JP4978431B2 - Radiation heating device thermal uniformity adjustment structure - Google Patents

Description

  The present invention relates to a technique for adjusting the thermal uniformity of a radiant heating device, and more particularly to a technique for equalizing radiant energy by changing the position of the radiant heaters and the position of the reflectors arranged in parallel. .

The radiant heating device is used for the purpose of heating an object to be heated by radiant heat by irradiating the object to be heated with infrared rays.
The radiation heating device using the heater lamp is often used in, for example, a semiconductor manufacturing process because it has a merit that the temperature is not easily biased and can be used even in a vacuum.
Patent Document 1 discloses a technology of an energy beam heating device and a control method thereof. In the semiconductor manufacturing process, a heating lamp, which is a heating means fixed on a rotary table, is provided in order to uniformly heat and maintain the entire surface of the semiconductor wafer. In this technique, the optical axes of the heating lamps are attached to the rotary table at different angles, and the rotary table is rotated to uniformly heat the semiconductor wafer.
The heating lamp provided on the rotary table can adjust the output, and temperature unevenness can be suppressed by adjusting the output.

Further, in Patent Document 2, as a wafer heating apparatus, a corrugated transparent optical system in which a convex lens and a concave lens are combined is sandwiched between a heater lamp and an object to be heated, so that the light hitting the wafer is made uniform. A technique for heating evenly is disclosed.
This transparent optical system is an example using one corresponding to a heater lamp arranged in a circle in accordance with a wafer to be heated, and another one using one corresponding to a heater lamp arranged in a straight line. Examples have been described.

By the way, there is a case where a radiation heating device is used for an application of curing an adhesive such as an electronic component, a sealing gel, or the like.
This is because it is advantageous when the shape of the object to be heated is complex or when it is desired to heat the object evenly. It is also an advantage that the heating rate is fast.
However, in the method using the heater lamp in a circular shape as described in Patent Document 1 and Patent Document 2, there is a large loss to cope with a square workpiece. Therefore, it is conceivable to employ a system in which a number of heater lamps, which are radiant heaters, are arranged in parallel to heat a region corresponding to a product.

JP-A-6-224135 JP 2003-264157 A

However, when the techniques disclosed in Patent Document 1 and Patent Document 2 are used, the following problems are considered.
When curing the adhesive or sealing gel attached to the product, it is desirable to heat evenly. However, if the heater lamps are arranged in parallel, the radiation energy of the part where the light from the heater lamps overlaps will be increased. There is a problem of being amplified.
That is, in the part where the lights of the adjacent heater lamps overlap, the workpiece is heated by the light emitted from the two heater lamps. Therefore, the radiant energy is synthesized and the workpiece may be heated more than necessary.
When the radiant energy is combined, the combined radiant energy becomes higher than when the heater lamp alone is irradiated. For this reason, when the workpiece is heated in a plane, a temperature difference occurs between a place where the heater lamp exists, a place where the heater lamp does not exist, and a place where light overlaps. Further, a temperature difference also occurs depending on the distance from the heater lamp.

The ideal heating temperature of a workpiece is determined by the requirement for the upper limit temperature due to the semiconductor element attached to the workpiece, the resin parts to be bonded and the like, and the lower limit temperature requirement due to the curing temperature of the adhesive sealing gel. The And when the temperature range requested | required is narrow, it is not preferable that a temperature difference arises.
As described in Patent Document 1, mounting the heater lamps at different angles and rotating them with the rotary table has a problem that energy loss increases when used for a rectangular workpiece as described above.
In addition, it is conceivable to use a transparent optical system such as that disclosed in Patent Document 2 to equalize the temperature, but when manufacturing a lens for a transparent optical system, fine corrections require trial and error, which is costly. It seems that it is not suitable for.

  Accordingly, an object of the present invention is to provide a heat uniformity adjusting structure of a radiant heating device capable of adjusting radiant energy at low cost in order to solve such problems.

In order to achieve the above object, the heat equalization adjusting structure of the radiant heating device according to the present invention has the following characteristics.
(1) In the thermal uniformity adjustment structure of the radiant heating device that improves the thermal uniformity of the radiant heating device in which a plurality of radiant heaters including a reflecting mirror that reflects light in the direction of the heating object is arranged in parallel,
Said plurality of reflecting mirrors each comprise a rotational axis, rotates around the radiant heater, respectively fixable at any angle,
The plurality of radiant heaters are configured to be movable together with the reflecting mirror in a direction approaching or separating from the heating object,
It is characterized by.

