JP4937935B2 - Organic EL display and method for manufacturing organic EL display - Google Patents

Description

  The present invention relates to an organic EL (electroluminescence) display and an organic EL display manufacturing method.

  An organic EL display is being developed as a self-luminous display using an organic material for a light emitting layer, and is partially put into practical use.

  As a conventional organic EL display, as shown in FIG. 11, a first insulating film 112 formed on a substrate 100 having a circuit layer 111, and a light emitting region of one pixel formed on the first insulating film 112. A structure having a second insulating film 113 having a corresponding opening 115 and a light emitting element 114 formed in the opening is known (see, for example, Patent Document 1).

The light emitting element 114 mainly includes a light emitting functional layer 114a including a light emitting layer, a charge injection layer, and the like, and an upper electrode 114b and a lower electrode 114c that sandwich the light emitting functional layer 114a from above and below. The material of the light emitting functional layer can be roughly classified into two types. There are cases where a low molecular organic material is used and a polymer organic material is used. A low molecular organic material is used as a material of the light emitting functional layer. In some cases, the light emitting functional layer is formed mainly by a vacuum deposition method. On the other hand, when a high molecular weight organic material is used as the material of the light emitting functional layer, a light emitting function is achieved by applying a liquid light emitting material containing a high molecular weight organic material by a coating method such as a spin coating method, an ink jet method, or a printing method. A layer can be formed (see, for example, Patent Document 2).

Compared to organic EL displays using low molecular weight organic materials, organic EL displays using high molecular weight organic materials do not require a vacuum device for the production of the light-emitting functional layer. It attracts attention as a technology that can be expected to reduce the cost and area of EL displays.
JP 2007-234572 A JP 2003-142260 A

  By the way, like the organic EL display described in Patent Document 1, the second insulating film 113 has an opening (second opening) different from the opening (first opening 115) corresponding to one pixel. 116) may be formed. The second opening 116 is provided, for example, to secure a path for connecting the light emitting element 114 and the circuit layer 111. Specifically, the connection conductor 117 connected to the circuit layer 111 is exposed on the bottom surface of the second opening 116, and the connection conductor 117 and the light emitting element 114 exposed from the bottom surface of the second opening. By connecting the upper electrode 114b, the light emitting element 114 and the circuit layer 111 are electrically connected.

  In the organic EL display having such a structure, when the liquid polymer organic material that becomes the light emitting functional layer 114 a is applied to the first opening 115, the polymer organic material is also applied to the second opening 116. May be applied. In this case, the connection conductor 117 exposed on the bottom surface of the second opening is covered with the polymer organic material, and a conduction failure occurs between the connection conductor 117 and the upper electrode 114b of the light emitting element 114. It becomes easy. A pixel in which such a continuity failure has occurred becomes a dark spot and causes a reduction in image quality of the organic EL display.

  The present invention has been made in view of the above problems, and an object thereof is to provide an organic EL display having a good image quality even when a polymer organic material is used for a light emitting functional layer, and a method for manufacturing the organic EL display. .

  In order to solve the above-described problems and achieve the object, an organic EL display of the present invention is formed on a substrate, a circuit layer formed on the main surface of the substrate, and the circuit layer so as to cover the circuit layer. A first insulating film to be formed, a second insulating film formed on the first insulating film and having first and second openings, and a light emitting function formed in the first opening A connecting portion that covers the upper end of the protruding portion and is connected to the circuit layer, and the light emitting function. And an upper electrode covering the connection conductor located on the upper surface of the layer and the upper end of the protrusion.

  The organic EL display according to the present invention is characterized in that the upper end of the protrusion is positioned higher than the upper surface of the light emitting functional layer.

  Moreover, the organic EL display of the present invention is characterized in that the protrusion is formed by protruding the first insulating layer upward.

