JP4869729B2 - High viscosity fluid application system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a system capable of applying a precise quantity of a high viscous fluid without causing problems such as the increase of moving mass. <P>SOLUTION: A dispense unit housing apparatus 252 is held by a feeder holding apparatus to house a dispense unit 250. An air feed passage is provided in a housing apparatus main body 400 and temperature controlled air is fed to a gap 312 between a syringe 260 and a cover 264 to control the temperature of the adhesive 268. The leakage of the adhesive 268 is prevented by applying positive pressure to a discharge port 336 of a discharge nozzle 262 from a pressure applying passage 520. The remaining quantity of the adhesive 268 is determined by detecting an aluminum layer 282 of a float 278 by a high frequency oscillating type proximity switch 502. Because the temperature control and the remaining quantity detection of the adhesive 268 are carried out when the dispense unit 250 is housed in the housing apparatus 252, the moving mass is reduced compared to that in a transporting apparatus and the coating is rapidly and precisely performed. <P>COPYRIGHT: (C)2007,JPO&amp;INPIT

Description

  The present invention relates to a system for applying a high-viscosity fluid such as an adhesive, cream-like solder, and flux, and in particular, a system for discharging a high-viscosity fluid contained in a syringe from a discharge nozzle and applying it to an application object. It is about.

This type of high-viscosity fluid application system is already known, for example, as described in Patent Document 1 below. The adhesive application system described in Patent Document 1 includes a dispensing unit including a syringe in which an adhesive is accommodated in an internal space and a discharge nozzle communicated with the internal space of the syringe, and a movement for moving the dispensing unit in a horizontal direction. The dispensing unit is moved to a predetermined position on the substrate positioned on the guide rail and moved up and down, and the adhesive is discharged from the discharge nozzle by applying the gas pressure into the syringe, and the substrate To be applied. The adhesive application system is also provided with a temperature controller so as to keep the temperature of the adhesive in the discharge nozzle at a predetermined height. The temperature controller is provided in the moving device, and an annular circulation path is provided around the discharge nozzle, and water adjusted to a temperature within a predetermined range by the temperature controller is supplied along the circulation path. After circulating around the discharge nozzle, it is returned to the temperature controller. Therefore, the adhesive pushed out of the syringe is brought to a predetermined temperature by heat transfer from the water flowing in the circulation path while flowing down the discharge nozzle, and an appropriate viscosity is obtained, and a predetermined amount is accurately applied to the substrate. The
JP-A-10-244196

However, in the coating system described in Patent Document 1, since the temperature controller and the circulation path are provided in the moving device and moved together with the dispensing unit, the moving mass is large, the moving speed is kept low, and the time for coating is long. Take it. If the moving speed is not suppressed, the vibration at the start and stop of movement is large, the stop position accuracy of the dispensing unit is lowered, and the coating accuracy is lowered. In addition, it is necessary to provide wiring for supplying current to the temperature controller so as to move following the movement of the temperature controller, and the design of the system is troublesome.
The present invention has been made against the background of the above circumstances, and an object thereof is to provide a system capable of applying an accurate amount of a highly viscous fluid without causing problems such as an increase in moving mass.

The above-mentioned problem is that a high-viscosity fluid application system includes: (a) a dispensing unit including a syringe that contains the high-viscosity fluid and a discharge nozzle that communicates with the internal space of the syringe; and (b) the dispensing unit is detachably held. A unit holding head, (c) a moving device that moves the unit holding head to an arbitrary position in at least one plane, and (d) a discharge device that discharges the highly viscous fluid in the syringe from the discharge nozzle, (e) a storage device for storing the dispense unit removed from the unit holding head; and (f) a temperature control head, and the temperature control head adjusts the temperature of the highly viscous fluid in the dispense unit to a set temperature. A temperature control device, wherein at least the temperature control head of the temperature control device is provided in the storage device, and the dispense head itself Preliminary said unit holding head not provided in, and the mobile device comprises a lifting device for moving the unit holder in the vertical direction, the upper portion of the housing portion for housing the dispensing unit of the storage device, the upper The dispensing unit housed in the housing portion is formed so that the unit holding head is lifted by the lifting device in a direction parallel to the one plane by the moving device. The problem is solved by allowing the movement to be separated from the storage portion through an opening continuously opened upward and laterally by both movement .
The temperature control device may be a device that adjusts the temperature of the highly viscous fluid in the syringe, or may be a device that adjusts the temperature of the highly viscous fluid in the syringe and the discharge nozzle.
The temperature control device may be provided with all the components including the temperature control head in the storage device, and at least a part of the components other than the temperature control head is separate from the storage device and is moved by the moving device. You may provide in the state which is not made to be made.

In the high-viscosity fluid application system according to the present invention, the dispensing unit is held by a unit holding head that is moved by a moving device during application of the high-viscosity fluid, and is stored in the storage device and provided in the storage device at times other than application. The temperature of the highly viscous fluid is adjusted to the set temperature by the temperature control head. Therefore, it is not necessary to provide a temperature control device in the moving device, the moving mass is small, the dispensing unit can be moved at a high speed while suppressing vibration, and the high-viscosity fluid can be applied quickly and accurately. In addition, since the temperature control device does not move with the dispense head, it is not necessary to movably provide wiring for supplying current and piping for supplying temperature control fluid, which makes system design easy. The effect becomes. While the dispensing unit is held by the moving device and applying high-viscosity fluid, the temperature of the high-viscosity fluid in the syringe is not adjusted by the temperature adjustment device. The temperature is returned to the set temperature while being stored in the apparatus.
In addition, the upper part of the storage unit that stores the dispense unit of the storage unit has an opening that opens continuously upward and laterally, so the dispense unit stored in the storage unit is held by the lifting device. Both the head lift and the movement of the moving device in a direction parallel to a plane can be separated from the storage section through the opening continuously opened upward and laterally, and the lifting device can be It can be small.

Aspects of the Invention

The following invention which is considered claimable (hereinafter referred to as "claimable invention". Claimable invention, Ru invention der that the claimed "the prior invention" and subordinate concepts invention, may also include an invention of the preamble or another concept of the present invention.) aspects illustrate some of them will be described. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiments, etc., and as long as the interpretation is followed, another aspect is added to the form of each section. In addition, an aspect in which constituent elements are deleted from the aspect of each item can be an aspect of the claimable invention.

Note that some of the following items are no longer the invention described in the claims by the amendment or the invention of the subordinate concept thereof, but are useful for understanding the invention described in the claims. This information is included, so it will be left as it is.

