JP4943568B1 - Apparatus and method for removing cultured soil adhering to the root of edible mushroom - Google Patents

Abstract

An object of the present invention is to remove culture soil such as sawdust that has been incorporated into the stem root of artificially grown mushrooms, such as agaric bamboo, and attach the stem root to the root of an edible mushroom that can be effectively used as a raw material for health foods. An apparatus and method for removing culture soil are provided.
A slicing device 11 for slicing a pedicle root portion 20 of an edible mushroom, a transport device 12 for transporting a tip 20a of a root portion sliced by a slicing device in a predetermined direction, and a tip of a pedicle portion transported by the transport device. A laser beam irradiation device 13 for irradiating a laser beam for incinerating only the culture soil adhering to the chip disposed above the conveyance path, and a conveyance path for the tip of the pedicle portion conveyed by the conveyance device. And a high water pressure shower device 14 for washing and removing the incineration ash of the culture soil incinerated by the laser light irradiation means, which is disposed above the conveyance path on the downstream side of the laser light irradiation device.
[Selection] Figure 1

Description

  The present invention is, for example, for removing culture soil such as sawdust attached to the stem root of edible mushrooms such as artificially cultivated Hanabiratake, and making the stem root of edible mushrooms available as a raw material for products. The present invention relates to a culture soil removing apparatus and method.

Hanabiratake is a very large mushroom that can be harvested by artificial cultivation.
However, what is actually sold as an edible product is a large number of petal-like and spatula-like pieces on the upper side of about 50 to 60%, gathered so as to wave, and overhanging to cover the side of the handle, The main part of the mushroom is a part corresponding to an umbrella, and the remaining lower pedicle is discarded.

The reason why the lower root portion is discarded is as follows.
Generally, in artificial cultivation of mushrooms, sawdust is used as culture soil, and fungi are planted in sawdust. As a result, the stem root part enters into the sawdust and extends downward in a complicated form to take in the sawdust. Removing sawdust from the shoot root is complicated due to the complex shape of the shoot root. As a result, the current situation is that they are not shipped for food and are discarded.

  Further, in artificially cultivated edible mushrooms other than Hanabira bamboo, for example, the stone bumps that contact the lower culture soil are generally removed as being hard and not edible.

  Conventionally, as an apparatus for removing artificially cultivated mushrooms, there is an automatic mushroom harvesting apparatus described in Patent Document 1, for example.

JP 2000-175560 A

Outline of Technology described in Patent Document 1 FIG. 3 is an explanatory view showing the overall configuration of the automatic harvesting apparatus for mushrooms described in Patent Document 1, and FIG. 4 is a longitudinal sectional view showing a state of cutting a stone bump by the apparatus of FIG.
As shown in FIG. X1, the automatic mushroom harvesting device 50 of Patent Document 1 has a stone bump cutting unit 51 that removes stone bumps from mushrooms harvested from a cultivation bottle.
The stone bump cutting part 51 has a support plate 52 oriented in the horizontal direction, as shown in FIG. A hopper-like harvest mushroom receiver 53 penetrating vertically is fixed to the support plate 52. A cutter 54 that moves in the horizontal direction is installed below the harvest mushroom receiver 53.
In the stone bump cutting unit 51, the harvested mushroom 60 conveyed by the mushroom conveyance gripping device 55 is moved into the harvest mushroom receiver 53 and released, so that the harvest mushroom 60 protrudes the stone projection 60 a below the harvest mushroom receiver 53. Held in. Next, the mushroom grasping device 56 for cutting the stone mound is lowered, the mushroom top surface presser 57 presses the mushroom top surface 60b in the harvest mushroom receiver 53, and in this state, the cutter 54 is moved to cut the stone mush 60a. .

  By the way, the lower part of a mushroom, such as a garlic mushroom, is a part corresponding to an umbrella in a common mushroom that bulges to cover the side of the handle by gathering together many petal-like or spatula-like pieces. Even though the stem portion is not suitable for edible use such as cooking, the component is the same as the portion corresponding to the umbrella, so it is desired to effectively utilize it as a raw material for health food.

  However, as mentioned above, artificially cultivated mushrooms are planted with fungus in sawdust, the root of the stem enters into the sawdust, and takes up the sawdust in a complex form, so sawdust from the root of the stem It is not easy to remove.

