JP4943399B2 - Polyarylene sulfide resin composition - Google Patents
Polyarylene sulfide resin composition Download PDFInfo
- Publication number
- JP4943399B2 JP4943399B2 JP2008242053A JP2008242053A JP4943399B2 JP 4943399 B2 JP4943399 B2 JP 4943399B2 JP 2008242053 A JP2008242053 A JP 2008242053A JP 2008242053 A JP2008242053 A JP 2008242053A JP 4943399 B2 JP4943399 B2 JP 4943399B2
- Authority
- JP
- Japan
- Prior art keywords
- polyarylene sulfide
- sulfide resin
- resin composition
- weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011342 resin composition Substances 0.000 title claims description 27
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 title claims description 18
- 229920000412 polyarylene Polymers 0.000 title claims description 18
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 239000000460 chlorine Substances 0.000 claims description 14
- -1 alkali metal hydrosulfides Chemical class 0.000 claims description 13
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 12
- 239000000155 melt Substances 0.000 claims description 12
- 229910052717 sulfur Inorganic materials 0.000 claims description 12
- 239000011593 sulfur Substances 0.000 claims description 12
- 239000011256 inorganic filler Substances 0.000 claims description 11
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 11
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 10
- 229910052801 chlorine Inorganic materials 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 10
- 150000002484 inorganic compounds Chemical class 0.000 claims description 9
- 229910010272 inorganic material Inorganic materials 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- 229910052783 alkali metal Inorganic materials 0.000 claims description 5
- 229910052977 alkali metal sulfide Inorganic materials 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 238000004898 kneading Methods 0.000 claims description 4
- HYHCSLBZRBJJCH-UHFFFAOYSA-M sodium hydrosulfide Chemical compound [Na+].[SH-] HYHCSLBZRBJJCH-UHFFFAOYSA-M 0.000 claims description 4
- GLNWILHOFOBOFD-UHFFFAOYSA-N lithium sulfide Chemical group [Li+].[Li+].[S-2] GLNWILHOFOBOFD-UHFFFAOYSA-N 0.000 claims description 3
- HXQGSILMFTUKHI-UHFFFAOYSA-M lithium;sulfanide Chemical group S[Li] HXQGSILMFTUKHI-UHFFFAOYSA-M 0.000 claims description 3
- 229910052979 sodium sulfide Inorganic materials 0.000 claims description 3
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 229920001971 elastomer Polymers 0.000 description 10
- 239000000806 elastomer Substances 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 239000004734 Polyphenylene sulfide Substances 0.000 description 7
- 125000000732 arylene group Chemical group 0.000 description 7
- 239000004927 clay Substances 0.000 description 7
- 239000000835 fiber Substances 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229920000069 polyphenylene sulfide Polymers 0.000 description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- 229920013633 Fortron Polymers 0.000 description 4
- 239000004738 Fortron® Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000003484 crystal nucleating agent Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 229920002725 thermoplastic elastomer Polymers 0.000 description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 3
- XWUCFAJNVTZRLE-UHFFFAOYSA-N 7-thiabicyclo[2.2.1]hepta-1,3,5-triene Chemical group C1=C(S2)C=CC2=C1 XWUCFAJNVTZRLE-UHFFFAOYSA-N 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 2
- 239000002667 nucleating agent Substances 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000012643 polycondensation polymerization Methods 0.000 description 2
- 239000008262 pumice Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229940079101 sodium sulfide Drugs 0.000 description 2
- ZGHLCBJZQLNUAZ-UHFFFAOYSA-N sodium sulfide nonahydrate Chemical compound O.O.O.O.O.O.O.O.O.[Na+].[Na+].[S-2] ZGHLCBJZQLNUAZ-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 125000000101 thioether group Chemical group 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- 125000002030 1,2-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([*:2])C([H])=C1[H] 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- HNSDLXPSAYFUHK-UHFFFAOYSA-N 1,4-bis(2-ethylhexyl) sulfosuccinate Chemical compound CCCCC(CC)COC(=O)CC(S(O)(=O)=O)C(=O)OCC(CC)CCCC HNSDLXPSAYFUHK-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- SOHCOYTZIXDCCO-UHFFFAOYSA-N 6-thiabicyclo[3.1.1]hepta-1(7),2,4-triene Chemical group C=1C2=CC=CC=1S2 SOHCOYTZIXDCCO-UHFFFAOYSA-N 0.000 description 1
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical group C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- 229910004762 CaSiO Inorganic materials 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 1
- COOGPNLGKIHLSK-UHFFFAOYSA-N aluminium sulfide Chemical compound [Al+3].[Al+3].[S-2].[S-2].[S-2] COOGPNLGKIHLSK-UHFFFAOYSA-N 0.000 description 1
- RHZUVFJBSILHOK-UHFFFAOYSA-N anthracen-1-ylmethanolate Chemical compound C1=CC=C2C=C3C(C[O-])=CC=CC3=CC2=C1 RHZUVFJBSILHOK-UHFFFAOYSA-N 0.000 description 1
- 239000003830 anthracite Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000004301 calcium benzoate Substances 0.000 description 1
- 235000010237 calcium benzoate Nutrition 0.000 description 1