  The organic EL display manufacturing method of the present invention includes a substrate having a plurality of pixel regions, a circuit layer formed on the main surface of the substrate, and a first layer formed on the substrate so as to cover the circuit layer. 1 insulating film, a second insulating film formed on the first insulating film and having first and second openings, and on the first insulating film exposed from the second opening A step A of preparing a light emitting element forming substrate having a protrusion formed on the upper surface of the protrusion and a connection conductor covering the upper end of the protrusion and connected to the circuit layer; and an organic material for each pixel region Step B for forming the light emitting functional layer by solidifying the applied organic material, and Step C for forming the upper electrode covering the light emitting functional layer and the connection conductor formed on the upper ends of the protrusions It is characterized by including these.

  According to this invention, the protrusion is provided in the second opening, the connecting conductor is formed so as to cover the upper end of the protrusion, and the upper electrode is positioned at the upper end of the protrusion. Since it extends over the protrusion so as to cover the connection conductor, the connection conductor is prevented from being covered with the polymer organic material, and the connection conductor and the upper electrode are in a good state. Can be connected. As a result, poor conduction between the connecting conductor and the upper electrode can be reduced, and an organic EL display with good image quality with few dark spots can be obtained.

  Exemplary embodiments of an organic EL display and a method for manufacturing the organic EL display according to the present invention will be described below in detail with reference to the accompanying drawings. Note that the drawings used in the following embodiments are schematic, and the dimensional ratios in the drawings do not necessarily match the actual ones.

[Organic EL display]
FIG. 1 is an enlarged plan view of a part of the display area of the organic EL display according to the present embodiment, and FIG. 2 is a cross-sectional view taken along line AA ′ in FIG. Note that the organic EL display of the present embodiment employs a top emission type structure in which light is extracted from the upper surface side.

  As shown in FIG. 1, in the organic EL display according to the present embodiment, a plurality of pixels P having a substantially rectangular shape are arranged in a matrix, and each pixel P is provided with a light emitting element. The light emitting element has a function of emitting any of red (R), green (G), and blue (B), for example. When the organic EL display is used as a full-color display panel, R, G, The B light emitting elements are arranged according to a predetermined rule. When the organic EL display is used as a monocolor display panel, a single color light emitting element of that color may be provided in each pixel region.

  As shown in FIG. 2, the organic EL display of the present invention includes a substrate 1, a circuit layer 2 formed on the main surface of the substrate 1, a first insulating film 3 covering the circuit layer 2, and a first insulation. A second insulating film 4 formed on the film 3, a light emitting element 5 formed in each pixel, and a connection conductor 6 for electrically connecting the light emitting element 5 and the circuit layer 2 are provided. It is configured.

  For example, plastic or glass can be used as the substrate 1. However, since the organic EL display according to the present embodiment is a top emission type organic EL display, a substrate having no translucency can also be employed. The circuit layer 2 formed on the substrate 1 is composed of various circuit elements (not shown) such as a transistor and a capacitor for performing drive control of the light emitting element 5 and the like. Then, the first insulating film 3 is formed so as to cover the circuit layer 2, and the light emitting element 5 is formed on the first insulating film 3.

  The first insulating film 3 is for reducing the influence of unevenness due to the difference in height of various circuit elements constituting the circuit layer 2 when the light emitting element 5 is formed. For example, a resin such as an acrylic resin is used. Formed of material. Further, the first insulating film 3 is provided with a contact hole 3a penetrating the first insulating film 3 in the thickness direction, and the connecting conductor 6 is attached to the inner surface of the contact hole 3a. . The first insulating film 3 is formed by applying a photosensitive resin material on a substrate to form a film, and then subjecting it to an exposure process and a development process.

  The light emitting element 5 formed on the first insulating film 3 includes a lower electrode 7, a light emitting functional layer 8 formed on the lower electrode 7, and an upper electrode 9 formed on the light emitting functional layer 8. It is what is done.

  In this organic EL display, the lower electrode 7 is a common electrode, and the lower electrodes of adjacent pixels are electrically connected to each other. The lower electrode 7 is formed by sputtering or the like using, for example, aluminum or an aluminum alloy, and then formed into a predetermined pattern by a conventionally known photolithography method or the like. In the present embodiment, the lower electrode 7 functions as an anode (anode) of the light emitting element 5.