( 2 ) In the heat uniformity adjusting structure of the radiation heating device according to (1 ) ,
Among the plurality of radiant heaters, a second radiant heater arranged next to the first radiant heater is moved together with the reflecting mirror in a direction away from or closer to the first radiant heater. It is a possible configuration.

The following functions and effects can be obtained by the heat uniformity adjusting structure of the radiant heating device according to the present invention having such characteristics.
First, the invention described in (1) is a radiant heating device that improves the thermal uniformity of a radiant heating device in which a plurality of radiant heaters including a reflecting mirror that reflects light in the direction of a heating object is arranged in parallel. in thermal uniformity adjustment structure comprises said plurality of reflector rotation axes, respectively, and rotates around the radiant heater, respectively fixable at any angle.
For example, when three heater lamps are arranged in parallel as a radiant heater, the light from the center heater lamp is left and right by turning the reflecting mirrors of the left and right heater lamps outward without leaving the center. It is possible to adjust so that the radiant energy reaching the object to be heated is hard to be amplified by overlapping with the light of the heater lamp.

Since the reflecting mirror rotates around the radiation heater and can be fixed at an arbitrary position, it can be easily adjusted and does not require a dedicated lens as in Patent Document 2, which is costly. Can be adjusted at low cost.
In addition, although the state of radiant energy varies depending on the output of the radiant heater, it is possible to adjust the reflector and fix it at an arbitrary angle, so the output of the radiant heater changes due to changes in the heating object, etc. But we can respond.

Moreover, the invention described in (1) is a configuration in which the plurality of radiant heaters can move together with the reflecting mirror in a direction in which the plurality of radiant heaters approach or separate from the object to be heated.
In addition, the invention described in ( 2 ) is a second aspect of the radiation uniformity adjusting structure for the radiant heating device described in (1 ), wherein the second radiant heater is disposed next to the first radiant heater among the plurality of radiant heaters. This radiation heater can be moved together with the reflecting mirror in a direction away from or close to the first radiation heater.
In this way, the individual radiant heaters can be moved together with the reflector in the direction of approaching and separating from the object to be heated, and in the direction of parallel movement, so that the radiation energy reaching the object to be heated is reached. Can be finely adjusted so as not to amplify.

Next, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a plan view schematically showing the configuration of the radiant heating device 10. FIG. 2 is a side sectional view schematically showing the configuration of the radiation heating apparatus 10.
The radiant heating device 10 includes a heater lamp 11 and a reflecting mirror 12.
The heater lamp 11 is a radiant heater, and can heat the workpiece 20 by irradiating the workpiece 20 as a heated body with infrared rays using a halogen heater, a carbon heater, or the like. The output of the heater lamp 11 can be arbitrarily changed.
The heater lamp 11 provided in the radiant heating device 10 includes a first heater lamp 11a, a second heater lamp 11b, a third heater lamp 11c, a fourth heater lamp 11d, and a fifth heater lamp 11e. There are five. For convenience, the lamps are referred to as the first heater lamp 11a to the fifth heater lamp 11e. When the heater lamp 11 is described without particular notice, any one of the first heater lamp 11a to the fifth heater lamp 11e, or It is assumed that it points to the whole.

The reflecting mirror 12 provided in the radiation heating device 10 has a semicircular mirror surface so as to surround the heater lamp 11. The mirror surface of the reflecting mirror 12 is made of, for example, buffed stainless steel or the like, and gold is vapor-deposited on the surface thereof to improve the reflectance.
FIG. 3 shows an enlarged schematic diagram of the heater lamp 11 and the reflecting mirror 12.
The reflecting mirror 12 has a rotation axis C at substantially the center of the heater lamp 11 and includes a mechanism that can rotate in the θ-axis direction. It also has a mechanism that can be fixed at an arbitrary position. Therefore, the reflecting mirror 12 can rotate around the heater lamp 11 and can be fixed at an arbitrary position.
Further, the heater lamp 11 and the reflecting mirror 12 can be individually adjusted in the direction of approaching and separating from the workpiece 20 and the direction of moving parallel to the workpiece 20.

