JP4867262B2 - Electromagnetic wave shielding sheet - Google Patents

Description

  The present invention relates to an electromagnetic wave shielding sheet that shields (shields) electromagnetic waves generated from a display such as a CRT or PDP.

In recent years, with the advancement of functions and increased use of electrical and electronic equipment, electromagnetic noise interference (EMI) has increased, and electromagnetic waves are also generated in displays such as cathode ray tubes (referred to as CRT) and plasma display panels (referred to as PDP). appear. A plasma display panel is a combination of a glass having a data electrode, a fluorescent layer, and a glass having a transparent electrode, and generates a large amount of electromagnetic waves, near infrared rays, and heat when operated. Usually, a front plate including an electromagnetic wave shielding sheet is provided on the front surface of the plasma display panel in order to shield electromagnetic waves. The shielding property of electromagnetic waves generated from the front surface of the display requires a function of 30 dB or more at 30 MHz to 1 GHz. In the present specification, the term “electromagnetic wave” simply refers to an electromagnetic wave having a frequency in the kHz to GHz band centered on the above range, and does not include infrared rays, visible rays, ultraviolet rays, X-rays, and the like. (For example, electromagnetic waves having a frequency in the infrared band are referred to as infrared rays).
The electromagnetic wave shielding sheet used for such applications is required to have optical transparency as well as electromagnetic shielding performance. Therefore, as an electromagnetic wave shielding sheet, a transparent conductive ITO (Indium Tin Oxide) film provided on the entire surface of a transparent substrate (Patent Document 1, etc.) or a transparent substrate made of a resin film is bonded with an adhesive. A metal foil such as copper foil is etched to form a mesh (Patent Document 2 etc.).
It is also known to form a metal layer to be a conductive layer by a plating method. For example, (1) a method in which conductive ink is printed in a pattern on a transparent substrate, and metal plating is performed on the patterned conductive ink layer (Patent Document 3, etc.); A method in which a photosensitive coating solution containing ink or a chemical plating catalyst is applied to the entire surface, and the coating layer is made into a mesh by photolithography, followed by metal plating on the mesh (Non-Patent Document 1, etc.), (3) A method in which a conductive treatment layer is applied on a transparent substrate, a metal plating layer is formed thereon by electrolytic plating, and then the metal plating layer and the conductive treatment layer are meshed by a photolithography method (Patent Document 4). Are known.

In addition to the electromagnetic wave shielding function, the front plate placed on the front of the display blocks unnecessary light emitted from the display (for example, light with a wavelength of about 590 nm due to neon light emission in PDP), and adjusts the hue of the image to reproduce the color. There are cases where a function to improve the performance, a function to suppress unnecessary reflection of external light, a function to suppress unnecessary infrared radiation from the display and to prevent malfunction of an infrared using device may be required. Therefore, as the actual front plate, an electromagnetic wave shielding sheet and an optical filter having other filter functions, for example, a color filter, antireflection filter, near infrared absorption filter, etc., laminated and integrated into a composite filter are used. (For example, Patent Document 5).
When laminating the optical filter layer on the metal mesh surface, the surface of the metal mesh area is flattened by filling the mesh openings with a transparent resin called a flattening resin in advance. In general, the optical filter layer or the like is laminated on the layer via an adhesive layer. This is because the metal mesh layer has a concave and concave surface, and when the optical filter layer is directly laminated with an adhesive, bubbles remain in the metal mesh opening, and the light scattering of the bubbles causes compounding. This is because the problem arises that the haze value of the filter increases.

JP-A-1-278800 JP 61-134189 A JP 2000-13088 A Japanese Patent Laid-Open No. 2004-241761 JP 2003-86991 A Sumitomo Osaka Cement Co., Ltd. New Materials Division, New Materials Research Institute, New Materials Research Group, “Photoresolvable Chemical Plating Catalyst”, [online], date not listed, Sumitomo Osaka Cement Co., Ltd. Month 7 Search], Internet <URL: http: // www. socnb. com / product / hproduct / display. html>

Electromagnetic wave shielding sheets having a mesh-like copper plating layer as a metal layer are widely used due to the electromagnetic wave shielding properties of copper, the availability of copper, and the ease of copper plating.
Regarding the thickness of the mesh-like copper plating layer, the thickness of about 5 to 15 μm has been widely used in the past, but it is easy to flatten the surface by reducing the unevenness of the mesh pattern and the viewpoint of saving the amount of copper used From the viewpoint of reducing the thickness of the mesh-like copper plating layer, it is desired to make it as thin as possible.
However, if the thickness of the mesh copper plating layer is reduced, there is a problem that the copper plating layer is easily damaged during the manufacturing process of the electromagnetic wave shielding sheet. In particular, when a web with a very thin copper plating layer formed on a transparent substrate sheet such as PET (polyethylene terephthalate) is wound or rewound at a high speed, various processing is performed because the copper plating layer is thin and scratches. There is a risk of cracking when pulled.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an electromagnetic wave shielding sheet in which the mesh copper plating layer is not easily damaged during the manufacturing process of the electromagnetic wave shielding sheet.

The electromagnetic wave shielding sheet provided by the present invention is an electromagnetic wave shielding material in which a mesh-like conductor layer having at least a plurality of openings and a line portion surrounding and dividing the openings is provided on one surface of a transparent substrate. A plane index peak ratio of a crystal plane, wherein the conductor layer includes a copper plating layer, and an abundance ratio of a crystal plane parallel to the surface of the copper plating layer is specified by X-ray diffraction measurement The ratio of the (200) plane strength to the (111) plane strength is 50% or more.
In the present invention, the hardness and elongation of the copper plating layer are improved by adjusting the crystal orientation of the copper plating layer contained in the conductor layer of the electromagnetic shielding sheet as described above. Hard to break.

  In the electromagnetic wave shielding sheet of the present invention, a resin film can be used as the transparent substrate. The resin sheet is lightweight and flexible, and is a preferable material as a transparent substrate. When a flexible resin sheet is used as a transparent substrate, there is a high risk that the copper plating layer will be damaged by rubbing or pulling when processing a web-shaped intermediate product. Since it has excellent hardness and elongation rate, breakage of the copper plating layer can be prevented even when a resin sheet is used as the transparent substrate.

