JP4869593B2 - コンプライアント支持構造体を有する微細加工超音波トランスデューサセル - Google Patents
コンプライアント支持構造体を有する微細加工超音波トランスデューサセル Download PDFInfo
- Publication number
- JP4869593B2 JP4869593B2 JP2004380343A JP2004380343A JP4869593B2 JP 4869593 B2 JP4869593 B2 JP 4869593B2 JP 2004380343 A JP2004380343 A JP 2004380343A JP 2004380343 A JP2004380343 A JP 2004380343A JP 4869593 B2 JP4869593 B2 JP 4869593B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- membrane
- wall
- support structure
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012528 membrane Substances 0.000 claims description 86
- 239000000758 substrate Substances 0.000 claims description 50
- 230000002093 peripheral effect Effects 0.000 claims description 47
- 239000003990 capacitor Substances 0.000 claims description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 13
- 210000004027 cell Anatomy 0.000 description 88
- 239000000463 material Substances 0.000 description 57
- 239000010408 film Substances 0.000 description 20
- 238000000151 deposition Methods 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 10
- 229910052581 Si3N4 Inorganic materials 0.000 description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000005459 micromachining Methods 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 241000208967 Polygala cruciata Species 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 210000000170 cell membrane Anatomy 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000002604 ultrasonography Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 241000723353 Chrysanthemum Species 0.000 description 2
- 235000005633 Chrysanthemum balsamita Nutrition 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000001614 effect on membrane Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000026683 transduction Effects 0.000 description 1
- 238000010361 transduction Methods 0.000 description 1
- -1 tungsten Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/002—Electrostatic motors
- H02N1/006—Electrostatic motors of the gap-closing type
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Micromachines (AREA)
- Transducers For Ultrasonic Waves (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/748,920 | 2003-12-29 | ||
| US10/748,920 US7030536B2 (en) | 2003-12-29 | 2003-12-29 | Micromachined ultrasonic transducer cells having compliant support structure |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005193374A JP2005193374A (ja) | 2005-07-21 |
| JP2005193374A5 JP2005193374A5 (enExample) | 2008-02-14 |
| JP4869593B2 true JP4869593B2 (ja) | 2012-02-08 |
Family
ID=34710999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004380343A Expired - Fee Related JP4869593B2 (ja) | 2003-12-29 | 2004-12-28 | コンプライアント支持構造体を有する微細加工超音波トランスデューサセル |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US7030536B2 (enExample) |
| JP (1) | JP4869593B2 (enExample) |
| DE (1) | DE102004063740A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020100305A1 (de) | 2019-01-15 | 2020-07-16 | Hitachi, Ltd. | Ultraschallwandler, verfahren zu seiner herstellung und ultraschall-bildgebungsvorrichtung |
Families Citing this family (118)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7030536B2 (en) * | 2003-12-29 | 2006-04-18 | General Electric Company | Micromachined ultrasonic transducer cells having compliant support structure |
| US7285897B2 (en) * | 2003-12-31 | 2007-10-23 | General Electric Company | Curved micromachined ultrasonic transducer arrays and related methods of manufacture |
| JP2007528153A (ja) * | 2004-02-06 | 2007-10-04 | ジョージア テック リサーチ コーポレイション | Cmutデバイス及び製造方法 |
