JP4970300B2 - Recognition processing method in electronic component mounting apparatus - Google Patents

Description

  In the present invention, an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head, and light irradiated by a plurality of illumination lamps provided for each lighting unit is sucked and held by the suction nozzle. The present invention relates to a recognition processing method in an electronic component mounting apparatus that irradiates a component, images the electronic component with a component recognition camera, and performs recognition processing.

This type of electronic component mounting apparatus is disclosed in, for example, Patent Document 1. In general, an electronic component sucked and held by the suction nozzle is imaged by a component recognition camera, and recognition processing is performed.
JP-A-6-61700

  However, due to the correspondence between one mounting head and one illuminating lamp, there is a risk that a recognition error may occur because the luminance is not appropriate when the board recognition camera captures an image. In addition, when imaging the electronic parts held by the suction nozzle, it is necessary to transfer the luminance data for the types of illumination lamps of the illumination unit from the image processing unit to the illumination control unit, so the amount of data is large. It took a long time and it was difficult to shorten the printed circuit board production tact for recognition. In particular, a reduction in communication time has been demanded in recognition of a component that captures an image of the component while the suction nozzle is moving.

  Accordingly, an object of the present invention is to reduce the generation of recognition errors as much as possible and to reduce the amount of data to be transferred as much as possible to improve the printed circuit board production tact time.

Therefore, according to the first aspect of the present invention, the electronic components supplied from the component supply device are taken out by the suction nozzles provided in the plurality of mounting heads and irradiated by the plurality of illumination lamps provided for each of the plurality of illumination units. The electronic component mounted by irradiating the electronic component sucked and held by the suction nozzle with the component recognition camera provided for each of the plurality of illumination units. In the recognition processing method in the apparatus,
The image processing unit, which has received information on the electronic parts to be mounted, information on the mounting head number to be used, and information on the lighting unit number from the control unit, has mounted head number and lighting unit number for each number based on these information. And the brightness table number consisting of the brightness of the illuminating lamp,
Transfer the brightness table number determined by the image processing unit to the lighting control unit,
The transferred illumination control unit turns on the illumination lamp of the necessary illumination unit based on the determined luminance table number and the luminance data table stored in the memory, irradiates the electronic component held by the suction nozzle and A component recognition camera picks up images and performs recognition processing.

According to a second aspect of the present invention, an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a plurality of mounting heads, and an arbitrary combination of a plurality of illumination lamps provided for each of the plurality of illumination units is provided. The light irradiated by the lighting pattern is irradiated to the electronic component sucked and held by the suction nozzle, and the electronic component is imaged by a component recognition camera provided for each of the plurality of illumination units provided for recognition processing. In the recognition processing method in the electronic component mounting apparatus made,
The image processing unit, which has received information on the electronic parts to be mounted, information on the mounting head number to be used, and information on the lighting unit number from the control unit, has mounted head number and lighting unit number for each number based on these information. And the brightness table number and lighting pattern composed of the brightness of the illuminating lamp,
Transfer the brightness table number and lighting pattern determined by the image processing unit to the lighting control unit,
The transferred illumination control unit turns on the illumination lamp of the necessary illumination unit based on the determined luminance table number and the lighting pattern based on the luminance data table stored in the memory, and causes the electronic component held by the suction nozzle to Irradiation is performed, and the component recognition camera captures an image and performs recognition processing.

According to a third invention, in the first or second invention, the illumination control unit stores the luminance data table in a memory thereof.

  The present invention can reduce the occurrence of recognition errors as much as possible by using an appropriate lighting unit, and reduce the amount of data to be transferred as much as possible when performing component recognition, thereby shortening the printed circuit board production tact. Can also be improved.

  Hereinafter, an embodiment of an electronic component mounting apparatus 1 for mounting electronic components on a printed circuit board P will be described with reference to FIG. The electronic component mounting apparatus 1 includes a transport device 2 that transports the printed circuit board P, a component supply device 3 that supplies electronic components, and a pair of beams 4A and 4B that can be moved in one direction (Y direction) by a drive source. Each of the beams 4A and 4B is provided with a plurality of suction nozzles 5 and provided with three mounting heads 6 each movable by each drive source in a direction along each of the beams 4A and 4B.

