JP4893578B2 - Electronic component sealing method - Google Patents

Description

The present invention relates to an electronic component sealing method .

  The electronic component hermetically seals the internal space in order to prevent the characteristics of the electronic component element mounted in the internal space from deteriorating. Examples of electronic components that require hermetic sealing include a piezoelectric vibration device in which a piezoelectric vibration element is mounted in an internal space.

  Examples of the piezoelectric vibrating device herein include a crystal resonator, a crystal filter, and a crystal oscillator. This piezoelectric vibrating device houses (mounts) a piezoelectric vibrating element such as a quartz vibrating plate or a tuning-fork type quartz vibrating piece in a base, and uses a sealing material (for example, a metallic brazing material such as silver brazing) as a base. The piezoelectric vibration element is hermetically sealed by melting by sealing material to protect the piezoelectric vibration element from the external environment (see, for example, Patent Document 1).

  This Patent Document 1 discloses a structure in which a sealing material is melted by heating to bond a lid to a base. Specifically, heat is generated by irradiating an electron beam or the like, and the irradiated portion is bonded. A sealing method using a beam welding method is disclosed.

By the way, in this patent document 1, in order to prevent that gas is generated when the sealing material is melted and the gas is confined in the internal space, welding (primary sealing) is performed except for a part of the periphery of the opening. ), The gas staying in the internal space is exhausted, the gas generated from the sealing material by welding is exhausted to the outside of the internal space, and then the unsealed part is welded (secondary sealing) Thus, the internal space is hermetically sealed.
JP 2000-223604 A

  However, in the prior art of Patent Document 1 described above, there is a case where the gas of the sealing material generated at the time of secondary sealing cannot be exhausted from the internal space and the gas remains in the internal space (contains), This causes variations in the quality of piezoelectric vibration devices.

Accordingly, in order to solve the above-described problems, an object of the present invention is to provide a method for sealing an electronic component that suppresses the sealing material gas from remaining in the internal space.

In order to achieve the above object, an electronic component sealing method according to the present invention includes an electronic component that hermetically seals an electronic component element by bonding a lid to a base holding the electronic component element via a sealing material. In the sealing method, a line welding step of joining the base and the lid linearly using the sealing material, using a beam welding method with continuous oscillation output or pulse oscillation output for joining the lid to the base; A dot bonding step of bonding the base and the lid in a dot shape using the sealing material, the line bonding step is performed in an atmosphere of an inert gas, the dot bonding step, It is performed in a vacuum atmosphere, and the dot bonding step is performed after the line bonding step.

According to the present invention, it is possible to suppress the gas of the sealing material from remaining in the internal space. Specifically, since the base and the lid are joined by the line joining step and the dot joining step, the line joining step makes the joining strength between the lid and the base good, It becomes possible to suppress the generation of gas of the sealing material by the dot bonding step, and as a result, it is possible to suppress the residual gas in the internal space in a state where the bonding strength between the base and the lid is increased. Become. Further, since the dot joining step is performed after the line joining step, it becomes possible to exhaust the gas of the sealing material in the internal space generated during the line joining step before the dot joining step, and the line joining step In combination with the dot bonding step, the gas of the sealing material does not remain in the internal space as compared with the bonding between the base and the lid only by the line bonding step, and only the dot bonding step. It is possible to increase the bonding strength between the lid and the base compared to the bonding between the base and the lid. Especially in an electronic component to be vacuum-sealed, how to suppress the molten gas generated when the base and the lid are joined by the sealing material is an important point for improving the characteristics of the electronic component, The reliability of sealing can be improved by applying the present invention having the above effects to an electronic component. Further, according to the present invention, since the beam welding method using continuous oscillation output or pulse oscillation output is used for joining the lid to the base, any joining process of the line joining process and the dot joining process is used. In addition, it is possible to apply the same sealing method, and it is possible to simplify the manufacturing apparatus. According to the present invention, in the line bonding, the base and the lid are bonded in an atmosphere of an inert gas. ) Cracks can be prevented, and the gas (molten gas) generated from the sealing material by the inert gas can be prevented from adhering to the electronic component element. Furthermore, in the dot bonding step, the base and the lid are bonded in a vacuum atmosphere, so that the exhaust of gas in the internal space and high vacuum can be suitably performed. In addition, since the line bonding step is performed in an atmosphere of an inert gas, the straightness of the laser beam is not sacrificed, and the sealing material can be stably melted by the laser beam. .

