JP4905668B2 - Liquid epoxy resin composition for semiconductor encapsulation and semiconductor device - Google Patents
Liquid epoxy resin composition for semiconductor encapsulation and semiconductor device Download PDFInfo
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- JP4905668B2 JP4905668B2 JP2006250188A JP2006250188A JP4905668B2 JP 4905668 B2 JP4905668 B2 JP 4905668B2 JP 2006250188 A JP2006250188 A JP 2006250188A JP 2006250188 A JP2006250188 A JP 2006250188A JP 4905668 B2 JP4905668 B2 JP 4905668B2
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- resin
- epoxy resin
- liquid epoxy
- mass
- resin composition
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- 239000000203 mixture Substances 0.000 title claims description 60
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 title claims description 50
- 239000004065 semiconductor Substances 0.000 title claims description 25
- 238000005538 encapsulation Methods 0.000 title claims description 7
- 239000002245 particle Substances 0.000 claims description 92
- 229920005989 resin Polymers 0.000 claims description 89
- 239000011347 resin Substances 0.000 claims description 89
- 239000003822 epoxy resin Substances 0.000 claims description 33
- 229920000647 polyepoxide Polymers 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 30
- 229920005992 thermoplastic resin Polymers 0.000 claims description 29
- 239000011256 inorganic filler Substances 0.000 claims description 28
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 28
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 17
- 229920002857 polybutadiene Polymers 0.000 claims description 16
- 229920001577 copolymer Polymers 0.000 claims description 14
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 11
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 11
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 11
- 239000000113 methacrylic resin Substances 0.000 claims description 10
- 229920006287 phenoxy resin Polymers 0.000 claims description 10
- 239000013034 phenoxy resin Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
- 229920005990 polystyrene resin Polymers 0.000 claims description 8
- 238000003892 spreading Methods 0.000 claims description 7
- 230000007480 spreading Effects 0.000 claims description 7
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229920002050 silicone resin Polymers 0.000 claims description 6
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 claims description 5
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 claims description 4
- 238000005227 gel permeation chromatography Methods 0.000 claims description 4
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical group OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 claims description 3
- RNIPJYFZGXJSDD-UHFFFAOYSA-N 2,4,5-triphenyl-1h-imidazole Chemical compound C1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 RNIPJYFZGXJSDD-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 37
- 239000000377 silicon dioxide Substances 0.000 description 15
- 238000012360 testing method Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- 238000004381 surface treatment Methods 0.000 description 12
- -1 imidazole compound Chemical class 0.000 description 10
- 238000002156 mixing Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000007423 decrease Effects 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 229910052801 chlorine Inorganic materials 0.000 description 5
- 239000000460 chlorine Substances 0.000 description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 5
- 239000004793 Polystyrene Substances 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 3
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 3
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000012756 surface treatment agent Substances 0.000 description 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- 102100025854 Acyl-coenzyme A thioesterase 1 Human genes 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- 101000720368 Homo sapiens Acyl-coenzyme A thioesterase 1 Proteins 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 2
- 238000002050 diffraction method Methods 0.000 description 2
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZDZYGYFHTPFREM-UHFFFAOYSA-N 3-[3-aminopropyl(dimethoxy)silyl]oxypropan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCN ZDZYGYFHTPFREM-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 229910002014 Aerosil® 130 Inorganic materials 0.000 description 1
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- 229910002018 Aerosil® 300 Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 0 CCC([*-])=NC(N)=C(N)N Chemical compound CCC([*-])=NC(N)=C(N)N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920009204 Methacrylate-butadiene-styrene Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000005998 bromoethyl group Chemical group 0.000 description 1
- WWNGFHNQODFIEX-UHFFFAOYSA-N buta-1,3-diene;methyl 2-methylprop-2-enoate;styrene Chemical compound C=CC=C.COC(=O)C(C)=C.C=CC1=CC=CC=C1 WWNGFHNQODFIEX-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- FSBVERYRVPGNGG-UHFFFAOYSA-N dimagnesium dioxido-bis[[oxido(oxo)silyl]oxy]silane hydrate Chemical compound O.[Mg+2].[Mg+2].[O-][Si](=O)O[Si]([O-])([O-])O[Si]([O-])=O FSBVERYRVPGNGG-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
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- 238000002296 dynamic light scattering Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical group FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
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- 230000009545 invasion Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
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- 238000002360 preparation method Methods 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
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- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
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- 238000005476 soldering Methods 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
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Description
本発明は、半導体封止用液状エポキシ樹脂組成物及びその硬化物にて樹脂封止された半導体装置に関する。 The present invention relates to a liquid epoxy resin composition for semiconductor encapsulation and a semiconductor device encapsulated with a cured product thereof.
従来より、電子部品を回路基板へ実装した混成集積回路装置が知られている。図５は、この混成集積回路装置における電子部品の実装構造を示した断面図である。この図に示されるように、この混成集積回路装置では、リードＪ１が延設された電子部品Ｊ２とパッドＪ３が備えられた回路基板Ｊ４とを用意し、回路基板Ｊ４上に電子部品Ｊ２を搭載したのち、リードＪ１とパッドＪ３とがはんだ等の接合材料Ｊ５を介して接合されるようになっている。 Conventionally, a hybrid integrated circuit device in which electronic components are mounted on a circuit board is known. FIG. 5 is a cross-sectional view showing a mounting structure of an electronic component in this hybrid integrated circuit device. As shown in this figure, in this hybrid integrated circuit device, an electronic component J2 with an extended lead J1 and a circuit board J4 with a pad J3 are prepared, and the electronic component J2 is mounted on the circuit board J4. After that, the lead J1 and the pad J3 are bonded via a bonding material J5 such as solder.
このような混成集積回路装置において、回路基板上の接合材料Ｊ５の耐熱性、熱疲労向上のために、特殊な表面処理を実施することで、高温環境下での合金層の成長を押さえ、強度を確保する（例えば特許文献１：特開２００３−１９８１１６号公報参照）ことが提案されている。
また、リードＪ１と回路基板Ｊ４の隙間に、従来公知のフリップチップ用アンダーフィル材として使用可能な液状エポキシ樹脂組成物を適用する構造においては、はんだを十分に覆うことができないために信頼性に大きな問題が生じる（特許文献２：特許第３７０７５３１号公報）。
In such a hybrid integrated circuit device, a special surface treatment is performed to improve the heat resistance and thermal fatigue of the bonding material J5 on the circuit board, thereby suppressing the growth of the alloy layer in a high temperature environment and improving the strength. (For example, refer to Japanese Patent Application Laid-Open No. 2003-198116).
In addition, in a structure in which a liquid epoxy resin composition that can be used as a conventionally known flip-chip underfill material is applied to the gap between the lead J1 and the circuit board J4, the solder cannot be sufficiently covered, so that reliability is ensured. A big problem arises (Patent Document 2: Japanese Patent No. 3707531).
しかしながら、はんだ接合部の強度確保や寿命の確保のためには、電子部品の端子の表面処理を行ったり、特殊な材料を用いなければならないという問題がある。このため、表面処理を行うという製造工程増加や特殊な材料が必要になるための材料コストの増大により、混成集積回路装置の製造コストが多大になるという問題がある。 However, in order to ensure the strength and life of the solder joint, there is a problem that the surface treatment of the terminals of the electronic component must be performed or a special material must be used. For this reason, there is a problem that the manufacturing cost of the hybrid integrated circuit device increases due to an increase in the manufacturing process of performing the surface treatment and an increase in material cost due to the necessity of a special material.
さらに、近年、はんだ接合材料における鉛（Ｐｂ）フリー化が進められていることから、接合材料として鉛フリーはんだを用いた場合、上記のような手法を採用したとしても、高温環境下での強度劣化やはんだ接合寿命の低下を防止できない可能性がある。 Furthermore, since lead (Pb) -free soldering materials are being promoted in recent years, when lead-free solder is used as the bonding material, the strength in a high-temperature environment can be ensured even if the above method is employed. It may not be possible to prevent deterioration and decrease in solder joint life.
また、樹脂で覆う構造においては、従来の樹脂材料を用いる場合、樹脂の厚みを確保するためには、樹脂の広がり率を０．１以上とすることが重要であるが、従来の材料では、０．１を安定して得ることは難しく、信頼性の上で大きな問題となっていた。 Moreover, in the structure covered with resin, when a conventional resin material is used, in order to ensure the thickness of the resin, it is important to set the spreading ratio of the resin to 0.1 or more. It was difficult to stably obtain 0.1, which was a big problem in terms of reliability.
本発明は、上記事情に鑑みなされたもので、信頼性の高い半導体装置の封止材となり得る液状エポキシ樹脂組成物、及びこの組成物の硬化物で封止された半導体装置を提供することを目的とする。 The present invention has been made in view of the above circumstances, and provides a liquid epoxy resin composition that can be a highly reliable sealing material for a semiconductor device, and a semiconductor device sealed with a cured product of this composition. Objective.
