JP4952386B2 - Chip-type electronic component storage mount - Google Patents

Description

The present invention relates to a chip-type electronic component storage board provided with antistatic performance.

The chip-type electronic component storage board is usually processed as follows and used as a carrier for the chip-type electronic component.
(1) Slit to a predetermined width.
(2) Open a square hole and a round hole of a predetermined size. The square hole is for storing chip-type electronic components, and the round hole is for feeding into the filling machine.
(3) Adhere the cover tape to the back side (bottom side) of the mount. In addition, square embossing of a predetermined size may be performed without making a square hole, and in this case, this step is omitted. A method of bonding the mount and the cover tape is performed by a so-called heat seal method in which the mount and the cover tape are overlapped and bonded by applying heat and pressure from the cover tape.
(4) The chip type electronic component is filled.
(5) A cover tape is bonded to the surface (top side) of the mount by a heat seal method.
(6) It is wound around a cassette reel of a predetermined size and shipped with a chip-type electronic component.
(7) The top user peels off the top cover tape and takes out the chip-type electronic component.

Since it is used as described above, the quality required for the storage board does not adversely affect the chip components that are filled, and furthermore, the surface of the paper has a smoothness so that the cover tape is satisfactorily adhered, For example, it has a strength capable of withstanding various types of processing on paper, and the size of a square hole (hereinafter referred to as a cavity) into which a chip component is inserted is accurate.

In particular, since electronic components are stored in the carrier tape, the electronic components may be peeled off when the top tape is peeled off, or frictionally charged between the carrier tape and the substance that comes into contact with the carrier tape. There has been concern about troubles caused by charging.

Until now, as a method for preventing charging of an electronic component storage board, Japanese Patent Laid-Open No. 9-188385 (see Patent Document 1) discloses a method of applying a conductive agent such as carbon black or bonding a conductive paper to the surface. Kaihei 9-216659 (see Patent Document 2) discloses a method of laying one conductor along a cavity, Japanese Patent Laid-Open No. 2000-203521 (see Patent Document 3) and Japanese Patent No. 3383935 (Patent Document). 4) proposes a method in which a conductive substance is internally added to all or middle layers and a conductive substance is applied to the surface. However, the cost increases due to an increase in the number of processes and the need for an excessive conductive agent. It was difficult to adopt.

Japanese Patent Laid-Open No. 9-188385 Japanese Patent Laid-Open No. 9-216659 JP 2000-203521 A Japanese Patent No. 3383935

  The present invention relates to a paper-made chip-type electronic component storage board, and more particularly to a chip-type electronic component storage board that has no trouble due to static electricity when the cover tape is peeled off and has excellent antistatic performance.

The present inventors have found that the antistatic performance can be imparted by a simple method by grasping the trouble due to static electricity during mounting by the mounter, the charged state, and the necessary and sufficient conductivity level of the carrier tape, and completed the present invention. It came to do.

The present invention includes the following inventions.
(1) An electronic component storage board for storing chip-type electronic components, having a conductive layer on the back surface, and having a surface electrical resistance value of 1.0 × on the back surface in an environment of a temperature of 23 ° C. and a relative humidity of 50%. A chip-type electronic component housing that is 10 ⁷ Ω or less and that has an initial voltage of 10 mV or less on the surface of the mount measured using the half-life measuring device described in “Half-life measurement method” of JIS-L-1094 Mount.

(2) The chip-type electronic component storage board according to (1), wherein the conductive layer is selected from a conductive fine particle layer, a metal vapor deposition layer, a conductive polymer layer, and an antistatic agent layer.

(3) The chip-type electronic component storage board according to (2), wherein the conductive fine particle layer is formed by applying or printing a paint or ink containing fine particles such as carbon black and metal.

  The present invention is advantageous in that electronic components can be safely mounted without causing trouble due to static electricity when mounted on a mounter.

  In the present invention, it is important to provide a conductive layer on the back surface opposite to the surface on which the chip is filled and the top tape is bonded. When the electronic component storage board (carrier tape) is running, the back surface has a larger contact area and has a greater effect on frictional charging. When a conductive layer is provided on the front surface, it is very difficult to balance the decrease in the peeling charge when the top tape is peeled off and the adhesiveness between the top tape and the back tape. Further, by setting the surface electric resistance value to a specific value or less, it is possible to suppress even the surface peeling charge.

