JP4921316B2 - Work storage / conveyance device and cutting device including the work storage / conveyance device - Google Patents

Description

  The present invention relates to a workpiece storage and conveyance device for storing a workpiece such as a semiconductor wafer and a cutting apparatus including the workpiece storage and conveyance device.

  A semiconductor wafer in which a number of devices such as IC and LSI are formed on the surface, and each device is partitioned by a line to be divided (street), the back surface is ground by a grinding machine and processed to a predetermined thickness. A division line is cut by a dicing machine (cutting machine) and divided into individual devices, which are used for electric devices such as mobile phones and personal computers.

  The cutting apparatus includes a cassette mounting mechanism having a cassette mounting table for mounting a cassette containing a semiconductor wafer, and an inspection wafer that is disposed below the cassette mounting mechanism and stores a single semiconductor wafer to be inspected. And a storage unit.

  The cutting apparatus further includes a wafer transport mechanism for unloading and loading a semiconductor wafer stored in a cassette or a wafer storage unit for inspection, a chuck table for holding a semiconductor wafer unloaded by the wafer transport mechanism, and a chuck table. And a cutting mechanism for cutting the semiconductor wafer (see, for example, JP-A-2006-74004).

  A wafer storage unit for inspection is opened on both the wafer transport mechanism side and the operator side, and when the operator takes out the semiconductor wafer, a mechanism is also proposed in which the semiconductor wafer is slid out to the operator side (for example, Patent No. 1). No. 2997766).

  In the inspection wafer storage section having such a mechanism, the operator can easily take out the inspection semiconductor wafer by sliding the slide mechanism on which the semiconductor wafer in the inspection wafer storage section is placed to the operator side. .

After the inspection is completed, the semiconductor wafer is again placed on the slide mechanism and slid into the inspection wafer storage portion, so that the inspection semiconductor wafer can be easily stored in the inspection wafer storage portion.
JP 2006-74004 A Japanese Patent No. 2997766 Utility Model Registration No. 3122771

  However, when storing the inspected semiconductor wafer in the inspection wafer storage section using the slide mechanism, when the operator presses the slide mechanism strongly, the wafer often jumps out to the transport mechanism side with the momentum in the front-rear direction when sliding. May end up.

  If the semiconductor wafer jumps out to the transport mechanism in this way, there is a risk of colliding with the semiconductor wafer when the cassette mounting mechanism or the transport mechanism moves up and down. For this reason, as disclosed in Patent Document 1, a means for detecting the protrusion of the inspection wafer is provided, or a step to be abutted on the wafer mounting portion is provided so that the inspection wafer does not protrude. Measures are being taken.

  In Patent Document 1, when a wafer transport mechanism carries a semiconductor wafer out of a wafer storage unit for inspection, a clamp of the transport mechanism clamps an annular frame on which the semiconductor wafer is mounted via a dicing tape, and lifts the annular frame. Thus, a method is adopted in which the annular frame is pulled out in the direction of the transport mechanism over the step.

  However, when the annular frame clamped by the clamp is warped upward (especially, the larger the wafer diameter, the larger the warp angle becomes). The ring frame could not get over the level difference only by the lifting amount, and a conveyance error occurred.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a work storage and transport device that can securely store a work in a work storage unit and prevent a work transfer error. Is to provide.

According to the present invention, a first workpiece storage unit that stores a plurality of workpieces, a second workpiece storage unit disposed at a lower portion of the first workpiece storage unit, the first workpiece storage unit, and the Elevating means for simultaneously elevating and lowering the second workpiece storage portion; and workpiece transfer means for transferring the workpiece substantially horizontally with respect to the first workpiece storage portion or the second workpiece storage portion; The work storage unit includes a frame having a first carry-in opening opened on the work transfer means side and a second carry-in opening opened on the operator side, and a work load that can be slid out of the second carry-in opening. A table, two parallel drawer slide rails each having one end fixed to the workpiece mounting table and the other end fixed to the frame, and vertically penetrating through the bottom of the workpiece mounting table. Little biased upward by a spring A positioning pin for positioning the workpiece relative to Kutomo one of said workpiece mounting table, and a guide means disposed on the bottom of the cuts can be the frame of the positioning pin engages to the positioning pins When the workpiece mounting table is pulled more than a certain position into the frame body, the guide means engages with the positioning pin and pulls the positioning pin down to a predetermined position. Is provided.