In the electromagnetic wave shielding sheet of the present invention, the total thickness of the line portion including the conductor layer can be 1 to 10 μm.
In the present invention, since the copper plating layer has excellent hardness and elongation, even when an extremely thin copper plating layer is formed, the copper plating layer can be prevented from being damaged.

According to the present invention, by adjusting the crystal orientation of the copper plating layer contained in the conductor layer of the electromagnetic wave shielding sheet, the hardness and elongation rate of the copper plating layer are improved. The copper plating layer is hard to break inside.
In particular, even when a web with an extremely thin copper plating layer formed on a flexible resin sheet is processed while being wound or rewound at a high speed, the copper plating layer is rubbed and damaged or pulled to cause a crack, etc. There is little risk of causing damage.
Accordingly, the copper plating layer can be formed thin to save the amount of copper used, and the unevenness of the mesh pattern can be reduced to facilitate surface flattening.

The present invention will be described in detail below.
The electromagnetic wave shielding sheet provided by the present invention is an electromagnetic wave shielding material in which a mesh-like conductor layer having at least a plurality of openings and a line portion surrounding and dividing the openings is provided on one surface of a transparent substrate. The conductive layer includes a copper plating layer, and an abundance ratio of a crystal plane parallel to the surface of the copper plating layer is determined by an X-ray diffraction method (hereinafter abbreviated as XRD). The ratio of the (200) plane strength to the (111) plane strength is 50% or more when expressed as the plane index peak ratio of the crystal plane specified by XRD measurement). It is.

An example of the electromagnetic wave shielding sheet according to the present invention is shown in FIG. FIG. 1A is a plan view of an example of an electromagnetic wave shielding sheet used in the present invention, and FIG. 1B is a cross-sectional view of an example of an electromagnetic wave shielding sheet used in the present invention.
As shown in FIG. 1A, the electromagnetic wave shielding sheet 1 of the present invention includes a mesh region 101 that can cover all image display regions of a display to be applied in the plane direction, and the mesh region. A conductor layer 12 having a grounding region 102 is formed on at least a part of the periphery of the substrate. The conductor layer 12 in this example includes a conductive treatment layer 13 that is a base layer and a copper plating layer 14 that is a main portion of the conductor layer, but the conductive treatment layer 13 is not necessarily provided. The conductor layer 13 may be composed of only a mesh-like copper plating layer, or may include other layers than the conductive treatment layer 13.
The mesh area 101 has a size and a shape that can cover the entire image display area of the applied display, and always includes a portion 30 that faces the image display area of the applied display. The outer edge portion that is an area outside the portion 30 facing the image display area of the display may include the mesh-shaped area 101 or may include only the grounding area 102. The grounding region 102 normally has the same layer configuration as the mesh region 101 but does not form an opening, and is provided to facilitate grounding when installed on a display. The grounding region 102 may have a mesh shape in which an opening is formed. The grounding region 102 is often provided in a frame shape around the four sides in a portion that does not affect image display, which is an outer edge portion that is an outer region of the portion 30 facing the image display region of a rectangular display, The form may be provided not only on the entire periphery of the mesh region 101 but on a part of the periphery, or may be provided on only three sides, two sides, or one side.

As shown in FIG. 1B, the electromagnetic wave shielding sheet 1 of the present invention is a conductor having a mesh region 101 and a grounding region 102 on one surface of a transparent substrate 11 in the thickness direction. The layer 12 is formed by stacking at least. The electromagnetic wave shielding sheet of the present invention may be formed by further laminating a non-conductive layer on the front and back surfaces of the conductor layer. Examples of the non-conductive layer include a rust preventive layer and a blackened layer that do not have conductivity. Even if it is a rust prevention layer, a blackening layer, etc., as long as it has electroconductivity, it is contained in a conductor layer in this invention. The non-conductive layer further laminated on the front and back surfaces of the conductor layer is integrated with the conductor layer to form a mesh region and a grounding region.
The electromagnetic wave shielding sheets shown in the drawings are all formed into single sheets. However, in the present invention, the electromagnetic wave shielding sheets may be in a state of a continuous belt-like sheet including two or more sheets. Good.

Hereinafter, the electromagnetic wave shielding sheet of the present invention will be described in order from the transparent substrate 11.
[Transparent substrate]
The transparent substrate 11 is a layer for reinforcing a mesh layer having a low mechanical strength. Therefore, as long as it has light transmittance as well as mechanical strength, it may be selected and used depending on the application, taking into account heat resistance, insulation, etc. as appropriate. As a specific example of the transparent substrate, for example, a plate, sheet, or film made of a transparent material such as resin or glass is used.
Examples of the resin include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, terephthalic acid-isophthalic acid-ethylene glycol copolymer, terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer, nylon 6, and the like. Polyamide resins, polyolefin resins such as polypropylene and polymethylpentene, acrylic resins such as polymethyl methacrylate, styrene resins such as polystyrene and styrene-acrylonitrile copolymers, cellulose resins such as triacetyl cellulose, and imides Examples thereof include resins and polycarbonate resins.
In addition, these resins are used as a single or a plurality of types of mixed resins (including polymer alloys) as a resin material, and as a layer, they are used as a single layer or a laminate of two or more layers. In the case of a resin sheet, a uniaxially stretched or biaxially stretched sheet is more preferable in terms of mechanical strength.
Moreover, you may add additives, such as a ultraviolet absorber, a filler, a plasticizer, an antistatic agent, in these resins suitably as needed.

Examples of the glass include quartz glass, borosilicate glass, and soda lime glass. More preferably, the glass has a low coefficient of thermal expansion, excellent dimensional stability and workability in high-temperature heat treatment, and does not contain an alkali component in the glass. Examples include alkali-free glass and the like, which can also be used as an electrode substrate used as a front substrate of a display.
The thickness of the transparent substrate is not particularly limited as long as it depends on the application. When the transparent substrate is made of a transparent resin, it is usually about 12 to 1000 μm, preferably 50 to 500 μm. On the other hand, when a transparent base material is a glass plate, about 1-5 mm is usually suitable. In any material, if the thickness is less than the above, the mechanical strength is insufficient, causing warping, sagging, breakage, etc. If the thickness exceeds the above, it becomes excessive performance and high cost, and thinning is difficult. .