| US7646133B2 (en) * | 2004-02-27 | 2010-01-12 | Georgia Tech Research Corporation | Asymmetric membrane cMUT devices and fabrication methods |
| WO2005084284A2 (en) * | 2004-02-27 | 2005-09-15 | Georgia Tech Research Corporation | Multiple element electrode cmut devices and fabrication methods |
| US7612483B2 (en) | 2004-02-27 | 2009-11-03 | Georgia Tech Research Corporation | Harmonic cMUT devices and fabrication methods |
| US8309428B2 (en) * | 2004-09-15 | 2012-11-13 | Sonetics Ultrasound, Inc. | Capacitive micromachined ultrasonic transducer |
| US7888709B2 (en) * | 2004-09-15 | 2011-02-15 | Sonetics Ultrasound, Inc. | Capacitive micromachined ultrasonic transducer and manufacturing method |
| US8658453B2 (en) * | 2004-09-15 | 2014-02-25 | Sonetics Ultrasound, Inc. | Capacitive micromachined ultrasonic transducer |
| US7489593B2 (en) * | 2004-11-30 | 2009-02-10 | Vermon | Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor |
| US7037746B1 (en) * | 2004-12-27 | 2006-05-02 | General Electric Company | Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane |
| EP1883956A4 (en) * | 2005-05-18 | 2011-03-23 | Kolo Technologies Inc | BY-THE-WAFER CONNECTION |
| EP1881822A2 (en) * | 2005-05-18 | 2008-01-30 | Kolo Technologies, Inc. | Methods for fabricating micro-electro-mechanical devices |
| US7589456B2 (en) * | 2005-06-14 | 2009-09-15 | Siemens Medical Solutions Usa, Inc. | Digital capacitive membrane transducer |
| WO2006134580A2 (en) | 2005-06-17 | 2006-12-21 | Kolo Technologies, Inc. | Micro-electro-mechanical transducer having an insulation extension |
| US20070038088A1 (en) * | 2005-08-04 | 2007-02-15 | Rich Collin A | Medical imaging user interface and control scheme |
| US8764664B2 (en) | 2005-11-28 | 2014-07-01 | Vizyontech Imaging, Inc. | Methods and apparatus for conformable medical data acquisition pad and configurable imaging system |
| WO2007115283A2 (en) * | 2006-04-04 | 2007-10-11 | Kolo Technologies, Inc. | Modulation in micromachined ultrasonic transducers |
| US7745973B2 (en) * | 2006-05-03 | 2010-06-29 | The Board Of Trustees Of The Leland Stanford Junior University | Acoustic crosstalk reduction for capacitive micromachined ultrasonic transducers in immersion |
| JP4979283B2 (ja) * | 2006-06-29 | 2012-07-18 | 株式会社日立製作所 | 半導体装置の製造方法および半導体装置 |
| WO2008038454A1 (en) * | 2006-09-28 | 2008-04-03 | Hitachi, Ltd. | Ultrasonic probe and ultrasonic imaging device |
| JP4271253B2 (ja) * | 2006-10-11 | 2009-06-03 | オリンパスメディカルシステムズ株式会社 | 超音波トランスデューサ、超音波トランスデューサの製造方法、及び超音波内視鏡 |
| CN101772383B (zh) * | 2007-07-31 | 2011-11-02 | 皇家飞利浦电子股份有限公司 | 具有高k电介质的cmut |
| US8792658B2 (en) * | 2007-08-30 | 2014-07-29 | General Monitors, Inc. | Techniques for protection of acoustic devices |
| WO2009039640A1 (en) * | 2007-09-28 | 2009-04-02 | University Of Toronto | A system, apparatus and method for applying mechanical force to a material |
| US7605466B2 (en) | 2007-10-15 | 2009-10-20 | General Electric Company | Sealed wafer packaging of microelectromechanical systems |
| US7915696B2 (en) * | 2007-10-24 | 2011-03-29 | General Electric Company | Electrical connection through a substrate to a microelectromechanical device |
| CN101874343B (zh) * | 2007-12-03 | 2014-09-10 | 科隆科技公司 | 静电换能器阵列的封装和连接 |
| EP2218094A1 (en) * | 2007-12-03 | 2010-08-18 | Kolo Technologies, Inc. | Through-wafer interconnections in electrostatic transducer and array |
| JP5337812B2 (ja) * | 2007-12-03 | 2013-11-06 | コロ テクノロジーズ インコーポレイテッド | マイクロマシン加工超音波変換器における可変動作電圧 |
| US8767514B2 (en) * | 2007-12-03 | 2014-07-01 | Kolo Technologies, Inc. | Telemetric sensing using micromachined ultrasonic transducer |
