JP4891676B2 - Display device - Google Patents

Description

  The present invention relates to a display device, and more particularly, to a display device including an inspection unit for performing an inspection related to quality.

  A display device such as a liquid crystal display device includes an active area composed of matrix pixels. The active area is arranged in the vicinity of a plurality of scanning lines extending along the pixel row direction, a plurality of signal lines extending along the pixel column direction, and an intersection between the scanning lines and the signal lines. A switching element, a pixel electrode connected to the switching element, and the like are provided. Each of these scanning lines and each signal line is drawn to the outer periphery of the active area.

In such a display device, glass which is an insulator is used as a light-transmitting substrate. Therefore, there is a possibility that the manufacturing yield may be reduced due to electrostatic breakdown of elements due to charging of the glass. To deal with such a problem, according to Patent Document 1, the gate electrode wiring provided in the active area is divided for each pixel and electrically connected by the conductive film made of the same material as the signal electrode wiring on the interlayer insulating film. Techniques to do this have been proposed.
JP 2005-134446 A

  The present invention has been made in view of the above-described problems, and an object thereof is to provide a display device including an inspection unit capable of preventing the occurrence of defects in a reliability test and a decrease in manufacturing yield. There is.

According to this embodiment,
A plurality of pixels each having a pixel electrode, and an active area having a plurality of signal supply wirings for supplying drive signals to each pixel;
An inspection unit disposed outside the active area and inspecting the active area, and
The inspection unit
A main part to which an inspection signal is supplied when inspecting the active area, and an inspection wiring having an island-shaped electrode part spaced from the main part,
A switching element comprising a thin film transistor disposed between the main part and the signal supply wiring and having the electrode part as a gate electrode;
The inspection wiring is arranged in a different layer via an insulating layer and is formed of the same material as the pixel electrode, and the main part and the electrode part are electrically connected via a contact hole formed in the insulating layer. Jumper part to be connected
A display device is provided .

  According to this display device, by applying the inspection wiring having a structure in which the separated main portion and the electrode portion are electrically connected by the jumper portion, charging of the inspection wiring is suppressed, and a short circuit between the wirings is prevented. Occurrence can be prevented. For this reason, it is possible to prevent electrostatic breakdown of the switching element or the like in the inspection unit, and it is possible to prevent occurrence of a defect in the reliability test and a decrease in manufacturing yield.

  According to the present invention, it is possible to provide a display device including an inspection unit capable of preventing the occurrence of defects in the reliability test and the decrease in manufacturing yield.

  A display device according to an embodiment of the present invention will be described below with reference to the drawings.

  As shown in FIGS. 1 and 2, a liquid crystal display device as an example of a display device includes a liquid crystal display panel 1 having a substantially rectangular flat plate shape. The liquid crystal display panel 1 is composed of a pair of substrates, that is, an array substrate 3 and a counter substrate 4, and a liquid crystal layer 5 held as a light modulation layer between the pair of substrates. The liquid crystal display panel 1 includes a substantially rectangular active area 6 for displaying an image. The active area 6 has a plurality of pixels PX arranged in a matrix, a plurality of signal supply wirings for supplying a drive signal to each pixel PX, and the like.

  The array substrate 3 is configured by using an insulating substrate 81 such as light-transmitting glass, and as a signal supply wiring disposed in the active area 6, for example, a plurality of scans extending along the row direction of the pixels PX. Line Y (1, 2, 3,..., M), a plurality of signal lines X (1, 2, 3,..., N) extending along the column direction of the pixels PX, and the like. These scanning lines Y and signal lines X are arranged in different layers with an insulating layer interposed therebetween. The array substrate 3 includes a switching element 7 arranged for each pixel PX in the vicinity of the intersection of the scanning line Y and the signal line X in the active area 6, a pixel electrode 8 connected to the switching element 7, and the like. It has.

  The switching element 7 is configured by a thin film transistor (TFT) or the like. The switching element 7 includes a semiconductor layer 7SC, a gate electrode 7G, a source electrode 7S, and a drain electrode 7D.