  Preferably, each of the drawer slide rails includes a spring that urges the workpiece mounting table in a direction in which the workpiece mounting table is pulled into the frame body, and the spring extends in a state where the drawer slide rail is pulled out to a predetermined position against the spring. Locking means for locking at the position, unlocking means for releasing the locking means when the work mounting table is pushed to the frame body to a predetermined position, and the biasing force of the spring after the lock is released Buffering means for buffering the speed at which the workpiece mounting table is automatically pulled into the frame body is provided.

  Preferably, the positioning pin has a large-diameter head at the lower end, and the guide means has a guide groove into which the positioning pin is inserted, and an inclined surface with which the head of the positioning pin can be engaged. The positioning pin is gradually pulled down to the predetermined position by inserting the head into the guide groove while engaging the inclined surface of the guide means.

  According to the present invention, it is possible to reliably prevent the workpiece from protruding from the second workpiece storage portion, and it is not necessary to provide a step in the second workpiece storage portion. It is possible to prevent the transport error that has been caused.

  In addition, when the work mounting table using the drawer slide rail is closed to the frame body side, the speed of being automatically drawn into the frame body by the buffer means of the drawer slide rail is reduced even if it is closed forcefully, and unnecessary vibration and noise and Dust generation due to collision of parts can be suppressed, and even if it is closed with a weak force, it can be securely closed by the spring of the drawer slide rail.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, there is shown an external perspective view of a cutting device (dicing device) 2 to which the workpiece storage and conveyance device of the present invention can be applied.

  The cutting device 2 includes a first wafer storage unit 4 that is a first work storage unit shown in FIG. 2, a second wafer storage unit 6 that is a second work storage unit, and a first wafer transport. Means 10, second wafer conveying means 12, wafer guide rail 14, chuck table 16, cutting means 18, and cleaning means 20 are provided.

  The first wafer transport means 10 unloads the wafer from the first wafer storage unit 4 or the second wafer storage unit 6 and transports the transferred wafer to the chuck table 16. Further, the wafer cleaned by the cleaning means 20 is carried into the first wafer storage unit 4 or the second wafer storage unit 6 again.

  The first wafer transport means 10 includes a wafer support main body portion 22, a clamp mechanism 24 for clamping the wafer, a suction portion 26, a vertical movement member 28, a horizontal movement member 30, and a vertical movement member that move in the vertical direction. And an air cylinder 32, a ball screw 36 with which a horizontally moving member is engaged, and a motor 38 for driving the ball screw 36.

  The clamp mechanism 24 of the first wafer transport means 10 clamps and removes the wafer from the first wafer storage unit 4 or the second wafer storage unit 6 and places the wafer on the pair of wafer guide rails 14.

  Next, after the clamp mechanism 24 is rotated to the top of the wafer support main body 22, the motor 38 is driven to move the wafer support main body 22 to the chuck table 16 in the Y-axis direction, and the air cylinder 32 is operated. To move vertically.

  Next, after the wafer is adsorbed by the adsorbing portion 26, the pair of wafer guide rails 14 is opened in a direction away from each other, the wafer is placed on the chuck table 16, and the wafer is adsorbed by the chuck table 16.

  The second wafer transfer means 12 is for transferring the cut wafer from the chuck table 16 to the cleaning means 20. The second wafer transport means 12 includes a wafer support main body portion 40, a suction portion 42, a vertical movement member 44, a horizontal movement member 46, an air cylinder 48 that moves the vertical movement member 44 in the vertical direction, and a horizontal movement. A ball screw 50 with which the member 46 engages and a motor 52 for driving the ball screw 50 are provided.

  The chuck table 16 is movable in the X-axis direction by the chuck table moving mechanism 58 and is placed on the chuck table support member 54. The chuck table moving mechanism 58 includes a base 56, a pair of guide rails 60 mounted on the base 56, a ball screw 62, and a motor 64 that drives the ball screw 62.

  The cutting means 18 is disposed on the chuck table 16 moved in the X-axis direction by the chuck table moving mechanism 58. The cutting means 18 includes a spindle 66 rotated by a motor (not shown) and a cutting blade 68 attached to the spindle 66.

  The cutting means 18 is fixed to a bracket 72, and the bracket 72 is moved in the vertical direction along a pair of guide rails 76 fixed to a horizontal moving block 74 by a vertical moving mechanism 70 including a ball screw 78 and a motor 80. The

  On the other hand, the horizontal movement block 74 is moved in the horizontal direction by a horizontal movement mechanism 84 including a ball screw 88 and a motor 90 along a pair of guide rails 86 fixed to the support member 82.

