JP4904246B2 - Capacitor manufacturing method, capacitor - Google Patents

Description

  The present invention relates to a method for manufacturing a capacitor, and more particularly to a method for manufacturing a capacitor using nanofibers obtained by electrostatic explosion as a dielectric layer.

  In recent years, information communication devices such as mobile phones are required to be downsized and highly functional. Accordingly, circuit boards used in mobile phones and the like are also required to be miniaturized, and in order to realize high functions, this is achieved by narrowing the component mounting pitch.

  However, since the component mounting pitch is reaching its limit, it is conceivable that passive elements and the like are included in the circuit board to form a multilayer structure, thereby increasing the degree of component integration and further miniaturizing the circuit board. Yes.

  For example, the circuit board described in Patent Document 1 is intended to be multilayered by sandwiching a chip-type capacitor component between a plurality of resin substrates.

In the invention described in Patent Document 2, multilayering is achieved by forming a capacitor including a pair of electrodes on a part of a ceramic substrate laminated in multiple layers.
JP-A-2-74099 JP-A-8-213755

  However, when a chip-type capacitor component is sandwiched between the resin substrates, there is a problem that the substrate cannot be thin as a whole because the chip-type capacitor component is thick.

  In addition, when a capacitor is manufactured between ceramic substrates, a capacitor having an accurate capacitance cannot be obtained because it is formed and fired. In addition, it is necessary to repeat a large-scale process, and there is a problem that manufacturing is difficult.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a capacitor manufacturing method capable of easily manufacturing a small-sized and large-capacity capacitor.

  In order to achieve the above object, a capacitor manufacturing method according to the present invention is a capacitor manufacturing method including a conductor layer forming step and a dielectric layer forming step, wherein the dielectric layer forming step forms the dielectric layer. Is a first discharge step of discharging a first raw material liquid containing a dielectric material from a discharge port, a first charging step of charging the first raw material liquid, and between the discharge port and the conductor layer, A first electric field generating step for generating an electric field in a direction in which the charged first raw material liquid flies toward the conductor layer; and the dielectric material is formed by electrostatic explosion of the first raw material liquid in flight. A first short fiber forming step for forming the first short fiber; and a first deposition step for depositing the first short fiber that has passed through the transmission hole on the conductor layer using a mask means having a transmission hole. Special to include To.

  As a result, the dielectric layer of the capacitor is formed by depositing nanofibers obtained by electrostatic explosion, so that it is possible to easily and locally form the dielectric layer of the capacitor. In addition, since the dielectric layer is formed of nanofibers, the capacitance can be improved.

  Furthermore, the conductor layer forming step for forming the conductor layer includes a second discharge step for discharging a second raw material liquid containing a conductive material from a discharge port, and a second charging step for charging the second raw material liquid. A second electric field generating step of generating an electric field in a direction in which the charged second raw material liquid flies toward the dielectric layer between the discharge port and the dielectric layer; and a second in flight A second short fiber forming step for forming the conductor material on the second short fiber by electrostatic explosion of the raw material liquid, and a mask means having a permeation hole, and the second short fiber passing through the permeation hole A second deposition step of depositing on the dielectric layer.

  As a result, in addition to the dielectric layer, the conductor layer is also formed of nanofibers obtained by electrostatic explosion, so that the capacitance can be further improved in combination with the nanofibers in the dielectric layer. It becomes possible. Moreover, the point which can form a conductor layer easily and locally is the same as the above.

  Further, in the capacitor manufacturing method in which the second deposition step is repeated a plurality of times, in the second deposition step, the second short fibers are deposited so as to protrude in one direction from the dielectric layer, and the first first deposition step is performed. In another second deposition step of forming a conductor layer adjacent to the second deposition step, it is preferable to deposit the second short fibers so as to protrude in the other direction from the dielectric layer.

  Thereby, each conductor layer can be connected, and the capacitance can be easily adjusted only by adjusting the number of layers to be stacked only by the method according to the present invention. Further, it is possible to connect to an electrode or the like provided on the substrate.

  Moreover, since the capacitor obtained by the above method includes a layer in which nanofibers are deposited in a nonwoven fabric shape, its performance can be exhibited by the shape characteristics.

  According to the present invention, since a capacitor can be manufactured at a relatively low temperature, it is possible to easily manufacture a capacitor even in a part with limited manufacturing conditions such as a capacitor included in a circuit board.

  Next, an embodiment of a capacitor manufacturing method according to the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a diagram schematically showing a layer forming apparatus for forming layers such as a dielectric layer and a conductor layer of a capacitor.

