JPH0627264B2 - Polyphenylene sulfide resin composition - Google Patents

Polyphenylene sulfide resin composition

Info

Publication number
JPH0627264B2
JPH0627264B2 JP16674085A JP16674085A JPH0627264B2 JP H0627264 B2 JPH0627264 B2 JP H0627264B2 JP 16674085 A JP16674085 A JP 16674085A JP 16674085 A JP16674085 A JP 16674085A JP H0627264 B2 JPH0627264 B2 JP H0627264B2
Authority
JP
Japan
Prior art keywords
polyphenylene sulfide
sulfide resin
resin composition
fiber
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP16674085A
Other languages
Japanese (ja)
Other versions
JPS6227459A (en
Inventor
敏秀 山口
齊 井筒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Priority to JP16674085A priority Critical patent/JPH0627264B2/en
Publication of JPS6227459A publication Critical patent/JPS6227459A/en
Publication of JPH0627264B2 publication Critical patent/JPH0627264B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0333Organic insulating material consisting of one material containing S
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は極めて優れた機械的特性、耐湿性、成形加工性
を有するポリフエニレンスルフイド樹脂組成物に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a polyphenylene sulfide resin composition having extremely excellent mechanical properties, moisture resistance, and moldability.

(従来の技術及び問題点) ポリフエニレンスルフイド樹脂は耐薬品性、耐熱性、難
燃性、電気特性に優れるエンジニアリングプラスチツク
として知られ、各種分野で利用されており、さらに近年
では電子部品の封止材料として注目を浴びつつある。こ
れらの用途では、特に強度、耐湿性、成形時の流動性の
バランスがとれていることが好ましい。この目的のため
に樹脂と充てん材とを含み系において、充てん材をシラ
ンカツプリング剤処理することが試みられているが、十
分な成果を得るに至つていない。たとえば、エポキシシ
ランやアミノシランで処理すると強度は大きいが、流動
性が著しく悪化するし、長鎖炭化水素基を有するカツプ
リング剤を用いた場合には流動性はよいが、強度が低
い。両者を併用した場合には、流動性改良効果は小さ
く、かつ、強度物性が著しく低下する。
(Prior art and problems) Polyphenylene sulfide resin is known as an engineering plastic with excellent chemical resistance, heat resistance, flame retardancy, and electrical properties, and is used in various fields. It is gaining attention as a sealing material. In these applications, it is preferable that the strength, moisture resistance, and fluidity during molding are well balanced. For this purpose, it has been attempted to treat the filler with a silane coupling agent in a system containing a resin and a filler, but this has not been sufficient. For example, when treated with epoxysilane or aminosilane, the strength is high, but the fluidity is significantly deteriorated. When a coupling agent having a long chain hydrocarbon group is used, the fluidity is good, but the strength is low. When both are used in combination, the effect of improving the fluidity is small and the strength properties are remarkably deteriorated.

(問題点を解決するための手段) 本発明者等は上記の如き状況に鑑み、鋭意検討した結
果、ポリフエニレンスルフイド樹脂と充てん材とから成
る系のおいて特定のシラン化合物を介在させることで機
械的強度、耐湿性、流動性のバランスを著しく向上させ
得ることを発見し、本発明に至つた。
(Means for Solving Problems) The inventors of the present invention have made diligent studies in view of the above situation, and as a result, interpose a specific silane compound in a system including a polyphenylene sulfide resin and a filler. As a result, they have found that the balance among mechanical strength, moisture resistance and fluidity can be remarkably improved, leading to the present invention.

すなわち、本発明は、ポリフエニレンスルフイド樹脂と
充てん材と下記一般式で示されるシラン化合物とから成
るポリフエニレンスルフイド樹脂組成物を提供するもの
である。
That is, the present invention provides a polyphenylene sulfide resin composition comprising a polyphenylene sulfide resin, a filler and a silane compound represented by the following general formula.

本発明で用いられるポリフエニレンスルフイド樹脂(以
下、PPSと称す)としては一般式 で示される構造単位を70モル%以上含むものが好まし
く、未架橋品、一部架橋品あるいはそれらの混合物が挙
げられ、又他種ポリマー、たとえばポリサルホン、スチ
レン−ブタジエンゴムなどを共重合させたものを利用で
きる。
The polyphenylene sulfide resin (hereinafter referred to as PPS) used in the present invention has a general formula It is preferable to contain 70 mol% or more of the structural unit represented by the formula (1), which may be an uncrosslinked product, a partially crosslinked product or a mixture thereof, and a copolymer of another kind of polymer such as polysulfone or styrene-butadiene rubber. Is available.