Therefore, the heater lamp 11 and the reflecting mirror 12 can be moved together in the Z-axis direction, which is the direction in which the heater lamp 11 approaches and separates from the workpiece 20, and can be fixed at an arbitrary position.
Further, the heater lamp 11 and the reflecting mirror 12 can be moved together in the Y-axis direction, which is the direction in which the heater lamp 11 moves in parallel to the workpiece 20, and can be adjusted to an arbitrary position.
The moving mechanism is not particularly limited. For example, a trapezoidal screw may be combined to be movable in the Z-axis and Y-axis directions, or a slide mechanism using a servo motor may be used.

The work 20 is an inverter component made of an aluminum alloy, and a semiconductor component or the like is mounted on the surface thereof. The adhesive or sealing gel applied to the surface is cured by irradiating infrared rays with the radiant heating device 10. Resin parts are bonded by an adhesive applied to the surface.
The workpiece 20 is conveyed by the roller conveyor 14 as a conveying device, and is heated after being stopped at a predetermined position where the heater lamps 11 are arranged.
The jig 13 includes a window 15 and separates the heater lamp 11 and the workpiece 20. The room in which the heater lamp 11 is provided is filled with nitrogen or the like, and is sealed so that dust does not enter from the outside.

Since the radiant heating device 10 of the present embodiment has the above-described configuration, the following operation is exhibited.
FIG. 4 shows the distribution of the radiant energy given to the workpiece 20 by the radiant heating device 10 in the AA cross section of FIG. FIG. 5 shows the distribution of the radiant energy given to the workpiece 20 by the radiant heating device 10 as viewed in the direction of arrow B in FIG.
The horizontal axis indicates the position, and the vertical axis indicates the amount of radiant energy. Since the workpiece 20 is heated by radiant energy, it may be assumed that immediately after the workpiece 20 is irradiated with infrared rays by the heater lamp 11, it appears as an uneven temperature. Actually, the irradiation energy amount is measured by attaching a temperature measuring element to the workpiece 20 and directly measuring the temperature of the workpiece 20.
4 and 5 indicate the width of the workpiece 20. Therefore, the area sandwiched by the alternate long and short dash line is the width of the work 20 and is the area where the combined radiation energy E is applied to the work 20.

The workpiece 20 is conveyed to a predetermined position of the radiant heating device 10, and heating is started by the heater lamp 11.
At this time, if the first heater lamp 11a to the fifth heater lamp 11e are simply arranged at equal intervals, the radiant energy is given to the workpiece 20 almost equally in the direction of arrow B in FIG. . The first radiation curve e1 from the first heater lamp 11a, the second radiation curve e2 from the second heater lamp 11b, the third radiation acid e3 from the third heater lamp 11c, and the fourth heater The fourth radiation curve e4 from the lamp 11d and the energy indicated by the fifth radiation curve e5 from the fifth heater lamp 11e are given to the workpiece 20.

The first radiation curve e1 to the fifth radiation curve e5 given to the first heater lamp 11a to the fifth heater lamp 11e are curves that virtually indicate the respective radiation energies. When the workpiece 20 is heated using the heater lamp 11 and the reflecting mirror 12, the workpiece 20 is heated by the light (infrared ray) directly irradiated from the heater lamp 11 and the light reflected by the reflecting mirror 12. Become. For this reason, the heater lamp 11 itself becomes a shadow, and the portion directly above the heater lamp 11 is hardly heated. Therefore, as shown in the first radiation curve e1 to the fifth radiation curve e5 shown in FIG. 4, the center of the heater lamp 11 is a concave curve.
However, actually, the combined radiation energy E obtained by combining the first radiation curve e1 to the fifth radiation curve e5 is the sum of the radiation energy given to the workpiece 20.
That is, as shown in the combined radiation energy E of FIG. 4, a peak is generated around the third heater lamp 11c.
Accordingly, the combined radiation energy E is highest at the third heater lamp 11c located at the center, the second heater lamp 11b and the fourth heater lamp 11d are slightly lower, and the first heater lamp 11a. And the portion of the fifth heater lamp 11e is lowered.

