JP4963912B2 - Integrated electrical array connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an integrated arrangement electrical connector which comprises an insulating region and conducting regions disposed at a narrow pitch, is small in size, has a high resistance to changes in the environmental temperature, and is capable of displaying its performance stably and where the boundaries between the insulating region and conducting regions are properly adjusted, by forming the isolated conducting regions present in the insulating region, through a method where the desired parts of the insulating region, which is, at least partially formed of a porous insulating material, are selectively impregnated with a conductive material. <P>SOLUTION: The integrated arrangement electrical connector is equipped with an insulating region, formed of insulating material and the isolated conducting regions which are positioned in the insulating region; and at a part of the insulating region is a porous insulating region, formed of a porous insulating material, and the conducting regions are formed by making the porous insulating region selectively impregnated with a conductive material. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to an integrated electrical array connector.

  In recent years, along with the development of digital communication systems, particularly wireless digital communication systems, the electrical elements and electronic elements used in digital communication systems have improved performance and complicated structures. As a result, electrical and electronic devices with wide bandwidth and small size are manufactured. And in order to connect such a small electric element or electronic element, the electrical connector with a small size and high reliability is required.

  Conventionally, an electrical connector utilizes a number of electrical wirings to connect two electrical or electronic elements. In this case, the electrodes of the electrical connector usually consist of two groups, and the geometric pattern of each group is repeated uniformly. Such a group of electrodes is referred to as an electrode array or an electrode array, and an electrical connector including the electrode array is referred to as an electrical array connector or an electrical array connector. The width between the electrodes in the electrode array is called an electrode pitch.

  In order for the electrical array connector to correctly connect two electrical elements or electronic elements, it is necessary to adjust the boundary between one electrode group and the other electrode group of the electrical array connector and bring the corresponding electrodes into contact with each other. . That is, in order not to cause a malfunction of the connector such as short circuit or open, it is necessary to adjust the electrode arrangement, shape, size, etc. of one electrode group and adjust the other electrode group accordingly (hereinafter, this Adjusting the arrangement, shape and size of the electrodes is called boundary adjustment). If this condition is satisfied, an electrical signal can flow from the electrode of one electrode group to the electrode of the other electrode group.

  In a conventional electrical array connector, the electrodes and the housing are formed of metal and plastic with electrical insulation, respectively. Thus, since the materials are different, the temperature expansion coefficient of the electrode and the temperature expansion coefficient of the housing are not the same. Therefore, when the environmental temperature of the electrical array connector changes, the boundary between the electrode groups is affected, and as a result, the function of the electrical array connector may be impaired. Furthermore, since the electrodes and the housing are physically different parts, repeated connection and disconnection of the electrical array connector affects the boundary of the electrode group, and as a result, the function of the electrical array connector may fail. is there.

  One way to reduce the overall size of the electrical array connector while maintaining the basic geometric form of the electrical array connector is to reduce the electrode pitch. However, when the electrode pitch is narrowed, there is a problem that the tolerance for adjusting the boundary of the electrode group is incidentally reduced.

  By the way, in a semiconductor device, in order to connect a connection layer of a module formed on a wafer, a technique for forming a connector by injecting conductive ions into an insulating layer between connection layers has been proposed (for example, (See Patent Document 1).

  FIG. 6 is a view showing a conventional method of forming a connector on a wafer. In addition, in FIG. 6, (a)-(c) has shown each manufacturing process.

  In FIG. 6A, reference numeral 801 denotes a silicon wafer, and a plurality of connection layers 802 formed independently of each other are disposed on the wafer 801 and further cover the connection layer 802 of the wafer 801. Thus, an insulating layer 803 is formed. The insulating layer 803 is made of an insulator such as a silicon oxide film, for example.

  Then, as shown in FIG. 6B, after applying a photoresist 804 on the insulating layer 803, exposure and development are performed so that the insulating layer 803 between the connecting layers 802 to be connected to each other is exposed. Then, a part of the photoresist 804 is patterned. Then, using the patterned photoresist 804 as a mask, an ion beam is irradiated as indicated by an arrow 805 to implant N-type or P-type ions.

