JP4886914B2 - Electronics - Google Patents

Description

  The present invention relates to an electronic device having a heat dissipation structure.

  For example, a heating element such as an LSI is mounted on a circuit board of an electronic device such as a video recorder or a personal computer. In order to cool such a heat generating body, for example, a cooling system using a heat pipe and a heat sink is used.

  In the heat sink disclosed in Patent Document 1, one end of each of the first heat pipe or the second heat pipe is thermally connected to a plurality of heating elements, and the other end of each heat pipe is thermally connected to the heat sink. Connected. The first and second heat pipes have different contact areas with respect to the heat sink, and efficiently cool a plurality of heating elements.

JP 2009-150561 A

  A block-shaped heat receiving block may be used as a member for thermally connecting the heat pipe to the heating element. The heat receiving block has a heat receiving surface that comes into contact with the heat generating element and a fitting portion such as a hole into which an end of the heat pipe is fitted, and is thermally connected to the heat generating element and the heat pipe.

  When the heat receiving block is used, it is possible to cool the heating element more effectively than to directly connect the heat pipe to the heating element. However, since the heat receiving block is a relatively large component among the components attached to the circuit board, the arrangement of other components may be limited.

  The objective of this invention is providing the electronic device which can prevent arrangement | positioning of other components being restrict | limited by a heat receiving block.

In order to achieve the above object, an electronic apparatus according to one aspect of the present invention provides:
A housing, a circuit board housed in the housing, a heat dissipating portion provided in the housing, a first heating element mounted on the circuit board, and the heat dissipation from the first heating element A second heat generating element mounted on the circuit board at a position far from the first part, a first heat receiving block provided with a notch and thermally connected to the first heat generating element, and the first heat receiving element. A first heat pipe having a first end thermally connected to the block; and a second end thermally connected to the heat dissipating part; and thermally to the second heating element. A third end connected, a fourth end thermally connected to the heat radiating portion, and the first heat receiving block located between the third and fourth ends. A second heat pipe having an intermediate portion spaced apart and passed through the notch, and provided in the first heat receiving block, Comprising a regulating member for regulating the position of the middle portion in the cut-out portion, a.

  According to the electronic device of the present invention, it is possible to prevent the arrangement of other components from being limited by the heat receiving block.

The perspective view of the television connection apparatus which concerns on the 1st Embodiment of this invention. The horizontal sectional view which shows the internal structure of the television connection apparatus shown in FIG. The rear view which showed the inside of the television connection apparatus shown in FIG. 1 from back. The top view which shows the main board | substrate of the television connection apparatus shown in FIG. The top view which shows the 1st heat receiving block periphery mounted on the main board | substrate shown in FIG. FIG. 5 is a longitudinal sectional view taken along line F6-F6 in FIG. The top view which shows the 2nd heat receiving block periphery mounted on the main board | substrate shown in FIG. FIG. 5 is a longitudinal sectional view taken along line F8-F8 in FIG. The perspective view which shows the 2nd heat receiving block periphery shown in FIG. The longitudinal cross-sectional view which shows the 1st heat receiving block periphery which concerns on the 2nd Embodiment of this invention. The longitudinal cross-sectional view which shows the 1st heat receiving block periphery which concerns on the 3rd Embodiment of this invention.

  Embodiments of the present invention will be described below with reference to FIGS.

  FIG. 1 shows a television connection device 1 which is an example of an electronic device. The TV connection device 1 is used by connecting to an LCD TV, and has, for example, a function of receiving various TV programs and a function of recording a plurality of TV programs at the same time or recording a program for a long time. ing.

  The television connection device 1 includes a flat box-shaped device body 2. The device body 2 includes a metal housing 3, a decorative cover 4 that covers the housing 3, and left and right front doors 5 a and 5 b that cover the front surface of the decorative cover 4. In the description of the present embodiment, the direction in which the front doors 5a and 5b are provided is the front of the TV connection device 1, and the opposite direction is the rear of the TV connection device 1.