  The semiconductor layer 7SC is disposed on the undercoat layer 82 that covers the insulating substrate 81. The semiconductor layer 7SC is formed of, for example, a polycrystalline silicon thin film. The undercoat layer 82 is formed of a silicon nitride film, a silicon oxide film, or the like. The semiconductor layer 7SC is covered with a gate insulating layer 83.

  The gate electrode 7G is disposed on the gate insulating layer 83. The gate electrode 7G is electrically connected to the corresponding scanning line Y (or formed integrally with the scanning line). The gate insulating layer 83 is formed of, for example, a silicon oxide film. The gate electrode 7G is covered with a first insulating layer 84.

  The source electrode 7S and the drain electrode 7D are disposed on the first insulating layer 84. The source electrode 7S is in contact with the source region of the semiconductor layer 7SC through a contact hole 85 that penetrates the gate insulating layer 83 and the first insulating layer 84, and is electrically connected to the corresponding signal line X. (Alternatively, it is formed integrally with the signal line). The drain electrode 7D is in contact with the drain region of the semiconductor layer 7SC through a contact hole 86 that penetrates the gate insulating layer 83 and the first insulating layer 84. The first insulating layer 84 is formed of an inorganic material such as a silicon nitride film or a silicon oxide film. The source electrode 7S and the drain electrode 7D are covered with a second insulating layer 87. The second insulating layer 87 is made of an inorganic material such as a silicon nitride film or a silicon oxide film.

  The pixel electrode 8 is disposed on the second insulating layer 87. The pixel electrode 8 is electrically connected to the drain electrode 7D through a contact hole 88 that penetrates the second insulating layer 87. The pixel electrode 8 is formed of a light-transmissive metal material such as indium tin oxide (ITO) in a transmissive liquid crystal display device that selectively transmits backlight and displays an image. . The pixel electrode 8 is made of a metal material having light reflectivity such as aluminum (Al) in a reflective liquid crystal display device that selectively reflects external light incident from the counter substrate 4 side and displays an image. It is formed. At least the surface of the active area 6 in the array substrate 3 having such a configuration is covered with an alignment film 89.

  The counter substrate 4 is configured by using an insulating substrate 91 such as light-transmitting glass, and includes the counter electrode 9 common to all the pixels PX in the active area 6. The counter electrode 9 is made of a light-transmissive metal material such as ITO. At least the surface of the active area 6 in the counter substrate 4 having such a configuration is covered with an alignment film 92.

  The array substrate 3 and the counter substrate 4 are arranged with the pixel electrodes 8 and the counter electrodes 9 of all the pixels PX facing each other, and a gap is formed between them. The liquid crystal layer 5 is formed of a liquid crystal composition sealed in the gap between the array substrate 3 and the counter substrate 4.

  In a color display type liquid crystal display device, the liquid crystal display panel 1 includes a plurality of types of pixels, for example, a red pixel that displays red (R), a green pixel that displays green (G), and a blue pixel that displays blue (B). have. That is, the red pixel includes a red color filter that transmits light having a red main wavelength. The green pixel includes a green color filter that transmits light having a green dominant wavelength. The blue pixel includes a blue color filter that transmits light having a blue main wavelength. These color filters are arranged on the main surface of the array substrate 3 or the counter substrate 4.

  The liquid crystal display panel 1 includes a connection wiring group 20, a first connection portion 31, and a second connection portion 32 on the outer peripheral portion 10 located outside the active area 6. The first connection unit 31 can be connected to the drive IC chip 11 that functions as a signal supply source that supplies a drive signal to the signal supply wiring. The second connection unit 32 can be connected to a flexible printed circuit (FPC) that functions as a signal supply source. In the example shown in FIG. 1, the first connection portion 31 and the second connection portion 32 are disposed on the extending portion 10 </ b> A of the array substrate 3 that extends outward from the end portion 4 </ b> A of the counter substrate 4. . The drive IC chip 11 and the first connection part 31 are electrically and mechanically connected through, for example, an anisotropic conductive film.