(1) a dispensing unit including a syringe containing a highly viscous fluid and a discharge nozzle communicating with the internal space of the syringe;
A movement device that detachably holds the dispensing unit and moves it to an arbitrary position in one plane;
A discharge device for discharging the highly viscous fluid in the syringe from the discharge nozzle;
A high-viscosity fluid application system, comprising: a storage device that stores the dispensing unit removed from the moving device.
Various effects can be obtained if the dispensing unit is detachably held on the moving device and the dispensing unit removed from the moving device is housed in the housing device. For example, the storage device can adjust the temperature of the high-viscosity fluid in the dispensing unit and detect the remaining amount of the high-viscosity fluid in the syringe, and can reduce the moving mass of the moving device while performing them. The effect is obtained. Also, a plurality of dispensing units can be provided and used in replacement, or can be used in replacement with another work unit. Furthermore, replenishment of the highly viscous fluid to the syringe can be performed with the dispensing unit removed from the moving device and supported by the storage device, and replenishment work can be performed stably.
(2) A temperature control device that adjusts the temperature of the highly viscous fluid in the dispense unit being stored in the storage device to a set temperature, and at least a temperature control head of the temperature control device is provided in the storage device. The highly viscous fluid application system according to item (1).
(3) The dispensing unit includes a cover that surrounds the outer periphery of the syringe leaving a gap between the outer periphery of the syringe and the temperature control device supplies the temperature adjustment fluid to the gap. The high-viscosity fluid application system according to item (2), including a supply device.
The temperature adjustment fluid may be, for example, a gas or a liquid. If the temperature is adjusted by the fluid, for example, regardless of the shape of the syringe, the temperature can be adjusted by supplying the fluid around the syringe, and the temperature can be adjusted reliably and inexpensively.
In particular, according to the configuration of this section, the temperature of the highly viscous fluid in the syringe is adjusted by the temperature adjusting fluid supplied to the gap between the outer peripheral surface of the syringe and the cover. For this reason, the temperature of the highly viscous fluid in the syringe is efficiently adjusted by the temperature adjustment fluid having a relatively small flow rate. In addition, even when the dispensing unit is removed from the storage device, the syringe is surrounded by a cover, and the temperature change of the highly viscous fluid in the syringe is less than that when directly exposed to the temperature of the application environment. Application is performed well. Furthermore, the syringe is protected by the cover, and it is well avoided that the syringe is damaged and the highly viscous fluid leaks.
The coating system described in this section allows the storage device to be taken out of the syringe as in the coating system described in section (13), for example, by moving the first half in the vertical direction and in the second half by moving in the horizontal direction. It is suitable for the case where it includes a storage portion having a shape. In this case, for example, an opening that is always open to the outside is provided in the storage unit, and the syringe is moved in the lateral direction so as to come out of the storage unit, but a part of the storage unit is opened. Therefore, it becomes impossible to efficiently supply the temperature adjusting fluid between the storage portion and the syringe. If the syringe is surrounded by the cover, the temperature adjusting fluid can be supplied between the syringe and the cover, so that an opening is provided in the storage portion, and the dispensing unit can be taken out from the storage device by moving in the vertical direction and moving in the horizontal direction. .
(4) The storage device includes a container for storing at least the lower part of the dispensing unit with a gap between the lower peripheral surface and the outer peripheral surface of the lower part, and the temperature control device supplies the temperature adjusting fluid to the gap. The high-viscosity fluid application system according to item (2), including a temperature control fluid supply device for supplying.
If the temperature adjusting fluid is supplied to at least the lower part of the dispensing unit and the temperature of the high-viscosity fluid is adjusted, the temperature of the high-viscosity fluid in at least the portion near the discharge nozzle is adjusted and the object is achieved.
In the coating system described in this section, the syringe is not surrounded by the cover, and the configuration of the dispensing unit is simplified.
(5) The high-viscosity fluid according to any one of (1) to (4), including a control device that includes a plurality of the dispensing units and includes a replacement control unit that alternately holds the plurality of dispensing units in the moving device. Application system.
If multiple dispensing units are included, providing the same number of storage devices as the dispensing units, for example, can provide a state in which the moving device does not hold the dispensing unit, and mounting the dispensing unit directly between the moving device and the storing device , Can be removed. Further, when a temperature control device is provided in the storage device, the temperature of the highly viscous fluid can be adjusted simultaneously for a plurality of dispense units.
The storage device can be smaller than the dispensing unit. For example, if the mobile device always holds at least one dispensing unit, the number of storage devices can be reduced accordingly. In this case, for example, an exchange assist device is provided to assist the exchange of the dispense unit between the moving device and the storage device. For example, the exchange assisting device includes two unit holding units, and one of the unit holding units delivers the dispensing unit to and from the moving device, and the other delivers the dispensing unit to the storage device. It is assumed that the position and the position where one dispenses the dispensing unit to and from the storage device, and the other position delivers the dispensing unit to the moving device. Alternatively, the replacement auxiliary device may be a dispensing unit holding base provided between the moving device and the storage device. The exchange assisting device may be used as a storage device, and in that case, a state in which the moving device does not hold the dispensing unit can be obtained.
When the moving device also holds the mounting unit, and the high-viscosity fluid application system functions as an electronic circuit component mounting system that mounts the electronic circuit component on the circuit board, and the composite device is configured, the moving device is a unit holding unit. If the mounting unit and the dispensing unit are held at the same time and the unit holding unit can hold either the mounting unit or the dispensing unit, the unit holding unit can be used as a replacement auxiliary device, and the storage device Less than the dispensing unit. If the unit holding unit that holds the mounting unit is dedicated to the mounting unit, a replacement assisting device is provided when the number of storage devices is smaller than the dispensing unit.
When a plurality of dispensing units are included and are alternately held by the moving device, the usability of the highly viscous fluid application system is improved.
For example, different types of dispensing units are different from each other, for example, the discharge nozzles have different cross-sectional areas, or the number of discharge nozzles is different from each other, or a highly viscous fluid accommodated in a syringe If the types of are different, if the application diameter of the high-viscosity fluid applied to the object to be applied is different to multiple types, if the number of high-viscosity fluid applied simultaneously by one application operation is different, This can cope with a case where a plurality of types of highly viscous fluids are applied to one application object. If the types of multiple dispensing units are the same, for example, when the remaining amount of high-viscosity fluid is reduced, the dispensing unit is replaced to perform application so that the application of high-viscosity fluid is not interrupted. It is sufficient to suppress a decrease in coating efficiency.
Further, in the aspect in which this item is dependent on the item (2), while one of the plurality of dispensing units is held by the moving device and coating is performed, the temperature of the highly viscous fluid is adjusted for the other dispensing units. For each dispense unit, the ratio of the time during which the temperature is not adjusted to the time during which the temperature is adjusted can be reduced, and the temperature of the highly viscous fluid in the dispense unit can be easily maintained. For example, when multiple dispense units of the same type are used, the dispense unit is replaced when the temperature of the highly viscous fluid of the dispense unit held by the moving device decreases, and the temperature of the highly viscous fluid is stored in the storage device and the temperature is set. The high viscosity fluid can be applied by the dispensing unit adjusted to the above, and the high temperature fluid having an appropriate temperature can be continuously applied.
(6) The highly viscous fluid coating system according to item (5), including a plurality of the storage devices.
For example, if the same number of storage devices as the dispensing units are included, for example, all the dispensing units can be stored in the storage device when the system is stopped. Further, it is possible to obtain a state where the moving device does not hold the dispensing unit.
(7) A feeder holding device including a plurality of feeder holding portions each holding a plurality of electronic circuit components and holding a plurality of feeders that are sequentially supplied one by one, wherein the storage device is held by the feeder holding device. The highly viscous fluid coating system according to any one of (1) to (6).
The high-viscosity fluid application system described in this section is provided with a work system in which an electronic circuit component is supplied by a feeder and performs an operation such as mounting of the electronic circuit component on a circuit board as an application target, and constitutes a composite system. To do. The work system in the complex system is a system that performs work related to the application of the high-viscosity fluid to the material to be applied, and can perform two types of work by one system, and is convenient and highly viscous fluid. The system installation space can be reduced as compared with the case where the coating system and the work system are provided separately. Further, by sharing a part of the constituent elements in the high viscosity fluid application system and the work system, the apparatus cost can be reduced.
If the storage device is held by the feeder holding device, the system can be made more compact than when the storage device is provided separately from the feeder holding device. Also, the feeder holding device is often provided outside the system, and the operator can easily approach the dispensing unit stored in the storage device, and easily perform operations such as replenishment of high-viscosity fluid and replacement of the dispensing unit. Can do.
(8) The highly viscous fluid coating system according to (7), wherein the storage device is held by at least one of the plurality of feeder holding portions.
If the storage device is held in all of the feeder holding parts, the high-viscosity fluid application system can be operated as a coating-only system, and if the storage device is held in part and the feeder is held in another part, The viscous fluid application system is operated as a complex system that performs operations such as application and component mounting.
(9) Item (7) or (7), wherein the moving device includes a unit holding unit that selectively holds the mounting unit that takes out the electronic circuit component from the plurality of feeders and mounts the electronic circuit component on the circuit board, and the dispensing unit. 8. A highly viscous fluid application system according to item 8).
The high-viscosity fluid application system functions as an electronic circuit component mounting system in a state where the moving device holds the mounting unit, and functions as a high-viscosity fluid application system in a state where the dispensing unit is held.
The moving device may be provided with a plurality of unit holding units and move while holding the dispensing unit and the mounting unit at the same time, but the unit holding unit selectively holds the dispensing unit and the mounting unit. Thus, the moving mass of the moving device can be small, the moving speed is increased while suppressing the occurrence of vibration, the stopping position accuracy is improved for each of the application of the high-viscosity fluid and the mounting of the electronic circuit component, and the application accuracy and The work efficiency can be improved while improving the mounting accuracy. In particular, in a mode in which this item is subordinate to item (2), the temperature adjustment head is provided in the storage device, so that the temperature of the highly viscous fluid is adjusted, the application is performed with high accuracy, and a simple system is obtained. It is done.
When application of a highly viscous fluid to a circuit board is performed for mounting an electronic circuit component, the electronic circuit component is temporarily fixed to the circuit board, for example, by applying an adhesive to the circuit board, and applied to the circuit board. The electronic circuit components are prevented from shifting when the cream solder is melted, or the adhesive is cured by heating when the cream solder is melted, and the fixing of the electronic circuit components to the circuit board is reinforced or the circuit When medium and large electronic circuit components are mounted on both the front and back sides of the substrate, the electronic circuit components are bonded to one surface by melting cream-like solder, and the electronic circuit components are mounted on the other surface. The lower electronic circuit component falls when the cream solder is melted with respect to the electronic circuit component mounted on the other surface. Is adhesive applied to prevent Rukoto, the electronic circuit components are fixed is cured upon melting of the creamy solder. As described above, the adhesive is applied to the circuit board for various reasons. In any case, if the mounting unit and the dispensing unit are selectively held by the moving device, high-viscosity fluid is applied. Compared with the case where the system is provided alone, the system installation space can be reduced, the apparatus cost can be reduced, the operating rate can be improved, and the total cost of electronic circuit production can be reduced. For example, the adhesive may not be applied depending on the type of circuit board, such as electronic circuit parts are mounted only on the surface of the circuit board, or all mounted electronic circuit parts are small parts. When the viscous fluid application system is provided as a single system and an electronic circuit assembly line is configured together with the electronic circuit component mounting system, the high-viscosity fluid application system does not work when an electronic circuit is assembled for a certain type of circuit board. As a result, the operating rate becomes worse. On the other hand, if the high-viscosity fluid application system also functions as an electronic circuit component mounting system, the operation rate is improved by operating as an electronic circuit component mounting system even if application of a high-viscosity fluid is unnecessary, Electronic circuit production costs can be reduced.
(10) The apparatus according to any one of (1) to (9), further comprising a remaining amount detection device that detects a remaining amount of the highly viscous fluid in the syringe, wherein at least a detection head of the remaining amount detection device is provided in the storage device. The highly viscous fluid application system according to any one of the above.
If the remaining amount of high-viscosity fluid is detected, for example, the discharge pressure by the discharge device can be controlled according to the remaining amount, or replenishment can be performed before the high-viscosity fluid is completely exhausted. improves.
For example, JP-A-4-247262 discloses an adhesive in which a float is floated on an adhesive accommodated in a syringe and a ring is attached, and a plurality of sensors for detecting the position of the ring are provided outside the syringe. An application system is described. The plurality of sensors are provided at intervals in the vertical direction, the ring is lowered due to a decrease in the adhesive, and the remaining amount of adhesive is calculated and the remaining amount is calculated depending on which sensor detects the ring. The smaller the amount, the higher the extrusion pressure of the adhesive from the syringe, and the discharge rate is kept almost constant regardless of the remaining amount. Since the moving mass is large, there arises a problem that the coating accuracy is lowered due to the vibration generation at the start and stop of the movement or the coating efficiency is lowered due to the suppression of the moving speed. On the other hand, in the highly viscous fluid application system described in this section, the detection head is provided in the storage device, and the dispensing head is high when the dispense unit is stored in the storage device, during storage, or when taken out from the storage device. Since the remaining amount of the viscous fluid is acquired, the moving mass is small, and application can be performed with high accuracy and speed. Further, since the detection head is provided with a fixed position, it is easy to route a signal line for sending the output signal, and it is not necessary to provide a detection head in the dispense unit, thereby reducing the cost of the dispense unit. be able to.
(11) The moving device includes a unit holding unit that detachably holds the dispensing unit, and an elevating device that moves the unit holding unit in the vertical direction, and at least the dispensing unit is moved up and down with respect to the storage device. The high-viscosity fluid application system according to any one of items (1) to (10), which is stored and taken out by movement including movement in a direction.
(12) A level detecting device that detects a remaining amount of the highly viscous fluid in the syringe, the remaining amount detecting device being provided in the dispensing unit and indicating a level of the highly viscous fluid in the syringe A detection head provided with an indicator, a detection device provided in the storage device for detecting the level indicator, a vertical position acquisition unit provided in the elevating device for acquiring a vertical position of the unit holding unit, (11) including a remaining amount acquisition unit that acquires a remaining amount of the highly viscous fluid in the syringe based on the vertical position acquired by the vertical position acquisition unit when the level indicator is detected by a detection device. The highly viscous fluid application system described.
The remaining amount can be acquired when the dispensing unit is taken out from the storage device or stored in the storage device, and the remaining amount of the high-viscosity fluid can be acquired using the movement of at least one of the extraction and storage. it can.
(13) The storage device includes a storage portion having a shape that allows the syringe to be taken out by movement in the vertical direction in the first half and movement in the second half in the horizontal direction, and the level indicator is a highly viscous fluid in the syringe. Including an indicator part having an upper part to be detected and a lower part to be detected, and the remaining amount acquisition part of the lower detected part by the detection device while the remaining amount is large. The high-viscosity fluid application system according to item (12), wherein the remaining amount is detected based on the detection of the upper detected part by the detection device after the remaining amount is reduced based on the detection.
It is desirable, but not essential, that the upper detected portion and the lower detected portion are constituted by an upper edge or a lower edge of an annular detected portion extending in the horizontal direction. For example, a wide band-like detected part is provided on the upper part of the float, and the upper and lower edges of the detected part are used as an upper detected part and a lower detected part, respectively. In addition, two line-like detected parts are provided in each case, and either one of the upper edge and the lower edge of each of the two detected parts is used as an upper detected part and a lower detected part, respectively.
An opening that is continuously open upward and laterally is provided at the top of the storage unit, and the syringe is initially moved upward and then moved laterally, so that the dispensing unit can be moved through the opening to the outside of the storage unit. If the dispensing unit is taken out, it is not necessary to raise the dispensing unit until the whole unit is pulled out above the storage part, the lifting stroke of the dispensing unit can be shortened, and the device can be downsized. The time required for removal and storage can be reduced. Further, for example, even when the lifting stroke is limited due to the system configuration, the dispensing unit can be stored in the storage device and taken out. Then, the remaining amount of the highly viscous fluid can be detected by using at least one of the storage and removal movements.
(14) A leakage prevention device that prevents leakage of the highly viscous fluid from the discharge nozzle in a state where the dispensing unit is accommodated in the accommodation device, and at least a leakage prevention head of the leakage prevention device is provided in the accommodation device. The highly viscous fluid coating system according to any one of (1) to (13).
If the dispensing unit is stored in the storage device in the same posture as when the high-viscosity fluid is applied, the next time the high-viscosity fluid is applied, it is held by the moving device and applied immediately without changing the posture. However, the discharge nozzle is stored in a downward orientation, and even if the viscosity of the highly viscous fluid is high, the longer the storage time, the higher the risk of leakage from the discharge nozzle due to its own weight. For this reason, it is desirable to avoid, for example, generation of waste of high-viscosity fluid and contamination of the storage device by preventing leakage of the high-viscosity fluid by the leak prevention device.
(15) The leakage prevention device includes a pressure application device that applies a leakage prevention pressure set higher than atmospheric pressure to the discharge port of the discharge nozzle, and the leakage prevention head includes a pressure application head. The highly viscous fluid application system described.
Leakage of the highly viscous fluid can be prevented by closing the discharge port of the discharge nozzle with, for example, a shutter provided in the storage device or the dispensing unit. In addition, it is necessary to provide a shutter moving device, and the structure of the leakage prevention device becomes complicated. Moreover, it is difficult to process the highly viscous fluid adhering to the shutter. On the other hand, if leakage is prevented by applying leakage prevention pressure, leakage of high-viscosity fluid can be easily prevented, regardless of the shape and size of the discharge nozzle, and there is a problem with the treatment of adhering high-viscosity fluid. Does not occur.
If at least the leakage prevention head of the leakage prevention device is provided in the storage device and the leakage prevention device is not moved by the movement device, the moving mass of the movement device can be small.
(16) The pressure application head includes a connection portion connected to a portion including at least the discharge nozzle of the dispense unit as the dispense unit is stored in the storage device, and the pressure application device includes the connection The high-viscosity fluid application system according to item (15), further including a gas supply device that supplies gas adjusted to the leakage prevention pressure to the unit.
In order to avoid adhesion of a highly viscous fluid, it is desirable that the connecting portion does not contact at least the tip of the discharge nozzle.
(17) The pressure application device has a remaining amount detection device for detecting the remaining amount of the high-viscosity fluid in the syringe, and the remaining amount of the high-viscosity fluid in which the leakage prevention pressure is detected by the remaining amount detection device is large. A high-viscosity fluid application system according to item (15) or (16), which includes a pressure control device that controls the pressure to be higher than when there are few cases.
The higher the remaining amount of the highly viscous fluid, the higher the extrusion pressure from the discharge nozzle and the more likely it is to leak.However, if the leakage prevention pressure is increased accordingly, the leakage prevention pressure becomes excessive when the remaining amount is small. When the viscous fluid is retracted into the discharge nozzle and the application is performed next time, the discharge amount may be insufficient. On the other hand, if the pressure control of the leakage prevention pressure is performed according to the remaining amount of the high-viscosity fluid, the leakage is satisfactorily prevented without causing excessive drawing of the high-viscosity fluid regardless of the remaining amount. Can do.
(18) The moving device includes a unit holding portion that detachably holds the dispensing unit, and an elevating device that moves the unit holding portion in the vertical direction, and the high-viscosity fluid application system is based on the discharge device. By controlling the end point of the discharge of the high-viscosity fluid from the discharge nozzle and the point of time when the dispenser unit is lowered from the lowering by the lifting / lowering device without rising, the high-viscosity fluid in the discharge nozzle is controlled. The high-viscosity fluid application system according to any one of (1) to (17), including a control device including a stringing prevention unit that cuts stringing.
When the dispense unit is lowered for a set time and then raised and separated from the application target, the high viscosity fluid adhering to the application target is poorly cut from the discharge nozzle, Whereas stringing occurs, in the coating system described in this section, the dispensing unit is raised at the same time as the discharge of the high-viscosity fluid from the discharge nozzle is completed. The cut is good, does not continue to adhere to the discharge port, the occurrence of stringing is well prevented, and a set amount of highly viscous fluid is applied with high accuracy.
The invention according to this section is effective even when implemented in a form excluding the two structural requirements that the moving device holds the dispensing unit in a detachable manner and that the storage device is included.

  Hereinafter, embodiments of the claimable invention will be described in detail with reference to the drawings. In addition to the following examples, the claimable invention can be practiced in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section. .

  This adhesive application system, which is a kind of high-viscosity fluid application system, is provided with an electronic circuit component mounting system, and constitutes an electronic circuit assembly system that is a composite system having an adhesive application function and an electronic circuit component mounting function. Yes. This electronic circuit assembly system is an electronic circuit component mounting system as shown in FIG. 1, as shown in FIG. 1. A device 16, a mounting device 18 and a mounting unit storage device 20 are included.

  The substrate transfer device 10 is provided on a bed 30 as a system main body, and includes, for example, a belt conveyor, and transfers a circuit board 32 as a high-viscosity fluid application target and a component mounting target in one horizontal direction. It is carried into the holding device 16 and carried out from the substrate holding device 16. The board conveying direction is the X-axis direction, and the direction perpendicular to the X-axis direction is a Y-axis direction in a horizontal plane that is a plane parallel to the high-viscosity fluid application surface or component mounting surface of the circuit board 32. The substrate holding device 16 is provided with a fixed position, and although not shown, for example, a substrate support device that supports the circuit board 32 from below, and both edge portions of the circuit board 32 that are parallel to the substrate conveyance direction are clamped. The circuit board 32 carried in by the board conveyance device 10 is held horizontally.