FIG. 2 is a perspective view schematically showing the layer forming apparatus.
As shown in these drawings, the layer forming apparatus 100 is an apparatus that can form each layer of a capacitor having a layer structure. The layer forming apparatus 100 includes a raw material liquid 200 (a first raw material liquid containing a dielectric material when forming a dielectric layer, a second raw material liquid containing a conductive material when forming a conductor layer, and so on). Is charged and sprayed, and the sprayed raw material liquid 200 is electrostatically exploded in the space, and a predetermined portion of the substrate 210 (an electrode, a conductor layer, or a dielectric layer provided in advance on the substrate 210) The first short fiber made of a dielectric material when a dielectric layer is formed on the substrate 210. The second short fiber made of a conductor material is formed when forming a conductor layer. A first discharger 101, a fluid nozzle 102, a charge supply power source 103 as a charging unit, an electric field generating electrode 104 as an electric field generating unit, and an electric field generating power source 105. , Mask means 20 It is equipped with a door.

  The layer forming apparatus 100 further includes an electric field control plate 106, an electric field control power source 107, a gas supply source 111 that supplies a gas 110 as a fluid, and a raw material supply source 120. The gas used here may be air and is not particularly limited. Moreover, you may mix the raw material liquid 200 and gas using inert gas like nitrogen gas.

  The first discharge body 101 is a nozzle having a first discharge port 108 through which the raw material liquid 200 supplied from the raw material supply source 120 is discharged. The first discharge body 101 is connected to the tip of the supply path of the raw material liquid 200 and is connected to the first discharge port 108. This is a nozzle whose diameter is reduced toward the nozzle. In addition, the first discharge body 101 has at least a peripheral portion of the first discharge port 108 made of a conductive material, and a charge supply electrode for applying a charge supplied from the charge supply power source 103 to the raw material liquid 200 for charging. It is functioning as well.

  The fluid nozzle 102 is a nozzle having a fluid nozzle port 109 through which the gas 110 supplied from the gas supply source 111 is discharged. The fluid nozzle 102 is disposed so as to surround the first discharge body 101, and the fluid nozzle port 109 has an annular shape surrounding the first discharge port 108. The fluid nozzle 102 has a cylindrical shape arranged concentrically with the first discharge body 101, and the end on the opposite side of the fluid nozzle port 109 is in close contact with the outer periphery of the first discharge body 101 and is in a closed state. ing. In addition, an introduction hole for introducing the gas 110 is provided in the peripheral wall of the fluid nozzle 102.

  As described above, the first discharge body 101 and the fluid nozzle 102 form a so-called two-fluid nozzle.

  The charge supply power source 103 is a DC power source that functions as a charging unit that supplies charges to the raw material liquid 200 via the first discharge body 101, and a potential that becomes a voltage in the range of 2 KV or more and 200 KV or less is used as the charge supply electrode. It can be applied to the functioning first discharge body 101.

  The substrate 210 is a member that becomes a base for manufacturing a capacitor. The substrate 210 is a constituent member constituting a predetermined layer of the circuit board, and a circuit pattern is provided on the surface, and in order to conduct from the back surface of the substrate 210 to the circuit pattern on the surface, in the thickness direction of the substrate 210. A penetrating pattern penetrating is provided. The substrate 210 is a nanofiber deposition target for the layer forming apparatus 100 and is not a constituent member of the layer forming apparatus 100 in principle. However, the circuit pattern included in the substrate 210 functions as the electric field generating electrode 104. Note that a conductor layer, which will be described later, is electrically connected to the circuit pattern and functions as the electric field generating electrode 104.

  The electric field generating power source 105 is a DC power source that applies a predetermined potential to a circuit pattern or a conductor layer on the substrate 210 that functions as the electric field generating electrode 104, and the raw material liquid 200 flowing out from the first discharge body 101 is charged, The charged raw material liquid floating in the space can be efficiently deposited on the electric field generating electrode 104. The electric field generating power source applies a voltage having a polarity opposite to that of the charged raw material liquid, and selects a voltage within a range of several hundred V to 100 KV. A potential having a voltage in the range of 2 KV or more and 200 KV or less can be applied to the electric field generating electrode 104 with respect to the first ejection body 101.