本発明者らは、上記目的を達成するために鋭意検討を重ねた結果、回路基板上に表面実装（以下ＳＭＤという（ＳＭＤ：Ｓｕｒｆａｃｅ Ｍｏｕｎｔ Ｄｅｖｉｃｅ））部品を搭載したのち、回路基板内の回路配線に電気的に接続された複数個のパッドとＳＭＤ部品から引き延ばされた複数本のリードとが接合材料を介して電気的に接続されることで構成されている混成集積回路装置において、少なくともリードとパッドとの電気的接合部を覆うように樹脂部材で封止する第１の構造、或いは少なくともリードと回路基板との間に入り込むように構成された第１樹脂部材と第１樹脂部材の上層に配置されるように構成された第２樹脂部材とで電気的接合部を覆うように樹脂部材で封止する第２の構造について、上記第１の構造の樹脂部材、第２の構造の第２樹脂部材を下記（Ａ）〜（Ｅ）成分を必須成分とする液状エポキシ樹脂組成物の硬化物とすることにより、落下試験や熱衝撃試験など耐久試験に有効で、高信頼性の封止材となること、特に、（Ｃ）成分の硬化促進剤として、下記一般式（１）で表される硬化促進剤を用いたものとすることにより、この液状エポキシ樹脂組成物の硬化物で封止した樹脂部材が、更に落下試験や熱衝撃試験など耐久試験に有効であることを知見した。
なお従来、液状エポキシ樹脂組成物においては、硬化剤として酸無水物が広く用いられている。しかし、酸無水物は吸湿し易いため、硬化前では吸湿による粘度上昇により侵入性がばらついたり途中でとまってしまう現象が見られ、また、未硬化の酸無水物は容易に水を取り込み、硬化後もエステル結合のため加水分解が促進され、吸湿により体積膨張が起こり、リード界面で剥離が発生し抵抗値を増大させてしまうというような信頼性の問題が生じており、そこで本発明者は飽和吸湿量をいかに下げるかが信頼性向上のための重要なファクターの一つと考え、エステル結合よりも加水分解しにくいエポキシ自己縮合（エーテル結合）を持つ樹脂組成物を検討した。この硬化系を用いることによって湿度による特性の劣化、例えば吸水後の接着力低下、吸水後のＴｇ（ガラス転移温度）の低下等を抑えることが可能なものである。
As a result of intensive studies to achieve the above object, the present inventors have mounted surface mount (hereinafter referred to as SMD: Surface Mount Device (SMD)) components on a circuit board, and then circuit wiring in the circuit board. In a hybrid integrated circuit device configured by electrically connecting a plurality of pads electrically connected to each other and a plurality of leads extended from an SMD component via a bonding material, A first structure that is sealed with a resin member so as to cover an electrical joint between the lead and the pad, or at least a first resin member and a first resin member that are configured to enter between the lead and the circuit board. With respect to a second structure that is sealed with a resin member so as to cover the electrical joint portion with the second resin member configured to be disposed in the upper layer, the resin member having the first structure, the second structure By making the second resin member of the structure a cured product of a liquid epoxy resin composition containing the following components (A) to (E) as essential components, it is effective for durability tests such as drop tests and thermal shock tests, and is highly reliable. The liquid epoxy resin composition is cured by using a curing accelerator represented by the following general formula (1) as a curing accelerator for the component (C). It was found that the resin member sealed with an object is further effective for durability tests such as a drop test and a thermal shock test.
Conventionally, acid anhydrides are widely used as curing agents in liquid epoxy resin compositions. However, since acid anhydrides are easy to absorb moisture, before incurring, there is a phenomenon that the invasion property varies due to the increase in viscosity due to moisture absorption or stops in the middle, and uncured acid anhydrides easily take in water and cure. Later, hydrolysis was promoted due to the ester bond, volume expansion occurred due to moisture absorption, peeling occurred at the lead interface, and the resistance problem was increased. Considering how to reduce the saturated moisture absorption is one of the important factors for improving the reliability, a resin composition having an epoxy self-condensation (ether bond), which is harder to hydrolyze than an ester bond, was investigated. By using this curing system, it is possible to suppress deterioration of characteristics due to humidity, for example, decrease in adhesive strength after water absorption, decrease in Tg (glass transition temperature) after water absorption, and the like.
従って、本発明は、下記半導体封止用液状エポキシ樹脂組成物及び半導体装置を提供する。
［Ｉ］ 回路基板上に表面実装部品を搭載したのち、回路基板内の回路配線に電気的に接続された複数個のパッドと表面実装部品から引き延ばされた複数本のリードとが接合材料を介して電気的に接続されることで構成されている混成集積回路装置において、上記リードとパッドとの電気的接合部を覆うように樹脂部材で封止するのに用いられる液状エポキシ樹脂組成物であって、
（Ａ）液状エポキシ樹脂：１００質量部
（Ｂ）平均粒径が２〜２０μｍの無機質充填剤：１００〜１，０００質量部
（Ｃ）融点が１７０℃以上、平均粒径が１〜５μｍ、最大粒径が２０μｍ以下である下記一般式（１）で示される硬化促進剤：１〜１５質量部
（Ｄ）非反応性有機ケイ素化合物で表面処理された平均粒径が０．０１〜０．１μｍである無機質充填材：０．５〜１０質量部
（Ｅ）平均粒径が０．１〜５μｍ、最大粒径が１０μｍ以下であり、シランカップリング剤で表面処理された、メタクリル樹脂、フェノキシ樹脂、ブタジエン樹脂、ポリスチレン樹脂若しくはこれらの共重合体からなる熱可塑性樹脂粒子、又はシリコーン樹脂、フッ素樹脂若しくはブタジエン樹脂からなるコア部とメタクリル樹脂、フェノキシ樹脂、ブタジエン樹脂、ポリスチレン樹脂若しくはこれらの共重合体からなるシェル部から構成されるコア・シェル構造の熱可塑性樹脂粒子：１〜５０質量部
を必須成分とすることを特徴とする半導体封止用液状エポキシ樹脂組成物。
［ＩＩ］ 回路基板上に表面実装部品を搭載したのち、回路基板内の回路配線に電気的に接続された複数個のパッドと表面実装部品から引き延ばされた複数本のリードとが接合材料を介して電気的に接続されることで構成されている混成集積回路装置において、上記リードと回路基板との間に入り込むように構成された第１樹脂部材と第１樹脂部材の上層に配置されるように構成された第２樹脂部材とで電気的接合部を覆うように樹脂部材で封止するに際し、上記第２樹脂部材に用いられる液状エポキシ樹脂組成物であって、
（Ａ）液状エポキシ樹脂：１００質量部
（Ｂ）平均粒径が２〜２０μｍの無機質充填剤：１００〜１，０００質量部
（Ｃ）融点が１７０℃以上、平均粒径が１〜５μｍ、最大粒径が２０μｍ以下である下記一般式（１）で示される硬化促進剤：１〜１５質量部
（Ｄ）非反応性有機ケイ素化合物で表面処理された平均粒径が０．０１〜０．１μｍである無機質充填材：０．５〜１０質量部
（Ｅ）平均粒径が０．１〜５μｍ、最大粒径が１０μｍ以下であり、シランカップリング剤で表面処理された、メタクリル樹脂、フェノキシ樹脂、ブタジエン樹脂、ポリスチレン樹脂若しくはこれらの共重合体からなる熱可塑性樹脂粒子、又はシリコーン樹脂、フッ素樹脂若しくはブタジエン樹脂からなるコア部とメタクリル樹脂、フェノキシ樹脂、ブタジエン樹脂、ポリスチレン樹脂若しくはこれらの共重合体からなるシェル部から構成されるコア・シェル構造の熱可塑性樹脂粒子：１〜５０質量部
を必須成分とすることを特徴とする半導体封止用液状エポキシ樹脂組成物。
［ＩＩＩ］ （Ｃ）成分の硬化促進剤が、２−フェニル−４−メチル−５−ヒドロキシメチルイミダゾール、２−フェニル−４，５−ジヒドロキシメチルイミダゾール、２，４，５−トリフェニルイミダゾールから選ばれるものである［Ｉ］又は［ＩＩ］記載の半導体封止用液状エポキシ樹脂組成物。
［ＩＶ］ （Ｅ）成分の熱可塑性樹脂粒子が、ゲルパーミエーションクロマトグラフィーによるポリスチレン換算の数平均分子量１０，０００〜１００，０００及び重量平均分子量１００，０００〜１，０００，０００を有することを特徴とする［Ｉ］〜［ＩＩＩ］のいずれか１項に記載の液状エポキシ樹脂組成物。
［Ｖ］ エポキシ樹脂組成物が、樹脂の広がり率が０．１以上であることを特徴とする［Ｉ］〜［ＩＶ］のいずれか１項に記載の液状エポキシ樹脂組成物。
［ＶＩ］ エポキシ樹脂組成物の粘度が、２５℃において１，０００Ｐａ・ｓ以下であることを特徴とする［Ｉ］〜［Ｖ］のいずれか１項に記載の液状エポキシ樹脂組成物。
［ＶＩＩ］ 回路基板上に表面実装部品を搭載したのち、回路基板内の回路配線に電気的に接続された複数個のパッドと表面実装部品から引き延ばされた複数本のリードとが接合材料を介して電気的に接続されることで構成されている混成集積回路装置において、上記リードとパッドとの電気的接合部を覆うように樹脂部材で封止する構造において、上記樹脂部材が［Ｉ］，［ＩＩＩ］〜［ＶＩ］のいずれか１項記載の液状エポキシ樹脂組成物の硬化物であることを特徴とする半導体装置。
［ＶＩＩＩ］ 回路基板上に表面実装部品を搭載したのち、回路基板内の回路配線に電気的に接続された複数個のパッドと表面実装部品から引き延ばされた複数本のリードとが接合材料を介して電気的に接続されることで構成されている混成集積回路装置において、上記リードと回路基板との間に入り込むように構成された第１樹脂部材と第１樹脂部材の上層に配置されるように構成された第２樹脂部材とで電気的接合部を覆うように樹脂部材で封止する構造において、上記第２樹脂部材が［ＩＩ］〜［ＶＩ］のいずれか１項記載の液状エポキシ樹脂組成物の硬化物であることを特徴とする半導体装置。
Accordingly, the present invention provides the following liquid epoxy resin composition for semiconductor encapsulation and a semiconductor device.