- QXDMQSPYEZFLGF-UHFFFAOYSA-L calcium oxalate Chemical compound [Ca+2].[O-]C(=O)C([O-])=O QXDMQSPYEZFLGF-UHFFFAOYSA-L 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- JGIATAMCQXIDNZ-UHFFFAOYSA-N calcium sulfide Chemical compound [Ca]=S JGIATAMCQXIDNZ-UHFFFAOYSA-N 0.000 description 1
- GBAOBIBJACZTNA-UHFFFAOYSA-L calcium sulfite Chemical compound [Ca+2].[O-]S([O-])=O GBAOBIBJACZTNA-UHFFFAOYSA-L 0.000 description 1
- 235000010261 calcium sulphite Nutrition 0.000 description 1
- GUPPESBEIQALOS-UHFFFAOYSA-L calcium tartrate Chemical compound [Ca+2].[O-]C(=O)C(O)C(O)C([O-])=O GUPPESBEIQALOS-UHFFFAOYSA-L 0.000 description 1
- 239000001427 calcium tartrate Substances 0.000 description 1
- 235000011035 calcium tartrate Nutrition 0.000 description 1
- HZQXCUSDXIKLGS-UHFFFAOYSA-L calcium;dibenzoate;trihydrate Chemical compound O.O.O.[Ca+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 HZQXCUSDXIKLGS-UHFFFAOYSA-L 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- PYSZASIZWHHPHJ-UHFFFAOYSA-L calcium;phthalate Chemical compound [Ca+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O PYSZASIZWHHPHJ-UHFFFAOYSA-L 0.000 description 1
- YAECNLICDQSIKA-UHFFFAOYSA-L calcium;sulfanide Chemical compound [SH-].[SH-].[Ca+2] YAECNLICDQSIKA-UHFFFAOYSA-L 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910001610 cryolite Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000010881 fly ash Substances 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000001475 halogen functional group Chemical group 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004255 ion exchange chromatography Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- OJXAKZMMWGESHM-UHFFFAOYSA-L magnesium sulfanide Chemical compound [Mg++].[SH-].[SH-] OJXAKZMMWGESHM-UHFFFAOYSA-L 0.000 description 1
- QENHCSSJTJWZAL-UHFFFAOYSA-N magnesium sulfide Chemical compound [Mg+2].[S-2] QENHCSSJTJWZAL-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VASIZKWUTCETSD-UHFFFAOYSA-N manganese(II) oxide Inorganic materials [Mn]=O VASIZKWUTCETSD-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000010434 nepheline Substances 0.000 description 1
- 229910052664 nepheline Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- ZOCLAPYLSUCOGI-UHFFFAOYSA-M potassium hydrosulfide Chemical compound [SH-].[K+] ZOCLAPYLSUCOGI-UHFFFAOYSA-M 0.000 description 1
- DPLVEEXVKBWGHE-UHFFFAOYSA-N potassium sulfide Chemical compound [S-2].[K+].[K+] DPLVEEXVKBWGHE-UHFFFAOYSA-N 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- ZNCPFRVNHGOPAG-UHFFFAOYSA-L sodium oxalate Chemical compound [Na+].[Na+].[O-]C(=O)C([O-])=O ZNCPFRVNHGOPAG-UHFFFAOYSA-L 0.000 description 1
- 229940039790 sodium oxalate Drugs 0.000 description 1
- 229940048181 sodium sulfide nonahydrate Drugs 0.000 description 1
- WMDLZMCDBSJMTM-UHFFFAOYSA-M sodium;sulfanide;nonahydrate Chemical compound O.O.O.O.O.O.O.O.O.[Na+].[SH-] WMDLZMCDBSJMTM-UHFFFAOYSA-M 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000005650 substituted phenylene group Chemical group 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000005335 volcanic glass Substances 0.000 description 1
Description
本発明は、射出成形時における流動性に優れたポリアリーレンサルファイド樹脂組成物に関する。 The present invention relates to a polyarylene sulfide resin composition having excellent fluidity during injection molding.
ポリフェニレンサルファイド(以下PPSと略す)樹脂に代表されるポリアリーレンサルファイド(以下PASと略す)は、高い耐熱性、機械的物性、耐薬品性、寸法安定性、難燃性を有していることから、電気・電子機器部品材料、自動車機器部品材料、化学機器部品材料等に広く使用されている。 Polyarylene sulfide (hereinafter abbreviated as PAS) typified by polyphenylene sulfide (hereinafter abbreviated as PPS) resin has high heat resistance, mechanical properties, chemical resistance, dimensional stability, and flame retardancy. Widely used in electrical / electronic equipment parts materials, automotive equipment parts materials, chemical equipment parts materials, etc.
PAS樹脂は無機フィラーとの相溶性に優れるため、一般的に無機フィラーを添加した複合材料として使用されることが多い。無機フィラーを配合することにより、機械物性をはじめとする各種特性が向上する、あるいは安価な無機フィラーを適用することによりコストを低減できるといった利点がある一方、樹脂組成物の溶融粘度が増大するため、流動性が低下し、薄肉成形品を成形するのが困難になるといった問題点を抱えている。 Since PAS resin is excellent in compatibility with an inorganic filler, it is generally used as a composite material to which an inorganic filler is added. By blending the inorganic filler, various properties including mechanical properties are improved, or there is an advantage that the cost can be reduced by applying an inexpensive inorganic filler, while the melt viscosity of the resin composition increases. However, there is a problem that fluidity is lowered and it becomes difficult to form a thin molded product.
PAS樹脂組成物の流動性を向上させる手法としては、例えば、重合系に分子量調整剤を使用する方法が提案されている(特許文献1)。しかしながら、PAS樹脂の製造安定性、収率、品質を考慮した上で重合条件をより精密にコントロールしなければならず、実際に実施するのは困難を要する。 As a technique for improving the fluidity of the PAS resin composition, for example, a method of using a molecular weight modifier in a polymerization system has been proposed (Patent Document 1). However, the polymerization conditions must be controlled more precisely in consideration of the production stability, yield, and quality of the PAS resin, and it is difficult to actually carry out.
生産性と品質が良好である任意のPAS樹脂を原料とし、添加剤及びコンパウンディング技術の工夫によりPAS樹脂組成物の溶融粘度を容易にコントロールすることができれば、流動性の高いPAS樹脂組成物を自由に設計し、安定的に生産することができる。
以上のように、高流動化する手法及びそれから得られるPAS樹脂組成物が市場からは望まれるが、これらの要求をすべて満足するPAS樹脂組成物はこれまで知られていない。 As described above, a high fluidization method and a PAS resin composition obtained therefrom are desired from the market, but no PAS resin composition satisfying all these requirements has been known so far.