  The electric field control plate 106 adjusts the electric field generated in the flight space of the raw material liquid 200, concentrates as much of the raw material liquid 200 as possible on the electric field generating electrode 104 on the substrate 210, and deposits nanofibers efficiently. It is a member. Further, as shown in FIG. 2, the electric field control plate 106 has a shape of a part of a hollow true sphere, and is disposed in the vicinity of the fluid nozzle 102 with a so-called bowl lying down. A circular hole is provided in the upper end portion of the electric field control plate 106, and the first discharge port 108 is located at the center of the hole. When the substrate 210 is large, an electric field control plate is not necessary, the raw material liquid 200 may be spread over the entire substrate 210, and the raw material liquid 200 may be deposited at a specific location by the mask unit 201.

  The electric field control power source 107 is a DC power source that applies a potential to the electric field control plate 106 with a voltage in the range of 2 KV to 200 KV with respect to the electric field generating electrode 104.

  The mask means 201 is a member for depositing the raw material liquid (nanofiber) that has flew only at a predetermined location of the circuit pattern provided on the substrate 210, and a through hole 203 is provided in a portion corresponding to the location where the capacitor is formed. It is a thin metal plate provided.

  The mask power source 202 applies a predetermined voltage to the electric field generating electrode 104. The voltage is a direct current power source that applies a potential in the range of several hundred volts or less to the mask means 201. Further, the mask means 201 may be grounded instead of the mask power source 202.

  Here, the charge supply power source 103, the electric field generation power source 105, the electric field control power source 107, and the mask power source 202 can independently set the applied potential with reference to the ground potential. The voltage between the first discharge body 101 and the electric field generating electrode 104 may be 2 KV or more and 200 KV or less, and the polarity of the voltage of the electric field generating electrode 104 may be the reverse polarity of the charged charge of the sprayed raw material liquid 200. . Further, either the first discharge body 101 or the electric field generating electrode 104 may be in a grounded state. When the dielectric material has a cation or a cationic functional group, the polarity of the electric field generating electrode 104 is preferably negative, and when the dielectric material has an anion or an anionic functional group, The polarity of the electric field generating electrode 104 is preferably positive.

  The gas supply source 111 is a means for supplying a gas as a fluid discharged from the fluid nozzle port 109, and is a gas cylinder capable of supplying the gas 110 at a predetermined pressure. In addition, the kind of gas is not specifically limited, It selects suitably according to the kind etc. of the raw material liquid sprayed. Further, when the gas 110 is air, a gas cylinder is not particularly required, and air used in a general factory may be supplied after being dried to a predetermined value.

  The raw material supply source 120 heats and adjusts the solution to a predetermined viscosity while producing the raw material liquid 200 by mixing or stirring a dielectric material or a conductor material and a solvent, and then at a predetermined pressure. The apparatus is capable of supplying the raw material liquid 200 to one discharge body 101 and includes a hopper 121 and a heater 122.

  The hopper 121 is an apparatus into which an organic or inorganic material, an organic solvent, or the like is charged, and a mixer such as a twin screw extruder is connected to the tip of the hopper 121.

  The heater 122 is a heating unit that heats the first raw material liquid mixed in the mixer, and is one of means for adjusting the viscosity of the first raw material liquid to be discharged.

  As the raw material liquid 200, a suitable raw material liquid 200 is selected depending on the capacity and characteristics required of the capacitor, the use of the circuit board, and the like.

For example, as a 1st raw material liquid, what melt | dissolves and mixes an organic solvent in an epoxy resin, a polyimide resin, a LCP (liquid crystal polymer) resin etc. can be illustrated. Further, an inorganic ferroelectric material may be mixed in the solution. Examples of the ferroelectric material include barium titanate (BaTiO ₃ ) and titanium oxide, and Mg, Ca, Nb, Co, Mn, Ni, Si, B, Bi, Zn, Cu, Ho, Zr, It may be titanic acid containing at least one element selected from the group of Hf and Sr.

  Furthermore, as another dielectric material, a substance having a high dielectric constant is considered preferable. However, when the capacitor manufacturing method according to the present invention is used, the first short fibers are deposited in a non-woven fabric to form a dielectric layer. It is also considered that there is a possibility as a dielectric material. Currently, examples of the dielectric material include polypropylene, polyethylene, polystyrene, polyethylene oxide, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, poly-m-phenylene terephthalate, poly-p-phenylene isophthalate, polyvinylidene fluoride, Polyvinylidene fluoride-hexafluoropropylene copolymer, polyvinyl chloride, polyvinylidene chloride-acrylate copolymer, polyacrylonitrile, polyacrylonitrile-methacrylate copolymer, polycarbonate, polyarylate, polyester carbonate, nylon, aramid, polycaprolactone, Examples thereof include polylactic acid, polyglycolic acid, collagen, polyhydroxybutyric acid, polyvinyl acetate, and polypeptide. Moreover, the above-mentioned one type may be used, or a plurality of types may be mixed and used at a predetermined ratio.

