JP4874895B2 - Antistatic coating composition, method for producing antistatic coating film using the same, and coating film therefor - Google Patents
Antistatic coating composition, method for producing antistatic coating film using the same, and coating film therefor Download PDFInfo
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- JP4874895B2 JP4874895B2 JP2007217697A JP2007217697A JP4874895B2 JP 4874895 B2 JP4874895 B2 JP 4874895B2 JP 2007217697 A JP2007217697 A JP 2007217697A JP 2007217697 A JP2007217697 A JP 2007217697A JP 4874895 B2 JP4874895 B2 JP 4874895B2
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- 238000000576 coating method Methods 0.000 title claims description 61
- 239000011248 coating agent Substances 0.000 title claims description 53
- 239000008199 coating composition Substances 0.000 title claims description 48
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 230000002776 aggregation Effects 0.000 claims description 26
- 229920000642 polymer Polymers 0.000 claims description 25
- 229920001940 conductive polymer Polymers 0.000 claims description 24
- 238000004220 aggregation Methods 0.000 claims description 22
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 20
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 18
- 239000006185 dispersion Substances 0.000 claims description 17
- 238000001035 drying Methods 0.000 claims description 16
- 239000003112 inhibitor Substances 0.000 claims description 13
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 claims description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 8
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 239000003960 organic solvent Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 6
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 claims description 6
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 5
- 239000012964 benzotriazole Substances 0.000 claims description 5
- 229920000123 polythiophene Polymers 0.000 claims description 5
- BHRZNVHARXXAHW-UHFFFAOYSA-N sec-butylamine Chemical compound CCC(C)N BHRZNVHARXXAHW-UHFFFAOYSA-N 0.000 claims description 5
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 4
- 229920000767 polyaniline Polymers 0.000 claims description 4
- 229920000128 polypyrrole Polymers 0.000 claims description 4
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 4
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 4
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical group C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 claims description 3
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims description 3
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 claims description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- FULZLIGZKMKICU-UHFFFAOYSA-N N-phenylthiourea Chemical compound NC(=S)NC1=CC=CC=C1 FULZLIGZKMKICU-UHFFFAOYSA-N 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 3
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 claims description 3
- KVKFRMCSXWQSNT-UHFFFAOYSA-N n,n'-dimethylethane-1,2-diamine Chemical compound CNCCNC KVKFRMCSXWQSNT-UHFFFAOYSA-N 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 3
- LRUDIIUSNGCQKF-UHFFFAOYSA-N 5-methyl-1H-benzotriazole Chemical compound C1=C(C)C=CC2=NNN=C21 LRUDIIUSNGCQKF-UHFFFAOYSA-N 0.000 claims description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 8
- -1 aliphatic alcohols Chemical class 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000005054 agglomeration Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229920000144 PEDOT:PSS Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000003232 water-soluble binding agent Substances 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000002482 conductive additive Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- BQUDLWUEXZTHGM-UHFFFAOYSA-N ethyl propaneperoxoate Chemical compound CCOOC(=O)CC BQUDLWUEXZTHGM-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/16—Anti-static materials
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
本発明は、帯電防止用コーティング組成物、それを利用した帯電防止コーティング膜の製造方法及びこれによって製造された帯電防止コーティング膜に係り、さらに詳細には、コーティング組成物中の高分子凝集現象を除去した帯電防止用コーティング組成物、それを利用した透明帯電防止コーティング膜の製造方法及びこれによって製造された帯電防止コーティング膜に関する。 The present invention relates to an antistatic coating composition, a method for producing an antistatic coating film using the same, and an antistatic coating film produced thereby, and more particularly, the polymer aggregation phenomenon in the coating composition. The present invention relates to a removed antistatic coating composition, a method for producing a transparent antistatic coating film using the same, and an antistatic coating film produced thereby.
各種の半導体及び電子機器の微細化・高集積化に伴い、静電気の発生が製品に色々な影響を与えている。このような静電気を効果的に除去するために、伝導性物質を利用した帯電防止コーティング方法が提示されている。現在、このようなコーティング技術は、ディスプレイ素子の外面ガラスの帯電防止コーティング膜、半導体素子運搬用トレイ、偏光板及びバックライトユニットの保護フィルム、透明レンズのコーティング膜に適用されている。 With the miniaturization and high integration of various semiconductors and electronic devices, the generation of static electricity has various effects on products. In order to effectively remove such static electricity, an antistatic coating method using a conductive material has been proposed. At present, such a coating technique is applied to an antistatic coating film on the outer glass of a display element, a tray for transporting a semiconductor element, a protective film for a polarizing plate and a backlight unit, and a coating film for a transparent lens.