| US8345513B2 (en) * | 2007-12-03 | 2013-01-01 | Kolo Technologies, Inc. | Stacked transducing devices |
| WO2009073562A1 (en) * | 2007-12-03 | 2009-06-11 | Kolo Technologies, Inc. | Dual-mode operation micromachined ultrasonic transducer |
| CN101868185B (zh) * | 2007-12-03 | 2013-12-11 | 科隆科技公司 | 用于超声系统的cmut封装 |
| US8850893B2 (en) | 2007-12-05 | 2014-10-07 | Valtion Teknillinen Tutkimuskeskus | Device for measuring pressure, variation in acoustic pressure, a magnetic field, acceleration, vibration, or the composition of a gas |
| FI20075879A0 (fi) * | 2007-12-05 | 2007-12-05 | Valtion Teknillinen | Laite paineen, äänenpaineen vaihtelun, magneettikentän, kiihtyvyyden, tärinän ja kaasun koostumuksen mittaamiseksi |
| US20090190254A1 (en) * | 2008-01-29 | 2009-07-30 | Seagate Technology Llc | Micromachined mover |
| EP2254476A4 (en) * | 2008-02-29 | 2013-10-30 | Stc Unm | ULTRASONIC THERAPEUTIC-ON-CHIP TRANSDUCER WITH INTEGRATED ULTRASONIC IMAGING SYSTEM, AND METHODS OF MAKING AND USING THE TRANSDUCER |
| JP5376982B2 (ja) * | 2008-06-30 | 2013-12-25 | キヤノン株式会社 | 機械電気変換素子と機械電気変換装置および機械電気変換装置の作製方法 |
| US8828520B2 (en) * | 2008-07-01 | 2014-09-09 | Alcatel Lucent | Micro-posts having improved uniformity and a method of manufacture thereof |
| US9310339B2 (en) * | 2008-07-30 | 2016-04-12 | The Boeing Company | Hybrid inspection system and method employing both air-coupled and liquid-coupled transducers |
| US8315125B2 (en) * | 2009-03-18 | 2012-11-20 | Sonetics Ultrasound, Inc. | System and method for biasing CMUT elements |
| CN101898743A (zh) * | 2009-05-27 | 2010-12-01 | 漆斌 | 微加工超声换能器 |
| US8451693B2 (en) * | 2009-08-25 | 2013-05-28 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined ultrasonic transducer having compliant post structure |
| US8531919B2 (en) * | 2009-09-21 | 2013-09-10 | The Hong Kong Polytechnic University | Flexible capacitive micromachined ultrasonic transducer array with increased effective capacitance |
| IT1397115B1 (it) * | 2009-11-27 | 2012-12-28 | St Microelectronics Rousset | Struttura risonante microelettromeccanica con migliorate caratteristiche elettriche. |
| US9079494B2 (en) | 2010-07-01 | 2015-07-14 | Mill Mountain Capital, LLC | Systems, devices and methods for vehicles |
| US8359932B2 (en) * | 2010-07-19 | 2013-01-29 | Goodrich Corporation | Systems and methods for mounting landing gear strain sensors |
| EP2420470B1 (en) * | 2010-08-18 | 2015-10-14 | Nxp B.V. | MEMS Microphone |
| US8409102B2 (en) | 2010-08-31 | 2013-04-02 | General Electric Company | Multi-focus ultrasound system and method |
| US9148712B2 (en) * | 2010-12-10 | 2015-09-29 | Infineon Technologies Ag | Micromechanical digital loudspeaker |
| KR101630759B1 (ko) * | 2010-12-14 | 2016-06-16 | 삼성전자주식회사 | 초음파 변환기의 셀, 채널 및 이를 포함하는 초음파 변환기 |
| WO2012127360A2 (en) * | 2011-03-22 | 2012-09-27 | Koninklijke Philips Electronics N.V. | Ultrasonic cmut with suppressed acoustic coupling to the substrate |
| US8622752B2 (en) * | 2011-04-13 | 2014-01-07 | Teradyne, Inc. | Probe-card interposer constructed using hexagonal modules |
| KR101761819B1 (ko) * | 2011-08-24 | 2017-07-26 | 삼성전자주식회사 | 초음파 변환기 및 그 제조 방법 |
| DE102011084537B4 (de) * | 2011-10-14 | 2017-05-04 | Robert Bosch Gmbh | Ultraschallsensorarray |
| US10194017B2 (en) * | 2011-12-12 | 2019-01-29 | Mill Mountain Capital, LLC | Systems, devices and methods for vehicles |
| WO2013090282A1 (en) * | 2011-12-12 | 2013-06-20 | Clay Skelton | Systems, devices and methods for vehicles |
| US9499392B2 (en) | 2013-02-05 | 2016-11-22 | Butterfly Network, Inc. | CMOS ultrasonic transducers and related apparatus and methods |