  The transport device 2 is disposed at an intermediate portion before and after the electronic component mounting device 1, and includes a substrate supply unit that inherits the printed circuit board P from an upstream device (located on the left side in FIG. 1), and the mounting heads 6. The board positioning unit for positioning and fixing the printed circuit board P supplied from the board supply unit in order to mount the electronic component sucked and held by the suction nozzle 5, and the printed circuit board P on which the electronic component is mounted by the positioning unit are inherited. And a substrate discharging unit that is transported to a downstream device (located on the right side in FIG. 1).

  The component supply device 3 is disposed on both the front side and the rear side of the transport device 2, and is provided with a feeder base 3A that is attached to the device main body of the electronic component mounting device 1, and a plurality of components on the feeder base 3A. And a component supply unit 3B group for supplying various electronic components one by one to the component take-out portion (component suction position).

  The pair of front and rear beams 4A and 4B that are long in the X direction are slid by sliders fixed to the beams 4A and 4B along guides extending in the pair of left and right by driving the Y direction linear motor. Move in the Y direction individually. The Y-direction linear motor includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 9A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. It consists of.

  The beams 4A and 4B are respectively provided with the mounting heads 6 that move along the guides in the longitudinal direction (X direction) by the X direction linear motor. 4B, and a pair of front and rear stators fixed to 4B and a mover provided on the mounting head 6 between the stators.

  Accordingly, the mounting heads 6 are provided inside the beams 4A and 4B so as to face each other, and move above the printed circuit board P on the positioning unit of the transfer device 2 and the component extraction position of the component supply unit 3B.

  Each mounting head 6 is urged downward by each spring, for example, twelve suction nozzles 5 are arranged on the circumference at predetermined intervals. It is also possible to simultaneously take out electronic components from a plurality of component supply units 3B arranged in parallel by the suction nozzle 5 located at the 9 o'clock position. The suction nozzle 5 can be moved up and down by a vertical axis motor, and by rotating the mounting head 6 around the vertical axis by a θ-axis motor, as a result, each suction nozzle 5 of each mounting head 6 is moved in the X direction and the Y direction. It is movable, can rotate around a vertical line, and can move up and down.

  In addition, each mounting head 6 is provided with a board recognition camera 8 and images a positioning mark attached to the printed board P being positioned.

  The mounting head 6 is not limited to the mounting head having the above-described configuration, and may have one nozzle at the center of each mounting head. The plurality of mounting heads and the substrate recognition camera are arranged side by side. It may be configured to be movable along each beam.

  Reference numeral 10 denotes an illumination unit which will be described later. As shown in FIG. 1, two units are arranged side by side on the front and rear of the electronic component mounting apparatus 1, and illumination light is applied to the electronic components sucked and held by the suction nozzles 5. Irradiate. The lighting units 10 arranged side by side on the front and rear of the electronic component mounting apparatus 1 are different in the number, arrangement, or type of lighting LEDs described below, for example. In addition, you may use the thing of the same structure for each illumination unit 10. FIG.

  Next, the lighting unit 10 will be described in detail with reference to FIGS. The device main body 11 of the illumination unit 10 has a rectangular parallelepiped outer shape, and has a through hole 12 that has a circular shape in plan view at the center and a diameter that decreases as it goes downward. Further, when the electronic component D sucked and held by the suction nozzle 5 is a BGA (Ball Grid Array), illumination is performed on the upper part of the inner peripheral surface of the through-hole 12 while being inclined toward the component. BGA lighting LEDs (Light Emitting Diodes) 15 that are a plurality of BGA reflecting illuminating lamps that irradiate light are arranged in parallel across a plurality of rows, for example, four rows along the entire circumference of the inner peripheral surface. . That is, an annular printed board 14A is attached to the uppermost mounting part 13A having an L-shaped cross section so as to be closer to the center as it goes downward, and a horizontal row of rows is mounted on the printed board 14A. A plurality of BGA illumination LEDs 15 are arranged in parallel at predetermined intervals over a plurality of rows, for example, four rows in the horizontal direction (horizontal direction) (four rows in the vertical direction).

  An attachment portion 13B having a diameter smaller than that of the attachment portion 13A is formed below the uppermost attachment portion 13A. The attachment portion 13B is closer to the center as it goes downward and than the printed board 14A. An annular printed circuit board 14B is attached in a state inclined at an angle of about 15 degrees, and a plurality of horizontal rows, for example, three rows in the horizontal direction (horizontal direction) (3 in the vertical direction) are mounted on the printed circuit board 14B. A plurality of general reflection illumination LEDs 16, which are general reflection illumination lamps, are arranged in parallel at predetermined intervals.