本発明者らは上記課題を解決すべく鋭意検討した結果、特定のPAS樹脂に、硫黄系無機化合物を配合し溶融混練することにより、高流動なPAS樹脂組成物が得られることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that a high-fluidity PAS resin composition can be obtained by mixing and kneading a sulfur-based inorganic compound with a specific PAS resin. The invention has been completed.
即ち本発明は、
(A)実質的に直鎖状構造のポリアリーレンサルファイド樹脂100重量部
(B)硫黄系無機化合物0.05〜2重量部(但し、水溶液、水和物を使用する場合は水含有量分を除く)
を配合し溶融混練して得られる、溶融粘度が80〜350Pa・s(温度310℃、剪断速度1200/秒)であるポリアリーレンサルファイド樹脂組成物である。
That is, the present invention
(A) 100 parts by weight of a polyarylene sulfide resin having a substantially linear structure
(B) 0.05-2 parts by weight of a sulfur-based inorganic compound (however, when an aqueous solution or hydrate is used, the water content is excluded)
Is a polyarylene sulfide resin composition having a melt viscosity of 80 to 350 Pa · s (temperature: 310 ° C., shear rate: 1200 / sec) obtained by blending and melt kneading.
(A)PAS樹脂とは、繰返し単位として-(Ar-S)-(但しArはアリーレン基)で主として構成されたものである。アリーレン基としては、例えば、p−フェニレン基、m−フェニレン基、o−フェニレン基、置換フェニレン基、p,p’−ジフェニレンスルフォン基、p,p’−ビフェニレン基、p,p’−ジフェニレンエーテル基、p,p’−ジフェニレンカルボニル基、ナフタレン基などが使用できる。 The (A) PAS resin is mainly composed of — (Ar—S) — (wherein Ar is an arylene group) as a repeating unit. Examples of the arylene group include p-phenylene group, m-phenylene group, o-phenylene group, substituted phenylene group, p, p′-diphenylene sulfone group, p, p′-biphenylene group, and p, p′-di. A phenylene ether group, p, p′-diphenylenecarbonyl group, naphthalene group, and the like can be used.
この場合、前記のアリーレン基から構成されるアリーレンサルファイド基の中で同一の繰返し単位を用いたポリマー、即ちホモポリマーの他に、組成物の加工性という点から、異種繰返し単位を含んだコポリマーが好ましい場合もある。 In this case, in addition to the polymer using the same repeating unit in the arylene sulfide group composed of the arylene group, that is, a homopolymer, a copolymer containing a different repeating unit is used from the viewpoint of processability of the composition. It may be preferable.
ホモポリマーとしては、アリーレン基としてp−フェニレン基を用いた、p−フェニレンサルファイド基を繰返し単位とするポリフェニレンサルファイドが好ましく用いられる。また、コポリマーとしては、前記のアリーレン基からなるアリーレンサルファイド基の中で、相異なる2種以上の組み合わせが使用できるが、中でもp−フェニレンサルファイド基とm−フェニレンサルファイド基を含む組み合わせが特に好ましく用いられる。この中で、p−フェニレンサルファイド基を70モル%以上、好ましくは80モル%以上含むものが、耐熱性、成形性、機械的特性等の物性上の点から適当である。 As the homopolymer, polyphenylene sulfide using p-phenylene group as an arylene group and having p-phenylene sulfide group as a repeating unit is preferably used. As the copolymer, among the arylene sulfide groups comprising the above-mentioned arylene groups, two or more different combinations can be used, and among them, a combination containing a p-phenylene sulfide group and an m-phenylene sulfide group is particularly preferably used. It is done. Among these, those containing 70 mol% or more, preferably 80 mol% or more of p-phenylene sulfide groups are suitable from the viewpoint of physical properties such as heat resistance, moldability and mechanical properties.
又、本発明に用いるPAS樹脂は、2官能性ハロゲン芳香族化合物を主体とするモノマーから縮重合によって得られる実質的に直鎖状構造の高分子量ポリマーであるが、直鎖状構造のPAS樹脂以外にも、縮重合させるときに3個以上のハロゲン官能基を有するポリハロ芳香族化合物等のモノマーを少量用いて、部分的に分岐構造又は架橋構造を形成させたポリマーも使用できる。 The PAS resin used in the present invention is a high molecular weight polymer having a substantially linear structure obtained by condensation polymerization from a monomer mainly composed of a bifunctional halogen aromatic compound. In addition, a polymer in which a branched structure or a crosslinked structure is partially formed by using a small amount of a monomer such as a polyhaloaromatic compound having three or more halogen functional groups at the time of condensation polymerization can also be used.
また、本発明に用いるPAS樹脂は、重合後、酸洗浄、熱水洗浄、有機溶剤洗浄(或いはこれらの組合せ)等を行って副生不純物等を除去精製したものが好ましい。 In addition, the PAS resin used in the present invention is preferably a PAS resin that has been subjected to acid cleaning, hot water cleaning, organic solvent cleaning (or a combination thereof) and the like to remove by-product impurities and the like after polymerization.
(A)PAS樹脂の溶融粘度は5〜400Pa・s、特に50〜250Pa・sであることが好ましい。溶融粘度が過少であると、機械的強度が有効なPAS樹脂を得るのが非常に困難となり、溶融粘度が過大であると、溶融粘度が80〜350Pa・sのPAS樹脂組成物を得ることが困難となるため好ましくない。 (A) The melt viscosity of the PAS resin is preferably 5 to 400 Pa · s, particularly 50 to 250 Pa · s. If the melt viscosity is too low, it becomes very difficult to obtain a PAS resin having an effective mechanical strength. If the melt viscosity is too high, a PAS resin composition having a melt viscosity of 80 to 350 Pa · s can be obtained. Since it becomes difficult, it is not preferable.