  The present invention has been made in view of the above-described conventional problems, removes culture soil such as sawdust incorporated in the stem root part of artificially cultivated mushrooms such as agaric bamboo, and uses the stem root part as a raw material for health foods, etc. It is an object of the present invention to provide an apparatus and method for removing cultured soil adhering to the root of an edible mushroom that can be effectively used.

  In order to achieve the above object, the apparatus for removing cultured soil attached to the shoot root of edible mushrooms according to the present invention includes a slicing apparatus for slicing the shoot root of the edible mushroom, and the stalk root sliced by the slicing apparatus. Irradiating a laser beam for incinerating only the culture soil adhering to the chip, which is disposed above the conveyance path of the chip at the root portion conveyed by the conveyance device, and a conveyance device that conveys the chip in a predetermined direction. And a laser beam irradiating unit disposed above a conveyance path downstream of the laser beam irradiation apparatus, which is a conveyance path of the tip of the pedicle portion conveyed by the conveyor device. And a high water pressure shower device for washing away and removing the incinerated ash of the incinerated culture soil.

  Moreover, in the removal apparatus of the culture soil adhering to the shoot root part of the edible mushroom of the present invention, the transfer speed of the transfer apparatus is set on the transfer apparatus corresponding to the speed of slicing the shoot root part by the slicing device. It is preferable that the sliced stalk tip can be adjusted so as to fall without overlapping.

  Further, the method for removing the culture soil attached to the shoot root of the edible mushroom according to the present invention includes slicing the shoot root of the edible mushroom, and irradiating the chip of the shoot root sliced by the slicing step with laser light. A culture soil incineration step of incinerating only the culture soil adhering to the chip, and a burning residue removal step of washing away the incineration ash of the culture soil incinerated by the culture soil incineration step with a high water pressure shower. It is a feature.

  Moreover, in the removal method of the culture soil adhering to the shoot root part of the edible mushroom of the present invention, the culture soil incineration step, the burned dregs and the chips of the shoot root portion sliced in the slicing step are conveyed in a predetermined direction. It is preferable to perform the removal step in order.

  Moreover, in the removal method of the culture soil adhering to the shoot root part of the edible mushroom of the present invention, when the chip of the shoot root part sliced in the slicing step is conveyed in a predetermined direction, the chip of the shoot root part does not overlap. It is preferable to arrange on the conveyance path.

  According to the present invention, the edible mushroom stalk root part can be effectively used as a raw material for health foods, etc., by removing culture soil such as sawdust incorporated in the shoot root part of artificially cultivated mushrooms such as agaric bamboo An apparatus and method for removing the culture soil adhering to the soil is obtained.

It is a perspective view which shows notionally the schematic structure of the removal apparatus of the culture soil adhering to the stem root part of the edible mushroom concerning one Embodiment of this invention. It is explanatory drawing which shows notionally an example of the shape of the stem root part of the red-breasted bamboo used as a slice object with the slicing apparatus in the apparatus of FIG. 1, (a) is a side view, (b) is a top view. It is explanatory drawing which shows the whole structure of the automatic harvesting apparatus of the mushroom described in patent document 1. It is a longitudinal cross-sectional view which shows the stone bump cutting | disconnection state by the apparatus of FIG.

Prior to the description of the embodiments, the effects of the present invention will be described.
The apparatus for removing cultured soil attached to the shoot root of the edible mushroom of the present invention includes a slicing device for slicing the pedicle root of the edible mushroom, and a transport device for transporting the chips of the shoot root sliced by the slicing device in a predetermined direction. And a laser beam irradiation device for irradiating only the culture soil adhering to the chip, which is disposed above the conveyance path of the chip at the root portion conveyed by the conveyance device, and the conveyance Incineration ash of the culture soil incinerated by the laser light irradiation means disposed above the conveyance path downstream of the laser light irradiation device, which is a conveyance path of the shoot root chip conveyed by the device And a high water pressure shower device for washing and removing the water.

  If a slicing device for slicing the edible mushroom stalk root is provided, such as the removal device for the cultivated soil adhering to the edible mushroom stalk root of the present invention, the cultivated soil enters the cultured soil in a complicated manner. Even if it is the shoot root part which took in, the culture soil adhering to the shoot root part can be exposed to the surface by slicing and chipping.

