JP4935592B2 - 熱硬化型導電性ペースト - Google Patents

熱硬化型導電性ペースト Download PDF

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Publication number
JP4935592B2
JP4935592B2 JP2007237707A JP2007237707A JP4935592B2 JP 4935592 B2 JP4935592 B2 JP 4935592B2 JP 2007237707 A JP2007237707 A JP 2007237707A JP 2007237707 A JP2007237707 A JP 2007237707A JP 4935592 B2 JP4935592 B2 JP 4935592B2
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JP
Japan
Prior art keywords
resin
conductive paste
weight
thermosetting
melamine resin
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Expired - Fee Related
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JP2007237707A
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English (en)
Japanese (ja)
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JP2009070677A (ja
JP2009070677A5 (enExample
Inventor
隆 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shoei Chemical Inc
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Shoei Chemical Inc
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Priority to JP2007237707A priority Critical patent/JP4935592B2/ja
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Publication of JP2009070677A5 publication Critical patent/JP2009070677A5/ja
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Publication of JP4935592B2 publication Critical patent/JP4935592B2/ja
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  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
JP2007237707A 2007-09-13 2007-09-13 熱硬化型導電性ペースト Expired - Fee Related JP4935592B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007237707A JP4935592B2 (ja) 2007-09-13 2007-09-13 熱硬化型導電性ペースト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007237707A JP4935592B2 (ja) 2007-09-13 2007-09-13 熱硬化型導電性ペースト

Publications (3)

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JP2009070677A JP2009070677A (ja) 2009-04-02
JP2009070677A5 JP2009070677A5 (enExample) 2010-12-16
JP4935592B2 true JP4935592B2 (ja) 2012-05-23

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JP2007237707A Expired - Fee Related JP4935592B2 (ja) 2007-09-13 2007-09-13 熱硬化型導電性ペースト

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JP (1) JP4935592B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5412357B2 (ja) * 2010-04-01 2014-02-12 株式会社フジクラ メンブレン配線板
JP2012248370A (ja) * 2011-05-26 2012-12-13 Dainippon Printing Co Ltd 導電性銀ペースト
JP2013004309A (ja) * 2011-06-16 2013-01-07 Toyota Motor Corp 金属ナノ粒子ペースト
JP5734913B2 (ja) * 2011-08-31 2015-06-17 富士フイルム株式会社 感放射線性組成物、パターン形成方法、カラーフィルタ及びその製造方法、並びに、固体撮像素子
JP5803608B2 (ja) * 2011-11-22 2015-11-04 旭硝子株式会社 導電ペーストおよび導電ペーストの調製方法
TWI481326B (zh) * 2011-11-24 2015-04-11 Showa Denko Kk A conductive pattern forming method, and a conductive pattern forming composition by light irradiation or microwave heating
JP6383183B2 (ja) * 2014-06-03 2018-08-29 太陽インキ製造株式会社 導電性接着剤およびそれを用いた電子部品
US9683119B2 (en) 2014-07-03 2017-06-20 Corning Incorporated Jet ink composition, method and coated article
CN107112249B (zh) 2015-02-04 2020-04-14 纳美仕有限公司 导热膏及其制备方法
JP6813496B2 (ja) 2015-03-20 2021-01-13 コーニング インコーポレイテッド インクジェット用インク組成物、インク被覆方法、および被覆物品
JP6897278B2 (ja) * 2016-04-25 2021-06-30 住友金属鉱山株式会社 ニッケルペースト及びニッケルペーストの製造方法
JP2018035286A (ja) * 2016-09-01 2018-03-08 パナソニックＩｐマネジメント株式会社 導電性樹脂組成物及びそれを用いた電子回路部材
JP7143875B2 (ja) * 2020-10-30 2022-09-29 住友金属鉱山株式会社 積層セラミックコンデンサ内部電極用ペースト及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4951948B2 (ja) * 2005-12-02 2012-06-13 昭栄化学工業株式会社 導体形成方法

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