JP4922007B2 - Resin composition and molded body thereof - Google Patents

Description

  The present invention relates to a resin composition containing ultrahigh molecular weight polyethylene and a molded body thereof.

  Ultra high molecular weight polyethylene (UHMWPE) is an engineering plastic having excellent properties such as low specific gravity, low water absorption, high impact resistance, and high wear resistance. As described above, ultra high molecular weight polyethylene is a resin having excellent characteristics, but further improvements in characteristics such as mechanical strength are required. Ultra high molecular weight polyethylene has the above-mentioned excellent characteristics, but also has drawbacks such as being easily deformable by heat and poor in melt moldability. For this reason, improvement of the above-mentioned fault is also calculated | required in ultra high molecular weight polyethylene.

Regarding polysilane, Japanese Patent Application Laid-Open No. 2003-268247 (Patent Document 1) discloses that polysilane is used in combination with a resin additive such as a filler, a reinforcing agent, a flame retardant, and a color pigment to a resin such as a polycarbonate resin. It is described that the dispersibility of the resin additive is improved.
JP 2003-268247 A (Claims)

  Therefore, the object of the present invention is to maintain the excellent properties (such as impact resistance) of ultrahigh molecular weight polyethylene, while maintaining the physical properties of the resin system containing ultrahigh molecular weight polyethylene (for example, mechanical strength such as tensile strength or mechanical strength). It is an object of the present invention to provide a resin composition and a molded product thereof that can improve the characteristics.

  Another object of the present invention is to provide a resin composition capable of efficiently improving the heat resistance of a resin system containing ultrahigh molecular weight polyethylene and a molded product thereof.

  Still another object of the present invention is to provide a resin composition capable of improving the handleability of a resin system containing ultra high molecular weight polyethylene and a molded product thereof.

  Another object of the present invention is to provide a method for improving the mechanical properties (such as tensile strength) of a resin system containing at least ultra-high molecular weight polyethylene.

  As a result of intensive studies to solve the above problems, the present inventors have found that when polysilane is added to ultrahigh molecular weight polyethylene, the excellent properties (such as impact resistance) of ultra high molecular weight polyethylene are not impaired. The inventors have found that properties (such as tensile strength) can be improved, and completed the present invention.

  That is, the resin composition (ultra high molecular weight polyethylene resin composition) of the present invention is composed of ultra high molecular weight polyethylene and polysilane. The polysilane may be a polysilane having at least one structural unit among the structural units represented by the following formulas (1) to (3).

(Wherein, R ¹ to R ³ are the same or different, a hydrogen atom, a hydroxyl group, an organic group or a silyl group, x, y and z is an integer of 1 or more, respectively.)
The polysilane may be composed of a polysilane having a structural unit (1) in which at least one of R ¹ and R ² is an aryl group. Typically, the polysilane may be composed of a polysilane having a structural unit (1) in which R ¹ is an aryl group, and R ² is an alkyl group or an aryl group. In the resin composition of the present invention, a polysilane having a relatively low molecular weight may be suitably used as the polysilane. For example, the polysilane may be a polysilane having an average degree of polymerization of 2 to 10. Such a low molecular weight polysilane may be liquid at room temperature or normal temperature.

  In the resin composition of the present invention, the proportion of polysilane may be, for example, about 0.1 to 50 parts by weight with respect to 100 parts by weight of ultrahigh molecular weight polyethylene.

  The resin composition of the present invention may further contain other resins. Such other resins include, for example, polypropylene resins, polyamide resins, polyester resins, polyacetal resins, polycarbonate resins, poly (thio) ether resins, polysulfone resins, polyketone resins, polyimide resins, and fluorine. It may be at least one resin (A) selected from a series resin. In particular, the resin (A) may be composed of at least a polypropylene resin. In the present invention, the polysilane is excellent in dispersibility with respect to ultrahigh molecular weight polyethylene and also has an effect of improving the compatibility between the ultrahigh molecular weight polyethylene and other resins. Alloy can be obtained.

  In the resin composition containing such other resin, the ratio between the ultrahigh molecular weight polyethylene and the resin (A) may be about the former / the latter (weight ratio) = 95/5 to 50/50, The proportion of polysilane may be about 0.1 to 50 parts by weight with respect to 100 parts by weight of the total amount of ultrahigh molecular weight polyethylene and resin (A).