  Moreover, if a laser beam irradiation device for irradiating only the culture soil adhering to the chip is irradiated, it is possible to incinerate only the culture soil without damaging Hanabiratake chips. As the laser beam irradiation device, for example, a high energy type ruby laser irradiation device used for hair removal or the like is preferably used. The ruby laser light reacts to black or a pigment having a color close to black. For this reason, in the object irradiated with the laser beam, only the pigment portion of black or a color close to black absorbs the energy of the laser beam, and is heated and incinerated. The culture soil is black or close to black, while the white fly is milky white, so when ruby laser light is irradiated to the root of the fly, the portion of the fly is kept intact and the Only the attached soil is incinerated.

  Moreover, if the shower apparatus of the said high water pressure is provided, the incineration ash of the culture soil incinerated by the laser beam irradiation apparatus can be washed away and easily removed.

  In addition, the apparatus includes a conveyance device that conveys the tip of the root portion sliced by the slicing device in a predetermined direction, and the tip of the root portion that is conveyed by the conveyance device through the laser light irradiation device and the high water pressure shower device. If it arrange | positions in order above the conveyance path of this, the process from the stalk root slice to the removal of the culture soil can be continued, and the removal process of the culture soil adhering to the shoot root can be efficiently performed in large quantities. .

  Further, in the apparatus for removing cultured soil attached to the shoot root of the edible mushroom of the present invention, the transfer speed of the transfer device is set on the transfer device in correspondence with the speed of slicing the shoot root by the slicing device. If the sliced tip of the pedicle root can be adjusted so that it will fall without overlapping, the portion that is not irradiated with the laser beam by the laser beam irradiation device can be eliminated, and the culture soil is reliably removed from the pedicle root portion. it can.

  In addition, the method of removing the culture soil attached to the shoot root of the edible mushroom of the present invention includes slicing the shoot root of the edible mushroom, and irradiating the tip of the shoot root sliced by the slicing step with laser light. A culture soil incineration step of incinerating only the culture soil adhering to the chip, and a burning residue removal step of washing away the incineration ash of the culture soil incinerated in the culture soil incineration step with a high water pressure shower.

  If the slicing step of slicing the edible mushroom stalk root is provided as in the method for removing the cultivated soil adhering to the shoot root of the edible mushroom of the present invention, the cultivated soil enters into the cultured soil in a complicated manner and has a complicated form. Even if it is the shoot root part which took in, the adhesion part of culture soil can be exposed to the surface by slicing and chipping.

  In addition, if a culture soil incineration step is performed that irradiates only the culture soil attached to the chip by irradiating the tip of the stem root sliced by the slicing step with laser light, the culture soil is not damaged. Can only be incinerated.

  In addition, if there is a burning residue removal step of washing away the incineration ash of the culture soil incinerated by the culture soil incineration step with a high water pressure shower, the incineration ash of the culture soil incinerated by the culture soil incineration step can be easily obtained. Can be removed.

  Further, in the method for removing cultured soil adhering to the shoot root part of the edible mushroom of the present invention, the culture soil incineration step, the burning residue removal, while transporting the chips of the pedicle root portion sliced in the slicing step in a predetermined direction If the steps are performed sequentially, the steps from the stalk root slice to the removal of the culture soil can be continued, and the removal treatment of the culture soil adhering to the stem root portion can be carried out efficiently and in large quantities.

  Further, in the method for removing cultured soil adhering to the shoot root part of the edible mushroom of the present invention, when the tip of the pedicle part sliced in the slicing step is transported in a predetermined direction, the tip of the shoot root part does not overlap. If it arrange | positions on a conveyance path, the site | part which is not irradiated with the laser beam by the said laser beam irradiation apparatus can be eliminated, and culture soil can be removed reliably from a stem root part.

Hereinafter, based on the illustrated embodiment, the present invention will be described in detail.
FIG. 1 is a perspective view conceptually showing the overall configuration of a device for removing cultured soil attached to the root of an edible mushroom according to an embodiment of the present invention. 2A and 2B are explanatory views conceptually showing an example of the shape of the root part of the garlic bamboo to be sliced by the slicing apparatus in the apparatus of FIG. 1, wherein FIG. 2A is a side view and FIG. 2B is a top view.