  A second insulating film 4 is provided on the lower electrode 7. FIG. 3 is a plan view showing a schematic pattern shape of the second insulating film 4. As shown in the figure, the second insulating film 4 is a second insulating film for securing a connection path between the first opening 10, the upper electrode 9, and the connection conductor 6 corresponding to the region where the light emitting element 5 is formed. An opening 11 is provided. Note that a protrusion 15 described later is formed in the second opening 11.

Examples of the material of the second insulating film 4 include inorganic materials such as silicon oxide films (SiO, SiO ₂ , SiON, etc.), silicon nitride films (Si ₃ N ₄ , SiNx, etc.), acrylic resins, novolac resins, silicon An organic material such as a resin can be used, and after these materials are formed, an exposure process and a development process are performed to form a predetermined pattern.

  A partition wall 12 is provided on the upper surface of the second insulating film 4. FIG. 4 is a diagram showing a pattern shape when the partition 12 is viewed in plan. As shown in the figure, the partition wall 12 is formed in a lattice shape so as to have an opening corresponding to one pixel, in other words, to partition adjacent pixels. Further, as shown in FIG. 2, the cross-sectional shape of the partition wall 12 is a reverse taper shape in which the upper end portion is wider than the lower end portion. The partition wall 12 is formed in a shape as shown in FIG. 4 by applying a photosensitive resin material such as a polyimide resin, an acrylic resin, or a polyamide resin on the substrate 1 and then performing an exposure process and a development process. Further, the partition wall 12 has a predetermined thickness so that the liquid organic material that becomes the applied light emitting functional layer 8 stays in a predetermined pixel when the light emitting functional layer 8 described later is formed. It is formed with a thickness of 5 μm.

  A light emitting functional layer 8 is formed on the upper surface of the lower electrode 7 exposed from the first opening 10 of the second insulating film 4. Here, the light emitting functional layer is a layer made of an organic material sandwiched between the anode and the cathode among the members constituting the light emitting element 5, and the light emitting functional layer 8 in this embodiment is a hole transport. It consists of a layer 8a and a light emitting layer 8b.

  The hole transport layer 8a is formed, for example, by applying a polymer organic material obtained by doping a polythiophene derivative or a polypyrrole derivative. More specifically, it is formed by dispersing 3,4-ethylenedioxythiophene, which is a conductive polymer, in polystyrene sulfonic acid and applying a dispersion obtained by adding water to each pixel. On the other hand, the light emitting layer 8b is formed by applying a polymer organic material such as a polyfluorene derivative, a polyparaphenylene vinylene derivative, a polyphenylene derivative, a polythiophene derivative, or a polyalkylthiophene derivative to each pixel. As a method for applying the hole transport layer 8a and the light emitting layer 8b, a conventionally well-known technique such as a spin coating method, a screen printing method, an ink jet method, or the like can be applied. It is preferable to apply an ink jet method that can be applied smoothly.

  In the organic EL display according to the present invention, as shown in FIG. 2, a protrusion 15 is provided in the second opening 11 of the second insulating film 4, and the connecting conductor 6 covers the upper end of the protrusion 15. is doing. By having such a structure, it is possible to prevent the connecting conductor 6 from being covered with the applied organic material when the organic material to be the light emitting functional layer 8 is applied. If the upper end of the protrusion 15 is positioned higher than the upper surface of the light emitting functional layer 8, it is possible to more reliably prevent the connecting conductor 6 from being covered with the applied organic material. Therefore, the protrusion 15 is preferably formed so that the upper end thereof is positioned higher than the upper surface of the light emitting functional layer 8. For example, the thickness of the protrusion 15 (height from the upper surface of the flat portion of the first insulating film 3). Is set to 0.5 μm to 3.0 μm. The protrusion 15 may be formed by a member different from the first insulating film 3, but when the first insulating film 3 is formed, a part of the first insulating film 3 is protruded upward. If the protrusions 15 are formed by performing the exposure process and the development process, the process of forming the protrusions 15 is not necessary and the productivity of the organic EL display is not lowered. Therefore, the protrusion 15 is preferably formed integrally with the first insulating film 3.