  As best shown in FIG. 2, the first wafer storage unit 4 includes a cassette mounting table 5 and a wafer cassette 7 mounted on the cassette mounting table 5. A plurality of wafer mounting grooves 9 for mounting a semiconductor wafer mounted on the annular frame via a dicing tape are formed.

  The second wafer storage section 6 is provided in the lower part of the first wafer storage section 4 and has a first carry-in opening opened on the wafer transfer means side and a second carry-in opening opened on the operator side. The frame body 11 includes a shape frame 11 and a wafer mounting table 13 that can be inserted into and removed from the frame body 11.

  Two engaging projections 23 are formed on the top plate 11 a of the frame 11, and the lower surface of the wafer mounting table 5 of the first wafer storage portion 4 is engaged with these engaging projections 23. A concave portion is formed, and the first wafer storage portion 4 is stably placed on the second wafer storage portion 6 by engaging the engaging protrusion 23 with the engagement concave portion of the wafer mounting table 5. The

  Two frame mounting portions (frame mounting rails) 17 that are parallel to each other are provided on the bottom surface of the wafer mounting table 13 that can be pulled out of the second wafer storage unit 6. An annular frame 19 is placed on these frame placement portions 17.

  Although not particularly shown, a semiconductor wafer is mounted on the annular frame 19 via a dicing tape. The second wafer storage unit 6 is an inspection wafer storage unit, and the semiconductor wafer mounted on the annular frame 19 is an inspection semiconductor wafer cut by the cutting device 2.

  The wafer mounting table 13 is attached to the frame body 11 by a pair of drawer slide rails 15 so as to be able to be put in and out. Reference numeral 21 denotes a handle for pulling out the wafer mounting table 13.

  The elevating means 25 is an elevator-like mechanism, and can elevate and lower the first wafer storage unit 4 and the second wafer storage unit 6 simultaneously. The elevating means 25 includes a support member 27, a ball screw 29, a motor 31 for rotationally driving the ball screw 29, and a belt 33 that connects the motor 31 and the drive pulley 35.

  A frame positioning pin 92 penetrating through the bottom of the wafer mounting table 13 and urged upward by a loosely fitted spring described later is provided. A guide block 94 that engages with the frame positioning pin 92 is fixed to the bottom of the frame body 11.

  As shown in FIG. 3, the guide block 94 includes a guide groove 96 into which the frame positioning pin 92 is inserted, an inclined surface 94a with which the head of the frame positioning pin 92 is engaged, and an upper surface that pulls the frame positioning pin 92 down to a predetermined position. Parallel engagement surfaces 94b are formed. The guide block 94 is fixed to the bottom surface of the frame body 11 with screws 98.

  Next, the configuration of the drawer slide rail 15 will be described with reference to FIGS. 4A is a side view of the drawer slide rail 15, and FIG. 4B is a plan view thereof. The drawer slide rail 15 includes a fixed rail 100 fixed to the frame 11 of the second wafer storage unit 6, a first slide rail 102 slidable with respect to the fixed rail 100, and the first slide rail 102. The second slide rail 104 is slidable.

The fixed rail 100 is fixed to the inner side surface of the frame 11 with screws 106, and the second slide rail 104 is fixed to the side surface of the wafer mounting table 13 with screws 108 .

  Referring to FIG. 5, an exploded perspective view of the biasing buffer mechanism 110 of the drawer slide rail 15 is shown. The details of the urging buffer mechanism of the drawer slide rail are disclosed in Patent Document 3.

  A slide base 111 of the urging buffer mechanism 110 is fixed to the fixed rail 100 and has a hydraulic cylinder storage portion 112 and a slide groove 118 extending in the longitudinal direction. A hydraulic cylinder 114 having a piston rod 116 is stored in the hydraulic cylinder storage portion 112.

  Guide grooves 120 are formed on both side surfaces of the slide base 111 along the slide grooves 118. A front end portion (right end portion in FIG. 5) 120a of the guide groove 120 is formed in a bent portion that bends downward.

  Reference numeral 122 denotes a slide block, which has a pair of protrusions 124 fitted into the guide groove 120 and an engaging portion 126. Reference numeral 132 denotes a slide lock member. As shown in FIG. 6, two pairs of engagement protrusions 134 that engage with the engagement portions 126 of the slide block 122 and the guide grooves 120 of the slide base 111 are fitted. Protrusions 136 and 138 are provided.

