JP4969424B2 - External case for electronic device and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an external case for electronic apparatus, which can be made compact and thin by mounting a conductive pattern on a case, and to provide a manufacturing method thereof. <P>SOLUTION: A first film 12 forming an exterior which is provided with characters or coloring, a flexible second film 13 having a plurality of conductive patterns are installed in a prescribed metal mold, and a resin in a fused state is injected into between them to bury them in a base 11 made of the synthetic resin, and an upper case 10 is formed in one body. The conductor pattern can be mounted in the upper case 10, so a printed board can be made compact or thin. Therefore, the whole electronic apparatus can be made compact or thin. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to an outer case that covers the surface of an electronic device such as a mobile phone, and more particularly to an outer case for an electronic device in which a conductor pattern is mounted inside a synthetic resin that forms the case, and a manufacturing method thereof.

  In recent years, mobile terminal electronic devices such as mobile phones and digital audio players have been promoted to have higher functions, smaller sizes, and thinner thicknesses.

  For this reason, in such an electronic device, the printed circuit board mounted inside the external case (housing) is always required to be small and thin.

For example, Patent Document 1 below describes a mobile phone device in which a printed circuit board is fixed with a plurality of screws.
Japanese Patent Laid-Open No. 2002-27056

  However, it is difficult to reduce the size or thickness of an electronic device with a conventional configuration in which a printed circuit board is simply fixed inside the electronic device.

  That is, in the thing of patent document 1, since it is a type which mounts a printed circuit board as it is inside a case, there exists a limit in reducing only the area of a printed circuit board, without reducing a mounting component and a circuit structure. Therefore, when there are many mounting parts, the problem that it cannot mount on the printed circuit board designated beforehand arises.

  In addition, in an electronic device equipped with a detection electrode or the like that forms a non-contact type electrostatic sensor, the detection electrode is fixed to the back surface of the case by means such as affixing, but the operation position formed on the case surface is When the display unit to be displayed and the detection electrode are displaced, there is a problem that the electrostatic sensor cannot detect the operation (the operability is low) even though the display unit is operated.

  The present invention has been made to solve the above-described conventional problems, and an object of the present invention is to provide an external case for an electronic device that can be reduced in size or thickness by providing a conductor pattern on the case. .

  In addition, the present invention provides an external case for electronic equipment that is excellent in operability by reducing the positional deviation between the display unit formed on the front side of the case and the detection electrode provided on the back side, and a method for manufacturing the same. It is an object.

The present invention includes a first film having an appearance, a flexible second film having a conductive pattern, and a synthetic resin provided between the first film and the second film. With a base
With the first film exposed on the surface of the base, the first and second films are embedded and integrated in the base,
The second film is formed with an extension portion that is not embedded in the base, and the conductive pattern is drawn out by the extension portion .

  In the present invention, the appearance case side can be provided with a function as a printed circuit board. Therefore, if some components (for example, LEDs) are mounted on the second film of the appearance case, The mounting density of a separately provided printed circuit board can be reduced, and the entire electronic device can be reduced in size or thickness.

Moreover, in this invention , each signal can be taken out from the extension part. In addition, when the printed circuit board is arranged in the case, the case-side conductor pattern and the printed circuit board wiring pattern can be connected via the extending portion.

  In addition, an electrode portion for an electrostatic sensor is provided on a part of the conductive pattern, and a display portion indicating an operation position is formed on at least one surface of the first film at a position corresponding to the electrode portion. Are preferred.

  In the above means, since the distance between the display part provided on the front surface side of the case and the electrode part provided on the back surface side can be set to a predetermined dimension, the detection accuracy of the touch sensor can be increased.

In the method for manufacturing an external case for an electronic device according to the present invention, a first step of forming a first film having an appearance and having a display portion, and a conductive pattern including an electrode portion corresponding to the display portion are formed. And a second step of forming a flexible second film provided with an extending portion for drawing out the conductive pattern, and a synthetic resin between the first film and the second film. And a third step of integrating the first film and the second film on the base and extending the extending portion without being embedded in the base. It is characterized by.