  As shown in FIGS. 2 and 3, the housing 3 is a skeleton of the device body 2 and has a flat bottom plate 6. A tuner board 7, a power supply module 8, a card connection device 9, a first information storage module 10, and a second information storage module 11 are arranged on the bottom plate 6 of the housing 3.

  The tuner board 7 and the power supply module 8 are arranged in the latter half of the device main body 2. The card connection device 9, the first information storage module 10, and the second information storage module 11 are arranged in the first half of the device main body 2 and are arranged in a line in the width direction of the device main body 2.

  A plurality of tuners 13 for receiving television programs are mounted on the tuner board 7. A plurality of B-CAS cards for receiving, for example, terrestrial digital / BS digital broadcasting or the like are inserted into the card connection device 9.

  The first and second information storage modules 10 and 11 are storage devices such as hard disk drives. The first and second information storage modules 10 and 11 are for recording a television program, and for quickly searching and reproducing the recorded television program.

  As shown in FIG. 3, an image processing substrate 15 is provided below the tuner substrate 7. A main module 16 is provided above the tuner substrate 7. The tuner substrate 7, the image processing substrate 15, and the main module 16 are accommodated in the housing 3 side by side in parallel.

  For example, an image processing chip 18 is mounted on the image processing board 15. A heat sink 19 for heat dissipation is attached to the image processing chip 18. As shown in FIG. 4, the main module 16 includes a main board 17 as a circuit board, a cell processor 21 as a first heating element, an I / O controller 22 as a second heating element, and a cooling device 25. And a plurality of components (not shown) such as capacitors and memories.

  The cooling device 25 includes a heat dissipating part 26 disposed at the end of the main board 17. An example of the heat radiating portion 26 is a heat radiating fin having a plurality of fin elements.

  Each of the cell processor 21 and the I / O controller 22 is a BGA (Ball Grid Array) that generates heat during use. The cell processor 21 and the I / O controller 22 are soldered to pads (not shown) provided on the main board 17 and mounted on the main board 17.

  Note that the first and second heating elements are not limited to the cell processor 21 and the I / O controller 22, but may generate heat during use, such as a CPU, a graphic chip, North Bridge (registered trademark), or a memory. The electronic parts may be used. However, the first and second heating elements are not limited to the above example, and various parts for which heat dissipation is desired are applicable.

  As shown in FIG. 4, the I / O controller 22 is mounted on the main board 17 at a position farther from the heat dissipation part 26 than the cell processor 21. The cell processor 21 is located on one path that connects, for example, the I / O controller 22 and the heat dissipation unit 26.

  Here, for example, the power consumption of the cell processor 21 is larger than the power consumption of the I / O controller 22. That is, the heat generation amount of the cell processor 21 is larger than, for example, the heat generation amount of the I / O controller 22, and the cell processor 21 is likely to have a higher temperature than the I / O controller 22.

  For example, the upper limit of the standard temperature of the cell processor 21 is higher than the upper limit of the standard temperature of the I / O controller 22. The “standard temperature” is a so-called spec temperature and is a temperature range in which the operation of the component is guaranteed.

  As shown in FIGS. 4 to 6, a first heat receiving block 31 is attached to the cell processor 21. The first heat receiving block 31 is a metal block, and includes a flat heat receiving surface 32 facing the cell processor 21, a pressed surface 33 located on the opposite side of the heat receiving surface 32, a first side surface 31a, It has the 2nd side surface 31b located in the other side of the 1st side surface 31a, and the 3rd side surface 31c orthogonal to the 1st and 2nd side surfaces 31a and 31b.

  As shown in FIG. 6, the first heat receiving block 31 includes a facing region A that is a region facing the cell processor 21 and an outer side region B that is separated from the facing region A and surrounds the periphery of the facing region A. Yes. The first heat receiving block 31 is thermally connected to the cell processor 21 in the region A facing the heat receiving surface 32.