また、(A)PAS樹脂としては、射出成形時のバリの発生を低減するために添加されるアルコキシシランと反応させるため、重合後の後処理工程で酸処理したレジンを使用し、その時のレジンpHは4〜7であることが好ましい。レジンpHが過大であるとアルコキシシランとの反応が不十分なため、バリを抑制能力が十分でなくなる。また、レジンpHが過少であってもアルコキシシランとの反応が不安定になるため適さない。 In addition, as the (A) PAS resin, a resin that has been acid-treated in a post-treatment step after polymerization is used to react with an alkoxysilane that is added to reduce the occurrence of burrs during injection molding. The pH is preferably 4-7. If the resin pH is excessive, the reaction with the alkoxysilane is insufficient, so that the ability to suppress burrs becomes insufficient. Further, even if the resin pH is too small, the reaction with alkoxysilane becomes unstable, which is not suitable.
また、PAS樹脂中の塩素量は特に限定されないが、塩素量950ppm以下のPAS樹脂組成物を得るためには、1000〜2000ppmであることが好ましい。塩素量が1000〜2000ppmであればPAS樹脂の製造法は特に限定されない。 The amount of chlorine in the PAS resin is not particularly limited, but is preferably 1000 to 2000 ppm in order to obtain a PAS resin composition having a chlorine content of 950 ppm or less. If the chlorine content is 1000 to 2000 ppm, the production method of the PAS resin is not particularly limited.
無機フィラーを充填することによりPAS樹脂組成物中の塩素量は低減するが、PAS樹脂中の塩素濃度が2000ppmを超えると目的とするPAS樹脂組成物中の塩素量950ppm以下を達成することが困難となる。また、1000ppm未満のPAS樹脂は、通常の製造法では得ることが困難である。 Filling with inorganic filler reduces the chlorine content in the PAS resin composition, but if the chlorine concentration in the PAS resin exceeds 2000 ppm, it is difficult to achieve the target chlorine content of 950 ppm or less in the PAS resin composition. It becomes. Moreover, it is difficult to obtain a PAS resin of less than 1000 ppm by a normal production method.
本発明において、(B)硫黄系無機化合物としては、硫黄、アルカリ金属硫化物及びアルカリ金属水硫化物から選ばれる1種又は2種以上の混合物が好ましい。 In the present invention, the sulfur-based inorganic compound (B) is preferably one or a mixture of two or more selected from sulfur, alkali metal sulfides and alkali metal hydrosulfides.
アルカリ金属硫化物の例としては、硫化リチウム、硫化ナトリウム、硫化カリウム、硫化マグネシウム、硫化カルシウム、硫化アルミニウム等が挙げられ、好ましくは硫化リチウム、硫化ナトリウムである。 Examples of the alkali metal sulfide include lithium sulfide, sodium sulfide, potassium sulfide, magnesium sulfide, calcium sulfide, aluminum sulfide, and the like, preferably lithium sulfide and sodium sulfide.
アルカリ金属水硫化物の例としては、水硫化リチウム、水硫化ナトリウム、水硫化カリウム、水硫化マグネシウム、水硫化カルシウム等が挙げられ、好ましくは水硫化リチウム、水硫化ナトリウムである。 Examples of the alkali metal hydrosulfide include lithium hydrosulfide, sodium hydrosulfide, potassium hydrosulfide, magnesium hydrosulfide, calcium hydrosulfide and the like, preferably lithium hydrosulfide and sodium hydrosulfide.
(B)硫黄系無機化合物の添加量は、(A)PAS樹脂100重量部に対し0.05〜2重量部、好ましくは0.1〜1.5重量部である。アルカリ金属硫化物は、通常、水和物として使用される場合が多く、また、アルカリ金属水硫化物は水溶液として使用される場合が多い。(B)硫黄系無機化合物として、このような水溶液、水和物を使用する場合は、上記添加量は水含有量分を除いたものとする。 The amount of (B) sulfur-based inorganic compound added is 0.05 to 2 parts by weight, preferably 0.1 to 1.5 parts by weight, per 100 parts by weight of (A) PAS resin. Alkali metal sulfides are usually often used as hydrates, and alkali metal hydrosulfides are often used as aqueous solutions. (B) When such an aqueous solution or hydrate is used as the sulfur-based inorganic compound, the amount added is excluding the water content.
添加量が過少であると、得られるPAS樹脂組成物の流動性が十分でなく、添加量が過大であると、溶融混練時のガス発生が多くなり好ましくない。 If the addition amount is too small, the resulting PAS resin composition has insufficient fluidity, and if the addition amount is too large, gas generation during melt-kneading increases, which is not preferable.
本発明において、(C)アルコキシシランは特に必須ではないが、射出成形時のバリ発生を低減する上で使用するのが好ましい。(C)アルコキシシランの種類は特に限定しないが、エポキシアルコシキシラン、アミノアルコキシシラン、ビニルアルコキシシラン、メルカプトアルコキシシラン等が挙げられ、これらの1種または2種以上が用いられる。尚、アルコキシ基の炭素数は1〜10、好ましくは1〜4である。 In the present invention, (C) alkoxysilane is not essential, but is preferably used for reducing the generation of burrs during injection molding. (C) Although the kind of alkoxysilane is not specifically limited, Epoxy alkoxysilane, amino alkoxysilane, vinyl alkoxysilane, mercapto alkoxysilane, etc. are mentioned, These 1 type (s) or 2 or more types are used. In addition, carbon number of an alkoxy group is 1-10, Preferably it is 1-4.
エポキシアルコキシシランの例としては、γ−グリシドキシプロピルトリメトキシシラン、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、γ−グリシドキシプロピルトリエトキシシラン等が挙げられる。 Examples of the epoxyalkoxysilane include γ-glycidoxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, and the like.