The transparent substrate may also be used as a front substrate which is a component of the display main body, but as a front filter disposed in front of the front substrate, an electromagnetic shield filter to which a function other than the electromagnetic shield is added is used. Then, the sheet is superior to the plate in terms of thinness and lightness, and the resin sheet is superior to the glass plate in that it does not break.
In addition, the transparent base material is preferably handled in the form of a continuous belt-like sheet at least at the initial stage of production, such as mesh layer formation, in that the electromagnetic shielding filter can be continuously produced and productivity can be improved. .
In this respect, a resin sheet is a preferable material for the transparent substrate. In addition, compared with the case of using a rigid transparent substrate such as a glass plate, when using a flexible resin sheet as a transparent substrate, there is a risk of damage to the copper plating layer when processing an intermediate product. large. Therefore, the present invention is particularly preferably applied to an electromagnetic wave shielding sheet using a resin sheet as the transparent substrate.

Among the resin sheets, polyester resin sheets such as polyethylene terephthalate and polyethylene naphthalate are particularly preferable in terms of transparency, heat resistance, cost, and the like, and more preferably a biaxially stretched polyethylene terephthalate sheet. In addition, although the transparency of a transparent base material is so good that it is high, Preferably the light transmittance which becomes 80% or more by visible light transmittance | permeability is good.
In addition, a transparent substrate such as a resin sheet is appropriately coated on the surface thereof with known easy processes such as corona discharge treatment, plasma treatment, ozone treatment, flame treatment, primer treatment, pre-heat treatment, dust removal treatment, vapor deposition treatment, and alkali treatment. An adhesion treatment may be performed.

[Conductor layer]
The conductor layer 12 is a layer having conductivity, and is a layer responsible for an electromagnetic wave shielding function. Even if the conductive layer 12 itself is opaque, the presence of an opening in a mesh shape causes an electromagnetic wave shield. It balances performance and light transmission. An example of the conductor layer 12 forming the mesh region 101 is shown in FIG. The conductor layer 12 forming the mesh-like region 101 has a mesh shape in which the openings 103 are densely arranged, and the mesh-like region forms a frame that divides the opening 103 from each opening. The line unit 104 is configured.
In the present invention, the conductor layer 12 includes a copper plating layer 14 as a main layer and may be composed of only the copper plating layer 14. However, in general, in addition to the copper plating layer 14, a conductive treatment serving as a base layer. The layer 13 is included, and in some cases, further includes a blackening layer and a rust prevention layer having conductivity as described later.
The shape of the mesh is arbitrary and not particularly limited, but the shape of the opening is typically a square. Examples of the shape of the opening include a triangle such as a regular triangle, a square such as a square, a rectangle, a rhombus, and a trapezoid, a polygon such as a hexagon, a circle, and an ellipse.

  The mesh has a plurality of openings having these shapes, and the gaps between the openings are usually line portions having a uniform width. Usually, the openings and the line portions have the same shape and the same size on the entire surface. As an example of a specific size, the width of the line part 104 between the openings is referred to as a line width W as shown in FIG. 2 in terms of the aperture ratio and the mesh invisibility, and is 25 μm or less, preferably 20 μm or less It is preferable that However, it is preferable to secure a line width W of at least 5 μm or more in order to exhibit the electromagnetic wave shielding effect and prevent breakage. The opening width of the opening is represented by (line pitch P) − (line width W). In the present invention, the width is 150 μm or more, preferably 200 μm or more. It is preferable from the point that air bubbles hardly remain in the opening during lamination. However, in order to exhibit electromagnetic wave shielding properties in the MHz to GHz band, the maximum is 3000 μm or less.

In the present invention, the total thickness of the line portions in the finally obtained mesh region, that is, the height H of the line portions 104 between the openings is preferably 10 μm or less, and is preferably 5 μm or less. Is more preferable, and it is particularly preferably 3 μm or less.
In addition, the height H of the line part of a mesh-shaped area | region says the total thickness including all the thickness of the layer which forms the line part 104. FIG. For example, when the line part 104 is composed of only a conductor layer, the height of the line part is equal to the thickness of the conductor layer. For example, the line part has a conductor layer, a non-conductive blackening layer, and a non-conductive layer. In the case of the conductive rust preventive layer, the height of the line portion is the total thickness of the conductor layer, the nonconductive blackened layer, and the nonconductive rust preventive layer.
If the total thickness of the line portion is too large, the level difference between the line portion and the opening becomes large when processed into a mesh, and bubbles tend to remain when the adhesive layer is laminated. Further, if the thickness of the line portion is further increased, it becomes difficult to obtain a desired high-definition mesh shape by side etching or the like during etching.
In contrast, when the total thickness of the line portion including the copper plating layer is 10 μm or less, the amount of copper used can be saved and the mesh surface can be flattened. In particular, when the total thickness of the line portion is 3 μm or less, the effect of flattening is large. In such a case, even when the step of flattening the mesh surface is omitted in advance before the lamination with the optical filter, the adhesive is placed in the opening of the metal mesh when the electromagnetic wave shielding sheet and the optical filter are laminated and bonded. This is because the layer easily enters uniformly, and bubbles do not easily remain in the opening. In this case, the disadvantage that the haze of the composite filter due to the light scattering of the bubbles can be avoided, and a composite filter with high transparency can be obtained with high production efficiency.
On the other hand, if the total thickness H of the line portion is too small, the thickness of the conductor layer is too small, so that the electric resistance value of the metal is increased and the electromagnetic wave shielding effect is easily impaired. Considering the electromagnetic shielding function, the thickness of the conductor layer including the copper plating layer is preferably 1 μm or more, more preferably 2 μm or more in the case of the line width and line pitch. Therefore, the height of the line part of the mesh region is preferably 1 μm or more, and more preferably 2 μm or more.
In addition, the bias angle of the mesh region (angle formed between the mesh line portion and the outer periphery of the electromagnetic wave shielding sheet) may be appropriately set to an angle at which moire is difficult to occur in consideration of the pixel pitch of the display and the light emission characteristics. .

