JPH0831677B2 - Potting device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a potting device for potting a circuit element on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, a potting apparatus has a nozzle of a dispenser unit which is fixed so as to face a printed circuit board which is conveyed by a conveying path for potting. Therefore, when the printed circuit board moves on the transport path and stops at a predetermined position, potting resin is dropped from the nozzle onto the circuit element by an appropriate amount to perform potting processing, and this is repeated. When the potting resin stored in the dispenser unit is used up, the operation is temporarily stopped and the potting resin is replenished.

[0003]

However, in the conventional device,
Since only one dispenser unit is provided, when the potting resin runs out in the unit,
You have to stop the work and refill the potting resin in the same unit. However, unless the refilled potting resin is heated to a predetermined temperature and a uniform temperature, potting treatment of desired quality cannot be obtained. For this reason, it takes time to warm the potting resin to a predetermined temperature, and when the potting resin is replenished, the operation of the potting device must be stopped for a period including this preheating time, which reduces the operating rate. There was a problem that was inevitable.

An object of the present invention is to provide a potting device which can minimize the operation stop time of the potting device and improve the operating rate.

[0005]

A feature of the present invention is that it comprises a printed circuit board, a conveying path, a mounting frame, a pair of dispenser units, and a driving means, and the printed circuit board is mounted with circuit elements to be potted. , The transport path is
The printed circuit board is transported, the mounting frame is rotatable in a plane, and is disposed on a side portion of the transport path, and the pair of dispenser units preheats the potting resin contained therein. Means and is attached to the mounting frame at a position equidistant from the center of rotation, the pair of dispenser units can drop potting resin on the printed circuit board on the transport path, the drive means, By rotating the mounting frame, the pair of dispenser units is switched and driven, and one selected from the dispenser units is switched and installed at a position facing the circuit element of the printed circuit board, and the print is performed. The dispenser unit, which is not facing the circuit element on the board, has a po Recruitment and preheating the coating resin is at is possible.

[0006]

Therefore, while one of the paired dispenser units selected is potting on the printed circuit board, the other dispenser unit is replenished with potting resin and preheated to be ready for potting. I will let you. When the potting resin in the dispenser unit under operation runs out, the drive unit causes the mounting frame to rotate in a plane, and the unit in standby is moved to a position facing the circuit element of the printed circuit board on the transport path. Immediately after starting the potting process by this unit, the potting resin is replenished and preheated to the unit that has moved to the standby position. This is repeated in sequence without a break.

[0007]

EXAMPLE A conveying path 1 is constituted by conveying rollers 3 and 3 which are rotatably supported inside the upper portions of side plates 2 and 2, and restraining plates 4 and 4 which are provided at the upper ends of both side plates. I am doing it. The printed circuit board S on which the circuit elements to be potted are mounted is carried by the carrying roller 3 along the lower surface of the holding plate 4.

A mounting frame 5 is rotatably arranged in a plane on the side of the conveying path 1, and a pair of dispenser units 6 and 6 are mounted on both sides of the mounting frame 5.
By rotating the mounting frame 5, one of the pair of dispenser units 6 and 6 is selected and can face the circuit element of the printed circuit board S on the transport path 1. That is, the mounting frame 5 is mounted on the mounting plate 8 mounted on the base 7 with bolts 9, 9
Fixed by The drive shaft 10 of the drive means penetrates through the center hole 7a of the base 7, and the tip portion 10a thereof is non-rotatably fitted in the center hole 8a of the mounting plate 8. A ball bearing 7b is interposed between the center hole 7a of the base 7 and the mounting plate 8, and the mounting plate 8 is rotationally driven by the drive shaft 10.
The mounting frame 5 is rotatable with respect to the base 7. On the mounting frame 5, at a position equidistant from the center of rotation,
Two mounting portions 5a, 5a to which a pair of dispenser units 6, 6 are respectively mounted are erected integrally.

The pair of dispenser units 6 and 6 are
With the same construction, a preheater 12 for preheating the potting resin P is provided along the inner circumference of the holding frame 11, and a storage container 13 for the potting resin P is fixed inside thereof. The storage container 13 has a bottom plate 1 at the lower end.
4 and the holding plate 15. Bottom plate 14
A nozzle 16 is provided at the center of the bottom surface of the nozzle, and a nozzle hole 16a for guiding the potting resin P in the storage container 13 is provided. A compressor 17, which is an air pressurizing device, is provided at the upper end of the storage container 13.