However, the adhesive or sealing gel applied to the workpiece 20 requires a temperature of 120 ° C. or higher, whereas the lower limit temperature of the resin component bonded to the workpiece 20 is set to 150 ° C. For this reason, the temperature range which the workpiece | work 20 requires is 120 degreeC or more and 150 degrees C or less.
That is, it is desirable to suppress the difference in the combined radiation energy E within 30 ° C.
When the arrangement of the heater lamps 11 is as shown in FIG. 2, the direction of arrow B is substantially uniform as shown in FIG. 5, but a peak occurs in the AA cross-sectional direction as shown in FIG. .
In the applicant's experiment, when the output of the heater lamp 11 is the same, this temperature difference is about 60 ° C. Therefore, when the upper limit is matched, the lower limit is broken, and there is a possibility that a portion where the adhesive or the sealing gel does not harden is formed. Further, if the lower limit is combined, the upper limit is exceeded, so that the resin component may be deformed by heat.

For this reason, the heater lamp 11 and the reflecting mirror 12 are adjusted so that the distribution of the combined radiation energy E is as flat as possible.
In FIG. 6, the side view which showed the example of adjustment of the radiation heating apparatus 10 is shown. This corresponds to FIG. The drawings are partially omitted. Moreover, the synthetic radiation energy E of the radiation heating apparatus 10 is shown in FIG. This corresponds to FIG.
The position of the heater lamp 11 is adjusted as shown in FIG. That is, the first heater lamp 11a is inclined leftward in the θ-axis direction, and the second heater lamp 11b is inclined leftward in the θ-axis direction and moved downward in the Z-axis direction. The third heater lamp 11c is moved downward in the Z-axis direction. The fourth heater lamp 11d is inclined rightward in the θ-axis direction and moves downward in the Z-axis direction. The fifth heater lamp 11e is tilted to the right in the θ-axis direction.

It moves in this way, and it adjusts so that the synthetic radiation energy E may become equal as shown in FIG. The output of the heater lamp 11 may be adjusted as necessary.
The applicant can reduce the difference in the combined radiation energy E to about 15 ° C. in the state shown in FIG. 7 while the difference in the combined radiation energy E was 60 ° C. in the state shown in FIG. Have confirmed. Thereby, the workpiece | work 20 which satisfy | filled the upper limit and the minimum with the radiation heating apparatus 10 is attained.
Furthermore, optimization can be achieved by combining the adjustment in the Y-axis direction and the adjustment of the output of the heater lamp 11, and it can be expected to reduce the temperature difference.

In the present embodiment, since the above-described configuration and operation are shown, the effects described below can be obtained.
First, the temperature difference can be reduced.
In the thermal uniformity adjustment structure of the radiant heating device 10 that improves the thermal uniformity of the radiant heating device 10 in which a plurality of heater lamps 11 each having a reflecting mirror 12 that reflects light in the direction of the workpiece 20 are arranged in parallel, the reflective mirror 12 Has a rotation axis C, and the reflecting mirror 12 rotates around the heater lamp 11 and can be fixed at an arbitrary angle. Therefore, it is difficult to amplify the radiation energy by overlapping the light emitted from the heater lamp 11. It is possible to adjust to.
For example, when three heater lamps 11 are arranged in parallel as a radiant heater, the center heater lamp 11 is left by directing the reflecting mirrors 12 of the left and right heater lamps 11 to the outside without changing the center. Can be adjusted so that the radiant energy reaching the workpiece 20 is not amplified by overlapping the light of the left and right heater lamps 11.
Since the reflecting mirror 12 rotates around the heater lamp 11 and can be fixed at an arbitrary position, it can be easily adjusted and does not require a dedicated lens as in Patent Document 2. Adjustment is possible at low cost.

  Further, the heater lamp 11 is configured to be movable together with the reflecting mirror 12 in a direction in which the heater lamp 11 approaches or separates from the workpiece 20, and for example, a second heater lamp 11b disposed next to the third heater lamp 11c. Can be moved together with the reflecting mirror 12 in a direction away from or closer to the third heater lamp 11c, so that it cannot be adjusted by simply rotating the reflecting mirror 12 around the heater lamp 11. In addition, by further finely adjusting the position of the heater lamp 11, the composite radiation energy E given to the work 20 can be made uniform, and the heat uniformity of the work 20 can be improved.