| CA2903479C (en) | 2013-03-15 | 2023-10-10 | Butterfly Network, Inc. | Monolithic ultrasonic imaging devices, systems and methods |
| EP2969914B1 (en) | 2013-03-15 | 2020-01-01 | Butterfly Network Inc. | Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same |
| US9667889B2 (en) | 2013-04-03 | 2017-05-30 | Butterfly Network, Inc. | Portable electronic devices with integrated imaging capabilities |
| WO2015013245A2 (en) | 2013-07-23 | 2015-01-29 | Butterfly Network, Inc. | Interconnectable ultrasound transducer probes and related methods and apparatus |
| JP2015080011A (ja) * | 2013-10-15 | 2015-04-23 | セイコーエプソン株式会社 | 振動子、発振器、電子機器及び移動体 |
| KR102163729B1 (ko) * | 2013-11-20 | 2020-10-08 | 삼성전자주식회사 | 전기 음향 변환기 |
| KR102237662B1 (ko) | 2014-04-18 | 2021-04-09 | 버터플라이 네트워크, 인크. | 상보적 금속 산화물 반도체(cmos) 웨이퍼들 내의 초음파 트랜스듀서들 및 관련 장치 및 방법들 |
| EP3132441B1 (en) * | 2014-04-18 | 2020-11-25 | Butterfly Network, Inc. | Architecture of single substrate ultrasonic imaging devices, related apparatuses |
| WO2015161164A1 (en) | 2014-04-18 | 2015-10-22 | Butterfly Network, Inc. | Ultrasonic imaging compression methods and apparatus |
| US9067779B1 (en) | 2014-07-14 | 2015-06-30 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| US9482592B2 (en) * | 2014-09-24 | 2016-11-01 | General Monitors, Inc. | Directional ultrasonic gas leak detector |
| US10695034B2 (en) | 2015-05-15 | 2020-06-30 | Butterfly Network, Inc. | Autonomous ultrasound probe and related apparatus and methods |
| US11147531B2 (en) | 2015-08-12 | 2021-10-19 | Sonetics Ultrasound, Inc. | Method and system for measuring blood pressure using ultrasound by emitting push pulse to a blood vessel |
| US9987661B2 (en) | 2015-12-02 | 2018-06-05 | Butterfly Network, Inc. | Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods |
| US10325915B2 (en) | 2016-05-04 | 2019-06-18 | Invensense, Inc. | Two-dimensional array of CMOS control elements |
| US10315222B2 (en) | 2016-05-04 | 2019-06-11 | Invensense, Inc. | Two-dimensional array of CMOS control elements |
| US10656255B2 (en) | 2016-05-04 | 2020-05-19 | Invensense, Inc. | Piezoelectric micromachined ultrasonic transducer (PMUT) |
| US10670716B2 (en) | 2016-05-04 | 2020-06-02 | Invensense, Inc. | Operating a two-dimensional array of ultrasonic transducers |
| US10445547B2 (en) | 2016-05-04 | 2019-10-15 | Invensense, Inc. | Device mountable packaging of ultrasonic transducers |
| US10562070B2 (en) | 2016-05-10 | 2020-02-18 | Invensense, Inc. | Receive operation of an ultrasonic sensor |
| US10408797B2 (en) | 2016-05-10 | 2019-09-10 | Invensense, Inc. | Sensing device with a temperature sensor |
| US10706835B2 (en) | 2016-05-10 | 2020-07-07 | Invensense, Inc. | Transmit beamforming of a two-dimensional array of ultrasonic transducers |
| US10600403B2 (en) | 2016-05-10 | 2020-03-24 | Invensense, Inc. | Transmit operation of an ultrasonic sensor |
| US10632500B2 (en) * | 2016-05-10 | 2020-04-28 | Invensense, Inc. | Ultrasonic transducer with a non-uniform membrane |
| US11673165B2 (en) | 2016-05-10 | 2023-06-13 | Invensense, Inc. | Ultrasonic transducer operable in a surface acoustic wave (SAW) mode |
| US10441975B2 (en) | 2016-05-10 | 2019-10-15 | Invensense, Inc. | Supplemental sensor modes and systems for ultrasonic transducers |
| US10452887B2 (en) | 2016-05-10 | 2019-10-22 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers |
| US10539539B2 (en) | 2016-05-10 | 2020-01-21 | Invensense, Inc. | Operation of an ultrasonic sensor |
| US11047979B2 (en) | 2016-07-27 | 2021-06-29 | Sound Technology Inc. | Ultrasound transducer array |