As a result, as shown in FIG. 6C, a conductive connector 806 is formed at a location where ions are implanted in the insulating layer 803, and the connector 806 electrically connects adjacent connection layers 802. .
JP 11-330258 A

  However, in Patent Document 1, although a technique for forming the connector 806 for connecting the coupling layers 802 on the wafer 801 is disclosed, no technique for manufacturing an electrical array connector is disclosed.

  The present invention solves the above-mentioned conventional problems by selectively impregnating a conductive substance into a desired portion of an insulating region made of at least a part of a porous insulating material, and thereby insulating the insulating material. By forming a plurality of isolated conductive regions existing in the region, the boundary between the insulating region and the conductive region is adjusted, the pitch of the conductive region is narrow, the size is small, and it is resistant to changes in environmental temperature, and has stable performance. An object of the present invention is to provide an integrated electrical array connector that can be exerted.

Therefore, in the integrated electrical array connector of the present invention, an integrated electrical array connector having an insulating region made of an insulating material and a plurality of isolated conductive regions existing in the insulating region , wherein the insulating region is consists Si, Ge, SiC, GaP, GaAs, an InP or Al ₂ O _3, wherein at least part of the insulating region is a porous insulating region made of a porous insulating material, said conductive region, The porous insulating region is selectively impregnated with a conductive material.

  In another integrated electrical array connector of the present invention, the porous insulating region is further impregnated with the conductive material by depositing the conductive material in the porous insulating region.

  In yet another integrated electrical array connector of the present invention, the porous insulating region is further impregnated into the porous insulating region by exposing the porous insulating region to a gas containing the conductive material. .

  In still another integrated electrical array connector of the present invention, the porous insulating region is further impregnated with the conductive material by pressing the conductive material against the porous insulating region.

  In still another integrated electrical array connector of the present invention, the insulating region is a plate-like region having a contact surface that contacts the mating connector, and the conductive region is in the thickness direction of the insulating region. And at least one end face is exposed to the contact surface.

  In still another integrated electrical array connector of the present invention, the insulating region is a plate-like region, and the conductive region is a strip-like region extending along one surface of the insulating region.

  In still another integrated electrical array connector of the present invention, a conductive metal layer is further formed on the conductive region.

  In yet another integrated electrical array connector of the present invention, the conductive region further has one end surface exposed at the contact surface and the other end surface exposed at the back surface facing the contact surface, An electrode is connected to the other end face.

  According to the present invention, the integrated electrical array connector is formed in the insulating region formed by selectively impregnating a conductive material in a desired portion of the insulating region at least partially made of a porous insulating material. It has a plurality of isolated conductive regions present. As a result, it is possible to obtain an integrated electrical array connector in which the boundary between the insulating region and the conductive region is accurately adjusted, the pitch of the conductive region is narrow, the size is small, the device is resistant to changes in environmental temperature, and exhibits stable performance.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing an integrated electrical array connector according to a first embodiment of the present invention.

  In the figure, reference numerals 1A and 1B denote a first connector and a second connector as integrated electrical array connectors according to the present embodiment, which are used to electrically connect electric elements or electronic elements (not shown), for example. However, it may be used to electrically connect an electric element or electronic element and an electric cable, and is used to electrically connect an electric element or electronic element and a substrate such as a circuit board. It may be used to electrically connect electrical cables, and may be used for any purpose. The first connector 1A and the second connector 1B function as both mating connectors.

  In the present embodiment, the first connector 1A and the second connector 1B have the same structure as each other, and those attached to the first connector 1A and those attached to the second connector 1B have the same structure. Therefore, the first connector 1A and its accompanying items are given a "first" designation, and the letter "A" is added to the end of the reference, and the second connector 1B and its accompanying items are given a "second" Identification is performed by adding a name and adding the letter “B” to the end of the code. In the case where the first connector 1A and the one accompanying it are described without distinguishing the second connector 1B and the one accompanying it, the designations “first” and “second” and “A” and “ The letter “B” will be omitted.