  A mounting portion 13C having a smaller diameter than the mounting portion 13B is formed below the mounting portion 13B. The mounting portion 13C is closer to the center as it goes downward and is 15 degrees from the printed board 14B. An annular printed circuit board 14C is attached in a state of being inclined at an angle that is laid down to a certain degree, and a plurality of rows in the horizontal direction, for example, three rows in the horizontal direction (horizontal direction) (three rows in the vertical direction) are mounted on this printed circuit board 14C A plurality of general reflection illumination LEDs 16 are arranged in parallel at predetermined intervals.

  Further, an attachment portion 13D having a smaller diameter than the attachment portion 13C is formed below the attachment portion 13C. The attachment portion 13D is closer to the center as it goes downward and is 15 degrees from the printed board 14C. An annular printed circuit board 14D is attached in a state of being inclined to a certain level, and a plurality of horizontal rows, for example, three rows in the horizontal direction (horizontal direction) (three rows in the vertical direction) are mounted on the printed circuit board 14C. A plurality of general reflection illumination LEDs 16 are arranged in parallel at predetermined intervals.

  Reference numeral 17 denotes a transmission illumination LED mounted on a printed circuit board 14E disposed in each of mounting spaces formed in four corners of the apparatus main body 11 which has a rectangular parallelepiped shape outside the BGA illumination LED 15. 11 irradiates light toward the diffusion plate fixed to the suction nozzle 5 through the openings 18 formed on the top surface 11A of the eleventh surface, and the reflected light is applied to the electronic component D held by the suction nozzle 5 by suction. It is the structure irradiated from above.

  A component recognition camera 20 is disposed below the central portion of the illumination unit 10, and a lens 21, a half mirror 22, and a lens 23 are disposed above the component recognition camera 20, and the lens 23 is used for illumination. It arrange | positions so that the through-hole 12 of the apparatus main body 11 of the unit 10 may be faced. The light emitted from the coaxial illumination LED 25 attached to the printed circuit board 14F is transmitted through the half mirror 22 and half of the light is reflected and rises. The suction nozzle 5 passes through the lens 23 and rises. In this configuration, the electronic component D held by suction is irradiated and the reflected image is captured by the component recognition camera 20 via the lens 21, the half mirror 22, and the lens 23.

  Next, a description will be given below based on FIG. 4 which is a control block diagram relating to various illumination controls. First, reference numeral 30 denotes a component mounting operation for mounting an electronic component on the printed circuit board P in the electronic component mounting apparatus 1 and an operation related to lighting of various illumination lamps that irradiate light to the electronic component D sucked and held by the suction nozzle 5. A control device that performs overall control, 31 is a CPU (Central Processing Unit) as a control unit, 32 is a RAM (Random Access Memory) as a storage device, 33 is a ROM (Read Only Memory), Reference numeral 34 denotes an input / output unit, and the CPU 31 controls operations related to component mounting in accordance with a program stored in the ROM 33 based on data stored in the RAM 32.

  In the RAM 32, NC data indicating the mounting coordinates of the electronic component on the printed circuit board P for each mounting order, component library data that is a characteristic of the electronic component, each magnification that is the lens, and each LED that is an illumination lamp of the illumination unit 10 Device data such as luminance data is stored.

  An image processing unit 35 receives a mounting head position signal from first and second input / output units 36 and 37, a CPU 38 as a control unit, and linear scale reading heads (not shown) of the beams 4A and 4B. The counter circuit 39, the comparison register 40 storing the position where the component is to be recognized, and whether the position where the component is to be recognized and the mounting head position of the counter circuit 39 stored in the comparison register 40 match. A comparison circuit 41 is provided for comparing and outputting a coincidence signal when they coincide.

  Reference numeral 42 denotes an exposure timing circuit that constitutes the illumination control unit 43. The movement of any of the beams 4A and 4B causes the mounting head 6 to move to a position above the component recognition camera 20, and a matching signal is input from the comparison circuit 41. Then, an image capture signal is output to the component recognition camera 20 for exposure, and a flash lighting signal is output to the LED control / drive circuit 45 constituting the illumination control unit 43. The LED control / drive circuit 45 stores the brightness and which LED is lit only once according to the type of the electronic component sucked and held by the suction nozzle 5. Fly recognition in which the component recognition camera 20 images the electronic component is performed while the held suction nozzle 5 is moved.