A method for preparing such an electromagnetic wave shielding sheet in which at least a conductor layer having a mesh-like region is laminated is not particularly limited, and examples thereof include the following three methods.
(1) A method of printing a conductive ink on a transparent base material in a pattern and copper plating on the conductive ink layer (for example, JP 2000-13088 A).
(2) A method in which a conductive ink or a photosensitive coating solution containing a chemical plating catalyst is applied to the entire surface of a transparent substrate, the coating layer is made into a mesh by a photolithography method, and copper plating is performed on the mesh (for example, , Sumitomo Osaka Cement Co., Ltd. New Materials Division, New Materials Research Institute, New Materials Research Group, “Photoresolvable Chemical Plating Catalyst”, [online], date not listed, Sumitomo Osaka Cement Co., Ltd. [2003 Search on January 7], Internet <URL: http://www.socnb.com/product/hproduct/display.html>).
(3) On one surface of the transparent substrate, a metal thin film is formed by sputtering or the like to form a conductive treatment layer, and a transparent substrate on which a copper plating layer is formed by electrolytic plating is prepared. The copper plating layer and the conductive treatment layer on the material are formed into a mesh shape by a photolithography method (for example, Japanese Patent No. 3502979, Japanese Patent Application Laid-Open No. 2004-241761).

Among them, particularly in the present invention, since the transparency and mesh accuracy are excellent, the display image can be satisfactorily viewed. Further, in the manufacturing process, there is little warpage or mixing of bubbles, and the manufacturing process can be performed at a low yield with a low yield. In view of the above, it is particularly preferable to use the method (3). Therefore, a method for forming a mesh-like conductor layer by the method (3) will be described in detail.
An example of an electromagnetic wave shielding sheet formed by the method (3) above, in which a conductive layer forming a mesh-like region is laminated on one surface of a transparent substrate, is shown in FIG. 3 is a cross-sectional view taken along line AA and BB in FIG. 3A shows an AA cross section that crosses the opening, and the openings 103 and the lines 104 are alternately formed. FIG. 3B shows a BB cross section that runs through the line 104 and is formed of the conductor layer 12. Lines 104 are formed continuously. In FIG. 3, the conductor layer 12 has a conductive treatment layer 13, a first antirust layer 16 </ b> A, a first blackening layer 15 </ b> A, a copper plating layer 14, and a second blackening from the side close to the transparent substrate 11. The layer 15B and the second antirust layer 16B have a structure in which they are laminated in this order. Of these layers, the minimum required one is the copper plating layer 14. Other layers are provided as necessary.

(Formation of conductive treatment layer)
In the above method (3), a conductive treatment layer is formed on the transparent substrate 11 as described above prior to metal electroplating described later. As a method for the conductive treatment, a thin film of a known conductive material may be formed. Examples of the conductive material include metals such as gold, silver, copper, iron, nickel, and chromium, or alloys of these metals (for example, nickel-chrome alloys). Moreover, transparent metal oxides, such as a tin oxide, ITO, and ATO, may be sufficient. The conductive treatment may be a single layer or multiple layers (for example, a laminate of a nickel-chromium alloy and a copper layer), and these materials are formed by a known vacuum deposition method, sputtering method, electroless plating method, or the like. The conductive treatment layer 13 is used. The thickness of the conductive treatment layer 13 is preferably an extremely thin layer of about 0.001 to 1 μm, as long as necessary conductivity can be obtained at the time of plating.

(Copper plating layer)
After directly or another layer is formed on the surface of the conductive treatment layer 13, a copper plating layer 14 is formed by an electrolytic plating method to obtain a copper plated transparent substrate.
In the present invention, by forming a copper layer by a plating method, it is possible to efficiently form a copper layer without requiring a step of bonding a copper foil. In particular, when it is desired to form an extremely thin copper layer (for example, 5 μm or less), handling of the copper foil in the process of laminating the copper foil is very troublesome and easily damaged. A thin copper layer can be easily formed.
In the present invention, the copper plating layer 14 is typically composed of copper alone, but if it is mainly composed of copper and has crystal orientation described later, gold, silver, copper, iron, nickel, Other metals such as chromium may be included. When the copper plating layer is a mixture of copper and another metal or a copper alloy, the copper content is preferably 90% by weight or more of the total metal components, and more preferably 95% by weight or more. preferable.

  The thickness of the copper plating layer is preferably as thin as possible within a range where sufficient shielding performance and physical properties that do not break during the processing process can be obtained, but the thickness of the entire conductor layer including the copper plating layer is not limited. It is determined in consideration of the thickness of other layers within the range. From this viewpoint, the thickness of the copper plating layer 14 included in the conductor layer is preferably 10 μm or less, more preferably 5 μm or less, and particularly preferably 3 μm or less. Further, the thickness of the copper plating layer 14 is preferably 1 μm or more, and more preferably 2 μm or more.

The copper plating layer formed on the transparent substrate is considered to be deposited by growing copper crystals upward from the base surface.
The copper crystal has a face-centered cubic lattice, and when the crystal plane is represented by a plane index, at least three crystals, that is, a crystal plane represented by a plane index (111) with respect to the crystal axis of the face-centered cubic lattice. There may be a crystal having, a crystal having a crystal plane represented by a plane index (200), and a crystal having a crystal plane represented by a plane index (220).
Here, the plane index of the crystal plane is a means for expressing the direction of the crystal plane with respect to the crystal axis. The length by which the crystal plane cuts the crystal axis is expressed in terms of the lattice constant, and the reciprocal of the expressed length is obtained. The reciprocal ratio is reduced to three integers (usually the smallest integer combination) that make up the same ratio. The reduced integer is enclosed in parentheses and determined as the plane index of the crystal plane.

Therefore, in the copper plating layer, crystals grown with the (111) plane facing upward (in a state parallel to the surface of the plating layer), the (200) plane facing upward (with the surface of the plating layer) There may be crystals that have grown (in a parallel state) and crystals that have grown (with the (220) plane facing up) (with the surface parallel to the surface of the plating layer).
The ratio of the number of crystal planes parallel to the surface of the copper plating layer is the ratio of the number of unit cells of crystals in which the same crystal plane faces the deposition direction of the plating. Thus, the ratio of the number of unit lattices of crystals having the same crystal growth direction is a means for indicating the orientation state of the copper crystals constituting the copper plating layer.

  In the present invention, by adjusting the crystal orientation of the copper constituting the copper plating layer so that the copper plating layer formed on the transparent substrate is not damaged during the processing process of the electromagnetic wave shielding sheet, Improve hardness and elongation. Specifically, the ratio of the number of crystal planes parallel to the surface of the copper plating layer was expressed by the plane index peak ratio of the crystal plane specified by XRD measurement in which the surface of the copper mesh layer was irradiated with X-rays. Sometimes, the crystal orientation of copper is adjusted so that the ratio of (200) plane strength to (111) plane strength is 50% or more.