  Further, in the present embodiment, expressions indicating directions such as upper, lower, left, right, front, rear, etc. used for explaining the configuration and operation of each part of the connector 1 are not absolute but relative. This is appropriate when the connector 1 is in the posture shown in the figure, but when the posture of the connector 1 is changed, it should be interpreted according to the change in the posture.

  Here, 11 is a housing portion as an insulating region made of an insulating material, 61 is a contact portion as a conductive region formed in the housing portion 11, and 62 is an electrode made of a conductive material such as metal. Yes, and connected to the contact portion 61. Each electrode 62 is connected to each of conductive wires such as an electric element, an electronic element, an electric cable, and a substrate.

  In the illustrated example, the housing portion 11 is a rectangular plate-shaped member, but may be any shape member. Here, it is assumed that the housing part 11 is a plate-like member having a thickness of about 5 [mm] or less, preferably about 1 [mm]. In the housing portion 11, the surfaces facing each other are contact surfaces 66, and the opposite surface is a back surface 67. The contact portion 61 is a cylindrical region formed so as to extend through the housing portion 11 in the thickness direction, and one end surface thereof is exposed to the contact surface 66 and the corresponding contact surface 66. And the other end surface is exposed to the back surface 67 and is flush with the back surface 67. An electrode 62 is connected to the end surface of the contact portion 61 on the back surface 67 side. The contact portion 61 is columnar and a cylinder is an example, and the shape is determined as appropriate.

  Thereby, the first connector 1A and the second connector 1B are brought close to each other, and the first contact surface 66A of the first connector 1A and the second contact surface 66B of the second connector 1B are brought into contact with each other. The electric element, electronic element, electric cable, substrate, etc. connected to the first electrode 62A are electrically connected to the electric element, electronic element, electric cable, substrate, etc. connected to the second electrode 62B. Can be connected. In this case, the first contact portion 61A of the first connector 1A and the second contact portion 61B of the second connector 1B are in contact with each other and are electrically connected.

In the present embodiment, the housing portion 11 is a porous insulating region made of insulating porous silicon (Si), that is, porous silicon. Porous silicon can be produced, for example, by immersing a silicon wafer in hydrofluoric acid, passing a current using the silicon wafer as an anode and a counter electrode such as platinum as a cathode, that is, anodizing. The contact portion 61 is a region in which a conductive metal is selectively deposited and impregnated on porous silicon by a metal deposition method such as sputtering, and exhibits conductivity. The conductive metal may be any kind of metal, but is preferably copper having high conductivity or an alloy thereof. Further, the material of the housing part 11 may be a substance other than silicon as long as it is a porous substance. For example, it may be a semiconductor such as Ge, SiC, GaP, GaAs, InP, or alumina. (Al ₂ O ₃ ) may also be used.

  Next, a method for manufacturing the connector 1 will be described.

  FIG. 2 is a diagram showing a method for manufacturing an integrated electrical array connector according to the first embodiment of the present invention. In FIG. 2, (a) to (c) show each manufacturing process.

  In FIG. 2A, reference numeral 12 denotes a housing base portion as an insulating region made of an insulating material, specifically made of a silicon wafer. The housing portion 11 as a porous insulating region made of insulating porous silicon is formed on the housing base portion 12.

  Subsequently, as shown in FIG. 2B, a mask 91 made of a photoresist or the like is placed on the housing portion 11. The mask 91 is patterned so that a region to be the contact portion 61 is exposed, and a part of the mask 91 is removed to form an opening 91a. Then, a metal, specifically, copper is deposited on the mask 91 by a metal deposition method such as sputtering. Then, copper is deposited only on the portion corresponding to the opening 91 a in the housing portion 11 and is impregnated in the region that becomes the contact portion 61.

  Then, when the mask 91 is removed, as shown in FIG. 2C, the housing portion 11 having the contact portions 61 as a plurality of isolated conductive regions can be obtained. Finally, the housing base portion 12 is removed, and the electrode 62 is connected to the end surface of the contact portion 61 on the back surface 67 side, whereby the connector 1 as shown in FIG. 1 can be obtained.

