, and a chip bonding unit 8 on a base 2.

基板供給部3は、一対の平行な基板供給コンベア3aにより、基板PBを水平方向に搬送して所定の位置に供給する。   The substrate supply unit 3 transports the substrate PB in the horizontal direction and supplies it to a predetermined position by a pair of parallel substrate supply conveyors 3a.

基板移載部4は、基板供給部3より供給された基板PBを移載ヘッド4aの基板吸着部4bにより吸着し、移載ヘッド4aを移載ヘッド移動機構4cにより移動させて、基板PBを基板位置決め部5に移載する。   The substrate transfer unit 4 sucks the substrate PB supplied from the substrate supply unit 3 by the substrate suction unit 4b of the transfer head 4a, moves the transfer head 4a by the transfer head moving mechanism 4c, and moves the substrate PB. Transfer to the substrate positioning unit 5.

基板位置決め部5は基台2に対してY軸方向(水平面内の一の方向)に相対移動するY軸ステージ5a、Y軸ステージ5aに対してX軸方向(Y軸方向と直交する水平面内の方向)に相対移動するX軸ステージ5bから成り、X軸ステージ5bの上面には基板移載部4によって基板供給部3から移載された基板PBを保持する基板保持装置10が設けられている。基板位置決め部5は、基板保持装置10によって保持した基板PBを、Y軸ステージ5aの基台2に対するY軸方向への移動及びX軸ステージ5bのY軸ステージ5aに対するX軸方向への移動によって、所定の位置に位置決めする。   The substrate positioning unit 5 moves relative to the base 2 in the Y-axis direction (one direction in the horizontal plane), and in the X-axis direction (in the horizontal plane orthogonal to the Y-axis direction) with respect to the Y-axis stage 5a. The substrate holding device 10 for holding the substrate PB transferred from the substrate supply unit 3 by the substrate transfer unit 4 is provided on the upper surface of the X axis stage 5b. Yes. The substrate positioning unit 5 moves the substrate PB held by the substrate holding device 10 in the Y-axis direction with respect to the base 2 of the Y-axis stage 5a and moves in the X-axis direction with respect to the Y-axis stage 5a of the X-axis stage 5b. And positioning at a predetermined position.

チップ供給部6は基台2に対してY軸方向に相対移動するY軸ステージ6a及びY軸ス
テージ6aに対してX軸方向に相対移動するX軸ステージ6bから成り、X軸ステージ6bの上面にはパレットテーブル6cが設けられている。パレットテーブル6cには基板PBに接合すべきチップPを載せたパレット6dが載置されている。チップ供給部6は、パレット6d内のチップPを、Y軸ステージ6aの基台2に対するY軸方向への移動及びX軸ステージ6bのY軸ステージ6aに対するX軸方向への移動によって、所定の位置に位置決めする。
The chip supply unit 6 includes a Y-axis stage 6a that moves relative to the base 2 in the Y-axis direction and an X-axis stage 6b that moves relative to the Y-axis stage 6a in the X-axis direction. Is provided with a pallet table 6c. On the pallet table 6c, a pallet 6d on which the chip P to be bonded to the substrate PB is placed. The chip supply unit 6 moves the chip P in the pallet 6d in a predetermined direction by moving the Y-axis stage 6a in the Y-axis direction relative to the base 2 and moving the X-axis stage 6b in the X-axis direction relative to the Y-axis stage 6a. Position to position.

チップ反転部7は、チップ供給部6より供給されたチップPを反転ヘッド7aのチップ吸着部7bにより吸着し、反転ヘッド7aをY軸回りに回転させてチップPを表裏反転させる(図1中に示す矢印A1)。そして、反転ヘッド7aを反転ヘッド移動機構7cにより移動させて、チップPを所定の位置に位置決めする。   The chip reversing unit 7 sucks the chip P supplied from the chip supply unit 6 by the chip sucking unit 7b of the reversing head 7a, and rotates the reversing head 7a around the Y axis to reverse the chip P front and back (in FIG. 1). Arrow A1). Then, the reversing head 7a is moved by the reversing head moving mechanism 7c to position the chip P at a predetermined position.