  According to the present invention, it is possible to suppress the sealing material gas from remaining in the internal space.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the case where the present invention is applied to a tuning fork type crystal resonator which is a piezoelectric vibration device as an electronic component is shown.

  In the tuning fork type crystal resonator 1 (hereinafter referred to as a crystal resonator) according to the present embodiment, as shown in FIGS. 1 to 3, a tuning fork type crystal resonator element 2 (this is a piezoelectric resonator element formed by a photolithography method). An electronic component element referred to in the invention, hereinafter referred to as a crystal vibrating piece), a base 3 holding the crystal vibrating piece 2, a lid 4 for hermetically sealing the crystal vibrating piece 2 held on the base 3, Is provided.

  In the crystal resonator 1, a base body 11 is configured by joining a base 3 and a lid 4. The base 3 and the lid 4 are joined via the sealing material 5, and an internal space 12 of the main body housing 11 is formed by this joining. The crystal vibrating piece 2 is held and joined to the base 3 of the internal space 12 of the main body casing 11 via the conductive bumps 6, and the inside of the main body casing 11 on which the crystal vibrating piece 2 is mounted. The space 12 is hermetically sealed. At this time, as shown in FIGS. 1 and 2, the base 3 and the quartz crystal vibrating piece 2 are ultrasonically bonded and electrically connected by the FCB (Flip Chip Bonding) method using the conductive bumps 6 ( Electromechanically joined). As the sealing material 5, a metal brazing material is used, and in this embodiment, a silver brazing material is used.

  In the present embodiment, the size of the main body housing 11 is set to 2.0 × 1.2 × 0.5 mm. In the present embodiment, the size of the main body housing is set to 2.0 × 1.2 × 0.5 mm, but the size of the main body housing 11 is 3.2 × 2.5 × 0.75 mm or less. When set, the effects of the present invention are remarkably exhibited. This must take into account that the ratio of the amount of the molten gas of the sealing material 5 to the capacity of the internal space 12 increases as the width (region) of the joint portion 33 (see below) of the base 3 decreases. Related to that. For example, in a main body case (for example, the lid has a plan view size of 5.0 × 3.2 mm) that is larger than the size of the main body case 11 of the present embodiment, the secondary sealing with respect to the capacity of the internal space 12 is performed. Although the residual ratio of the gas of the sealing material 5 that occurs when stopped (see the above-described prior art) is small, the main body housing 11 having a size as shown in the present embodiment (the size in plan view of the lid 4 is 2.0 ×). In the case of secondary sealing with respect to the capacity of the internal space 12 (see the above prior art), the residual ratio of the gas in the sealing material 5 that cannot be ignored becomes large, and the internal space 12 is particularly vacuumed. As a result, the characteristics (for example, CI value) of the crystal vibrating piece 2 disposed in the vacuum atmosphere are deteriorated. However, according to the crystal resonator 1 and its sealing method as shown in the present embodiment (see below), the characteristics of the crystal resonator element 2 are deteriorated even when the size of the main body housing 11 is reduced. This is suitable for reducing the size of the main body casing 11.

  Next, each configuration of the crystal resonator 1 will be described.

  As shown in FIGS. 1 and 2, the base 3 is formed in a box-like body including a bottom portion 31 and a bank portion 32 extending upward from the bottom portion 31.