  The contact portions 61 may have any shape as long as each contact portion 61 is isolated in the housing portion 11 and adjacent ones are separated from each other, but the example shown in FIG. As described above, has a cylindrical shape formed so as to penetrate the housing portion 11 in the thickness direction. Further, the number and arrangement of the contact portions 61 can be arbitrarily set, but in the example shown in FIG. 1, there are nine, and the contact portions 61 and the rear surface 67 are arranged so as to form a square lattice. ing. Further, the dimensions of the contact portion 61 can be arbitrarily set. For example, the radius is 100 [μm], and the length is the same as the thickness of the housing portion 11, that is, about 1 [mm]. Yes. Further, the distance between adjacent contact portions 61, that is, the pitch of the contact portions 61 is about 200 [μm].

  Moreover, the case where the housing part 11 is a substance other than silicon, for example, Ge, SiC, GaP, GaAs, InP, alumina or the like, and the case where the metal to be deposited is a metal other than copper are also shown in FIG. The connector 1 can be manufactured by a method similar to the method.

  As a result, as shown in FIG. 1, the housing portion 11 made of an insulating material, that is, a plurality of, for example, nine contact portions 61 as isolated conductive regions existing in the porous insulating region is formed. Can do. The electrode 62 is connected to the end face on the back surface 67 side of the contact portion 61 by an arbitrary connecting means.

  Next, the resistance of the connector 1 will be described.

The most widely used numerical value as the figure of merit of an electrical connector is the operating resistance R _d of the terminal. Since the purpose of the electrical connector is to electrically connect the electrical element or electronic element, that is, to conduct power between the connected electrical element or electronic element, ideally, the operating resistance R _d is zero. In practice, the value of the operating resistance _Rd varies depending on the structure and application of the electrical connector. However, in most electrical connectors, the value of the operating resistance _Rd is several millimeters [ Ω] to about 1 [Ω] at most. Therefore, in a practical electrical connector, the maximum value of the operating resistance R _d can be said to be about 1 [Ω].

In the present embodiment, the contact portion 61 as a terminal of the connector 1 has a cylindrical shape with a circular cross section. Therefore, if the radius, length, and electrical conductivity of the contact portion 61 are r, L, and σ, respectively, the operating resistance R _d of the contact portion 61 is expressed as the following equation (1).

そして、コンタクト部６１が前述のように銅が含浸されたポーラスシリコンから成るものであるところ、銅が含浸されたポーラスシリコンの電気伝導率σが約１０００００〔Ω^-1ｍ^-1〕であり、コンタクト部６１の半径及び長さは１００〔μｍ〕及び１〔ｍｍ〕であるから、コンタクト部６１の動作抵抗Ｒ_d は、約０．６〔Ω〕となる。このことから、本実施の形態におけるコネクタ１は、実際的な電気コネクタであることが分かる。

The contact portion 61 is made of porous silicon impregnated with copper as described above, and the electrical conductivity σ of the porous silicon impregnated with copper is about 100,000 [Ω ⁻¹ m ⁻¹ ], Since the radius and length of the contact portion 61 are 100 [μm] and 1 [mm], the operating resistance R _d of the contact portion 61 is about 0.6 [Ω]. From this, it can be seen that the connector 1 in the present embodiment is a practical electrical connector.

  As described above, in the present embodiment, the housing portion 11 of the connector 1 is a porous insulating region made of a porous insulating material, and a desired portion of the housing portion 11 is selectively impregnated with a conductive substance. Thus, a plurality of contact portions 61 as isolated conductive regions existing in the insulating region are formed. As a result, the boundary between the housing portion 11 and the contact portion 61 is adjusted, and the connector 1 having a narrow pitch and a small overall size can be obtained. That is, an integrated electrical array connector with a high degree of integration can be obtained.

  In addition, since the conductive portion enters the fine nanopores of the porous insulating material and integrates to form the contact portion 61, the housing portion 11 and the contact portion 61 are firmly bonded. . Furthermore, since the housing part 11 and the contact part 61 are integrally formed from the same material, thermal stress is applied to the boundary between the housing part 11 and the contact part 61 even if the environmental temperature of the connector 1 changes. The boundary between the housing part 11 and the contact part 61 is stabilized. Therefore, the connector 1 has high resistance to changes in the environmental temperature and can exhibit stable performance.