  Examples of other inorganic solid materials include metals, oxides, carbides, nitrides, borides, silicides, fluorides, sulfides, and the like. By mixing these inorganic substances, it is possible to adjust the characteristics of the dielectric layer. For example, the electrical properties (dielectric constant, etc.), mechanical and physical properties (heat resistance, weather resistance, stability over time, temperature characteristics, etc.) of the dielectric layer can be adjusted by mixing conductive materials such as metals. It is also possible to do.

Specific examples of the inorganic solid material include Al ₂ O ₃ , SiO ₂ , TiO ₂ , Li ₂ O, Na ₂ O, MgO, CaO, SrO, BaO, B ₂ O ₃ , P ₂ O ₅ , SnO ₂ , ZrO. ₂ , K ₂ O, Cs ₂ O, ZnO, Sb ₂ O ₃ , As ₂ O ₃ , CeO ₂ , V ₂ O ₅ , Cr ₂ O ₃ , MnO, Fe ₂ O ₃ , CoO, NiO, Y ₂ O ₃ , Lu ₂ O ₃ , Yb ₂ O ₃ , HfO ₂ , Nb ₂ O _{5 and the} like. Moreover, the above-mentioned one type may be used, or a plurality of types may be mixed and used at a predetermined ratio.

  As the solvent that can be used, a solvent in which the raw material liquid 200 evaporates (volatilizes) while flying in a space is preferable. Specific examples include acetonitrile, toluene, dichloromethane, alcohols such as methanol and ethanol, and acetone. Furthermore, methanol, ethanol, 1-propanol, 2-propanol, hexafluoroisopropanol, tetraethylene glycol, triethylene glycol, dibenzyl alcohol, 1,3-dioxolane, 1,4-dioxane, methyl ethyl ketone, methyl isobutyl ketone, methyl -N-hexyl ketone, methyl-n-propyl ketone, diisopropyl ketone, diisobutyl ketone, acetone, hexafluoroacetone, phenol, formic acid, methyl formate, ethyl formate, propyl formate, methyl benzoate, ethyl benzoate, propyl benzoate, Methyl acetate, ethyl acetate, propyl acetate, dimethyl phthalate, diethyl phthalate, dipropyl phthalate, methyl chloride, ethyl chloride, methylene chloride, chloroform, o-chlorotoluene, p Chlorotoluene, chloroform, carbon tetrachloride, 1,1-dichloroethane, 1,2-dichloroethane, trichloroethane, dichloropropane, dibromoethane, dibromopropane, methyl bromide, ethyl bromide, propyl bromide, acetic acid, benzene, toluene, Examples include hexane, cyclohexane, cyclohexanone, cyclopentane, o-xylene, p-xylene, m-xylene, acetonitrile, tetrahydrofuran, N, N-dimethylformamide, pyridine, water and the like. Moreover, the above-mentioned one type may be used, or a plurality of types may be mixed and used at a predetermined ratio.

  Moreover, what is necessary is just to use the solution obtained by mixing the organic binder as a conductor material with an organic solvent as a 2nd raw material liquid. Examples of organic binders include cellulose derivatives such as methyl cellulose, ethyl cellulose, and carboxymethyl cellulose, polyvinyl alcohols, polyvinyl pyrrolidones, acrylic resins, vinyl acetate-acrylic ester Examples thereof include butyral resin derivatives such as coalescence and polyvinyl butyral. Moreover, you may use these resin individually or in mixture of 2 or more types.

  Examples of the solvent for dissolving and dispersing these resins include dioxane, hexane, toluene, ethyl cellosolve, cyclohexanone, butyl cellosolve, butyl cellosolve acetate, butyl carbitol acetate, diethylene glycol monoethyl ether, diethylene glycol diethyl ether, diacetone alcohol, terpineol, Examples include benzyl alcohol, N-methylpyrrolidone, dimethylformamide and the like. These may be used alone or in combination of two or more.

  Further, a Ni resinate paint mainly composed of a Ni resinate compound such as Ni octylate and an organic binder such as an acrylic resin may be used.

  Alternatively, a conductive material such as a metal may be mixed into an organic material that does not have conductivity, such as the dielectric material, and conductivity may be imparted to the entire generated second short fiber.

  Next, using the layer forming apparatus 100, a dielectric layer and a conductor layer on which the first short fibers made of a dielectric material or the second short fibers made of a conductor material are deposited are formed on the substrate 210. A method for manufacturing the capacitor will be described.