  The first heat receiving block 31 has two connection holes 34, a stud 35 as a regulating member, a notch 36, and a positioning pin 37. The two connection holes 34 are respectively provided from the first side surface 31 a to the second side surface 31 b of the first heat receiving block 31. The positioning pin 37 protrudes from the outer side region B of the pressed surface 33.

  The notch 36 is provided at the corner where the third side surface 31 c of the first heat receiving block 31 and the pressed surface 33 intersect. The notch 36 has an inner side surface 36a continuous from the pressed surface 33 and a bottom surface 36b continuous from the third side surface 31c. A press-fit hole 38 provided from the bottom surface 36b to the heat receiving surface 32 is provided in the outer side region B of the bottom surface 36b.

  The stud 35 is provided in the notch 36 and has a columnar spacer 41, a press-fit pin 42 provided at one end of the spacer 41, and a positioning pin 43 provided at the other end of the spacer 41. is doing.

  The press-fit pin 42 is larger in diameter and shorter in length than the press-fit hole 38. The stud 35 is fixed to the outer side region B of the first heat receiving block 31 by press-fitting the press-fit pin 42 into the press-fit hole 38. The positioning pin 43 has the same shape as the positioning pin 37 of the first heat receiving block 31 and is located in the outer side region B.

  As shown in FIGS. 4 and 7 to 9, a second heat receiving block 51 is attached to the I / O controller 22. As shown in FIGS. 7 to 9, the second heat receiving block 51 is a metal block, and includes a flat heat receiving surface 52 facing the I / O controller 22, and a target object positioned on the opposite side of the heat receiving surface 52. It has a pressing surface 53 and first to fourth corners 51a to 51d. The second heat receiving block 51 is thermally connected to the I / O controller 22 at the heat receiving surface 52.

  A fitting portion 54 is provided from the first corner portion 51 a to the third corner portion 51 c of the second heat receiving block 51. The fitting portion 54 is a notch that opens in the pressed surface 53 of the second heat receiving block 51.

  A pair of positioning pins 55 are provided on the pressed surface 53 of the second heat receiving block 51. The pair of positioning pins 55 are arranged symmetrically with the fitting portion 54 interposed therebetween.

  As shown in FIG. 4, the cooling device 25 includes a heat radiating portion 26, two first heat pipes 62, and a second heat pipe 63. The first and second heat pipes 62 and 63 are formed by enclosing a working fluid such as water in a hollow rod-shaped main body made of copper or the like.

  The two first heat pipes 62 each include a first end portion 62 a thermally connected to the first heat receiving block 31 and a second end portion 62 b thermally connected to the heat radiating portion 26. Have.

  The first end 62 a is thermally connected to the first heat receiving block 31 by being inserted into the connection hole 34 of the first heat receiving block 31 and being caulked. The second end portion 62 b is thermally connected to the heat radiating portion 26 by penetrating the fin element of the heat radiating portion 26.

  The second heat pipe 63 includes a third end portion 63a thermally connected to the second heat receiving block 51, a fourth end portion 63b thermally connected to the heat radiating portion 26, a third And an intermediate portion 63c located between the fourth ends 63a and 63b.

  The third end 63 a is thermally connected to the second heat receiving block 51 by being fitted into the fitting portion 54 of the second heat receiving block 51 and being caulked. The fourth end portion 63 b is thermally connected to the heat radiating portion 26 by penetrating the fin element of the heat radiating portion 26. As shown in FIG. 3, the fourth end 63 b is connected to the heat radiating portion 26 at a position closer to the main substrate 17 than the second end 62 b of the first heat pipe 62.

  As shown in FIG. 6, the intermediate portion 63 c passes through the opposed region A above the cell processor 21 by passing through the cutout portion 36 of the first heat receiving block 31. More specifically, the intermediate portion 63 c passes through a passage region C that is sandwiched between the inner side surface 36 a of the notch portion 36 and the spacer portion 41 of the stud 35. That is, the position through which the intermediate portion 63 c passes is regulated by the stud 35.