  Further, since the contact portion 61 can be formed simply by selectively impregnating a desired portion of the housing portion 11 with a conductive material, the connector 1 can be manufactured easily and accurately.

  Next, a second embodiment of the present invention will be described. In addition, about the thing which has the same structure as 1st Embodiment, the description is abbreviate | omitted by providing the same code | symbol. The description of the same operation and the same effect as those of the first embodiment is also omitted.

  FIG. 3 is a perspective view showing an integrated electrical array connector according to the second embodiment of the present invention.

  As illustrated, the connector 1 according to the present embodiment has the housing base portion 12 integrated with the housing portion 11 without removing the housing base portion 12 in the manufacturing process. The contact portion 61 extends along the contact surface 66 and has a strip-like or rod-like shape in which adjacent members are parallel to each other. Note that the end surface of the contact portion 61 on the contact surface 66 side is exposed to the contact surface 66 and is flush with the corresponding contact surface 66. An electrode (not shown) is connected to an arbitrary portion of the contact portion 61 by an arbitrary connection means.

  Since the configuration of other points is the same as that of the first embodiment, description thereof is omitted.

  Thus, in this embodiment, since it is not necessary to remove the housing base portion 12, the connector 1 can be easily manufactured. Moreover, since the housing base part 12 is integrally connected to the surface of the housing part 11 opposite to the contact surface 66, the strength of the housing part 11 increases. Therefore, the housing part 11 can be thinned.

  Next, a third embodiment of the present invention will be described. In addition, about the thing which has the same structure as 1st and 2nd embodiment, the description is abbreviate | omitted by providing the same code | symbol. Also, the description of the same operations and effects as those of the first and second embodiments is omitted.

  FIG. 4 is a diagram showing a method of manufacturing an integrated electrical array connector according to the third embodiment of the present invention. In addition, in FIG. 4, (a)-(c) has shown each manufacturing process.

  In the present embodiment, since the structure of the connector 1 is the same as that of the first and second embodiments, only the method for manufacturing the connector 1 will be described.

  As shown in FIG. 4A, in the present embodiment, the housing portion 11 made of insulating porous silicon is formed in a selected region on the housing base portion 12. In this case, the housing base portion 12 on which the mask 91 is placed is immersed in hydrofluoric acid to perform anodization, so that only the portion corresponding to the opening 91a of the mask 91 becomes porous, and the housing portion made of porous silicon. 11 is selectively formed. Each of the housing parts 11 is isolated in the housing base part 12, and adjacent ones are separated from each other.

Subsequently, as shown in FIG. 4B, when the housing base portion 12 on which the housing portion 11 is formed is exposed to a tungsten fluoride (WF ₆ ) gas 92, a reaction according to the following equation (2) is performed. As a result, the housing portion 11 is impregnated with tungsten (W), and the porous silicon and tungsten are bonded at the molecular level to form a contact portion 61 as a conductive region.
2WF ₆ + 3Si → 2W + 3SiF ₄ Formula (2)
Subsequently, after removing the mask 91, as shown in FIG. 4C, a contact upper portion 611 as a conductive metal layer is formed on the upper surface of the contact portion 61. The contact upper portion 611 is a conductive region made of a highly conductive metal such as gold or copper, and is formed by a method such as electrolytic plating, vapor deposition, or sputtering, and is attached to the upper surface of the contact portion 61. Therefore, like the contact portion 61, the contact upper portion 611 is also isolated in the housing base portion 12, and adjacent ones are separated from each other. In the illustrated example, in the direction perpendicular to the drawing. It has a band-like shape formed so as to extend.

  The contact upper portion 611 may be any kind of metal, but is preferably gold, copper, or an alloy thereof having high conductivity. The method for forming the contact upper portion 611 is not limited to a method such as electrolytic plating, vapor deposition, or sputtering, and any method may be used.

  An electrode (not shown) is connected to an arbitrary portion of the contact upper portion 611 by an arbitrary connection means. Thereby, the connector 1 can be obtained. Then, conductive wires such as an electric element, an electronic element, an electric cable, and a substrate can be connected to the contact upper portion 611 via the electrode.