  The present invention also includes a method in which polysilane is added to a resin system containing at least ultrahigh molecular weight polyethylene to improve the mechanical properties (or mechanical strength, such as tensile strength) of the resin system.

  Moreover, the molded object formed with the said resin composition is also contained in this invention.

  Since the resin composition of the present invention is composed of ultrahigh molecular weight polyethylene and polysilane, a resin system containing ultrahigh molecular weight polyethylene while maintaining the excellent properties (such as impact resistance) of ultrahigh molecular weight polyethylene ( It is possible to improve (or improve) physical properties (for example, mechanical strength or mechanical properties such as tensile strength) of ultrahigh molecular weight polyethylene, a polymer blend composed of ultrahigh molecular weight polyethylene and another resin, and the like. Therefore, in the method of the present invention, it is possible to improve the mechanical properties (such as tensile strength) of a resin system containing at least ultrahigh molecular weight polyethylene.

  In addition, because polysilane acts as a compatibilizer between ultrahigh molecular weight polyethylene and another resin, the characteristics of other resins can be efficiently imparted to ultrahigh molecular weight polyethylene. For example, when the resin composition is composed of ultra high molecular weight polyethylene, a high heat resistance resin (for example, polypropylene resin) and polysilane, the heat resistance of the resin system containing ultra high molecular weight polyethylene can be improved efficiently. Furthermore, when polysilane is added to a resin system containing ultra high molecular weight polyethylene, the handling properties [for example, fluidity (or melt moldability) in melt molding] of the resin system containing ultra high molecular weight polyethylene can be improved or improved.

  The resin composition of the present invention is composed of ultrahigh molecular weight polyethylene and polysilane. Such a resin composition can maintain the excellent characteristics of ultrahigh molecular weight polyethylene and improve characteristics such as mechanical strength. Moreover, although the resin composition of the present invention is a resin system containing ultra-high molecular weight polyethylene having poor moldability (such as melt moldability), the handling property is improved by the addition of polysilane.

[Ultra high molecular weight polyethylene]
The viscosity average molecular weight of ultra high molecular weight polyethylene is, for example, 1 million or more (for example, about 1.5 to 10 million), preferably 2 million or more (for example, about 2.5 to 8 million), and more preferably 3 million or more (for example, 340). About 7 million). In addition, a viscosity average molecular weight can be measured based on ASTM-D2857 etc. Moreover, the melt flow rate of ultra high molecular weight polyethylene is 0.1 g / 10 min or less (for example, about 0.01 to 0.08 g / 10 min), preferably 0.1. It may be about 02 to 0.07 g / 10 minutes.

[Polysilane]
The polysilane used in the present invention is not particularly limited as long as it is a linear, cyclic, branched, or network compound having a Si—Si bond, but is usually represented by the following formulas (1) to (3). Often, the structural unit is composed of polysilane having at least one structural unit.

(Wherein, R ¹ to R ³ are the same or different, a hydrogen atom, a hydroxyl group, an organic group or a silyl group, x, y and z is an integer of 1 or more, respectively.)
In the formulas (1) and (2), examples of the organic group represented by R ^{1 to} R ³ include a hydrocarbon group (an alkyl group, an alkenyl group, a cycloalkyl group, a cycloalkenyl group, an aryl group, and an aralkyl group). And ether groups (alkoxy groups, cycloalkyloxy groups, aryloxy groups, aralkyloxy groups, etc.) corresponding to these hydrocarbon groups. Usually, the organic group is often a hydrocarbon group such as an alkyl group, an alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group. Also, hydrogen atoms, hydroxyl groups, alkoxy groups, silyl groups, etc. are often substituted at the ends.

In R ^{1 to} R ³ of the above formulas (1) and (2), examples of the alkyl group include C _1-14 alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, t-butyl, pentyl, hexyl (preferably C _1-10 alkyl group, more preferably C _1-6 alkyl group).

Examples of the alkoxy group include C _1-14 alkoxy groups such as methoxy, ethoxy, propoxy, isopropoxy, butoxy, t-butoxy and pentyloxy (preferably C _1-10 alkoxy groups, more preferably C _1-6 alkoxy groups). Is mentioned.

Examples of the alkenyl group include C _2-14 alkenyl groups such as vinyl, allyl, butenyl, pentenyl (preferably a C _2-10 alkenyl group, more preferably a C _2-6 alkenyl group).