  The intermediate portion 63 c passes through the passage region C so as to provide a gap between the notch portion 36 and the stud 35. For this reason, the second heat pipe 63 is thermally separated from the first heat receiving block 31.

  As shown in FIGS. 4 to 6, a first pressing member 66 is attached to the first heat receiving block 31. The first pressing member 66 is an X-shaped leaf spring having a main body portion 67, four leg portions 68, and a pair of positioning portions 69. The main body 67 is formed in a plate shape, for example, and faces the pressed surface 33 of the first heat receiving block 31.

  The leg portion 68 extends outward from the periphery of the main body portion 67 and is bent toward the main board 17. The distal end portion of the leg portion 68 is fixed to the main board 17 by fixing means 68a in which screws and studs are combined. When the main body portion 67 and the leg portion 68 cooperate to form a leaf spring structure, the first pressing member 66 presses the first heat receiving block 31 toward the cell processor 21.

  The pair of positioning portions 69 each extend to the side of the main body portion 67. Each of the pair of positioning portions 69 is provided with a through hole portion 69a. The first pressing member is positioned by fitting the positioning pin 37 of the first heat receiving block 31 and the positioning pin 43 of the stud 35 into the through hole 69a.

  The first pressing member 66 is not limited to the structure as described above, and any member that can press the first heat receiving block 31 toward the cell processor 21 may be used.

  As shown in FIGS. 4 and 7 to 9, a second pressing member 71 is attached to the second heat receiving block 51. The second pressing member 71 is an N-shaped leaf spring having a main body portion 72, two leg portions 73, and a pair of positioning portions 74. The main body 72 is formed in a rectangular plate shape, for example, and faces the pressed surface 53 of the second heat receiving block 51.

  The leg portions 73 are bent from both end portions of the main body portion 72 and bent toward the main board 17. The leg portion 73 has a constricted portion 73a with a reduced width. The distal end portion of the leg portion 73 is fixed to the main board 17 by fixing means 73b that combines a screw and a stud.

  The main body portion 72 is in contact with the pressed surface 53 so as to cover the fitting portion 54 of the second heat receiving block 51. When the main body portion 72 and the leg portion 73 cooperate to form a leaf spring structure, the second pressing member 71 presses the second heat receiving block 51 toward the I / O controller 22.

  The pair of positioning portions 74 each extend to the side of the main body portion 72. Each of the pair of positioning portions 74 is provided with a through hole 74a. The second pressing member is positioned by fitting the pair of positioning pins 55 of the second heat receiving block 51 into the pair of through holes 74a.

  The second pressing member 71 is not limited to the above structure, and may be any member that can press the second heat receiving block 51 toward the I / O controller 22.

  When the television connection device 1 having the above-described configuration is used, the cell processor 21 and the I / O controller 22 generate heat. Here, the heat generated by the cell processor 21 is received by the first end 62 a of the first heat pipe 62 through the first heat receiving block 31, and is transported to the heat radiating unit 26 by the first heat pipe 62. The

  On the other hand, the heat generated by the I / O controller 22 is received by the third end 63 a of the second heat pipe 63 through the second heat receiving block 51, and transported to the heat radiating unit 26 by the second heat pipe 63. Is done.

  The intermediate part 63 c of the second heat pipe 63 passes through the notch part 36 of the first heat receiving block 31. Since there is a gap between the intermediate portion 63 c and the first heat receiving block 31, the second heat pipe 63 receives heat only from the second heat receiving block 31.

Next, effects of the television connection device 1 having the above-described configuration will be described.
The first heat receiving block 31 is provided with a cutout portion 36 for allowing the intermediate portion 63c of the second heat pipe 63 to pass therethrough. As a result, the second heat pipe 63 does not need to bypass the first heat receiving block 31, and the degree of freedom of component placement increases.