  In the manufacturing method of the present invention, the displacement between the display portion provided on the front surface side (one surface side) of the case and the electrode portion provided on the back surface side (the other surface side), in particular, the distance between the two. Variations can be reduced. For this reason, variation in sensitivity can be reduced and an electrostatic touch sensor with excellent operability can be obtained.

In the above, as the third step,
Placing the first film and the second film in a first mold, respectively;
Pouring a molten resin between the first film and the second film, and embedding the first film and the second film in the base formed by solidifying the molten resin;
Those having the following are preferred.

  With the above-described means, it is possible to manufacture the outer case only by performing resin molding once using a single mold.

As the third step,
A first molten resin is poured into the first mold and the second film in a state where the first molten resin is placed in a second mold, and the first molten resin is solidified. A previous step of embedding the one film in the base of
One film provided with the first base and the other film are respectively disposed in a third mold, and the second molten resin is poured between the first base and the other film. The first base and the second molten resin are integrated to form the base and the other film is embedded in the second base formed by solidifying the second molten resin. Process,
Those having the following are preferred.

  In the above means, the resin molding process is divided into two stages, so that it is not necessary to manage two films placed in the mold at the same time. Appearance defects can be easily prevented and the yield can be improved.

The second mold and the third mold each have a male mold and a female mold,
Of the male mold and the female mold, a mold having no gate is preferably used in common in the previous process and the subsequent process.

  In the above means, a part of the mold can be used in common in each manufacturing process, so that the cost of the mold can be reduced.

  Further, it is preferable that the first molten resin and the second molten resin are made of the same resin having translucency.

  In the above means, since the first molten resin and the second molten resin are made of the same resin, the first base in which the first molten resin is solidified and the second base in which the second molten resin is solidified Can be integrated into a single base. Further, these molten resins are light-transmitting resins that transmit light. When a light-emitting element such as an LED is mounted on the conductive pattern on the back surface side of the outer case, the light is transmitted to the first base. It is possible to illuminate the surface side of the outer appearance case with almost no influence from the interface between the first base and the second base.

  Furthermore, in the third step, as a pre-process for installing any film in any of the molds, the film is pre-formed so as to match the shape of the installed mold. Are preferred.

  In the above means, since it becomes easy to install a film in the mold, the quality of the resin molded product can be improved, and the yield can be improved.

  In the present invention, it is possible to reduce the mounting density of the printed circuit board disposed in the casing of the electronic device, so that the entire electronic device can be reduced in size or thickness.

  In addition, the exterior case has an electrostatic touch sensor with excellent operability that can improve the positional accuracy including the distance between the display part on the front side of the case and the electrode part on the back side. It can be.

  Furthermore, in the manufacturing method of the present invention, it is possible to reduce the positional deviation between the display part provided on the front surface side of the case and the electrode part provided on the back surface side, in particular, variation in the distance between the two. Become.

  FIG. 1 is an exploded perspective view showing a configuration of an electronic apparatus showing an embodiment of the present invention, FIG. 2 is an exploded perspective view showing a configuration of an upper case, and FIG. 3 is a perspective view showing a back side of the upper case.

The electronic device 1 shown in FIG. 1 is a mobile phone.
The electronic device 1 includes an upper case 10 provided on the front (a) side of the figure and a lower case 50 provided on the back (b) side. By connecting the upper case 10 and the inner side of the lower case 50 with a means such as screwing in a state where the upper case 10 and the inner side of the lower case 50 face each other, a casing (outer case) forming the outer appearance of the electronic device 1 is formed. In this embodiment, the upper case 10 constitutes the appearance case in the present invention.

  A frame-shaped frame 30 is provided between the upper case 10 and the lower case 50. A display device 20 made of liquid crystal or the like is held between the upper case 10 and the frame 30, and a printed board 40 that is the center of the circuit board is held between the frame 30 and the lower case 50. .

  That is, the frame 30 is fixed between the upper case 10 and the lower case 50 with the display device 20 on the front (a) side and the printed circuit board 40 on the back (b) side.

  The upper case 10 has a transparent part 10A that is transparent and transmits light, and the front surface of the display device 20 is disposed to face the transmission part 10A.