Examples of the cycloalkyl group include C _5-14 cycloalkyl groups (preferably C _5-10 cycloalkyl groups, more preferably C _5-8 cycloalkyl groups) such as cyclopentyl, cyclohexyl, and methylcyclohexyl. _{Examples of the} cycloalkyloxy group include C _5-14 cycloalkyloxy groups such as cyclopentyloxy and cyclohexyloxy (preferably C _5-10 cycloalkyloxy groups, more preferably C _5-8 cycloalkyloxy groups). . Examples of the cycloalkenyl group include C _5-14 cycloalkenyl groups such as cyclopentenyl and cyclohexenyl (preferably a C _5-10 cycloalkenyl group, more preferably a C _5-8 cycloalkenyl group).

Examples of the aryl group include C _6-20 aryl groups (preferably C _6-15 aryl group, more preferably C _6-12 aryl group) such as phenyl, methylphenyl (tolyl), dimethylphenyl (xylyl), and naphthyl. Can be mentioned. Examples of the aryloxy group include C _6-20 aryloxy groups such as phenoxy and naphthyloxy (preferably a C _6-15 aryloxy group, more preferably a C _6-12 aryloxy group). Examples of the aralkyl group include C _6-20 aryl-C _1-4 alkyl groups (preferably C _6-10 aryl-C _1-2 alkyl groups) such as benzyl, phenethyl, and phenylpropyl. Examples of the aralkyloxy group include C _6-20 aryl-C _1-4 alkyloxy groups (preferably C _6-10 aryl-C _1-2 alkyloxy groups) such as benzyloxy, phenethyloxy, and phenylpropyloxy. It is done.

Examples of the silyl group include Si _1-10 silanyl groups (preferably Si _1-6 silanyl groups) such as a silyl group, a disilanyl group, and a trisilanyl group.

Further, when R ^{1 to} R ³ are the organic group (alkyl group, aryl group, etc.) or silyl group, at least one of the hydrogen atoms may be substituted with a substituent (or functional group). Good. Such a substituent (or functional group) may be the same group as described above, such as a hydroxyl group, an alkyl group, an aryl group, and an alkoxy group.

Among these, R ^{1 to} R ³ are often an alkyl group (eg, a C _1-4 alkyl group such as a methyl group), an aryl group (eg, a C _6-20 aryl group such as a phenyl group), or the like. .

  When the polysilane has an acyclic structure (straight, branched, or network), the terminal group (terminal substituent) is usually a hydrogen atom, a hydroxyl group, a halogen atom (such as a chlorine atom), an alkyl group, or an alkoxy group. Or a silyl group.

  Specific examples of the polysilane include a linear or cyclic polysilane having a structural unit represented by the formula (1), and a branched polysilane having a structural unit represented by the formula (2) or (3). Alternatively, a reticulated polysilane, a polysilane having a combination of structural units represented by the above formulas (1) to (3), and the like can be given.

  Typical polysilanes include linear or cyclic polysilanes such as polydialkylsilanes [eg polydimethylsilane, polymethylpropylsilane, polymethylbutylsilane, polymethylpentylsilane, polydibutylsilane, polydihexylsilane, dimethylsilane. -Methylhexylsilane copolymer, etc.], polyalkylarylsilane [eg, polymethylphenylsilane, methylphenylsilane-phenylhexylsilane copolymer, etc.], polydiarylsilane (eg, polydiphenylsilane), dialkylsilane- Alkylarylsilane copolymers (eg, dimethylsilane-methylphenylsilane copolymer, dimethylsilane-phenylhexylsilane copolymer, dimethylsilane-methylnaphthylsilane copolymer), etc. And the like. Details of such polysilanes are described in, for example, R.A. D. Miller, J.M. Michl; Chemical Review, 89, 1359 (1989); Matsumoto; Japan Journal of Physics, Volume 37, p. 5425 (1998).