  An upper electrode 9 is formed so as to cover the upper surface of the connection conductor 6 and the light emitting functional layer 8 covering the upper end of the protrusion 15. By connecting the connecting conductor 6 and the upper electrode 9, the light emitting element 5 and the circuit layer 2 are electrically connected. Since the connecting conductor 6 is formed so as to cover the upper end of the protrusion 15, the connecting conductor 6 is prevented from being covered with the light emitting functional layer 8, and the connecting conductor 6 and the upper electrode 9 are excellent. Can be connected in a simple state. Thereby, the connection failure of the connection conductor 6 and the upper electrode 9 is reduced, and an organic EL display with few dark spots can be obtained.

  In this embodiment, since a top emission type organic EL display is employed, the upper electrode 9 uses an electrode material that transmits light. A transparent metal material such as ITO (indium tin oxide) can be used as the light transmissive electrode material. Moreover, even if it is metal materials, such as Ca, Mg, and Ag which are not transparent in nature, these materials may be used since light can be transmitted by making it adhere very thinly. The upper electrode 9 functions as a cathode (cathode). The upper electrode 9 is provided independently for each pixel, and the upper electrodes between adjacent pixels are insulated from each other. In the organic EL display according to the present embodiment, since the partition wall 12 is formed in a reverse taper shape, if the metal material to be the upper electrode 9 is evaporated from a direction substantially perpendicular to the substrate 1, the upper electrode 9 is formed of the partition wall 12. The upper electrode is divided at this portion without going into the side surface, and the independent upper electrode 9 can be easily produced for each pixel.

  A sealing film 13 is provided on the upper electrode 106. The sealing film 13 covers at least the upper electrode 9 and protects the light emitting element 5 from moisture and outside air. The sealing film 13 is made of, for example, an inorganic material such as a silicon oxide film or a silicon nitride film, and is formed by conventionally known CVD or the like.

  Further, a sealing substrate 16 is disposed on the substrate 1 so as to cover all the pixels, and the sealing substrate 16 is bonded to the substrate 1 side by the sealing material 14, whereby the light emitting elements 5 of the respective pixels are sealed. ing. The sealing substrate 16 is formed of a light-transmitting substrate such as plastic or glass, for example. The sealing material 14 is made of an acrylic resin, an epoxy resin, a urethane resin, a silicon resin, or the like.

[Method of manufacturing organic EL display]
Next, an embodiment of a method for producing an organic EL display of the present invention will be described with reference to FIGS. The following explanatory diagram corresponds to a cross section taken along line AA ′ in FIG. 1.

(Process A)
First, the light emitting element forming substrate 20 is prepared. The light emitting element forming substrate 20 includes a substrate 1 having a plurality of pixel regions, a circuit layer 2 formed on the main surface of the substrate 1, and a first layer formed on the substrate 1 so as to cover the circuit layer 2. The insulating film 3, the second insulating film 4 formed on the first insulating film 3 and having the first and second openings 10 and 11, and the first exposed from the second opening 11 A projection 15 formed on the insulating film 3 and a connection conductor 6 that covers the upper end of the projection 15 and is connected to the circuit layer 15 are provided.

  In order to manufacture the light emitting element forming substrate 20, first, the circuit layer 2 is formed on the main surface of the substrate 1 as shown in FIG.

  The substrate 1 is made of, for example, plastic or glass and has a plurality of pixel regions arranged in a matrix. Various constituent members (such as light emitting elements) for one pixel are formed in each pixel region. On the substrate 1, a circuit layer 2 composed of various circuit elements such as a thin film transistor and a capacitor, and a wiring conductor for connecting the circuit elements to each other is formed. The circuit layer 2 is formed through a conventionally known photoetching process. That is, the circuit layer 2 constituting a predetermined circuit is formed by repeatedly performing film formation, exposure, development, etching, and the like using a metal material, a photosensitive resin material, a semiconductor material, and the like.