In the present invention, the provision of the conductive layer on the back surface can provide the antistatic performance on the front surface as follows. That is, the cellulose and hemicellulose that originally constitute the pulp fiber used in the paper carrier tape have OH ^- groups that easily transfer electrons to the terminal, and these are intertwined in a complicated manner to form a paper layer. For this reason, even with paper to which no antistatic performance is imparted, the surface electrical resistance is usually in the range of 10 ¹⁰ to 10 ¹³ Ω, and it does not mean that no electricity is passed. However, if the top tape (plastic film) heat-sealed on the surface is abruptly peeled off, peeling electrification occurs, but the tape is long in the vertical direction, and it is necessary to go through a long distance to discharge, so a continuous tape In the case of peeling, a high charged voltage remains. On the other hand, when a conductive layer is provided on the back side, the electric charge generated when the top tape is peeled off is transmitted in the thickness direction of the mount, and the metal such as a feeder of a mounting machine (mounter) through the conductive layer provided on the back side It is easily discharged out of the system by touching the part. Since the thickness of the mount is usually as thin as 0.3 to 1.3 mm, the discharge is completed as long as the electric charge moves through this short distance. If the surface electrical resistance of the back surface is 1.0 × 10 ⁷ Ω or less, as described above, a distance of several centimeters to several tens of centimeters can be transferred instantaneously, and the electrical resistance of the back surface is 1 It is preferably less than 0.0 × 10 ⁴ Ω.

The method for providing the conductive layer on the back surface is not particularly limited as long as the surface electrical resistance on the back surface can be reduced to 1.0 × 10 ⁷ Ω or less. For example, printing, coating, and metal using a paint containing conductive fine particles Examples include vapor deposition, application of metal foil such as gold foil, silver foil, and aluminum foil, application of a conductive polymer material, application of an antistatic agent, and the like.

In the present invention, it is essential that the surface electrical resistance of the back surface of the chip-type electronic component storage board is 1.0 × 10 ⁷ Ω or less, but this is not sufficient, and “half-life measurement of JIS-L-1094” It is important that the initial charged voltage on the surface of the mount measured with the half-life measuring apparatus described in “Method” is 10 mV or less. This is because it becomes an index for grasping whether or not the electric charge generated when peeling off on the surface where the top tape is actually applied is efficiently discharged. The initial voltage is defined as the voltage immediately after applying a voltage of 10 kV for a certain period of time using a static Honest meter. The smaller this value is, the more electricity can continue to escape during application. If the voltage is 10 mV or less, it is difficult to be charged when the top tape is actually peeled off, and there is a tendency that troubles such as an electronic component popping out during mounting do not occur. On the other hand, if it exceeds 10 mV, the probability of occurrence of the above-mentioned trouble increases because it is easily charged.

The reason why the surface electrical resistance of the back surface is not more than 1.0 × 10 ⁷ Ω or less is that, as described above, the charge generated when the top tape is peeled is first released in the thickness direction of the backing sheet, and this is the conductive layer on the back surface. This is because it is discharged to the outside through the system, but it receives a factor of the ease of electricity flow of the substance existing in the thickness direction. Cellulose fibers used in very general paper, that is, chemical pulp, mechanical pulp, waste paper pulp, non-wood fiber pulp, etc., as described above, allow electric charges to pass through in the thickness direction of the mount without any particular problems. This is because the object of the present invention may not be achieved when it is formed of only a substance that is difficult to conduct electricity or when such a substance is mixed.

  Examples of the conductive fine particles used in the present invention include carbon black fine particles, conductive metals / metal oxides, and the like. Can be attached. If this method is used, a conductive layer can be provided on the back surface efficiently and inexpensively, which is particularly preferable.

  The metal vapor deposition used in the present invention does not particularly limit the type of metal / metal oxide, but aluminum vapor deposition is preferred. This is because the conductive metal can be processed at low cost. Normally, the metal is evaporated in a vacuum and processed by adhering to the sheet surface. However, in the case of the present invention, since the carrier tape is usually used in a wound state, winding vapor deposition is preferable.

  For the metal foil sticking used in the present invention, various thin foils such as a gold foil, a silver foil, a copper foil, and an aluminum foil can be used, but an aluminum foil is particularly preferable because it can be processed at low cost. The method of bonding is not particularly limited, but if an insulating material is used when glue or adhesive is used, the object of the present invention cannot be achieved. Using paste / adhesives, using paste / adhesives partially, securing a part where the metal foil and pulp fiber are in direct contact, or using a hot press that uses almost no glue Are preferably used.