[I] After mounting a surface mounting component on a circuit board, a plurality of pads electrically connected to circuit wiring in the circuit board and a plurality of leads extended from the surface mounting component are bonding materials. Liquid epoxy resin composition used for sealing with a resin member so as to cover the electrical joint between the lead and the pad in a hybrid integrated circuit device configured to be electrically connected via Because
(A) Liquid epoxy resin: 100 parts by mass (B) Inorganic filler having an average particle diameter of 2 to 20 μm: 100 to 1,000 parts by mass (C) Melting point is 170 ° C. or higher, average particle diameter is 1 to 5 μm, maximum Curing accelerator represented by the following general formula (1) having a particle size of 20 μm or less : 1 to 15 parts by mass
(D) Inorganic filler with an average particle diameter of 0.01 to 0.1 μm surface-treated with a non-reactive organosilicon compound: 0.5 to 10 parts by mass (E) An average particle diameter of 0.1 to 5 μm , Thermoplastic resin particles comprising a methacrylic resin, a phenoxy resin, a butadiene resin, a polystyrene resin or a copolymer thereof having a maximum particle size of 10 μm or less and surface-treated with a silane coupling agent, or a silicone resin or a fluororesin Alternatively, core / shell structure thermoplastic resin particles composed of a core portion made of butadiene resin and a shell portion made of methacrylic resin, phenoxy resin, butadiene resin, polystyrene resin or a copolymer thereof : 1 to 50 parts by mass are essential A liquid epoxy resin composition for encapsulating a semiconductor, characterized by comprising a component.
[II] After mounting the surface mounting component on the circuit board, the plurality of pads electrically connected to the circuit wiring in the circuit board and the plurality of leads extended from the surface mounting component are the bonding material. In the hybrid integrated circuit device configured to be electrically connected through the first resin member, the first resin member configured to enter between the lead and the circuit board is disposed on the upper layer of the first resin member. A liquid epoxy resin composition used for the second resin member when sealing with the resin member so as to cover the electrical joint with the second resin member configured as described above,
(A) Liquid epoxy resin: 100 parts by mass (B) Inorganic filler having an average particle diameter of 2 to 20 μm: 100 to 1,000 parts by mass (C) Melting point is 170 ° C. or higher, average particle diameter is 1 to 5 μm, maximum Curing accelerator represented by the following general formula (1) having a particle size of 20 μm or less : 1 to 15 parts by mass
(D) Inorganic filler with an average particle diameter of 0.01 to 0.1 μm surface-treated with a non-reactive organosilicon compound: 0.5 to 10 parts by mass (E) An average particle diameter of 0.1 to 5 μm , Thermoplastic resin particles comprising a methacrylic resin, a phenoxy resin, a butadiene resin, a polystyrene resin or a copolymer thereof having a maximum particle size of 10 μm or less and surface-treated with a silane coupling agent, or a silicone resin or a fluororesin Alternatively, core / shell structure thermoplastic resin particles composed of a core portion made of butadiene resin and a shell portion made of methacrylic resin, phenoxy resin, butadiene resin, polystyrene resin or a copolymer thereof : 1 to 50 parts by mass are essential A liquid epoxy resin composition for encapsulating a semiconductor, characterized by comprising a component.
[ III ] The curing accelerator of component (C) is selected from 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, and 2,4,5-triphenylimidazole. The liquid epoxy resin composition for semiconductor encapsulation according to [I] or [II].
[ IV ] The thermoplastic resin particles of component (E) have a number average molecular weight of 10,000 to 100,000 and a weight average molecular weight of 100,000 to 1,000,000 in terms of polystyrene by gel permeation chromatography. The liquid epoxy resin composition according to any one of [I] to [ III ].
[ V ] The liquid epoxy resin composition according to any one of [I] to [ IV ], wherein the epoxy resin composition has a resin spreading ratio of 0.1 or more.
[ VI ] The liquid epoxy resin composition according to any one of [I] to [ V ], wherein the viscosity of the epoxy resin composition is 1,000 Pa · s or less at 25 ° C.
[ VII ] After mounting the surface mounting component on the circuit board, the plurality of pads electrically connected to the circuit wiring in the circuit board and the plurality of leads extended from the surface mounting component are bonding materials. In a hybrid integrated circuit device configured by being electrically connected via a resin member, the resin member is sealed in a structure in which the resin member is sealed so as to cover the electrical joint between the lead and the pad. ], [III]-[ VI ] The semiconductor device characterized by being a hardened | cured material of the liquid epoxy resin composition of any one of [ VI ].
[ VIII ] After mounting the surface mount component on the circuit board, the plurality of pads electrically connected to the circuit wiring in the circuit board and the plurality of leads extended from the surface mount component are the bonding material. In the hybrid integrated circuit device configured to be electrically connected through the first resin member, the first resin member configured to enter between the lead and the circuit board is disposed on the upper layer of the first resin member. The structure of sealing with a resin member so that an electrical junction part may be covered with the 2nd resin member comprised so that the said 2nd resin member may be a liquid of any one of [II]-[ VI ] A semiconductor device, which is a cured product of an epoxy resin composition.
本発明の半導体封止用液状エポキシ樹脂組成物は、特に形状維持特性、保存安定性に優れており、この封止材を用いた半導体装置は、非常に信頼性の高いものである。 The liquid epoxy resin composition for semiconductor encapsulation of the present invention is particularly excellent in shape maintenance characteristics and storage stability, and a semiconductor device using this encapsulant is very reliable.
本発明に係る半導体封止用液状エポキシ樹脂組成物は、
（Ａ）液状エポキシ樹脂
（Ｂ）平均粒径が２〜２０μｍの無機質充填剤
（Ｃ）硬化促進剤
（Ｄ）非反応性有機ケイ素化合物で表面処理された平均粒径が０．０１〜０．１μｍである無機質充填材
（Ｅ）熱可塑性樹脂粒子
を必須成分とするもので、以下これらの成分について詳しく説明する。
The liquid epoxy resin composition for semiconductor encapsulation according to the present invention is
(A) Liquid epoxy resin (B) Inorganic filler having an average particle diameter of 2 to 20 μm (C) Curing accelerator (D) The average particle diameter of the surface treated with a non-reactive organosilicon compound is 0.01-0. The inorganic filler (E) having a size of 1 μm is an essential component, and these components will be described in detail below.
［（Ａ）液状エポキシ樹脂］
本発明の半導体装置用封止材（半導体封止用液状エポキシ樹脂組成物）において、（Ａ）成分の液状のエポキシ樹脂は、一分子中に２個以上のエポキシ基があればいかなるものでも使用可能であるが、特に、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂等のビスフェノール型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂等のノボラック型エポキシ樹脂、ナフタレン型エポキシ樹脂、ビフェニル型エポキシ樹脂、シクロペンタジエン型エポキシ樹脂などや下記構造式で示されるエポキシ樹脂が例示される。この中でも室温で液状のエポキシ樹脂を使用する。
[(A) Liquid epoxy resin]
In the sealing material for semiconductor devices of the present invention (liquid epoxy resin composition for semiconductor sealing), the liquid epoxy resin of component (A) can be any if there are two or more epoxy groups in one molecule. Although it is possible, in particular, bisphenol type epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin, novolak type epoxy resins such as phenol novolak type epoxy resin and cresol novolak type epoxy resin, naphthalene type epoxy resin, biphenyl type Examples include epoxy resins, cyclopentadiene type epoxy resins, and epoxy resins represented by the following structural formula. Among these, a liquid epoxy resin is used at room temperature.
上記液状エポキシ樹脂中の全塩素含有量は、１，５００ｐｐｍ以下、望ましくは１，０００ｐｐｍ以下であることが好ましい。また、１００℃で５０％エポキシ樹脂濃度における２０時間での抽出水塩素が１０ｐｐｍ以下であることが好ましい。全塩素含有量が１，５００ｐｐｍを超え、抽出水塩素が１０ｐｐｍを超えると、半導体素子の信頼性、特に耐湿性に悪影響を与えるおそれがある。 The total chlorine content in the liquid epoxy resin is preferably 1,500 ppm or less, more preferably 1,000 ppm or less. Moreover, it is preferable that the extraction water chlorine in 20 hours in the 50% epoxy resin density | concentration at 100 degreeC is 10 ppm or less. If the total chlorine content exceeds 1,500 ppm and the extracted water chlorine exceeds 10 ppm, the reliability of the semiconductor element, particularly moisture resistance, may be adversely affected.
［（Ｂ）無機質充填剤］
本発明においては、膨張係数を小さくする目的から、公知の各種無機質充填剤（Ｂ）を添加することができる。無機質充填剤として具体的には、溶融シリカ、結晶シリカ、アルミナ、ボロンナイトライド、窒化アルミニウム、窒化珪素、マグネシア、マグネシウムシリケートなどが挙げられる。中でも真球状の溶融シリカが低粘度化のため望ましい。
[(B) Inorganic filler]
In the present invention, various known inorganic fillers (B) can be added for the purpose of reducing the expansion coefficient. Specific examples of the inorganic filler include fused silica, crystalline silica, alumina, boron nitride, aluminum nitride, silicon nitride, magnesia, magnesium silicate, and the like. Among them, spherical fused silica is desirable for reducing the viscosity.
無機質充填剤は、樹脂と無機質充填剤との結合強度を強くするため、シランカップリング剤、チタネートカップリング剤などのカップリング剤で予め表面処理したものを配合することが好ましい。このようなカップリング剤としては、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルメチルジエトキシシラン、β−（３，４−エポキシシクロヘキシル）エチルトリメトキシシラン等のエポキシシラン、Ｎ−β（アミノエチル）−γ−アミノプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、Ｎ−フェニル−γ−アミノプロピルトリメトキシシラン等のアミノシラン、γ−メルカプトシラン等のメルカプトシランなどのシランカップリング剤を用いることが好ましい。ここで表面処理に用いるカップリング剤の配合量及び表面処理方法については、特に制限されるものではない。 In order to increase the bond strength between the resin and the inorganic filler, the inorganic filler is preferably blended in advance with a surface treatment with a coupling agent such as a silane coupling agent or a titanate coupling agent. As such a coupling agent, epoxy silane such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, N Silane cups such as amino silanes such as -β (aminoethyl) -γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, and mercaptosilane such as γ-mercaptosilane It is preferable to use a ring agent. Here, the blending amount of the coupling agent used for the surface treatment and the surface treatment method are not particularly limited.