  The driving IC chip 11 mounted on the first connection unit 31 of the liquid crystal display panel 1 includes at least a part of the signal line driving unit 11X that supplies a driving signal (video signal) to each signal line X in the active area 6, and It has at least a part of a scanning line driving section 11Y that supplies a driving signal (scanning signal) to each scanning line Y in the active area 6.

  The connection wiring group 20 includes a plurality of connection wirings connected to each signal supply wiring. That is, the connection wiring group 20 includes the same number or more connection wirings W as the number of signal supply wirings, and the connection wirings WY connected to the respective scanning lines Y and the signal lines X. Connection wiring WX connected to each is provided.

  With such a configuration, the scanning line driving unit 11Y is electrically connected to each scanning line Y (1, 2, 3,...) Via the connection wiring WY. That is, the drive signal output from the scanning line driving unit 11Y is supplied to the corresponding scanning line Y (1, 2, 3,...) Via the first connection unit 31 and the connection wirings WY. The switching elements 7 included in each pixel PX in each row are on / off controlled based on the scanning signal supplied from the corresponding scanning line Y.

  Further, the signal line driver 11X is electrically connected to each signal line X (1, 2, 3,...) Via the connection wiring WX. That is, the drive signal output from the signal line drive unit 11X is supplied to the corresponding signal line X (1, 2, 3,...) Via the first connection unit 31 and each connection wiring WX. The switching element 7 included in each pixel PX of each column inputs the video signal supplied from the corresponding signal line X to the pixel electrode 8 at the timing when it is turned on.

  As shown in FIG. 3, the array substrate 3 is inspected for performing inspections related to quality in the active area 6 such as wiring defects in the connection wiring group 20, wiring defects in the active area 6, and display quality of the pixels PX. Part 40 is provided. The inspection unit 40 includes a signal line inspection unit 41 provided corresponding to the signal line driving unit 11X, a scanning line inspection unit 42 provided corresponding to the scanning line driving unit 11Y, and the inspection units 41, 42. Has a pad portion 44 for inputting a signal for inspection.

  The signal line inspection unit 41 is supplied with an inspection drive signal when inspecting the active area 6 and is connected to each signal line X via the connection wiring WX of the connection wiring group 20. 51 is provided. The signal line inspection unit 41 includes a switching element 61 between each signal line X (1, 2,..., N) and the signal line inspection drive wiring 51. Further, the signal line inspection unit 41 includes an inspection control wiring 55 to which an inspection control signal for controlling on / off of the switching element 61 when the active area 6 is inspected is supplied. That is, the signal line inspection drive wiring 51 and the inspection control wiring 55 function as inspection wirings to which a signal for inspection is supplied when the active inspection of the active area 6 is performed in the signal line inspection unit 41.

  The switching element 61 is configured by a thin film transistor. The gate electrode 61G of each switching element 61 is electrically connected to the inspection control wiring 55. The source electrode 61S of each switching element 61 is electrically connected to the signal line inspection drive wiring 51. Further, the drain electrode 61D of each switching element 61 is electrically connected to the signal line X through a corresponding connection wiring.

  The scanning line inspection unit 42 is supplied with a driving signal for inspection when inspecting the active area 6 and is connected to each scanning line Y via the connection wiring WY of the connection wiring group 20. 52. Further, the scanning line inspection unit 42 includes a switching element 62 between each scanning line Y (1, 2,..., M) and the scanning line inspection drive wiring 52. Further, the scanning line inspection unit 42 includes an inspection control wiring 55 to which an inspection control signal for controlling on / off of the switching element 62 when the active area 6 is inspected is supplied. The inspection control wiring 55 is common to the signal line inspection unit 41. In other words, the scanning line inspection drive wiring 52 and the inspection control wiring 55 function as inspection wirings to which inspection signals are supplied when the active area 6 is inspected in the scanning line inspection unit 42.