| US10196261B2 (en) | 2017-03-08 | 2019-02-05 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| DE102017206766A1 (de) | 2017-04-21 | 2018-10-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mems-wandler zum interagieren mit einem volumenstrom eines fluids und verfahren zum herstellen desselben |
| US10891461B2 (en) | 2017-05-22 | 2021-01-12 | Invensense, Inc. | Live fingerprint detection utilizing an integrated ultrasound and infrared sensor |
| US10474862B2 (en) | 2017-06-01 | 2019-11-12 | Invensense, Inc. | Image generation in an electronic device using ultrasonic transducers |
| TW201908021A (zh) | 2017-06-21 | 2019-03-01 | 美商蝴蝶網路公司 | 具有電性隔離的電極部分的個別單元的微加工超音波換能器 |
| US10643052B2 (en) | 2017-06-28 | 2020-05-05 | Invensense, Inc. | Image generation in an electronic device using ultrasonic transducers |
| US10997388B2 (en) | 2017-12-01 | 2021-05-04 | Invensense, Inc. | Darkfield contamination detection |
| US10936841B2 (en) | 2017-12-01 | 2021-03-02 | Invensense, Inc. | Darkfield tracking |
| US10984209B2 (en) | 2017-12-01 | 2021-04-20 | Invensense, Inc. | Darkfield modeling |
| US11151355B2 (en) | 2018-01-24 | 2021-10-19 | Invensense, Inc. | Generation of an estimated fingerprint |
| US10755067B2 (en) | 2018-03-22 | 2020-08-25 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers |
| US10936843B2 (en) | 2018-12-28 | 2021-03-02 | Invensense, Inc. | Segmented image acquisition |
| KR102196437B1 (ko) * | 2019-01-29 | 2020-12-30 | 한국과학기술연구원 | 정전용량형 미세가공 초음파 트랜스듀서 |
| US11188735B2 (en) | 2019-06-24 | 2021-11-30 | Invensense, Inc. | Fake finger detection using ridge features |
| WO2020264046A1 (en) | 2019-06-25 | 2020-12-30 | Invensense, Inc. | Fake finger detection based on transient features |
| US11176345B2 (en) | 2019-07-17 | 2021-11-16 | Invensense, Inc. | Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness |
| US11216632B2 (en) | 2019-07-17 | 2022-01-04 | Invensense, Inc. | Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness |
| US11232549B2 (en) | 2019-08-23 | 2022-01-25 | Invensense, Inc. | Adapting a quality threshold for a fingerprint image |
| US11392789B2 (en) | 2019-10-21 | 2022-07-19 | Invensense, Inc. | Fingerprint authentication using a synthetic enrollment image |
| WO2021077381A1 (zh) * | 2019-10-25 | 2021-04-29 | 京东方科技集团股份有限公司 | 电容式微机械超声换能单元及其制备方法、面板、装置 |
| US11522469B2 (en) * | 2019-12-06 | 2022-12-06 | Alliance For Sustainable Energy, Llc | Electric machines as motors and power generators |
| EP4100176B1 (en) | 2020-03-09 | 2024-10-09 | InvenSense, Inc. | Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness |
| US11243300B2 (en) | 2020-03-10 | 2022-02-08 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers and a presence sensor |
| US11328165B2 (en) | 2020-04-24 | 2022-05-10 | Invensense, Inc. | Pressure-based activation of fingerprint spoof detection |
| US11995909B2 (en) | 2020-07-17 | 2024-05-28 | Tdk Corporation | Multipath reflection correction |
| US12174295B2 (en) | 2020-08-07 | 2024-12-24 | Tdk Corporation | Acoustic multipath correction |
| FR3114255B1 (fr) * | 2020-09-18 | 2023-05-05 | Moduleus | Transducteur CMUT |
| US12416807B2 (en) | 2021-08-20 | 2025-09-16 | Tdk Corporation | Retinal projection display system |
| US12260050B2 (en) | 2021-08-25 | 2025-03-25 | Tdk Corporation | Differential receive at an ultrasonic transducer |
| DE102022201921A1 (de) | 2022-02-24 | 2023-08-24 | Robert Bosch Gesellschaft mit beschränkter Haftung | Messarray, Verfahren zum Ansteuern eines Messarrays, Verfahren zum Auswerten eines Messarrays und Verfahren zum Betreiben eines Messarrays |
Family Cites Families (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US559622A (en) * | 1896-05-05 | Check sales or order book | ||