チップ接合部8は、チップ反転部7によって表裏反転されて所定の位置に位置決めされたチップPをボンディングヘッド8aの吸着部8bによって吸着し、ボンディングヘッド8aをボンディングヘッド移動機構8cにより移動させて、チップPを基板位置決め部5に位置決めされた基板PBの上方に移動させる。そして、吸着部8bを下降させて、チップPを基板PB上の目標接合位置に上方から接合させる。   The chip bonding unit 8 sucks the chip P, which is reversed by the chip reversing unit 7 and positioned at a predetermined position, by the sucking unit 8b of the bonding head 8a, and moves the bonding head 8a by the bonding head moving mechanism 8c. The chip P is moved above the substrate PB positioned by the substrate positioning unit 5. And the adsorption | suction part 8b is lowered | hung and the chip | tip P is joined to the target joining position on the board | substrate PB from upper direction.

次に、基板保持装置10について説明する。図2、図3及び図4において、基板保持装置10はベース部材11及びベース部材11の上面11aに設置されたホルダ部材12から成る。   Next, the substrate holding device 10 will be described. 2, 3, and 4, the substrate holding device 10 includes a base member 11 and a holder member 12 installed on the upper surface 11 a of the base member 11.

ベース部材11は金属材料から成り、内部にホルダ部材吸引管路21を有している(図3及び図4)。このホルダ部材吸引管路21の一端側は、ベース部材11の上面11aに開口する環状溝から成る上方開口部21a(図4も参照)となっており、他端側はベース部材11の側方に開口する側方開口部21bとなっている。ホルダ部材吸引管路21の側方開口部21bは、ベース部11の外部に設けられた外部管路22に繋がっている。   The base member 11 is made of a metal material and has a holder member suction pipe 21 therein (FIGS. 3 and 4). One end side of the holder member suction pipe 21 is an upper opening 21 a (see also FIG. 4) composed of an annular groove opened on the upper surface 11 a of the base member 11, and the other end side is a side of the base member 11. It becomes the side opening part 21b which opens in this. The side opening 21 b of the holder member suction pipe 21 is connected to an external pipe 22 provided outside the base portion 11.

ベース部材11の内部にはまた、基板吸引管路23が設けられている(図3)。この基板吸引管路23の一端側は、ベース部材11の上面11aの中央部に開口する上方開口部23aとなっており、他端側はベース部11の側方に開口する側方開口部23bとなっている。基板吸引管路23の側方開口部23bは、ベース部材11の外部に設けられた外部管路24に繋がっている。   A substrate suction line 23 is also provided inside the base member 11 (FIG. 3). One end of the substrate suction line 23 is an upper opening 23 a that opens in the center of the upper surface 11 a of the base member 11, and the other end is a side opening 23 b that opens to the side of the base 11. It has become. The side opening 23 b of the substrate suction pipe 23 is connected to an external pipe 24 provided outside the base member 11.

ホルダ部材12は内部に無数の空孔を有する多孔質材料から成っている。ホルダ部材12の下面12a(ベース部材11の上面11aとの接触面)には、ホルダ部材吸引管路21の上方開口部21aを上下反対にした形状の環状溝部25が、ホルダ部材吸引管路21の上方開口部21aと上下に対向する位置に設けられている。そして、この環状溝部25内には、ホルダ部材12がベース部材11上に設置された状態でホルダ部材吸引管路21の上方開口部21aを封止する封止部材26が設けられている(図3及び図5)。   The holder member 12 is made of a porous material having countless pores inside. On the lower surface 12 a of the holder member 12 (contact surface with the upper surface 11 a of the base member 11), an annular groove portion 25 having a shape in which the upper opening 21 a of the holder member suction pipe 21 is turned upside down is arranged on the holder member suction pipe 21. The upper opening 21a is provided at a position facing vertically. And in this annular groove part 25, the sealing member 26 which seals the upper opening part 21a of the holder member suction conduit 21 in the state in which the holder member 12 was installed on the base member 11 is provided (FIG. 3 and FIG. 5).