FIG. 3 is a diagram schematically showing a plurality of layer forming apparatuses arranged inline.
FIG. 4 is a schematic diagram showing the state of layer formation step by step.

(Formation of dielectric layer)
The dielectric layer forming step is executed as follows. First, the substrate 210 is placed in the layer forming apparatus 100a for forming the dielectric layer, and the electrode a (see FIG. 4A) provided in advance on the substrate 210 and the electric field generating power source 105 are connected.

  As a result, the electrode a on the substrate 210 functions as the electric field generating electrode 104. The connection between the electric field generating electrode 104 and the electric field generating power source 105 on the substrate is provided so as to penetrate in the thickness direction of the substrate 210 in order to connect to an electronic component that is surface-mounted when the circuit substrate is completed. A through electrode 151 (such as a via hole) may be used.

  Next, necessary dielectric materials, solvents, and the like are charged into the raw material supply source 120a to manufacture the first raw material liquid 200a.

  Next, the charge supply power source 103, the electric field generation power source 105, the electric field control power source 107, and the mask power source 202 are operated. As a result, an electric field is generated such that the discharged first raw material liquid 200a flies in the direction of the substrate 210 (first electric field generation step).

  Next, the first raw material liquid 200 a is discharged from the first discharge port 108 (first discharge step), and at the same time, gas is discharged from the fluid nozzle port 109.

  Here, the first raw material liquid 200a discharged from the first discharge port 108 passes through the first discharge body 101 connected to the charge supply power source 103, and charges are supplied and charged during the passage (the first Charging step).

  As described above, the charged first raw material liquid 200a is scattered as quite small particles due to the effect of the two-fluid nozzle.

  Next, the first raw material liquid 200 a having small particles is applied with a force in the direction of the substrate 210 along the electric field (lines of electric force) and flies toward the substrate 210. Further, electrostatic explosion occurs while the first raw material liquid 200a is flying in the space, and the particles of the first raw material liquid 200a are subdivided into fibers (first short fiber forming step).

  Here, electrostatic explosion means the following phenomenon. That is, the solvent evaporates when the charged first raw material liquid 200a flies through the space. Then, as the solvent evaporates, the charge density of the first raw material liquid 200a in flight in the space increases. The first raw material liquid 200a explodes when the repulsive Coulomb force generated in the first raw material liquid 200a having an increased charge density exceeds the surface tension of the first raw material liquid 200a, and the first raw material liquid 200a becomes fibrous. Subdivided.

  As the electrostatic explosions occur one after another in the space, the very small first raw material liquid 200a changes to the first short fibers.

  As described above, in the space between the first discharge body 101 and the substrate 210, the first raw material liquid 200a of fine particles is distributed from the first short fibers.

  Finally, a first short fiber made of a dielectric material that has passed through the through hole 203 of the mask means 201 is deposited at a predetermined location on the electric field generating electrode 104 on the substrate 210 (first deposition step) (FIG. 4B). reference).

(Formation of second conductor layer)
Next, in order to form the conductor layer, the substrate 210 on which the dielectric layer is formed is moved to the layer forming apparatus 100b for forming the conductor layer, and the electrode a and the electric field generating power source 105 are connected. . Note that the conductor layer formed here is a second conductor layer electrically connected to the electrode b.

  Next, necessary conductor materials, solvents, and the like are charged into the raw material supply source 120b to manufacture the second raw material liquid 200b.

  Next, the charge supply power source 103, the electric field generation power source 105, the electric field control power source 107, and the mask power source 202 are operated. As a result, an electric field is generated such that the discharged second raw material liquid 200b flies in the direction of the substrate 210 (second electric field generation step).

  Next, the second raw material liquid 200 b is discharged from the first discharge port 108 (second discharge step), and at the same time, gas is discharged from the fluid nozzle port 109.

  Here, the second raw material liquid 200b discharged from the first discharge port 108 passes through the first discharge body 101 connected to the charge supply power source 103, and charges are supplied and charged during the passage (second discharge). Charging step).

  Next, the sprayed second raw material liquid 200 b is applied with a force in the direction of the substrate 210 along the electric field (lines of electric force) and flies toward the substrate 210. Further, electrostatic explosion occurs while the second raw material liquid 200b is flying in the space, and the particles of the second raw material liquid 200b are subdivided into fibers (second short fiber forming step). The electrostatic explosions occur one after another in the space, and the very small second raw material liquid 200b is changed to the second short fibers.