このような帯電防止コーティング膜は、アルミニウムなどの金属粒子と、カーボンブラックと、水分と反応すればイオン伝導性を有する、界面活性剤のような伝導性添加剤を含む非伝導性高分子と、ポリチオフェン、ポリピロール、ポリアニリンのように、自身が伝導性を有する伝導性高分子と、を含む。 Such an antistatic coating film includes metal particles such as aluminum, carbon black, a non-conductive polymer containing a conductive additive such as a surfactant that has ionic conductivity when reacted with moisture, And a conductive polymer having conductivity, such as polythiophene, polypyrrole, and polyaniline.
色々な伝導性材料のうち、透明であり、かつ基材と密着性の良好な伝導性高分子材料が、近年色々な産業分野で注目されている。しかし、伝導性高分子を含むコーティング組成物でコーティングを行う場合、コーティング器の金属部分で高分子が凝集される現象が発生しやすい。このような凝集は、コーティング過程で不良の原因となり、凝集部分を除去するために工程を中断すれば、生産性が低下し、そのため製造コストが上昇してしまう。 Among various conductive materials, conductive polymer materials that are transparent and have good adhesion to the substrate have recently attracted attention in various industrial fields. However, when coating is performed with a coating composition containing a conductive polymer, a phenomenon in which the polymer is aggregated at the metal portion of the coating device tends to occur. Such agglomeration causes a defect in the coating process, and if the process is interrupted to remove the agglomerated part, the productivity is lowered and the manufacturing cost is increased.
本発明の目的は、帯電防止用コーティング作業を行うときに、機器の金属部分で発生する高分子の凝集現象を効果的に除去してコーティング作業の効率性を高める帯電防止用コーティング組成物を提供することである。 The object of the present invention is to provide an antistatic coating composition that effectively removes the polymer agglomeration phenomenon that occurs in the metal part of the equipment and improves the efficiency of the coating operation when performing the antistatic coating operation. It is to be.
本発明の他の目的は、前記組成物を利用して透明で、優秀な帯電防止性能を有する帯電防止コーティング膜を製造する方法を提供することである。 Another object of the present invention is to provide a method for producing an antistatic coating film which is transparent and has excellent antistatic performance using the composition.
本発明のさらに他の目的は、前記方法で製造された帯電防止コーティング膜を提供することである。 Still another object of the present invention is to provide an antistatic coating film produced by the above method.
前記目的を達成するために本発明は、ポリチオフェン系、ポリピロール系、ポリアニリン系高分子化合物またはこれらの混合物を含有する伝導性高分子水分散液と、水溶性ポリウレタン、水溶性ポリアクリレート、水溶性ポリビニルアルコール、水溶性ポリビニルアセタル、及びこれらの混合物からなる群から選択される1種以上である水溶性バインダー樹脂と、アルコール溶媒と、ジメチルスルホキシド、プロピレングリコールメチルエーテル、N−メチルピロリドン、エチル−3−エトキシプロピオネート、プロピレングリコールモノメチルエーテルアセテート、ブチルカルビトール及びこれらの混合物からなる群から選択される機能性有機溶媒と、水と、エチレンジアミン、ジメチルエチレンジアミン、2−ブチルアミン、トリエタノールアミン、ベンゾトリアゾール、ベンゾチアゾール、ピリジン、トリルトリアゾール、キノリン、イミダゾール、ベンズイミダゾール、5−メチル−1H−ベンゾトリアゾール、ポリビニルピロリドン、N−フェニルチオウレアからなる群から選択される1種以上の高分子凝集抑制剤を含むコーティング組成物を提供する。 In order to achieve the above object, the present invention provides a conductive polymer aqueous dispersion containing a polythiophene-based, polypyrrole-based, polyaniline-based polymer compound or a mixture thereof, a water-soluble polyurethane, a water-soluble polyacrylate, and a water-soluble polyvinyl. One or more water-soluble binder resins selected from the group consisting of alcohol, water-soluble polyvinyl acetal, and mixtures thereof , alcohol solvents, dimethyl sulfoxide, propylene glycol methyl ether, N-methylpyrrolidone, ethyl-3 A functional organic solvent selected from the group consisting of ethoxypropionate, propylene glycol monomethyl ether acetate, butyl carbitol and mixtures thereof, water, ethylenediamine, dimethylethylenediamine, 2-butylamine, triethanol One or more polymer aggregates selected from the group consisting of ruamine, benzotriazole, benzothiazole, pyridine, tolyltriazole, quinoline, imidazole, benzimidazole, 5-methyl-1H-benzotriazole, polyvinylpyrrolidone, N-phenylthiourea A coating composition comprising an inhibitor is provided.
