JP4894582B2 - ウェハテスト方法及びプローブカード - Google Patents
ウェハテスト方法及びプローブカード Download PDFInfo
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- JP4894582B2 JP4894582B2 JP2007074260A JP2007074260A JP4894582B2 JP 4894582 B2 JP4894582 B2 JP 4894582B2 JP 2007074260 A JP2007074260 A JP 2007074260A JP 2007074260 A JP2007074260 A JP 2007074260A JP 4894582 B2 JP4894582 B2 JP 4894582B2
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- wafer
- temperature
- chip
- probe
- probe card
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- 239000000523 sample Substances 0.000 title claims description 46
- 238000010998 test method Methods 0.000 title claims description 8
- 238000012360 testing method Methods 0.000 claims description 27
- 238000001514 detection method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Description
12 ホットチャック
14 ICチップ
15 電極
16 ダイシングライン
17 プローブカード
18 プローブ
19 温度センサープローブ
Claims (2)
- ウェハをホットチャック上に搭載し、前記ウェハ上に形成されたICチップの各電極にプローブカードのプローブを接触させて前記ICチップの電気的テストを行う際に、前記ICチップを取り囲むように前記ICチップの周囲のダイシングラインに温度センサープローブを接触させて前記ウェハの温度を検知することを特徴とするウェハテスト方法。
- ウェハ上に形成されたICチップの各電極に接触して前記ICチップの電気的テストを行うプローブと、
前記ICチップを取り囲むように前記ICチップの周囲のダイシングラインに接触して前記ウェハの温度を検知する温度センサープローブとを有することを特徴とするプローブカード。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2007074260A JP4894582B2 (ja) | 2007-03-22 | 2007-03-22 | ウェハテスト方法及びプローブカード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2007074260A JP4894582B2 (ja) | 2007-03-22 | 2007-03-22 | ウェハテスト方法及びプローブカード |
Publications (2)
Publication Number | Publication Date |
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JP2008235643A JP2008235643A (ja) | 2008-10-02 |
JP4894582B2 true JP4894582B2 (ja) | 2012-03-14 |
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JP2007074260A Active JP4894582B2 (ja) | 2007-03-22 | 2007-03-22 | ウェハテスト方法及びプローブカード |
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JP (1) | JP4894582B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210247786A1 (en) * | 2020-02-12 | 2021-08-12 | Tokyo Electron Limited | Temperature control device and method, and inspection apparatus |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63132A (ja) * | 1986-06-19 | 1988-01-05 | Mitsubishi Electric Corp | ウエハテスト装置 |
JP4125736B2 (ja) * | 2005-04-11 | 2008-07-30 | エルピーダメモリ株式会社 | プローバ装置の温度制御方法 |
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2007
- 2007-03-22 JP JP2007074260A patent/JP4894582B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210247786A1 (en) * | 2020-02-12 | 2021-08-12 | Tokyo Electron Limited | Temperature control device and method, and inspection apparatus |
US11740643B2 (en) * | 2020-02-12 | 2023-08-29 | Tokyo Electron Limited | Temperature control device and method, and inspection apparatus |
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Publication number | Publication date |
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JP2008235643A (ja) | 2008-10-02 |
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