アミノアルコキシシランの例としては、γ−アミノプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、γ−アミノプロピルメチルジメトキシシラン、γ−アミノプロピルメチルジエトキシシラン、N−(β−アミノエチル)−γ−アミノプロピルトリメトキシシラン、N−フェニル−γ−アミノプロピルトリメトキシシラン、γ−ジアリルアミノプロピルトリメトキシシラン、γ−ジアリルアミノプロピルトリエトキシシラン等が挙げられる。 Examples of aminoalkoxysilane include γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, N- (β-aminoethyl)- Examples thereof include γ-aminopropyltrimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-diallylaminopropyltrimethoxysilane, and γ-diallylaminopropyltriethoxysilane.
ビニルアルコキシシランの例としては、ビニルトリメトキシシラン、ビニルトリエトキシシラン、ビニルトリス(β−メトキシエトキシ)シラン等が挙げられる。 Examples of vinylalkoxysilane include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, and the like.
メルカプトアルコキシシランの例としては、例えば、γ−メルカプトプロピルトリメトキシシラン、γ−メルカプトプロピルトリエトキシシラン等が挙げられる。 Examples of mercaptoalkoxysilanes include γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, and the like.
使用するアルコキシシランはエポキシアルコキシシランとアミノアルコシシシランが好ましく、中でも特に好ましいのはγ−アミノプロピルトリエトキシシランである。 The alkoxysilane to be used is preferably an epoxyalkoxysilane and an aminoalkoxysilane, and particularly preferably γ-aminopropyltriethoxysilane.
アルコキシシラン化合物の使用量は、(A)PAS樹脂100重量部に対して、0.1〜3重量部であり、好ましくは0.4〜2重量部である。アルコシシシラン化合物の使用量が過少であると、十分なバリ抑制効果が得られず、また、アルコシシシラン化合物の使用量が過大であると、発生ガスが多くなる等の問題が生じ、好ましくない。 The usage-amount of an alkoxysilane compound is 0.1-3 weight part with respect to 100 weight part of (A) PAS resin, Preferably it is 0.4-2 weight part. If the use amount of the alkoxysilane compound is too small, a sufficient burr suppression effect cannot be obtained, and if the use amount of the alkoxysilane compound is excessive, problems such as an increase in the amount of generated gas occur. Absent.
本発明において、(D)無機フィラーは特に必須ではないが、組成物の塩素量を950ppm以下にするため、また、十分な機械的強度を得るためには必須となる。無機フィラーとしては、特に種類を限定されず、例えば、軽質炭酸カルシウム、重質ないし微粉化炭酸カルシウム、特殊カルシウム系充填剤などの炭酸カルシウム粉末;霞石閃長石微粉末、モンモリロナイト、ベントナイト等の焼成クレー、シラン改質クレーなどのクレー(けい酸アルミニウム粉末);タルク;溶融シリカ、結晶シリカなどのシリカ(二酸化けい素)粉末;ケイ藻土、ケイ砂などのけい酸含有化合物;軽石粉、軽石バルーン、スレート粉、雲母粉などの天然鉱物の粉砕品;アルミナ、アルミナコロイド(アルミナゾル)、アルミナ・ホワイト、硫酸アルミニウムなどのアルミナ含有化合物;硫酸バリウム、リトポン、硫酸カルシウム、二硫化モリブデン、グラファイト(黒鉛)などの鉱物;ガラス繊維、ガラスビーズ、ガラスフレーク、発泡ガラスビーズなどのガラス系フィラー;フライアッシュ球、火山ガラス中空体、合成無機中空体、単結晶チタン酸カリ、カーボン繊維、カーボンナノチューブ、炭素中空球、炭素64フラーレン、無煙炭粉末、人造氷晶石(クリオライト)、酸化チタン、酸化マグネシウム、塩基性炭酸マグネシウム、ドロマイト、チタン酸カリウム、亜硫酸カルシウム、マイカ、ケイ酸カルシウム、アルミニウム粉、硫化モリブデン、ボロン繊維、炭化ケイ素繊維などが挙げられる。 In the present invention, the (D) inorganic filler is not particularly essential, but is essential for making the chlorine content of the composition 950 ppm or less and for obtaining sufficient mechanical strength. The inorganic filler is not particularly limited, and for example, calcium carbonate powder such as light calcium carbonate, heavy or finely divided calcium carbonate, special calcium-based filler; calcination of nepheline feldspar fine powder, montmorillonite, bentonite, etc. Clay (aluminum silicate powder) such as clay and silane modified clay; Talc; Silica (silicon dioxide) powder such as fused silica and crystalline silica; Silicate-containing compounds such as diatomaceous earth and silica sand; Pumice powder, Pumice Natural mineral pulverized products such as balloons, slate powder, mica powder; alumina-containing compounds such as alumina, colloidal alumina (alumina sol), alumina white, aluminum sulfate; barium sulfate, lithopone, calcium sulfate, molybdenum disulfide, graphite (graphite) ) Minerals such as glass fiber, glass beads, glass Glass fillers such as flakes and foamed glass beads; fly ash sphere, volcanic glass hollow body, synthetic inorganic hollow body, single crystal potassium titanate, carbon fiber, carbon nanotube, carbon hollow sphere, carbon 64 fullerene, anthracite powder, artificial ice Examples thereof include crystallite (cryolite), titanium oxide, magnesium oxide, basic magnesium carbonate, dolomite, potassium titanate, calcium sulfite, mica, calcium silicate, aluminum powder, molybdenum sulfide, boron fiber, and silicon carbide fiber.
これらの中でも繊維状無機充填材が好ましく、例えばガラス繊維、アスベスト繊維、炭素繊維、シリカ繊維、シリカ/アルミナ繊維、チタン酸カリ繊維、ポリアラミド繊維等が挙げられる。 Among these, fibrous inorganic fillers are preferable, and examples thereof include glass fiber, asbestos fiber, carbon fiber, silica fiber, silica / alumina fiber, potassium titanate fiber, and polyaramid fiber.