The structure for attaching the pair of dispenser units 6 to the attachment frame 5 will be described.

The inverted L-shaped sliding portion 18 protruding from the outer peripheral portion of the holding frame 11 is inserted into the sliding groove of the mounting portion 5a of the mounting frame 5 and is vertically movable. The upper end of the sliding portion 18 can face the upper surface of the mounting portion 5a, and the adjustment screw 1
9 is screwed. The lower end surface of the screw 19 contacts the upper surface of the mounting portion 5a to position the dispenser units 6 and 6 in the vertical direction. In addition, the bracket 20 attached to the side surface of the sliding portion 18 has a vertical guide groove 2
0a is provided, and the fixing screw 21 is provided in the guide groove 20a.
And is screwed into the mounting portion 5a to fix the dispenser unit 6 to the mounting frame 5 in a vertically adjustable position.

Next, the method of using the potting device of the present invention and the operation associated therewith will be described. The height of the dispenser unit 6 is from the circuit element to the nozzle 16
Since it is desirable to have a height that optimizes the distance to the lower end of the dispenser unit, the fixing screw 21 is loosened before starting the work, and the height of the dispenser unit is adjusted by advancing and retracting the adjusting screw 19, and then the fixing screw 21 is adjusted. Tighten and fix in place.

Therefore, the insides of the dispenser units 6 and 6 are preheated to a predetermined temperature by the preheater 12 to keep the entire potting resin P in the storage container 13 at a predetermined temperature and a uniform temperature. Next, the mounting frame 5 is rotated in a plane by the driving means 10, and the dispenser unit 6 on one side is rotated.
Are moved to the upper surface of the transport path 1. When the printed circuit board S is transported by the transport path 1 and the circuit element is located directly below the nozzle 16, the transportation of the printed circuit board S is stopped. Therefore, the air pressure in the storage container 13 is raised by the compressor 17 and an appropriate amount of the potting resin P is dropped to perform the potting process. The printed circuit board S is intermittently conveyed, and the potting process is performed on the circuit elements on the printed circuit board S one after another.

When the potting resin P in the storage container 13 is exhausted, the transportation of the printed circuit board S is once stopped, the mounting frame 5 is rotated 180 degrees in a plane by the driving means 10, and the other dispenser unit 6 is transported to the transportation path 1. Move to the upper surface facing. And potting processing is performed like the above. During this time, one of the dispenser units 6 is replenished with potting resin P, preheated by the preheater 12 in the same manner as described above, and kept waiting for the next work.

[0015]

According to the present invention, since a pair of dispenser units is provided, while potting work is being performed by one of the selected dispenser units, the other dispenser unit is replenished with potting resin and then predetermined. It can be preheated to a uniform temperature and kept on standby. For this reason, if there is no potting resin in the dispenser unit being used, it is possible to immediately replace it with a spare dispenser unit and continue working. Contribute to improving the operating rate of.

[Brief description of drawings]

FIG. 1 is a partially sectional front view.

[Explanation of symbols]

 1 Transport Path 5 Mounting Frame 6 Dispenser Unit 10 Drive Means 12 Preheating Means (Preheater) S Printed Circuit Board P Potting Resin

Continuation of the front page (56) Reference JP-A-61-171564 (JP, A) JP-A-63-178582 (JP, A) Actually-opened Shou 62-48478 (JP, U) JP-B-62-43751 (JP) , B2)

Claims (1)

[Claims] 1. A printed circuit board, a conveyance path, a mounting frame,
A circuit board to be potted is mounted on the printed circuit board, the transport path transports the printed circuit board, and the mounting frame is planar. The pair of dispenser units are provided with preheating means for preheating built-in potting resin, and the mounting frame is equidistant from the center of rotation. The pair of dispenser units are attached, the potting resin can be dripped onto the printed circuit board on the transport path, and the drive means switches the pair of dispenser units by rotating the mounting frame. Then, one selected from this dispenser unit is used as the circuit element of the printed circuit board. It is intended to switching installation in a position direction, potting and wherein the the said dispenser unit in a position that is not opposite to the circuit elements of the printed circuit board, it is possible to supplement and preheating of the potting resin.