本発明の組成物を使用する場合、無機質充填剤は、平均粒径が２〜２０μｍであり、最大粒径が７５μｍ以下、特に５０μｍ以下のものが望ましい。平均粒径が２μｍ未満では粘度が高くなり、多量に充填できない場合があり、一方、２０μｍを超えると粗い粒子が多くなり、リード線につまり、ボイドとなるおそれがある。なお、この平均粒径、最大粒径は、レーザー光回折法による粒度分布測定装置等によって求めることができ、平均粒径は重量平均値（又はメジアン径）等として得ることができる。 When the composition of the present invention is used, the inorganic filler preferably has an average particle diameter of 2 to 20 μm and a maximum particle diameter of 75 μm or less, particularly 50 μm or less. If the average particle size is less than 2 μm, the viscosity increases, and a large amount may not be filled. On the other hand, if the average particle size exceeds 20 μm, coarse particles increase, which may lead to voids in the lead wires. The average particle size and the maximum particle size can be obtained by a particle size distribution measuring apparatus using a laser light diffraction method, and the average particle size can be obtained as a weight average value (or median diameter) or the like.
この場合、（Ｂ）無機質充填剤の配合量としては、（Ａ）液状エポキシ樹脂総量１００質量部に対して１００〜１，０００質量部、特に２００〜８００質量部の範囲が好ましい。１００質量部未満では、膨張係数が大きく冷熱試験においてクラックの発生を誘発させる。１，０００質量部を超えると、粘度が高くなり、流動性の低下をもたらす。 In this case, the blending amount of the (B) inorganic filler is preferably in the range of 100 to 1,000 parts by mass, particularly 200 to 800 parts by mass with respect to 100 parts by mass of the total amount of the (A) liquid epoxy resin. If the amount is less than 100 parts by mass, the coefficient of expansion is large, and the occurrence of cracks is induced in the thermal test. When it exceeds 1,000 parts by mass, the viscosity increases and the fluidity is lowered.
［（Ｃ）硬化促進剤］
本発明においては、上記エポキシ樹脂の硬化促進剤（反応促進剤）として、エポキシ樹脂に対する溶解度が１質量％以下で、融点が１７０℃以上であり、平均粒径が１〜５μｍ、最大粒径が２０μｍ以下である、下記一般式（１）のイミダゾール化合物を用いることが好ましい。
[(C) Curing accelerator]
In the present invention, the epoxy resin curing accelerator (reaction accelerator) has a solubility in epoxy resin of 1% by mass or less, a melting point of 170 ° C. or higher, an average particle size of 1 to 5 μm, and a maximum particle size of It is preferable to use an imidazole compound of the following general formula (1) which is 20 μm or less.
具体的に硬化促進剤としては、融点が１７０℃以上の２−フェニル−４−メチル−５−ヒドロキシメチルイミダゾール、２−フェニル−４，５−ジヒドロキシメチルイミダゾール、２−アリール−４，５−ジフェニルイミダゾール、２，４，５−トリフェニルイミダゾールなどのイミダゾール誘導体が最も適している。
これらイミダゾール誘導体は常温で固体であり、平均粒径が５μｍ以下、最大粒径が２０μｍ以下のものを使用する。好ましくは平均粒径１〜５μｍ、特に２〜５μｍかつ最大粒径が１５μｍ以下のものである。硬化促進剤の平均粒径が小さすぎると、比表面積が大きくなり、混合した時の粘度が高くなるおそれがある。５μｍを超えると、エポキシ樹脂との分散が不均一になり、信頼性の低下を引き起こす場合がある。
Specific examples of the curing accelerator include 2 -phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-aryl-4,5-diphenyl having a melting point of 170 ° C. or higher. Imidazole derivatives such as imidazole and 2,4,5-triphenylimidazole are most suitable.
These imidazole derivatives are solid at room temperature and have an average particle size of 5 μm or less and a maximum particle size of 20 μm or less. Preferably, the average particle size is 1 to 5 μm, particularly 2 to 5 μm and the maximum particle size is 15 μm or less. If the average particle size of the curing accelerator is too small, the specific surface area increases and the viscosity when mixed may increase. If it exceeds 5 μm, the dispersion with the epoxy resin becomes non-uniform, which may cause a decrease in reliability.
更に、この硬化促進剤の粒度、比表面積は、無機質充填剤の粒度、比表面積に比べ大きくすることが好ましい。小さいと混合、混練時に硬化促進剤が不均一に分散され、硬化性が悪くなり、信頼性に悪影響を及ぼすおそれがある。例えば、シリカ充填剤が平均粒径１〜３μｍ、比表面積２．５ｍ2／ｇの場合、硬化促進剤の平均粒径は３〜５μｍ、比表面積は２．５〜１０ｍ2／ｇが好ましい。また、純度は、９０％以上、好ましくは９３％以上であり、９０％未満では反応性にばらつきが生じ、硬化性、侵入特性にばらつきが生じるおそれがある。
なお、本発明において、平均粒径は、上述したように、レーザー光回折法等による重量平均値（又はメディアン径）等として求めることができる。
Furthermore, it is preferable that the particle size and specific surface area of the curing accelerator be larger than the particle size and specific surface area of the inorganic filler. If it is small, the curing accelerator is unevenly dispersed during mixing and kneading, the curability is deteriorated, and the reliability may be adversely affected. For example, silica filler
In the present invention, as described above, the average particle diameter can be obtained as a weight average value (or median diameter) by a laser light diffraction method or the like.
上記硬化促進剤の配合量は、（Ａ）液状エポキシ樹脂１００質量部に対して１〜１５質量部、特に２〜７質量部とすることが好ましい。配合量が少なすぎると硬化性が低下し、多すぎると保存性が低下するおそれがある。 The blending amount of the curing accelerator is preferably 1 to 15 parts by mass, particularly 2 to 7 parts by mass with respect to 100 parts by mass of the (A) liquid epoxy resin. If the blending amount is too small, the curability decreases, and if it is too large, the storage stability may decrease.
［（Ｄ）非反応性有機ケイ素化合物で表面処理された無機質充填材］
本発明においては、形状を維持するに当たり、非反応性有機ケイ素化合物で表面処理された、平均粒径が０．０１〜０．１μｍである無機質充填材を用いる。この場合、前記表面処理は、この無機質充填材の分散性を向上させるために行われる。この無機質充填材の平均粒径が０．０１μｍ未満であるとエポキシ樹脂組成物の粘度が高くなるおそれがあり、作業性が著しく悪くなるおそれがある。また、０．１μｍを超えると硬化前の封止物の形状維持が困難となるという問題がある。なお、この平均粒径は動的光散乱法／レーザートラップ法により測定することができる。
[(D) Inorganic filler surface-treated with non-reactive organosilicon compound]
In the present invention, in order to maintain the shape, an inorganic filler having an average particle diameter of 0.01 to 0.1 μm and surface-treated with a non-reactive organosilicon compound is used. In this case, the surface treatment is performed in order to improve the dispersibility of the inorganic filler. If the average particle size of the inorganic filler is less than 0.01 μm, the viscosity of the epoxy resin composition may be increased, and workability may be significantly deteriorated. Moreover, when it exceeds 0.1 micrometer, there exists a problem that the shape maintenance of the sealing material before hardening will become difficult. The average particle diameter can be measured by a dynamic light scattering method / laser trap method.
平均粒径が０．０１〜０．１μｍである無機質充填材としては、例えば、アエロジル１３０、アエロジル２００、アエロジル３００（商品名、日本アエロジル社製）等のフュームドシリカ；ニプシルＶＮ−３−ＬＰ（商品名、日本シリカ工業社製）等の湿式シリカ；等のシリカが好適に用いられる。 Examples of the inorganic filler having an average particle diameter of 0.01 to 0.1 μm include fumed silica such as Aerosil 130, Aerosil 200, Aerosil 300 (trade name, manufactured by Nippon Aerosil Co., Ltd.); Nipsil VN-3-LP Silica such as wet silica (trade name, manufactured by Nippon Silica Kogyo Co., Ltd.) is preferably used.
また、非反応性有機ケイ素化合物としては、例えば、ＣＨ3Ｓｉ（ＯＣＨ3）3、（ＣＨ3）3ＳｉＯＣＨ3、ＰｈＳｉ（ＯＣＨ3）3、ＰｈＳｉＣＨ3（ＯＣＨ3）2、｛（ＣＨ3）3Ｓｉ｝2ＮＨ、ＣＨ3ＣＨ2Ｓｉ（ＯＣＨ3）3等（なお、前記「Ｐｈ」はフェニル基を意味する）が挙げられる。 Examples of the non-reactive organosilicon compound include CH 3 Si (OCH 3 ) 3 , (CH 3 ) 3 SiOCH 3 , PhSi (OCH 3 ) 3 , PhSiCH 3 (OCH 3 ) 2 , {(CH 3 ) 3 Si} 2 NH, CH 3 CH 2 Si (OCH 3 ) 3 and the like (wherein “Ph” means a phenyl group).
また、前記無機質充填材の表面処理方法としては、前記無機質充填材を予め前記非反応性有機ケイ素化合物を用いて処理しておいてもよく、また、本発明の液状エポキシ樹脂組成物の調製時に前記非反応性有機ケイ素化合物を添加・配合するインテグラルブレンド法によって表面処理をおこなってもよいが、前記非反応性有機ケイ素化合物の使用量を抑制する点から、前者の方法の方が好ましい。 In addition, as a surface treatment method of the inorganic filler, the inorganic filler may be previously treated with the non-reactive organosilicon compound, and at the time of preparing the liquid epoxy resin composition of the present invention. The surface treatment may be performed by an integral blend method in which the non-reactive organosilicon compound is added and blended, but the former method is preferred from the viewpoint of suppressing the amount of the non-reactive organosilicon compound used.