  The base 3 is formed by laminating a rectangular parallelepiped of a ceramic material on a single plate having a rectangular shape in a plan view made of a ceramic material, and integrally firing in a concave shape. Moreover, the bank part 32 is shape | molded along the surface outer periphery of the bottom part 31 shown to FIG. The upper surface of the bank portion 32 is a joint portion 33 with the lid 4, and the joint portion 33 is provided with a metallized layer (not shown) for joining with the lid 4. Further, the metallized layer of the joint portion 33 has, for example, a structure in which a nickel layer and a gold layer are plated in this order on a tungsten metallized layer or a molybdenum metallized layer. Note that a Kovar ring may be interposed without using a tungsten metallized layer or a molybdenum metallized layer, and a nickel layer and a gold layer may be plated on the Kovar ring in this order. In this case, the Kovar ring is effective in suppressing cracks because of its superior ductility than the tungsten metallized layer and the molybdenum metallized layer. Further, as shown in the present embodiment, the metallized layer may not be formed on the entire surface of the joint portion 33, and may be a slightly narrow region.

  The joint portion 33 (upper surface of the bank portion 32) is a portion to be joined to the lid 4 by a sealing process (sealing method) described below, and the seal path (width) on the long side 34 side of the joint portion 33 is 0.03 to 0.03. The seal path (width) on the short side 35 side is set to 0.03 to 0.3 mm.

  Further, as shown in FIGS. 1 and 2, electrode pads 36 are formed on the bottom surface of the internal space 12 of the base 3, which is laminated and fired integrally in a concave shape. Ceramic crystals are formed on these electrode pads 36. The vibrating piece 2 is provided while being held. These electrode pads 36 are electrically connected to terminal electrodes (not shown) formed on the outer peripheral surface such as the back surface of the base 3 via corresponding routing electrodes (not shown). Connected to external electrodes of external parts and devices. The electrode pad 36, the lead electrode, and the terminal electrode are formed by printing a metallized material such as tungsten or molybdenum and then firing it integrally with the base 3. Some of the electrode pads 36, the routing electrodes, and the terminal electrodes are formed by forming nickel plating on the metallized upper portion and forming gold plating on the upper portion thereof.

  As shown in FIGS. 2 and 3, the lid 4 is formed into a single plate having a rectangular shape in plan view. A sealing material 5 is provided on the lower surface of the lid 4 before joining to the base 3. The lid 4 is bonded to the base 3 through the sealing material 5 by a beam welding method (in this embodiment, a laser beam welding method using a fiber laser using a continuous oscillation output), and a crystal formed by the lid 4 and the base 3 is used. A main body casing 11 of the vibrator 1 is configured. In addition, the lid | cover 4 and the sealing material 5 are formed from the metal material from which the thermal expansion coefficient differs, for example of 4 layers. Specifically, from the lower surface side of the lid 4 serving as a joint surface with the base 3, a low melting point material such as a silver brazing material (sealing material 5), a copper layer (or a copper alloy layer), a kovar layer, and a nickel layer are sequentially formed. The lid 4 and the sealing material 5 are formed by being laminated. In this embodiment, the sealing material 5 is formed on the entire lower surface of the lid 4. The sealing material 5 may be formed in an annular layer along the outer peripheral edge of the lower surface of the lid 4.

  Furthermore, the region (joining region) in which the base 3 and the lid 4 are joined in the main body housing 11 is made of the base 3 and the lid 4 by a beam welding method using a sealing process (sealing method) described below. 5 (line joining) region that is joined linearly through 5 and a region in which the base 3 and the lid 4 are joined in a dot-like manner by a beam welding method using the sealing step (sealing method) described below. It consists of. In other words, the base 3 and the lid 4 are joined via the sealing material 5 in a dense line joint (see the linear irradiation trace 71 shown in FIG. 3) and a coarse dot joint (point shown in FIG. 3). Shaped irradiation mark 72). In this embodiment, an area for performing line bonding (line bonding area) is set in advance as one bonding area 13, and an area for performing dot bonding other than the one bonding area 13 (dot bonding area) is set in advance as another bonding area 14. ing. The other joining region 14 is set to be smaller than the one joining region 13, and the other joining region 14 is set to a region equal to or less than half of the joining portion 33 on one short side 35 side as shown in FIGS. Yes. In addition, the other joining area | region 14 is set to 0.1-0.4 mm with respect to the length direction of the short side 35, and is set to 0.3 mm in a present Example. Moreover, the diameter of the dot-shaped spot 72 of the dot joint in the other joint region 14 is set to 100 to 200 μm, and is set to about 150 μm in this embodiment. In addition, although the dot-shaped irradiation trace 72 of this dot junction may partly overlap with the adjacent irradiation trace 72 as shown in FIG. 3, this is a preferred example and is not limited to this. It may be in contact with the irradiation mark 72.