| GB2076970A (en) * | 1980-05-19 | 1981-12-09 | Jackson Brothers London Ltd | Displacement transducers |
| US5146435A (en) * | 1989-12-04 | 1992-09-08 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer |
| US6140143A (en) * | 1992-02-10 | 2000-10-31 | Lucas Novasensor Inc. | Method of producing a buried boss diaphragm structure in silicon |
| AU6953994A (en) * | 1993-06-04 | 1995-01-03 | Regents Of The University Of California, The | Microfabricated acoustic source and receiver |
| US5450498A (en) * | 1993-07-14 | 1995-09-12 | The University Of British Columbia | High pressure low impedance electrostatic transducer |
| US5452268A (en) * | 1994-08-12 | 1995-09-19 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer with improved low frequency response |
| US5596222A (en) * | 1994-08-12 | 1997-01-21 | The Charles Stark Draper Laboratory, Inc. | Wafer of transducer chips |
| US5527741A (en) * | 1994-10-11 | 1996-06-18 | Martin Marietta Corporation | Fabrication and structures of circuit modules with flexible interconnect layers |
| US5619476A (en) * | 1994-10-21 | 1997-04-08 | The Board Of Trustees Of The Leland Stanford Jr. Univ. | Electrostatic ultrasonic transducer |
| US5894452A (en) * | 1994-10-21 | 1999-04-13 | The Board Of Trustees Of The Leland Stanford Junior University | Microfabricated ultrasonic immersion transducer |
| US5600610A (en) * | 1995-01-31 | 1997-02-04 | Gas Research Institute | Electrostatic transducer and method for manufacturing same |
| US5828394A (en) * | 1995-09-20 | 1998-10-27 | The Board Of Trustees Of The Leland Stanford Junior University | Fluid drop ejector and method |
| EP1012552B1 (en) * | 1996-10-07 | 2004-06-30 | Lucas Novasensor Inc. | 5 micron high acute cavity with channel by oxidizing fusion bonding of silicon substrates and stop etching |
| DE19643893A1 (de) * | 1996-10-30 | 1998-05-07 | Siemens Ag | Ultraschallwandler in Oberflächen-Mikromechanik |
| US6025951A (en) * | 1996-11-27 | 2000-02-15 | National Optics Institute | Light modulating microdevice and method |
| AU6533598A (en) | 1997-01-24 | 1998-08-18 | California Institute Of Technology | Flexible skin incorporating mems technology |
| US6384952B1 (en) * | 1997-03-27 | 2002-05-07 | Mems Optical Inc. | Vertical comb drive actuated deformable mirror device and method |
| US5982709A (en) * | 1998-03-31 | 1999-11-09 | The Board Of Trustees Of The Leland Stanford Junior University | Acoustic transducers and method of microfabrication |
| US6109113A (en) | 1998-06-11 | 2000-08-29 | Delco Electronics Corp. | Silicon micromachined capacitive pressure sensor and method of manufacture |
| GB9815992D0 (en) | 1998-07-23 | 1998-09-23 | Secr Defence | Improvements in and relating to microchemical devices |
| US6295247B1 (en) * | 1998-10-02 | 2001-09-25 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined rayleigh, lamb, and bulk wave capacitive ultrasonic transducers |
| US6346459B1 (en) | 1999-02-05 | 2002-02-12 | Silicon Wafer Technologies, Inc. | Process for lift off and transfer of semiconductor devices onto an alien substrate |
| US6329738B1 (en) * | 1999-03-30 | 2001-12-11 | Massachusetts Institute Of Technology | Precision electrostatic actuation and positioning |
| US6292435B1 (en) * | 1999-05-11 | 2001-09-18 | Agilent Technologies, Inc. | Circuit and method for exciting a micro-machined transducer to have low second order harmonic transmit energy |
| US6381197B1 (en) * | 1999-05-11 | 2002-04-30 | Bernard J Savord | Aperture control and apodization in a micro-machined ultrasonic transducer |
| US6271620B1 (en) * | 1999-05-20 | 2001-08-07 | Sen Corporation | Acoustic transducer and method of making the same |