  More specifically, for example, when the second heat pipe 63 is arranged so as to bypass the first heat receiving block 31, the arrangement of other components such as a condenser around the first heat receiving block 31 is limited. There is a case. However, by providing the notch 36 in the first heat receiving block 31 as in the present embodiment, the second heat pipe 63 does not need to bypass the first heat receiving block 31. Therefore, it is possible to prevent the arrangement of other components from being limited by the first heat receiving block 31.

Further, the television connection device 1 has the following effects.
The notch 36 allows the intermediate part 63 c to pass through so as to provide a gap between the notch 36 and the intermediate part 63 c of the second heat pipe 63. Thereby, the notch part 36 can absorb a dimensional tolerance and can let the intermediate part 63c of the 2nd heat pipe 63 pass.

  Since the I / O controller 22 generates less heat than the cell processor 21, it is sufficient to connect one second heat pipe 63 to the second heat receiving block 51 that is in thermal contact with the I / O controller 22. . As a result, the notch 36 is small, and the notch 36 can be easily provided in the first heat receiving block 31.

  The first and second pressing members 66 and 71 press the first and second heat receiving blocks 31 and 51 against the cell processor 21 and the I / O controller 22, respectively. Thus, the first and second heat receiving blocks 31 and 51 can efficiently receive heat from the cell processor 21 and the I / O controller 22.

  The stud 35 regulates the position where the intermediate part 63 c of the second heat pipe 63 passes through the notch part 36. As a result, it is possible to prevent the second heat pipe 63 from coming off the notch 36 and hitting other components.

  The press-fit pin 42 of the stud 35 is press-fitted into a press-fit hole 38 provided in the outer side region B of the first heat receiving block 31. Thereby, the fall of the heat receiving efficiency by the 1st heat receiving block 31 having the stud 35 and the press-fit hole 38 can be prevented.

  The first pressing member 66 has a through-hole portion 69 a that fits in the first heat receiving block 31 and the positioning pins 37 and 43 of the stud 35. The second pressing member 71 has a through hole portion 74 a that fits in the positioning pin 55 of the second heat receiving block 51. Thereby, the 1st and 2nd press members 66 and 71 can be positioned easily.

  The fitting portion 54 of the second heat receiving block 51 is provided from the first corner portion 51a to the third corner portion 51c. Thereby, the contact area of the 2nd heat receiving block 51 and the 2nd heat pipe 63 can be enlarged.

  The fourth end 63 b of the second heat pipe 63 is connected to the heat radiating unit 26 at a position closer to the main substrate 17 than the second end 62 b of the first heat pipe 62. Thereby, the 2nd heat pipe 63 can be shortened.

  Furthermore, since the second pressing member 71 having the above-described configuration is N-shaped, a long path from one fixing means 73b to the other fixing means 73b can be taken. Thereby, the 2nd press member 71 can press the 2nd heat receiving block 51 with sufficient load.

  The leg portion 73 of the second pressing member 71 is provided with a constricted portion 73a having a narrowed width. Thereby, the balance of the load concerning the 2nd press member 71 can be adjusted, and the buckling by stress concentration can be prevented.

  Next, another embodiment of the present invention will be described with reference to FIGS. At this time, components having the same functions as those of the television connection device 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 10 shows the first heat receiving block 31 of the second embodiment. The television connection device 1 of the second embodiment is different from the first embodiment in that it includes a heat connection member 81.

  The first heat receiving block 31 has a sheet-like heat connecting member 81 in the gap between the notch 36 and the second heat pipe 63. The thermal connection member 81 thermally connects the first heat receiving block 31 and the second heat pipe 63.

  The thermal connection member 81 is formed using, for example, a synthetic resin having thermal conductivity as a main material, and has a large flexibility that can follow the shape of a component. Note that the thermal connection member 81 is not limited to this and may be a member having thermal conductivity.