Preferred polysilanes include polysilanes having a structural unit (1) in which at least one of R ¹ and R ² is an aryl group (particularly a C _6-20 aryl group) [for example, polyalkylaryl silane, polydiaryl silane, aryl silane unit And the like (dialkylsilane-alkylarylsilane copolymer and the like). In particular, R ¹ is an aryl group (particularly a C _6-20 aryl group) and R ² is an aryl group (particularly a C _6-20 aryl group) or an alkyl group (particularly a C _1-6 alkyl group). Polysilanes (especially linear or cyclic polysilanes) having (1), such as poly C _1-6 alkyl C _6-20 aryl silanes (eg poly C _1-3 alkyl C _6-10 aryl silanes), polydi C _{6- 20} aryl silanes (eg, polydiC _6-10 aryl silane) and the like are preferred.

  In addition, x, y, and z should just be 1 or more, respectively, for example, 1-500, respectively, Preferably it is 1-300, More preferably, about 1-200 may be sufficient, respectively.

  These polysilanes can be used alone or in combination of two or more.

  The degree of polymerization (average degree of polymerization) of the polysilane may be 2 or more, for example, 2 to 400, preferably 3 to 350, more preferably about 4 to 300, and usually about 2 to 100. May be. When the polysilane is cyclic, the degree of polymerization (or the number of members) of the cyclic polysilane may usually be about 4 to 12, preferably 4 to 10, more preferably 5 to 10 (particularly 5 to 5). It may be about 8). The degree of polymerization (average degree of polymerization) corresponds to the number of silicon atoms, and when the polysilane is a polysilane having a structural unit represented by the above formulas (1) to (3), x, y and z Is the polymerization degree (average polymerization degree).

  The molecular weight of the polysilane may be about 200 to 100,000, preferably 300 to 50,000, and more preferably about 400 to 30,000 in terms of weight average molecular weight. In particular, as polysilane (chain polysilane and cyclic polysilane), the molecular weight is particularly small (for example, weight average molecular weight (for example, 200 to 1500, preferably 250 to 1200, more preferably 300 to 1000, particularly about 400 to 800). The polysilane may be suitably used.

  The polysilane may be solid or liquid at room temperature (for example, about 15 to 25 ° C.). The polysilane having a low molecular weight or a low polymerization degree may be usually in a liquid state.

  The polysilane can be prepared using various known methods. In order to produce these polysilanes, for example, a method of dehalogenating polycondensation of halosilanes using magnesium as a reducing agent using a silicon-containing monomer having a specific structural unit (“magnesium reduction method”, WO 98/29476) Etc.), a method of dehalogenating polycondensation of halosilanes in the presence of an alkali metal (“Kipping method”, J. Am. Chem. Soc., 110, 124 (1988), Macromolecules, 23, 3423 (1990), etc.) A method of dehalogenating polycondensation of halosilanes by electrode reduction (J. Chem. Soc., Chem. Commun., 1161 (1990)), J. Chem. Chem. Soc. , Chem. Commun. 897 (1992), etc.), a method of dehydrocondensation polymerization of hydrazines in the presence of a metal catalyst (JP-A-4-334551 etc.), a method by anionic polymerization of disilene crosslinked with biphenyl or the like (Macromolecules, 23, 4494 (1990)), and a method such as a method by ring-opening polymerization of cyclic silanes.

  Of these production methods, the magnesium reduction method is preferred from the viewpoint of industrial properties such as the purity, molecular weight distribution, production cost, and safety of the resulting polysilane.

  In the resin composition of the present invention, the proportion of polysilane is, for example, 0.1 to 50 parts by weight (for example, 0.2 to 40 parts by weight), preferably 0.3 with respect to 100 parts by weight of ultrahigh molecular weight polyethylene. -30 parts by weight (for example, 0.5-25 parts by weight), more preferably 1-20 parts by weight (for example, 2-15 parts by weight), particularly about 3-10 parts by weight.

[Other resins]
The resin composition of the present invention may contain other resins as a resin component in addition to ultrahigh molecular weight polyethylene. The polysilane is excellent in dispersibility with respect to ultrahigh molecular weight polyethylene, and also appears to have an effect of improving or improving the compatibility between the ultrahigh molecular weight polyethylene and other resins. For this reason, in this invention, the polymer blend (polymer alloy) which has the characteristic of ultra high molecular weight polyethylene and the characteristic of other resin in a good balance can also be obtained by combining ultra high molecular weight polyethylene and other resin. Further, as described above, even if other resins are included in addition to ultrahigh molecular weight polyethylene, the handling property is high and the moldability can be improved.