また、本発明は、前記他の目的を達成するために、前記コーティング組成物を基板にコーティングする工程と、前記コーティングされた組成物を乾燥させる工程と、を含む帯電防止コーティング膜の製造方法を提供する。 In order to achieve the other object, the present invention provides a method for producing an antistatic coating film, comprising: a step of coating a substrate with the coating composition; and a step of drying the coated composition. provide.
本発明の一具現例によるコーティング組成物において、前記コーティング組成物は、1ないし30重量%の前記伝導性高分子水分散液と、5ないし25重量%の前記バインダー樹脂と、5ないし40重量%のアルコール溶媒と、5ないし30重量%の前記機能性有機溶媒と、10ないし50重量%の水と、0.001ないし10重量%の前記高分子凝集抑制剤と、を含むことが望ましい。 In the coating composition according to an embodiment of the present invention, the coating composition is 1 to said conductive polymer aqueous dispersion 30 wt%, and 5 to 25% by weight of the binder resin, 5 to 40 wt% It is preferable to contain 5 to 30% by weight of the functional organic solvent, 10 to 50% by weight of water, and 0.001 to 10% by weight of the polymer aggregation inhibitor.
本発明の一具現例によるコーティング組成物において、アルコール溶媒は、炭素数1ないし5の脂肪族アルコールであることが望ましい。 In the coating composition according to an embodiment of the present invention, the alcohol solvent is preferably an aliphatic alcohol having 1 to 5 carbon atoms.
本発明による帯電防止コーティング膜の製造方法は、前記コーティング組成物を基板にコーティングする工程と、前記コーティングされた組成物を乾燥させる工程と、を含む。 The method for producing an antistatic coating film according to the present invention includes a step of coating a substrate with the coating composition and a step of drying the coated composition.
前記方法によって製造された帯電防止用コーティング組成物を利用して帯電防止コーティング膜を形成すれば、コーティング器の金属部分で発生する高分子の凝集現象を効果的に除去してコーティング作業の効率性及び生産性を高めることができる。 If an antistatic coating film is formed using the antistatic coating composition manufactured by the above method, the polymer agglomeration phenomenon generated in the metal part of the coating device is effectively removed, and the efficiency of the coating operation is reduced. And can increase productivity.
本発明の帯電防止用コーティング組成物を利用して帯電防止コーティング膜を形成すれば、機器の金属部分で発生する高分子の凝集現象を効果的に除去してコーティング作業の効率性及び生産性を高めることができる。 If the antistatic coating film is formed using the antistatic coating composition of the present invention, the polymer agglomeration phenomenon generated in the metal part of the device is effectively removed, and the efficiency and productivity of the coating operation are improved. Can be increased.
本発明によって製造された帯電防止コーティング膜は、優秀な帯電防止機能と透明性とを有し、半導体、ディスプレイ産業の様々な分野に適用することができる。 The antistatic coating film produced by the present invention has an excellent antistatic function and transparency, and can be applied to various fields in the semiconductor and display industries.
以下、本発明の1実施形態をさらに詳細に説明する。
本発明の1実施形態に係る帯電防止用コーティング組成物は、伝導性高分子水分散液と、バインダー樹脂と、アルコール溶媒と、機能性有機溶媒と、水と、高分子凝集抑制剤と、を含む。
Hereinafter, one embodiment of the present invention will be described in more detail.
Antistatic coating composition according to one embodiment of the present invention, a conductive polymer aqueous dispersion, and Ba Indah resin, an alcohol solvent, a functional organic solvent, water, a polymeric aggregation inhibitor, including.
前記伝導性高分子は、コーティング膜の表面に帯電防止効果を発生してホコリなどの汚染源を除去するために使われる。本発明の1実施形態に係るコーティング組成物のうち、伝導性高分子水分散液は、伝導性高分子化合物を水に分散または溶解させたものであって、高分子化合物の濃度は総分散液を基準に0.1ないし10重量%である。前記伝導性高分子化合物としては、ポリチオフェン系、ポリピロール系またはポリアニリン系高分子化合物が望ましく、二重ポリチオフェン系化合物がさらに望ましく、ポリエチレンジオキシチオフェン(PEDOT:Polyethylene Dioxythiophene)が特に望ましい。 The conductive polymer is used to remove a contamination source such as dust by generating an antistatic effect on the surface of the coating film. In the coating composition according to one embodiment of the present invention, the conductive polymer aqueous dispersion is obtained by dispersing or dissolving the conductive polymer compound in water, and the concentration of the polymer compound is the total dispersion. 0.1 to 10% by weight based on the above. The conductive polymer compound is preferably a polythiophene-based, polypyrrole-based, or polyaniline-based polymer compound, more preferably a double polythiophene-based compound, and particularly preferably polyethylene dioxythiophene (PEDOT).