  As shown in FIG. 2, the upper case 10 has a laminated structure in which a plurality of synthetic resins are stacked in the thickness direction. That is, the upper case 10 includes a base 11 formed as a molded body, a first film 12 provided on the front surface (a) side which is one surface of the base 11, and a back surface which is the other surface of the base 11. The second film 13 provided on the (b) side is integrally laminated.

  The base 11 is formed as a transparent molded body formed by an injection molding method by injecting a synthetic resin material such as molten polycarbonate or acrylic into a predetermined mold. In the upper half of the base 11, a display area 11 </ b> A that forms the transmission part 10 </ b> A of the upper case 10 is provided. A sensor area 11B is provided in the lower half of the base 11, and a Y slide area 11C and an X slide area 11D are provided on the left side and the lower side of the display area 11A.

  The first film 12 is formed of a flexible transparent insulating resin film, such as a polyester film (PET film), and has a predetermined color (color) on the back surface (the surface on the (b) side). Rings) and patterns are given. A portion of the first film 12 facing the display area 11A is formed with a square light transmission portion 12A. The light transmitting portion 12A may be formed as an opening in which a resin film is cut out in a square shape, or may be a portion in which a transparent resin film is exposed without being colored, In the embodiment, the latter configuration is adopted. An image displayed on the display device 20 is visually recognized from the outside through the light transmitting portion 12A and the display area 11A.

  In addition, a touch display portion 12B is provided on the back surface (the surface on the (b) side) of the first film 12 and at a position overlapping the sensor region 11B. On the touch display unit 12B, characters, symbols, figures, and the like indicating the operation position when operating with a finger are displayed. The operator can input the character or the like by pressing or touching the corresponding position while viewing the character or the like displayed on the touch display unit 12B.

  In addition, as described above, it is preferable that the surface on which characters, symbols, figures, and the like indicating coloring and operation positions are formed on the back side of the first film 12 in consideration of disappearance due to wear or the like. In the case of forming a protective film for preventing disappearance on the surface side of the first film 12, characters, symbols, figures, etc. indicating coloring and operation positions are formed on the surface side of the first film 12. It can also be set as the structure to do.

  A Y slide display portion 12C and an X slide display portion 12D are provided on the first film 12 at positions corresponding to the Y slide region 11C and the X slide region 11D formed on the base 11. For example, the Y slide display unit 12C and the X slide display unit 12D form a transparent film by forming a non-colored portion in a frame shape on a part of the first film 12, for example, and framing a vertically long and horizontally long rectangle. It is formed by exposing. Alternatively, the Y slide display unit 12C and the X slide display unit 12D may be formed by coloring with a color different from the surrounding colors.

  The second film 13 is formed of a flexible insulating film sheet such as a polyimide film or a polyester film (PET film). The second film 13 has an opening 13A formed at a position corresponding to the display area 11A, and a plurality of electrode portions and a conductor pattern connected to the plurality of electrode portions are formed in the other portions. Other electronic chip parts are fixed. Conductive patterns such as electrode portions and conductor patterns are formed, for example, by screen printing a thin conductive pattern (conductive wire) made of gold, silver, copper, or the like on a film, or by etching.

  On the second film 13, a capacitive touch sensor portion 13B is formed at a position facing the sensor region 11B. The touch sensor unit 13B includes, for example, a plurality of Y sensor electrodes (one electrode) extending in the vertical direction and arranged at a predetermined interval in the horizontal direction, and a plurality of Y sensor electrodes extending in the horizontal direction and arranged at a predetermined interval in the vertical direction. X sensor electrode (the other electrode). A Y sensor electrode is formed on the front surface (the surface on the (a) side of FIG. 2) of the second film 13, and an X sensor electrode is formed on the back surface, both of which are orthogonally arranged in a matrix (not shown). ) Alternatively, as shown in FIG. 3, one sensor electrode 14 having comb teeth and the other sensor electrode 15 having comb teeth are alternately arranged on the same plane so that the comb teeth do not contact each other. It may be a configuration.