Other resins can be appropriately selected according to the properties imparted to the ultra high molecular weight polyethylene. Examples of such other resins include addition polymerization resins [for example, olefin resins (poly α-C _2-10 olefins such as polyethylene, polypropylene, polymethylpentene, etc.), amorphous polyolefin resins (low Amorphous polyolefins such as density polyethylene, cyclic olefins such as cyclopentadiene resins and norbornene resins, etc.), vinyl resins (polyvinyl chloride, vinyl acetate resins, etc.), aromatic vinyl resins [polystyrene, syndiotactic Tic polystyrene, acrylonitrile-styrene resin, styrene-methyl methacrylate resin, acrylonitrile-butadiene-styrene copolymer (ABS resin), etc.], acrylic resin (for example, polymethyl methacrylate, (meth) acrylic acid- (meth)) Acrylic ester (Meth) acrylic monomers alone or copolymers, methyl methacrylate-styrene copolymers, etc.), fluororesins (eg, polytetrafluoroethylene), thermoplastic elastomers (eg, styrene thermoplastics) Elastomers, olefinic thermoplastic elastomers, etc.), condensation polymerization resins [eg, polycarbonate resins (eg, bisphenol A polycarbonate), polyester resins (eg, poly C such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc.) _2-10 alkylene arylate, poly cyclohexane dimethylene terephthalate, these copolyesters, polyarylate resins, liquid crystal polyester, etc.), polyacetal resin, polyamide resin, polysulfone resin Poly (thio) ether resins, such as polybenzimidazole can be exemplified. These other resins may be used alone or in combination of two or more.

  In particular, other resins include polypropylene resins, polyamide resins (for example, polyamide 6, polyamide 66, polyamide 46, polyamide 6T, polyamide 9T, polyamide 11, polyamide 12, polyamide MXD, etc.), polyester resins [for example, polyethylene Polyalkylene arylates such as terephthalate, polybutylene terephthalate and polyethylene naphthalate, polycyclohexanedimethylene terephthalate, reinforced polyethylene terephthalate, polyarylate resins (polycondensates of bisphenols such as bisphenol A and aromatic dicarboxylic acids such as phthalic acid, etc. ), Liquid crystal polyester, etc.], polyacetal resin (polyoxymethylene homo or copolymer, etc.), polycarbonate resin (for example, bisphenol A type Carbonate resin)), poly (thio) ether resin [for example, polyphenylene ether resin (for example, polyphenylene ether, modified polyphenylene ether, etc.), polysulfide resin (polyphenylene sulfide, polybiphenylene sulfide, etc.), etc.], polysulfone resin ( For example, polysulfone, polyethersulfone, etc.), polyketone resins (polyetherketone, polyetheretherketone, polyphenylene sulfide ketone, etc.), polyimide resins (eg, polyimide, polyetherimide, polyamideimide, etc.), and fluorine resins. It may be at least one resin (A) selected from (for example, polytetrafluoroethylene). Such a resin is advantageous in that it improves the heat resistance of the resin composition of the present invention. The resin composition of the present invention has low melt fluidity, and even if it is a resin that is difficult to mold or poor in moldability, it can efficiently improve the fluidity of the resin, and thus the moldability. Very useful.

  Particularly preferred other resins (or resin (A)) include polypropylene resins. For this reason, the other resin may be composed of at least a polypropylene resin. Examples of polypropylene resins include polypropylene (or propylene homopolymer), copolymers of propylene and other copolymerizable monomers (for example, propylene-ethylene copolymer, propylene-butene-1 copolymer, propylene- Propylene-α-olefin copolymers such as ethylene-butene-1 copolymer). In the propylene-α-olefin copolymer, the proportion of propylene is 70% by weight or more (for example, about 75 to 99.5% by weight), preferably 80% by weight or more (for example, 85 to 85%) with respect to the whole monomer. About 99% by weight).

  Polypropylene resins may be used alone or in combination of two or more. Moreover, you may combine polypropylene resin and other resin other than polypropylene resin.

  In the resin composition of the present invention, the ratio of ultrahigh molecular weight polyethylene to other resin (for example, resin (A) such as polypropylene resin) is, for example, the former / the latter (weight ratio) = 99/1 to 1/1 / 99 (e.g. 99/1 to 30/70), preferably 97/3 to 40/60, more preferably 95/5 to 50/50, especially 90/10 to 60/40 (e.g. 90/10 to 70). / 30) degree may be sufficient.