Here, the XRD measurement refers to a crystal analysis method based on X-ray diffraction (X-Ray Diffraction) measurement. X-rays are incident on the crystal to be measured, and the intensity of Bragg reflection on each crystal plane such as the (111) plane in the crystal is measured. From this, the abundance ratio of each crystal plane is obtained from the type of crystal plane present in the crystal and its intensity ratio. As a specific measurement method, a known method or apparatus already established in the field of crystal lattice analysis may be used.
The peak ratio of crystal planes identified by such XRD measurement is a crystal lattice having a specific crystal growth direction in relation to the ratio of the number of crystal planes facing a specific direction or the crystal axis in a polycrystalline system. The abundance ratio of.

  In this way, the ratio of the number of crystal planes having a specific orientation existing in a region having a certain extent in the plane direction, that is, the ratio of crystal orientation of each single crystal particle constituting the polycrystal (distribution). ) Can be measured.

According to JCPDS (Joint Committee on Powder Diffraction standards), which is standard data for powder X-ray diffraction, the standard XRD peak ratio (peak ratio of random orientation) of copper crystals is (111) plane: (200) Plane: (220) plane = 100: 46: 20. In this case, the (111) plane has the largest peak (this state is referred to as (111) orientation), and the (200) plane strength is 46% with respect to the (111) plane strength of 100%. % Has not reached.
On the other hand, in the present invention, the (200) plane strength of the copper crystal is larger than the standard strength value as described above, that is, the copper crystal is preferentially oriented in the (200) plane. And the hardness and elongation rate of a copper plating layer can be improved by adjusting the degree of the preferential orientation so that the ratio of the (200) plane strength to the (111) plane strength is 50% or more. .
By improving the hardness of the copper plating layer, it becomes particularly resistant to rubbing during the processing process, and scratch resistance is improved. Further, by improving the elongation rate of the copper plating layer, it becomes particularly resistant to pulling during the processing process, and crack resistance is improved.
In the present invention, as long as the (200) plane strength of the copper crystal in the copper plating layer is preferentially oriented so as to be 50% or more of the (111) plane strength, the (200) plane orientation (strength) The effect is obtained even if the orientation plane having the largest (200) plane is not), but the copper crystal in the copper plating layer may be (200) plane orientation.

  Here, the Vickers hardness can be measured using a general Vickers hardness measuring apparatus (for example, model name MVK-G2 manufactured by AKASHI Co., LTD) with an indenter load of 10 g and a holding time of 15 seconds. .

  Further, the elongation can be performed in accordance with JIS Z-2241 (1980) “Metal Material Tensile Test Method”, and using a general tensile test apparatus (for example, manufactured by SHIMADZU Co., LTD) It can be measured with a thickness of 18 μm × width of 10 mm × length of 50 mm and a tensile speed of 10 mm / min.

As a copper plating solution by the electrolytic plating method, a known plating bath such as a copper sulfate bath, a copper bromide bath, a copper borofluoride bath, a copper pyrophosphate bath can be used, but a copper sulfate bath is a typical plating bath. Used. As the composition of the copper sulfate bath, for example, a copper sulfate and an aqueous solution containing sulfuric acid and a plating additive for adjusting the orientation of copper crystals are used. The sulfuric acid concentration is about 150 to 220 g / L (liter), and the copper sulfate concentration is about 50 to 85 g / L for pentahydrate.
Examples of the orientation controlling component contained in the plating additive include known hydrocarbon compounds, sulfur-containing hydrocarbon compounds, proteins, glues, amines, alkaloids, mercaptans, sulfides, and various dye compounds. It is done. One or more of these orientation adjusting components are appropriately selected and used. The addition amount is about 1 to 100 g / L.
It is known that the parallel alignment of the copper crystal (200) plane to the surface of the copper plating layer depends on the blending ratio of the constituent components of the additive. Therefore, in order to increase the ratio of the crystal plane parallel to the surface of the copper plating layer (200), particularly 50% or more, the blending ratio of the constituent components of the additive is preferably adjusted. For example, the compound etc. which have a hydrocarbon type polymer compound as a main component and mixed other additives, such as a sulfur-containing hydrocarbon compound as needed, are mentioned.
If necessary, hydrochloric acid may be added at a chlorine concentration of about 40 to 80 mg / L in order to roughen the surface of the copper plating layer.
The plating conditions may be general settings. For example, the bath temperature is 20 to 30 ° C., the current density is 1 to 3 A / dm ² , the plating time is 30 minutes to 2 hours, and the plating bath is stirred. After the plating layer is deposited, it is preferable to perform an annealing treatment as necessary in order to stabilize the crystal orientation. The annealing conditions are, for example, 100 to 200 ° C., 30 minutes to 2 hours.

(Blackening layer)
In order to absorb external light to the electromagnetic wave shielding sheet 1 and improve the visibility of the image on the display, a blackening process is performed on the observation side of the conductor layer 12 forming the mesh-like region, and the contrast is increased. It is preferable to give a feeling. For this purpose, as shown in FIG. 3A, a blackening layer 15A and / or 15B is provided on at least one surface of the metal plating layer 14 as necessary. The blackening layer is carried out by either roughening the surface of the metal plating layer 14, providing light absorption over the entire visible light spectrum (blackening), or using both in combination. Further, when a blackened layer is provided on the surface of the transparent substrate 11, the copper plated layer 14 may be provided after conducting a conductive treatment with a transparent conductive thin film on the transparent substrate and providing the black plated layer. .
A preferable blackening layer forming method in the case of copper includes cathodic electrodeposition in which copper is subjected to cathodic electrolysis in an electrolytic solution composed of sulfuric acid, copper sulfate, cobalt sulfate, and the like to attach cationic particles. . By providing the cationic particles, the surface becomes more rough, and at the same time, black is obtained. As the cationic particles, copper particles and alloy particles of copper and other metals can be used, but copper-cobalt alloy particles are preferred. The average particle diameter of the cationic particles is preferably about 0.1 to 1 μm from the viewpoint of black density.
In addition, as the blackening layer forming method, nickel-zinc alloy, nickel sulfide, or blackening nickel plating composed of a composite thereof, and copper oxide can also be suitably used.