  Next, the configuration of the crystal vibrating piece 2 disposed in the internal space 12 will be described.

  As shown in FIGS. 1 and 2, the crystal vibrating piece 2 is a crystal Z plate that is formed by wet etching from a crystal element plate (not shown) that is a crystal piece made of anisotropic material. Therefore, this crystal vibrating piece 2 is suitable for mass production. The substrate 21 of the quartz crystal resonator element 2 has an outer shape composed of two leg portions 22 and a base portion 23 which are vibration portions, and the two leg portions 22 are one end portion (specifically one end surface) of the base portion 23. ) Projecting from.

  The base portion 23 is set from a width dimension substantially the same as that of the pair of leg portions 22. Further, the side surface 24 of the external shape of the quartz crystal vibrating piece 2 is formed so as to be inclined with respect to both main surfaces 25. This is because the etching speed in the crystal direction (X, Y direction) of the material of the substrate 21 is different when the quartz crystal vibrating piece 2 is formed by wet etching.

  Moreover, in order to improve the series resonance resistance value (CI value in this embodiment, the same applies hereinafter) that deteriorates due to the miniaturization of the crystal vibrating piece 2, the concave portions 26 are formed on both main surfaces 25 of the two leg portions 22. Has been.

  On the surface (both main surface 25 and side surface 24) of the quartz crystal vibrating piece 2, excitation is performed in order to electrically connect the two excitation electrodes 27 having different potentials and the excitation electrodes 27 to the electrode pads 36. An extraction electrode 28 extracted from the electrode 27 is provided. Note that the extraction electrode 28 in this embodiment refers to an electrode pattern extracted from the two excitation electrodes 27.

  A part of the two excitation electrodes 27 is formed inside the recess 26. For this reason, even if the crystal vibrating piece 2 is downsized, the vibration loss of the leg portion 22 is suppressed, and the CI value can be suppressed low. The excitation electrode 27 includes a main surface electrode formed on both main surfaces 25 and the recess 26 of the leg portion 22, and side surface electrodes formed on both side surfaces 24 of the leg portion 22, and the main surface electrode and the side surface electrode are formed. Are connected as shown in FIG. 1, and the excitation electrode 27 is drawn out to the extraction electrode 28.

  The excitation electrode 27 and the extraction electrode 28 of the crystal vibrating piece 2 described above are, for example, laminated thin films composed of a chromium base electrode layer and a gold upper electrode layer. These thin films are formed on the entire surface by a technique such as vacuum vapor deposition, and then formed into a desired shape by metal etching by photolithography. In this embodiment, the thickness of the excitation electrode 27 is set to about 0.1 μm.

  As shown in FIGS. 1 and 2, the base portion 23 of the quartz crystal resonator element 2 performs electromechanical joining between the extraction electrode 28 and the electrode pad 36 of the base 3 through the conductive bump 6. Specifically, the extraction electrode 28 of the crystal vibrating piece 2 and the electrode pad 36 of the base 3 are joined via the conductive bump 6, and the extraction electrode 28 and the electrode pad 36 are connected electromechanically. The The conductive bumps 6 used in this embodiment are connection bumps made of a metal material such as gold.

  Next, the sealing process (sealing method) of the crystal unit 1 in which the lid 4 is bonded to the base 3 via the sealing material 5 will be described. In the sealing process of this embodiment, a laser beam welding method is used for joining the lid 4 to the base 3 (see FIGS. 3 to 6).