Examples of the conductive polymer used in the present invention include polyacetylene, polyparaphenylene, polyaniline, polythiophene, and polyparaphenylene vinylene. These are appropriately adjusted and used in a form dispersed in a dispersion medium such as water or an organic solvent, if necessary. The amount to be applied to the back surface of the chip-type electronic component storage board (carrier tape) is not particularly limited, but by applying 0.1 to 2.0 g / m ^{2 as} the active ingredient solid content, A surface electrical resistance of 0 × 10 ⁷ Ω or less is achieved.

Examples of the antistatic agent used in the present invention include inorganic salts, organic salts, and ionic polymers. Inorganic salts include lithium compounds, sodium aluminate, magnesium chloride, sodium chloride, sodium sulfide, calcium chloride, potassium chloride and other alkali metal and alkaline earth metal salts, and organic salts such as calcium formate and sodium oxalate. Of these carboxylates. In addition, an ionic polymer antistatic agent selected from an anionic polymer having a carboxyl group, a sulfone group, a sulfate group or the like in the molecule, or a cationic polymer having a base such as an amino group or a quaternary ammonium group. Can be used. When using an ionic polymer, either an aqueous solution type or an emulsion type may be used, but an emulsion type antistatic agent was selected in consideration of the ionicity of the resin emulsion to be used in order to avoid aggregation and emulsion collapse. Better. A particularly preferred acrylic ester copolymer as the resin emulsion is anionic, and an anionic polymer having a carboxyl group, a sulfone group, a sulfuric acid group or the like in the molecule is suitable. The amount to be applied to the back surface of the chip-type electronic component storage board (carrier tape) is not particularly limited, and varies depending on the type, but the active ingredient solid content is 1 to 10 g / m ² for application. A surface electrical resistance of less than 0.0 × 10 ⁷ Ω is achieved.

In the present invention, the method for printing ink containing fine particles of carbon black, various metals, etc. is not particularly limited. Offset printing (sheet-fed, rotary), gravure printing, letterpress printing, flexographic printing, screen (silk) ) Printing is performed by a commonly used method such as printing or inkjet printing. Above all, the offset rotary printing, gravure printing, and flexographic printing methods can efficiently pre-process chip-type electronic component storage boards (carrier tapes) of several thousand meters at high speeds, and are available in more than two colors. A color machine is mainly used, and a transparent varnish (oxidation type, thermosetting type, photocurable type) or the like as an over (protective) coat can be coated at the same time as necessary, so that it is particularly preferable. The amount applied to the back surface of the chip-type electronic component storage board (carrier tape) is not particularly limited, and the surface electrical resistance of 1.0 × 10 ⁷ Ω or less can be obtained by printing very thinly on the surface. The amount to achieve can be secured.

In the present invention, the conductive fine particles, the conductive polymer, or the antistatic agent can be applied by equipment such as a coater or a spray. As the coater, a bar coater, a blade coater, an air knife coater, a rod coater, a gate roll coater, a roll coater such as a size press or a calendar coater, a bill blade coater, a bellbapa coater, or the like can be employed. After coating, it is preferably heat-dried in the range of 60 ° C to 150 ° C.
There is no particular limitation on the drying apparatus, and any drying apparatus can be used. When the heating and drying temperature is 60 ° C. or less, the drying is insufficient, and particularly in the case of a thick material such as a chip-type electronic component storage board, migration is likely to occur, and the amount of internal resin is reduced and the effect is reduced. This is not preferable. Further, drying at a high temperature exceeding 150 ° C. is not preferable because not only the effect reaches a peak but also uneconomical.

The basis weight of the electronic component storing mount of the present invention is generally 200g ^{/ m 2} ~1000g ^/ m 2 approximately. Since the basis weight is within such a range, multilayer papermaking that is easy to form is preferable as a papermaking method for the base material.

  Various raw pulps can be used in the present invention. For example, chemical pulp, mechanical pulp, waste paper pulp, non-wood fiber pulp, etc. may be used alone or in combination. However, it is preferable to use a pulp having a uniform fiber form.