  As described above, in the present embodiment, the housing portion 11 as the porous insulating region is selectively formed at a desired location of the housing base portion 12 as the insulating region, and a plurality of portions existing in the housing base portion 12 are present. It is an isolated area. Then, the housing portion 11 is impregnated with a conductive material, and a plurality of contact portions 61 as isolated conductive regions existing in the housing base portion 12 are formed. Accordingly, the boundary between the housing base portion 12 and the contact portion 61 is adjusted, and the connector 1 having a small overall size can be obtained with a narrow pitch between the contact portion 61 and the contact upper portion 611 formed thereon. That is, an integrated electrical array connector with a high degree of integration can be obtained.

  In addition, since the conductive portion enters the fine nanopores of the porous insulating material and integrates to form the contact portion 61, the housing portion 11 and the contact portion 61 are firmly bonded. . Furthermore, since the housing base portion 12 and the contact portion 61 are integrally formed from the same material, even if the environmental temperature of the connector 1 changes, thermal stress is applied to the boundary between the housing base portion 12 and the contact portion 61. The boundary between the housing base portion 12 and the contact portion 61 is stabilized. Therefore, the connector 1 has high resistance to changes in the environmental temperature and can exhibit stable performance.

  Next, a fourth embodiment of the present invention will be described. In addition, about the thing which has the same structure as the 1st-3rd embodiment, the description is abbreviate | omitted by providing the same code | symbol. Explanation of the same operations and effects as those of the first to third embodiments is also omitted.

  FIG. 5 is a diagram showing a method of manufacturing an integrated electrical array connector according to the fourth embodiment of the present invention. In FIG. 5, (a) to (c) show each manufacturing process.

  In the present embodiment, since the structure of the connector 1 is the same as that of the first and second embodiments, only the method for manufacturing the connector 1 will be described.

  In FIG. 5 (a), reference numeral 12 denotes a housing base as an insulating region made of an insulating material, specifically made of alumina. The housing portion 11 made of insulating porous alumina is formed on the housing base portion 12. In the present embodiment, a stamp tool 94 is used in which gold, which is a conductive metal, is attached as the impregnating metal 93 to the tip portion (lower end portion in the figure) of the protrusion 95.

  Then, by pressing the projection 95 of the stamp tool 94 against the housing 11, gold as the impregnating metal 93 is pressed and impregnated into the housing 11 made of porous alumina, as shown in FIG. 5B. Then, a contact portion 61 as a conductive region is formed. The stamp tool 94 and the protrusion 95 thereof are made of, for example, an elastomer, but may be made of any material. Thereby, the housing part 11 having the contact part 61 as a plurality of isolated conductive regions can be obtained.

  Subsequently, as shown in FIG. 5C, a contact upper portion 611 as a conductive metal layer is formed on the upper surface of the contact portion 61. The contact upper portion 611 is a conductive region made of a highly conductive metal such as copper and is formed by a method such as electrolytic plating, vapor deposition, or sputtering, and is attached to the upper surface of the contact portion 61. Therefore, similarly to the contact portion 61, the contact upper portion 611 is isolated in the housing portion 11 and adjacent ones are separated from each other. In the illustrated example, the contact upper portion 611 extends in a direction perpendicular to the drawing. It has a belt-like shape formed to exist.

  In the present embodiment, the case where the housing base portion 12 is made of alumina and the housing portion 11 is made of porous alumina has been described. However, the housing base portion 12 is made of silicon, Ge, SiC, GaP, GaAs, InP, or the like. The housing portion 11 may also be made of silicon, Ge, SiC, GaP, GaAs, InP or the like as long as it is a porous substance. Further, the impregnating metal 93 is not necessarily gold, but may be any metal having high conductivity, such as copper.