  Next, as shown in FIG. 5B, a first insulating film 3 is formed so as to cover the circuit layer 2. In order to manufacture the first insulating film 3, first, a photosensitive resin material mainly composed of an acrylic resin, a novolac resin, a silicon resin, a polyimide resin or the like is used as a conventionally known spin coat method, slit coat method, ink jet method, or the like. To a predetermined thickness. Next, a first insulating film 3 having contact holes 3a is formed by subjecting the applied photosensitive resin material to exposure processing and development processing. In the manufacturing method of the organic EL display according to the present embodiment, the protrusion 15 is also formed at the same time in the step of forming the contact hole 3 a in the first insulating film 3. In order to form the protrusions 15 at the same time in the contact hole 3a formation process, for example, the exposure amount when the photosensitive resin material is subjected to the exposure process may be adjusted. This will be described with reference to FIG. FIG. 6 is a diagram showing the stage of exposing the photosensitive resin material applied on the circuit layer 2. When a positive type material is used as the photosensitive resin material, the portion where the protrusion 15 is formed is prevented from being exposed to the exposure light, and the portion where the contact hole 3a is formed is exposed to the exposure light L1. A mask 21 that is used as it is is used. Further, a portion other than the protrusion 15 and the contact hole 3a is irradiated with a relatively weak light L2 that is transmitted through the exposure light L1 at a rate of 20 to 80%, for example. By performing the exposure in this way, in the subsequent development processing, the portion that has not been irradiated with the exposure light remains as it is, and becomes the protrusion 15, and the portion that has been irradiated with the exposure light as it is, the coated photosensitive resin material Is removed so as to penetrate the thickness direction, and a contact hole 3a is formed. In addition, the coated photosensitive resin material is removed by a predetermined thickness at portions other than the protrusion 15 and the contact hole 3a. By using a mask capable of adjusting the exposure amount in this way, the contact hole 3a and the protrusion 15 can be formed simultaneously in the step of forming the first insulating film 2.

  As a mask whose exposure amount can be adjusted, for example, a halftone mask or a slit mask can be used. A halftone mask is a mask whose exposure intensity can be adjusted by forming a mask using a material having a predetermined transmittance, and a material whose transmittance with respect to the wavelength of exposure light is known. It is a mask having an arbitrary transmittance for exposure light by adjusting the thickness. The slit mask is a mask in which dots or stripes having dimensions smaller than the resolution limit value of the exposure apparatus are arranged. The photosensitive resin material applied by making the pattern finer than the resolution limit value of the exposure apparatus is not exposed in the form of dots or stripes, and the substrate area corresponding to the slit portion is larger than the normal exposure intensity. It is exposed with low intensity.

  After the first insulating film 3 is formed, the lower electrode 7 and the connecting conductor 6 are formed as shown in FIG. For example, the lower electrode 7 and the connection conductor 6 are formed by depositing a conductive material such as aluminum or an aluminum alloy so as to cover the surface of the first insulating film 3 by sputtering or vapor deposition, and then patterned by a photolithography method. Formed by.

  Next, a second insulating film 4 is formed on the lower electrode 7 as shown in FIG. The second insulating film 4 is produced, for example, by applying an organic material such as acrylic resin, novolac resin, or silicon resin on the lower electrode 7 and subjecting the applied organic material to exposure processing and development processing. The shape of the second insulating film 4 when viewed in plan is as shown in FIG. 3, and the connection path between the first opening 10 corresponding to the light emitting region of one pixel, the light emitting element 5, and the connecting conductor 6. And a second opening 11 for securing.

After the second insulating film 4 is formed, the partition wall 12 is formed as shown in FIG. The partition wall 12 is produced by applying a photosensitive resin material such as polyimide resin, and subjecting the applied photosensitive resin material to exposure processing and development processing. The shape of the partition 12 in plan view is as shown in FIG. 4 and is formed in a lattice shape so as to have an opening corresponding to one pixel. The partition wall 12 serves as a partition member that keeps the liquid organic material in the pixel area when a liquid organic material to be the light emitting function layer 8 is applied to each pixel area in the step of forming the light emitting function layer 8 to be described later. It functions and preferably has water repellency with respect to a liquid organic material. In order to exhibit water repellency for the liquid organic material, the surface of the partition wall 12 may be subjected to a surface treatment with a fluorinated compound such as CF ₄ . Further, the partition wall 12 in the present embodiment has a reverse tapered shape in which the cross-sectional shape is wider from the lower end to the upper end, and has a function of dividing the upper electrode 9 for each pixel in the formation process of the upper electrode 9 described later. .