| US6239482B1 (en) * | 1999-06-21 | 2001-05-29 | General Electric Company | Integrated circuit package including window frame |
| US6246158B1 (en) * | 1999-06-24 | 2001-06-12 | Sensant Corporation | Microfabricated transducers formed over other circuit components on an integrated circuit chip and methods for making the same |
| US6262946B1 (en) * | 1999-09-29 | 2001-07-17 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasonic transducer arrays with reduced cross-coupling |
| US6430109B1 (en) * | 1999-09-30 | 2002-08-06 | The Board Of Trustees Of The Leland Stanford Junior University | Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections |
| US6242282B1 (en) * | 1999-10-04 | 2001-06-05 | General Electric Company | Circuit chip package and fabrication method |
| US6359367B1 (en) * | 1999-12-06 | 2002-03-19 | Acuson Corporation | Micromachined ultrasonic spiral arrays for medical diagnostic imaging |
| US6493288B2 (en) * | 1999-12-17 | 2002-12-10 | The Board Of Trustees Of The Leland Stanford Junior University | Wide frequency band micromachined capacitive microphone/hydrophone and method |
| US6474786B2 (en) * | 2000-02-24 | 2002-11-05 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined two-dimensional array droplet ejectors |
| US6639339B1 (en) * | 2000-05-11 | 2003-10-28 | The Charles Stark Draper Laboratory, Inc. | Capacitive ultrasound transducer |
| US6443901B1 (en) * | 2000-06-15 | 2002-09-03 | Koninklijke Philips Electronics N.V. | Capacitive micromachined ultrasonic transducers |
| EP1294493A2 (en) | 2000-06-15 | 2003-03-26 | Koninklijke Philips Electronics N.V. | Capacitive micromachined ultrasonic transducers. |
| US6646364B1 (en) * | 2000-07-11 | 2003-11-11 | Honeywell International Inc. | MEMS actuator with lower power consumption and lower cost simplified fabrication |
| US6735008B2 (en) * | 2000-07-31 | 2004-05-11 | Corning Incorporated | MEMS mirror and method of fabrication |
| DK1469701T3 (da) * | 2000-08-11 | 2008-08-18 | Knowles Electronics Llc | Ophöjede mikrostrukturer |
| US6862254B2 (en) | 2000-10-19 | 2005-03-01 | Sensant Corporation | Microfabricated ultrasonic transducer with suppressed substrate modes |
| US6558330B1 (en) | 2000-12-06 | 2003-05-06 | Acuson Corporation | Stacked and filled capacitive microelectromechanical ultrasonic transducer for medical diagnostic ultrasound systems |
| JP3724432B2 (ja) * | 2001-04-19 | 2005-12-07 | 株式会社ニコン | 薄膜弾性構造体及びその製造方法並びにこれを用いたミラーデバイス及び光スイッチ |
| US6587613B2 (en) * | 2001-07-24 | 2003-07-01 | Innovative Technology Licensing, Llc | Hybrid MEMS fabrication method and new optical MEMS device |
| US6795374B2 (en) * | 2001-09-07 | 2004-09-21 | Siemens Medical Solutions Usa, Inc. | Bias control of electrostatic transducers |
| US6836029B2 (en) * | 2001-11-28 | 2004-12-28 | International Business Machines Corporation | Micro-electromechanical switch having a conductive compressible electrode |
| US6659954B2 (en) | 2001-12-19 | 2003-12-09 | Koninklijke Philips Electronics Nv | Micromachined ultrasound transducer and method for fabricating same |
| FR2837294A1 (fr) * | 2002-03-12 | 2003-09-19 | Koninkl Philips Electronics Nv | Dispositif pour accelerer l'interpretation d'un programme en langage interprete |
| US6785039B2 (en) * | 2002-06-03 | 2004-08-31 | Pts Corporation | Optical routing elements |
| US6676602B1 (en) * | 2002-07-25 | 2004-01-13 | Siemens Medical Solutions Usa, Inc. | Two dimensional array switching for beamforming in a volume |
| US6958255B2 (en) * | 2002-08-08 | 2005-10-25 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined ultrasonic transducers and method of fabrication |