  A preferable black density of the blackened layer is 0.6 or more. In addition, the measurement method of black density was set to the density standard ANSIT as an observation viewing angle of 10 degrees, an observation light source D50, and an illumination type using GRETAG SPM100-11 (trade name, manufactured by Kimoto Co., Ltd.) of COLOR CONTROL SYSTEM. The specimen is measured after calibration. Further, the light reflectance of the blackened layer is preferably 5% or less. The light reflectance is measured using a haze meter HM150 (trade name, manufactured by Murakami Color Co., Ltd.) in accordance with JIS-K7105. In addition, instead of measuring the reflectance, the Y value of reflection may be expressed by a color difference meter. In this case, the Y value is preferably 10 or less.

(Rust prevention layer)
Further, the rust preventive layers 16A and / or 16B are formed so as to cover at least one side of the copper plating layer 14 and, when a blackened layer is provided, so as to cover at least one side of the blackened layers 15A and / or 15B. Is preferably provided.
The rust prevention layers 16A and 16B are preferably provided at least on the blackening layer in order to prevent the rust prevention function and the blackening layer from dropping or deforming. As the rust prevention layer 16B, nickel, zinc, and / or copper oxide, or a chromate treatment layer can be applied. The nickel, zinc, and / or copper oxide may be formed by a known plating method, and the thickness is about 0.001 to 1 μm, preferably 0.001 to 0.1 μm.
When the rust prevention layer 16A is provided on the blackened layer 15A surface of the transparent substrate 11, the conductive treatment is performed on the transparent substrate, and the rust prevention layer 16A is provided by the same material and method as the above 16B. Good. In this case, a black plating layer (corresponding to the blackening layer 15A), the copper plating layer 14, and, if necessary, a blackening layer 15B and a rust prevention layer 16B are sequentially provided on the surface of the rust prevention layer 16A.
The blackening layers 15A and 15B and the rust prevention layers 16A and 16B may be provided at least on the observation side, and the contrast is improved and the visibility of the image on the display is improved. Further, it may be provided on the other surface, that is, on the display surface side, and stray light generated from the display can be suppressed, so that the visibility of the image is further improved.

(Mesh processing)
Next, the process of making the conductor layer on the transparent substrate provided as described above into a mesh by a photolithography method will be described.
First, a resist layer is provided on the surface of the conductive layer 12 on the transparent substrate prepared as described above, meshed, and the portion of the conductive layer 12 not covered with the resist layer is removed by etching. A mesh-like metal layer is formed by a so-called photolithography method for removing the layer. Furthermore, existing equipment can be used, and by performing many of these manufacturing processes continuously, quality is high, production efficiency is high, yield is high, and production can be performed at low cost.

(Masking process)
First, the surface on the conductor layer side of the laminate of the transparent base material 11 and the conductor layer 12 is made into a mesh shape by a photolithography method, and the mesh-like region 101 is formed. Also in this step, it is preferable to process a roll-shaped laminated body continuously wound in a band shape (referred to as a winding process or a roll-to-roll process). While the laminate is conveyed continuously or intermittently, masking, etching, and resist peeling are performed in a stretched state without looseness. When glass is used as the transparent substrate 11, it is processed one by one (referred to as single wafer processing or single wafer processing).
First, in the masking, for example, a photosensitive resist is applied onto the conductor layer 12 forming the mesh-like region, and after drying, contact exposure is performed with a photomask having a predetermined pattern, water development is performed, and film hardening is performed. Etc. and baking. Note that either a negative type or a positive type of photosensitive resist can be used. When the photosensitive resist is a negative type, it is assumed that the line portion of the mesh pattern of the photomask is transparent. When the photosensitive resist is a positive type, the mesh pattern of the photomask has a transparent opening. Further, the exposure pattern is a desired pattern as an electromagnetic wave shielding sheet, and is composed of a pattern of a mesh area at a minimum. Further, as necessary, a grounding area pattern is added to the outer periphery of the mesh area as shown in FIG.
In the winding process, the resist is applied by winding the belt-like laminated body (laminated body of the transparent base material 11 and the conductive layer 12) continuously or intermittently while forming the mesh-like region on the surface of the conductive layer 12 A resist such as casein, PVA, or gelatin is dipped (immersed), curtain coated, or poured. Moreover, a dry film resist may be used instead of application | coating, and workability | operativity can be improved. In the case of a casein resist, baking is performed at 200 to 300 ° C., but the lowest possible temperature is preferable in order to prevent warping of the laminate.

(Etching process)
Etching is performed after masking. As the etching solution used for the etching, an aqueous solution of ferric chloride or cupric chloride that can be easily circulated is preferable in the present invention in which etching is continuously performed. The etching is basically the same as the equipment for manufacturing a shadow mask for a color TV cathode ray tube that etches a strip-like continuous steel material, particularly a thin plate having a thickness of 20 to 80 μm. In other words, the existing manufacturing equipment for the shadow mask can be diverted, and from masking to etching can be produced consistently and continuously, which is extremely efficient. Single-wafer processing in the case of using glass as the transparent substrate 11 has also been performed for a long time. After etching, the substrate may be dried after washing with water, stripping the resist with an alkaline solution, and washing. Since the transparent base material is exposed on the surface of the mesh opening thus formed, the transparency of the mesh opening is good.
By the above mesh processing, a mesh-like conductor layer is formed and an electromagnetic wave shielding sheet is obtained.

(Addition of optical filter)
In the electromagnetic wave shielding sheet of the present invention, an optical filter may be further laminated and bonded to the side having the mesh-like conductor layer. As an optical filter, on the transparent base material of the optical filter, various function expressing layers such as a near infrared absorption layer (NIR layer), a neon light absorption layer, an ultraviolet absorption layer, an antireflection layer (AR layer), a hard coat layer. (HC layer), antiglare layer (AG layer), antifouling layer, etc., one or two or more laminated are used.
When laminating an optical filter on the electromagnetic wave shielding sheet of the present invention, usually, a planarizing layer is coated on the mesh-like conductor layer, and the optical filter is pasted on the planarizing layer using an adhesive. Match. The flattening layer may be one having high transparency, good adhesion to the conductive layer of the mesh, and good adhesion to the adhesive in the next step. The resin used for the flattening layer is not particularly limited, and various natural or synthetic resins can be applied. From the viewpoint of durability, applicability, ease of flattening, flatness, and the like, acrylic ultraviolet curable resins are used. Is preferred.

