JP4880408B2 - 基板処理装置、基板処理方法、半導体装置の製造方法、メインコントローラおよびプログラム - Google Patents

基板処理装置、基板処理方法、半導体装置の製造方法、メインコントローラおよびプログラム Download PDF

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JP4880408B2
JP4880408B2 JP2006257777A JP2006257777A JP4880408B2 JP 4880408 B2 JP4880408 B2 JP 4880408B2 JP 2006257777 A JP2006257777 A JP 2006257777A JP 2006257777 A JP2006257777 A JP 2006257777A JP 4880408 B2 JP4880408 B2 JP 4880408B2
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boat
processing chamber
substrates
pod
transfer device
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Japanese (ja)
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JP2008078505A (ja
JP2008078505A5 (enrdf_load_stackoverflow
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行雄 尾崎
覚 高畑
礼三 布澤
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Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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JP2006257777A 2006-09-22 2006-09-22 基板処理装置、基板処理方法、半導体装置の製造方法、メインコントローラおよびプログラム Active JP4880408B2 (ja)

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JP2006257777A JP4880408B2 (ja) 2006-09-22 2006-09-22 基板処理装置、基板処理方法、半導体装置の製造方法、メインコントローラおよびプログラム

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JP2006257777A JP4880408B2 (ja) 2006-09-22 2006-09-22 基板処理装置、基板処理方法、半導体装置の製造方法、メインコントローラおよびプログラム

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JP2008078505A JP2008078505A (ja) 2008-04-03
JP2008078505A5 JP2008078505A5 (enrdf_load_stackoverflow) 2009-11-05
JP4880408B2 true JP4880408B2 (ja) 2012-02-22

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101385659B1 (ko) * 2012-04-27 2014-04-16 주식회사 테라세미콘 배치식 장치
WO2015030047A1 (ja) * 2013-08-27 2015-03-05 株式会社日立国際電気 基板処理装置のメンテナンス方法、半導体装置の製造方法、基板処理装置、及び基板処理装置のメンテナンスプログラムを読取可能な記録媒体
WO2023127054A1 (ja) * 2021-12-27 2023-07-06 株式会社Kokusai Electric 漏洩検知装置、半導体装置の製造方法、基板処理方法およびプログラム
CN119786412A (zh) * 2024-12-05 2025-04-08 东莞市晟鼎精密仪器有限公司 一种晶圆全自动快速退火设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3468577B2 (ja) * 1994-04-14 2003-11-17 東京エレクトロン株式会社 熱処理装置
JP4456727B2 (ja) * 2000-05-29 2010-04-28 株式会社日立国際電気 半導体装置の製造方法および基板処理装置

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