  In the touch sensor unit 13B, there is electrostatic capacitance between a conductive indicator such as a finger that is close to the base 11 and the first film 12 and one electrode, and between the indicator and the other electrode, respectively. A capacitance is formed. When a conductive indicator such as a finger is brought close to the touch sensor unit 13B via the touch display unit 12B and the sensor region 11B, between the indicator and one of the electrodes corresponding to the portion to which the indicator has approached, and The capacitance between the indicator and the corresponding other electrode changes. When a control unit (not shown) detects these changes in capacitance, the position of the finger in the touch sensor unit 13B is detected as coordinate data. Based on the coordinate data, the position of the cursor displayed on the display device 20 is determined. When the finger position is moved, the coordinate data changes, so that the cursor position is moved accordingly.

  On the left end of the opening 13A, Y slide detection electrodes 13a, 13b, 13c and 13d having a small area are arranged side by side in the vertical direction. Similarly, X slide detection electrodes 13e, 13f, 13g and 13h having a small area are also arranged in the lateral direction at the lower end of the opening 13A.

  The Y slide detection electrodes 13a, 13b, 13c and 13d are arranged to face the Y slide area 11C, and the X slide detection electrodes 13e, 13f, 13g and 13h are arranged to face the X slide area 11D. The Y slide detection electrodes 13 a to 13 d and the X slide detection electrodes 13 e to 13 h are all formed on one surface (the surface on the (a) side in FIG. 2) that is the surface of the second film 13.

  For example, when a conductive indicator such as an operator's finger is brought close to the Y slide display portion 12C on the first film 12, the static between the indicator and the Y slide detection electrodes 13a, 13b, 13c and 13d. A capacitance is formed. When the indicator is moved in the vertical direction on the Y slide display unit 12C, the capacitance formed between the indicator and the individual Y slide detection electrodes 13a, 13b, 13c, and 13d changes. To do. A control unit (not shown) detects the change in capacitance in time series, whereby detection data indicating the moving direction of the indicator is obtained. Based on this detection data, the control unit, for example, scrolls the screen displayed on the display device 20 in the vertical direction or moves the cursor in the vertical direction. The same applies to the X slide display unit 12D.

  As shown in FIG. 3, the second film 13 is provided with an extending portion 13 </ b> E that is partially protruded laterally. A plurality of conductive patterns extending from the respective electrode portions of the second film 13 are densely arranged at predetermined intervals in the extending portion 13E. The extending portion 13 </ b> E is pulled out from the second film 13 to the side, and further folded back to the inside of the upper case 10, and the tip thereof is connected to the printed circuit board 40. Note that the tip of the extension 13E and the printed circuit board 40 are connected via a connector (not shown), and the conductive pattern formed on the extension 13E and the wiring pattern (not shown) of the printed circuit board 40 are conductively connected. Is done. The extending part 13E may be directly connected to the printed circuit board 40.

  As described above, in the present invention, the conductive pattern can be wired in the upper case 10 that forms the outer case other than the printed circuit board 40. In other words, the appearance case itself covering the electronic device can have a function as a printed circuit board. For this reason, by mounting electronic components such as LEDs for illuminating the display unit on the upper case 10 side, the mounting density on the printed circuit board 40 side can be reduced, and the size or thickness can be reduced. Is possible.

  In addition, on the back side of the upper case 10, each electrode portion forming an electrostatic touch sensor, that is, one electrode, the other electrode, Y slide detection electrodes 13a, 13b, 13c, 13d and an X slide detection electrode 13e. , 13f, 13g, 13h, etc., and the upper case 10 is provided with a touch display unit 12B, a Y slide display unit 12C, and an X slide display unit 12D on the front surface side corresponding thereto. On the side, the electrode part forming the sensor itself and the display part indicating the operation position can be integrally formed. That is, in the present embodiment, the display unit and the electrode unit for the electrostatic sensor are arranged to face each other with the base 11 interposed therebetween. For this reason, the display part provided in the surface side (in this Embodiment, the back surface side of the 1st film 12) of the upper case 10, and the back surface side (in this Embodiment, the 2nd film in this Embodiment) 13 can be prevented from being displaced with respect to the sensor provided on at least one surface side.

  Further, since the distance between each electrode part forming the electrostatic touch sensor and the display part in contact with the operating body is determined by the plate thickness of the base 11, variation is reduced and a predetermined plate of the upper case 10 is reduced. It is possible to set the thickness dimension. For this reason, the detection accuracy of a touch sensor can be improved.