  However, in the present invention, as described above, an extremely thin mesh-like conductor layer can be provided on the electromagnetic wave shielding sheet. When the mesh-like conductor layer is extremely thin, it is only necessary to provide a thin planarizing layer, and an optical filter can be laminated without using the planarizing layer. From this viewpoint, the total thickness of the line portion including the mesh-like conductor layer is preferably 5 μm or less, and more preferably 3 μm or less.

As described above, in the present invention, by adjusting the crystal orientation of the copper plating layer included in the conductor layer of the electromagnetic shielding sheet, the hardness and elongation rate of the copper plating layer are improved. It can be expected that the copper plating layer is less likely to be damaged during the manufacturing process of the shielding sheet and the throughput is improved.
In particular, even when a web with an extremely thin copper plating layer formed on a flexible resin sheet is processed while being wound or rewound at a high speed, the copper plating layer is rubbed and damaged or pulled to cause a crack, etc. There is little risk of causing damage.
Accordingly, the copper plating layer can be formed thin to save the amount of copper used, and the unevenness of the mesh pattern can be reduced to facilitate surface flattening.
The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

(Reference Experiment Example 1)
A copper plating film was formed on the surface of the stainless steel plate by electrolytic plating. As a plating solution, water is used as a solvent, copper sulfate pentahydrate: 75 g / liter, sulfuric acid: 180 g / liter, chlorine (added as hydrochloric acid): 60 mg / liter, hydrocarbon polymer plating additive 1: A plating solution mixed with 40 ml / liter was used. The plating conditions are as follows. Bath amount: 500 ml, stirring: air stirring, bath temperature: 25 ° C., current density: 2 A / dm ² , plating time: 40 min (target film thickness: 18 μm).
The film deposited by plating was annealed at 120 ° C. for 60 minutes to obtain a copper plating film.

(Comparative Experimental Example 1)
A commercially available electrolytic copper foil having a thickness of 18 μm (a copper plating layer deposited on a releasable drum-like cathode, and the copper plating layer is released from the cathode to form a single-layer copper foil. Product name: B-WS, manufacturer: Furukawa Electric) was prepared.

(Example 1, Comparative Example 1)
(Damage evaluation during mesh production)
In Example 1, an electromagnetic wave shielding sheet was manufactured by forming a copper plating layer having a thickness of 2.3 μm on a transparent substrate under the same conditions as in Reference Experiment Example 1, and meshing the copper plating layer. .
On the other hand, in Comparative Example 1, an electrolytic copper foil equivalent to Comparative Experimental Example 1 having a thickness of 2.3 μm was obtained, and this was adhered to a transparent substrate to form a copper foil layer. The copper foil layer was meshed to produce an electromagnetic wave shielding sheet.
And the generation | occurrence | production state of the crack in the mesh-like area | region at the time of a process and an abrasion was evaluated.
First, the electromagnetic wave shielding sheet of Example 1 was obtained as follows. Both the transparent substrate and the conductor layer were formed as a continuous belt. That is, one unit (one screen) composed of a mesh-like region 101 and a grounding region 102 having a shape as shown in FIG. In this manner, a strip-shaped conductor layer 12 formed in a stacked manner was manufactured. As a unit of the conductor layer, the diagonal length of the mesh region is 42 inches, and the width of the grounding region is 55 mm. And the laminated body of this strip | belt-shaped transparent base material and a conductor layer was stored in the state wound up by roll shape, unwinded, processed all the numbers for 1000 m, and processed in the form wound up again after a process.

First, an uncolored transparent biaxially stretched polyethylene terephthalate film having a total length of 1000 m and having a polyester resin primer layer formed on one side and having a thickness of 100 μm was prepared as the transparent substrate 11.
On the primer layer of the transparent substrate, a nickel-chromium alloy layer having a thickness of 0.1 μm and a copper layer having a thickness of 0.2 μm (a part of the conductor layer) are sequentially provided by sputtering. Treatment layer 13 was obtained.
On the surface of the conductive treatment layer, a copper plating layer 14 having a thickness of 2.3 μm is provided by an electrolytic plating method using a copper sulfate bath similar to that in Reference Experimental Example 1, and both the conductive treatment layer 13 and the copper plating layer 14 are provided. A layer was formed as the conductor layer 12, and a copper-clad laminated sheet in which the conductor layer was directly formed on the transparent substrate without interposing the adhesive layer was produced.

On the other hand, the electromagnetic wave shielding sheet of Comparative Example 1 was obtained as follows. An adhesive layer of a two-component curable urethane resin (based on polyester urethane polyol and xylene diisocyanate as a curing agent) is applied to the same transparent substrate as in each example in a thickness of 5 g / m ² (coating amount when dried). Then, an electrolytic copper foil having a thickness of 2.3 μm equivalent to that of Comparative Experimental Example 1 was adhered on the adhesive layer by dry lamination to prepare a copper-clad laminate sheet. Subsequent steps were performed in the same manner as in the example to prepare an electromagnetic wave shielding sheet.

  Next, a blackening layer 15 was formed on the conductor layer. Specifically, a nickel plate is used for the anode, and the mesh-like conductor layer is formed on a transparent base material in a blackening plating bath made of a mixed aqueous solution of a nickel ammonium sulfate aqueous solution, a zinc sulfate aqueous solution and a sodium thiocyanate aqueous solution. The laminated sheet formed above is immersed and subjected to electroplating to blacken, and a blackened layer 15B made of a nickel-zinc alloy is formed on the entire surface of the exposed conductor layer so as to be conductive. The body layer 12 (the example is composed of the conductive treatment layer 13, the copper plating layer 14, and the blackening layer 15B, and the comparative example is composed of the electrolytic copper foil layer and the blackening layer) is laminated. A continuous strip sheet having a total length of 1000 m was obtained.

Next, a mesh region 101 including an opening 103 and a line portion 104 was formed on the laminated sheet by etching the conductor layer using a photolithography method.
Specifically, using a production line for a color TV shadow mask, the etching was performed consistently from masking to etching on the continuous belt-like laminated sheet. That is, after applying a photosensitive etching resist to the entire surface of the conductor layer of the laminated sheet, a desired mesh pattern is closely exposed, developed, hardened, and baked on the area corresponding to the line portion of the mesh. After processing the resist layer into a pattern in which the resist layer remains and there is no resist layer on the area corresponding to the opening, the conductor layer including the blackened layer is etched away with an aqueous ferric chloride solution. Then, a mesh-shaped opening was formed, and then water washing, resist peeling, washing, and drying were sequentially performed.