(Process B)
Next, the light emitting functional layer 8 is formed (FIG. 8). The light emitting functional layer 8 in the present embodiment is composed of a hole transport layer 8a and a light emitting layer 8b.

  In order to form the light emitting functional layer 8, first, a liquid organic material 8 a ′ that becomes the light emitting functional layer 8 a is applied to each pixel region, that is, the region surrounded by the partition walls 12. Conventionally known techniques such as spin coating, screen printing, and ink jet can be applied as the organic material coating method, but the ink is excellent in material utilization efficiency and enables fine coating of each pixel. The method is preferably applied. FIG. 8A is a diagram showing a step of forming the hole transport layer 8a by the ink jet method. As shown in the figure, when the liquid organic material 8a ′ to be the hole transport layer 8a is applied by the ink jet method, the ink jet head 22 is disposed immediately above the pixel region, and the liquid organic material 8a ′ is removed from the ink jet head 22. It discharges in the area | region enclosed by the partition 12. The hole transport layer 8a is, for example, a polymer organic material obtained by doping a polythiophene derivative or a polypyrrole derivative. In this embodiment, 3,4-ethylenedioxythiophene is dispersed in polystyrene sulfonic acid. A dispersion with water added is used. The applied liquid organic material 8 a ′ is heat-treated to form the hole transport layer 8.

  The light emitting layer 8b is also produced by an ink jet method in the same manner as the hole transport layer 8a. FIG. 8B is a diagram showing a process of forming the light emitting layer 8b by the ink jet method. As shown in the figure, the inkjet head 23 is disposed immediately above the pixel region, and the liquid organic material 8 b ′ that becomes the light emitting layer 8 is discharged from the inkjet head 23 into the region surrounded by the partition wall 12. The light emitting layer 8b is made of, for example, a polymer organic material such as a polyfluorene derivative, a polyparaphenylene vinylene derivative, a polyphenylene derivative, a polythiophene derivative, or a polyalkylthiophene derivative. The applied liquid organic material 8 b ′ is heat-treated to become the light emitting layer 8.

(Process C)
Next, the upper electrode 9 is formed as shown in FIG. The upper electrode 9 is formed so as to cover the connection conductor 6 formed on the upper surface of the light emitting functional layer 8 and the upper end portion of the protrusion 15 by vacuum deposition, sputtering or the like with a metal material. Since the connection conductor 6 is formed so as to cover the upper end of the protrusion 15, a part of the connection conductor is exposed without the connection conductor 6 being completely covered with the light emitting functional layer 8, and the connection conductor 6 and the upper electrode 9 can be connected in good condition. Thereby, the connection failure of the connection conductor 6 and the upper electrode 9 is reduced, and an organic EL display with few dark spots can be obtained.

  In this embodiment, since a top emission type organic EL display is employed, the upper electrode 9 uses an electrode material that transmits light. A transparent metal material such as ITO (indium tin oxide) can be used as the light transmissive electrode material. Moreover, even if it is metal materials, such as Ca, Mg, and Ag which are not transparent in nature, these materials may be used since light can be transmitted by making it adhere very thinly. Since the partition wall 12 is formed in a reverse taper shape, the upper electrode 9 does not enter the side surface of the partition wall 12 by vapor-depositing a metal material to be the upper electrode 9 from a direction substantially perpendicular to the substrate 1. The upper electrode is divided, and the independent upper electrode 9 can be easily manufactured for each pixel. The upper electrode 9 is deposited on the upper surface of the partition wall 12 but is not shown in the drawing.

  After forming the upper electrode 9, the sealing film 13 is formed. The sealing film 13 is formed by, for example, a CVD method using an inorganic material such as a silicon oxide film or a silicon nitride film. By providing the sealing film 13, members that are easily affected by moisture and oxygen, such as the light emitting functional layer 8 and the upper electrode 9, can be protected from moisture and oxygen.

  Finally, the sealing substrate 16 is bonded via the sealing material 14 to complete an organic EL display as a product.