  In the electronic circuit component mounting system, as shown in FIG. 1, the feeder-type component supply device 12 and the tray-type component supply device 14 are provided on both sides of the bed 30 separated from the substrate transfer device 10 in the Y-axis direction. Each is provided. The feeder-type component supply device 12 includes a plurality of feeders 40 that are a kind of component supply tool, and a feeder holding device 42 as a component supply tool holding device. The feeder 40 is, for example, a tape feeder that supplies a plurality of electronic circuit components in a state of being held on a component holding tape, and the component holding tape is fed by a predetermined pitch by a tape feeder, so that a large number of electronic circuit components are supplied. One by one, the parts are sequentially positioned and supplied.

  As shown in part in FIG. 3, the feeder holding device 42 includes a feeder holding base 44 as a feeder holding member. A plurality of slots 46 are provided at equal intervals in the feeder holding base 44. Each of the slots 46 has an inverted T-shaped cross section, and is provided in an opening on the support surface 48 that is the upper surface of the feeder holding base 44. The feeder 40 has a plurality of different widths depending on the dimensions of components to be supplied, and the slots 46 are formed at intervals at which the narrowest feeder 40 is attached with a gap as small as possible. Although not shown in the drawing, the feeder holding base 44 holds the feeder 40 with a positioning portion for positioning the feeder 40 in the width direction, the left-right direction, and the front-rear direction, the floating prevention portion for preventing the feeder 40 from lifting up, and the feeder 40. A plurality of engaging portions for engaging with the base 44 are provided, and each of the plurality of slots 46 is provided.

  As shown by a two-dot chain line in FIG. 3, the feeder 40 includes a rail 50 having an inverted T-shaped cross section, and is fitted into a slot 46 in the rail 50 and placed on a support surface 48. Supported from below. In this state, the feeder 40 is positioned by the positioning portion and the like provided on the feeder holding base 44 to prevent the feeder 40 from being lifted, and an engaging device (not shown) provided on the feeder 40 is connected to the feeder holding base 44. The parts are engaged with each other, are detachably attached to the feeder holding base 44, and are held in a state in which the component supply parts are arranged along the X-axis direction. The wide feeder 40 is held on the feeder holding base 44 using a space for a plurality of slots. The slot 46, the positioning portion, the lifting prevention portion, the engaging portion, and the like constitute a feeder holding portion. A plurality of feeder holding units are provided, and a plurality of feeders 40 are respectively held by the feeder holding units. The feeder holding portion and the engaging device are configured in the same manner as the feeder holding portion and the engaging device described in the specification of Japanese Patent Application No. 2004-272640, which is not disclosed yet, for example. Such illustration and description are omitted.

  As shown in FIG. 2, the feeder-type component supply device 12 is mounted on a carriage 60 and moved. The feeder holding device 42 is mounted on a carriage 60 while holding a plurality of feeders 40, and is attached to a mounting base 62 that is provided on the bed 30 and constitutes a mounting portion. As the carriage 60 approaches the mounting base 62, a pair of legs 64 provided on the feeder holding base 44 as shown in FIG. 3 (only one leg 64 is shown in FIG. 3). The guide roller 66 is fitted into a guide groove 68 provided in the mounting base 62 and guided by the guide roller 66 and another guide roller 70, and the engaging roller 72 is engaged with the mounting base 62. The feeder holding base 44 is attached to the attachment base 62. During operation of the electronic circuit component mounting system, the carriage 60 is removed from the feeder-type component supply device 12 as shown in FIG. 2 (a), and when the feeder-type component supply device 12 is removed from the mounting base 62, 2 (b), the feeder holding device 42 is engaged. As shown in FIG. 2 (c), the feeder-type component supply device 12 is detached from the mounting base 62 and conveyed. The structure in which the carriage 60, the mounting base 62, the feeder-type component supply device 12 are detachably held on the carriage 60, and the structure in which the feeder holding base 44 is attached to the mounting base 62 are described in Japanese Patent Application Laid-Open No. 2004-172500. Since the configuration is the same, detailed illustration and description are omitted.

  The tray-type component supply device 14 is a device for storing and supplying electronic circuit components to a tray having a large number of receiving recesses, and although detailed illustration and description thereof are omitted, as with the feeder-type component supply device 12, a tray is used. It can be moved.

  As shown in FIG. 1, the mounting device 18 includes a mounting unit 80 and a unit moving device 82. The unit moving device 82 includes an X-axis direction moving device 84 and a Y-axis direction moving device 86. The X-axis direction moving device 84 includes an X-axis slide 90 and an X-axis slide moving device 92 (see FIG. 9) as movable members. The X-axis slide moving device 92 includes an X-axis moving motor 94 (see FIG. 9) as a driving source, and a feed screw mechanism 96 (see FIG. 9) including a ball screw and a nut. The Y-axis direction moving device 86 is provided on the X-axis slide 90, and includes a Y-axis slide 100 and a Y-axis slide moving device 102 (see FIG. 9) as movable members. Similar to the X-axis slide moving device 92, the Y-axis slide moving device 102 includes a Y-axis moving motor 104 (see FIG. 9) and a feed screw mechanism 106 (see FIG. 9) as drive sources. The X-axis moving motor 94 and the Y-axis moving motor 104 are constituted by, for example, a servo motor with an encoder, which is a kind of electric motor. The servo motor is an electric rotary motor capable of accurately controlling the rotation angle, and a step motor may be used instead of the servo motor. A linear motor may be used.

  As shown in FIG. 4, the Y-axis slide 100 is provided with a unit suction head 120 that is a unit holding head as a unit holding portion that sucks and holds the mounting unit 80, an elevating device 122, and a rotating device 124. By the movement of the Y-axis slide 100, the mounting unit 80 sucked by the unit suction head 120 is moved to an arbitrary position in the horizontal plane. These unit suction heads 120 and the like have not been disclosed yet, but are configured in the same manner as the electronic circuit component holding device described in the specification of Japanese Patent Application No. 2005-075397 related to the present applicant, and will be briefly described.

  As shown in FIG. 5, the unit suction head 120 is integrally provided at the lower end portion of the shaft-shaped member 130 that is a holding member. The shaft-shaped member 130 is a spline shaft member having a circular cross-sectional shape and a spline 132 provided on the outer peripheral surface. The unit suction head 120 has a circular cross section and a larger diameter than the shaft member 130.

  The rotating device 124 includes a rotating body 136 as a rotating member held rotatably on the Y-axis slide 100 around a vertical axis, and a rotating body driving device 138 as a rotating member driving device. The rotating body driving device 138 uses a rotating motor 140 (see FIG. 9) as a driving source, and the rotation is transmitted to the rotating body 136 by a rotation transmitting device including a gear 142 fixed to the rotating body 136, and the rotating body 136 rotates. Be made. The rotation motor 140 is constituted by a servo motor, for example. The rotating body 136 has a cylindrical shape, and the spline 132 of the shaft-like member 130 is fitted to the spline 144 provided on the inner peripheral surface thereof so as to be relatively movable in the axial direction but not to be relatively rotatable. The shaft-shaped member 130 and the unit suction head 120 are rotated at an arbitrary angle in both forward and reverse directions around the vertical axis.

  The elevating device 122 includes an elevating member 150 that can be moved up and down on the Y-axis slide 100, an elevating motor 152 (see FIG. 9) as a drive source, and a vertical axis that cannot move relative to the Y-axis slide 100 in the axial direction. A ball screw 154 as a screw shaft rotatably provided around and a feed screw mechanism 158 including a nut 156 fixed to the elevating member 150 are included. The raising / lowering motor 152 is, for example, a servo motor with an encoder. The upper part of the shaft-like member 130 is held by the elevating member 150 so as to be relatively rotatable and not relatively movable in the axial direction. The ball screw 154 is rotated by the elevating motor 152 and the elevating member 150 is raised and lowered. The shaft member 130 and the unit suction head 120 are moved up and down.

  In the shaft-shaped member 130, a passage 160 is provided on the axis thereof, and an annular passage 162 is provided on the outer side thereof. An annular passage 166 and a passage 168 provided in the member 150 are connected to a negative pressure source 170 such as a negative pressure pump. Supply of negative pressure from the negative pressure source 170 to the annular passage 166 is permitted or blocked by the opening / closing device 172. Hereinafter, the annular passage 166 is referred to as a negative pressure supply passage 162. The negative pressure supply passage 162 may be released to the atmosphere.

  The passage 160 is connected to a positive pressure source 186 such as a compressor and the negative pressure source 170 by a radial passage 180 provided in the shaft member 130, an annular passage 182 provided in the elevating member 150, a passage 184, and the like. Yes. Supply of positive pressure and supply of negative pressure to the passage 160 are switched by a switching device 188, and positive pressure and negative pressure are alternatively supplied. The switching device 188 includes, for example, an electromagnetic valve, and also adjusts the magnitude of the positive pressure supplied to the passage 160. A state in which the passage 160 is opened to the atmosphere by the switching device 188 is also obtained. Hereinafter, the passage 160 is referred to as a positive pressure / negative pressure supply passage 160.

  The unit suction head 120 has a flat surface perpendicular to its axis and has a horizontal and downward suction surface 200. As shown in FIG. 4, the unit suction head 120 is formed with an annular negative pressure chamber recess 202 that opens to the suction surface 200 and has the axis as the center line. Communicated. The lower end portion of the positive / negative pressure supply passage 160 is opened to the suction surface 200.

  The mounting unit 80 includes a single nozzle mounting unit (not shown) that holds one suction nozzle that sucks electronic circuit components by negative pressure, and a multi-nozzle mounting unit that holds a plurality of suction nozzles 208 as shown in FIG. Although there is a revolver mounting unit 80, all of them are attracted and held by the unit suction head 120 with a negative pressure, and are moved up and down and rotated. Therefore, as shown in FIG. 4, the mounting unit 80 includes a held portion that includes a suction target surface 210 that is perpendicular to the axis of the revolver mounting unit 80, and the suction target surface 210 is the suction surface 200. In this state, the negative pressure chamber recess 202 is closed to form a unit suction negative pressure chamber 212, which is attached by the negative pressure supplied from the negative pressure supply passage 162 to the unit suction negative pressure chamber 212. The unit 80 is sucked and held by the unit suction head 120.

  In a state where the one nozzle mounting unit is held by the unit suction head 120, the positive / negative pressure supply passage 160 is communicated with the passage provided in the one nozzle mounting unit, and the suction nozzle is negatively attracted when the electronic circuit component is sucked. When the electronic circuit component is mounted on the circuit board, the negative pressure supply is cut off and the positive pressure is supplied to quickly open the electronic circuit component.

  As shown in FIG. 4, the revolver mounting unit 80 includes a plurality of suction nozzles 208 and a valve device 222 provided for each of the suction nozzles 208, and in the state held by the unit suction head 120, the positive pressure The negative pressure supply passage 160 and the negative pressure supply passage 162 are respectively communicated with the passages in the revolver mounting unit 80. By switching the valve device 222, negative pressure is supplied to the suction nozzle 208 when the electronic circuit component is sucked. At the time of wearing, the supply of negative pressure is cut off and positive pressure is supplied. Switching of the valve device 222 is performed by the valve switching device 224 as the revolver mounting unit 80 moves up and down. The revolver mounting unit 80, the valve device 222, the valve switching device 224 and the like are described in the specification of the Japanese Patent Application No. 2005-075397, and detailed description thereof is omitted.

  A plurality of mounting units 80 including these one-nozzle mounting unit and revolver mounting unit 80 are stored in the mounting unit storage device 20 shown in FIG. 1, and the unit suction head 120 is moved to the mounting unit storage device 20. The mounting unit 80 being held is stored, or the mounting unit 80 to be used is held. Storage and holding of the mounting unit 80 by the mounting unit storage device 20 and the unit suction head 120 are described in the specification of the Japanese Patent Application No. 2005-075397, and detailed illustration and description thereof will be omitted.

  Further, as schematically shown in FIG. 1, the X-axis slide 90 is provided with a component imaging system 230, and the Y-axis slide 100 is provided with a mark imaging system 232. Each of these imaging systems 230 and 232 includes CCD cameras 234 and 236 (see FIG. 9) and illumination devices (not shown) as imaging devices.

An adhesive application system will be described.
The adhesive application system includes a plurality of dispense units 250 (one shown in FIG. 5) and a plurality of dispense unit storage devices 252 (see FIG. 1). As shown in FIG. 6, the dispensing unit 250 includes a syringe 260, a discharge nozzle 262, a cover 264, and a cap 266 that constitutes a held portion, and is sucked by negative pressure by the unit suction head 120 in the same manner as the mounting unit 80. Held. The syringe 260 is made of a non-metallic material such as a synthetic resin, has a circular cross-sectional shape, and contains an adhesive 268 as a highly viscous fluid. The syringe 260 has a cylindrical shape that is open at both ends in the axial direction and has both upper and lower ends opened, and a lower portion thereof is inclined so that the diameter decreases toward the tip, and a tapered portion 270 is provided. In addition, a fitting portion 272 having a constant diameter is provided at the tip of the taper portion 270.

  In the syringe 260, a float 278 that is a level indicator in a state of being floated on the adhesive 268 is fitted so as to be movable in the depth direction of the syringe 260. The float 278 is configured in the same manner as the float described in Japanese Patent Application Laid-Open No. 10-277456, and has a structure including a wide band-shaped aluminum layer 282 as a nonmagnetic metal material layer on the float body 280. ing. The float main body 280 is an integrally molded product made of a synthetic resin, forms a hollow container, and has a circular cross section similar to the syringe 260. In the upper part of the outer peripheral surface of the float body 280, an annular groove 284 is formed over the entire circumference, whereby land portions 286, 288 projecting in an annular shape are formed on both sides of the annular groove 284, respectively.

  Aluminum foil is attached to the bottom surface of the annular groove 284 to form an aluminum layer 282. The aluminum layer 282 has a thickness of about 10 μm, and this thickness is thinner than the depth of the annular groove 284. Therefore, the land portions 286 and 288 come into contact with the inner peripheral surface of the syringe 260 and function as protrusions that prevent the aluminum layer 282 and the inner peripheral surface of the syringe 260 from contacting each other. Two separated sliding surfaces are formed, and the float 278 moves easily without being squeezed inside the syringe 260.