  Although the pulp used by this invention can be beaten and used by a well-known method, even if it does not beat, there is no problem. There are no particular limitations on the beater, and various beaters such as a beater, Jordan, a deluxe refiner (DF), and a double disc refiner (DDR) are used. When beaten, a treatment of about 250 ml to 560 ml is preferred with Canadian Standard Freeness. If it is higher than 560 ml, the strength, particularly the interlayer strength, is weak, which is not preferable. On the other hand, if the beating is proceeded more than 250 ml, there is a problem of yield loss and loss of scale due to high density, which is not preferable.

  Although not particularly limited in the present invention, various internal chemicals can be used as necessary during papermaking. Examples include rosin-based sizing agents, styrene / maleic acid, styrene / acrylic, styrene / olefins, alkyl ketene dimers, alkenyl succinic anhydrides, internal sizing agents for natural and synthetic papermaking, various paper strength enhancers, filtered water Yield improvers, waterproofing agents, antifoaming agents, fillers such as talc, dyes, and the like can be used.

In the present invention, a surface treatment agent can be applied to the surface layer of the mount for the purpose of suppressing the flaking when the cover tape is peeled off. The surface treatment agent contains a water-soluble polymer. Examples of water-soluble polymers include polyvinyl alcohol, starch, polyacrylamide, acrylic resins, styrene-butadiene resins, styrene-isoprene resins, polyester resins, ethylene-vinyl acetate resins, vinyl acetate-vinyl alcohol resins, Although there exist urethane type resin etc., in this invention, at least one chosen from polyvinyl alcohol, starch, and polyacrylamide is contained. Polyvinyl alcohol, starch, and polyacrylamide are preferable because they can increase the adhesive strength of pulp fibers efficiently and inexpensively, and also have good applicability to the mount surface.
The coating amount of the water-soluble polymer is preferably 0.1 g / m ² or more and 1.1 g / m ² or less, more preferably 0.6 g / m ² or more and 1.1 g / m ² or less. If the coating is applied in excess of 1.1 g / m ² , the peel strength is lowered, and if it is less than 0.1 g / m ² , the effect of suppressing erosion does not appear.

In addition, the surface treatment agent can contain styrene / maleic acid resin or olefin / maleic acid resin in order to improve the adhesiveness to the cover tape and to further increase the strength of the surface of the mount. Styrene / maleic acid resin and olefin / maleic acid resin have a hydrophobic group and a hydrophilic group. By coating on the surface of the backing paper, in addition to covering the surface, it penetrates into the paper layer and is a hydrophilic group. Carboxylic acid forms a hydrogen bond with the pulp fiber, crosslinks between the fibers, and greatly improves the bond between the fibers. By improving the bond between fibers, the resistance force when peeling the cover tape is improved, and the peeling strength is increased and the removal of fibers that become a fluff can be prevented.

When a styrene / maleic acid resin or olefin / maleic acid resin is used, one having a glass transition temperature of 10 to 50 ° C. is preferable. If the glass transition temperature is less than 10 ° C., the bonding temperature of the styrene / maleic acid resin and olefin / maleic acid resin existing as a cross-linked state between the pulp fibers is weakened by the application temperature when the cover tape is applied. End up. Moreover, when the glass transition temperature exceeds 50 ° C., the crosslinking with the pulp fiber becomes too hard, and the cover tape adhesive layer may be damaged by the stress when it is peeled off, and the damaged portion may be generated as a fluff.

In the present invention, by controlling the coating / impregnation amount of styrene / maleic acid or olefin / maleic acid, it is possible to obtain the necessary level of adhesive strength of the cover tape by suppressing the generation of the chipping. When the surface treatment agent is mixed with styrene / maleic acid or olefin / maleic acid and applied, the solid content ratio with the water-soluble polymer can be adjusted arbitrarily, but styrene / maleic acid or olefin / maleic acid is applied / impregnated. the amount is in ^the range 0.01g / ^{m 2} ~0.10g / m 2 is preferred. Even if the coating / impregnation amount of styrene / maleic acid or olefin / maleic acid exceeds 0.10 g / m ² , the effect reaches a peak and is not preferable. If it is less than 0.01 g / m ² , the effect is not clearly manifested. .

In the present invention, as means for applying and impregnating the surface treatment agent on the surface of the mount, for example, bar coater, blade coater, air knife coater, rod coater, gate roll coater, roll coater such as size press and calendar coater, bill blade, etc. There are coaters. Among these, a size press or a calendar coater is preferable because it can easily penetrate the surface treatment agent deeply by the nip pressure.