一方、前記伝導性高分子水分散液としては、市販されているBayer社製の商品名Baytron PやBaytron PHを使用してよい。Baytron
Pは、水にPEDOTが分散されている水分散液にポリスチレンスルホン酸(PSS)をドーパントとして添加した製品である。前記Baytron Pのうち、PEDOTの含量は、約1.4%である。
On the other hand, as the conductive polymer aqueous dispersion, commercially available product names Baytron P and Baytron PH manufactured by Bayer may be used. Baytron
P is a product obtained by adding polystyrene sulfonic acid (PSS) as a dopant to an aqueous dispersion in which PEDOT is dispersed in water. Of the Baytron P, the content of PEDOT is about 1.4%.
前記伝導性高分子水分散液の含量は、コーティング組成物全体に対して1ないし30重量%であることが望ましい。前記伝導性高分子水分散液の含量が1重量%未満であれば、コーティング膜の表面抵抗が増加して帯電防止性能が低下するという問題があり、30重量%を超えれば、帯電防止及び電磁波遮蔽性能の特別な向上なしにコーティング組成物のコーティング性が低下し、かつ製造コストが上昇するという問題がある。 The content of the conductive polymer aqueous dispersion is preferably 1 to 30% by weight based on the entire coating composition. If the content of the conductive polymer aqueous dispersion is less than 1% by weight, there is a problem that the surface resistance of the coating film is increased and the antistatic performance is deteriorated. There is a problem that the coating property of the coating composition is lowered and the manufacturing cost is increased without special improvement of the shielding performance.
本発明の1実施形態に係る帯電防止用コーティング組成物のうち、水溶性バインダー樹脂は、伝導性高分子の分散性を向上させ、生成されるコーティング膜の膜均一性、付着性、膜強度を向上させる役割を有する。前記バインダー樹脂としては、通常的な光硬化型または熱硬化型バインダーを広範囲に使用でき、例えば、水溶性ポリウレタン、水溶性ポリアクリレート、水溶性ポリビニルアルコール、水溶性ポリビニルアセタル、またはこれらの混合物が挙げられるが、これらに限定されるものではない。このうち、水溶性熱硬化型であるポリウレタン樹脂を使用すれば、形成されるコーティング膜の付着性及び膜強度の特性及び帯電防止性能が向上するので望ましい。 Among the antistatic coating compositions according to an embodiment of the present invention, the water-soluble binder resin improves the dispersibility of the conductive polymer and improves the film uniformity, adhesion, and film strength of the coating film to be produced. Have a role to improve. As the binder resin, ordinary photo-curing or thermosetting binders can be used in a wide range, for example, water-soluble polyurethane, water-soluble polyacrylate, water-soluble polyvinyl alcohol, water-soluble polyvinyl acetal , or a mixture thereof. Although it is mentioned, it is not limited to these. Of these, use of a water-soluble thermosetting polyurethane resin is desirable because it improves the adhesion and film strength characteristics and antistatic performance of the coating film to be formed.
前記バインダー樹脂の含量は、コーティング組成物全体に対して5ないし25重量%であることが望ましい。前記バインダー樹脂の含量が5重量%未満であれば、コーティング膜の均一性、付着性及び膜強度が低下するという問題があり、25重量%を超えれば、伝導性高分子の分散性が低下して帯電防止性能が劣化し、大きな面積をコーティングした時に汚れ発生の頻度が増加するという問題がある。 Content in the pre fangs Indah resin is preferably 5 to with respect to the total coating composition is 25% by weight. If it is less than before Kiba Indah content of the resin is 5 wt%, the uniformity of the coating film, there is a problem that adhesion and film strength is lowered, if it exceeds 25 wt%, the dispersibility of the conductive polymer As a result, the antistatic performance deteriorates, and the frequency of occurrence of contamination increases when a large area is coated.