封止部材26は、図6(a)に示すように、ホルダ部材12の環状溝部25の内面に塗布した塗料26aの固形物から成るものであってもよいし、図6(b)に示すように、環状溝部25内に充填した樹脂26bから成るものであってもよい。或いは、図6(c)に示すように、環状溝部25の内面に塗布された接着剤27に接着された金属部材26cから成るものであってもよい。なお、ホルダ部材12の下面12aに、ベース部材11に設けられたホルダ部材吸引管路21の上方開口部21aと対向する環状溝部25が設けられ、この環状溝部25内に封止部材26が設けられるようにしているのは、封止部材26がベース部材11の上面11aと干渉しないようにするためである。   As shown in FIG. 6A, the sealing member 26 may be made of a solid material of paint 26a applied to the inner surface of the annular groove 25 of the holder member 12, or as shown in FIG. 6B. Thus, it may be made of the resin 26b filled in the annular groove 25. Alternatively, as shown in FIG. 6 (c), it may be composed of a metal member 26 c bonded to an adhesive 27 applied to the inner surface of the annular groove 25. An annular groove 25 is provided on the lower surface 12 a of the holder member 12 so as to face the upper opening 21 a of the holder member suction pipe 21 provided in the base member 11, and a sealing member 26 is provided in the annular groove 25. The reason is that the sealing member 26 does not interfere with the upper surface 11a of the base member 11.

図3及び図5において、ホルダ部材12の下面12aには、下方に開口する溝状の空気通路28が、環状溝部25の内側領域内を広がって設けられている。この空気通路28はホルダ部材12の下面12aの中央部を通って設けられ、ホルダ部材12がベース部材11の上面11aに設置された状態で、ベース部材11に設けられた基板吸引管路23の上方開口部23aと連通するようになっている。   3 and 5, a groove-shaped air passage 28 that opens downward is provided on the lower surface 12 a of the holder member 12 so as to extend in the inner region of the annular groove portion 25. The air passage 28 is provided through a central portion of the lower surface 12 a of the holder member 12, and the holder member 12 is installed on the upper surface 11 a of the base member 11, so that the substrate suction conduit 23 provided in the base member 11 is provided. It communicates with the upper opening 23a.

図3において、ホルダ部材吸引管路21に繋がる外部管路22は第1電磁制御バルブ41aが介装された第1真空管路42aを介して真空源43に繋がっており、フリップチップボンダー1が備える制御装置44から第1電磁制御バルブ41aの作動制御を行うことにより、第1真空管路42a及び外部管路22を介してホルダ部材吸引管路21内に真空を発生させて、ホルダ部材12をベース部材11側に真空吸引することができるようになっている。   In FIG. 3, the external pipe line 22 connected to the holder member suction pipe line 21 is connected to the vacuum source 43 via the first vacuum pipe line 42a in which the first electromagnetic control valve 41a is interposed, and the flip chip bonder 1 is provided. By controlling the operation of the first electromagnetic control valve 41a from the control device 44, a vacuum is generated in the holder member suction line 21 via the first vacuum line 42a and the external line 22, and the holder member 12 is used as a base. Vacuum suction can be performed on the member 11 side.

また、図3において、基板吸引管路23に繋がる外部管路24は第2電磁制御バルブ41bが介装された第2真空管路42bを介して真空源43に繋がっており、制御装置44から第2電磁制御バルブ41bの作動制御を行うことにより、第2真空管路42b及び外部管路24を介して基板吸引管路23内(及びホルダ部材12の空気通路28内)に真空を発生させて、基板吸引管路23の上方開口部23aと繋がるホルダ部材12の多孔質部分を介して(多孔質材料の内部の無数の空孔を介して)、ホルダ部材12の上面12bに載置された基板PBを、ホルダ部材12側に真空吸引することができるようになっている。なお、前述のように、ホルダ部材12の下面12aに設けられた空気通路28は環状溝部25の内側領域内を広がって設けられているので、ホルダ部材12の上面12bに生じる基板PBの吸引力はホルダ部材12の上面12bの広い範囲で均一なものとなる。   Further, in FIG. 3, the external conduit 24 connected to the substrate suction conduit 23 is connected to the vacuum source 43 via the second vacuum conduit 42b in which the second electromagnetic control valve 41b is interposed. 2 By controlling the operation of the electromagnetic control valve 41b, a vacuum is generated in the substrate suction line 23 (and in the air path 28 of the holder member 12) via the second vacuum line 42b and the external line 24. The substrate placed on the upper surface 12b of the holder member 12 through the porous portion of the holder member 12 connected to the upper opening 23a of the substrate suction conduit 23 (through innumerable holes inside the porous material). PB can be vacuum-sucked to the holder member 12 side. As described above, since the air passage 28 provided in the lower surface 12a of the holder member 12 is provided so as to expand in the inner region of the annular groove 25, the suction force of the substrate PB generated on the upper surface 12b of the holder member 12 is provided. Becomes uniform over a wide range of the upper surface 12 b of the holder member 12.