  The slide lock member 132 further includes an unlocking protrusion 140 having an abutment surface 140a with which an engagement piece 105 (see FIG. 4) fixed to the second slide rail 104 abuts, and when the drawer slide rail 15 is pulled out, the second slide. A first engagement protrusion 142 that engages with the engagement piece 105 of the rail 104 and a second engagement member that engages with an engagement hole formed in the bottom surface of the fixed rail 100 when the slide lock member 132 is pulled out to a predetermined position. The engaging projection 144 and a fitting portion 146 into which the engaging piece 105 of the second slide rail 104 is fitted are provided.

  The tip of the piston rod 116 of the hydraulic cylinder 114 is fixed to the slide block 122, one end 128 a of the coil spring 128 is engaged with the engagement groove 130 of the slide base 110, and the other end 128 b is engaged with the protrusion 124 of the slide block 122. The engagement protrusion 134 of the slide lock member 132 is engaged with the engagement portion 126 of the slide block 122 and integrated, and the two pairs of protrusions 136 and 138 of the slide lock member 132 are integrated with the guide groove 120 of the slide base 110. The biasing buffering mechanism 110 is assembled by inserting it inside.

  Next, an outline of the operation of the bias buffer mechanism 110 will be described with reference to FIGS. 4 and 7. In a state where the wafer mounting table 13 is stored in the frame body 11, the engagement piece 105 of the second slide rail 104 is in a state of being fitted to the fitting portion 146 of the slide lock member 132.

  From this state, when the handle 21 is grasped and the wafer mounting table 13 is pulled out from the inside of the frame body 11, the slide blocks 122 are engaged with each other while the engagement pieces 105 are engaged with the first protrusions 142 of the slide lock member 132. Since the slide lock member 132 is pulled out, the coil spring 114 is gradually extended.

  When the wafer mounting table 13 is pulled out to a predetermined position, the second engagement protrusion 144 of the slide lock member 132 engages with an engagement hole formed on the bottom surface of the fixed rail 100. Due to this engagement, the second engagement protrusion 144 falls into the engagement hole, so that the height of the first engagement protrusion 142 is lowered, and when the wafer mounting table 13 is further pulled by the handle 21, the second slide rail 104 is pulled. Since the engagement piece 105 and the first protrusion 142 of the slide lock member 132 are disengaged and the urging force of the coil spring 128 is lost, the wafer mounting table 133 is pulled out fully.

  In this state, the dicing state of the cut inspection semiconductor wafer mounted on the annular frame 19 via the dicing tape is inspected. At this time, since the second protrusion 144 of the slide lock member 132 is engaged with the engagement hole of the fixed rail 100, the biasing buffering mechanism 110 is locked with the coil spring 128 extended.

  As shown in FIG. 7A, the frame positioning pin 92 for positioning the annular frame 19 on the wafer mounting table 13 has a large-diameter head 92a and a stopper 150 fixed to the pin 92. The frame positioning pin 92 is always biased upward by loosely fitting the coil spring 152 between the stopper 150 and the bottom surface of the wafer mounting table 13.

  In the state where the inspection of the semiconductor wafer is completed and the wafer mounting table 13 is pushed in, as shown in FIG. 7A, the frame positioning pin 92 protrudes upward from the frame mounting portion 17. Since the frame positioning pin 92 acts as a stopper in the annular frame 19 shown in FIG. 2, even if the wafer mounting table 13 is pushed in vigorously, the semiconductor wafer mounted on the annular frame 19 is not in the second wafer storage portion 6. Never jump out of it.

  When the wafer mounting table 13 is pushed to a predetermined position, the engagement piece 105 of the second slide rail 104 comes into contact with the contact surface 140a of the lock release protrusion 140 of the slide lock member 132 and the lock release protrusion 140 is pushed in. The engagement between the second engagement projection 144 of the slide lock member 132 and the engagement hole of the fixed rail 100 is released.

  As a result, the wafer mounting table 13 is automatically pulled into the frame 11 by the urging force of the coil spring 128, but its moving speed is buffered by the buffering action of the hydraulic cylinder 114, so that the wafer mounting table 13 is very It is slowly pulled into the frame 11.

  At this time, in the state shown in FIG. 7B, since the frame positioning pin 92 does not come into contact with the guide block 94, the frame positioning pin 92 protrudes upward from the frame mounting portion 17 and functions as a stopper. Yes.

  As shown in FIG. 7C, when the wafer mounting table 13 is further pulled and the head portion 92a of the frame positioning pin 92 is engaged with the inclined surface 94a of the guide block 94, the frame positioning pin 92 is gradually pulled down.