  Finally, a first short fiber made of a dielectric material that has passed through the through hole 203 of the mask means 201 is deposited at a predetermined position on the electric field generating electrode 104 on the substrate 210 (second deposition step) (FIG. 4C). reference).

  Here, the position of the through hole 203 of the mask means 201 in the second deposition step is arranged in a state slightly deviated from the previously deposited dielectric layer to the electrode b side, as shown in FIG. ing. And in the said 2nd deposition step, the 2nd short fiber used as a conductor layer is deposited so that it may protrude to the electrode b side from a dielectric material layer.

  Thereby, it becomes possible to electrically connect the electrode b and the conductor layer.

(Formation of dielectric layer)
Next, in order to form the dielectric layer, the substrate 210 on which the conductor layer was formed in the previous step is moved to the layer forming apparatus 100c for forming the dielectric layer, and the dielectric layer is formed in the same manner as described above. (See FIG. 4 (d)).

  In this case, the electrode b and the second conductor layer may be the electric field generating electrode 104. This is because the second conductor layer is located in the uppermost layer.

(Formation of the first conductor layer)
Further, in order to form the conductor layer, the substrate 210 on which the dielectric layer is formed is moved to the layer forming apparatus 100d for forming the conductor layer, and the conductor layer is formed in the same manner as described above (FIG. 4 ( e)).

  Here, the position of the through hole 203 of the mask means 201 in the second deposition step is arranged in a state slightly shifted from the previously deposited dielectric layer toward the electrode a as shown in FIG. The second deposition step (see FIG. 4C) in which the conductor layer is formed first is different from the direction in which the dielectric layer is displaced. And in the said 2nd deposition step, the 2nd short fiber used as a conductor layer is deposited so that it may protrude to the electrode a side from a dielectric material layer.

  Furthermore, as shown in FIG. 4 (f) and FIG. 4 (g), if the dielectric layer and the conductor layer are sequentially formed, the dielectric layer and the conductor layer as shown in FIG. A capacitor made of a non-woven thin film made of nanofibers (short fibers) formed by electrostatic explosion can be manufactured.

  Furthermore, by forming the conductor layer so as to protrude alternately from the dielectric layer, the conductor layer alternately includes a first conductor layer connected to the electrode a and a second conductor layer connected to the electrode b, The first conductor layer is formed in a comb-teeth shape connected to the end in the electrode a direction, and the second conductor layer is a capacitor formed in a comb-teeth shape connected in the electrode b direction. Can be manufactured.

  After the capacitor is manufactured on the substrate 210 as described above, each layer constituting the circuit substrate is provided in addition to the portion of the substrate 210 where the capacitor is formed. As shown in FIG. Can be formed.

  When the capacitor is manufactured by the above method, a dielectric layer in which nanofibers (short fibers) having a diameter of 300 nm or less obtained by electrostatic explosion are deposited in a nonwoven fabric shape is formed. This dielectric layer is porous and has a very large surface area. Accordingly, air existing in the hole portion of the dielectric layer can also function as the dielectric layer, and a capacitor having a high capacitance can be manufactured.

  Furthermore, by forming a conductor layer in which nanofibers are deposited in a non-woven form, the surface area for holding electric charges is widened, so that it is possible to manufacture a compact and high-capacitance capacitor.

  Further, according to the above capacitor manufacturing method, a large-scale facility such as a furnace for superheating and a chamber for placing a substrate in a vacuum is not required, and the capacitor can be manufactured easily. In addition, the number of layers and the state of the layers in the capacitor can be easily adjusted, and the capacitance can be easily adjusted.

  Furthermore, if the capacitor formed by the above method is included in the circuit board, the capacitor is formed at a relatively low temperature. Therefore, not only ceramics but also resin may be adopted as the material of the substrate 210, and the flexibility of the circuit board In addition, it is possible to improve the lightness. In addition, since a small capacitor having a high capacitance is formed, it is possible to reduce the thickness of the entire circuit board.

  In the above embodiment, the conductor layer is formed of nanofibers, but the present invention is not limited to this. For example, the conductor layer may be formed by spraying metal.

  It is also possible to use the dielectric layer as a separator and fill the space in the circuit board where the capacitor is formed with an electrolytic solution to form an electrolytic capacitor.

(Embodiment 2)
Next, Embodiment 2 will be described with reference to the drawings.

FIG. 7 is a schematic cross-sectional view of the layer forming apparatus according to the second embodiment.
As shown in the figure, the layer forming apparatus 100 is similar to the first embodiment in the apparatus configuration. Therefore, description of members having the same function is omitted.