この成分の使用量は、（Ａ）成分の液状エポキシ樹脂１００質量部に対し、通常、０．５〜１０質量部、好ましくは２〜７質量部の範囲とするのがよい。前記使用量が少なすぎると、液状成分のブリードの発生を抑制することが困難となり、また、逆に、多すぎるとチキソ性が高くなり過ぎるため、エポキシ樹脂組成物の流動性が低下し、実質上液状のエポキシ樹脂組成物を得ることが困難となるおそれがある。 The amount of this component used is usually 0.5 to 10 parts by mass, preferably 2 to 7 parts by mass, relative to 100 parts by mass of the liquid epoxy resin (A). If the amount used is too small, it becomes difficult to suppress the occurrence of bleed of the liquid component, and conversely, if too large, the thixotropy becomes too high, so that the fluidity of the epoxy resin composition decreases, There is a possibility that it may be difficult to obtain an upper liquid epoxy resin composition.
［（Ｅ）熱可塑性樹脂粒子］
本発明の組成物は、粒子状の（Ｅ）熱可塑性樹脂粒子を含むことを特徴とする。該熱可塑性樹脂は、２５℃で固体状である。即ち、保存中及び基板上に塗布される温度において、エポキシ樹脂（Ａ）と相溶された樹脂相を形成しない。該熱可塑性樹脂としては公知の樹脂であってよく、例えばＡＡＳ樹脂、ＡＥＳ樹脂、ＡＳ樹脂、ＡＢＳ樹脂、ＭＢＳ樹脂、塩化ビニル樹脂、酢酸ビニル樹脂、メタクリル樹脂、フェノキシ樹脂、ポリブタジエン樹脂、各種のフッ素樹脂、各種シリコーン樹脂、ポリアセタール、各種のポリアミド、ポリアミドイミド、ポリイミド、ポリエーテルイミド、ポリエーテルエーテルケトン、ポリエチレン、ポリエチレンオキサイド、ポリエチレンテレフタレート、ポリカーボネート、ポリスチレン、ポリサルホン、ポリエーテルサルホン、ポリビニルアルコール、ポリビニルエーテル、ポリビニルブチラール、ポリビニルホルマール、ポリフェニレンエーテル、ポリフェニレンサルファイド、ポリブチレンテレフタレート、ポリプロピレン、ポリメチルペンテン等が挙げられる。これらの中でも、メタクリル樹脂、フェノキシ樹脂、ブタジエン樹脂、ポリスチレンもしくはこれらの共重合体が望ましい。或いは、粒子の内核（コア）部と外皮（シェル）部で樹脂が異なるコア・シェル構造のものであっても良い。その場合、コアはシリコーン樹脂、フッ素樹脂、又はブタジエン樹脂等からなるゴム粒子であり、シェルは線状分子鎖からなる上記各種の熱可塑性樹脂であることが望ましい。
[(E) Thermoplastic resin particles]
The composition of the present invention comprises particulate (E) thermoplastic resin particles. The thermoplastic resin is solid at 25 ° C. That is, a resin phase that is compatible with the epoxy resin (A) is not formed during storage and at the temperature applied on the substrate. The thermoplastic resin may be a known resin, for example, AAS resin, AES resin, AS resin, ABS resin, MBS resin, vinyl chloride resin, vinyl acetate resin, methacrylic resin, phenoxy resin, polybutadiene resin, various kinds of fluorine. Resin, various silicone resins, polyacetal, various polyamides, polyamideimide, polyimide, polyetherimide, polyetheretherketone, polyethylene, polyethylene oxide, polyethylene terephthalate, polycarbonate, polystyrene, polysulfone, polyethersulfone, polyvinyl alcohol, polyvinyl ether , Polyvinyl butyral, polyvinyl formal, polyphenylene ether, polyphenylene sulfide, polybutylene terephthalate, polypropylene, polymer Rupenten, and the like. Among these, methacrylic resin, phenoxy resin, butadiene resin, polystyrene, or a copolymer thereof is desirable. Alternatively, a core / shell structure in which the resin is different between the inner core (core) portion and the outer skin (shell) portion of the particle may be used. In that case, it is desirable that the core is rubber particles made of silicone resin, fluororesin, butadiene resin, or the like, and the shell is the above-described various thermoplastic resins made of linear molecular chains.
（Ｅ）熱可塑性樹脂粒子は、略球状、円柱もしくは角柱状、不定形状、破砕状、及び燐片状等であってよく、ダイボンド剤用途には、略球状、及び、鋭角部を有しない不定形状が好ましい。 (E) The thermoplastic resin particles may be substantially spherical, cylindrical or prismatic, indeterminate, crushed, and flake-shaped, and for die bond applications, are almost spherical and indefinite with no sharp corners. Shape is preferred.
（Ｅ）熱可塑性樹脂粒子の平均粒径は、用途に応じて適宜選択されるが、通常は最大粒径が１０μｍ以下、特に５μｍ以下であることが望ましく、平均粒径は０．１〜５μｍ、特に０．１〜２μｍであることが望ましい。最大粒径が前記上限値より大きい、或いは平均粒径が５μｍより大きい場合は、粒子熱可塑性樹脂の一部が十分に膨潤或いは溶解せずに残り、硬化後の組成物の特性を損なうおそれがある。一方、平均粒径が前記下限値よりも小さい場合、組成物の粘度が大きくなり、作業性が著しく悪くなるおそれがある。なお、粒径の測定は、電子顕微鏡観察により行うことができる。 (E) The average particle diameter of the thermoplastic resin particles is appropriately selected depending on the application, but usually the maximum particle diameter is preferably 10 μm or less, particularly preferably 5 μm or less, and the average particle diameter is 0.1 to 5 μm. In particular, the thickness is desirably 0.1 to 2 μm. When the maximum particle size is larger than the above upper limit value or the average particle size is larger than 5 μm, a part of the particle thermoplastic resin may not be sufficiently swollen or dissolved, which may impair the properties of the composition after curing. is there. On the other hand, when the average particle size is smaller than the lower limit, the viscosity of the composition is increased, and workability may be significantly deteriorated. The particle size can be measured by observation with an electron microscope.
（Ｅ）熱可塑性樹脂粒子は、架橋構造を有していてもよい。しかし、熱可塑性樹脂（Ｅ）がエポキシ樹脂網目構造中に均一に分散された構造を形成することが好ましいと考えられることから、架橋度は低い方が好ましく、より好ましくは架橋の無い線状分子鎖である。 (E) The thermoplastic resin particles may have a crosslinked structure. However, since it is considered preferable to form a structure in which the thermoplastic resin (E) is uniformly dispersed in the epoxy resin network structure, the degree of crosslinking is preferably lower, and more preferably linear molecules without crosslinking. Is a chain.
（Ｅ）熱可塑性樹脂粒子の分子量は、樹脂の種類に依存して適宜選択される。典型的には、ゲルパーミエーションクロマトグラフィー（ＧＰＣ）によるポリスチレン換算の数平均分子量が１，０００〜１０，０００，０００が好ましく、より好ましくは１０，０００〜１００，０００、重量平均分子量が１０，０００〜１００，０００，０００が好ましく、より好ましくは１００，０００〜１，０００，０００である。数平均分子量が上記下限値より小さい、或いは重量平均分子量が上記下限値より小さい場合は、形状維持性が安定的に得られない場合が生じる。一方、数平均分子量が上記上限値より大きい、或いは重量平均分子量が上記上限値より大きい場合は、樹脂粘度が著しく高くなり、作業性が悪くなる可能性がある。 (E) The molecular weight of the thermoplastic resin particles is appropriately selected depending on the type of resin. Typically, the number average molecular weight in terms of polystyrene by gel permeation chromatography (GPC) is preferably 1,000 to 10,000,000, more preferably 10,000 to 100,000, and the weight average molecular weight is 10,000. It is preferably from 100,000 to 100,000,000, more preferably from 100,000 to 1,000,000. When the number average molecular weight is smaller than the lower limit value or the weight average molecular weight is smaller than the lower limit value, the shape maintainability may not be stably obtained. On the other hand, when the number average molecular weight is larger than the upper limit value or the weight average molecular weight is larger than the upper limit value, the resin viscosity is remarkably increased and workability may be deteriorated.
（Ｅ）熱可塑性樹脂粒子の含有量は、（Ａ）エポキシ樹脂１００質量部に対して１〜５０質量部、より好ましくは５〜３０質量部である。含有量が前記下限値より少ない場合は、形状が維持できなくなる可能性がある。一方含有量が前記上限値よりも多い場合は、粘度が高くなり、作業性が著しく悪くなるおそれがある。 (E) Content of a thermoplastic resin particle is 1-50 mass parts with respect to 100 mass parts of (A) epoxy resins, More preferably, it is 5-30 mass parts. If the content is less than the lower limit, the shape may not be maintained. On the other hand, when the content is higher than the upper limit, the viscosity becomes high and the workability may be remarkably deteriorated.