本発明の1実施形態に係る帯電防止用コーティング組成物のうち、アルコール溶媒は、コーティング組成物の乾燥性などのコーティング性を向上させる役割を担う。前記アルコール溶媒としては、高分子コーティング組成物に通常的に使われるアルコール化合物を広範囲に使用し、望ましくは、炭素数1ないし5の脂肪族アルコールのうち一つ以上を選択して使用し、さらに望ましくは、メタノール、エタノール、イソプロピルアルコール(IPA)またはこれらの混合物を使用し、望ましくは、エタノールとイソプロピルアルコールとを混合して製造した溶媒混合物を使用してよい。 Among the antistatic coating compositions according to one embodiment of the present invention, the alcohol solvent plays a role of improving coating properties such as drying properties of the coating composition. As the alcohol solvent, alcohol compounds commonly used in polymer coating compositions are used in a wide range, and preferably one or more aliphatic alcohols having 1 to 5 carbon atoms are selected and used. Desirably, methanol, ethanol, isopropyl alcohol (IPA) or a mixture thereof may be used. Desirably, a solvent mixture prepared by mixing ethanol and isopropyl alcohol may be used.
前記アルコール溶媒の含量は、コーティング組成物全体に対して5ないし40重量%、望ましくは、10ないし30重量%のアルコール溶媒であることが望ましい。前記アルコール溶媒の含量が全体コーティング組成物に対して5重量%未満であれば、乾燥性が低下する恐れがあり、40重量%を超えれば、伝導性高分子の分散性が低下して表面抵抗が上昇するという問題がある。 The content of the alcohol solvent is 5 to 40% by weight, preferably 10 to 30% by weight, based on the entire coating composition. If the content of the alcohol solvent is less than 5% by weight with respect to the total coating composition, the drying property may be lowered. If the content exceeds 40% by weight, the dispersibility of the conductive polymer is lowered and the surface resistance is lowered. There is a problem of rising.
本発明の1実施形態に係る帯電防止用コーティング組成物は、前記脂肪族アルコール溶媒と共に、コーティング組成物の溶解性、分散性、乾燥性、膜均一性などのコーティング性をさらに向上させる機能性有機溶媒を含む。前記機能性有機溶媒としては、ジメチルスルホキシド(DMSO)、プロピレングリコールメチルエーテル(PGME)、N−メチルピロリドン(NMP)、エチル−3−エトキシプロピオネート(EEP)、プロピレングリコールモノメチルエーテルアセテート(PGMEA)、ブチルカルビトール(BC)、またはこれらの混合物を使用し、望ましくは、ジメチルスルホキシドを使用する。 The antistatic coating composition according to an embodiment of the present invention is a functional organic material that further improves the coating properties such as solubility, dispersibility, drying property, and film uniformity of the coating composition together with the aliphatic alcohol solvent. Contains solvent. Examples of the functional organic solvent include dimethyl sulfoxide (DMSO), propylene glycol methyl ether (PGME), N-methylpyrrolidone (NMP), ethyl-3-ethoxypropionate (EEP), propylene glycol monomethyl ether acetate (PGMEA). , Butyl carbitol (BC), or a mixture thereof, preferably dimethyl sulfoxide.
前記機能性有機溶媒の含量は、全体コーティング組成物に対して5ないし30重量%、望ましくは、10ないし30重量%である。前記機能性有機溶媒の含量が5重量%未満であれば、コーティング組成物のコーティング性が低下して不均一膜が形成されるという問題があり、30重量%を超えれば、コーティング性能が特別に向上されずに乾燥性が低下するという問題がある。 The content of the functional organic solvent is 5 to 30% by weight, preferably 10 to 30% by weight, based on the total coating composition. If the content of the functional organic solvent is less than 5% by weight, there is a problem in that the coating property of the coating composition is deteriorated and a non-uniform film is formed. There is a problem that the drying property is lowered without being improved.
本発明の1実施形態に係る帯電防止用コーティング組成物は、金属表面での高分子凝集を抑制させる添加剤をさらに含む。使われる高分子凝集抑制剤は、アミン類化合物としてエチレンジアミン、ジメチルエチレンジアミン、2−ブチルアミン、トリエタノールアミン、ベンゾトリアゾール、ベンゾチアゾール、ピリジン、トリルトリアゾール、キノリン、イミダゾール、ベンズイミダゾール、5−メチル−1H−ベンゾトリアゾール、ポリビニルピロリドン、及びN−フェニルチオウレアからなる群から選択された1種以上を含む。 The antistatic coating composition according to an embodiment of the present invention further includes an additive that suppresses polymer aggregation on the metal surface. The polymer aggregation inhibitor used is ethylenediamine, dimethylethylenediamine, 2-butylamine, triethanolamine, benzotriazole, benzothiazole, pyridine, tolyltriazole, quinoline, imidazole, benzimidazole, 5-methyl-1H- as amine compounds. 1 or more types selected from the group which consists of benzotriazole, polyvinylpyrrolidone, and N-phenylthiourea are included.