  As shown in FIG. 1, the culture soil removing device 10 attached to the edible mushroom stalk root portion of the present embodiment includes a slicing device 11, a transport device 12, a laser light irradiation device 13, and a shower device 14. In addition, 15 is the collection container of the stem root part after removing culture soil, 16 is a control apparatus, 20 is a stem root part of mushrooms, such as a bamboo shoot.

The slicing device 11 has a hopper-shaped container 11a and a cutter 11b that rotates and moves along the exit surface of the container 11a to slice the root part of the bamboo leaf that comes out of the container 11a into a thickness of about 1 mm. is doing. In the example of FIG. 1, the cutter 11 b includes a cutter unit 11 b ₁ , a rotating shaft 11 b ₂ for rotating the cutter unit 11 b _1, and a motor 11 b ₃ for rotating the rotating shaft 11 b ₂ .

  The conveying device 12 is composed of a movable conveyor provided below the slicing device 11, and the chip 20 a of the stalk root portion 20 sliced by the slicing device 11 is driven by a conveyor driving means such as a stepping motor (not shown). It is conveyed at a predetermined speed in a predetermined direction.

The laser beam irradiation device 13 includes a plurality of ruby laser beam irradiation devices 13a ₁ to 13 _n arranged in parallel above the conveyance path of the chip 20a of the root portion 20 conveyed by the conveyance device 12 ( _{n in} the example of FIG. 1 for convenience). = 10, but is not limited to n = 10). The ruby laser beam reacts with black or a color close to black at a wavelength of 694 nm, acts to absorb light energy only at that portion, and performs high heating, and the chip 20a remains as it is and the culture soil attached to the chip 20a. Only the (a plurality of dotted portions shown as attached to the chip 20a in FIG. 1) are incinerated.

  The shower device 14 is a conveyance path of the tip 20a of the pedicle portion 20 conveyed by the conveyance apparatus 12, and is above the conveyance path on the downstream side (that is, the position farther from the slicing apparatus 11) than the laser beam irradiation apparatus 13. The incinerated ash of the culture soil incinerated by the laser light irradiation device 13 is washed away and removed by applying a high water pressure shower to the chip 20a.

  The collection container 15 is arranged at the most downstream (that is, a position farther from the slicing device 11) in the conveyance path of the chip 20a of the pedicle portion 20 conveyed by the conveyance device 12 and below the conveyance device 12. In the state where the incineration ash is removed by the shower device 14, the tip 20a of the stem root 20 falling from the conveying device 12 is accommodated.

  The control device 16 is constituted by a computer such as a microcomputer, and is connected to a motor 11c in the slicing device 11 and a conveyor driving means (not shown) in the conveying device 12, and the speed at which the slicing device 11 slices the root portion 20 On the other hand, the conveying speed of the conveying device 12 is configured to be adjusted on the conveying device 12 so that the chips 20a of the stalk root portions 20 are not overlapped.

The removal process of the culture soil adhering to the stalk root part of the edible mushroom using the culture soil removal apparatus 10 of this embodiment comprised in this way is demonstrated.
The removal of the culture soil is performed in the order of a slicing step, a culture soil incineration step, and a burned residue removal step.
The slicing step, placed inside a block of Kukine portion 20 of Sparassis crispa from the inlet of the hopper-shaped container 11a, the Kukine portion 20 of Sparassis crispa leaving the outlet of the container 11a by rotating the cutter portion 11b ₁ of the cutter 11b For example, it is sliced into chips having a thickness of about 1 mm.

  The sliced tip 20 a of the stalk root portion 20 sequentially falls on the upstream conveyance path of the conveyance device 12. At this time, the conveying speed of the conveying device 12 is such that the chip 20a of the sliced pedicle portion 20 does not overlap on the conveying device 12 with respect to the speed at which the slicing device 11 slices the pedicle portion 20 by the control device 16. The speed is adjusted to fall. For this reason, the chip | tip 20a of the shoot root part 20 is conveyed toward the downward direction of the laser beam irradiation apparatus 13a in the state arranged on the conveyance apparatus 12 without overlapping each other.