  The present invention will be described in detail below with reference to examples, but the present invention is not limited thereto. Numerical values indicating the composition, concentration, etc. are numerical values based on the mass of the solid component or active ingredient. Further, unless otherwise specified, the paper made was subjected to pretreatment according to JIS-P-8111, and then subjected to measurement and testing. The results are shown in Table 1. The details of the method for measuring the surface electrical resistance, the method for measuring the initial charging voltage, and the method for evaluating the part jump-out are as follows.

<Measurement method of surface electrical resistance>
Under an environment of a temperature of 23 ° C. and a relative humidity of 50%, the sample is slit into a tape shape having a width of 8 mm, and in accordance with JIS C 0806-3, round holes with a diameter of 1.54 mm are opened at intervals of 4 mm, and at the same time, 2 mm A chip-type electronic component storage board having cavities of 0.66 mm in the CD direction, 0.36 mm in the MD direction, and 0.35 mm in the Z-axis direction at intervals was created. Next, from this 8 mm wide tape-like sample, three pieces each having a length of 45 mm were cut out, and these three tapes were brought into close contact with the back side up on the desk so that there was no overlap and no gap was formed. X A rectangle with a length of 45 mm was formed. In accordance with JIS-K-6911, a surface electrical resistance meter (manufactured by Mitsubishi Oil Chemical Co., Ltd., model: Hiresta IP MCP-HT260) was used to press the electrode, and the surface was applied at an applied voltage of 100 V for 10 seconds. The electrical resistance was measured.

<Initial voltage measurement method>
Under an environment of a temperature of 23 ° C. and a relative humidity of 50%, the sample is slit into a tape shape having a width of 8 mm, and in accordance with JIS C 0806-3, round holes with a diameter of 1.54 mm are opened at intervals of 4 mm, and at the same time, 2 mm A chip-type electronic component storage board having cavities of 0.66 mm in the CD direction, 0.36 mm in the MD direction, and 0.35 mm in the Z-axis direction at intervals was created. Next, 5 tapes of 45 mm in length are cut from the 8 mm wide tape-shaped sample, and 5 tape-shaped samples are placed in the sample window of a static Honest meter (model: S-5109). With the surface facing upwards and being closely attached so that no gap is formed, the applied voltage (+) is 10 kV and applied for 30 seconds in accordance with the “half-life measurement method” in JIS-L-1094. The charged voltage (initial charged voltage) immediately after the measurement was measured.

<Part pop-out evaluation method>
Under an environment of a temperature of 23 ° C. and a relative humidity of 50%, the sample is slit into a tape shape having a width of 8 mm, and in accordance with JIS C 0806-3, round holes with a diameter of 1.54 mm are opened at intervals of 4 mm, and at the same time, 2 mm A chip-type electronic component storage board having cavities of 0.66 mm in the CD direction, 0.36 mm in the MD direction, and 0.35 mm in the Z-axis direction at intervals was created. Next, “TWA6601” manufactured by Tokyo Wells Co., Ltd. is operated at a speed of 2400 tact / min, and the cover tape is applied to the mount while inserting the parts (chip-type electronic parts of 0603). A heat-sealed tape reel was obtained.
Next, a peeling apparatus and a constant speed tension apparatus as shown in the schematic diagram of FIG. 1 were brought into an environmental chamber having a temperature of 10 ° C. and a humidity of 30% RH. Set the tape reel in the constant-speed tensioning device (substituting the high-speed peeling tester, trade name: ZPE-1100W, manufactured by IMASS INC., USA), introduce the tape into the peeling machine, and peel off the top tape. Only the tape was pulled at the end (point A) of a metal plate having a thickness of 1 mm to the opposite side of the board traveling direction, and was sandwiched between the nip portions of the constant speed tension device. After that, pull the constant speed tension device at a constant speed of 4.5m / min and check whether there are any parts remaining in each cavity of the electronic component storage board after peeling, and all the parts remain It was evaluated as ○ when it was, and when no part remained (when popped out when the top tape was peeled off), it was evaluated as ×.