成分(B)の配合量は(A)PAS樹脂100重量部に対して、10〜250重量部であり、好ましくは30〜150重量部である。成分(B)の配合量が過少であると十分な機械的強度が得られず、また過大であると成形性や機械強度が低下し、好ましくない。 The amount of component (B) is 10 to 250 parts by weight, preferably 30 to 150 parts by weight, based on 100 parts by weight of (A) PAS resin. If the amount of component (B) is too small, sufficient mechanical strength cannot be obtained, and if too large, moldability and mechanical strength are lowered, which is not preferable.
得られるPAS樹脂組成物の溶融粘度は80〜350Pa・s、好ましくは150〜330Pa・s、特に好ましくは180〜330Pa・sである。溶融粘度が過小であると成形性が不安定となるばかりか、バリの発生が悪化するため好ましくない。また、溶融粘度が過大であると流動性が不足するため成形安定性が悪くなる、あるいは薄肉成形品を成形するのが困難となる。 The melt viscosity of the obtained PAS resin composition is 80 to 350 Pa · s, preferably 150 to 330 Pa · s, particularly preferably 180 to 330 Pa · s. An excessively low melt viscosity is not preferable because not only the moldability becomes unstable but also the occurrence of burrs deteriorates. On the other hand, if the melt viscosity is excessive, the fluidity is insufficient and the molding stability is deteriorated, or it is difficult to mold a thin molded product.
次に、特に必須ではないがさらに結晶核剤を添加併用することにより、本発明の効果は一段と増大する。この目的に使用する結晶核剤としては、公知の有機質核剤、無機核剤のいずれも使用することができる。無機物としては、例えばZn粉末、Al粉末、グラファイト、カーボンブラックなどの単体や、ZnO、MgO、Al2O3、TiO2、MnO2、SiO2、Fe3O4などの金属酸化物、ボロンナイトライドなどの窒化物、Na2CO3、CaCO3、MgCO3、CaSO4、CaSiO3、BaSO4、Ca3(PO4)3などの無機塩、シリカ、タルク、カオリン、クレー、白土などがあげられる。又、有機物としては、シュウ酸カルシウム、シュウ酸ナトリウム、安息香酸カルシウム、フタル酸カルシウム、酒石酸カルシウム、ステアリン酸マグネシウムなどの有機塩類、耐熱性の高分子、耐熱性高分子の架橋物などを使用することができる。特に好ましいものはボロンナイトライド;或いはタルク、カオリン、クレー、白土等の粘土類;架橋又は分岐構造を有する高分子化合物等である。ここで架橋又は分岐構造を有する高分子化合物とは、例えばモノマーの一部に3ケ以上の官能機を有するものの重縮合によって生じた分岐、又は架橋構造を有する高分子化合物、或いは既成の高分子物質に後で架橋、分岐構造を付与したものの何れにてもよい。 Next, although not essential, the effect of the present invention is further increased by adding and using a crystal nucleating agent. As the crystal nucleating agent used for this purpose, any of known organic nucleating agents and inorganic nucleating agents can be used. Examples of inorganic substances include simple substances such as Zn powder, Al powder, graphite, and carbon black, metal oxides such as ZnO, MgO, Al 2 O 3 , TiO 2 , MnO 2 , SiO 2 , and Fe 3 O 4 , and boronite. Nitrides such as rides, inorganic salts such as Na 2 CO 3 , CaCO 3 , MgCO 3 , CaSO 4 , CaSiO 3 , BaSO 4 , Ca 3 (PO 4 ) 3 , silica, talc, kaolin, clay, clay, etc. It is done. As organic substances, use is made of organic salts such as calcium oxalate, sodium oxalate, calcium benzoate, calcium phthalate, calcium tartrate, magnesium stearate, heat-resistant polymers, cross-linked products of heat-resistant polymers, etc. be able to. Particularly preferred are boron nitride; or clays such as talc, kaolin, clay and clay; polymer compounds having a crosslinked or branched structure, and the like. Here, the polymer compound having a crosslinked or branched structure is, for example, a polymer compound having a branched or crosslinked structure generated by polycondensation of a monomer having three or more functional units, or an existing polymer. Any of those obtained by adding a cross-linked or branched structure to the substance later may be used.
尚、上記結晶核剤中には(D)無機フィラーと重複するものも存在し、これらの物質は両機能を果たすことが出来るが、結晶核剤としての使用量は(A)成分100重量部あたり0.01〜3重量部あれば充分であり、好ましくは0.1〜2重量部である。 In addition, some of the above crystal nucleating agents overlap with (D) inorganic filler, and these substances can fulfill both functions, but the amount used as a crystal nucleating agent is 100 parts by weight of component (A). 0.01 to 3 parts by weight per unit is sufficient, and preferably 0.1 to 2 parts by weight.
本発明では高低温衝撃特性のさらなる改善のために、熱可塑性エラストマーを適宜併用することができる。熱可塑性エラストマーとしては、ポリオレフィン系エラストマー、ポリエステル系エラストマー、フッ素系エラストマー、シリコーン系エラストマー、ブタジエン系エラストマー、ポリアミド系エラストマー、ポリスチレン系エラストマー、ウレタン系エラストマー、中心に架橋構造をもつ各種粒子系エラストマーなどが挙げられ、1種又は2種以上を用いることができる。 In the present invention, a thermoplastic elastomer can be used in combination as appropriate in order to further improve the high and low temperature impact characteristics. Thermoplastic elastomers include polyolefin-based elastomers, polyester-based elastomers, fluorine-based elastomers, silicone-based elastomers, butadiene-based elastomers, polyamide-based elastomers, polystyrene-based elastomers, urethane-based elastomers, and various particle-based elastomers with a cross-linked structure at the center. 1 type or 2 types or more can be used.