In the culture soil incineration process, the laser beam irradiation device 13 (a plurality of ruby laser beam irradiation devices 13a ₁ to _n ) is applied to the tip 20a of the pedicle root portion 20 that has been sliced by the slicing step and dropped onto the conveyance path of the conveyance device 12. The culture soil adhering to the chip 20a is incinerated by irradiating with laser light. The laser light absorbs energy from the black sawdust adhering to the chip 20a of the sliced pedicle root portion 20 to increase the heat and burn it. At this time, the flower is a milky white color, so that it does not absorb the laser beam and is maintained as it is without being damaged by heat.

  In the burn residue removal process, the shower device 14 applies a high water pressure shower to the chip 20a to wash away and remove the incineration ash of the incinerated culture soil. The incineration ash of the culture soil incinerated by the laser light irradiation device 13 in the culture soil incineration step is washed away with a high water pressure shower.

  The chip 20a from which the incineration ash has been removed by the burning residue removal process reaches the most downstream side in the transport device 12, falls downward from the transport device 12, and is collected in the collection container 15. The chip 20a collected in the collection container 15 can be used as a raw material such as health food.

  According to the apparatus 10 for removing the cultured soil adhering to the edible mushroom stalk root portion of the present embodiment, since the slicing device 11 for slicing the edible mushroom stalk root part 20 is provided, the cultivated soil enters the cultured soil in a complicated manner. As shown in FIG. 2 (b), even the pedicle root portion 20 that has taken up the cultured soil in a complicated form is sliced into chips 20a, so that the attached portion of the cultured soil (chips in FIG. 2). A plurality of dotted portions shown as attached to 20a) can be exposed on the surface.

  In addition, since the laser light irradiation device 13 for irradiating the laser light for incinerating the culture soil adhering to the chip 20 is provided, only the culture soil can be incinerated without damaging the chip 20 of the bamboo leaf.

  Moreover, since the high water pressure shower device 14 is provided, the incineration ash of the culture soil incinerated by the laser beam irradiation device 13 can be washed away and easily removed.

  Further, a stalk root portion 20 is provided that includes a transport device 12 that transports the chip 20 a of the stalk root portion 20 sliced by the slicing device 11 in a predetermined direction, and the laser light irradiation device 13 and the high water pressure shower device 14 are transported by the transport device 12. Since the chips 20a are sequentially arranged above the conveying path of the chip 20a, the process from the slicing of the stem root 20 to the removal of the culture soil can be continued, and the removal of the culture soil adhering to the stem root 20 can be efficiently performed in large quantities. Can be done.

  Moreover, according to the removal apparatus 10 of the culture soil adhering to the shoot root part of the edible mushroom of this embodiment, according to the speed | rate which slices the shoot root part 20 by the slicing apparatus 11, the conveyance speed of the conveyance apparatus 12 is set to the conveyance apparatus. 12, the chip 20 a of the sliced root portion 20 can be adjusted so as to fall without overlapping, so that a portion that is not irradiated with laser light by the laser light irradiation device 13 can be eliminated. The culture soil can be surely removed.

  In addition, according to the method for removing cultured soil adhering to the edible mushroom stalk root part of the present embodiment, since the slicing step for slicing the edible mushroom stalk root part 20 is provided, it enters the cultured soil in a complicated manner, Even if it is the stalk root part 20 which took culture soil with the complicated form, the adhesion part of culture soil can be exposed to the surface by slicing and making into chip | tip 20a.

  Moreover, according to the removal method of the culture soil adhering to the stem root part of the edible mushroom of this embodiment, only the culture soil adhering to the chip | tip 20a by irradiating the chip | tip 20a of the stem root part 20 sliced by the slicing process with a laser beam. Since the culture soil incineration step of incineration is provided, it is possible to incinerate only the culture soil without damaging the tips of Hanabira bamboo.

  In addition, according to the method for removing cultured soil adhering to the stem root portion of the edible mushroom according to the present embodiment, it is provided with a burning residue removing step of washing away the incinerated ash of the cultured soil incinerated by the cultured soil incineration step with a high water pressure shower. Therefore, the incineration ash of the culture soil incinerated by the culture soil incineration step can be easily removed.

  Moreover, according to the removal method of the culture soil adhering to the stem root part of the edible mushroom of this embodiment, while conveying the chip | tip 20a of the stem root part 20 sliced at the slicing process to a predetermined direction, a culture soil incineration process, burning residue Since the removal process is performed in order, the process from the slicing of the pedicle root portion 20 to the removal of the cultured soil can be continued, and the removal treatment of the cultured soil attached to the pedicle root portion can be performed efficiently and in large quantities. .