Pulp is properly used for the surface, middle and back layers. For the surface layer, mixed pulp of 30% by weight of softwood kraft pulp and 70% by weight of hardwood bleached kraft pulp is mixed and beaten with a double disc refiner, and CSF (Canadian Standard Freeness) 450ml For the middle layer, 10% by weight of softwood kraft pulp and 90% by weight of hardwood bleached kraft pulp are mixed and beaten with a double disc refiner to prepare 410 ml of CSF (Canadian Standard Freeness), and hardwood for the back layer. The bleached kraft pulp was prepared by beating up to 470 ml of CSF (Canadian Standard Freeness) alone with a double disc refiner. A sulfuric acid band is added to each of the pulp slurries of the surface layer and the back layer to adjust to pH 6.0, and polyacrylamide type paper strength agent (Polystron 1250 manufactured by Arakawa Chemical Industry Co., Ltd.) is added to 1.0 as an internal strength paper strength agent. Mass% was added. To the pulp slurry for the middle layer, 0.7% by mass of a rosin sizing agent (size pine N-111: manufactured by Arakawa Chemical Industries) is added to the pulp mass, and a sulfuric acid band is added to adjust the pH to 6.0. As an internally added paper strength agent, 1.0% by mass of a polyacrylamide type paper strength agent (Polystron 1250 manufactured by Arakawa Chemical Industries, Ltd.) was added. The pulp slurry of the above conditions was formed with a three-layered paper machine, and a wet sheet was formed at a ratio of surface layer: middle layer: back layer = 1: 1.5: 1, and smoothed with a calendar installed in the paper machine. Later, 0.9 g / m ^{2 of} polyacrylamide (Arakawa Chemicals Polymer Set-512, molecular weight 200,000) was applied to produce a chip-type electronic component storage board a having a basis weight of 370 g / m ² and a thickness of 0.42 mm. did.

Example 1
The winding of the chip-type electronic component storage mount a was prepared, and gravure printing was performed on the back surface of the mount a using black ink (containing carbon black). The carbon black adhesion amount was 1.1 g / m ² .

Example 2
The winding of the chip-type electronic component storage mount a was prepared, and aluminum vacuum deposition was performed on the back surface of the mount a. The aluminum adhesion amount was measured and found to be 1.0 g / m ² .

Example 3
Prepare to wind up chip-type electronic component storage mount a, use an off-machine coating machine, and use conductive polymer (conductive polyaniline aqueous dispersion, made by Starlight PMC, T-Y243) on the back side of mount a. The concentration was adjusted so that the component adhesion amount was 1.0 g / m ^2, and the coating was dried.

Example 4
Prepare the winding of the chip-type electronic component storage mount a, use an off-machine coating machine, and apply a styrene resin sulfonate antistatic agent (VERSA-TL125, manufactured by NSC Japan) to the back of the mount a. Then, the concentration was adjusted so that the active ingredient adhesion amount was 2.8 g / m ^2, and it was applied and dried.

Comparative Example 1
The mount a was used as the chip-type electronic component storage mount as it was.

Comparative Example 2
A chip-type electronic component storage board was manufactured in the same manner as in Example 4 except that the concentration was adjusted so that the active ingredient adhesion amount would be 0.5 g / m ² , coating and drying.

Table 1 shows the evaluation results of the surface electrical resistance, initial charging voltage, and component pop-out evaluation of the sample obtained by the above-described methods. In Examples 1 to 4, the surface electrical resistance on the back surface of the mount was 1.0 × 10 ⁷ Ω or less, and the initial voltage on the mount surface was 10 mV or less. On the other hand, in Comparative Examples 1 and 2, the surface electrical resistance on the back side of the mount exceeded 1.0 × 10 ⁷ Ω, the initial voltage on the paper surface exceeded 10 mV, and the result of x in the part pop-out test became.

Peeling device and constant speed tension device

Explanation of symbols

1: Cover tape peeling device 2: Tape reel 3: Electronic component storage mount 4: Top tape 5: Metal plate 6: Constant speed tension device 7: Nip roll

Claims (2)

An electronic component storage board for storing chip-type electronic components, by coating or printing, or metal depositing a coating or ink selected from conductive fine particles, metal fine particles, conductive polymers, and antistatic agents on the back surface It has the formed conductive layer, the surface electrical resistance value of the back surface is 1.0 × 10 ⁷ or less in an environment of a temperature of 23 ° C. and a relative humidity of 50%, and “Half-life measurement” of JIS-L-1094 A chip-type electronic component storage board, characterized in that the initial charged voltage on the surface of the mount measured with the half-life measuring device described in the "Method" is 10 mV or less. 2. The chip-type electronic component storage board according to claim 1, wherein the conductive fine particles are carbon black or metal fine particles.

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