（Ｅ）熱可塑性樹脂粒子は、表面処理することが好ましい。表面処理は、公知の表面処理剤を用いて公知の方法により行うことができる。表面処理剤としては、シランカップリング剤が好ましく、例えば、ビニルトリメトキシシラン、ビニルトリエトキシシラン、ビニルトリス（β−メトキシエトキシ）シラン、β−（３，４−エポキシシクロヘキシル）エチルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルメチルジエトキシシラン、γ−グリシドキシプロピルトリエトキシシラン、γ−メタクリロキシプロピルメチルジメトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン、γ−メタクリロキシプロピルメチルジエトキシシラン、γ−メタクリロキシプロピルトリエトキシシラン、Ｎ−β（アミノエチル）γ−アミノプロピルメチルジメトキシシラン、Ｎ−β（アミノエチル）γ−アミノプロピルトリメトキシシラン、Ｎ−β（アミノエチル）γ−アミノプロピルトリエトキシシラン、γ−アミノプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、Ｎ−フェニル−γ−アミノプロピルトリメトキシシラン、γ−メルカプトプロピルトリメトキシシラン等のシランカップリング剤が挙げられ、特にビニルトリメトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−アミノプロピルトリメトキシシラン、Ｎ−フェニル−γ−アミノプロピルトリメトキシシラン、γ−メルカプトプロピルトリメトキシシランが好適に使用される。表面処理方法は、湿式処理或いは乾式処理のいずれによってもよい。表面処理に使用するシランカップリング剤の量は、熱可塑性樹脂粒子の表面積にも依存するが、典型的には、熱可塑性樹脂粒子１００質量部に対して０．１〜５質量部である。 (E) The thermoplastic resin particles are preferably surface-treated. The surface treatment can be performed by a known method using a known surface treatment agent. As the surface treatment agent, a silane coupling agent is preferable. For example, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ -Glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ- Methacryloxypropylmethyldiethoxysilane, γ-methacryloxypropyltriethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N β (aminoethyl) γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, etc. And silane coupling agents such as vinyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltrimethoxysilane, N-phenyl-γ-aminopropyltri Methoxysilane and γ-mercaptopropyltrimethoxysilane are preferably used. The surface treatment method may be either wet treatment or dry treatment. Although the amount of the silane coupling agent used for the surface treatment depends on the surface area of the thermoplastic resin particles, it is typically 0.1 to 5 parts by mass with respect to 100 parts by mass of the thermoplastic resin particles.
［その他添加剤］
本発明のエポキシ樹脂組成物には、応力を低下させる目的でシリコーンゴム、シリコーンオイルや液状のポリブタジエンゴム、メタクリル酸メチル−ブタジエン−スチレンよりなる熱可塑性樹脂などを配合してもよい。好ましくは、アルケニル基含有エポキシ樹脂又はフェノール樹脂のアルケニル基と下記平均組成式（３）で示される１分子中の珪素原子の数が２０〜４００であり、珪素原子に結合する水素原子（ＳｉＨ基）の数が１〜５であるオルガノポリシロキサンのＳｉＨ基との付加反応により得られる共重合体を配合することが好ましい。
ＨaＲ5 bＳｉＯ(4-a-b)/2 （３）
（但し、式中Ｒ5は置換又は非置換の一価の炭化水素基、ａは０．０１〜０．１、ｂは１．８〜２．２、１．８１≦ａ＋ｂ≦２．３である。）
[Other additives]
The epoxy resin composition of the present invention may be blended with silicone rubber, silicone oil, liquid polybutadiene rubber, thermoplastic resin made of methyl methacrylate-butadiene-styrene, or the like for the purpose of reducing stress. Preferably, the alkenyl group of the alkenyl group-containing epoxy resin or phenol resin and the number of silicon atoms in one molecule represented by the following average composition formula (3) are 20 to 400, and the hydrogen atom (SiH group bonded to the silicon atom) ) Is preferably blended with a copolymer obtained by addition reaction with SiH groups of organopolysiloxane having 1-5.
H a R 5 b SiO (4-ab) / 2 (3)
(Wherein R 5 is a substituted or unsubstituted monovalent hydrocarbon group, a is 0.01 to 0.1, b is 1.8 to 2.2, and 1.81 ≦ a + b ≦ 2.3. is there.)
なお、Ｒ5の一価炭化水素基としては、炭素数１〜１０、特に炭素数１〜８のものが好ましく、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、ｔｅｒｔ−ブチル基、へキシル基、オクチル基、デシル基等のアルキル基、ビニル基、アリル基、プロペニル基、ブテニル基、ヘキセニル基等のアルケニル基、フェニル基、キシリル基、トリル基等のアリール基、ベンジル基、フェニルエチル基、フェニルプロピル基等のアラルキル基などや、これらの炭化水素基の水素原子の一部又は全部を塩素、フッ素、臭素等のハロゲン原子で置換したフロロメチル基、ブロモエチル基、トリフルオロプロピル基等のハロゲン置換一価炭化水素基を挙げることができる。 The monovalent hydrocarbon group for R 5 is preferably a group having 1 to 10 carbon atoms, particularly 1 to 8 carbon atoms, and is preferably a methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert- Alkyl groups such as butyl group, hexyl group, octyl group and decyl group, alkenyl groups such as vinyl group, allyl group, propenyl group, butenyl group and hexenyl group, aryl groups such as phenyl group, xylyl group and tolyl group, benzyl Groups, phenylethyl groups, aralkyl groups such as phenylpropyl groups, etc., and fluorocarbon groups, bromoethyl groups, trifluoro, etc. in which some or all of the hydrogen atoms of these hydrocarbon groups are replaced by halogen atoms such as chlorine, fluorine, bromine, etc. Mention may be made of halogen-substituted monovalent hydrocarbon groups such as propyl groups.
上記共重合体としては、中でも下記構造式（４）のものが望ましい。 As the above-mentioned copolymer, the following structural formula (4) is preferable.
上記式（４）中、Ｒ5は上記と同じであり、Ｒ6は−ＣＨ2ＣＨ2ＣＨ2−、−ＯＣＨ2−ＣＨ（ＯＨ）−ＣＨ2−Ｏ−ＣＨ2ＣＨ2ＣＨ2−又は−Ｏ−ＣＨ2ＣＨ2ＣＨ2−であり、Ｒ7は水素原子又は炭素数１〜４のアルキル基である。ｎは４〜１９９、好ましくは１９〜１０９の整数、ｐは１〜１０の整数、ｑは１〜１０の整数である。 In the above formula (4), R 5 is the same as above, and R 6 is —CH 2 CH 2 CH 2 —, —OCH 2 —CH (OH) —CH 2 —O—CH 2 CH 2 CH 2 — or —O—CH 2 CH 2 CH 2 —, wherein R 7 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. n is an integer of 4 to 199, preferably 19 to 109, p is an integer of 1 to 10, and q is an integer of 1 to 10.
上記共重合体をジオルガノポリシロキサン量が、（Ａ）成分１００質量部に対して０〜２０質量部、特には２〜１５質量部含まれるように配合することで応力をより一層低下させることができ、密着性も向上する。ここで、ジオルガノポリシロキサン量は、下記式で示される。
ポリシロキサン量＝（ポリシロキサン部分の分子量／共重合体の分子量）×添加量
The stress is further reduced by blending the copolymer so that the amount of diorganopolysiloxane is 0 to 20 parts by mass, particularly 2 to 15 parts by mass with respect to 100 parts by mass of component (A). And adhesion is improved. Here, the amount of diorganopolysiloxane is represented by the following formula.
Polysiloxane amount = (molecular weight of polysiloxane portion / molecular weight of copolymer) × added amount
本発明の封止材には、更に必要に応じ、接着向上用炭素官能性シラン、カーボンブラックなどの顔料、染料、酸化防止剤、表面処理剤（γ−グリシドキシプロピルトリメトキシシランなど）、その他の添加剤を配合することができる。また、必要により本発明の効果を妨げない範囲で、公知の他の硬化剤、硬化促進剤を配合することができるが、酸無水物硬化剤の使用は避けることが望ましい。 In the sealing material of the present invention, if necessary, a carbon functional silane for improving adhesion, a pigment such as carbon black, a dye, an antioxidant, a surface treatment agent (such as γ-glycidoxypropyltrimethoxysilane), Other additives can be blended. In addition, other known curing agents and curing accelerators can be blended as long as the effects of the present invention are not hindered, if necessary, but it is desirable to avoid the use of acid anhydride curing agents.
［液状エポキシ樹脂組成物の調製等］
本発明のエポキシ樹脂組成物は、例えば、エポキシ樹脂、無機質充填剤などと硬化促進剤を同時に又は別々に必要により加熱処理を加えながら撹拌、溶解、混合、分散させることによって製造することができる。これらの混合物の混合、撹拌、分散等の装置は特に限定されないが、撹拌、加熱装置を備えたライカイ機、３本ロール、ボールミル、プラネタリーミキサー等を用いることができる。これら装置を適宜組み合わせて使用してもよい。
[Preparation of liquid epoxy resin composition, etc.]
The epoxy resin composition of the present invention can be produced, for example, by stirring, dissolving, mixing, and dispersing an epoxy resin, an inorganic filler, and the like and a curing accelerator simultaneously or separately with heat treatment as necessary. A device for mixing, stirring, and dispersing these mixtures is not particularly limited, and a lykai machine equipped with a stirring and heating device, a three-roll, a ball mill, a planetary mixer, and the like can be used. You may use combining these apparatuses suitably.
なお、本発明において、封止材として用いる液状エポキシ樹脂組成物の粘度は、上記した成分の種類及び配合量を適宜選定することにより、Ｅ型回転粘度計を用いて１ｒｐｍの回転数で測定した２５℃の粘度で１，０００Ｐａ・ｓ以下、特に５００Ｐａ・ｓ以下とすることが好ましい。なお、その下限は特に制限されないが、通常１０Ｐａ・ｓ以上である。
また、この封止材の成形方法、成形条件は、常法とすることができるが、好ましくは４０〜１００℃で成形硬化後、１５０〜１８０℃で１〜３時間ポストキュアーすることが好ましく、例えば、１５０℃で１時間以上熱オーブンにてポストキュアーすることが望ましい。ポストキュアーが１５０℃で１時間未満では十分な硬化物特性が得られない場合がある。
この場合、本発明の液状エポキシ樹脂組成物は、樹脂の広がりを０．１以上、より好ましくは０．１〜０．５、更に好ましくは０．１〜０．３とすることが好ましい。広がり率が０．１より小さいとはんだ部を十分覆うことがでず、冷熱サイクルにおいてはんだクラックが発生するおそれがある。なお、広がり率は、後述する方法によって測定された値である。
In the present invention, the viscosity of the liquid epoxy resin composition used as the sealing material was measured at an rpm of 1 rpm using an E-type viscometer by appropriately selecting the type and blending amount of the components described above. The viscosity at 25 ° C. is preferably 1,000 Pa · s or less, and particularly preferably 500 Pa · s or less. The lower limit is not particularly limited, but is usually 10 Pa · s or more.