  When the resin composition of the present invention contains other resins, the proportion of polysilane is based on 100 parts by weight of the total amount of ultrahigh molecular weight polyethylene and other resins (for example, resin (A) such as polypropylene resin). In the range of 0.05 to 60 parts by weight, for example, 0.05 to 40 parts by weight (for example, 0.1 to 30 parts by weight), preferably 0.2 to 25 parts by weight (for example, 0. 3 to 20 parts by weight), more preferably 0.5 to 15 parts by weight (for example, 1 to 12 parts by weight), particularly about 1 to 10 parts by weight, usually about 0.1 to 50 parts by weight. There may be.

  The resin composition of the present invention further contains conventional additives such as flame retardants, fillers, stabilizers (for example, antioxidants, ozone degradation inhibitors, ultraviolet absorbers, light stabilizers), plastics, and the like. You may mix | blend additives, such as an agent, a softening agent, surfactant, a lubricant, a mold release agent, an antistatic agent, and a coloring agent suitably. These additives may be used alone or in combination of two or more.

  As described above, in the present invention, the mechanical strength (for example, tensile strength) can be improved by adding polysilane to ultra high molecular weight polyethylene (and other resins such as polypropylene resin). Therefore, in the present invention, polysilane is added to a resin system containing at least ultra high molecular weight polyethylene (for example, a resin composition composed of ultra high molecular weight polyethylene, ultra high molecular weight polyethylene and other resins), and the resin system Also included is a method for improving the mechanical strength (such as tensile strength).

  The resin composition can be prepared by mixing ultrahigh molecular weight polyethylene and polysilane (if necessary, with other components such as other resins such as the polypropylene resin) by a conventional method. For example, the resin composition may be prepared by melt-mixing a pellet-like resin (ultra high molecular weight polyethylene, ultra high molecular weight polyethylene and other resins) and the polysilane.

  Since the resin composition of the present invention contains polysilane, it is improved in melt fluidity despite being composed of ultrahigh molecular weight polyethylene. For this reason, the molded product (resin molded product) of the present invention is obtained by using the resin composition by a molding method involving melting (for example, an injection molding method, an injection compression molding method, an extrusion molding method, a blow molding method, etc.). It can be formed by molding. In particular, in the present invention, the melt fluidity is improved, and even molding methods such as injection molding and blow molding can be used. And can be formed efficiently. In addition, as a shape of a molded object, a two-dimensional structure (a film, a sheet | seat, a plate, etc.), a three-dimensional structure (for example, a pipe | tube, a rod, a tube, leather, a hollow article, etc.), etc. are mentioned.

  Since the resin composition of the present invention contains polysilane, it has characteristics (such as impact resistance) of ultrahigh molecular weight polyethylene and is improved in mechanical strength (such as tensile strength). In addition, the addition of polysilane can improve the compatibility between ultrahigh molecular weight polyethylene and other resins. Therefore, in addition to ultrahigh molecular weight polyethylene, other resins (such as polypropylene resins) can be used as the resin component. A polymer blend having the characteristics of both resins can be obtained efficiently. Furthermore, the addition of polysilane can also improve the handling properties of resin systems containing ultrahigh molecular weight polyethylene (and other resins) that are usually poor in moldability.

  Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.

(Comparative Example 1)
Ultra high molecular weight polyethylene (manufactured by Mitsui Chemicals, Inc., viscosity average molecular weight (Mv) 4 million) using “LABO PLASTOMILL 50M” manufactured by Toyo Seiki Seisakusho under the conditions of a kneading temperature of 200 ° C. and a rotation speed of 60 rpm. A sample was obtained by melt-kneading for 20 minutes.

Example 1
Linear polymethylphenylsilane (Osaka Gas Co., Ltd., weight average molecular weight (Mw) 500 per 100 parts by weight of ultra high molecular weight polyethylene (Mitsui Chemicals, Inc., viscosity average molecular weight (Mv) 4 million) ) A composition containing 5 parts by weight was melt-kneaded for 20 minutes under the conditions of a kneading temperature of 200 ° C. and a rotation speed of 60 rpm using “LABO PLASTOMILL 50M” manufactured by Toyo Seiki Seisakusho Co., Ltd. to obtain a sample.