かかるPPSは一般的な製造法、例えば(1)ハロゲン置
換芳香族化合物と硫化アルカリとの反応(米国特許第2
513188号明細書、特公昭44−27671号およ
び特公昭45−3368号参照)(2)チオフエノール類
のアルカリ触媒又は銅塩等の共存下における縮合反応
(米国特許第3274165号、英国特許第11606
60号参照)(3)芳香族化合物を塩化硫黄とのルイス酸
触媒共存下に於ける縮合反応(特公昭46−27255
号、ベルギー特許第29437号参照)等により合成さ
れるものであり、目的に応じ任意に選択し得る。
Such PPS is produced by a general method, for example, (1) reaction of a halogen-substituted aromatic compound with an alkali sulfide (US Pat.
513188, JP-B-44-27671 and JP-B-45-3368) (2) Condensation reaction of thiophenols in the presence of an alkali catalyst or a copper salt (US Pat. No. 3,274,165, British Patent No. 11606).
No. 60) (3) Condensation reaction of an aromatic compound with sulfur chloride in the presence of a Lewis acid catalyst (Japanese Examined Patent Publication No. 46-27255).
No. 29, Belgian Patent No. 29437), etc., and can be arbitrarily selected according to the purpose.

本発明で用いる充てん材としては、ガラス繊維、アスベ
スト繊維、シリカ繊維、シリカ・アルミナ繊維、アルミ
ナ繊維、ジルコニア繊維、窒化ホウ素繊維、窒化ケイ素
繊維、ほう素繊維、炭化ケイ素ウイスカ、チタン酸カリ
ウムウイスカ、ケイ酸カルシウム繊維、石コウ繊維、ポ
リアミド繊維などの繊維状充てん材や、シリカ、タル
ク、クレー、マイカ、ガラス、ケイ酸カルシウム、モン
モリロナイト、ベントナイト等のケイ酸質あるいは炭酸
カルシウム、硫酸カルシウム、硫酸バリウム等の他の充
てん材で、市販の天然品、精製品、合成品の粉砕物、球
状及び中空のものが利用できる。これらの充てん材は収
束剤やカツプリング剤で処理されたものであつても何ら
さしつかえない。
As the filler used in the present invention, glass fiber, asbestos fiber, silica fiber, silica-alumina fiber, alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, silicon carbide whiskers, potassium titanate whiskers, Fibrous fillers such as calcium silicate fiber, gypsum fiber, polyamide fiber, etc., silica, talc, clay, mica, glass, calcium silicate, montmorillonite, bentonite, etc. or calcium carbonate, calcium sulfate, barium sulfate. Other fillers such as commercially available natural products, purified products, crushed products of synthetic products, spherical products and hollow products can be used. These fillers may be treated with a sizing agent or a coupling agent and may be used in any way.

本発明で用いられるシラン化合物とは、次の一般式で示
される構造をもつものである。
The silane compound used in the present invention has a structure represented by the following general formula.

このようなものとしては、たとえば、ブチルアミノプロ
ピルトリエトキシシラン、オクタデシルアミノプロピル
トリエトキシシラン、ヘプチルアセトキシプロピルトリ
メトキシシラン、オクチルスルホンアミドエチルトリメ
トキシシラン、オクタデシルアミドメチルフエネチルト
リメトキシシランなど種々のものを挙げることができ
る。
Examples of such compounds include butylaminopropyltriethoxysilane, octadecylaminopropyltriethoxysilane, heptylacetoxypropyltrimethoxysilane, octylsulfonamidoethyltrimethoxysilane, octadecylamidomethylphenethyltrimethoxysilane and the like. I can list things.