  An annular groove 290 deeper than the depth of the annular groove 284 is formed in the circumferential direction on the side opposite to the side where the annular groove 284 is formed across the land portion 288. Thereby, an annular projecting portion 292 is formed at a position separated from the land portion 288 on the opposite side of the land portion 286 in the depth direction of the syringe 260, and the adhesive 268 is prevented from entering the aluminum layer 282. The Even when the adhesive 268 enters, the adhesive 268 enters the annular groove 290, so that further intrusion is prevented.

  The syringe 260 is almost entirely accommodated in the cover 264. Therefore, as shown in FIGS. 6 and 7, the cover 264 has a bottomed container shape with a circular cross section. The cover 264 is made of a non-metallic material, for example, a synthetic resin, has a low thermal conductivity, and is excellent in heat insulation. The inner surface of the bottom wall portion 300 of the cover 264 is a tapered surface 302 that is inclined so that the diameter decreases toward the lower side, and a stepped hole 304 is provided through the center in the axial direction. The syringe 260 is fitted into the cover 264 with a gap 312 between the outer peripheral surface 308 and the inner peripheral surface 310 of the cover 264, and the fitting portion 272 is a large-diameter hole portion of the stepped hole 304. 314 is fitted in an airtight state with an O-ring 316 as a seal member, and is brought into contact with the shoulder surface 320 between the large-diameter hole 314 and the small-diameter hole 318 and surrounded by a cover 264. And supported from below. The inclination of the tapered surface 302 is slightly gentler than the inclination of the tapered portion 270 of the syringe 260, and a gap is obtained between them.

  As shown in FIG. 6, the discharge nozzle 262 includes a nozzle main body 330 and a discharge pipe 332. The discharge nozzle 262 is fitted into the small-diameter hole 318 of the cover 264 in the nozzle main body 330, and the outer end surface of the bottom wall portion 300 of the cover 264. A protrusion 333 that is protruded from the center of the tube, and is held in a non-removable manner by a nut 334 screwed into the protrusion 333 provided with a small-diameter hole 318 and communicated with the syringe 260, and the discharge pipe 332 The adhesive 268 is discharged from the discharge port 336 which is the front end opening. The discharge nozzle 262 can be attached to and detached from the cover 264, and a plurality of types of discharge nozzles 262 having different diameters of the discharge pipes 332 and the number of discharge pipes 332 are selectively held by the cover 264. The portion of the cover 264 provided with the large-diameter hole portion 314 constitutes a syringe holding portion, and the portion provided with the small-diameter hole portion 318 constitutes a discharge nozzle holding portion. The discharge nozzle may be detachably held on the syringe. The discharge nozzle 262 having a plurality of discharge pipes 332 can apply a plurality of adhesives 268 at the same time. For example, the discharge nozzle 262 is rotated by the rotating device 124 while the dispense unit 250 is held by the unit suction head 120. Thus, the application position of the adhesive 268 by the plurality of discharge pipes 332 is changed.

  As shown in FIGS. 6 and 7, the cover 264 is provided with an air passage 340 as a gas passage which is a kind of an annular fluid passage centering on the axis of the cover 264 inside the bottom wall portion 300. It has been. The air passage 340 is opened in the tapered surface 302 by a plurality of holes 342 provided in the bottom wall portion 300 and communicated with the gap 312. The plurality of holes 342 are provided at regular intervals over the entire circumference of the bottom wall portion 300, for example, at equiangular intervals. In FIG. 7, the hole 342 is not shown. The air passage 340 is also opened to the outer peripheral surface 346 of the cover 264 by the opening 344. Further, the peripheral wall of the cover 264 is provided with an opening 348 penetrating the air passage 340 and the portion above the opening 344 on the upper opening side thereof, and the gap 312 is communicated with the outside. Yes. The cover 264 is further provided with a notch 350, in which a part of the outer peripheral surface 346 is notched in a single plane parallel to the axial direction. Further, as shown in FIGS. 6 and 8, the upper end opening of the cover 264 has a plurality of protrusions 352 as engaging portions protruding outward in the radial direction, and three in the main cover 264 at equal angular intervals. Is provided. Each of the protrusions 352 is provided with one recess 354 as an engaging portion or a positioning portion on the lower surface thereof.

  As shown in FIG. 8, the cap 266 has a circular cross-sectional shape. As shown in FIG. 6, the cap 266 has a bottomed stepped hole 360 that opens on the lower surface on one axial surface. Is formed, and the upper end portion projected from the cover 264 of the syringe 260 is fitted into the small diameter hole portion 362. An adsorbed member or contact member 364 is provided on the other axial surface of the cap 266 and on the upper surface. The contact member 364 has a circular plate shape, and the upper surface of the contact member 364 is slightly protruded from the upper surface of the cap 266 to form a suction surface 366 that is sucked by the unit suction head 120. Further, a through hole 368 is formed in the center portion of the cap 266 so as to penetrate through the bottom portions of the contact member 364 and the stepped hole 360. In the dispensing unit 250, the cap 266 is made of synthetic resin, and the contact member 364 is made of synthetic resin, for example, urethane resin.

  The large-diameter hole portion 372 of the stepped hole 360 has a diameter that allows the protrusion 352 of the cover 264 to be fitted, and the opening has a plurality of protrusions 374 that protrude radially inward. In the present cap 266, three gaps are left at equal angular intervals and between the shoulder surface 376 between the large-diameter hole 372 and the small-diameter hole 362 so as to allow the protrusion 352 to be fitted. It is formed and constitutes an engaging part or positioning part. Each of the protrusions 374 is provided with a positioning tool or engagement tool 384 including a ball 380 and a spring 382, and the ball 380 is urged by the spring 382 in a direction protruding from the protrusion 374 toward the shoulder surface 376. ing. Further, at the bottom of the large-diameter hole 372 of the cap 266, as shown in FIGS. 6 and 8, there are shafts on portions corresponding to both sides of the respective engagement tools 384 of the three protrusions 374 of the shoulder surface 376. A through hole 388 extending in the direction is formed. The through hole 388 is also provided so as to penetrate the contact member 364, and is opened to the shoulder surface 376 and the attracted surface 366. A plurality of through-holes 388 are provided corresponding to one protrusion 374, here two, but at least one may be provided.

  As shown by a two-dot chain line in FIG. 8, the cap 266 is fitted with the syringe 260 in a state where the three protrusions 352 of the cover 264 are positioned between the three protrusions 374 of the cap 266. Covering the cover 264 to which the nozzle 262 is attached, the upper end portion of the cover 264 is fitted into the large diameter hole portion 372, and the upper end portion protruding from the cover 264 of the syringe 260 as the seal member is inserted into the small diameter hole portion 362. As shown in FIGS. 6 and 8, the cap 266, the syringe 260 and the cover 264 are rotated relative to each other while being fitted in an airtight state by the O-ring 394 (see FIG. 6). The protrusion 352 is caused to enter between the protrusion 374 and the shoulder surface 376, and the ball 380 is depressed by the bias of the spring 382. 4 is is fitted, the cap 266 is placed over so as not to escape in the axial direction in a state in which a predetermined phase in the syringe 260 and the cover 264, to close the opening of the syringe 260. In this state, the through-hole 368 of the cap 266 is communicated with the internal space of the syringe 260, and the through-hole 388 of the cap 266 is blocked by the protrusion 352 of the cover 264 as shown in FIG. Become.

The dispense unit storage device 252 will be described.
As shown in FIG. 1, the dispense unit storage device 252 is held by the feeder-type component supply device 12. The storage device main body 400 of the dispense unit storage device 252 has a block shape as shown in FIGS. 6 and 7, and is fixed to the table 402 (see FIG. 1) by a fixing device (not shown). As shown by a two-dot chain line in FIG. 6, the table 402 is provided with an inverted T-shaped rail 404 similar to the feeder 40, and is fitted in the slot 46 similarly to the feeder 40. In any feeder holding part of the feeder holding base 44, the feeder 40 and the dispense unit storage device 252 can be selectively attached. The table 402 is positioned in the width direction, the left-right direction, and the front-rear direction by the positioning portion, and is prevented from being lifted from the feeder holding base 44 by the lifting prevention portion, and is engaged with the engaging portion by the engagement device. It is detachably attached to the feeder holding base 44. The table 402 constitutes a mounting portion for the dispensing unit storage device 252. The storage device main body 400 is made of a synthetic resin, is light, and can be easily transported and attached to and detached from the table 402. Further, the dispense unit storage device 252 can be light. The storage apparatus main body 400 may be attached to any part of the table 402 that is located within the movement area of the unit suction head 120, but is fixed to, for example, a part on the substrate holding apparatus 16 side.

  The dispensing unit 250 has a width that is a multiple of the width of the smallest feeder 40, and occupies a space corresponding to a plurality of slots when the feeder holding base 44 is attached. The number of dispense unit storage devices 252 attached to the feeder holding base 44 is determined by, for example, the number of dispense units 250 required for applying the adhesive 268, and a plurality, for example, two are attached. These dispensing units 250 are attached to one end in the X-axis direction, for example, in a direction in which the component supply units of the feeder holding base 44 are arranged.

  As shown in FIG. 6, the storage device main body 400 is formed with a bottomed storage hole 430 that opens on the upper surface thereof. As shown in FIG. 7, the storage hole 430 has a circular cross-sectional shape and a depth that allows the entire cover 264 to be stored in the storage device main body 400. The opening of the storage hole 430 is provided with a bottomed fitting hole 432 having a diameter larger than that of the storage hole 430 and into which the cap 266 is fitted, and an upward and annular support surface 434 is provided. As shown in FIG. 7, a positioning projection 436 is provided on the support surface 434 to provide a positioning unit. In addition, as shown in FIG. 6, the fitting hole 432 and the accommodation hole 430 are inclined downward toward the center line of the accommodation hole 430 as shown in FIG. A taper hole 438 that gradually decreases is provided as a guide portion that guides the storage of the dispensing unit 250 into the storage hole 430. Further, when the dispensing unit 250 is supported by the support surface 434 in the cap 266, interference between the engaging tool 384 and the storage device main body 400 is avoided.

  As shown in FIGS. 6 and 7, the storage device main body 400 also has an opening 440 that opens to the upper surface and one side surface of the substrate holding device 16, opens upward and laterally, and communicates with the storage hole 430. Is provided. The opening 440 is always open to the outside, and is shallower than the storage hole 430 and has a width through which a portion of the dispensing unit 250 where the protrusion 352 of the cover 264 is not provided can pass. Accordingly, when the dispense unit 250 is stored in the storage hole 430, the dispense unit 250 may be lowered from a position above the storage hole 430. However, as shown in FIG. In the direction, the discharge nozzle 262 is positioned at the unit storage / removal start position located slightly above the lower end of the opening 440, moved in the horizontal direction from that state, and entered the storage hole 430 through the opening 440. The dispensing unit 250 is lowered in phase by supporting the outer peripheral portion of the cap 266 on the support surface 434 and fitting the positioning protrusion 436 into a recess (not shown) as a positioning portion provided on the cap 266. It can be stored in the storage hole 430 in a determined state. In addition, the dispensing unit 250 is taken out from the storage device 252 in the first half. In the first half, the dispensing unit 250 is supported by the support surface 434 on the cap 266, and almost entirely is stored in the storage hole 430. The unit is raised from the storage position to the unit storage / removal start position, and the latter half is taken out of the storage device 252 through the opening 440 by horizontal movement. A portion of the storage device main body 400 provided with the storage hole 430 and the opening 440 constitutes a storage portion, and the opening 440 is provided at an upper portion of the storage portion, and a part of the storage portion is open.

  This adhesive application system is a temperature control device 450 that adjusts the temperature of the adhesive in the dispensing unit 250 being stored in the dispensing unit storage device 252 to a set temperature, and the remaining amount of the adhesive 268 in the syringe 260 is detected. The pressure detecting device 452 and the dispensing unit storage device 252 include a pressure application device 454 as a leakage preventing device that prevents leakage of the adhesive 268 from the discharge nozzle 262 in a state where the dispensing unit 250 is stored.

  The temperature control device 450 is a device that adjusts the temperature of the adhesive 268 by supplying temperature adjustment air, which is a temperature adjustment gas, as a temperature adjustment fluid to the gap 312 between the syringe 260 and the cover 264. The temperature adjustment head 458 and the temperature adjustment air supply device 460 are provided, and the temperature of the air supplied from the positive pressure source 186 is heated by the temperature adjustment heater 462 (see FIG. 7) and supplied to the gap 312. Therefore, the storage device main body 400 is provided with an air supply passage 466 as shown in FIG. The air supply passage 466 is provided so as to communicate with the opening 344 provided in the cover 264 of the dispensing unit 250 in a state of being accommodated in the dispensing unit storage device 252, and includes an opening 344, an air passage 340, and a plurality of holes. 342 is communicated with the gap 312. The air supply passage 466 is connected to a passage (not shown) provided in the table 402. This passage is connected to the positive pressure source 186 by a passage provided on the bed 30 side and the air supply passage 466 is connected to the positive pressure source 186 when the feeder holding base 44 is attached to the mounting base 62 of the bed 30. Is done. In the temperature control device 450, a portion where the air supply passage 466 of the storage device main body 400 is provided constitutes a temperature control head 458.

  As shown in FIG. 7, the temperature adjusting heater 462 is provided in the middle of the passage 468 that includes a plurality of passages and connects the air supply passage 466 to the positive pressure source 186 as shown in FIG. 7. Is provided. Further, a flow rate adjustment valve 472 is provided between the temperature adjustment heater 462 and the positive pressure source 186 to adjust the flow rate of the compressed air supplied to the air supply passage 466, and the flow rate adjustment valve 472 and the positive pressure source. An electromagnetic direction switching valve 474 is provided between the air supply path 186 and the state where the air supply passage 466 is supplied to the positive pressure source 186 and is opened to the atmosphere. The temperature adjustment heater 462 is provided with an overheat sensor 476, and it is detected that the temperature of the temperature adjustment heater 462 exceeds the set temperature. The positive pressure source 186, the temperature adjustment heater 462, the passage 468, the flow rate adjustment valve 472, the electromagnetic direction switching valve 474, and the like constitute the temperature adjustment air supply device 460.