In addition, the molding method and molding conditions of this encapsulant can be a conventional method, but preferably it is post-cured at 150 to 180 ° C. for 1 to 3 hours after molding and curing at 40 to 100 ° C., For example, it is desirable to post-cure in a heat oven at 150 ° C. for 1 hour or longer. If the post cure is less than 1 hour at 150 ° C., sufficient cured product properties may not be obtained.
In this case, the liquid epoxy resin composition of the present invention preferably has a resin spread of 0.1 or more, more preferably 0.1 to 0.5, and still more preferably 0.1 to 0.3. If the spreading ratio is less than 0.1, the solder portion cannot be sufficiently covered, and solder cracks may occur in the cooling / heating cycle. The spread rate is a value measured by a method described later.
ここで、本発明に用いる半導体装置としては、例えば図１〜３に示すものが挙げられる。
この場合、図１は、本発明のエポキシ樹脂組成物による封止が適用された混成集積回路装置における電子部品の実装構造を示す断面図である。また、図２は、混成集積回路装置における電子部品の実装構造の上面図であり、図１の紙面上方から見たときの図に相当する。以下、これらの図を参照して、本発明の樹脂材料を用いた混成集積回路装置における電子部品の実装構造について説明する。
Here, as a semiconductor device used for this invention, what is shown, for example in FIGS. 1-3 is mentioned.
In this case, FIG. 1 is a cross-sectional view showing a mounting structure of electronic components in a hybrid integrated circuit device to which sealing with the epoxy resin composition of the present invention is applied. FIG. 2 is a top view of the electronic component mounting structure in the hybrid integrated circuit device, and corresponds to a view when viewed from above the sheet of FIG. Hereinafter, a mounting structure of electronic components in a hybrid integrated circuit device using the resin material of the present invention will be described with reference to these drawings.
図１に示されるように、混成集積回路装置は、回路基板１上に表面実装（以下ＳＭＤという（ＳＭＤ：Ｓｕｒｆａｃｅ Ｍｏｕｎｔ Ｄｅｖｉｃｅ））部品２を搭載したのち、回路基板１内の回路配線に電気的に接続された複数個のパッド１ａとＳＭＤ部品２から引き延ばされた複数本のリード２ａとが接合材料３を介して電気的に接続されることで構成されている。
As shown in FIG. 1, a hybrid integrated circuit device has a surface mounting (hereinafter referred to as “SMD: Surface Mount Device”)
そして、このような構造において、本発明では、少なくともリード２ａとパッド１ａとの電気的接合部を覆うように、樹脂部材（上記液状エポキシ樹脂組成物の硬化物）４の封止を備えた構成としているものである。
また、図３は、図１に示した混成集積回路装置において、樹脂部材４が２層構造とされている。具体的には、樹脂部材４が第１樹脂部材４ａと第２樹脂部材４ｂとによって構成されている。第１樹脂部材４ａは、複数本のリード２ａと回路基板１との間に入り込むように構成されたものであり、第２樹脂部材４ｂは、第１樹脂部材４ａの上層に配置されるように構成されたものである。この場合、本発明の樹脂部材は第２樹脂部材４ｂとして好適に使用される。
And in such a structure, in this invention, the structure provided with the sealing of the resin member (hardened | cured material of the said liquid epoxy resin composition) 4 so that the electrical junction part of the
3 shows the hybrid integrated circuit device shown in FIG. 1, in which the resin member 4 has a two-layer structure. Specifically, the resin member 4 is composed of a
以下、実施例及び比較例を挙げて本発明を詳細に説明するが、本発明は下記の実施例に制限されるものではない。 EXAMPLES Hereinafter, although an Example and a comparative example are given and this invention is demonstrated in detail, this invention is not restrict | limited to the following Example.
［実施例、比較例］
下記の成分を表１に示す量で用い、表１に示す成分を３本ロールで均一に混練することにより種々のエポキシ樹脂組成物を得た。これらのエポキシ樹脂組成物を用いて、以下に示す試験を行った。その結果を表１に示す。
[Examples and Comparative Examples]
The following components were used in the amounts shown in Table 1, and various epoxy resin compositions were obtained by uniformly kneading the components shown in Table 1 with three rolls. The test shown below was done using these epoxy resin compositions. The results are shown in Table 1.
（Ａ）液状エポキシ樹脂
ＲＥ３０６：ビスフェノールＦ型エポキシ樹脂（日本化薬（株）製）
共重合体：
Copolymer:
（Ｂ）無機質充填剤
主シリカ：最大粒径５３μｍ以下で、平均粒径７μｍの球状シリカ処理シリカ（株式会社龍森製）
(B) Inorganic filler main silica: spherical silica-treated silica having a maximum particle size of 53 μm or less and an average particle size of 7 μm (manufactured by Tatsumori Co., Ltd.)
（Ｃ）硬化促進剤
２ＰＨＺ−ＰＷ：平均粒径４．２μｍ、最大粒径１５μｍ以下の２−フェニル−４，５−ジヒドロキシメチルイミダゾール粉末（四国化成（株）製）
（Ｄ）非反応性有機ケイ素化合物で表面処理された無機質充填材
シリカＡ：｛（ＣＨ3）3Ｓｉ｝2ＮＨ、ＣＨ3ＣＨ2Ｓｉ（ＯＣＨ3）3で処理された平均粒径０．００８μｍの処理シリカ
シリカＢ：｛（ＣＨ3）3Ｓｉ｝2ＮＨ、ＣＨ3ＣＨ2Ｓｉ（ＯＣＨ3）3で処理された平均粒径０．０１μｍの処理シリカ
シリカＣ：｛（ＣＨ3）3Ｓｉ｝2ＮＨ、ＣＨ3ＣＨ2Ｓｉ（ＯＣＨ3）3で処理された平均粒径０．０８μｍの処理シリカ
シリカＤ：｛（ＣＨ3）3Ｓｉ｝2ＮＨ、ＣＨ3ＣＨ2Ｓｉ（ＯＣＨ3）3で処理された平均粒径０．１２μｍの処理シリカ
(C) Curing accelerator 2PHZ-PW: 2-phenyl-4,5-dihydroxymethylimidazole powder (manufactured by Shikoku Kasei Co., Ltd.) having an average particle size of 4.2 μm and a maximum particle size of 15 μm or less
(D) a non-reactive organic silicon compound surface-treated with inorganic filler <br/> Silica A: {(CH 3) 3 Si} 2 NH, CH 3
（Ｅ）熱可塑性樹脂粒子
熱可塑性粒子Ａ：攪拌羽、滴下漏斗、温度計、還流管を取り付けたフラスコに、粒子状熱可塑性樹脂（ポリメタクリル酸メチル製、数平均分子量５００，０００、重量平均分子量１，５００，０００、平均粒径１μｍ、最大粒径３μｍ）１００ｇと水９００ｇを入れ、２５℃で全体が均一なスラリー状になるまで十分に攪拌した。これとは別に攪拌羽、滴下漏斗、温度計、環流管を取り付けたフラスコに水１００ｇを入れ、攪拌しながらシランカップリング剤（γ−メタクリロキシプロピルトリメトキシシラン）２ｇを１０分程度で滴下し、更に２５℃／２時間で熟成した。このシランカップリング剤水溶液を、粒子状熱可塑性樹脂／水のスラリーに３０分程度で滴下し、更に２５℃／１２時間で熟成した。これから水を除去し、白色粉末にしたもの。
(E) Thermoplastic resin particles Thermoplastic particles A: In a flask equipped with a stirring blade, a dropping funnel, a thermometer, and a reflux tube, a particulate thermoplastic resin (manufactured by polymethyl methacrylate, number average molecular weight 500,000, weight average) (Molecular weight 1,500,000,
その他添加剤
シランカップリング剤：γ−グリシドキシプロピルトリメトキシシラン（ＫＢＭ４０３：信越化学工業株式会社製）
試験
［粘度］Ｅ型回転粘度計を用いて１ｒｐｍの回転数で２５℃における粘度を測定した。
［樹脂の広がり率］
樹脂の広がり率の測定方法は、図４に示すようにガラス板１１（１ｍｍ厚み）に組成物１２の０．１ｇを静置させ、５分後に、事前に１２０℃に設定されたホットプレート上に、前記板を設置する。次に硬化後、冷却させ、硬化物の高さ（ｈ）と直径（ｄ）を測定する。樹脂の広がり率とは、硬化物の高さと直径の比である（ｈ／ｄ）を意味する。
［曲げ強度、曲げ弾性率］ ＪＩＳ−Ｋ−６９１１による方法
［Ｔｇ］：ガラス転移温度
５ｍｍ×５ｍｍ×１５ｍｍの硬化物サンプルを用いてＴＭＡ（熱機械分析装置）により５℃／分の速度で昇温した際の値を測定した。
［ＣＴＥ−１］：Ｔｇ以下の膨張係数
［ＣＴＥ−２］：Ｔｇ以上の膨張係数
上記ガラス転移温度の測定において、ＣＴＥ−１は２０〜５０℃の温度範囲、ＣＴＥ−２は２００〜２３０℃の温度範囲における値を求めた。
［保存安定性試験］２５℃の恒温室に組成物をポリビンに密閉したサンプルに対し、９６時間の粘度変化を測定した。
Other additives Silane coupling agent: γ-glycidoxypropyltrimethoxysilane (KBM403: manufactured by Shin-Etsu Chemical Co., Ltd.)
Test [Viscosity] Using an E-type rotational viscometer, the viscosity at 25 ° C. was measured at 1 rpm.
[Resin spreading ratio]
As shown in FIG. 4, 0.1 g of the composition 12 is allowed to stand on a glass plate 11 (1 mm thickness) as shown in FIG. 4, and after 5 minutes on a hot plate set to 120 ° C. in advance. The plate is installed. Next, after hardening, it is cooled and the height (h) and diameter (d) of the cured product are measured. The spreading rate of the resin means (h / d), which is the ratio of the height and diameter of the cured product.