  That is, when the electronic component is a BGA, the BGA illumination LED 15 is flashed on, and when the electronic component is a cylindrical electronic component or PLCC (Plastic Leaded Chip Carrier), the BGA illumination LED 15, the general reflective illumination LED 16, and the coaxial The illumination LED 25 is turned on in a flash, and the general reflection illumination LED 16 and the coaxial illumination LED 25 are turned on in a flash when the electronic component requires normal reflection illumination, and the transmission is transmitted in the case where the transmission illumination is an electronic component. The LED control / drive circuit 45 controls the lighting LED 17 so as to light the flash.

  When the exposure of the component recognition camera 20 is completed, a video signal is input from the component recognition camera 20 to the image input unit 49, the captured image is stored in the frame memory 47, and the CPU 48 performs a recognition process.

  The illumination control unit 43 includes an input / output unit 50, a CPU 44, a memory 46, an LED control / drive circuit 45, and an exposure timing circuit 42.

  With the above configuration, the mounting operation will be described below. First, when the apparatus power is turned on and the operation start switch is pressed, the CPU 31 of the control unit 30 stores the luminance data table (see FIG. 6) constituting the apparatus data stored in the RAM 32 into the input / output unit 34 and the first input. The image data is transferred to the image processing unit 35 via the output unit 36.

  In this luminance data table, for each luminance table number (24 from “01H” to “24H”), the mounting head number (the number of the mounting head 6 on the back side is “1”, “2”, “3”). , The number of the mounting head 6 on the front side is “4”, “5”, “6”, the lighting unit number (the numbers of the left and right lighting units 10 are “1A”, “1B”, The number is “2A”, “2B”), the type of illumination light, and luminance data, and according to the luminance data table, a plurality of illumination units 10 correspond to at least one mounting head 6. In addition, the brightness of each illumination lamp is set for each illumination unit 10, and a plurality of mounting heads 6 correspond to at least one illumination unit 10, and the brightness of each illumination lamp is determined for each illumination unit 10. Is set.

  Then, the image processing unit 35 to which the luminance data table is transferred causes the luminance data table to be transferred to the illumination control unit 43 via the second input / output unit 37 and the input / output unit 50. The CPU 44 of the illumination control unit 43 stores the transferred luminance data table in the memory 46.

  Then, the production operation of the printed circuit board P is started, and when the printed circuit board P is inherited from the upstream device (not shown) and exists on the substrate supply unit of the transport device 2, the printed circuit board P on the substrate supply unit Is moved to the board positioning portion, and this printed board P is positioned and fixed.

  When the printed circuit board P is positioned, the slider 4 slides in the Y direction along the guide extending in the back and forth direction by driving the Y direction linear motor, and the X direction linear motor moves the slider. The mounting head 6 moves in the X direction, and moves to the upper part extraction position of the component supply unit 3B for supplying the electronic component of step number 0001 according to the NC data stored in the RAM 32, and the suction nozzle 5 is driven by driving the vertical axis motor. The electronic component is taken out from the component supply unit 3B. In this case, the mounting head 6 is moved and rotated in the X direction, and the suction nozzle 5 is moved up and down, so that the plurality of suction nozzles 5 can take out electronic components from the component supply unit 3B one after another.

  Further, after or after taking out the electronic component by the suction nozzle 5 of the mounting head 6 on the back side, the beam 4B on the near side moves in the Y direction by driving the Y direction linear motor and the X direction linear motor. As a result, the mounting head 6 moves in the X direction, and similarly to the mounting head 6 of the back beam 4A, the mounting head 6 moves above the corresponding component supply unit 3B and lowers the suction nozzle 5 by driving the vertical axis motor. Thus, the electronic component can be taken out from the component supply unit 3B.

  After the removal, the suction nozzles 5 of both mounting heads 6 are raised so that the mounting heads 6 of both beams 4A and 4B pass over the respective component recognition cameras 20, and the suction of both mounting heads 6 is performed during this movement. A plurality of electronic components sucked and held by the nozzle 5 can be picked up at once, and the picked-up image can be recognized by the recognition processing device, and the positional deviation with respect to the sucking nozzle 5 can be grasped (fly recognition).

  In this case, the CPU 31 of the control unit 30 uses the NC data, the component library data, and the device data stored in the RAM 32 to recognize and mount electronic component information, the mounting head number information to be used, and the lighting unit number information. Since the image data is transferred to the processing unit 35, the image processing unit 35 determines the luminance table number based on the information on the mounting head number to be used and the information on the lighting unit number, and determines the lighting pattern based on the information on the electronic component. To do.