(Modification)
FIG. 10 is a diagram showing a modification of the method for manufacturing the organic EL display described above. In the manufacturing method according to the above-described embodiment, the mask 21 capable of adjusting the exposure amount is used as a method of forming the protrusion 15 and the contact hole 3a in the same process, but here, by performing two-stage exposure. The protrusion 15 and the contact hole 3a are formed in the same process. Specifically, as shown in FIG. 10A, first, after applying a photosensitive resin material on the element 1, the first shadow mask 30 is exposed so that only the portion where the contact hole 3a is formed is exposed. The first exposure is performed using. Subsequently, as shown in FIG. 10B, exposure is performed using the second shadow mask 31 so that the portion other than the portion where the protrusion 15 is formed is exposed. After the exposure as described above, development processing is performed to form the first insulating film 3 in which the protrusions 15 and the contact holes 3a are formed as shown in FIG.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

  For example, in the above-described embodiment, the example in which the light-emitting functional layer 8 is configured by the hole transport layer 8a and the light-emitting layer 8b has been described. And a light emitting layer, or an electron transport layer and a light emitting layer.

1 is a partially enlarged plan view of an organic EL display according to an embodiment of the present invention. It is sectional drawing in the A-A 'line segment of FIG. It is a top view of the 2nd insulating film concerning the embodiment of the present invention. It is a top view of the partition concerning the embodiment of the present invention. It is sectional drawing which shows 1 process of the manufacturing method of the organic electroluminescent display concerning one Embodiment of this invention. It is sectional drawing which shows 1 process of the manufacturing method of the organic electroluminescent display concerning one Embodiment of this invention. It is sectional drawing which shows 1 process of the manufacturing method of the organic electroluminescent display concerning one Embodiment of this invention. It is sectional drawing which shows 1 process of the manufacturing method of the organic electroluminescent display concerning one Embodiment of this invention. It is sectional drawing which shows 1 process of the manufacturing method of the organic electroluminescent display concerning other embodiment of this invention. It is sectional drawing which shows the modification of the manufacturing method of the organic electroluminescent display concerning one Embodiment of this invention. It is a partially expanded sectional view of the conventional organic EL display.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Circuit layer 3 ... 1st insulating film 4 ... 2nd insulating film 5 ... Light emitting element 6 ... Conducting conductor 7 ... Lower electrode 8. ··· Light emitting functional layer 9 ··· Upper electrode 10 ··· 1st opening portion 11 ··· 2nd opening portion 12 ··· Partition 13 ··· Sealing film 14 · · · Sealing material 15 ···・ Protrusions 16 ... sealing substrate

Claims (6)

A substrate,
A circuit layer formed on the main surface of the substrate;
A first insulating film formed on the substrate so as to cover the circuit layer;
A second insulating film formed on the first insulating film and having first and second openings;
A light emitting functional layer formed in the first opening;
A protrusion formed on the first insulating film exposed from the second opening;
A connection conductor covering the upper end of the protrusion and connected to the circuit layer;
An organic EL display comprising: the connection conductor located at the upper end of the protrusion, and an upper electrode covering the upper surface of the light emitting functional layer. The organic EL display according to claim 1, wherein an upper end of the protrusion is higher than an upper surface of the light emitting functional layer. The organic EL display according to claim 1, wherein the protrusion is formed by protruding the first insulating layer upward. A substrate having a plurality of pixel regions;
A circuit layer formed on the main surface of the substrate;
A first insulating film formed on the substrate so as to cover the circuit layer;
A second insulating film formed on the first insulating film and having first and second openings;
A protrusion formed on the first insulating film exposed from the second opening;
Preparing a light emitting element forming substrate having a connection conductor that covers the upper end of the protrusion and is connected to the circuit layer;
Step B for forming a light emitting functional layer by applying an organic material to each pixel region and solidifying the applied organic material;
Forming an upper electrode that covers the connection conductor formed on the light emitting functional layer and the upper end of the protruding portion; and a method of manufacturing an organic EL display. The method for manufacturing an organic EL display according to claim 4, wherein an upper end of the protrusion is higher than an upper surface of the light emitting functional layer. The method of manufacturing an organic EL display according to claim 4, wherein the protrusion is formed by causing the first insulating layer to protrude upward.

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