[Bending strength, flexural modulus] Method according to JIS-K-6911 [Tg]: Glass transition temperature 5 mm x 5 mm x 15 mm of cured material sample is increased at a rate of 5 ° C / min by TMA (thermomechanical analyzer). The value when warmed was measured.
[CTE-1]: Expansion coefficient equal to or less than Tg [CTE-2]: Expansion coefficient equal to or greater than Tg In the measurement of the glass transition temperature, CTE-1 is in a temperature range of 20 to 50 ° C, and CTE-2 is in a range of 200 to 230 ° C. The value in the temperature range was determined.
[Storage Stability Test] A change in viscosity for 96 hours was measured on a sample in which the composition was sealed in a plastic bottle in a thermostatic chamber at 25 ° C.
次に、図１に示した混成集積回路の構造で冷熱サイクル試験を行い、上記実施例、比較例のエポキシ樹脂組成物による耐久性を評価した。結果を表２に示す。
この場合、樹脂部材４は、表１に示す樹脂材料を用い、ディスペンサーにて樹脂を塗布し、１００℃×３０分間高温にし、樹脂を低粘度化させ、ＳＭＤの下部に樹脂を流し込み、接合材料３を覆うようにし、１５０℃×２時間を硬化させた混成集積回路装置に対し、冷熱耐久試験を実施し、はんだ接合部の信頼性評価を実施した。
Next, a thermal cycle test was conducted with the structure of the hybrid integrated circuit shown in FIG. 1, and the durability of the epoxy resin compositions of the above examples and comparative examples was evaluated. The results are shown in Table 2.
In this case, the resin member 4 is made of the resin material shown in Table 1, and is applied with a dispenser, heated to 100 ° C. for 30 minutes to reduce the viscosity of the resin, and the resin is poured into the lower part of the SMD. 3 was covered, and a thermal integrated durability test was conducted on the hybrid integrated circuit device cured at 150 ° C. for 2 hours to evaluate the reliability of the solder joints.
評価として、樹脂の注入性（接合部のカバレージ性）を評価し、また、冷熱耐久試験は、−４０℃／１２５℃を交互に５分間保持し、これを１サイクルとし、繰り返し実施した後の樹脂クラックの有無を確認し、有意判定を実施した。 As an evaluation, the resin injectability (joint coverage) was evaluated, and in the thermal endurance test, −40 ° C./125° C. was alternately held for 5 minutes, and this was repeated for 1 cycle. The presence or absence of the resin crack was confirmed and the significance determination was implemented.
また、図３の混成集積回路装置の構造で同様に冷熱サイクル試験を行った。その結果を表３に示す。
この場合、樹脂部材４ａ，４ｂは、表１に示す樹脂材料を用い、まず、ＳＭＤの下部に樹脂が流し込み易い比較例１の材料をディスペンサーにて塗布し、１００℃×３０分間高温にし、樹脂を低粘度化させ、ＳＭＤの下部に樹脂を流し込んだ。その後、樹脂材料４ｂをディスペンサーにて樹脂を塗布し、接合材料３を覆うようにし、１５０℃×２時間を硬化させた混成集積回路装置に対し、冷熱耐久試験を実施し、はんだ接合部の信頼性評価を実施した。
Further, the thermal cycle test was similarly performed on the structure of the hybrid integrated circuit device of FIG. The results are shown in Table 3.
In this case, the
評価として、樹脂の注入性（接合部のカバレージ性）を評価し、また冷熱耐久試験は、−４０℃／１２５℃を交互に５分間保持し、これを１サイクルとし、繰り返し実施した後の樹脂クラックの有無を確認し、有意判定を実施した。 As an evaluation, resin injectability (joint coverage) was evaluated, and in the thermal endurance test, −40 ° C./125° C. was held alternately for 5 minutes, and this was set as one cycle, and the resin after repeated execution The presence or absence of cracks was confirmed, and significance was determined.
１ 回路基板
１ａ パッド
２ 表面実装部品
２ａ リード
３ 接合材料
４ 樹脂部材（液状エポキシ樹脂組成物の硬化物）
４ａ 第１樹脂部材
４ｂ 第２樹脂部材
DESCRIPTION OF
4a
Claims (8)
（Ａ）液状エポキシ樹脂：１００質量部
（Ｂ）平均粒径が２〜２０μｍの無機質充填剤：１００〜１，０００質量部
（Ｃ）融点が１７０℃以上、平均粒径が１〜５μｍ、最大粒径が２０μｍ以下である下記一般式（１）で示される硬化促進剤：１〜１５質量部
（Ｄ）非反応性有機ケイ素化合物で表面処理された平均粒径が０．０１〜０．１μｍである無機質充填材：０．５〜１０質量部
（Ｅ）平均粒径が０．１〜５μｍ、最大粒径が１０μｍ以下であり、シランカップリング剤で表面処理された、メタクリル樹脂、フェノキシ樹脂、ブタジエン樹脂、ポリスチレン樹脂若しくはこれらの共重合体からなる熱可塑性樹脂粒子、又はシリコーン樹脂、フッ素樹脂若しくはブタジエン樹脂からなるコア部とメタクリル樹脂、フェノキシ樹脂、ブタジエン樹脂、ポリスチレン樹脂若しくはこれらの共重合体からなるシェル部から構成されるコア・シェル構造の熱可塑性樹脂粒子：１〜５０質量部
を必須成分とすることを特徴とする半導体封止用液状エポキシ樹脂組成物。 After mounting the surface mount component on the circuit board, the plurality of pads electrically connected to the circuit wiring in the circuit board and the plurality of leads extended from the surface mount component are connected via the bonding material. In a hybrid integrated circuit device configured by being electrically connected, a liquid epoxy resin composition used for sealing with a resin member so as to cover the electrical joint between the lead and the pad. ,
(A) Liquid epoxy resin: 100 parts by mass (B) Inorganic filler having an average particle diameter of 2 to 20 μm: 100 to 1,000 parts by mass (C) Melting point is 170 ° C. or higher, average particle diameter is 1 to 5 μm, maximum Curing accelerator represented by the following general formula (1) having a particle size of 20 μm or less : 1 to 15 parts by mass
(D) Inorganic filler with an average particle diameter of 0.01 to 0.1 μm surface-treated with a non-reactive organosilicon compound: 0.5 to 10 parts by mass (E) An average particle diameter of 0.1 to 5 μm , Thermoplastic resin particles comprising a methacrylic resin, a phenoxy resin, a butadiene resin, a polystyrene resin or a copolymer thereof having a maximum particle size of 10 μm or less and surface-treated with a silane coupling agent, or a silicone resin or a fluororesin Alternatively, core / shell structure thermoplastic resin particles composed of a core portion made of butadiene resin and a shell portion made of methacrylic resin, phenoxy resin, butadiene resin, polystyrene resin or a copolymer thereof : 1 to 50 parts by mass are essential A liquid epoxy resin composition for encapsulating a semiconductor, characterized by comprising a component.
（Ａ）液状エポキシ樹脂：１００質量部
（Ｂ）平均粒径が２〜２０μｍの無機質充填剤：１００〜１，０００質量部
（Ｃ）融点が１７０℃以上、平均粒径が１〜５μｍ、最大粒径が２０μｍ以下である下記一般式（１）で示される硬化促進剤：１〜１５質量部
（Ｄ）非反応性有機ケイ素化合物で表面処理された平均粒径が０．０１〜０．１μｍである無機質充填材：０．５〜１０質量部
（Ｅ）平均粒径が０．１〜５μｍ、最大粒径が１０μｍ以下であり、シランカップリング剤で表面処理された、メタクリル樹脂、フェノキシ樹脂、ブタジエン樹脂、ポリスチレン樹脂若しくはこれらの共重合体からなる熱可塑性樹脂粒子、又はシリコーン樹脂、フッ素樹脂若しくはブタジエン樹脂からなるコア部とメタクリル樹脂、フェノキシ樹脂、ブタジエン樹脂、ポリスチレン樹脂若しくはこれらの共重合体からなるシェル部から構成されるコア・シェル構造の熱可塑性樹脂粒子：１〜５０質量部
を必須成分とすることを特徴とする半導体封止用液状エポキシ樹脂組成物。 After mounting the surface mount component on the circuit board, the plurality of pads electrically connected to the circuit wiring in the circuit board and the plurality of leads extended from the surface mount component are connected via the bonding material. In the hybrid integrated circuit device configured by being electrically connected, the first resin member configured to enter between the lead and the circuit board and the upper layer of the first resin member are disposed. When sealing with a resin member so as to cover the electrical joint with the configured second resin member, a liquid epoxy resin composition used for the second resin member,
(A) Liquid epoxy resin: 100 parts by mass (B) Inorganic filler having an average particle diameter of 2 to 20 μm: 100 to 1,000 parts by mass (C) Melting point is 170 ° C. or higher, average particle diameter is 1 to 5 μm, maximum Curing accelerator represented by the following general formula (1) having a particle size of 20 μm or less : 1 to 15 parts by mass
(D) Inorganic filler with an average particle diameter of 0.01 to 0.1 μm surface-treated with a non-reactive organosilicon compound: 0.5 to 10 parts by mass (E) An average particle diameter of 0.1 to 5 μm , Thermoplastic resin particles comprising a methacrylic resin, a phenoxy resin, a butadiene resin, a polystyrene resin or a copolymer thereof having a maximum particle size of 10 μm or less and surface-treated with a silane coupling agent, or a silicone resin or a fluororesin Alternatively, core / shell structure thermoplastic resin particles composed of a core portion made of butadiene resin and a shell portion made of methacrylic resin, phenoxy resin, butadiene resin, polystyrene resin or a copolymer thereof : 1 to 50 parts by mass are essential A liquid epoxy resin composition for encapsulating a semiconductor, characterized by comprising a component.
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