  Moreover, according to the removal method of the culture soil adhering to the stem root part of the edible mushroom of this embodiment, when conveying the chip | tip 20a of the stem root part 20 sliced at the slicing process in a predetermined direction, the chip | tip 20a of the root part 20 Since they are arranged on the conveyance path so that they do not overlap, the portion not irradiated with the laser beam by the laser beam irradiation device 13 can be eliminated, and the culture soil can be reliably removed from the stem 20.

As mentioned above, although the embodiment of the removal device and the method of the culture soil adhering to the shoot root part of the edible mushroom of the present invention was described, the removal device and the method of the culture soil attached to the shoot root of the edible mushroom of the present invention, It is not limited to the configuration of the embodiment described above.
For example, the cutter 11b constituting the slicing device 11 may not be a rotary type, and may be configured to reciprocate horizontally. Further, for example, the mobile conveyor constituting the transport device 12 may not be a belt conveyor but may be a roller conveyor. In addition, for example, the laser beam irradiation device 13 may react with black or a color pigment close to black and irradiates only that portion with a laser beam that acts to absorb light energy and perform high heating. The apparatus is not limited to the 694 nm ruby laser beam irradiation apparatus.

  The apparatus and method for removing cultured soil attached to the root of the edible mushroom of the present invention are artificially cultivated using a container for cultivation such as Hanabiratake, etc., and enter the cultured soil in the container for cultivation. In addition to using the shoot root part that has taken up the culture soil in the above as a raw material of food, it is useful in fields where it is required to use the shoot roots of plants in the cultivated culture soil.

DESCRIPTION OF SYMBOLS 10 Removal device of culture soil adhering to shoot root part of edible mushroom 11 Slicing device 11a Container 11b Cutter 11b ₁ Cutter part 11b ₂ Rotating shaft 11b ₃ Motor 12 Conveying device 13 Laser light irradiation device 13a ₁ to _n Ruby laser light irradiation device 14 Shower device 15 Recovery container 16 Control device 20 Stem root portion 20a Chip at root portion 50 Automatic mushroom harvesting device 51 Stone bump cutting portion 52 Support plate 53 Harvested mushroom receiver 54 Cutter 55 Mushroom transport grip device 56 Mushroom grip device 57 for mushroom cutting Top presser 60 Harvested mushroom 60a Stone protrusion

Claims (5)

A slicing device for slicing the roots of edible mushrooms;
A transport device for transporting the tip of the root portion sliced by the slicing device in a predetermined direction;
A laser beam irradiation device for irradiating only the culture soil attached to the chip, disposed above the conveyance path of the chip of the root portion conveyed by the conveyance device; and
The culture soil that has been incinerated by the laser light irradiation means, disposed above the conveyance path downstream of the laser light irradiation device, which is the conveyance path of the pedicle root chips conveyed by the conveyance device. A high water pressure shower to wash away and remove incineration ash;
A device for removing cultured soil adhering to the root of an edible mushroom, characterized by comprising:   Corresponding to the speed of slicing the stalk root by the slicing device, the transport speed of the transport device can be adjusted so that the sliced chips of the stalk root do not overlap on the transport device The apparatus for removing cultured soil adhering to the shoot root of edible mushrooms according to claim 1. A slicing step of slicing the edible mushroom stem root;
A culture soil incineration step of incinerating only the culture soil attached to the chip by irradiating the tip of the root part sliced by the slicing step with a laser beam;
A burning residue removal step of washing away the incineration ash of the culture soil incinerated in the culture soil incineration step with a high water pressure shower;
A method for removing cultured soil adhering to the stem root of an edible mushroom, comprising:   The stem of the edible mushroom according to claim 3, wherein the culture soil incineration step and the burned residue removal step are sequentially performed while conveying the chips of the stem root sliced in the slicing step in a predetermined direction. To remove the culture soil adhering to the soil.   5. The edible mushroom according to claim 4, wherein when the chips at the root portion sliced in the slicing step are transported in a predetermined direction, the chips at the root portion are arranged on the transport path so as not to overlap each other. A method for removing culture soil adhering to the root of the stem.

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