  When using the television connection device 1 having the above-described configuration, part of the heat generated by the cell processor 21 is received by the intermediate portion 63c of the second heat pipe 63 via the first heat receiving block 31 and the heat connecting member 81, It is transported to the heat radiating part 26 by the second heat pipe 63.

  According to the television connection device 1 having such a configuration, high cooling performance can be realized. That is, the heat connection member 81 is provided between the intermediate portion 63c of the second heat pipe 63 and the cutout portion 36 of the first heat receiving block 31, so that the heat of the cell processor 21 is transferred to the first heat pipe 62 and the first heat pipe 62. Since it can be transported by the two heat pipes 63, the cooling of the cell processor 21 can be further promoted. Thereby, cooling of the cell processor 21 can be further promoted as compared with the first embodiment.

  When the heat connection member 81 has flexibility, the difference in the gap between the second heat pipe 63 and the first heat receiving block 31 caused by the dimensional tolerance is absorbed, and the second heat pipe 63 and the first heat pipe 63 are absorbed. The heat receiving block 31 can be more thermally connected to the heat receiving block 31.

  Next, a third embodiment of the present invention will be described with reference to FIG. The television connection device 1 according to the third embodiment is different from the first embodiment in that it includes a heat insulating member 82.

  The first heat receiving block 31 has a sheet-like heat insulating member 82 in the gap between the notch 36 and the second heat pipe 63. The heat insulating member 82 insulates between the first heat receiving block 31 and the second heat pipe 63.

  The heat insulating member 82 is formed using, for example, a synthetic resin having a heat insulating property as a main material, and has a large flexibility that can follow the component shape. The heat insulating member 82 is not limited to this and may be a member having heat insulating properties.

  According to the television connection device 1 having the above-described configuration, the second heat pipe 63 contacts the first heat receiving block 31 due to dimensional tolerance or external force, and the second heat pipe 63 and the first heat receiving block 31 are thermally connected. Can be prevented. That is, when heat insulation is required between the second heat pipe 63 and the first heat receiving block 31, it is possible to reliably insulate between the second heat pipe 63 and the first heat receiving block 31. it can.

  When the heat insulating member 82 has flexibility, it absorbs the difference in the gap between the second heat pipe 63 and the first heat receiving block 31 caused by the dimensional tolerance, and the second heat pipe 63 and the first heat receiving heat are absorbed. The space between the blocks 31 can be insulated more reliably.

The contents described in the claims at the beginning of application of Japanese Patent Application No. 2009-228132, which is the original application, will be added below.
[1] a housing;
A circuit board housed in the housing;
A heat dissipating part provided in the housing;
A first heating element mounted on the circuit board;
A second heating element mounted on the circuit board at a position farther from the heat dissipation part than the first heating element;
A first heat receiving block that is thermally connected to the first heating element opposite to the first heating element;
A second heat receiving block thermally connected to the second heat generating element so as to face the second heat generating element;
At least one first heat pipe having a first end thermally connected to the first heat receiving block and a second end thermally connected to the heat radiating portion;
A third end portion thermally connected to the second heat receiving block, a fourth end portion thermally connected to the heat radiating portion, and a third end portion located between the third and fourth end portions. A second heat pipe having an intermediate portion passing through a region facing the first heating element;
A notch portion that is provided in the first heat receiving block and allows the intermediate portion to pass therethrough so as to provide a gap with the intermediate portion;
An electronic apparatus comprising:

  [2] The electronic device according to [1], wherein the first heating element has a larger amount of heat generation than the second heating element.

  [3] A plate spring-like first pressing member that opposes the first heat receiving block and presses the first heat receiving block toward the first heat generating element is provided. [2 ] Is an electronic device.

  [4] A leaf spring-like second pressing member that opposes the second heat receiving block and presses the second heat receiving block toward the second heating element is provided. [3 ] Is an electronic device.