  First, the crystal vibrating piece 2 is electromechanically ultrasonically bonded to the base 3 through the conductive bumps 6 by the FCB method, and the crystal vibrating piece 2 is arranged (mounted) on the base 3. Further, a sealing material 5 is provided on the lid 4.

  Next, a plurality of lids 4 provided with the sealing material 5 are arranged in a matrix on a tray (not shown), and are placed in a chamber (not shown).

  Then, a plurality of bases 3 on which the quartz crystal vibrating pieces 2 are mounted in this chamber are arranged to face each of a plurality of lids 4 arranged in a matrix on the tray. At this time, the joining portion 33 of the base 3 is in contact with the sealing material 5 of the lid 4.

  After the lid 4 and the base 3 are arranged in the chamber, an inert gas (for example, nitrogen gas) is injected into the chamber to bring the chamber into an inert gas atmosphere.

  After the inside of the chamber is placed in an inert gas atmosphere, the base 3 and the lid 4 are joined linearly using the sealing material 5 in the one joining region 13 by a laser beam welding method (line joining step).

  After the line bonding process, the chamber is evacuated. At this time, the gas of the sealing material 5 generated in the line joining process and staying in the internal space 12 is exhausted.

  After exhausting the gas of the sealing material 5 staying in the internal space 12 under a vacuum atmosphere in the chamber, the base 3 and the lid 4 are dotted using the sealing material 5 in the other joining region 14. (Dot joining process). Then, after the joining and sealing of the base 3 and the lid 4 including the line joining process and the dot joining process are finished, the internal space 12 is hermetically sealed.

  Incidentally, there are the following two joining methods for joining the base 3 and the lid 4 by the laser beam welding method described above.

  As for the first joining method, referring to FIGS. 3 and 4, a light emitting part (not shown) that emits a laser beam is scanned counterclockwise on the joining part 33 provided along the outer periphery of the base 3 in plan view. While (see the arrow direction in FIG. 3), the laser beam welding is continuously performed at the position of the joint portion 33 corresponding to one joint region 13 (line joining step), and then the joint portion 33 corresponding to the other joint region 14 is processed. Laser beam welding is performed by intermittently oscillating only the part (dot joining process).

  In this first joining method, as shown in FIGS. 3 and 4, a light emitting part (not shown) that emits a laser beam counterclockwise on a joining part 33 provided along the outer periphery of the base 3 in plan view. Scan twice, perform the line joining process in the first round, and perform the dot joining process in the second round.

  5 and 6, the second bonding method includes a long side 34 and a short side on a bonding portion 33 provided with a light emitting portion (not shown) that emits a laser beam along the outer periphery in plan view of the base 3. While scanning each side of 35 (refer to the arrow direction in FIG. 5), laser beam welding is continuously performed for each portion corresponding to one joining region 13 for each side of the joining portion 33 (line joining step), and thereafter Then, laser beam welding is performed by intermittently oscillating only the portion of the joint portion 33 corresponding to the other joint region 14 (dot joining step).

  In the second joining method, as shown in FIGS. 5 and 6, a light emitting part (not shown) that emits a laser beam has a long side 34 on a joining part 33 provided along the outer periphery in plan view of the base 3, Scanning is performed for each side in the order of the short side 35, the long side 34, and the short side 35, this series of scans is performed twice, the line joining step is performed in the first round, and the dot joining step is performed in the second round. Further, at the time of scanning transition of each side, scanning as shown in FIG. 5 may be performed to change the direction in the next scanning direction, or light is emitted at that position (planar viewing angle portion of the main body housing 11). The section may stop and change direction to the next scanning direction.

  According to the above-described quartz crystal resonator 1 according to the present embodiment, the base 3 and the lid 4 are joined in a linear manner via the sealing material 5 in one joining region 13 by the beam welding method. In the other joining region 14, dot joining is performed in which the base 3 and the lid 4 are joined in a dot shape by a beam welding method. In addition, according to the sealing method of the crystal unit 1 according to the present embodiment, the beam welding method is used for joining the lid 4 to the base 3, the line joining step and the dot joining step are included. A dot joining process is performed later. According to the present embodiment having such a configuration and method, it is possible to suppress the gas of the sealing material 5 from remaining in the internal space 12.