(Comparative Example 2)
For 100 parts by weight of ultrahigh molecular weight polyethylene (Mitsui Chemicals, Inc., viscosity average molecular weight (Mv) 4 million), thermoplastic elastomer (JSR, density 0.88 g / cm ³ , glass transition temperature 52 C.) A composition containing 5 parts by weight was melt-kneaded for 20 minutes under the conditions of a kneading temperature of 200 ° C. and a rotation speed of 60 rpm using “LABO PLASTOMILL 50M” manufactured by Toyo Seiki Seisakusho Co., Ltd. to obtain a sample.

(Example 2)
90 parts by weight of ultra high molecular weight polyethylene (manufactured by Mitsui Chemicals, Inc., viscosity average molecular weight (Mv) 4 million), 10 parts by weight of polypropylene (manufactured by PRIME POLYMER, weight average molecular weight (Mw) 180,000), and linear poly A composition containing 5 parts by weight of methylphenylsilane (manufactured by Osaka Gas Co., Ltd., weight average molecular weight (Mw) 500) was mixed at a kneading temperature of 200 ° C. using “LABO PLASTOMILL 50M” manufactured by Toyo Seiki Seisakusho Co., Ltd. A sample was obtained by melt-kneading for 20 minutes under the condition of a rotational speed of 60 rpm.

(Comparative Example 3)
90 parts by weight of ultra high molecular weight polyethylene (manufactured by Mitsui Chemicals, Inc., viscosity average molecular weight (Mv) 4 million), 10 parts by weight of polypropylene (manufactured by PRIME POLYMER, weight average molecular weight (Mw) 180,000), thermoplastic elastomer ( A composition containing 5 parts by weight of JSR Corp., density 0.88 g / cm ³ , glass transition temperature 52 ° C.) is kneaded at 200 ° C. using “LABO PLASTOMILL 50M” manufactured by Toyo Seiki Seisakusho. And it melt-kneaded for 20 minutes on the conditions of rotation speed 60rpm, and obtained the sample.

(Example 3)
80 parts by weight of ultra high molecular weight polyethylene (manufactured by Mitsui Chemicals, Inc., viscosity average molecular weight (Mv) 4 million), 20 parts by weight of polypropylene (manufactured by PRIME POLYMER, weight average molecular weight (Mw) 180,000), and linear poly A composition containing 5 parts by weight of methylphenylsilane (manufactured by Osaka Gas Co., Ltd., weight average molecular weight (Mw) 500) was mixed at a kneading temperature of 200 ° C. using “LABO PLASTOMILL 50M” manufactured by Toyo Seiki Seisakusho Co., Ltd. A sample was obtained by melt-kneading for 20 minutes under the condition of a rotational speed of 60 rpm.

(Comparative Example 4)
80 parts by weight of ultra high molecular weight polyethylene (manufactured by Mitsui Chemicals, Inc., viscosity average molecular weight (Mv) 4 million), 20 parts by weight of polypropylene (manufactured by PRIME POLYMER, weight average molecular weight (Mw) 180,000), thermoplastic elastomer ( A composition containing 5 parts by weight of JSR Corp., density 0.88 g / cm ³ , glass transition temperature 52 ° C.) is kneaded at 200 ° C. using “LABO PLASTOMILL 50M” manufactured by Toyo Seiki Seisakusho. And it melt-kneaded for 20 minutes on the conditions of rotation speed 60rpm, and obtained the sample.

Example 4
70 parts by weight of ultra high molecular weight polyethylene (manufactured by Mitsui Chemicals, Inc., viscosity average molecular weight (Mv) 4 million), 30 parts by weight of polypropylene (manufactured by PRIME POLYMER, weight average molecular weight (Mw) 180,000), and linear poly A composition containing 5 parts by weight of methylphenylsilane (manufactured by Osaka Gas Co., Ltd., weight average molecular weight (Mw) 500) was mixed at a kneading temperature of 200 ° C. using “LABO PLASTOMILL 50M” manufactured by Toyo Seiki Seisakusho Co., Ltd. A sample was obtained by melt-kneading for 20 minutes under the condition of a rotational speed of 60 rpm.