  [5] The electronic device according to [4], further comprising a restricting member that is provided in the notch and restricts a position through which an intermediate portion of the second heat pipe passes.

  [6] The electronic device according to [5], wherein the restricting member is provided outside a region facing the first heating element.

[7] The first pressing member has a plurality of through holes,
Each of the first heat receiving block and the regulating member has a positioning pin that is provided off the region facing the first heating element, and the positioning pin fits into the through hole and the first The electronic device according to [6], wherein the position of the pressing member is determined.

  [8] The second heat receiving block includes a plurality of corner portions, and a fitting portion provided from one corner portion to the other corner portion and into which the third end portion of the second heat pipe is fitted. The electronic device according to [1], wherein

  [9] A sheet-like thermal connection provided in a gap between the second heat pipe and the first heat receiving block and thermally connecting the second heat pipe and the first heat receiving block. The electronic device according to [1], further comprising a member.

  [10] A sheet-like heat insulating member that is provided in a gap between the second heat pipe and the first heat receiving block and insulates the space between the second heat pipe and the first heat receiving block. The electronic device according to [1], further comprising:

  The contents described in the claims immediately before the division of the original application will be added below.

[1] a housing;
A circuit board housed in the housing;
A heat dissipating part provided in the housing;
A first heating element mounted on the circuit board;
A second heating element mounted on the circuit board;
A first heat receiving block provided with a notch and thermally connected to the first heating element;
A first heat pipe having a first end thermally connected to the first heat receiving block and a second end thermally connected to the heat radiating portion;
Positioned between a third end thermally connected to the second heating element, a fourth end thermally connected to the heat radiating portion, and the third and fourth ends. And a second heat pipe having an intermediate portion that is spaced apart from the first heat receiving block and passes through the notch,
A restricting member that is provided in the first heat receiving block and restricts the position of the intermediate portion within the cutout portion;
An electronic apparatus comprising:

[2] The electronic device according to [1], wherein the first heating element has a larger amount of heat generation than the second heating element.

[3] The electronic device according to [2], further comprising a leaf spring-shaped first pressing member that presses the first heat receiving block toward the first heating element.

[4] The electronic device according to [3], further including a leaf spring-shaped second pressing member that presses the second heat receiving block toward the second heat generating element.

[5] The electronic device according to [1], wherein the restricting member is provided outside a region facing the first heating element.

[6] A plate spring-like pressing member that presses the first heat receiving block toward the first heating element is further provided,
The pressing member has a plurality of through holes,
Each of the first heat receiving block and the regulating member has a positioning pin provided to be separated from a region facing the first heating element,
The electronic device according to [5], wherein the positioning pin is fitted in the through hole portion to determine a position of the pressing member.

[7] The second heat receiving block further interposed between the third end of the second heat pipe and the second heating element,
The second heat receiving block includes a plurality of corner portions and a fitting portion provided from one corner portion to the other corner portion and into which the third end portion of the second heat pipe is fitted. The electronic device according to [1], wherein

[8] A sheet-like thermal connection provided in a gap between the second heat pipe and the first heat receiving block, and thermally connecting the second heat pipe and the first heat receiving block. The electronic device according to [1], further comprising a member.

[9] A sheet-like heat insulating member that is provided in a gap between the second heat pipe and the first heat receiving block and insulates the space between the second heat pipe and the first heat receiving block. The electronic device according to [1], further comprising:

[10] a housing;
A circuit board housed in the housing;
A first heating element mounted on the circuit board;
A second heating element mounted on the circuit board;
A heat transfer member provided with an opening and thermally connected to the first heating element;
A first heat pipe having a first heat receiving portion thermally connected to the heat transfer member, and a first heat radiating portion from which heat is released;
A second heat receiving portion thermally connected to the second heat generating element; and a second heat radiating portion from which heat is released, and the second heat receiving portion and the second heat radiating portion. A second heat pipe in which the portion located between is housed in the opening;
A member provided on the heat transfer member, for positioning the second heat pipe in the notch,
An electronic apparatus comprising:

  DESCRIPTION OF SYMBOLS 1 ... TV connection apparatus, 3 ... Housing | casing, 17 ... Main board | substrate, 21 ... Cell processor, 22 ... I / O controller, 26 ... Radiation part, 31 ... 1st heat receiving block, 35 ... Stud, 36 ... Notch part, 37, 43, 55 ... positioning pin, 51 ... second heat receiving block, 51a to 51c ... corner, 54 ... fitting portion, 62 ... first heat pipe, 62a ... first end, 62b ... second 63, second heat pipe, 63a, third end, 63b, fourth end, 63c, intermediate portion, 66, first pressing member, 69a, 74a, through-hole portion, 71 ... 2nd press member, 81 ... thermal connection member, 82 ... heat insulation member.

Claims (10)

A housing,
A circuit board housed in the housing;
A heat dissipating part provided in the housing;
A first heating element mounted on the circuit board;
A second heating element mounted on the circuit board at a position farther from the heat dissipation part than the first heating element;
A first heat receiving block provided with a notch and thermally connected to the first heating element;
A first heat pipe having a first end thermally connected to the first heat receiving block and a second end thermally connected to the heat radiating portion;
Positioned between a third end thermally connected to the second heating element, a fourth end thermally connected to the heat radiating portion, and the third and fourth ends. And a second heat pipe having an intermediate portion that is spaced apart from the first heat receiving block and passes through the notch,
A restricting member that is provided in the first heat receiving block and restricts the position of the intermediate portion within the cutout portion;
An electronic apparatus comprising:   The electronic device according to claim 1, wherein the first heating element has a larger amount of heat generation than the second heating element.   The electronic apparatus according to claim 2, further comprising a leaf spring-shaped first pressing member that presses the first heat receiving block toward the first heating element. A second heat receiving block interposed between the third end of the second heat pipe and the second heating element;
The electronic apparatus according to claim 3, further comprising a leaf spring-like second pressing member that presses the second heat receiving block toward the second heating element.   The electronic device according to claim 1, wherein the regulating member is provided so as to be separated from a region facing the first heating element. A leaf spring-like pressing member that presses the first heat receiving block toward the first heating element;
The pressing member has a plurality of through holes,
Each of the first heat receiving block and the regulating member has a positioning pin provided to be separated from a region facing the first heating element,
The electronic device according to claim 5, wherein the positioning pin fits into the through hole portion and determines a position of the pressing member. A second heat receiving block interposed between the third end of the second heat pipe and the second heating element;
The second heat receiving block includes a plurality of corner portions and a fitting portion provided from one corner portion to the other corner portion and into which the third end portion of the second heat pipe is fitted. The electronic apparatus according to claim 1, wherein the electronic apparatus is an electronic device.   A sheet-like heat connecting member provided in a gap between the second heat pipe and the first heat receiving block, and thermally connecting the second heat pipe and the first heat receiving block; The electronic apparatus according to claim 1, further comprising:   A sheet-like heat insulating member that is provided in a gap between the second heat pipe and the first heat receiving block and insulates the space between the second heat pipe and the first heat receiving block; The electronic device according to claim 1. A housing,
A circuit board housed in the housing;
A heat dissipating part provided in the housing;
A first heating element mounted on the circuit board;
A second heating element mounted on the circuit board at a position farther from the heat dissipation part than the first heating element;
A heat receiving block provided with a notch and thermally connected to the first heating element;
A first heat pipe having a first portion thermally connected to the heat receiving block and a second portion connected to the heat radiating portion;
A third portion thermally connected to the second heating element; and a fourth portion connected to the heat radiating portion; and between the third portion and the fourth portion. A second heat pipe in which the located part is accommodated in the notch,
A member for positioning the second heat pipe in the notch,
An electronic apparatus comprising:

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