The storage device main body 400 is also provided with an air discharge passage 480 as shown in FIG. The air discharge passage 480 is provided above the air supply passage 466 and in a portion corresponding to the opening 348 provided in the cover 264 of the dispense unit 250 stored in the dispense unit storage device 252. In addition to being connected to a passage (not shown) provided in the table 402, it is connected to a passage provided on the bed 30 side by attachment of the feeder holding base 44 to the attachment base 62 and led to the exhaust location to control the temperature. Later air is discharged. A temperature sensor 484 is provided at a portion of the passage 482 including the exhaust passage on the bed 30 side, and the temperature of the air after being supplied to the dispensing unit 250 and adjusting the temperature of the adhesive 268 is detected. The temperature control air supply device 460 and the temperature sensor 484 are provided for each of the two dispense unit storage devices 252. The temperature control device 450 is provided for each of the two dispensing units 250, and the temperature adjustment of the adhesive 268 accommodated therein is performed individually. The positive pressure source 186 is shared by the two temperature control air supply devices 460.
Components other than the positive pressure source 186 of the temperature control air supply device 460 may be provided in the storage device main body 400, may be provided in the table 402, or may be shared by the two temperature control devices 450. The temperature-adjusted air discharged from the gap 312 may be guided to the air recovery location and recovered, and reused for adjusting the temperature of the adhesive 268, or used for another purpose. Also good.

  As shown in FIGS. 6 and 7, the detection head 500 of the remaining amount detection device 452 is provided in the dispense unit storage device 252 as shown in FIGS. 6 and 7, and includes a high-frequency oscillation proximity switch 502 as a detection device. 278 aluminum layer 282 is detected. Aluminum is a non-magnetic metal material, but has a reduced thickness, which increases the sensitivity of switch 502 to aluminum layer 282 and approaches that of magnetic material, and aluminum layer 282 is detected by switch 502. The switch 502 is a portion of the storage device main body 400 on the side opposite to the side where the opening 440 is provided, and is disposed inside the portion on the side opposite to the substrate holding device 16, and the detection unit 504 is provided in the storage hole. It is made to protrude in 430 and is detachably fixed to the storage device main body 400 by a fixing device such as a bolt. In the vertical direction, the switch 502 is provided at a position above the cover 264 and just below the cap 266 when the dispensing unit 250 is housed in the housing hole 430. As shown in FIG. 6, in a state where the adhesive 268 is fully accommodated in the syringe 260, the detection unit 504 does not detect the upper edge of the strip-shaped aluminum layer 282 provided on the float 278, but the lower side thereof. The part is provided at the position to be detected. The detection position, which is the position in the vertical direction of the switch 502 and parallel to the axis of the syringe 260, is adjusted by the spacer 506, and the signal line is connected to the rear side of the dispensing unit storage device 252 (substrate holding device). (The side opposite to the 16 side).

  The pressure application device 454 applies a leakage prevention pressure set higher than the atmospheric pressure to the discharge port 336 of the discharge nozzle 262 of the dispense unit 250 accommodated in the dispense unit storage device 252, and As shown in FIG. 6, the apparatus includes a pressure application head 516 and an air supply device 518 as a gas supply device. The pressure application head 516 includes a pressure application passage 520 provided in the storage device main body 400. One end of the pressure application passage 520 is opened at the center of the bottom surface of the storage hole 430 and includes a portion extending concentrically with the storage hole 430. When the dispensing unit 250 is housed in the housing hole 430 and the cap 266 is supported by the support surface 434, the lower end portion of the nozzle body 330 of the discharge nozzle 262 is fitted in a state of being almost sealed to one end portion of the pressure application passage 520. The discharge pipe 332 is positioned in the pressure application passage 520, and the pressure application device 454 is connected to the discharge nozzle 262. The discharge pipe 332 does not contact the inner peripheral surface of the pressure application passage 520 and other portions of the storage device main body 400, and the storage device main body 400 is not contaminated with the adhesive 268. An opening portion of the pressure application passage 520 to the accommodation hole 430 constitutes a connection portion. Note that the opening of the pressure application passage 520 to the storage hole 430 is formed by a metal ring-shaped member 524 so that durability can be obtained with respect to the fitting and detachment of the discharge nozzle 262.

  The other end of the pressure application passage 520 is connected to a passage (not shown) provided in the table 402 and is connected to a passage provided on the bed 30 side by attaching the feeder holding base 44 to the attachment base 62. Connected to a positive pressure source 186. As shown in FIG. 6, a pressure reducing valve 530 as a pressure control valve is provided in a portion on the bed 30 side of the passage 528 including these passages, and the pressure of the compressed air of the positive pressure source 186 is higher than atmospheric pressure. It is adjusted to a height suitable for preventing the adhesive 268 from leaking and supplied to the pressure application passage 520. In addition, an electromagnetic direction switching valve 532 is provided in a portion of the passage 528 between the pressure reducing valve 530 and the positive pressure source 186 so that the pressure application passage 520 communicates with the positive pressure source 186 and is opened to the atmosphere. Can be switched. The positive pressure source 186, the passage 528, the pressure reducing valve 530, and the like constitute an air supply device 518 that supplies the pressure adjusted passage 520 with air adjusted to the leakage prevention pressure. Components other than the positive pressure source 186 of the air supply device 518 may be provided in the dispense unit storage device 252 or the table 402.

  The electronic circuit assembly system is controlled by a control device 600 shown in FIG. The control device 600 mainly includes a control computer 610 including a CPU 602, a ROM 604, a RAM 606 and a bus 608 connecting them, and an input / output unit 612 includes an overheat sensor 476, a temperature sensor 484, and a high-frequency oscillation type proximity. An image processing computer 614, an input device 616, an encoder 618, a negative pressure sensor 619, and the like for processing image data obtained by imaging of the CCD cameras 234 and 236 of the switch 502, the component imaging system 230 and the mark imaging system 232 are connected. ing. The encoder 618 is an encoder provided in each of various servo motors such as the X-axis moving motor 94, and one is representatively shown. The negative pressure sensor 619 is provided between the negative pressure chamber recess 202 of the unit suction head 120 and the opening / closing device 172 and detects the negative pressure in the unit suction negative pressure chamber 212. The input / output unit 612 is also connected to various actuators such as an X-axis moving motor 94 via a drive circuit 620, and is connected to an alarm device 621 as a notification device, and is also displayed via a control circuit 622. A screen 626 is connected. These control circuit 622 and display screen 626 constitute a display device 624. The ROM 604 stores various programs and data such as a main routine (not shown), an electronic circuit component mounting program, and an application control program shown in the flowchart of FIG.

  The dispense unit storage device 252 is fixed to the table 402, the table 402 is attached to the feeder holding base 44, and the feeder-type component supply device 12 is attached to the mounting base 62, thereby supplying power, communication lines, and air between them. Connections such as passages are made, and detection signals are input to the control computer 610, air is supplied to the dispensing unit storage device 252, and the like.

Next, the operation will be described.
In this system, the feeder holding device 42 holds both the feeder 40 and the dispense unit storage device 252, and the unit suction head 120 selectively holds the mounting unit 80 and the dispense unit 250, so that On the other hand, both the mounting of the electronic circuit component and the application of the adhesive 268 can be performed. Further, the feeder holding device 42 can hold only one of the feeder 40 and the dispensing unit storage device 252 or only one of them can be used, so that a dedicated system for mounting electronic circuit components can be used. It can also be a dedicated system for agent application. When both the mounting of the electronic circuit component and the application of the adhesive are performed on the circuit board 32, it can be performed in various modes. In this system, after the circuit board 32 is carried in, the electronic circuit component Prior to mounting, the adhesive is applied to all adhesive application locations.

  The feeder holding device 42 holds two dispensing unit storage devices 252, each of which stores a dispensing unit 250, and can use the two dispensing units 250 for applying an adhesive. The two types of dispense unit storage devices 252 store the same type of dispense unit 250 or different types of dispense units 250, respectively. The type of adhesive 268 applied to all the adhesive application locations of the circuit board 32, the number of application points by one application operation of the dispensing unit 250, and the diameter of the discharge pipe 332 of the discharge nozzle 262 used for application are the same. When the adhesive 268 can be applied by the same dispensing unit 250, the dispensing unit 250 may only be stored in one dispensing unit storage device 252, but the same kind of dispensing unit is stored in each of the two dispensing unit storage devices 252. If 250 is accommodated, they can be used interchangeably. For example, when the number of adhesives applied to one circuit board 32 is large and the temperature of the adhesive 268 is lowered during the application, and the viscosity may become inappropriate for the application, It is desirable to replace 250. In addition, the dispensing unit 250 is applied during the time in which the temperature is stored in the dispensing unit storage device 252 due to the temperature difference between the environmental temperature and the adhesive, the allowable temperature range of the adhesive, and the like. Therefore, when the ratio of the time taken out from the dispense unit storage device 252 to the time taken out of the dispense unit storage device 252 is not sufficient to be stored in the dispense unit storage device 252 while no application is required, the two dispense units 250 are replaced. It is desirable to use and increase the time ratio.

  For this reason, in this system, even when only one type of dispensing unit 250 is required for applying the adhesive 268 to the circuit board 32, the same type of dispensing unit 260 is stored in the two dispensing unit storage devices 252 as necessary. To be used in turn. The presence / absence of replacement is instructed by the operator using the input device 616, for example. The operator determines whether or not replacement is necessary based on the number of application points, and if it is determined that replacement is necessary, the operator inputs conditions such as the necessity for replacement and the timing when the dispensing unit 250 should be replaced. For example, the replacement condition is that the dispensing unit 250 is held by the unit suction head 120 and taken out from the storage device 252 and the removal time or use time used for coating reaches a set time. The set time is set to a time during which it is guaranteed that the temperature of the adhesive 268 is at a height suitable for application after the dispensing unit 250 is taken out from the storage device 252. You may set by the number | score of the application | coating which can be performed within this time. The number of application points of the adhesive 268 to one circuit board 32 is known in the application control program for executing application, and the presence or absence of replacement and the time and application for replacement are automatically performed according to the number of application points. A score may be set.

  At least one of the type of adhesive 268 to be applied, the number of application points by one application operation of the dispense unit 250, and the diameter of the discharge pipe 332 of the discharge nozzle 262 used for application differs, and the two types of dispense units 250 are bonded. When used for application of the agent 268, different types of dispense units 250 are stored in the two dispense unit storage devices 252. In this case, the two dispensing units 250 are changed according to the application content of the adhesive 268 to the circuit board 32 according to the application control program. The replacement of the two dispensing units 250 will be described later. Depending on the application mode, the dispense unit 250 may be stored only in one of the two dispense unit storage devices 252.

  If the circuit board 32 is carried into the electronic circuit assembly system by the board transfer device 10 and is held by the board holding device 16, first, the adhesive 268 is applied, so that the electronic circuit component on the previous circuit board 32 is applied. After completion of the mounting, the work unit held by the unit suction head 120 is exchanged from the mounting unit 80 to the dispensing unit 250. The mounting unit 80 is stored in the mounting unit storage device 20, and the dispensing unit 250 is held by the unit suction head 120. This replacement is preferably performed in parallel with the loading and unloading of the circuit board 32. Storage and removal of the mounting unit 80 in and from the mounting unit storage device 20 are performed in the same manner as the storage and removal described in the specification of the Japanese Patent Application No. 2005-075397, and thus description thereof is omitted.

  The unit suction head 120 is moved to the mounting unit storage device 20 to store the mounting unit 80 and then moved to the dispensing unit storage device 252 to suck and hold the dispensing unit 250. When the dispensing unit 250 is stored in the storage device 252, the temperature of the adhesive 268 stored in the syringe 260 is adjusted to the set temperature by the temperature controller 450, and leakage of the adhesive 268 from the discharge nozzle 262 occurs. It is prevented by the pressure application device 454. In a state where the dispensing unit 250 is stored in the storage device 252, the electromagnetic direction switching valve 474 is switched to a state where the air supply passage 466 is communicated with the positive pressure source 186, and the air passage 340 is connected to the air supply passage 466 via the opening 344. The air is communicated and communicated with the positive pressure source 186, and air whose temperature is adjusted by the temperature adjusting heater 462 is supplied. The air flows from the air passage 340 through the plurality of holes 342 to the gap 312 between the syringe 260 and the cover 264 uniformly and substantially upward, and flows upward, and through the opening 348, the air discharge passage 480. And then discharged to the outside through the passage 482. Since the gap 312 is appropriately narrowed, a relatively small flow of air can generate a sufficiently high velocity flow across the gap, and the temperature of the adhesive 268 contained in the syringe 260 is uniform. The temperature is raised or lowered and adjusted to a set temperature, that is, a height at which a viscosity suitable for coating is obtained. The temperature control device 450 is provided in the dispense unit storage device 252 and the like, and the temperature of the adhesive 268 in the dispense unit 250 that is taken out of the storage device 252 and applies the adhesive 268 is not adjusted, but is changed. By being housed in the device 252, the temperature is returned to the set temperature. The dispensing unit 250 is removed from the storage device 252 with the syringe 260 still covered with the synthetic resin cover 264, and the adhesive 268 is applied, so that a heat retention effect by the cover 264 is obtained. Temperature change is gradual. In the present dispensing unit 250, the temperature of the adhesive 268 gradually decreases during application.

  The temperature of the air discharged from the gap 312 is detected by the temperature sensor 484 and input to the control computer 610. If the air temperature is lower than the set temperature, the amount of current supplied to the temperature adjustment heater 462 is increased, and if it is higher, it is decreased and supplied to the gap 312. The temperature of the air is adjusted to a height suitable for adjusting the temperature of the adhesive 268. If the overheat sensor 476 detects that the temperature of the temperature adjustment heater 462 has risen and exceeded the upper limit value, the alarm device 621 is sounded and the operator is notified of the overheating of the temperature adjustment heater 462. . The temperature of the air supplied to the gap 312 can also be adjusted by adjusting the flow rate of the air supplied to the air supply passage 466 by the flow rate adjusting valve 472.