本発明における、(ア)PPS、(イ)充てん材、(ウ)シラン
化合物の割合は、一般には (ア)100重量部に対して
(イ)600重量部以下;(イ)100重量部に対して (ウ)0.
01〜20重量部である。(ア)〜(ウ)からなる組成物を調製
する方法としては、(イ)を(ウ)にて処理した後、そのま
ま、あるいは(ウ)の分解点以下で加熱処理し、次に(ア)と
ともに溶融混合する方法が一般的であるが、これに制限
されるものではなく、(ア)〜(ウ)を同時に混合する方法、
(ア)に(ウ)を混合した後(イ)と混合する方法など任意に選
択することができる。また、本発明の目的を阻害しない
範囲内で酸化防止剤、熱安定剤、滑剤、結晶核剤、着色
剤、紫外線吸収剤、カツプリング剤、アルミニウム電極
腐食防止剤や各種ポリマーたとえばポリアミド、エポキ
シ、ポリサルホン、ポリエチレン、ポリスチレン液晶ポ
リマーやゴム成分たとえばポリアミドエラストマー、エ
チレンプロピレンラバー、各種変性ゴムなどを添加混合
することができる。
In the present invention, the proportions of (A) PPS, (A) filler, (U) silane compound are generally (A) 100 parts by weight.
(A) 600 parts by weight or less; (A) 100 parts by weight (C) 0.
01 to 20 parts by weight. As a method for preparing a composition consisting of (A) to (C), (A) is treated with (C) and then heat-treated as it is or below the decomposition point of (C), and then (A). ) Is generally melt-mixed with, but is not limited to this, (a) ~ (c) a method of simultaneously mixing,
The method of mixing (a) with (c) and then with (a) can be arbitrarily selected. Further, within a range that does not impair the object of the present invention, an antioxidant, a heat stabilizer, a lubricant, a crystal nucleating agent, a colorant, an ultraviolet absorber, a coupling agent, an aluminum electrode corrosion inhibitor and various polymers such as polyamide, epoxy and polysulfone. , Polyethylene, polystyrene liquid crystal polymers and rubber components such as polyamide elastomer, ethylene propylene rubber, and various modified rubbers can be added and mixed.

(発明の効果) 本発明の樹脂組成物は優れた強度特性、吸湿時の電気特
性、成形時の流動性を有するため電子部品の封止用材
料、プリント配線板用基材、各種電気部品計器類のコネ
クター、複雑形状部品用材料として、非常に有用であ
る。
(Effects of the Invention) The resin composition of the present invention has excellent strength characteristics, electric characteristics when absorbing moisture, and fluidity during molding, so that it is used as a sealing material for electronic components, a substrate for printed wiring boards, and various electrical component instruments. Very useful as a connector and a material for complex shaped parts.

(実施例) 以下、実施例により本発明を詳細に説明する。例中、部
及び%はすべて重量基準である。
(Examples) Hereinafter, the present invention will be described in detail with reference to Examples. In the examples, all parts and percentages are by weight.

実施例1〜5、比較的1〜3 PPS′(ライトンV−1 フイリツプス石油社製)と
充てん材、シラン化合物を表−1に示す割合で混合した
後、押出機にて溶融混練ペレツト化した。これを3オン
ス射出成形機(シリンダー温度320℃、金型温度15
0℃)でテストピースを作成し、物性を測定した。明ら
かに本発明になる成形品は強度吸湿時の電気特性、流動
性に優れた性能を示す。
Examples 1-5, relatively 1-3 PPS '(Ryton V-1 Made by Phillips Oil Co., Ltd.
The filler and the silane compound were mixed at the ratio shown in Table-1.
Then, the mixture was melt-kneaded into pellets with an extruder. Turn this on 3
Injection molding machine (cylinder temperature 320 ° C, mold temperature 15
A test piece was prepared at 0 ° C.) and the physical properties were measured. joy
The molded product according to the present invention has strong electrical properties and flow when absorbing moisture.
Shows excellent performance.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】ポリフエニレンスルフイド樹脂と充てん材
と下記一般式(1)で示されるシラン化合物とからなるポ
リフエニレンスルフイド樹脂組成物。
1. A polyphenylene sulfide resin composition comprising a polyphenylene sulfide resin, a filler and a silane compound represented by the following general formula (1).
JP16674085A 1985-07-30 1985-07-30 Polyphenylene sulfide resin composition Expired - Fee Related JPH0627264B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16674085A JPH0627264B2 (en) 1985-07-30 1985-07-30 Polyphenylene sulfide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16674085A JPH0627264B2 (en) 1985-07-30 1985-07-30 Polyphenylene sulfide resin composition

Publications (2)

Publication Number Publication Date
JPS6227459A JPS6227459A (en) 1987-02-05
JPH0627264B2 true JPH0627264B2 (en) 1994-04-13

Family

ID=15836870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16674085A Expired - Fee Related JPH0627264B2 (en) 1985-07-30 1985-07-30 Polyphenylene sulfide resin composition

Country Status (1)

Country Link
JP (1) JPH0627264B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5252679A (en) * 1989-12-07 1993-10-12 Polyplastics Co., Ltd. Polyarylene sulfide resin composition
EP3387070A4 (en) 2015-12-11 2019-08-14 Ticona LLC Polyarylene sulfide composition
CN108883600B (en) 2016-03-24 2021-08-06 提克纳有限责任公司 Composite structure

Also Published As

Publication number Publication date
JPS6227459A (en) 1987-02-05

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