熱可塑性エラストマーとしてはオレフィン系エラストマーが好ましく、さらに好ましくはα−オレフィンとα、β−不飽和酸のグリシジルエステルを主成分とするオレフィン系共重合体が用いられる。また、α−オレフィンとα、β−不飽和酸のグリシジルエステルの主成分に各種グラフト共重合体を共重合させたオレフィン系エラストマーも好ましく用いることができる。 As the thermoplastic elastomer, an olefin-based elastomer is preferable, and an olefin-based copolymer mainly containing an α-olefin and a glycidyl ester of an α, β-unsaturated acid is used. Further, an olefin elastomer obtained by copolymerizing various graft copolymers with main components of α-olefin and glycidyl ester of α, β-unsaturated acid can also be preferably used.
熱可塑性エラストマーの配合量としては(A)成分100重量部あたり1〜25重量部が配合され、好ましくは1〜15重量部、さらに好ましくは1〜8重量部が配合される。1重量部より少ない場合には、高低温衝撃特性の改善効果が十分ではなく、25重量部より多い場合には成形時に金型に付着するモールドデポジットが多くなる問題が発生する。 As a compounding quantity of a thermoplastic elastomer, 1-25 weight part is mix | blended with respect to 100 weight part of (A) component, Preferably it is 1-15 weight part, More preferably, 1-8 weight part is mix | blended. When the amount is less than 1 part by weight, the effect of improving the high and low temperature impact characteristics is not sufficient. When the amount is more than 25 parts by weight, there is a problem that the mold deposit attached to the mold during molding increases.
又、本発明のPAS樹脂組成物には、その目的に応じ前記成分の他に、他の熱可塑性樹脂を補助的に少量併用することも可能である。ここで用いられる他の熱可塑性樹脂としては、高温において安定な熱可塑性樹脂であれば、いずれのものでもよい。 The PAS resin composition of the present invention can be used in combination with a small amount of other thermoplastic resins in addition to the above components depending on the purpose. The other thermoplastic resin used here may be any thermoplastic resin that is stable at high temperatures.
更に、本発明に使用するPAS樹脂組成物には、本発明の効果を損なわない範囲で一般に熱可塑性樹脂に添加される公知の物質、すなわち酸化防止剤等の安定剤、難燃剤、染・顔料等の着色剤、潤滑剤等も要求性能に応じ適宜添加することができる。 Further, the PAS resin composition used in the present invention is a known substance generally added to a thermoplastic resin within a range not impairing the effects of the present invention, that is, a stabilizer such as an antioxidant, a flame retardant, a dye / pigment. Such coloring agents, lubricants, and the like can be appropriately added according to the required performance.
本発明で用いる樹脂成形法は特に限定されるものではなく、射出成形、押出し成形、真空成形、圧縮成形等、一般に公知の熱可塑性樹脂の成形法を用いて成形することができるが、最も好ましいのは射出成形である。 The resin molding method used in the present invention is not particularly limited, and can be molded using generally known thermoplastic resin molding methods such as injection molding, extrusion molding, vacuum molding, compression molding, etc., but is most preferable. Is injection molding.
以下、実施例により本発明を具体的に説明するが、本発明はこれらに限定されるものではない。
・使用原料
(A)PAS樹脂
A-1:(株)クレハ製、フォートロンKPS W214A
(リニアPPS、310℃、ズリ速度1200sec-1における粘度130Pa・s、Cl量1200ppm、レジンpH=6.0)
A-2:(株)クレハ製、フォートロンKPS W220A
(リニアPPS、310℃、ズリ速度1200sec-1における粘度210Pa・s、Cl量1700ppm、レジンpH=6.0)
A-3:(株)クレハ製、フォートロンKPS W203A
(リニアPPS、310℃、ズリ速度1200sec-1における粘度28Pa・s、Cl量3800ppm、レジンpH=6.0)
A-4:(株)クレハ製、フォートロンKPS W312
(リニアPPS、310℃、ズリ速度1200sec-1における粘度170Pa・s、Cl量1500ppm、レジンpH=10.8)
(B)硫黄系無機化合物
・B-1:硫黄(関東化学(株)製)
・B-2:硫化ナトリウム九水和物(関東化学(株)製)
・B-3:水硫化ナトリウム溶液(関東化学(株)製)
(C)アルコキシシラン
・C-1:γ−アミノプロピルトリエトキシシラン
(D)繊維状無機フィラー
・D-1:ガラス繊維(日本電気硝子(株)製、13μmφチョップドストランド(ECS03T−717))
EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto.
・ Raw material (A) PAS resin
A-1: Fortron KPS W214A, manufactured by Kureha Corporation
(Linear PPS, 310 ° C, Viscosity 130Pa · s at shear rate 1200sec -1 , Cl content 1200ppm, Resin pH = 6.0)
A-2: Fortron KPS W220A, manufactured by Kureha Corporation
(Linear PPS, 310 ° C, Viscosity 210Pa · s at shear rate 1200sec -1 , Cl content 1700ppm, Resin pH = 6.0)
A-3: Kureha Co., Ltd., Fortron KPS W203A
(Linear PPS, 310 ° C, Viscosity 28Pa · s at shear rate 1200sec -1 , Cl amount 3800ppm, Resin pH = 6.0)
A-4: Kureha Co., Ltd., Fortron KPS W312
(Linear PPS, 310 ° C, Viscosity 170Pa · s at shear rate 1200sec -1 , Cl content 1500ppm, Resin pH = 10.8)
(B) Sulfur-based inorganic compounds · B-1: Sulfur (manufactured by Kanto Chemical Co., Inc.)
・ B-2: Sodium sulfide nonahydrate (manufactured by Kanto Chemical Co., Inc.)
・ B-3: Sodium hydrosulfide solution (manufactured by Kanto Chemical Co., Inc.)