  The layer forming apparatus 100 includes a first discharge body 101, a charge supply electrode 131, an electric field generating electrode 104 that also functions as a mask unit, an electric field generating power source 105, a chamber 230, and a chamber power source 220.

  The first discharge body 101 is a device capable of spraying the raw material liquid 200, and a fine first discharge port 108 for spraying is provided at a tapered tip. The first discharge body 101 is attached to an L-shaped attachment member that hangs down from the ceiling of the chamber 230.

  The charge supply electrode 131 is one of charge supply means for supplying charge to the raw material liquid 200. In the present embodiment, the charge supply electrode 131 applies charge to the raw material liquid 200 passing through the inside of the first ejection body 101. It has become. The charge supply electrode 131 is connected to the charge supply power source 103.

  The electric field control plate 106 is applied with a potential having the same polarity as the polarity of the raw material liquid 200 sprayed from the first discharge body 101, so that the raw material liquid 200 which is sprayed and flies randomly is formed by a predetermined electric field. A member that guides in a direction. The electric field control plate 106 has a shape of a part of a hollow true sphere, and is attached to the chamber 230 in a state where the so-called bowl is turned down. A circular hole is provided in the upper end portion of the electric field control plate 106, and the first discharge body 101 is disposed at the center of the hole. In other words, the electric field control plate 106 is disposed so as to surround the first discharge body 101 disposed at the center of the hole. The chamber 230 and the electric field control plate 106 are in an insulated state.

  The presence of the electric field control plate 106 makes it possible to improve the amount of the deposited element material with respect to the amount of the sprayed raw material liquid 200.

  The electric field generating electrode 104 is a plate-like member that induces an electric charge to a predetermined electrode of the substrate 210, and as shown in FIG. It is functioning. Here, the hatching in FIG. 8A indicates the substantial part of the electric field generating electrode 104. The electric field generating electrode 104 has a two-layer structure, and includes an insulator layer 141 and a conductor layer 142 as shown in FIG. When the insulator layer 141 is disposed on the electric field control plate 106 side, the conductor layer 142 cannot be seen from the electric field control plate 106 side, and an electric field (electric field lines) is generated directly from the electric field control plate 106 toward the electric field generating electrode 104. No longer.

  The chamber 230 is a box for preventing dust and the like from being mixed into the raw material liquid 200, and at least the inner surface is made of a conductive substance. In the state where the raw material liquid 200 is deposited, the chamber 230 is applied with a potential having the same polarity as that of the raw material liquid 200 by the chamber power supply 220 and contributes to the formation of an electric field necessary for the deposition of the raw material liquid 200. Further, in the state where the deposition of the raw material liquid 200 is completed, the chamber 230 is applied with a potential having a polarity opposite to that of the raw material liquid 200 by the chamber power source 220 and adsorbs the raw material liquid 200 remaining in the space in the chamber 230. Increase the cleanliness within 230. That is, the chamber 230 functions as an adsorption member. In addition, when various members are charged and there is a concern about occurrence of abnormal discharge such as corona discharge, an AC voltage is applied to the chamber 230 by the chamber power source 220, and the various members are discharged.

  The raw material supply source 120 is a device that supplies the raw material liquid 200 to the first discharge body 101, and includes a raw material tank 123 and a pump 124.

The raw material tank 123 is a tank that stores the first raw material liquid or the second raw material liquid.
The pump 124 is a pump that applies a pressure necessary for spraying the raw material liquid 200 from the first discharge body 101 to the raw material liquid 200.

Next, a layer forming method using the layer forming apparatus 100 according to the second embodiment will be described.
First, the substrate 210 is placed in the layer forming apparatus 100, and an electrode as a circuit pattern provided in advance on the substrate 210 is grounded.

  Next, the charge supply power source 103, the electric field generation power source 105, and the electric field control power source 107 are operated. As a result, an electric field is generated such that the discharged raw material liquid 200 flies in the direction of the substrate 210 (first electric field generation step, second electric field generation step).

  Here, in the second embodiment, a high voltage is applied to the conductor layer 142 of the electric field generating electrode 104 from the electric field generating power source 105 with respect to the ground potential. As a result, charges are induced in the electrodes on the substrate 210.

  Next, the raw material liquid 200 is discharged from the first discharge port 108 (first discharge step, second discharge step).

  Here, the raw material liquid 200 discharged from the first discharge port 108 is charged by being supplied with charges by the charge supply electrode 131 connected to the charge supply power source 103 (first charging step, second charging step).

  Next, the small-particle raw material liquid 200 is applied with a force in the direction of the substrate 210 along the electric field (electric field lines) and flies toward the substrate 210.