(Comparative Example 5)
70 parts by weight of ultrahigh molecular weight polyethylene (Mitsui Chemicals, Inc., viscosity average molecular weight (Mv) 4 million), 30 parts by weight of polypropylene (manufactured by PRIME POLYMER, weight average molecular weight (Mw) 180,000), thermoplastic elastomer ( A composition containing 5 parts by weight of JSR Corp., density 0.88 g / cm ³ , glass transition temperature 52 ° C.) is kneaded at 200 ° C. using “LABO PLASTOMILL 50M” manufactured by Toyo Seiki Seisakusho. And it melt-kneaded for 20 minutes on the conditions of rotation speed 60rpm, and obtained the sample.

  And about the kneading | mixing sample obtained by the Example and the comparative example, the heat-deformation temperature, impact strength, and tensile breaking elongation were measured. The measurement was performed by the following method.

(1) Thermal deformation temperature measurement Using a thermal deformation temperature measuring device “S3-FH” (manufactured by Toyo Seiki Seisakusho Co., Ltd.), measurement temperature 40 to 100 ° C., load 4.51 × 10 ⁻¹ MPa, test piece dimensions Width It was measured at 12.7 mm x length 110 mm x thickness 3.2 mm. The thermal deformation temperature was the temperature at which the deformation amount reached 0.26 mm.

(2) Impact strength measurement Using a Charpy impact tester (manufactured by Yasuda Seiki Seisakusho Co., Ltd.), hammer weigh 1J, specimen temperature -150 ° C, specimen dimensions width 10mm x length 90mm x thickness 3mm, notch width 2mm Measured with

(3) Tensile break elongation measurement Using a tensile tester “EZ Test” (manufactured by Shimadzu Corporation), measurement was performed in a strip shape having a measurement temperature of room temperature, a tensile speed of 30 mm / min, a distance between chucks of 20 mm, and a specimen shape width of 5 mm. did.

  The results are shown in Table 1, Table 2, and Table 3.

  As apparent from the above results, when polysilane was added to ultrahigh molecular weight polyethylene, the tensile strength could be greatly improved while maintaining the impact resistance. In addition, when polysilane was used, the impact resistance and tensile strength of the polymer blend of ultrahigh molecular weight polyethylene and polypropylene could be maintained as compared with the case where a general-purpose compatibilizer was used. Furthermore, it has been found that the heat resistance can be improved without impairing the high impact resistance and high mechanical strength of the ultrahigh molecular weight polyethylene as much as possible.

Claims (10)

A resin composition composed of ultrahigh molecular weight polyethylene and polysilane ,
A resin composition, wherein the polysilane has a structural unit represented by the following formula (1) and is a linear polysilane that is liquid at 15 to 25 ° C.

Wherein R ^{1 and} R ² are the same or different and each represents a hydrogen atom, a hydroxyl group, an alkyl group, an alkenyl group, a cycloalkyl group, a cycloalkenyl group, an aryl group, or an aralkyl group, and x is 2 or more Indicates an integer.) Polysilane, R ¹ and R ² in at least one of the resin composition according to claim 1, wherein is composed of polysilane having the structural unit (1) is an aryl group. Polysilane, R ¹ is an aryl group, and R ² is an alkyl group or a structural unit (1) resin composition according to claim 1, wherein is composed of polysilane having an aryl group. Polysilane resin composition according to claim 1, wherein a polysilane having an average polymerization degree of 2 to 10.   The resin composition according to claim 1, wherein the ratio of polysilane is 0.1 to 50 parts by weight with respect to 100 parts by weight of ultrahigh molecular weight polyethylene.   Furthermore, at least one selected from polypropylene resin, polyamide resin, polyester resin, polyacetal resin, polycarbonate resin, poly (thio) ether resin, polysulfone resin, polyketone resin, polyimide resin, and fluorine resin The resin composition according to claim 1, comprising a seed resin (A). The resin composition according to claim 6 , wherein the resin (A) is composed of at least a polypropylene resin. The ratio between the ultrahigh molecular weight polyethylene and the resin (A) is the former / the latter (weight ratio) = 95/5 to 50/50, and the ratio of polysilane is the total amount of the ultrahigh molecular weight polyethylene and the resin (A) is 100. The resin composition according to claim 6, which is 0.1 to 50 parts by weight with respect to parts by weight. A method of improving the tensile elongation at break of the resin system by adding the polysilane according to claim 1 to a resin system that is an ultrahigh molecular weight polyethylene or a resin composition composed of ultrahigh molecular weight polyethylene and another resin .   The molded object formed with the resin composition of Claim 1.