  When the wafer mounting table 13 is fully pushed into the frame 11, the head 92a of the frame positioning pin 92 engages with the engaging surface 94b of the guide block 94 as shown in FIG. The positioning pin 92 is pulled down to a position retracted from the upper surface of the frame mounting portion 17.

  Therefore, in this state, as shown in FIG. 8 (A), the clamp mechanism 24 of the first wafer transport means 10 is moved closer to the second wafer storage portion 6 and is movable as shown in FIG. 8 (B). The clamp claw 24b is moved relative to the fixed clamp claw 24a, and the annular frame 19 is clamped by the clamp mechanism 24.

  Since the frame positioning pin 92 is pulled down from the upper surface of the frame mounting portion 17 by the guide block 94, the annular frame 19 is moved by the clamp mechanism 24 without the frame positioning pin 92 interfering as shown in FIG. The second wafer storage unit 6 can be easily pulled out.

It is an external appearance perspective view of the cutting device provided with the workpiece | work storage conveyance apparatus of this invention. It is a partially exploded perspective view which shows the 1st and 2nd wafer storage part and the raising / lowering means. It is a perspective view of a guide block. 4A is a side view of the drawer slide rail, and FIG. 4B is a plan view thereof. It is a disassembled perspective view of an urging buffer mechanism. It is a side view of a slide lock member. FIG. 7A to FIG. 7D are side sectional views for explaining the operation of the present embodiment. FIG. 8A to FIG. 8C are side cross-sectional views illustrating the carry-out state of the annular frame according to the present embodiment.

Explanation of symbols

2 Cutting device 4 1st wafer storage part 6 2nd wafer storage part 10 1st wafer conveyance means 11 Frame 12 2nd wafer conveyance means 13 Wafer mounting table 14 Wafer guide rail 15 Drawer slide rail 16 Chuck table 17 Frame mounting portion 18 Cutting means 19 Annular frame 20 Cleaning means 25 Elevating means (elevating mechanism)
66 Spindle 68 Cutting blade 92 Frame positioning pin 94 Guide block 100 Fixed rail 102 First slide rail 104 Second slide rail 110 Energizing buffer mechanism 111 Slide base 114 Hydraulic cylinder 122 Slide block 128 Coil spring 132 Slide lock member

Claims (4)

A first workpiece storage section for storing a plurality of workpieces;
A second workpiece storage portion disposed at a lower portion of the first workpiece storage portion;
Elevating means for simultaneously elevating and lowering the first work storage unit and the second work storage unit;
A workpiece transfer means for transferring the workpiece substantially horizontally with respect to the first workpiece storage portion or the second workpiece storage portion;
The second work storage unit has a frame having a first carry-in opening that opens on the work transfer means side and a second carry-in opening that opens on the operator side, and slides out from the second carry-in opening. A possible workpiece mounting table, two parallel drawer slide rails each having one end fixed to the workpiece mounting table and the other end fixed to the frame, and vertically penetrating through the bottom of the workpiece mounting table. A positioning pin for positioning the workpiece with respect to at least one workpiece mounting table biased upward by a loosely-fitted spring, and the frame body that can engage with the positioning pin and lower the positioning pin Guide means disposed at the bottom of the
When the work mounting table is pulled into the frame body at a certain position or more, the guide means engages with the positioning pin and pulls down the positioning pin to a predetermined position.   Each of the drawer slide rails includes a spring that urges the workpiece mounting table in a direction in which the workpiece mounting table is pulled into the frame, and a position where the spring is extended in a state in which the drawer slide rail is pulled out to a predetermined position against the spring Locking means for locking at a position, unlocking means for releasing the locking means when the work mounting table is pushed into the frame body to a predetermined position, and the work mounting by the urging force of the spring after the lock is released. 2. The workpiece storage and transfer device according to claim 1, further comprising buffer means for buffering a speed at which the mounting table is automatically drawn into the frame. The positioning pin has a large-diameter head at the lower end, and the guide means has a guide groove into which the positioning pin is inserted, and a slope on which the head of the positioning pin can be engaged,
3. The positioning pin according to claim 1, wherein the positioning pin is gradually pulled down to the predetermined position by being inserted into the guide groove while the head is engaged with the inclined surface of the guide means. Work storage and transfer device.   A cutting apparatus comprising the workpiece storage and conveyance device according to any one of claims 1 to 3.

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