  The switching element 62 is configured by a thin film transistor. The gate electrode 62G of each switching element 62 is electrically connected to the inspection control wiring 55. The source electrode 62S of each switching element 62 is electrically connected to the scanning line inspection drive wiring 52. Furthermore, the drain electrode 62D of each switching element 62 is electrically connected to the scanning line Y via a corresponding connection wiring.

  The pad unit 44 has an input pad 71 that allows input of an inspection drive signal to one end of the signal line inspection drive wiring 51, and an input of an inspection drive signal to one end of the scanning line inspection drive wiring 52. An input pad 72 that can be input and an input pad 75 that enables input of a control signal for inspection are provided at one end of the inspection control wiring 55.

  The drive signal input from the input pad 71 is an inspection signal written to the pixel electrode 8 of each pixel PX in the inspection stage. The drive signal input from the input pad 72 is an inspection signal for controlling on / off of the switching element 7 of each pixel PX in the inspection stage. The control signal input from the input pad 75 is an inspection signal for controlling on / off of the switching element 61 of the signal line inspection unit 41 and the switching element 62 of the scanning line inspection unit 42 in the inspection stage.

  The connection wirings WX and WY of the connection wiring group 20 include connection pads PD that enable connection to the drive IC chip 11 in the middle of each.

  According to the liquid crystal display device having the above-described configuration, wiring defects such as a short circuit between the wirings in the connection wiring group and disconnection of each wiring, and further, a wiring defect on the panel such as a wiring defect in the active area 6 can be reliably ensured. It becomes possible to detect.

  Further, the signal line inspection unit 41 and the scanning line inspection unit 42 are disposed on the extending portion 10 </ b> A of the array substrate 3 corresponding to the region where the drive IC chip 11 is disposed. Naturally, the signal line inspection drive wiring 51, the scanning line inspection drive wiring 52, and the inspection control wiring 55 are arranged on the extending portion 10A corresponding to the region where the drive IC chip 11 is arranged. Has been. These inspection wires 51, 52, and 55 extend along the longitudinal direction of the drive IC chip 11. That is, these inspection wirings 51, 52, and 55 overlap the drive IC chip 11 when the drive IC chip 11 is mounted. In short, it is possible to arrange the inspection wiring on the array substrate without enlarging the external dimensions.

  Further, the connection pad PD to which the driving IC chip 11 can be connected is disposed between the active area 6 and the inspection unit 40. Therefore, a wiring path through which an inspection signal for inspecting the quality in the active area 6 is supplied via the inspection unit 40 and a drive signal (a video signal and a scanning signal for displaying an image in the active area 6). ) Matches the wiring path supplied from the driving IC chip 11. Therefore, it is possible to provide a highly reliable liquid crystal display device by mounting the drive IC chip 11 determined to be normal on the liquid crystal display panel 1 determined to be non-defective by inspection through the inspection unit 40. Become.

  In the display device having the above-described configuration, electric charges charged during the manufacturing process are likely to accumulate in a wiring having a relatively large installation area. In particular, the inspection lines such as the signal line inspection drive wiring 51, the scanning line inspection drive wiring 52, and the inspection control wiring 55 have a wider line width than various signal supply wirings in the active area 6, In addition, since the wiring length is long, the installation area is large and charges are likely to accumulate. In particular, the switching element 7 in the active area 6 only needs to have a switching capability of one pixel, whereas the switching elements 61 and 62 arranged in the inspection unit 40 are connected to the signal supply wiring by one element. Since the ability to supply signals to all the pixels is required, it is larger than the switching element 7 and charges are likely to accumulate.