  Then, the image processing unit 35 transfers the data relating to the determined luminance table number and lighting pattern to the illumination control unit 43. The illumination control unit 43 stores the luminance and lighting pattern corresponding to the luminance table number in a predetermined area of the memory 46 based on the luminance data table stored in the memory 46.

  Then, after the electronic component is taken out by the suction nozzle 5 of the mounting head 6 on the back side, the mounting head 6 on the back side drives the X-direction linear motor and the Y-direction linear motor of the beam 4 </ b> A to drive the back-side component recognition camera 20. Although it passes above, before the passage, the position in the X direction of the rear part recognition camera 20 and the position in the X direction of the mounting head 6 are matched. When the mounting head 6 moves in the Y direction, a mounting head position signal is output from the linear scale reading head corresponding to the beam 4A to the counter circuit 39 during the movement, so that the component stored in the comparison register 40 is recognized. When the power position matches the mounting head position of the counter circuit 39, the comparison circuit 41 outputs a match signal.

  As described above, when the coincidence signal is input from the comparison circuit 41, the exposure timing circuit 42 outputs the image capture signal to the back-side component recognition camera 20 for exposure, and sends a flash lighting signal to the LED control / drive circuit 45. Output. The LED control / driving circuit 45 to which the flash lighting signal is input determines which LED is 1 according to the luminance according to the suction head 6 holding the electronic component and the type of the electronic component sucked and held by the suction nozzle 5. Since the flash 46 is turned on only once (lighting pattern) is stored in the memory 46, necessary LEDs are turned on in accordance with the luminance and lighting pattern.

  Thus, since the luminance data table is stored in the memory 46, it is not necessary to send luminance data from the image processing unit 35 to the LED control / drive circuit 45 every time the lighting unit 10 is turned on, and data to be transferred as much as possible. By reducing the amount, the printed circuit board production tact can be improved, that is, the production tact can be shortened.

  That is, when the electronic component is a BGA, the BGA illumination LED 15 is flashed to irradiate light to the BGA sucked and held by the plurality of suction nozzles 5 provided in the mounting head 6. In the case of a cylindrical electronic component or PLCC, the BGA illumination LED 15, the general reflection illumination LED 16, and the coaxial illumination LED 25 are flashed and the electrons sucked and held by the plurality of suction nozzles 5 provided in the mounting head 6. The part is irradiated with light so that a cylindrical electronic part can be illuminated uniformly and brightly. In the case of an electronic component that requires normal reflection illumination, the general reflection illumination LED 16 and the coaxial illumination LED 25 are flashed and light is applied to the electronic component that is sucked and held by the plurality of suction nozzles 5 provided in the mounting head 6. Irradiate. In the case of an electronic component that requires transmitted illumination, the LED 17 for transmitted illumination is flashed and directed to the diffusion plate fixed to the plurality of suction nozzles 5 through the openings 18 provided in the apparatus main body 11. Then, light is irradiated onto the electronic component D held by the plurality of suction nozzles 5 from above through the diffusion plate.

  The exposure timing circuit 42 outputs an image capture signal to the component recognition camera 20 to capture the image, the component recognition camera 20 captures an image, and a recognition processing is executed by the recognition processing device.

  After that, the substrate recognition camera 8 of both beams 4A and 4B is moved above the printed circuit board P to image the positioning mark attached to the printed circuit board P, and the recognition processing device recognizes the captured image. The position of the printed circuit board P is grasped by processing. Then, by adding the position recognition result of the printed circuit board P and the position recognition result of each electronic component to the mounting coordinates of the electronic component of the mounting data, the suction nozzle 5 corrects the positional deviation, and each electronic component is placed on the printed circuit board P Attach to. That is, in the X and Y directions, the Y direction linear motor corresponding to each beam 4 and the X direction linear motor related to the mounting head 6, the mounting angle by the θ axis motor, and as a result, each suction nozzle of each mounting head 6 5, the X / Y direction and the mounting angle are corrected, and the suction nozzle 5 mounts each electronic component on the printed circuit board P while correcting the positional deviation.

  Thus, when mounting of all the electronic components on the printed circuit board P is completed, the printed circuit board P is transferred from the circuit board positioning unit to the downstream device via the circuit board discharging unit.