すなわちこの基板保持装置10では、真空源43、第1電磁制御バルブ41a及び制御装置44は、ホルダ部材吸引管路21内に真空を発生させてホルダ部材12をベース部材11側に真空吸引するホルダ部材吸引部46を構成しており、真空源43、第2電磁制御バルブ41b及び制御装置44は、基板吸引管路23の上方開口部23aと繋がるホルダ部材12の多孔質部分(ホルダ部材12の内部の空孔)を介してホルダ部材12の上面12bに載置された基板PBをホルダ部材12側に真空吸引する基板吸引部47を構成している。   That is, in the substrate holding device 10, the vacuum source 43, the first electromagnetic control valve 41 a and the control device 44 generate a vacuum in the holder member suction pipe 21 and vacuum-suck the holder member 12 toward the base member 11. The member suction portion 46 is configured, and the vacuum source 43, the second electromagnetic control valve 41b, and the control device 44 are formed of a porous portion of the holder member 12 (of the holder member 12) connected to the upper opening 23a of the substrate suction conduit 23. A substrate suction portion 47 is configured to vacuum-suck the substrate PB placed on the upper surface 12b of the holder member 12 to the holder member 12 side through an internal hole).

このように基板保持装置10は、ベース部材11と、ベース部材11の内部に設けられてそれぞれベース部材11の上面11aに開口するホルダ部材吸引管路21及び基板吸引管路23と、ベース部材11の上面11aに設置された多孔質材料から成るホルダ部材12と、ホルダ部材12の下面12aに設けられてホルダ部材吸引管路21のベース部材11の上面11aの開口部(上方開口部21a)を封止する封止部材26と、ホルダ部材吸引管路21内に真空を発生させてホルダ部材12をベース部材11側に真空吸引するホルダ部材吸引手段としてのホルダ部材吸引部46と、基板吸引管路23内に真空を発生させ、基板吸引管路23のベース部材11の上面11aの開口部(上方開口部23a)と繋がるホルダ部材12の多孔質部分を介してホルダ部材12の上面12bに載置された基板PBをホルダ部材12側に真空吸引する基板吸引手段としての基板吸引部47を備えたものとなっている。   As described above, the substrate holding device 10 includes the base member 11, the holder member suction conduit 21 and the substrate suction conduit 23 that are provided inside the base member 11 and open to the upper surface 11 a of the base member 11, and the base member 11. A holder member 12 made of a porous material installed on the upper surface 11a of the base plate and an opening (upper opening portion 21a) of the upper surface 11a of the base member 11 of the holder member suction pipe 21 provided on the lower surface 12a of the holder member 12 A sealing member 26 to be sealed; a holder member suction portion 46 as a holder member suction means for generating a vacuum in the holder member suction pipe 21 to vacuum-suck the holder member 12 toward the base member 11; and a substrate suction pipe A porous portion of the holder member 12 that generates a vacuum in the passage 23 and is connected to the opening (upper opening 23a) of the upper surface 11a of the base member 11 of the substrate suction pipe 23 Through and has become one with the substrate suction unit 47 as a substrate suction means for vacuum sucking the substrate placed PB on the upper surface 12b of the holder member 12 to the holder member 12 side.