  Accumulated charges are likely to concentrate at the terminal end portion and the bent portion of the wiring, and cause electrostatic discharge between other adjacent conductive layers (wiring, electrodes, etc.). In addition, not only in the case of adjacent wirings in the same layer, wiring of adjacent conductive layers that overlap with each other through an insulating layer often causes electrostatic discharge. Such electrostatic discharge is caused by short-circuiting between adjacent wires that should be kept in an insulated state, disconnection of adjacent wires, or short-circuiting or disconnection of wires on the adjacent conductive layer through the insulating layer. There is a risk of inviting.

  Therefore, in the display device according to this embodiment, the inspection unit 40 is configured as follows.

  That is, as shown in FIGS. 4 and 5, the inspection unit 40 includes inspection control wiring 55 as inspection wiring. The inspection control wiring 55 has a main portion 55A to which an inspection signal is supplied and an island-shaped electrode portion 55B that is separated from the main portion 55A. Such an inspection control wiring 55 is disposed on the gate insulating layer 83 and is formed together with the scanning line Y of the active area 6 and the like.

  The switching element 61 is disposed between the main portion 55A and the signal line X that is a signal supply wiring. The switching element 62 is disposed between the main portion 55A and the scanning line Y that is a signal supply wiring. Since these switching elements 61 and 62 have basically the same structure, a detailed structure will be described by taking the switching element 61 as an example.

  The switching element 61 includes a semiconductor layer 61SC. The semiconductor layer 61SC is disposed on the undercoat layer 82 that covers the insulating substrate 81. The semiconductor layer 61SC is formed of, for example, a polycrystalline silicon thin film. The semiconductor layer 61SC is covered with a gate insulating layer 83.

  The electrode portion 55B of the inspection control wiring 55 functions as the gate electrode 61G of the switching element 61 (or the gate electrode 62G of the switching element 62). The inspection control wiring 55 having the electrode portion 55B and the main portion 55A is covered with the first insulating layer 84.

  The source electrode 61S and the drain electrode 61D are disposed on the first insulating layer 84. The source electrode 61S is in contact with the source region of the semiconductor layer 61SC through a contact hole 85 penetrating the gate insulating layer 83 and the first insulating layer 84, and is electrically connected to the signal line inspection drive wiring 51. ing. The drain electrode 61D is in contact with the drain region of the semiconductor layer 61SC through a contact hole 86 that penetrates the gate insulating layer 83 and the first insulating layer 84, and also has a signal line X (specifically, via the connection wiring WX). The signal line X) is electrically connected.

  Note that the source electrode 62S and the drain electrode 62D of the switching element 62 are similarly configured, the source electrode 62S is electrically connected to the scanning line inspection drive wiring 52, and the drain electrode 62D is the scanning line. It is electrically connected to Y (specifically, scanning line Y via connection wiring WY).

  The source electrode 61S (and 62S) and the drain electrode 61D (and 62D) are covered with a second insulating layer 87.

  In such an inspection control wiring 55, the separated main portion 55 </ b> A and the electrode portion 55 </ b> B are electrically connected via a jumper portion J. That is, the jumper portion J is disposed in a layer different from the inspection control wiring 55 via an insulating layer (that is, the first insulating layer 84 and the second insulating layer 87), and is made of the same material (for example, light) as the pixel electrode 8. A metal material having transparency or a metal material having light reflectivity). Such a jumper part J electrically connects the main part 55A and the electrode part 55B via contact holes CH1 and CH2 formed in the insulating layer. The contact hole CH1 penetrates the first insulating layer 84 and the second insulating layer 87 to the main portion 55A, and the contact hole CH2 extends the first insulating layer 84 and the second insulating layer 87 to the electrode portion 55B. It penetrates.

  According to such a configuration, the area of the inspection wiring having a relatively large installation area, in particular, the area of the inspection control wiring 55 can be reduced, and charging of the inspection wiring can be suppressed. For this reason, it is possible to prevent the occurrence of a short circuit between adjacent wirings. Therefore, electrostatic breakdown of the switching element or the like in the inspection unit 40 can be prevented, and it is possible to prevent the occurrence of defects in the reliability test and the decrease in manufacturing yield.