  Specifically, according to the present embodiment, since the base 3 and the lid 4 are joined by the line joining by the line joining process and the dot joining by the dot joining process, the lid 4 and the base are obtained by the line joining by the line joining process. 3 can be made to have a good bonding strength, and generation of gas of the sealing material 5 can be suppressed by dot bonding in the dot bonding process. As a result, the residual gas in the internal space 12 can be suppressed in a state where the bonding strength between the base 3 and the lid 4 is increased. In addition, since the dot joining by the dot joining process is performed after the line joining by the line joining process, the gas of the sealing material 5 in the internal space 12 generated at the time of the line joining can be exhausted before the dot joining. The combination of the line bonding and the dot bonding by the dot bonding process does not cause the gas of the sealing material 5 to remain in the internal space 12 as compared with the bonding of the base 3 and the lid 4 by only the line bonding. Compared with the joining of the base 3 and the lid 4 only by joining, the joining strength between the lid 4 and the base 3 can be increased. In particular, in the crystal unit 1 to be vacuum-sealed, how to suppress the gas (molten gas) generated when the base 3 and the lid 4 are joined by the sealing material 5 can improve the characteristics of the crystal unit 1. Therefore, according to the present embodiment, the sealing reliability can be improved.

  Further, since the beam welding method is used for joining the base 3 and the lid 4 via the sealing material 5, the same joining is performed in any joining process of the line joining in the line joining process and the dot joining in the dot joining process. A sealing method can be applied, and the manufacturing apparatus can be simplified.

  Moreover, since the area | region of the other joining area | region 14 is small with respect to the area | region of one joining area | region 13, while joining strength of the lid | cover 4 and the base 3 is improved by line joining, generation | occurrence | production of the gas of the sealing material 5 is suppressed by dot joining. It is suitable for.

  Moreover, since the diameter of the dot-shaped irradiation mark 72 of the dot bonding in the other bonding region 14 is 100 to 200 μm (in this embodiment, about 150 μm), the sealing region (one bonding region 13 and This is effective in reducing the other junction region 14), and the crystal resonator 1 can be miniaturized.

  Further, since the electronic component element is the quartz crystal resonator element 2, its characteristics are easily affected by heat. However, in this embodiment, since the base 3 and the lid 4 are not bonded at a high temperature, they are not easily affected by heat.

  Further, in the line joining using the laser beam welding method, since the base 3 and the lid 4 are joined in an atmosphere of an inert gas, the melting heat generated during the joining is released to release the main body casing 11 (for example, The crack of the base 3) can be prevented, and the gas (molten gas) generated from the sealing material 5 by the inert gas can be suppressed from adhering to the crystal vibrating piece 2. Furthermore, since the base 3 and the lid 4 are joined in a vacuum atmosphere in the dot joining process, the gas in the internal space 12 can be exhausted and the vacuum can be increased. In addition, since the line bonding step is performed in an atmosphere of an inert gas, the straightness of the laser beam is not sacrificed, and the sealing material 5 can be stably melted by the laser beam.

  In this embodiment, the case where the tuning fork type crystal resonator 1 is applied as an electronic component is shown. However, the present invention is not limited to this, and the base and the lid are joined via a sealing material, and the inner space is formed. Other forms may be used as long as the arranged (mounted) electronic component elements are hermetically sealed. For example, another piezoelectric vibration device different from the present embodiment, such as a crystal resonator on which an AT cut crystal resonator is mounted, an oscillator on which an AT cut crystal resonator element and an IC chip are mounted, or the like may be used.

  In the present embodiment, the number of the leg portions 22 of the crystal vibrating piece 2 is two, but the number is not limited to this, and may be three or more.