本実施の形態における基板保持装置10では、多孔質材料から成るホルダ部材12の下面12a(ベース部材11との接触面)に封止部材26を設け、ベース部材11に設けられたホルダ部材吸引管路21の開口部(上方開口部21a)を封止部材26によって封止するようにしているので、ホルダ部材吸引管路21内に真空を発生させてホルダ部材12を真空吸引することにより、ホルダ部材12を強固な吸着力でベース部材11の上面11aに固定することができる。また、ホルダ部材12がベース部材11にネジ止めされる場
合と異なり、非吸引領域がホルダ部材12の上面12bに生じず、ホルダ部材12の上面12bの全面を基板PBの吸着面として有効に利用することができるので、ホルダ部材12と同等のサイズの基板PBを保持することができる。加えて、ホルダ部材吸引管路21の上方開口部21aの真空が基板PBに作用しないため、基板吸引管路23の上方開口部23aの真空のオンオフ(真空の発生及び消滅)制御により、確実に基板PBの吸着のオンオフ(ホルダ部材12への着脱)が可能となる。
In the substrate holding apparatus 10 in the present embodiment, a sealing member 26 is provided on the lower surface 12a (contact surface with the base member 11) of the holder member 12 made of a porous material, and the holder member suction pipe provided on the base member 11 Since the opening portion (upper opening portion 21a) of the passage 21 is sealed by the sealing member 26, the holder member 12 is vacuum-sucked by generating a vacuum in the holder member suction pipe 21, whereby the holder The member 12 can be fixed to the upper surface 11a of the base member 11 with a strong adsorption force. Further, unlike the case where the holder member 12 is screwed to the base member 11, no non-suction area is generated on the upper surface 12b of the holder member 12, and the entire surface of the upper surface 12b of the holder member 12 is effectively used as the suction surface of the substrate PB. Therefore, the substrate PB having the same size as the holder member 12 can be held. In addition, since the vacuum in the upper opening 21a of the holder member suction pipe 21 does not act on the substrate PB, the upper opening 23a of the substrate suction pipe 23 is reliably controlled by on / off control (generation and extinction of vacuum). It is possible to turn on / off the adsorption of the substrate PB (attachment to and removal from the holder member 12).

一方、ホルダ部材12の上面12bに載置した基板PBについては、基板吸引管路23内に真空を発生させ、基板吸引管路23のベース部材11の上面11aの開口部(上面開口部23a)と繋がるホルダ部材12の多孔質部分(ホルダ部材12の内部の空孔)介して基板PBを真空吸引することにより、その基板PBをホルダ部材12の上面12bに固定することができる(図1及び図3参照)。このため本発明における基板保持装置10によれば、ホルダ部材12が多孔質材料から成ることによる利点(基板PBのサイズに応じてホルダ部材12を交換する必要がないといった利点)を維持しつつ、ホルダ部材12と同等のサイズの基板PBを保持することができる。   On the other hand, for the substrate PB placed on the upper surface 12 b of the holder member 12, a vacuum is generated in the substrate suction conduit 23, and an opening (upper surface opening 23 a) of the upper surface 11 a of the base member 11 of the substrate suction conduit 23. The substrate PB can be fixed to the upper surface 12b of the holder member 12 by vacuum-sucking the substrate PB through the porous portion of the holder member 12 connected to (a hole inside the holder member 12) (FIG. 1 and FIG. 1). (See FIG. 3). Therefore, according to the substrate holding device 10 of the present invention, while maintaining the advantage (the advantage that it is not necessary to replace the holder member 12 according to the size of the substrate PB) due to the holder member 12 being made of a porous material, The substrate PB having the same size as the holder member 12 can be held.

これまで本発明の実施の形態について説明してきたが、本発明は上述の実施の形態に示したものに限定されない。例えば、上述の実施の形態では、ベース部材11に設けられたホルダ部材吸引管路21の上方開口部21aを封止する封止部材26は、ホルダ部材吸引管路21の上方開口部21aと対向する部分(環状溝部25内)にのみ設けられる構成であったが、基板吸引管路23による多孔質材料を介した基板PBの真空吸引が妨げられないのであれば、ホルダ部材吸引管路21の上方開口部21aと対向する部分を越えた範囲に封止部材26が設けられていても構わない。また、上述の実施の形態では、基板保持装置10がフリップチップボンダー1に備えられるものであったが、本発明の基板保持装置10はフリップチップボンダー1に限られず、基板を保持する機構を有するあらゆる装置に適用することができる。   Although the embodiments of the present invention have been described so far, the present invention is not limited to those shown in the above-described embodiments. For example, in the above-described embodiment, the sealing member 26 that seals the upper opening 21 a of the holder member suction pipe 21 provided in the base member 11 faces the upper opening 21 a of the holder member suction pipe 21. However, if the vacuum suction of the substrate PB through the porous material by the substrate suction line 23 is not hindered, the holder member suction line 21 of the holder member suction line 21 is provided. The sealing member 26 may be provided in a range beyond the portion facing the upper opening 21a. In the above-described embodiment, the substrate holding device 10 is provided in the flip chip bonder 1, but the substrate holding device 10 of the present invention is not limited to the flip chip bonder 1 and has a mechanism for holding the substrate. Can be applied to any device.