| US6831394B2 (en) * | 2002-12-11 | 2004-12-14 | General Electric Company | Backing material for micromachined ultrasonic transducer devices |
| US6865140B2 (en) * | 2003-03-06 | 2005-03-08 | General Electric Company | Mosaic arrays using micromachined ultrasound transducers |
| US7030536B2 (en) * | 2003-12-29 | 2006-04-18 | General Electric Company | Micromachined ultrasonic transducer cells having compliant support structure |
| US7037746B1 (en) * | 2004-12-27 | 2006-05-02 | General Electric Company | Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane |
-
2003
- 2003-12-29 US US10/748,920 patent/US7030536B2/en not_active Expired - Lifetime
-
2004
- 2004-12-28 JP JP2004380343A patent/JP4869593B2/ja not_active Expired - Fee Related
- 2004-12-29 DE DE102004063740A patent/DE102004063740A1/de active Granted
-
2006
- 2006-02-07 US US11/348,984 patent/US7408283B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020100305A1 (de) | 2019-01-15 | 2020-07-16 | Hitachi, Ltd. | Ultraschallwandler, verfahren zu seiner herstellung und ultraschall-bildgebungsvorrichtung |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102004063740A1 (de) | 2005-07-28 |
| US7408283B2 (en) | 2008-08-05 |
| US20060125348A1 (en) | 2006-06-15 |
| US7030536B2 (en) | 2006-04-18 |
| JP2005193374A (ja) | 2005-07-21 |
| US20050146240A1 (en) | 2005-07-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4869593B2 (ja) | コンプライアント支持構造体を有する微細加工超音波トランスデューサセル | |
| US7564172B1 (en) | Micro-electro-mechanical transducer having embedded springs | |
| JP5128470B2 (ja) | 絶縁延長を有する微小電気機械変換器 | |
| US6958255B2 (en) | Micromachined ultrasonic transducers and method of fabrication | |
| US10576500B2 (en) | Piezoelectric micro-machined ultrasonic transducer (PMUT) and method for manufacturing the PMUT | |
| US6271620B1 (en) | Acoustic transducer and method of making the same | |
| US7759839B2 (en) | Acoustic decoupling in cMUTs | |
| CN101578686B (zh) | 微机电装置的制造方法 | |
| US8008105B2 (en) | Methods for fabricating micro-electro-mechanical devices | |
| EP3233311B1 (en) | Piezoelectric micromachined ultrasonic transducers with low stress sensitivity and methods of fabrication | |
| CN103958079B (zh) | 具有环形塌陷区域的预塌陷电容式微机械换能器元件 | |
| WO2009096576A2 (en) | Elastic wave transducer, elastic wave transducer array, ultrasonic probe, and ultrasonic imaging apparatus | |
| KR20150005961A (ko) | 이중 전극을 가진 초광대역 트랜스듀서 | |
| EP1294494A2 (en) | Capacitive micromachined ultrasonic transducers | |
| CN217479067U (zh) | 微机械装置及微机械系统 | |
| US20130069480A1 (en) | Electromechanical transducer and method of manufacturing the electromechanical transducer | |
| JP2023504383A (ja) | グラフェン変換器 | |
| US20210403321A1 (en) | Formation of self-assembled monolayer for ultrasonic transducers | |
| KR20230038027A (ko) | Mems 기술을 이용한 정전용량형 초음파 트랜스듀서 및 그 제조방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071225 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20071225 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20101125 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20101125 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110201 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110329 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110531 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110810 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111025 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111116 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141125 Year of fee payment: 3 |
|
| LAPS | Cancellation because of no payment of annual fees |