前記高分子凝集抑制剤の含量は、全体コーティング組成物に対して0.001ないし10重量%であることが望ましい。0.001重量%未満であれば、前記高分子凝集抑制剤の効果が微小で高分子の凝集を効果的に抑制できず、10重量%以上であれば、コーティング液の分散性及び帯電防止性能を低下させる。 The content of the polymer aggregation inhibitor is preferably 0.001 to 10% by weight based on the total coating composition. If the amount is less than 0.001% by weight, the effect of the polymer aggregation inhibitor is minute and the polymer aggregation cannot be effectively suppressed. If the amount is 10% by weight or more, the dispersibility of the coating liquid and the antistatic performance. Reduce.
前記高分子凝集抑制剤は、溶媒に先に溶解させた後に投入することもあり、残りの組成物を何れか混合した後に投入することもある。 The polymer aggregation inhibitor may be added after first being dissolved in a solvent, or may be added after any remaining composition is mixed.
前記成分を順次に混合してコーティング組成物を製造する場合、バインダー及び伝導性高分子水分散液の分散のために水を添加してよい。添加する水の含量は、組成物全体に対して10ないし50重量%であることが望ましい。 When producing the coating composition by mixing the components sequentially, the water may be added to the dispersion Bas Indah and conductive polymer aqueous dispersion. The content of water to be added is preferably 10 to 50% by weight based on the whole composition.
以下、本発明の1実施形態に係る帯電防止コーティング膜の製造方法について説明する。
本発明の1実施形態に係るコーティング膜の製造方法は、本発明の1実施形態に係るコーティング組成物を基板にコーティングする工程と、前記コーティングされた組成物を乾燥させる工程とを含む。
Hereinafter, the manufacturing method of the antistatic coating film which concerns on one Embodiment of this invention is demonstrated.
The manufacturing method of the coating film which concerns on one Embodiment of this invention includes the process of coating the board | substrate with the coating composition which concerns on one Embodiment of this invention, and the process of drying the said coated composition.
本発明の1実施形態に係る帯電防止コーティング膜の製造方法において、コーティング用組成物をコーティングする基板として、ポリエステル、ポリスチレン、ポリイミド、ポリアミド、ポリスルホン酸、ポリカーボネート、ポリアクリル酸、ポリエチレン、またはポリプロピレンなどの有機高分子基材を使用してよい。 In the method for producing an antistatic coating film according to one embodiment of the present invention, as a substrate on which the coating composition is coated, polyester, polystyrene, polyimide, polyamide, polysulfonic acid, polycarbonate, polyacrylic acid, polyethylene, polypropylene, or the like is used. Organic polymer substrates may be used.
望ましいコーティング方法としては、グラビア法、リバースコート法、ロールコート法が挙げられる。 Desirable coating methods include a gravure method, a reverse coating method, and a roll coating method.
本発明の1実施形態に係る帯電防止コーティング膜の製造方法において、コーティング膜の乾燥及び硬化条件は、各コーティング法によって適した条件が選択されるが、通常的に使用する60ないし120℃の温度で5ないし120秒間実施することが望ましく、80ないし120℃の温度で10ないし60秒間実施することがさらに望ましい。 In the method for producing an antistatic coating film according to an embodiment of the present invention, the drying and curing conditions for the coating film are selected according to the respective coating methods, but a temperature of 60 to 120 ° C. that is normally used. For 5 to 120 seconds, more preferably at a temperature of 80 to 120 ° C. for 10 to 60 seconds.
乾燥及び硬化温度が60℃未満である場合には、乾燥が不十分であり、120℃を超えて乾燥及び硬化させても、120℃以下で乾燥及び硬化させる時と比較すれば、コーティング膜の性能面で有利な点がないだけでなく、コストが上昇して高温加熱による作業上の危険性が増大するという問題がある。 When the drying and curing temperature is less than 60 ° C., the drying is insufficient. Even if the drying and curing is performed at a temperature exceeding 120 ° C., compared with the case of drying and curing at 120 ° C. or less, the coating film There is not only an advantage in terms of performance, but also there is a problem that the cost increases and the danger of work due to high temperature heating increases.
乾燥及び硬化時間が5秒未満である場合には、乾燥が不十分であり、120秒を超えて乾燥及び硬化させても、コーティング膜の性能面で有利な点がないだけでなく、コーティング膜を形成するコストが上昇する。 When the drying and curing time is less than 5 seconds, the drying is insufficient. Even if the drying and curing is performed for more than 120 seconds, there is no advantage in the performance of the coating film. The cost of forming will increase.