  Since the temperature control device 450 is provided for each of the two dispense unit storage devices 252, the temperature of the adhesive 268 can be individually adjusted for the two dispense units 250. Therefore, for example, when one dispense unit 250 is taken out from the dispense unit storage device 252 and the temperature drops while being used to apply the adhesive 268, the dispense unit 250 is stored in the dispense unit storage device 252. If so, the temperature of the air for adjusting the temperature is made higher than that in the case where it is stored in the dispense unit storage device 252 and is ready for application, and the temperature of the adhesive 268 is quickly raised.

  In the state where the dispensing unit 250 is stored in the storage device 252, as shown in FIG. 6, the discharge nozzle 262 is supplied to the pressure application passage 520 by fitting the lower end portion of the nozzle body 330 into the pressure application passage 520. The positive pressure is applied to the discharge port 336. When the dispensing unit 250 is stored in the storage device 252, the electromagnetic direction switching valve 532 is switched to a state in which the pressure application passage 520 communicates with the positive pressure source 186, and the pressure reducing valve 530 causes the adhesive 268 from the discharge port 336 to be connected. The pressure is reduced to a height suitable for preventing leakage, and the compressed air of the adjusted positive pressure source 186 is supplied to the pressure application passage 520. The height suitable for leakage prevention is a height that keeps the adhesive 268 staying at the discharge port 336 without leaving the discharge port 336 or withdrawing into the discharge pipe 332. Therefore, the dispensing unit 250 is stored in the storage device 252 in the posture at the time of application, that is, in a posture in which the axis is parallel to the vertical direction, and the discharge port 336 faces downward, but the adhesive 268 leaks. In addition, when the dispensing unit 250 is removed from the storage device 252 and used for applying the adhesive 268, the adhesive 268 is discharged from the discharge port 336 without delay based on the supply of positive pressure to the syringe 260. The

  The pressure applied to the discharge port 336 and the height of the leakage prevention pressure is also controlled according to the remaining amount of the adhesive 268 in the syringe 260. As will be described later, the remaining amount of the adhesive 268 is detected by a remaining amount detecting device 452, and the pressure applied to the discharge port 336 is reduced so that the pressure is higher when the remaining amount of the adhesive 268 is small than when it is small. The decompression height by the valve 530 is adjusted. The leakage prevention pressure is changed stepwise according to the remaining amount of the adhesive 268, for example. It may be changed continuously. By adjusting the leakage prevention pressure according to the remaining amount of the adhesive 268, regardless of the remaining amount of the adhesive 268, the pressure is too high and the adhesive 268 is retracted into the syringe 260 or too low. Leakage is well prevented without the adhesive 268 leaking.

  The electromagnetic direction switching valve 532 that allows or blocks the supply of positive pressure to the pressure application passage 520 switches to a position where the pressure application passage 520 communicates with the positive pressure source 186 in a state where no current is supplied. The electromagnetic control valve is in a state where positive pressure is supplied. Therefore, for example, even when the power supply of the system is turned off in a state where the dispensing unit 250 is stored in the storage device 252, positive pressure is supplied from the positive pressure tank (not shown) to the pressure application passage 520 and is supplied to the discharge port 336. The applied state is maintained and leakage of the adhesive 268 is prevented.

  When the unit suction head 120 takes out the dispense unit 250 stored in the dispense unit storage device 252 as described above, the unit suction head 120 is moved to the upper side of the dispense unit 250 and lowered, and the suction surface 200 is moved to the suction surface 366. To be contacted. Of the two storage devices 252, which storage device 252 accommodated in the dispensing unit 250 is used for coating is known in the application control program, and the unit suction head 120 has the suction surface 200 and the suction surface 366. Are moved to a position where their centers coincide with each other and lowered. The contact between the two surfaces 200 and 366 closes the opening of the negative pressure chamber recess 202 to form a unit suction negative pressure chamber 212, and the negative pressure supplied from the negative pressure source 170 attracts the dispensing unit 250. And is held by the unit suction head 120. The abutting member 364 that forms the attracted surface 366 is made of urethane resin, and the attracting surface 200 of the metal head attracting unit 120 is in close contact with the attracted surface 366, so that the negative pressure from the unit attracting negative pressure chamber 212 is reduced. Pressure leakage is well prevented. In addition, the internal space of the syringe 260 is communicated with the positive / negative pressure supply passage 160 through the through-hole 368, the positive pressure is supplied from the positive pressure source 186, or the negative pressure is supplied from the negative pressure source 170. Become. Due to the close contact of the surfaces 200 and 366, leakage of positive pressure from the positive / negative pressure supply passage 160 is well prevented.

  When the dispensing unit 250 is sucked by the unit suction head 120, as shown in FIG. 5, the through-hole 388 formed in the cap 266 is also communicated with the unit suction negative pressure chamber 212, and negative pressure is supplied. Whether the cover 264 holding the 260 and the discharge nozzle 262 is accurately held by the cap 266 is detected. When the cap 266 is put on and held by the syringe 260 or the like, the ball 380 of the engagement tool 384 is fitted into the recess 354 provided in the protrusion 352 of the cover 264 by the relative rotation of the syringe 260 and the cover 264 and the cap 266. If combined, as shown in FIG. 8, each of the two through-holes 388 corresponding to one engaging tool 384 is closed by the projection 352, and leakage of negative pressure is prevented. A negative pressure required for suction of the dispensing unit 250 is obtained in the suction negative pressure chamber 212. On the other hand, if the relative rotation between the cap 266 and the cover 264 is insufficient or excessive, and the ball 380 is not fitted into the recess 354 and is removed from the recess 354, the through hole 388 is detached from the projection 352. As a result, the negative pressure leaks, and the negative pressure necessary for suction of the dispensing unit 250 cannot be obtained in the negative pressure chamber 212 for unit suction. Therefore, the negative pressure sensor 619 detects the negative pressure in the unit suction negative pressure chamber 212 and compares it with the set value to detect whether the cover 264 and the like are accurately held by the cap 266. If the negative pressure is insufficient, the cover 264 or the like is not accurately held by the cap 266, and for example, this is displayed on the display screen 626 and notified. A warning device such as a buzzer, lighting of a lamp, blinking, or voice guidance may be used to give a warning, and the worker puts the cap 266 on the cover 264 and holds it again based on the notification. The ball 380 is fitted into the recess 354, and the cover 264 is engaged with the cap 266 to be held, so that the cover 264 and the like are prevented from dropping from the cap 266. The through holes 388 are respectively provided on both sides of the portion of the cap 266 corresponding to the engaging tool 384. When the cap 266 is put on the syringe 260 held by the cover 264, the cap 266 is rotated relative to either the forward or reverse direction. Even if it is made to do, it is detected whether the cover 264 etc. are correctly hold | maintained by the cap 266. FIG. Further, by supplying negative pressure to the through hole 388, the protrusion 352 of the cover 264 is also attracted and pressed against the shoulder surface 376 of the cap 266, and the holding of the syringe 260 and the cover 264 by the cap 266 is assisted.

  After the unit suction head 120 holds the dispensing unit 250, for example, as shown in FIG. 13 (b), the unit suction head 120 is moved up to the unit storing / removing start position and then moved in the horizontal direction so that the dispensing unit 250 is opened. It is taken out from the dispensing unit storage device 252 to the substrate holding device 16 side through 440. The remaining amount of the adhesive 268 is detected when the dispensing unit 250 is taken out from the storage device 252, which will be described later. Prior to the dispensing unit 250 being taken out from the storage device 252 (may be in parallel with or after taking out), the electromagnetic direction switching valves 474 and 532 respectively bring the air supply passage 466 and the pressure application passage 520 to the atmosphere. Switch to the open position, thereby avoiding the outflow of pressure-regulated air and temperature-regulated air.

  Then, the unit suction head 120 is moved by the unit moving device 82, the dispensing unit 250 is moved to an arbitrary position in the horizontal plane, and is moved to a predetermined adhesive application place set on the circuit board 32. Adhesive 268 is applied. The unit moving device 82 is both a mounting unit moving device and a dispensing unit moving device. The timing of movement of the dispensing unit 250 in the X-axis and Y-axis directions, ascending / descending (movement in the Z-axis direction), and discharging of the adhesive 268 will be described based on the time chart shown in FIG. As is apparent from this time chart, when the dispensing unit 250 is moved in the X-axis direction and the Y-axis direction and moved onto the adhesive application location, it is at the end of the movement, and is applied to the adhesive application location. The supply of positive pressure to the syringe 260 is started before reaching, the discharge of the adhesive 268 is started, and after the positive pressure supply starts, the unit suction head 120 is lowered by the elevating device 122, and the dispensing unit 250 is lowered. Is started. Under the control of the unit moving device 82, the lifting device 122, and the switching device 188, the horizontal movement and lowering of the dispensing unit 250 and the discharge of the adhesive 268 are performed in parallel. Therefore, the coating cycle time is shortened and the coating efficiency is improved compared to the case where they are separately performed in the order of horizontal movement, lowering, and discharging of the adhesive 268, or when two of them are performed in parallel. Can be made. The longer the ascending / descending distance of the dispensing unit 250, the more effectively the effect of reducing the coating cycle time can be obtained by setting the synchronization timing.

  By performing the horizontal movement and the lowering in parallel, the dispensing unit 250 reaches the adhesive application point, and is in the middle of lowering in the stopped state, and then reaches the lower end position. The descending end position is a position where the discharge port 336 of the discharge nozzle 262 is a set distance away from the upper surface, which is the adhesive application surface of the circuit board 32, and is based on the height of the adhesive application surface (vertical position). Is set. The height of the adhesive application surface is detected in advance by a height detection device. The height detection device is already known, for example, from Japanese Patent Laid-Open No. 2-268860, and the description thereof is omitted.

  When the dispensing unit 250 is lowered, positive pressure has already been supplied to the syringe 260, the dispensing unit 250 is lowered with the adhesive 268 beginning to come out from the discharge port 336, and the dispensing unit 250 is moved to the lowered end position. The adhesive 268 discharged from the discharge port 336 is attached to the circuit board 32 at the time of reaching. The dispensing unit 250 is immediately raised without stopping after reaching the lower end position. At the same time when the dispensing unit 250 reaches the lower end position (it is only necessary to determine the optimum time by experiment, and it may be slightly before and after reaching the lower end position), the positive pressure is supplied to the syringe 260. In addition to being cut off, negative pressure is supplied for a set time instead of positive pressure, and the adhesive 268 is sucked. Therefore, the adhesive 268 is in a state as if it is shaken off from the discharge port 336 toward the circuit board 32, and when the dispensing unit 250 is stopped in a state where it reaches the lower end position and then is raised. The resulting stringing is reduced and applied to the circuit board 32 in a good shape. Moreover, the air in the syringe 260 is sucked by the supply of negative pressure, and an effect of suppressing overheating due to adiabatic compression of air is obtained. Then, after the dispensing unit 250 is raised to the rising end position, the dispensing unit 250 is moved in the X-axis direction and the Y-axis direction, and is moved to the next adhesive application location. This movement and a part of the rise of the dispensing unit 250 may be performed in parallel, but should be performed within a range that does not cause deterioration of the adhesive application shape.

  The application time or discharge time of the adhesive 268, that is, the positive pressure supply time to the syringe 260 is set according to the application diameter of the adhesive 268. The application diameter can be changed by the diameter of the discharge pipe 332 of the discharge nozzle 262, but can also be changed by the application time. By changing the discharge time in one discharge nozzle 262, there is a limitation due to the diameter of the discharge pipe 332, but the application diameter can be changed. Therefore, the relationship between the application time and the application diameter is acquired in advance for each dispense unit 250 (for each discharge pipe 332), stored in the RAM 606 of the control computer 610, and the diameter of the adhesive 268 to be applied to the circuit board 32. The application time is set accordingly. The relationship between the application time and the application diameter is, for example, that the application of the adhesive 268 to the circuit board 32 starts when at least one of the type of the adhesive 268, the set temperature of the adhesive 268, and the diameter of the discharge pipe 332 changes. Obtained before or based on instructions from the operator.

  At the time of acquisition, the application time is changed to a plurality of steps at regular time intervals, one adhesive is applied to the dispense unit 250 at each application time, and the applied adhesive 268 is imaged by the mark imaging system 232, Measure the diameter. The application of the adhesive 268 is performed, for example, on a test coating material. The test coating material is provided in the moving area of the unit suction head 120, although illustration is omitted. Of the plurality of types of application diameters planned for the dispensing unit 250 according to the diameter of the discharge pipe 332, the application time is larger than the minimum application diameter and more than the application time when the application having the diameter closest to the application diameter is obtained. Multiple application times from short application time to multiple application times longer than the maximum expected application diameter and the application time with the closest diameter to the application diameter. In other words, application is performed a plurality of times for each application time, the applied adhesive 268 is imaged, its diameter is measured, and an average value of the application diameter is obtained for each application time. The relationship between the average value of the coating diameters thus obtained and the coating time is shown in the graph of FIG.

  Then, the change rate of the coating time with respect to the coating diameter is obtained from the acquired average value of the coating diameter, and is stored in the RAM 606 together with the average value of the coating diameter and the coating time. Then, the diameter of the adhesive scheduled to be applied to the circuit board 32, the average value of the application diameter closest to the diameter, the application time when the application of the average diameter is obtained, and the expected application diameter The application time for obtaining the expected application diameter is calculated based on the rate of change of the application time with respect to the average diameter closest to. The necessary application time is determined by the discrete data of the application time and the application diameter, and the interpolation operation, and is stored in association with the diameter of the discharge pipe 332 and the expected application diameter, and the adhesive to the actual circuit board 32. It is read at the time of application of 268, and a positive pressure is supplied to the syringe 260 during the application time. By determining the application time of the adhesive 268 as described above, the adhesive 268 is applied to the set diameter with high accuracy.