  The liquid crystal display device having the above-described configuration is manufactured as follows.

  That is, after forming the undercoat layer 82 on the insulating substrate 81, an amorphous silicon film is formed on the undercoat layer 82. After the polycrystalline silicon thin film is formed by annealing the amorphous silicon film, the polycrystalline silicon thin film is patterned into an island shape to thereby switch the switching element 7 in the active area 6, the switching elements 61 and 62 in the inspection unit 40, and the like. The semiconductor layer is formed. Thereafter, a gate insulating layer 83 covering the semiconductor layer is formed.

  Subsequently, after forming a metal thin film on the gate insulating layer 83, the metal thin film is patterned to form the scanning line Y of the active area 6, the gate electrode 7G of the switching element 7, and the like. At this time, the inspection unit 40 has a main part 55A and an electrode part 55B (which functions as the gate electrode 61G of the switching element 61 and the gate electrode 62G of the switching element 62) separated from the main part 55A. 55 etc. are formed simultaneously.

  Subsequently, using the gate electrode 7G and the electrode part 55B as a mask, a dopant is implanted into the semiconductor layer of each switching element by ion implantation or the like, and then this dopant is activated to form a source region and a drain region. Thereafter, a first insulating layer 84 is formed to cover the scanning lines Y, the gate electrodes 7G, the inspection control wiring 55, and the like.

  Subsequently, by patterning the gate insulating layer 83 and the first insulating layer 84, contact holes 85 and 86 penetrating to the source and drain regions of the semiconductor layers of the switching elements 7, 61 and 62 are formed, respectively. Thereafter, after forming a metal thin film on the first insulating layer 84, the metal thin film is patterned to contact the semiconductor layer via the signal line X of the active area 6 and the contact holes 85 and 86, respectively. Electrodes, that is, source electrodes and drain electrodes of the switching elements 7, 61 and 62 are formed.

  Subsequently, a second insulating layer 87 that covers the signal line X, the source electrode, the drain electrode, and the like is formed. Thereafter, in the active area 6, the second insulating layer 87 is patterned to form a contact hole 88 that penetrates to the drain electrode 7 </ b> D of the switching element 7. At the same time, the first insulating layer 84 and the second insulating layer are formed in the inspection unit 40. By patterning the layer 87, contact holes CH1 and CH2 penetrating to the main portion 55A and the electrode portion 55B of the inspection control wiring 55 are formed.

  Thereafter, after forming a metal thin film for forming the pixel electrode 8 on the second insulating layer 87, the metal thin film is patterned. Thereby, in the active area 6, the pixel electrode 8 that is in contact with the drain electrode 7D through the contact hole 88 is formed, and at the same time, in the inspection unit 40, the main part 55A is contacted through the contact hole CH1 and the contact hole CH2 is formed. A jumper portion J in contact with the electrode portion 55B is formed. Further, the array substrate 3 is manufactured by forming an alignment film 89 on the pixel electrode 8 at least in the active area 6.

  Subsequently, the counter substrate 4 manufactured in a separate process is bonded with the alignment film 92 facing the alignment film 89 side of the array substrate 3, and then a liquid crystal material is interposed between the array substrate 3 and the counter substrate 4. Is sealed to form the liquid crystal layer 5. Further, various members are attached to the array substrate 3 and the counter substrate 4 to form a liquid crystal display device.

  As described above, by reducing the area of the inspection control wiring 55, charging of the inspection control wiring during the manufacturing process can be suppressed. Further, when electrically connecting the main portion 55A of the inspection control wiring 55 and the electrode portion 55B, a contact hole 88 for enabling electrical connection between the switching element 7 and the pixel electrode 8 in the active area 6 is provided. In the step of forming, that is, the patterning step of the second insulating layer 87, contact holes CH1 and CH2 can also be formed by simultaneously patterning the first insulating layer 84 made of the same inorganic material as the second insulating layer 87. . In the step of forming the pixel electrode 8, the jumper portion J can be formed at the same time. For this reason, when the inspection control wiring 55 having a structure in which the main portion 55A and the electrode portion 55B are separated from each other is applied, a separate process for electrically connecting the main portion 55A and the electrode portion 55B is not required. Thus, an increase in manufacturing cost is suppressed.