  In this embodiment, the number of the conductive bumps 6 is two, but the number is not limited to this, and may be three or more. Furthermore, a plated bump may be used as the conductive bump 6, and not only the conductive bump but also a conductive bonding material such as a conductive resin adhesive or solder may be used.

  Further, in this embodiment, the crystal vibrating piece 2 having a shape as shown in FIG. 1 is adopted, but the present invention is not limited to this, and the crystal vibrating piece 2 having another shape may be used.

  In addition, the concave portion 26 of the quartz crystal vibrating piece 2 referred to in the present embodiment has a concave cross section as shown in FIG. 1, but is not limited thereto, and may be a through portion or a concave portion. May be.

  Further, in this embodiment, the concave portion 26 is formed in the leg portion 22 of the crystal vibrating piece 2, but this is a preferable example, and the present invention is not limited to this, and the concave portion is formed in the leg portion 22. The present invention can also be applied to a crystal vibrating piece 2 that is not present.

  In this embodiment, the laser beam welding method is used as the beam welding method. However, this is a preferred example, and the present invention is not limited to this. Any beam welding method (for example, a welding method using an electron beam). ) May be used.

  In this embodiment, a fiber laser is used for the laser beam welding method. However, this is a preferable example, and a solid laser such as a YAG laser may be used. Moreover, it is not limited to a continuous oscillation output, and may be a pulse oscillation output.

  In this embodiment, the excitation electrode 27 and the extraction electrode 28 of the quartz crystal vibrating piece 2 are formed in the order of chromium and gold. For example, the order of chromium, gold, and chromium, the order of chromium and silver, The order may be chrome, silver, chrome, etc. Further, the base electrode layer described above may be changed to nickel, and may be in the order of nickel, gold, chromium, nickel, silver, chromium, for example.

  In the present embodiment, the sealing material 5 is provided on the entire top surface of the bank portion 32, but is not limited to this. If the base 3 and the lid 4 can be joined, the top surface of the bank portion 32 is not limited. Some may be exposed.

  In the present embodiment, the metallized layer is provided on the entire upper surface of the bank portion 32, but the present invention is not limited to this, and the metalized layer may be provided only in a desired region on the upper surface of the bank portion 32. .

  It should be noted that the present invention can be implemented in various other forms without departing from the spirit, gist, or main features. For this reason, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

  The present invention can be applied to an electronic component that hermetically seals an electronic component element, and is particularly suitable for a piezoelectric vibration device that uses a piezoelectric vibration element as the electronic component element.

FIG. 1 is a schematic configuration diagram of a crystal resonator according to the present embodiment, and is a schematic cross-sectional view taken along line AA shown in FIG. FIG. 2 is a schematic side view showing the configuration of the internal space of the crystal resonator according to the present embodiment. FIG. 3 is a schematic plan view of the crystal resonator according to the present embodiment, and is a diagram illustrating a first sealing method according to the present embodiment. FIG. 4 is a timing chart of the first sealing method according to the present embodiment. FIG. 5 is a schematic plan view of the crystal resonator according to the present embodiment, showing a second sealing method according to the present embodiment. FIG. 6 is a diagram illustrating a timing chart of the second sealing method according to the present embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Tuning fork type crystal oscillator 11 Main body housing 12 Internal space 13 One joint area 14 Other joint area 2 Tuning fork type crystal vibrating piece 3 Base 4 Lid 5 Sealing material 71, 72 Irradiation trace

Claims (1)

In a method for sealing an electronic component in which a lid is joined to a base holding an electronic component element via a sealing material, and the electronic component element is hermetically sealed.
Beam welding method with continuous oscillation output or pulse oscillation output is used to join the lid to the base.
A line joining step for joining the base and the lid in a line using the sealing material;
A dot joining step for joining the base and the lid in a dot-like manner using the sealing material,
The line bonding step is performed in an atmosphere of an inert gas,
The dot bonding step is performed in a vacuum atmosphere,
An electronic component sealing method comprising performing the dot bonding step after the line bonding step.

Images