  When the predetermined adhesive 268 is applied to the circuit board 32, the dispensing unit 250 is returned to the storage device 252. At this time, the unit suction head 120 is moved to the dispense unit storage device 252. For example, as shown in FIG. 13B, the dispense unit 250 is positioned at the unit storage / removal start position in the vertical direction, and the discharge port From the state where 336 is located slightly above the lower end of the opening 440, it is made to enter the accommodation hole 430 through the opening 440. Then, the dispensing unit 250 is lowered to the storage position while being positioned in the storage hole 430, the nozzle body 330 is fitted into the pressure application passage 520, and the cap 266 is placed on the support surface 434. The dispensing unit 250 is lowered in a state in which the positioning recess provided in the cap 266 and the positioning protrusion 436 provided on the support surface 434 are in phase with each other. As a result, the positioning protrusion 436 is fitted into the positioning recess, and the phase of the notch 350 of the cover 264 and the high-frequency oscillation switch 502 are matched as shown in FIG. The dispensing unit 250 is fitted into the storage hole 430 while avoiding interference. Even when the dispensing unit 250 is stored in the storage device 252, the remaining amount of the adhesive 268 in the syringe 260 is detected by the remaining amount detection device 452, which will be described later. In the dispensing unit 250 that has been removed from the dispensing unit storage device 252 and applied with the adhesive 268, the temperature of the adhesive 268 has changed and decreased, but the dispensing unit 250 is returned to the storage device 252 and the adhesive 268 is removed. Is controlled by the temperature controller 450.

The replacement of the two dispensing units 250 will be described.
If the types of the dispense units 250 stored in the two dispense unit storage devices 252 are the same, the number of points applied to one circuit board 32 is large, the temperature of the adhesive is lowered during the application, and the viscosity Is changed when the coating amount becomes high and an appropriate coating amount cannot be obtained. The replacement is performed based on the setting by the worker as described above. Also, if the types of the two dispense units 250 are different, the contents of the application change, such as the type of the adhesive 268 to be applied, the application diameter, and the number of application points applied by one application operation of the dispense unit 250. To be replaced. In any case, the dispensing unit 250 is changed during the application of the series of adhesives 268, and the application control program determines whether or not the dispensing unit 250 is to be replaced, and when replacement is necessary. Is a program to be replaced.

  The application of the adhesive 268 and the replacement of the dispensing unit 250 are performed by executing an application control program represented by a flowchart in FIG. Application of the adhesive 268 to the circuit board 32 is performed by executing step 1 of the program (hereinafter abbreviated as S1; the same applies to other steps). As described above, application is performed by controlling movement of the dispensing unit 250 in the X-axis, Y-axis, and Z-axis directions, supplying positive pressure to the syringe 260, stopping, and supplying and stopping negative pressure. Each time one application operation by the dispense unit 250 is completed, for example, S2 is executed each time the dispense unit 250 is raised to the ascending end position, and all the coatings scheduled for one circuit board 32 are performed. It is determined whether or not the adhesive 268 has been applied to the location. This determination is initially NO, S3 is executed, and it is determined whether or not the dispensing unit 250 is to be replaced. This determination is based on whether or not the replacement of the dispensing unit 250 is set if the two dispensing units 250 are of the same type, and if so, from when the dispensing unit 250 is removed from the storage device 252 to the present. This is performed depending on whether or not the time has exceeded the set time. After the start of the application control program, the time is measured, and it is determined whether or not the time has exceeded the set time. If the replacement of the dispensing unit 250 is not set, and even if the replacement is set, if the dispensing unit usage time has not reached the set time, the replacement is not necessary, and the determination result of S3 is NO The program execution returns to S1. If the two dispensing units 250 are different, the determination in S3 is made based on whether or not the content of application changes. This determination is made based on the application data stored in the RAM 606, and if the application contents do not change and the dispense unit 250 need not be replaced, the determination result of S3 is NO and the program execution is S1. Return.

  Even if the types of the two dispensing units 250 are the same or different, if the dispensing unit 250 needs to be replaced, the determination result in S3 is YES, S4 is executed, and the dispensing unit 250 is Be replaced. The dispense unit 250 actually sucked by the unit suction head 120 is moved to the empty dispense unit storage device 252 and stored in the storage hole 430, and the dispense unit 250 stored in another dispense unit storage device 252 is the unit. While being held by the suction head 120, it is taken out from the dispensing unit storage device 252 and application is resumed.

  When the application of all the adhesives 268 to one circuit board 32 is completed, the determination result in S2 is YES and the execution of the program is terminated. Thereafter, the electronic circuit component is mounted on the circuit board 32. After the mounting is completed, the adhesive 268 is applied to the circuit board 32 on which the electronic circuit component is next mounted. Is the same dispense unit 250 that is not the dispense unit 250 used for applying the last adhesive 268 to the previous circuit board 32, and the storage time in the storage device 252 is long, The dispensing unit 250 in which the temperature of the adhesive 268 is adjusted is used for application.

  If the two types of the dispense units 250 are the same, the dispense unit 250 is housed in the dispense unit storage device 252 by replacement, and the temperature of the adhesive 268 is adjusted to an appropriate temperature by the temperature control device 450. The adhesive 268 is applied to the substrate 32, and a predetermined amount of the adhesive 268 is applied with a set diameter by discharging the adhesive 268 for a set time. The application is not performed in the state where the temperature of the adhesive 268 is lowered, and the application is performed accurately. When the types of the two dispensing units 250 are the same, the number of replacements of the dispensing unit 250 may be set a plurality of times depending on the number of application points. In this case, the replacement is performed every time the dispense unit usage time reaches the set time. At this time, the usage time is newly measured for the replaced dispense unit, and the determination of S3 is performed. In addition, after the last change (when the number of changes is set only once, after one change), the determination result of S3 is configured to be NO. If the types of the two dispense units 250 are different, the adhesive 268 can be applied to the circuit board 32 in two different modes by replacement.

Acquisition of the remaining amount of the adhesive 268 in the syringe 260 will be described.
The remaining amount acquisition is performed, for example, when the dispensing unit 250 is taken out from the dispensing unit storage device 252, stored in the dispensing unit storage device 252, or when remaining amount acquisition is instructed. When the dispensing unit 250 is taken out from the storage device 252, the dispense unit 250 is raised from the unit storage position to the unit storage / removal start position, then moved horizontally, and is removed from the storage hole 430 through the opening 440. At that time, the detection state of the aluminum layer 282 of the float 278 by the high-frequency oscillation type proximity switch 502 changes, and the remaining amount of the adhesive 268 is acquired based on the change in the output signal of the switch 502. The same applies when the dispensing unit 250 is stored in the storage device 252. The detection of the remaining amount of the adhesive 268 may be performed only at the time of taking out from the storage device 252 of the dispensing unit 250 or at the time of storage, or may be performed at both. In which of the remaining amount detection is performed, for example, it may be set in advance or may be set based on an instruction of the operator.

The acquisition of the remaining amount when the dispensing unit 250 is taken out from the storage device 252 will be described.
When the accommodation amount of the adhesive 268 in the syringe 260 is full, as shown in FIG. 13A, in the state where the dispensing unit 250 is accommodated in the accommodation hole 430 and is located at the unit accommodation position, the aluminum layer 282 is switched to the switch 502. The output signal of the switch 502 is ON. From this state, when the dispensing unit 250 is sucked and raised by the unit suction head 120 and is raised to the unit storing / removing start position as shown in FIG. The output signal from the switch 502 is turned off. The moment when the output signal of the switch 502 changes from ON to OFF is the time when the lower edge of the aluminum layer 282 is detected, and the inside of the syringe 260 is based on the height position (vertical direction position) of the dispensing unit 250 when this lower edge is detected. The accommodation amount (remaining amount) of the adhesive 268 is acquired. The height position of the dispensing unit 250 is acquired based on the output value of the encoder provided in the lifting motor 152. Although the height position of the dispensing unit 250 is acquired based on the height position of the unit suction head 120, in this embodiment, the output value of the encoder at the time of detecting the lower edge and the adhesive 268 in the syringe 260 are obtained. The relationship with the storage amount is stored in advance in association with each other, and the remaining amount is acquired based on the data.

  Even if the adhesive 268 is applied and the remaining amount is reduced, as shown in FIG. 14A, in the state where the storage amount is still large, the aluminum layer is in the state where the dispensing unit 250 is located at the unit storage position. When the switch 502 is detected by the switch 502 and raised to the unit storage / removal start position, the aluminum layer 282 is detached from the detection unit 504, and the output signal of the switch 502 changes from ON to OFF as in the full state. If the remaining amount further decreases, as shown in FIG. 15 (a), even when the dispensing unit 250 is located at the unit storage position, it rises to the unit storage / removal start position as shown in FIG. 15 (b). Even in this state, the aluminum layer 282 is not detected by the switch 502 and the output signal of the switch 502 is OFF, but the aluminum layer 282 is detected by the switch 502 in the middle of the rise, and the output signal changes from OFF to ON. Change and turn off again. Both the upper and lower edges of the aluminum layer 282 are detected.

  If the remaining amount of the adhesive 268 further decreases, as shown in FIG. 16 (a), the aluminum layer 282 is detected from the detection unit 504 in a state where the dispense unit 250 is located at the unit storage position. Although the output signal of the switch 502 is OFF, the output signal of the switch 502 is turned ON while the dispensing unit 250 is being raised to the unit storing / removing start position, and the upper edge of the aluminum layer 282 is detected by the switch 502. Is done. As shown in FIG. 16 (b), even when the dispensing unit 250 is raised to the unit storing / removing start position, the aluminum layer 282 is at the height detected by the detecting unit 504, and the output signal of the switch 502 is It remains ON. The same applies to the case where the remaining amount of the adhesive 268 becomes 0 and the syringe 260 becomes empty as shown in FIGS.

As the adhesive 268 decreases in this manner, the float 278 descends, so that the edge of the aluminum layer 282 that changes the output signal of the high-frequency proximity switch 502 changes. When the remaining amount of the adhesive 268 is large, the output signal of the switch 502 is changed from ON to OFF by the lower edge of the aluminum layer 282, and when it is low, the output signal is changed from OFF to ON by the upper edge of the aluminum layer 282. In the intermediate state, after being changed from OFF to ON by the upper edge of the aluminum layer 282, it is changed from ON to OFF by the lower edge.
Therefore, when the remaining amount of the adhesive 268 is large and the signal only changes from ON to OFF when the dispensing unit 250 is taken out, the remaining amount is acquired based on the change. Further, when the remaining amount of the adhesive 268 decreases and the output signal of the switch 502 only changes from OFF to ON when the dispensing unit 250 is taken out, the remaining amount is acquired based on the change. The relationship between the output value of the encoder of the lifting motor 152 when the signal changes from OFF to ON and the remaining amount of the adhesive 268 in the syringe 260 is stored in advance in association with each other, and the remaining value based on the data is stored. The quantity is acquired. While the remaining amount of adhesive 268 is decreasing, the remaining amount is acquired based on the change of the output signal from ON to OFF until the remaining amount of adhesive 268 is halved. The remaining amount is acquired based on the change of the signal from OFF to ON.

  When the dispensing unit 250 is stored, the aluminum layer 282 is detected by the switch 502 when the dispensing unit 250 is lowered from the state positioned at the unit storing / removing start position to the unit storing position, and the output signal changes. The output signal is opposite to that when the dispensing unit 250 is taken out, and the remaining amount is large. When the remaining amount is acquired based on the position in the direction and the remaining amount is less than half, the output signal changes from ON to OFF and the vertical position of the unit suction head 120 (dispensing unit 250) at that time The remaining amount is acquired based on.

  When the remaining amount of the adhesive 268 is acquired based on the instruction, the remaining amount acquisition instruction is issued by an operator or automatically by the control computer 610, for example. For example, the remaining amount is taken when a preset condition is satisfied, for example, when an adhesive is applied to a set number of circuit boards 32. When the setting condition is satisfied, the remaining amount may be acquired when the dispensing unit 250 is stored in the storage device 252 or may be acquired when the dispensing unit 250 is taken out from the storage device 252. If the setting condition is satisfied while the dispensing unit 250 is being held by the unit suction head 120 and the adhesive 268 is being applied, the remaining amount will remain when the dispensing unit 250 is stored in the storage device 252 next time. Is acquired. If the dispensing unit 250 is stored in the storage device 252, the remaining amount is acquired when the dispensing unit 250 is next removed from the storage device 252. Even during application, the application may be interrupted and stored in the storage device 252 to obtain the remaining amount.

  Various measures are taken depending on the remaining amount of adhesive 268 acquired. In order to simplify the description, the case where the adhesive 268 is applied by one dispensing unit 250 will be described. For example, if the remaining amount is displayed on the display screen 626 and the remaining amount is equal to or less than the set amount, A warning that the remaining amount is low is displayed. The warning may be displayed together with the remaining amount of the adhesive 268, or only the warning may be displayed. The display device 624 is an embodiment of a notification device or a warning device, and the warning may be performed by notification means other than the display, for example, by sounding a buzzer, lighting or blinking a lamp, announcement by voice, or the like.

  The set amount for determining that the remaining amount of the adhesive 268 has decreased as a warning is given, for example, in a state where there is still a margin before the adhesive 268 is completely removed. No. 32 is set to an amount that gives a warning in a state where the adhesive 268 can be applied. Therefore, the operator compares the number of the remaining circuit boards 32 on which the electronic circuit components are not yet mounted with the remaining amount of the adhesive 268 and finishes mounting the electronic circuit components on the series of circuit boards 32. If the adhesive 268 is sufficient for application to the remaining circuit board 32 and it is not necessary to replenish, the replenishment is not performed. Further, when the adhesive 268 is insufficient, the replenishment is performed. The operator determines that the adhesive 268 is sufficient for application to the remaining circuit board 32, and even if the replenishment is not performed, if the adhesive 268 is insufficient, the worker will not display the remaining adhesive 268. Recognize deficiencies based on volume and warning and shut down the system. The controller 600 automatically determines whether or not the adhesive 268 is replenished based on the remaining amount of the adhesive 268 and the number of remaining circuit boards 32 and determines whether or not to stop the system, and the determination result is notified. The operator may be supplied with the adhesive 268, or the system may be automatically stopped. When the adhesive 268 is alternately applied by the two dispensing units 250, the remaining amount of the adhesive 268 is similarly displayed. In particular, when the types of the two dispensing units 250 are the same, the operator Can perform the replenishment work of the adhesive 268 with more margin.