Next, a method for manufacturing the appearance case will be described.
FIG. 4 is a cross-sectional view showing a third step in the first manufacturing method.

  In the first step, characters, symbols, figures, etc. are printed on the touch display portion 12B etc. on the back surface (the surface on the (b) side) of the transparent first flexible film 12 such as a polyester film, Further, a predetermined color is applied.

In the second step, a predetermined conductive pattern on the front and back surfaces of the flexible second film 13 such as a polyimide film or a polyester film, that is, a plurality of one electrode, the other electrode, the Y slide detection electrode 13a, Conductive patterns extending to 13b, 13c, 13d, X slide detection electrodes 13e, 13f, 13g, 13h and extending portion 13E are formed by etching or printing, respectively. Further, the periphery of the second film 13 is cut into a predetermined shape, and an opening 13A is formed at the center.
Note that either the first step or the second step may be performed first.

  In the third step, the upper case 10 is manufactured using, for example, a first mold including a female mold 61 and a male mold 62 as shown in FIG.

  First, the first film 12 is installed in the female mold 61 with the surface (the surface on the (a) side) facing the concave portion 61A, and on the convex portion 62A of the male mold 62 (in FIG. 4). The second film 13 is arranged on the right side).

  Next, the first mold is closed, and the male mold 62 is installed in the female mold 61. In this state, as shown in FIG. 4, a cavity 63 having a predetermined gap dimension D is formed in a portion where the concave portion 61 </ b> A of the female die 61 and the convex portion 62 </ b> A of the male die 62 face each other. The first film 12 and the second film 13 are disposed to face each other in the cavity 63.

  Next, a thermoplastic resin 11 a having translucency such as polycarbonate or acrylic in a molten state is injected from the gate 64 into the cavity 63. When the molten resin 11a is cooled and solidified, the first film 12 and the second film 13 are embedded in the base 11 formed by solidifying the molten resin 11a. At this time, the base 11 after the molten resin 11 a is solidified, the first film 12 provided on the front surface (a) side, and the second film 13 provided on the back surface (b) side are integrated with the base 11. The upper case 10 is formed by molding. It should be noted that at least the surface of the first film 12 (the front surface on the (a) side) is molded while being exposed on the base 11.

  Moreover, the upper case 10 which is an external appearance case may be manufactured in two steps as shown below.

  FIG. 5 is a cross-sectional view showing a third step in the second manufacturing method, (A) is a cross-sectional view showing the previous step, and (B) is embedded in the first base formed in (A). Sectional drawing which shows the 1st film in the state of the state, (C) is sectional drawing which shows a next process, (D) is sectional drawing of the upper case formed by (C).

  The second manufacturing method also includes the first step and the second step, but the first step and the second step are the same as the first manufacturing method, and thus the description thereof is omitted.

  The third step of the second manufacturing method has two steps, the previous step and the subsequent step. In the previous process, a second mold composed of a female mold 71 and a male mold 72 is used, and in a subsequent process, a third mold composed of a female mold 71 and a male mold 73 is used. That is, the female mold 71 is used in common for the previous process and the subsequent process. Note that the positions of the gates 74 and 75 are different between the male mold 72 and the male mold 73.

  In the previous step shown in FIG. 5A, a second mold composed of a female mold 71 and a male mold 72 is used. First, the first film 12 is installed between the female mold 71 and the male mold 72. Then, in the cavity between the female mold 71 and the male mold 72 and on the side to be the back surface (b) of the first film 12, a molten polycarbonate or the like is formed from the gate 74 formed on the male mold 72. A first molten resin 11a made of a thermoplastic resin having translucency such as acrylic is injected.

  As shown in FIG. 5 (B), after cooling and solidification, the first molten resin 11a was buried between the female mold 71 and the male mold 72 in the solidified first base 11a ′. The first film 12 in a state is obtained.