  According to the luminance data table, a plurality of illumination units 10 correspond to at least one mounting head 6, the luminance of the illumination lamp is set for each illumination unit 10, and at least one illumination unit. Since the plurality of mounting heads 6 correspond to 10 and the brightness of the illuminating lamp is set for each lighting unit 10, the suction nozzles 6 of the three mounting heads 6 provided on the back beam 4A The electronic components held by suction can be subjected to component recognition processing using the lighting units 10 provided on the left and right sides of the back side, and can be recognized using the left and right lighting units 10 on the front side. Can do. Further, the electronic components sucked and held by the suction nozzles 6 of the three mounting heads 6 provided on the front beam 4B are subjected to component recognition processing using the illumination units 10 provided on the left and right sides of the front side. In addition, component recognition processing can be performed using the left and right illumination units 10 on the back side.

  Further, the three mounting heads 6 provided on the back beam 4A can take out electronic components not only from the back side component supply device 3 but also from the front side component supply device 3, or from the front side beam 4B. The three mounting heads 6 provided on the side can take out electronic components not only from the front-side component supply device 3 but also from the rear-side component supply device 3.

    Note that the recognition processing method of the present invention is not limited to the above-described fly recognition, and may be used when the suction nozzle 5 holding the electronic component stops and the component recognition camera 20 images the electronic component. .

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a schematic plan view of an electronic component mounting apparatus. It is general | schematic longitudinal cross-sectional views, such as an illumination unit. It is a longitudinal cross-sectional view of an illumination unit. It is a control block diagram concerning control of various illuminations. It is a figure which shows a flowchart. It is a figure which shows a brightness | luminance data table.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Conveyance apparatus 3 Component supply apparatus 3B Component supply unit 4A, 4B Beam 5 Adsorption nozzle 6 Mounting head 10 Illumination unit 15 LED for BGA illumination
16 LED for general reflection lighting
17 LED for transmitted illumination
20 Component recognition camera 25 LED for coaxial illumination
DESCRIPTION OF SYMBOLS 30 Control part 35 Image processing part 42 Exposure timing circuit 43 Illumination control part 45 LED control and drive circuit 49 Image input part

Claims (3)

A plurality of electronic components supplied from the component supply device are taken out by a suction nozzle provided in a plurality of mounting heads, and light irradiated by a plurality of illumination lamps provided for each of the plurality of illumination units is absorbed by the suction nozzle. In a recognition processing method in an electronic component mounting apparatus that irradiates a held electronic component, images the electronic component with a component recognition camera provided for each of the plurality of illumination units provided , and performs recognition processing.
The image processing unit, which has received information on the electronic parts to be mounted, information on the mounting head number to be used, and information on the lighting unit number from the control unit, has mounted head number and lighting unit number for each number based on these information. And the brightness table number consisting of the brightness of the illuminating lamp,
Transfer the brightness table number determined by the image processing unit to the lighting control unit,
The transferred illumination control unit turns on the illumination lamp of the necessary illumination unit based on the determined luminance table number and the luminance data table stored in the memory, irradiates the electronic component held by the suction nozzle and A recognition processing method in an electronic component mounting apparatus, wherein the component recognition camera images and performs recognition processing. A plurality of electronic components supplied from the component supply device are taken out by suction nozzles provided in a plurality of mounting heads, and irradiated by a lighting pattern of an arbitrary combination of a plurality of illumination lamps provided for each of the plurality of illumination units. An electronic component mounting apparatus that irradiates an electronic component sucked and held by the suction nozzle, images the electronic component with a component recognition camera provided for each of the plurality of illumination units , and performs recognition processing. In the recognition processing method in
The image processing unit, which has received information on the electronic parts to be mounted, information on the mounting head number to be used, and information on the lighting unit number from the control unit, has mounted head number and lighting unit number for each number based on these information. And the brightness table number and lighting pattern composed of the brightness of the illuminating lamp,
Transfer the brightness table number and lighting pattern determined by the image processing unit to the lighting control unit,
The transferred illumination control unit turns on the illumination lamp of the necessary illumination unit based on the determined luminance table number and the lighting pattern based on the luminance data table stored in the memory, and causes the electronic component held by the suction nozzle to A recognition processing method in an electronic component mounting apparatus, wherein the component recognition camera irradiates and performs image recognition processing.   The recognition processing method in the electronic component mounting apparatus according to claim 1, wherein the illumination control unit stores the luminance data table in a memory thereof.