As described above, the temperature range required by the workpiece 20 needs to be equal to or higher than the adhesive curing temperature at which the adhesive or the sealing gel is cured and equal to or lower than the heat resistance temperature required by the resin component or the like that adheres to the upper surface of the workpiece 20. Therefore, it is required to be 120 ° C. or higher and 150 ° C. or lower. That is, the temperature difference must be within 30 ° C.
In this embodiment, by optimizing the positions of the heater lamp 11 and the reflecting mirror 12 in the θ-axis direction, the Y-axis direction, and the Z-axis direction, it becomes possible to adjust the temperature difference within 15 ° C. The temperature unevenness given to 20 can be suppressed.

Secondly, it can be adjusted at low cost.
Providing an adjustment mechanism for the heater lamp 11 and the reflecting mirror 12 can be cheaper than forming a dedicated optical lens as disclosed in Patent Document 2.
If the temperature at which the workpiece 20 is heated changes, the position and angle of the heater lamp 11 need to be changed, and the composite radiation energy E may need to be increased depending on the size of the workpiece 20. This is because if the volume of the workpiece 20 is increased, a necessary temperature cannot be achieved within a predetermined time unless the synthetic radiant energy E is increased.
Therefore, when the workpiece 20 is switched, the cost performance is further improved as compared with the case of using a dedicated optical lens as in Patent Document 2. If the Y-axis, Z-axis, and θ-axis adjustments are automated, the number of adjustment steps can be reduced.

Although the invention has been described according to the present embodiment, the invention is not limited to the embodiment, and by appropriately changing a part of the configuration without departing from the spirit of the invention. It can also be implemented.
For example, the number of heater lamps 11 and the shape and material of the reflecting mirror 12 may be appropriately changed.
Further, in the present embodiment, the required temperature of the workpiece 20 is 120 or more and 150 or less, but this temperature may be changed as appropriate.
Moreover, although it is set as the workpiece | work 20 to which a semiconductor element and a resin component are adhere | attached as a heating object, it does not prevent using it for soldering etc. besides an adhesive agent or the gel for sealing.

The top view which represented typically about the structure of the radiation heating apparatus 10 of this embodiment is shown. Side surface sectional drawing which represented typically the structure of the radiation heating apparatus 10 of this embodiment is shown. The schematic diagram which expanded the lamp | ramp 11 for heaters and the reflective mirror 12 of this embodiment is shown. The distribution in the AA cross section of FIG. 1 of the radiant energy which the radiation heating apparatus 10 of this embodiment gives to the workpiece | work 20 is shown. The distribution of the radiant energy given to the workpiece 20 by the radiant heating device 10 according to the present embodiment is indicated by an arrow B in FIG. The side view which showed the example of adjustment of the radiation heating apparatus 10 of this embodiment is simplified and shown. The synthetic radiation energy E of the radiation heating apparatus 10 of this embodiment is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Radiation heating apparatus 11 Heater lamp 11a 1st heater lamp 11b 2nd heater lamp 11c 3rd heater lamp 11d 4th heater lamp 11e 5th heater lamp 12 Reflector 13 Jig 14 Roller conveyor 15 Window 20 Work E Synthetic radiation energy

Claims (2)

In the thermal uniformity adjustment structure of the radiant heating device that improves the thermal uniformity of the radiant heating device in which a plurality of radiant heaters equipped with reflecting mirrors that reflect light in the direction of the heating object are arranged in parallel,
Said plurality of reflecting mirrors each comprise a rotational axis, rotates around the radiant heater, respectively fixable at any angle,
The plurality of radiant heaters are configured to be movable together with the reflecting mirror in a direction approaching or separating from the heating object,
The soaking uniformity adjustment structure of the radiant heating device. In the heat uniformity adjusting structure of the radiant heating device according to claim 1 ,
Among the plurality of radiant heaters, a second radiant heater arranged next to the first radiant heater is moved together with the reflecting mirror in a direction away from or closer to the first radiant heater. A heat uniformity adjusting structure for a radiant heating device, characterized in that the structure is possible.

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