  In the subsequent process, a third mold composed of a female mold 71 and a male mold 73 is used. As shown in FIG. 5C, the first film 12 including the first base 11 a ′ formed in the previous step is placed in the female mold 71. At this time, the first film 12 embedded in the first base 11 a ′ is installed in a state where the surface (a) side of the first film 12 faces the recess 71 </ b> A of the female die 71. And the 2nd film 13 is arrange | positioned on the convex part 73A (FIG.5 (C) right side) of the male metal mold | die 73, and the 3rd metal mold | die is closed. In this state, the first base 11a ′ in which the first film 12 is embedded and the second film 13 are defined by the concave portion 71A of the female die 71 and the convex portion 73A of the male die 73. The inside 76 is arranged to face each other.

  Next, the second molten resin 11 b made of the same material as the first molten resin 11 a is injected into the cavity 76 from the gate 75 formed in the male mold 73. At this time, the second molten resin 11 b enters the space in the cavity 76 and between the first base 11 a ′ and the second film 13.

  Then, as shown in FIG. 5D, the second base 11b ′ is formed by cooling and solidifying the second molten resin 11b, and the second base 11b ′ is the first base 11a ′. The second base 11b ′ is easily integrated with the first base 11a ′. For this reason, the strength of the upper case 10 can be increased.

  The first film 12 is embedded in a first base 11a 'formed by solidifying the first molten resin 11a except for the surface (the front surface on the (a) side). The first base 11a ′ in which the first film 12 is embedded is integrated with the second base 11b ′ formed by solidifying the second molten resin 11b to form the base 11, and the second base 11a ′ The film 13 is embedded in the second base 11b ′.

  Thereby, it is provided in the base 11 which consists of 1st base 11a 'and 2nd base 11b', the 1st film 12 provided in these surface sides (front side), and a back surface side (back side). The upper case 10 integrally molded with the second film 13 is completed.

  In the second manufacturing method, the resin injection is manufactured in two stages. However, since the female mold 71 can be made common, the manufacturing cost of the mold can be suppressed.

  In addition, when the molten resin is injected in two stages, the first film 12 and the second film 13 that are not embedded in the base of the molded body are placed opposite to each other in the mold. Absent. For this reason, since it is not necessary to manage the two films arranged in the mold at the same time, the molten resin 11a is inherently used at the time of resin molding, such as the surface of the first film 12 or the back surface of the second film 13. In particular, it is possible to reduce the occurrence of defects due to wrapping around the portion where the molten resin 11a does not need to enter, and it is possible to improve the yield.

  In addition, since the first molten resin 11a and the second molten resin 11b are the same resin, there is almost no interface between the first base 11a ′ and the second base 11b ′, so that both can be securely connected. Can be integrated into a single base 11. Further, the first and second molten resins 11a and 11b are translucent resins that transmit light, and when a light emitting element such as an LED is mounted on the conductive pattern on the back side of the upper case 10, for example, Since the first base 11a ′ and the second base 11b ′ are integrated without generating an interface, the light illuminates the surface side of the upper case 10 with almost no influence from the interface. It becomes possible.

  In both the first and second manufacturing methods, the extending portion 13E formed on the second film 13 is the upper portion in a state of being drawn out of the first mold and the third mold. The case 10 is molded. Therefore, since the extending portion 13E does not include the base 11 (the first base 11a 'and the second base 11b') and the first film 12, it can have sufficient flexibility.

  In addition, a plurality of first films 12 are continuously bonded to each other with a predetermined interval so as to be peelable from a long band-shaped carrier film (carrier tape), and each of the first films 12 is individually attached together with the carrier film made of a continuous body. The first film 12 may be placed in a mold and molded. In this case, the first film 12 and the upper case 10 after molding can be easily handled and the productivity can be increased.

  Furthermore, in any of the above manufacturing methods, it is preferable to perform preforming by applying heat to each film as a pre-process for installing the first film 12 and the second film 13 in any mold. If the film is preformed in advance, each film can be accurately placed in the mold. As a result, the molten resin can reach every corner of the narrow cavity, and the degree of completion during molding can be increased. That is, it is possible to suppress the generation of defective products and improve the quality of the upper case 10.

  In the above embodiment, the first film 12 has been described as being colored by printing a color on the back surface of a transparent sheet film. However, the present invention is not limited to this, and the sheet film is not limited to this. It may have a predetermined color from the beginning, or a light-transmitting part 12A formed on such a colored sheet with an opening.