(C) Alkoxysilane / C-1: γ-aminopropyltriethoxysilane
(D) Fibrous inorganic filler D-1: Glass fiber (manufactured by Nippon Electric Glass Co., Ltd., 13 μmφ chopped strand (ECS03T-717))
実施例1〜9及び比較例1〜2
表1に示す各原料成分をヘンシェルミキサーで5分間混合し、これをシリンダー温度320℃の二軸押出機に投入し(ガラス繊維は押出機のサイドフィード部より別添加)、樹脂温度350℃にて溶融混練し、樹脂組成物のペレットを作った。
Examples 1-9 and Comparative Examples 1-2
Each raw material component shown in Table 1 is mixed with a Henschel mixer for 5 minutes, and this is put into a twin screw extruder with a cylinder temperature of 320 ° C (glass fiber is added separately from the side feed part of the extruder), and the resin temperature is 350 ° C. And kneaded to prepare pellets of the resin composition.
得られた樹脂組成物のペレットを、シリンダー温度320℃の射出成形機に投入して成形し、目的の成形品(試験片)を作成し、評価を行った。結果を表1に示す。 The obtained resin composition pellets were put into an injection molding machine having a cylinder temperature of 320 ° C. and molded to prepare a target molded product (test piece) for evaluation. The results are shown in Table 1.
尚、表1中の(B)硫黄系無機化合物の配合量は、水溶液、水和物を使用した場合は水含有量分を除いた値である。 In Table 1, the blending amount of (B) sulfur-based inorganic compound is a value excluding the water content when an aqueous solution or hydrate is used.
また、実施例および比較例での評価方法は以下の通りである。
《レジンpHの測定法》
室温(15〜25℃)にて、サンプル6gとアセトン15ml、及び精製水(関東化学(株)製)30mlをフラスコに入れ、振とう機を用いて30分間振とうした後、分液ロートで濾過した。その上澄みのpHをpHメーターで測定した。
《引張強度の評価》
ISO3167に準じた試験片(幅:10mm,厚み4mm)を成形し、ISO 527-1,2に準じて測定した。
《塩素量の測定法》
燃焼イオンクロマト法により測定した。
(測定条件)
イオンクロマトグラフ:DIONEX製 DX320
燃焼用前処理装置:三菱化学製 AQF-100,ABC,WS-100,GA-100
試料:10mg
ヒーター:Inlet Temp/900℃,Outlet Temp/1000℃
吸収液:H2O2 900ppm,内標準PO4 3- 25ppm
《溶融粘度の測定法》
溶融粘度は内径1.0mmφ、長さ20.0mmのノズルを装着したキャピログラフを用い、310℃、剪断速度1200(1/秒)で測定した。
・測定装置:(株)東洋精機製作所製 キャピログラフ1B
《バリ発生の評価》
金型間隙20μmのバリ測定部が外周に設けられている円盤状キャビティーの金型を用い、キャビティーが完全に充填するのに必要な最小圧力で射出成形し、その部分に発生するバリ長さを測定した。
(シリンダー温度320℃、金型温度150℃)
Moreover, the evaluation method in an Example and a comparative example is as follows.
<Method for measuring resin pH>
At room temperature (15-25 ° C), 6 g of sample, 15 ml of acetone, and 30 ml of purified water (manufactured by Kanto Chemical Co., Inc.) are placed in a flask, shaken for 30 minutes using a shaker, and then separated with a separating funnel. Filtered. The pH of the supernatant was measured with a pH meter.
<< Evaluation of tensile strength >>
A test piece (width: 10 mm, thickness 4 mm) according to ISO 3167 was molded and measured according to ISO 527-1,2.
<Measurement method of chlorine content>
It was measured by combustion ion chromatography.
(Measurement condition)
Ion chromatograph: DX320 made by DIONEX
Combustion pretreatment equipment: Mitsubishi Chemical AQF-100, ABC, WS-100, GA-100
Sample: 10mg
Heater: Inlet Temp / 900 ℃, Outlet Temp / 1000 ℃
Absorbing solution: H 2 O 2 900ppm, internal standard PO 4 3- 25 ppm
<Measuring method of melt viscosity>
The melt viscosity was measured at 310 ° C. and a shear rate of 1200 (1 / second) using a capillograph equipped with a nozzle having an inner diameter of 1.0 mmφ and a length of 20.0 mm.
・ Measuring device: Capillograph 1B manufactured by Toyo Seiki Seisakusho Co., Ltd.
<Evaluation of burrs>
Using a disk-shaped cavity mold with a burr measuring part with a mold gap of 20 μm on the outer periphery, injection molding is performed at the minimum pressure necessary to completely fill the cavity, and the burr length generated at that part Was measured.
(Cylinder temperature 320 ° C, mold temperature 150 ° C)
Claims (7)
(B)硫黄系無機化合物0.05〜2重量部(但し、水溶液、水和物を使用する場合は水含有量分を除く)
を配合し溶融混練して得られる、溶融粘度が80〜350Pa・s(温度310℃、剪断速度1200/秒)であるポリアリーレンサルファイド樹脂組成物。 (A) 100 parts by weight of a polyarylene sulfide resin having a substantially linear structure
(B) 0.05-2 parts by weight of a sulfur-based inorganic compound (however, when an aqueous solution or hydrate is used, the water content is excluded)
A polyarylene sulfide resin composition having a melt viscosity of 80 to 350 Pa · s (temperature of 310 ° C., shear rate of 1200 / sec) obtained by blending and melt kneading.
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JP2003213143A (en) * | 2002-01-24 | 2003-07-30 | Tokai Rubber Ind Ltd | Durable resin composition |
JP5167275B2 (en) * | 2007-01-04 | 2013-03-21 | エスケー ケミカルズ カンパニー リミテッド | Method for producing polyarylene sulfide resin excellent in brightness |
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2008
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