  As described above, in the present embodiment, the housing portion 11 of the connector 1 is a porous insulating region made of a porous insulating material, and a conductive substance is selectively applied to a desired portion of the housing portion 11. The contact portions 61 are formed as a plurality of isolated conductive regions existing in the insulating region by pressing and impregnating. Accordingly, the boundary between the housing base portion 12 and the contact portion 61 is adjusted, and the connector 1 having a small overall size can be obtained with a narrow pitch between the contact portion 61 and the contact upper portion 611 formed thereon. That is, an integrated electrical array connector with a high degree of integration can be obtained.

  In addition, since the conductive portion enters the fine nanopores of the porous insulating material and integrates to form the contact portion 61, the housing portion 11 and the contact portion 61 are firmly bonded. . Furthermore, since the housing base portion 12 and the contact portion 61 are integrally formed from the same material, even if the environmental temperature of the connector 1 changes, thermal stress is applied to the boundary between the housing base portion 12 and the contact portion 61. The boundary between the housing base portion 12 and the contact portion 61 is stabilized. Therefore, the connector 1 has high resistance to changes in the environmental temperature and can exhibit stable performance.

  Furthermore, since the contact portion 61 can be formed at a desired location of the housing portion 11 simply by pressing the protruding portion 95 using the stamp tool 94, the connector 1 can be manufactured easily and accurately. Can do.

  In addition, this invention is not limited to the said embodiment, It can change variously based on the meaning of this invention, and does not exclude them from the scope of the present invention.

1 is a perspective view showing an integrated electrical array connector according to a first embodiment of the present invention. It is a figure which shows the method of manufacturing the integrated electrical array connector in the 1st Embodiment of this invention. It is a perspective view which shows the integrated electrical array connector in the 2nd Embodiment of this invention. It is a figure which shows the method of manufacturing the integrated electrical array connector in the 3rd Embodiment of this invention. It is a figure which shows the method of manufacturing the integrated electrical array connector in the 4th Embodiment of this invention. It is a figure which shows the method of forming a connector on the conventional wafer.

Explanation of symbols

1A 1st connector 1B 2nd connector 11 Housing part 11A 1st housing part 11B 2nd housing part 12 Housing foundation part 12A 1st housing foundation part 12B 2nd housing foundation part 61 Contact part 61A 1st contact part 61B 2nd contact part 62A first electrode 62B second electrode 66A first contact surface 66B second contact surface 67A first rear 67B second rear 91 mask 91a opening 92 of tungsten fluoride (WF ₆₎ gas 93 impregnated metal 94 stamp tool 95 Protrusion 611 Contact top 801 Wafer 802 Connection layer 803 Insulating layer 804 Photoresist 805 Arrow 806 Connector

Claims (8)

(A) an insulating area formed of an insulating material,
(B) an integrated electric array connector having a plurality of isolated conductive area present in the insulating area,
(C) the insulating region is made of Si, Ge, SiC, GaP, GaAs, InP or Al ₂ O ₃ ;
; (D) at least part of the insulating area, a porous insulation area made of a porous insulating material,
(E) the conductive area, the porous insulating area selectively impregnated with conductive material, characterized in that it is formed by an integrated electric array connector. It said porous by depositing the conductive material on the insulating area, integrated electro array connector according to claim 1 impregnated with a conductive material in the porous insulating area. Wherein by a porous insulating area exposed to the gas containing the conductive material, integrated electro array connector according to claim 1 for impregnating the conductive material to said porous insulating area. It said porous by pressing the conductive material in the insulating area, integrated electro array connector according to claim 1 impregnated with a conductive material in the porous insulating area. (A) the insulating area is a plate-shaped region with a mating connector that contacts abutment surface,
(B) said conductive area, said a columnar region extending in the thickness direction of the insulating area, at least integrated electro array connector according to claim 1 in which one end face is exposed to the abutment surface . (A) the insulating area is a plate-shaped area,
(B) the conductive area is integrated electro array connector according to claim 1 which is strip-shaped area extending along one surface of the insulating area. On the conductive area, the integrated electro array connector according to claim 1 in which the conductive metal layer is further formed. (A) The conductive area, together with the one end face is exposed to the abutment surface, exposed on the back surface of the other end face opposite to the abutment surface,
(B) integrated electro sequences connector according to claim 5, electrode on the other end face is connected.

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