ホルダ部材が多孔質材料から成ることによる利点を維持しつつ、ホルダ部材と同等のサイズの基板を保持することができるようにした基板保持装置を提供する。   Provided is a substrate holding device capable of holding a substrate having a size equivalent to that of a holder member while maintaining the advantages of the holder member made of a porous material.

本発明の一実施の形態におけるフリップチップボンダーの要部斜視図The principal part perspective view of the flip chip bonder in one embodiment of this invention 本発明の一実施の形態におけるフリップチップボンダーにおける基板保持装置の斜視図The perspective view of the board | substrate holding | maintenance apparatus in the flip chip bonder in one embodiment of this invention 本発明の一実施の形態における基板保持装置の断面図Sectional drawing of the board | substrate holding | maintenance apparatus in one embodiment of this invention 本発明の一実施の形態における基板保持装置の分解斜視図1 is an exploded perspective view of a substrate holding device according to an embodiment of the present invention. 本発明の一実施の形態における基板保持装置を構成するホルダ部材の下方斜視図The lower perspective view of the holder member which comprises the board | substrate holding apparatus in one embodiment of this invention (a)(b)(c)本発明の一実施の形態における基板保持装置を構成するホルダ部材の封止部材の構成を示す図(A) (b) (c) The figure which shows the structure of the sealing member of the holder member which comprises the substrate holding apparatus in one embodiment of this invention.

10 基板保持装置
11 ベース部材
11a ベース部材の上面
12 ホルダ部材
12a ホルダ部材の下面
12b ホルダ部材の上面
21 ホルダ部材吸引管路
21a 上方開口部(開口部)
23 基板吸引管路
23a 上方開口部(開口部)
26 封止部材
46 ホルダ部材吸引部(ホルダ部材吸引手段)
47 基板吸引部(基板吸引手段)
PB 基板
DESCRIPTION OF SYMBOLS 10 Substrate holding device 11 Base member 11a Upper surface of base member 12 Holder member 12a Lower surface of holder member 12b Upper surface of holder member 21 Holder member suction conduit 21a Upper opening (opening)
23 Substrate suction line 23a Upper opening (opening)
26 Sealing member 46 Holder member suction part (holder member suction means)
47 Substrate suction part (Substrate suction means)
PB substrate

Claims (1)

  1. ベース部材と、ベース部材の内部に設けられてそれぞれベース部材の上面に開口するホルダ部材吸引管路及び基板吸引管路と、ベース部材の上面に設置された多孔質材料から成るホルダ部材と、ホルダ部材の下面に設けられてホルダ部材吸引管路のベース部材の上面の開口部を封止する封止部材と、ホルダ部材吸引管路内に真空を発生させてホルダ部材をベース部材側に真空吸引するホルダ部材吸引手段と、基板吸引管路内に真空を発生させ、基板吸引管路のベース部材の上面の開口部と繋がるホルダ部材の多孔質部分を介してホルダ部材の上面に載置された基板をホルダ部材側に真空吸引する基板吸引手段とを備えたことを特徴とする基板保持装置。   A base member, a holder member suction conduit and a substrate suction conduit that are provided inside the base member and open to the upper surface of the base member, a holder member made of a porous material installed on the upper surface of the base member, and a holder A sealing member that is provided on the lower surface of the member and seals the opening on the upper surface of the base member of the holder member suction pipe, and a vacuum is generated in the holder member suction pipe to suck the holder member to the base member. A holder member suction means for generating a vacuum in the substrate suction conduit and placed on the upper surface of the holder member via a porous portion of the holder member connected to the opening on the upper surface of the base member of the substrate suction conduit A substrate holding apparatus comprising: a substrate suction unit that vacuum-sucks the substrate toward the holder member.
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