以下、実施例及び比較例を通じて本発明の1実施形態をさらに具体的に説明するが、本発明は下記実施例によって限定されるものではない。下記の実施例及び比較例で、百分率及び混合比は、別途の言及がなければ、重量を基準とする。 Hereinafter, although one embodiment of the present invention will be described more specifically through examples and comparative examples, the present invention is not limited to the following examples. In the following examples and comparative examples, percentages and mixing ratios are based on weight unless otherwise noted.
(比較例1)
帯電防止用コーティング組成物及びコーティング膜の製造
混合容器に水を20重量部、ジメチルスルホキシド20重量部、エタノールを10重量部、イソプロピルアルコールを15重量部入れて1時間攪拌した。ここに水溶性ポリウレタン樹脂を15重量部投入してさらに1時間攪拌した。PEDOT水分散液を20重量部投入してさらに1時間攪拌してコーティング組成物を製造した。前記PEDOT水分散液としては、スルホン酸ポリスチレンでドーピングされたBayer社製のBaytron
P(PEDOT濃度1.4重量%)を使用した。
(Comparative Example 1)
Production of Antistatic Coating Composition and Coating Film 20 parts by weight of water, 20 parts by weight of dimethyl sulfoxide, 10 parts by weight of ethanol and 15 parts by weight of isopropyl alcohol were placed in a mixing container and stirred for 1 hour. To this was added 15 parts by weight of water-soluble polyurethane resin, and the mixture was further stirred for 1 hour. 20 parts by weight of PEDOT aqueous dispersion was added and stirred for another hour to prepare a coating composition. As the PEDOT aqueous dispersion, Baytron manufactured by Bayer, doped with sulfonic acid polystyrene.
P (PEDOT concentration of 1.4% by weight) was used.
得られたコーティング組成物を利用して、グラビアコート法でポリエチレンテレフタレート樹脂(PET)上にコーティングし、110℃で10秒間乾燥した。 Using the obtained coating composition, it was coated on polyethylene terephthalate resin (PET) by a gravure coating method and dried at 110 ° C. for 10 seconds.
(実施例1ないし7)
帯電防止用コーティング組成物及びコーティング膜の製造
比較例1と同じ組成で帯電防止用コーティング組成物を製造するが、下記表1に表した高分子凝集抑制剤をさらに0.5重量部添加した。高分子凝集抑制剤は、イソプロピルアルコールと混合して添加し、その後にさらに1時間攪拌した。得られたコーティング組成物を利用してグラビアコート法でポリエチレンテレフタレート樹脂(PET)上にコーティングし、110℃で10秒間乾燥した。
(Examples 1 to 7)
Production of Antistatic Coating Composition and Coating Film An antistatic coating composition was produced with the same composition as Comparative Example 1, but 0.5 parts by weight of the polymer aggregation inhibitor shown in Table 1 below was further added. The polymer aggregation inhibitor was added after being mixed with isopropyl alcohol, and then stirred for another hour. The obtained coating composition was coated on a polyethylene terephthalate resin (PET) by a gravure coating method and dried at 110 ° C. for 10 seconds.
(比較例2)
帯電防止用コーティング組成物及びコーティング膜の製造
実施例2と同じ方法で帯電防止用コーティング組成物を製造するが、高分子凝集抑制剤として2−ブチルアミンを20重量部添加した。
(Comparative Example 2)
Production of antistatic coating composition and coating film An antistatic coating composition was produced in the same manner as in Example 2, except that 20 parts by weight of 2-butylamine was added as a polymer aggregation inhibitor.
物性評価
(1)凝集程度
コーティング過程でドクターブレードに生じる伝導性高分子の凝集程度を肉眼で観察して下記のように評価した。
○: 凝集がたくさん生じる。
△: 凝集が少し生じる。
×: 凝集が生じない。
(2)表面抵抗
コーティング膜の表面抵抗は、SIMCO社製の表面抵抗測定器であるST−3を使用して測定した。表面抵抗値が小さいほど、帯電防止効果に優れることを表す。
Physical Property Evaluation (1) Degree of Aggregation The degree of aggregation of the conductive polymer generated on the doctor blade during the coating process was observed with the naked eye and evaluated as follows.
○: A lot of aggregation occurs.
Δ: Some aggregation occurs.
X: Aggregation does not occur.
(2) Surface resistance The surface resistance of the coating film was measured using ST-3 which is a surface resistance measuring instrument manufactured by SIMCO. It represents that it is excellent in the antistatic effect, so that a surface resistance value is small.