  The shape of the mesh in the mesh region is such that the opening is square and the line width of the non-opening line portion is 10 μm, the line interval (pitch) is 300 μm, and it is cut into rectangular sheets. The bias angle, defined as the minor angle with respect to the long side of the rectangle, was 49 degrees. Further, when the completed composite filter is mounted on the front surface of the image display device (display), the mesh region 101 has a portion facing the image display region of the display, and the mesh region 101 is located at the periphery of the mesh region. Is designed in such a pattern that when the electromagnetic wave shielding sheet is cut into a rectangular sheet, a frame portion having a width of 15 mm without an opening is left as a grounding region on the outer periphery of the four sides. In this way, an electromagnetic wave shielding sheet having no flattening layer was obtained.

(test)
With respect to the copper plating film or electrolytic copper foil sample obtained in the above experimental example, three film properties (surface index peak ratio by XRD measurement, Vickers hardness, elongation) were measured. Moreover, the damage state at the time of the mesh manufacture of the electromagnetic shielding sheet actually manufactured was observed, and durability was evaluated.
(1) Surface index peak ratio by XRD measurement Using an X-ray diffractometer (device name: XRD-6100, manufactured by Shimadzu Corporation), the X-ray source is CuKα (λ = 1.54 angstrom (Å)), and each The plane index peak ratios of the copper plating film and the electrolytic copper foil were measured.

(2) Vickers hardness The Vickers hardness of the copper-plated film on the stainless steel plate is determined using a Vickers hardness measuring device (manufactured by AKASHI Co., LTD, model name MVK-G2) with an indenter load of 10 g and a holding time of 15 seconds. It was measured. Vickers hardness was measured at five points on the copper plating film, and an average value was calculated.

(3) Elongation rate The copper plating film was peeled off from the stainless steel plate, and the elongation rate was measured according to JIS Z-2241 (1980) “Metal material tensile test method”. Using a general tensile testing apparatus (manufactured by SHIMADZU Co., LTD), the test piece dimensions were measured as thickness 18 μm × width 10 mm × length 50 mm, and tensile speed 10 mm / min. The elongation percentage was measured for five test pieces, and the average value was calculated.
(4) Mesh durability evaluation at the time of production As described above, the electromagnetic wave shielding sheet was continuously processed 1000 m, and the formed mesh portions were magnified and observed for all the products.
(Abrasion resistance)
The case where no scratch was observed on the mesh part was evaluated as good (◯), and the case where the mesh part was scratched was evaluated as poor (×).
(Crack resistance)
Moreover, the thing in which a crack is not recognized in a mesh part was evaluated as favorable ((circle)), and the thing in which a crack was recognized in a mesh part was evaluated as bad (x).

(Test results)
Table 1 shows the test results for each test piece.

The electrolytic copper foil obtained in Comparative Experimental Example 1 had a standard XRD peak ratio of copper crystals specified by JCPDS, which is standard data for powder X-ray diffraction. This electrolytic copper foil has a (111) orientation, and the (200) plane strength is 46% with respect to the (111) plane strength of 100%. And the electrolytic copper foil which consists of such a standard copper crystal had Vickers hardness (Hv) of 85 Hv, and the elongation rate was 10.8%. When an electrolytic copper foil layer (2.3 μm thick) equivalent to the electrolytic copper foil was applied to the substrate and meshed (Comparative Example 1), scratches and cracks were observed in some mesh regions. . The mesh was found to be insufficiently durable.
On the other hand, the copper plating film obtained in Reference Experimental Example 1 has a (200) plane strength of 88% with respect to a (111) plane strength of 100%, which is (200) compared to the standard XRD peak ratio (200). ) The plane was preferentially oriented. At this time, the Vickers hardness (Hv) was 105 Hv, and the elongation was 18.0%. When a copper plating layer (2.3 μm thick) equivalent to the copper plating film was formed on the substrate and meshed (Example 1), neither scratches nor cracks were observed, and the mesh had good durability. Certified.
Accordingly, the (200) plane is preferentially oriented so that the (200) plane strength is 50% or more with respect to the (111) plane strength of 100%, thereby improving the hardness and elongation of the copper plating film, It was confirmed that scratches and cracks were prevented and the mesh had good durability.
The thickness of the copper plating film and the electrolytic copper foil used for the film physical property test is about 18 μm. In the XRD measurement, the plane index peak ratio at a depth of about 1 to 5 μm from the film surface was measured, but it is estimated that the crystal orientation is uniform at any depth of the film. Also, the values of Vickers hardness and elongation measured for a copper plating film having a thickness of about 18 μm differ greatly even when the thickness of the copper plating film and the electrolytic copper foil is extremely thin, for example, 2 to 3 μm. I guess it is not.

FIG. 1A is a plan view of an example of an electromagnetic wave shielding sheet used in the present invention, and FIG. 1B is a cross-sectional view of an example of an electromagnetic wave shielding sheet used in the present invention. It is a perspective view which shows an example of the mesh-like area | region 101 of the conductor layer of this invention. FIG. 3A is a lateral view of a line portion in an example of the electromagnetic wave shielding sheet used in the present invention, and FIG. 3B is a vertical cross section of the line portion in an example of the electromagnetic wave shielding sheet used in the present invention. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electromagnetic wave shielding sheet 11 Transparent base material 12 Conductor layer 13 Conductive treatment layer 14 Metal plating layer (metal layer)
15 Blackening layer 16 Rust prevention layer 101 Mesh area 102 Grounding area 103 Opening 104 Line part

Claims (3)

  An electromagnetic wave shielding sheet comprising a mesh-like conductor layer having at least a plurality of openings and a line portion surrounding and dividing the plurality of openings on one surface of a transparent substrate, the conductor layer being made of copper When the abundance ratio of the crystal plane including the plating layer and parallel to the surface of the copper plating layer is expressed by the plane index peak ratio of the crystal plane specified by the X-ray diffraction measurement, (111) plane strength The electromagnetic wave shielding sheet, wherein the ratio of (200) plane strength to is 50% or more.   The electromagnetic shielding sheet according to claim 1, wherein the transparent substrate is made of a resin film. 3. The electromagnetic wave shielding sheet according to claim 1, wherein a total thickness of the line portion including the conductor layer is 1 to 10 μm.

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