  Further, electrostatic explosion occurs while the raw material liquid 200 is flying through the space, and the particles of the raw material liquid 200 are further subdivided into fibers.

  As described above, in the space between the first discharge body 101 and the substrate 210, the raw material liquid 200 of fine particles is distributed.

  Finally, a dielectric material or a conductive material (the solvent has considerably evaporated) is deposited at a predetermined position on the electric field generating electrode 104 on the substrate 210 (first deposition step, second deposition step).

  Dielectric material for forming capacitors only where needed by depositing the dielectric material that became nanofibers or the conductive material that became nanofibers to form a non-woven layer. A layer or a conductor layer can be formed.

  According to the present embodiment, since the electrode of the substrate 210 itself is at the ground potential, it is possible to avoid as much as possible damage to the substrate 210 and each layer of the capacitor due to abnormal discharge or the like.

  INDUSTRIAL APPLICABILITY The present invention can be used for manufacturing a capacitor that is a capacitor, and in particular, can be used for manufacturing a capacitor included in a circuit board.

It is a figure which shows typically the layer forming apparatus which forms layers, such as a dielectric material layer and a conductor layer, of a capacitor. It is a perspective view which shows a layer forming apparatus typically. It is a figure which shows typically the several layer forming apparatus arrange | positioned in-line. It is a schematic diagram which shows the mode of layer formation in steps. It is sectional drawing which shows the capacitor | condenser formed on the board | substrate. It is a figure which shows typically the other aspect of a layer formation apparatus. FIG. 5 is a cross-sectional view schematically showing a layer forming apparatus according to a second embodiment. It is a figure which shows the electrolysis generation electrode which functions also as a mask means.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Layer formation apparatus 101 1st discharge body 102 Nozzle 103 Charge supply power supply 104 Electric field generation electrode 105 Electric field generation power supply 106 Electric field control board 107 Electric field control power supply 108 First discharge port 109 Fluid nozzle port 111 Gas supply source 120 Raw material supply source 121 Hopper 122 heater 123 tank 124 pump 131 charge supply electrode 141 insulator layer 142 conductor layer 151 through electrode 200 raw material liquid 200a first raw material liquid 200b second raw material liquid 201 mask means 202 mask power source 203 through hole 210 substrate 220 chamber power source 230 chamber

Claims (4)

A capacitor manufacturing method including a conductor layer forming step and a dielectric layer forming step,
The dielectric layer forming step for forming the dielectric layer comprises:
A first discharge step of discharging a first raw material liquid containing a dielectric material from a discharge port;
A first charging step for charging the first raw material liquid;
A first electric field generating step for generating an electric field in a direction in which the charged first raw material liquid flies toward the conductor layer between the discharge port and the conductor layer;
A first short fiber forming step of forming the dielectric material into the first short fibers by electrostatic explosion of the first raw material liquid in flight;
Using the mask means comprising a transmission hole, saw including a first deposition step of depositing the first short fibers having passed through the transmitting hole in the conductor layer
The conductor layer forming step for forming the conductor layer includes:
A second discharge step of discharging the second raw material liquid containing the conductor material from the discharge port;
A second charging step for charging the second raw material liquid;
A second electric field generating step for generating an electric field in a direction in which the charged second raw material liquid flies toward the dielectric layer between the discharge port and the dielectric layer;
A second short fiber forming step in which the conductive material is formed into second short fibers by electrostatic explosion of the second raw material liquid in flight;
And a second deposition step of depositing the second short fibers that have passed through the transmission hole on the dielectric layer using a mask means having a transmission hole . A method of manufacturing a capacitor in which the second deposition step is repeated a plurality of times,
In one second deposition step, the second short fibers are deposited so as to protrude in one direction from the dielectric layer,
In another second deposition step of forming a conductive layer adjacent to the one second deposition step, the capacitor manufacture according to claim 1 of depositing said second short fibers so as to extend to the outside of the other direction from the dielectric layer Method. A capacitor comprising a plurality of conductor layers and a plurality of dielectric layers in a layer form,
The dielectric layer comprises a non-woven thin film made of short fibers formed by electrostatic explosion ,
The capacitor, wherein the conductor layer includes a non-woven thin film made of short fibers formed by electrostatic explosion . The conductor layer comprises a first conductor layer and a second conductor layer alternately,
The first conductor layer is formed in a comb-like shape with end portions in one direction connected,
The capacitor according to claim 3 , wherein the second conductor layer is formed in a comb-teeth shape in which ends in other directions are connected.

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