前記表2の実施例1ないし7のように高分子凝集抑制剤を添加した場合、コーティング性に優れ、比較例に比べて表面抵抗があまり増加せず、またコーティング過程で高分子の凝集現象が発生しなかった。実施例2ないし5のように、高分子凝集抑制剤としてトリエタノールアミン、2−ブチルアミン、キノリン、ベンゾトリアゾール、及びポリビニルピロリドンを使用した場合、凝集防止効果は特に顕著であった。 When the polymer aggregation inhibitor is added as in Examples 1 to 7 in Table 2, the coating property is excellent, the surface resistance does not increase much compared to the comparative example, and the polymer aggregation phenomenon occurs in the coating process. Did not occur. As in Examples 2 to 5, when triethanolamine, 2-butylamine, quinoline, benzotriazole, and polyvinylpyrrolidone were used as the polymer aggregation inhibitor, the aggregation prevention effect was particularly remarkable.
比較例2のように、添加剤の含量が多くなれば、表面抵抗が増加して帯電防止性能が低下し、コーティング液の分散性が低下する。 As in Comparative Example 2, when the content of the additive is increased, the surface resistance is increased, the antistatic performance is lowered, and the dispersibility of the coating liquid is lowered.
以上、望ましい実施例及び比較例を通じて本発明の1実施形態を説明したが、当業者ならば、これから多様な変形及び均等な他の実施例が可能であることが分かる。したがって、本発明の真の技術的保護範囲は、特許請求の範囲の技術的思想によって決定されねばならない。 Although one embodiment of the present invention has been described above through preferred examples and comparative examples, those skilled in the art will recognize that various modifications and other equivalent examples are possible. Therefore, the true technical protection scope of the present invention must be determined by the technical idea of the claims.
本発明は、半導体及びディスプレイ産業の色々な部分に適用可能である。 The present invention is applicable to various parts of the semiconductor and display industries.
Claims (6)
伝導性高分子水分散液1ないし30重量%と、
水溶性ポリウレタン、水溶性ポリアクリレート、水溶性ポリビニルアルコール、水溶性ポリビニルアセタル、及びこれらの混合物からなる群から選択される1種以上であるバインダー樹脂5ないし25重量%と、
アルコール溶媒5ないし40重量%と、
ジメチルスルホキシド、プロピレングリコールメチルエーテル、N−メチルピロリドン、エチル−3−エトキシプロピオネート、プロピレングリコールモノメチルエーテルアセテート、ブチルカルビトール及びこれらの混合物からなる群から選択される機能性有機溶媒5ないし30重量%と、
水10ないし50重量%と、
エチレンジアミン、ジメチルエチレンジアミン、2−ブチルアミン、トリエタノールアミン、ベンゾトリアゾール、ベンゾチアゾール、ピリジン、トリルトリアゾール、キノリン、イミダゾール、ベンズイミダゾール、5−メチル−1H−ベンゾトリアゾール、ポリビニルピロリドン、及びN−フェニルチオウレアからなる群から選択される1種以上の高分子凝集抑制剤0.001ないし10重量%と、
を含み、
前記伝導性高分子水分散液は、ポリチオフェン系、ポリピロール系、ポリアニリン系高分子化合物またはこれらの混合物を、前記伝導性高分子水分散液の総重量を基準に0.1ないし10重量%含有する帯電防止用コーティング組成物。 In the antistatic coating composition, the composition comprises:
1 to 30% by weight of a conductive polymer aqueous dispersion,
5 to 25% by weight of a binder resin that is one or more selected from the group consisting of water-soluble polyurethane, water-soluble polyacrylate, water-soluble polyvinyl alcohol, water-soluble polyvinyl acetal, and mixtures thereof ;
5 to 40% by weight alcohol solvent,
5 to 30 weights of functional organic solvent selected from the group consisting of dimethyl sulfoxide, propylene glycol methyl ether, N-methylpyrrolidone, ethyl-3-ethoxypropionate, propylene glycol monomethyl ether acetate, butyl carbitol and mixtures thereof %When,
10 to 50% by weight of water,
Consists of ethylenediamine, dimethylethylenediamine, 2-butylamine, triethanolamine, benzotriazole, benzothiazole, pyridine, tolyltriazole, quinoline, imidazole, benzimidazole, 5-methyl-1H-benzotriazole, polyvinylpyrrolidone, and N-phenylthiourea From 0.001 to 10% by weight of one or more polymer aggregation inhibitors selected from the group;
Including
The conductive polymer aqueous dispersion contains a polythiophene-based, polypyrrole-based, polyaniline-based polymer compound or a mixture thereof in an amount of 0.1 to 10% by weight based on the total weight of the conductive polymer aqueous dispersion. Antistatic coating composition.
前記コーティングされた組成物を乾燥する工程と、Drying the coated composition;
を含むことを特徴とする帯電防止コーティング膜の製造方法。A method for producing an antistatic coating film, comprising:
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