  In addition, this invention is not limited to the said embodiment itself, In the stage of implementation, it can change and implement a component within the range which does not deviate from the summary. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, you may combine suitably the component covering different embodiment.

  For example, the display device of the present invention is not limited to the liquid crystal display device described above, and may be another display device such as an organic electroluminescence display device using a self-luminous element as a display element.

FIG. 1 schematically shows a configuration of a liquid crystal display panel of a liquid crystal display device according to an embodiment of the present invention. FIG. 2 is a diagram schematically showing a cross-sectional structure of an active area in the liquid crystal display panel shown in FIG. FIG. 3 is a diagram schematically showing the configuration of the inspection unit in the liquid crystal display panel shown in FIG. FIG. 4 is a diagram for explaining a connection structure between the inspection control wiring and the switching element in the inspection unit illustrated in FIG. 3. FIG. 5 is a diagram schematically showing a cross-sectional structure when the inspection control wiring and the switching element shown in FIG. 4 are cut along an AA line.

Explanation of symbols

  PX ... Pixel Y ... Scanning line X ... Signal line WY ... Connection wiring WX ... Connection wiring J ... Jumper part 1 ... Liquid crystal display panel CH1 ... Contact hole CH2 ... Contact hole 3 ... Array substrate 4 ... Counter substrate 5 ... Liquid crystal layer 6 ... Active area 7 ... Switching element 8 ... Pixel electrode 9 ... Counter electrode 11 ... Drive IC chip 11X ... Signal line drive unit 11Y ... Scan line drive unit 20 ... Connection wiring group 40 ... Inspection unit 41 ... Signal line inspection unit 42 ... Scan line Inspection unit 44 ... Pad unit 51 ... Signal line inspection drive wiring 52 ... Scanning line inspection drive wiring 55 ... Inspection control wiring 55A ... Main part 55B ... Electrode unit 61 ... Switching element 62 ... Switching element 81 ... Insulating substrate 82 ... Undercoat layer 83 ... gate insulating layer 84 ... first insulating layer 85 ... contact hole 86 The contact hole 87 ... the second insulating layer 88 ... contact hole

Claims (6)

A plurality of pixels each having a pixel electrode, and an active area having a plurality of signal supply wirings for supplying drive signals to each pixel;
An inspection unit disposed outside the active area and inspecting the active area, and
The inspection unit
A main part to which an inspection signal is supplied when inspecting the active area, and an inspection wiring having an island-shaped electrode part spaced from the main part,
A switching element comprising a thin film transistor disposed between the main part and the signal supply wiring and having the electrode part as a gate electrode;
The inspection wiring is arranged in a different layer via an insulating layer and is formed of the same material as the pixel electrode, and the main part and the electrode part are electrically connected via a contact hole formed in the insulating layer. Jumper part to be connected
A display device comprising:   The insulating layer is formed of a first insulating layer formed of an inorganic material that covers the inspection wiring, and an inorganic material that covers a source electrode and a drain electrode of the switching element disposed on the first insulating layer. The display device according to claim 1, wherein the contact hole passes through the first insulating layer and the second insulating layer.   The display device according to claim 1, wherein the inspection wiring is a wiring to which an inspection control signal for controlling on / off of the switching element is supplied.   The display device according to claim 1, wherein the active area is provided in a liquid crystal display panel in which a liquid crystal layer is held between an array substrate and a counter substrate.   The display device according to claim 4, wherein the inspection wiring is disposed on an extended portion of the array substrate that extends outward from an end portion of the counter substrate.   The display device according to claim 5, further comprising a drive IC chip disposed corresponding to a region where the inspection wiring is disposed.

Images