  In the manufacturing method described above, the case where the upper case 10 is formed has been described as an example. However, the upper case 10 may be used for molding the lower case 50.

1 is an exploded perspective view showing a configuration of an electronic device showing an embodiment of the present invention; An exploded perspective view showing the configuration of the upper case, A perspective view showing the back side of the upper case, Sectional drawing which shows the 3rd process in a 1st manufacturing method, It is sectional drawing which shows the 3rd process in a 2nd manufacturing method, (A) is sectional drawing which shows a previous process, (B) is the state embedded at the 1st base formed by (A). Sectional drawing which shows a 1st film, (C) is sectional drawing which shows a next process, (D) is sectional drawing which shows the upper case formed by (C),

Explanation of symbols

1 Electronic equipment 10 Upper case (external case)
10A Transmission part 11 Base 11A Display area 11B Sensor area 11C Y slide area 11D X slide area 11a Molten resin (first molten resin)
11a ′ first base (after the first molten resin is solidified)
11b 2nd molten resin 11b '2nd base (after solidification of 2nd molten resin)
12 1st film 12A Light transmission part 12B Touch display part (display part)
12C Y slide display part (display part)
12D X slide display unit (display unit)
13 Second film 13A Opening portion 13B Touch sensor portion 13E Extension portions 13a to 13d Y slide detection electrodes 13e to 13h X slide detection electrode 20 Display device 30 Frame 40 Printed circuit board 50 Lower case 61 Female mold (first mold) Type)
62 Male mold (first mold)
61A Female mold recess 62A Male mold convex 63 Cavity 64 Gate 71 Female mold (common to second and third molds)
72 Male mold (second mold)
73 Male mold (third mold)
75 gate

Claims (9)

A first film having an appearance, a flexible second film having a conductive pattern, and a base made of a synthetic resin provided between the first film and the second film. Prepared,
With the first film exposed on the surface of the base, the first and second films are embedded and integrated in the base,
An external case for an electronic device , wherein an extension portion that is not embedded in the base is formed in the second film, and the conductive pattern is drawn out by the extension portion . The external case for electronic devices of Claim 1 with which the electrode part for electrostatic sensors is provided in a part of said conductive pattern . On at least one surface of the first film in the position corresponding to the electrode portion of the electrostatic sensor, appearance electronic device chassis of claim 2, wherein the display unit is formed indicating the operation position. A first step of forming a first film having an appearance and having a display portion, and a conductive pattern including an electrode portion corresponding to the display portion is formed, and an extending portion for drawing out the conductive pattern is provided A second step of forming a flexible second film; and a base made of a synthetic resin is formed between the first film and the second film, and the first film is formed on the base. A third step of integrating the second film with the second film and extending the extension without embedding the base in the base . The third step is,
Placing the first film and the second film in a first mold, respectively;
Pouring molten resin between said second film and said first film, said first film and said second film is embedded in the molten resin solidified within the base formed by Process,
The manufacturing method of the external case for electronic devices of Claim 4 which has these. The third step is,
The one film of said second film and the first film, when it is installed in the second mold cast a first molten resin, the first molten resin is formed by solidifying A previous step of embedding the one film in the first base;
In the third mold, the one film having the first base and the other film are respectively disposed, and the second molten resin is placed between the first base and the other film. pouring, said together with the first base second by integrating the molten resin to form the base, the other film, the second in the base of the second molten resin is formed by solidifying A process after being embedded in
The manufacturing method of the external case for electronic devices of Claim 4 which has these. The second mold and the third mold each have a male mold and a female mold,
The method of manufacturing an external case for an electronic device according to claim 6, wherein the mold having no gate of the male mold and the female mold is used in common in the previous process and the subsequent process.   The method for manufacturing an external case for an electronic device according to claim 6 or 7, wherein the first molten resin and the second molten resin are made of the same resin having translucency. Wherein prior to the third step, the second film, the manufacturing method of the appearance case for electronic device according to any one of claims 5 to 8 comprising the step of pre-forming to fit the shape of the mold.

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