  As is clear from the above description, in this system, the part of the control device 600 that executes S3 and S4 constitutes a replacement control unit. Further, the portion of the float 278 provided with the aluminum layer 282 constitutes an indicator part, the upper edge thereof constitutes the upper detected part, the lower edge constitutes the lower detected part, and the encoder of the lifting motor 152 is The part for obtaining the remaining amount of the adhesive 268 based on the output signal of the high frequency oscillation proximity switch 502 of the control device 600 and the position of the unit suction head 120 in the vertical direction constitutes the remaining amount obtaining unit. The portion that configures and displays a warning on the display screen 626 according to the remaining amount constitutes a low remaining amount warning unit that is a remaining amount corresponding processing unit, and depending on the remaining amount, it is based on an instruction from the operator or automatically The part that stops the system immediately constitutes a system stop unit that is a remaining amount corresponding processing unit. Further, the portion of the control device 600 that controls the height of the leakage prevention pressure applied to the discharge port 336 of the discharge nozzle 262 according to the remaining amount of the adhesive 268 constitutes the pressure control device. Further, the positive pressure source 186, the switching device 188, and the switching device 188 of the control device 600 are controlled, and the portion that supplies positive pressure from the positive pressure source 186 to the positive pressure / negative pressure supply passage 160 constitutes a discharge device. As shown in the time chart of FIG. 10 of the apparatus 600, the lifting device 122 and the switching device 188 are arranged so that the threading of the adhesive 268 at the discharge nozzle 262 is interrupted when the adhesive 268 is applied to the circuit board 32. The part to be controlled constitutes a yarn pulling prevention unit, controls the unit moving device 82, the lifting device 122 and the switching device 188, and moves the dispensing unit 250 in the horizontal direction, lifts and discharges the adhesive 268 in parallel. The part constitutes a movement / application synchronous control unit. Further, the negative pressure of the unit suction negative pressure chamber 212 detected by the negative pressure sensor 619 serving as the unit suction negative pressure chamber negative pressure acquisition unit and the negative pressure sensor 619 of the control device 600 is compared with a set value, and the dispensing unit 250 is compared. The determination unit that determines whether or not the negative pressure necessary for the adsorption is obtained constitutes a syringe holding state detection unit that detects whether or not the syringe 260 and the cover 264 are accurately held by the cap 266. .

  Only one dispense unit storage device 252 may be held by the feeder holding device 42. In this case, the number of dispensing units 250 used for coating is one. However, if the contents of coating performed on all the adhesive coating portions of the circuit board 32 are the same, the number of dispensing units 250 is one. That's it. Moreover, application | coating may be performed at once to all the adhesive application locations, and may be performed in multiple times. When the application is performed in a plurality of times, the mounting of the electronic circuit components is also performed in a plurality of times, and the application and the mounting of the electronic circuit components are alternately performed. If it is divided into a plurality of times, there is an advantage that the dispensing unit 250 is accommodated in the accommodating device 252 and the temperature of the adhesive 268 accommodated in the syringe 260 is adjusted while the electronic circuit component is mounted. In addition, for example, there is an advantage that a change in properties of the adhesive 268 applied to the circuit board 32 can be avoided. For example, depending on the nature of the adhesive 268, if the adhesive 268 applied to the circuit board 32 is not mounted with an electronic circuit component for a long time, the adhesive 268 may flow and change its shape, May dry and harden. If the application of the adhesive 268 and the mounting of the electronic circuit component are alternately performed, the number of coatings performed at one time is small, and the electronic circuit component may be mounted before the properties of the applied adhesive 268 change. it can. Whether the application is performed all at once or divided into a plurality of times, for example, is set by an operator, and when divided into a plurality of times, the number of application points for each time and the electronic circuit component for each time Is also set. These may be automatically set based on the properties of the adhesive 268, the number of coating points, and the like.

  If the operator sets a mode in which the application is performed in a plurality of times, for example, an application / mounting control program shown in FIG. 18 is executed. This program is stored in the ROM of the control computer. In S11 of the application / control program, the dispensing unit 250 is held by the unit suction head 120. At this time, if the unit suction head 120 holds the mounting head 80, it is returned to the mounting unit storage device 20, and the dispensing unit 250 is held. Then, S12 is executed, the dispensing unit 250 is moved to the circuit board 32, and the adhesive 268 is applied. After the application of the adhesive 268 to one adhesive application location, S13 is executed to determine whether or not one application has been completed. This determination is made based on whether or not the cumulative value of the application points has reached a preset application point. If not, the determination result in S13 is NO and S12 is executed.

  When the cumulative number of application points reaches the set number and one application is completed, the determination result in S13 is YES, S14 is executed, the dispensing unit 250 is stored in the storage device 252, and the mounting unit 80 Is held by the unit suction head 120. Then, S15 is executed, and the mounting unit 80 mounts the electronic circuit component on the circuit board 32. After mounting one or a plurality of electronic circuit components held by the mounting unit 80, S16 is executed to determine whether or not one mounting is completed. If the electronic circuit component is mounted in at least one preset position and one mounting is not completed, the determination result in S16 is NO and S15 is executed. S15 and S16 are repeatedly executed until one mounting is completed, and when one mounting is completed, the determination result of S16 is YES and S17 is executed, and all of the circuit boards 32 scheduled for one time are executed. It is determined whether or not the mounting of the electronic circuit components is completed. If not completed yet, the determination result in S17 is NO and the execution of the program returns to S11, the dispensing unit 250 is held by the unit suction head 120, and the adhesive 268 is applied. A portion of the control device 600 that executes S11 to S16 constitutes an application / mounting alternate execution control unit.

  In addition, when the high-viscosity fluid application system includes a plurality of dispensing units and applies high-viscosity fluid using them, the application and the mounting of the electronic circuit components may be alternately performed.

  Also, different types of high-viscosity fluids are accommodated in the syringes of the plurality of dispensing units, for example, an adhesive is accommodated in one of the dispensing units, and cream-like solder is accommodated in another one. Two types of high-viscosity fluid may be applied by one application system. Thus, for example, an adhesive is applied to the circuit board, electronic circuit components having electrodes on both the upper and lower surfaces are mounted, cream solder is applied to the upper electrode of the electronic circuit component, and the electrode is provided only on the lower surface. Another electronic circuit component can be mounted.

  Furthermore, when applying a highly viscous fluid using a plurality of dispensing units of the same type, the replacement condition of the dispensing unit depends on, for example, the number of circuit boards in addition to the dispensing unit usage time reaching the set time. It may be set. For example, when the number of application points of high-viscosity fluid to one circuit board is small and the use time of the dispensing unit per circuit board is short, the temperature change of the high-viscosity fluid due to use, for example, temperature decrease is small. Even if the time for returning the temperature to the storage device and adjusting the temperature is short, the temperature can be quickly adjusted to an appropriate temperature, and can be continuously used for applying a highly viscous fluid to a plurality of circuit boards.

  Further, when the high-viscosity fluid is applied using a plurality of dispense units of the same type, the replacement condition of the dispense unit may be that the remaining amount of the high-viscosity fluid has decreased below a set amount. In this case, one of the plurality of dispensing units is continuously used for applying the high-viscosity fluid until the remaining amount is reduced below the set amount.

  Furthermore, the dispensing unit may be moved up and down in parallel with the horizontal movement and stopped at the lower end position.

  In addition, the temperature sensor and the overheat sensor of the temperature control device may serve as the other one. The temperature of the temperature adjustment fluid may be detected before temperature adjustment, for example, before a temperature sensor is provided between the temperature adjustment heater and the temperature adjustment head and supplied to the temperature adjustment head.

  Further, a computer may be provided in the dispensing unit storage device to control the temperature of the temperature adjusting air, control the pressure applied to the discharge port of the discharge nozzle, and acquire the remaining amount of the highly viscous fluid. When a computer is provided in the dispensing unit storage device or the table, it is connected to a computer of a control device that controls the entire system so that communication can be performed.

  Further, the attachment unit of the dispense unit storage device constituted by the table may be shared by a plurality of dispense unit storage devices. A plurality of storage device main bodies may be attached to one table, and a dispense unit may be stored in each.

Furthermore, the feeder-type component supply device is not limited to a device that is moved by a carriage, and may be a device in which a feeder holding device is fixedly provided in the system body and the feeder is detachably held.
In addition, the dispense unit storage device is not limited to being held by the feeder holding device, and may be provided at a location within the moving area of the moving device and at a location different from the feeder holding device. It may be provided.

1 is a plan view schematically showing an electronic circuit assembly system including an adhesive application system and an electronic circuit component mounting system according to an embodiment of the claimable invention. It is a side view which illustrates roughly the attachment or detachment by the trolley | bogie of a feeder type component supply apparatus in the said electronic circuit component mounting system. It is a front view which shows the part attached to the bed of the feeder holding stand of the said feeder type component supply apparatus. It is a front view (partial cross section) which shows the state by which the revolver type mounting unit of the said electronic circuit component mounting system was hold | maintained at the unit suction head. It is a front view (partial cross section) which shows the state by which the dispensing unit of the said adhesive agent coating system was hold | maintained at the said unit suction head. It is a side view (partial cross section) which shows the state by which the said dispense unit was accommodated in the dispense unit accommodating apparatus. It is a top sectional view showing the state where the above-mentioned dispense unit was stored in the dispense unit storage device. It is a bottom sectional view showing the state where the cap was put on the cover of the dispensing unit. It is a block diagram which shows roughly the control apparatus which controls the said electronic circuit assembly system. It is a time chart which shows the timing of the horizontal movement of the dispensing unit in the said adhesive agent coating system, raising / lowering, and application | coating. It is a graph which shows the relationship between the application diameter acquired in order to set the application time of an adhesive agent, and application time. It is a flowchart which shows the application | coating control program memorize | stored in ROM of the control computer which comprises the main body of the said control apparatus. It is a figure explaining remaining amount acquisition in case the accommodation capacity of the adhesive agent in the syringe of the said dispensing unit is full. It is a figure explaining remaining amount acquisition in case the accommodation amount of the adhesive agent in the said syringe has decreased a little. It is a figure explaining remaining amount acquisition in case the accommodation amount of the adhesive agent in the said syringe further reduces. It is a figure explaining remaining amount acquisition in case the accommodation amount of the adhesive agent in the said syringe reduces significantly. It is a figure explaining remaining amount acquisition in case the above-mentioned syringe becomes empty. It is a flowchart which shows the application | coating and mounting | wearing control program memorize | stored in ROM of the control computer which comprises the main body of the control apparatus which controls the electronic circuit assembly system which has an adhesive agent coating system which is another aspect.

Explanation of symbols

  12: Feeder type component supply device 32: Circuit board 42: Feeder holding device 44: Feeder holding table 80: Mounting unit 82: Unit moving device 122: Lifting device 250: Dispensing unit 252: Dispensing unit storage device 260: Syringe 262: Ejection Nozzle 264: Cover 268: Adhesive 278: Float 336: Discharge port 450: Temperature control device 452: Remaining amount detection device 454: Pressure application device 458: Temperature control head 460: Temperature control air supply device 500: Detection head 516: Pressure application head 518: Air supply device 600: Control device

Claims (6)

A dispensing unit including a syringe containing a highly viscous fluid and a discharge nozzle communicating with the internal space of the syringe;
A unit holding head for detachably holding the dispensing unit;
A moving device for moving the unit holding head to an arbitrary position in at least one plane;
A discharge device for discharging the highly viscous fluid in the syringe from the discharge nozzle;
A storage device for storing the dispensing unit removed from the unit holding head;
A high-viscosity fluid application system comprising: a temperature control head; and a temperature control device that adjusts the temperature of the high-viscosity fluid in the dispensing unit to a set temperature by the temperature control head,
(a) at least the temperature control head of the temperature control device is provided in the storage device, and not provided in the dispense head and the unit holding head; and (b) the moving device includes the unit holding portion. An opening device that includes an elevating device that moves in a vertical direction; an opening that is continuously open upward and laterally is formed in an upper portion of a storage portion that stores the dispensing unit of the storage device; The dispensing unit is configured to pass through the opening continuously opened upward and laterally by both the lifting of the unit holding head by the lifting device and the movement of the moving device in the direction parallel to the one plane. A high-viscosity fluid application system characterized in that it can be detached from a storage part .   A feeder holding device having a plurality of feeder holding portions each holding a plurality of electronic circuit parts and holding a plurality of feeders that are sequentially supplied one by one, the storage device being held by the feeder holding device; and 2. The highly viscous fluid according to claim 1, wherein the unit holding head selectively holds a mounting unit that takes out the electronic circuit component from the plurality of feeders and mounts the electronic circuit component on the circuit board, and the dispensing unit. Application system.   3. The apparatus according to claim 1, further comprising a control device that includes a plurality of the dispensing units and the storage devices, and includes a replacement control unit that alternately holds the plurality of dispensing units on the unit holding head. The highly viscous fluid application system described.   The plurality of dispensing units have the same cross-sectional area of the discharge ports of the discharge nozzles, the number of discharge nozzles communicating with the common internal space of the syringe, and the type of high-viscosity fluid accommodated in the syringe. The high-viscosity fluid application system according to claim 3, further comprising: a same-type dispensing unit, wherein the replacement control unit includes a same-type unit replacement control unit that replaces the plurality of same-type units.   The same-type unit replacement control unit has a unit continuous use time in which the dispense unit is continuously held by the unit holding head, and a high-viscosity fluid is stored without the dispense unit being stored in the storage device. At least one of the number of continuous application points, which is the number of points to be applied, and the number of continuous application points, which is the number of circuit boards to which high-viscosity fluid is applied without the dispensing unit being stored in the storage device, is equal to or greater than a set value. The high-viscosity fluid application system according to claim 4, further comprising: a continuous usage amount-based replacement control unit that replaces a plurality of similar units on the condition.   The plurality of dispensing units includes at least one of a cross-sectional area of the discharge port of the discharge nozzle, the number of the discharge nozzles communicating with the common internal space of the syringe, and a type of the highly viscous fluid accommodated in the syringe. A plurality of different types of dispensation units, and the replacement control unit applies a high-viscosity fluid to be applied to an object to be applied, a high-viscosity fluid to be applied, and a high-viscosity fluid that is applied simultaneously by a single application And a dissimilar unit replacement control unit that replaces the dispensing unit held by the unit holding head in accordance with at least one of the types of the highly viscous fluid to be applied to the application object. The highly viscous fluid application system according to any one of 3 to 5.

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