JP4866553B2 - Adhesive application apparatus and adhesive application method - Google Patents

Description

  The present invention relates to an adhesive application device and an adhesive application method, and more particularly, to an adhesive application device for applying an adhesive to a substrate or a rod lens arranged on the substrate in the manufacturing process of the rod lens array, and The present invention relates to an adhesive application method.

  A rod lens array in which a large number of rod lenses are bonded and fixed between two substrates is widely used as an optical component such as a line sensor such as a copying machine, a facsimile, or a scanner, or a writing device of an LED printer.

  As a method for manufacturing such a rod lens array, a large number of rod lenses cut to a certain length are arranged in parallel between two substrates, and an adhesive is provided between the two substrates and the rod lenses. The rod lens is bonded and fixed between the substrates (for example, refer to Patent Document 1). Adhesive is applied to the substrate having a groove formed on the surface, and the rod lens is inserted into the groove between the substrates. A method of bonding and fixing a rod lens (for example, see Patent Document 2) or a method of bonding and fixing a rod lens between substrates by sandwiching a sheet-like adhesive between the substrate and the rod lens is known (for example, And Patent Document 3).

JP-A-61-55610 JP-A-5-333217 JP-A-9-90105

  However, the manufacturing method of Patent Document 1 requires a temporary bonding process / filling process between the substrate and the rod lens, which increases the manufacturing cost. When the rod lenses are arranged, a gap is provided between the rod lenses. If it is arranged at intervals, there will be a problem that the alignment accuracy will drop when filling the adhesive, and when filling the adhesive, if the decompression degree is set low, it takes a long time to fill, and conversely if it is set high, the adhesive will be filled rapidly. Since an air layer is partially formed, there is a problem that it is difficult to control the pressure reduction.

  Further, in the manufacturing method of Patent Document 2, it is necessary to apply an adhesive in the groove formed in the substrate, but it is difficult to apply the adhesive uniformly in the groove. There are problems that it is difficult to maintain quality due to variation in the thickness of the array, and that it is difficult to adjust the thickness of the substrate because grooves are formed in the substrate.

  Further, in the manufacturing method of Patent Document 3, it is difficult to maintain the quality because the thickness of the manufactured rod lens array will fluctuate unless the sheet-like adhesive is sandwiched uniformly so that the adhesives do not overlap each other. There is a problem. In addition, if a uniform application of high-viscosity resin is used, when the rod lens array is pressurized and embedded in the adhesive, a layer of air may be used depending on the thickness accuracy and viscosity of the sheet-like adhesive. There is also a problem that it is difficult to maintain quality.

  Furthermore, in the manufacturing method of Patent Document 3, when the roll forming method is employed and the pressure is gradually increased from the end while expelling air, it takes time to pressurize, and for example, the diameter is 0.4 mm or less. When a small-diameter rod lens is used, there is a problem that the manufactured rod lens array may be warped.

  As another general adhesive application, there is a method in which an adhesive is applied directly to a rod lens with a roll coater. However, in this method, since the adhesive is applied to the side surface of the rod lens, there is a problem that the arrangement of the rod lens is broken, and when the plastic rod lens is used, the rod lens is damaged by the high temperature adhesive. In addition, there is a problem that it is difficult to control the adhesive application accuracy and the discharge amount.

  On the other hand, in recent years, higher performance is required for rod lens arrays. In order to achieve higher performance, it is necessary to produce a high-precision rod lens array with a high precision of the arrangement of the rod lenses constituting the rod lens array and a uniform thickness. Therefore, there is a demand for a method of manufacturing a rod lens array that satisfies these requirements.

  The present invention has been made in response to such a demand, and in the manufacturing process of a rod lens array, a predetermined thickness of adhesive is applied to a substrate for an array or a rod lens with high accuracy. It is an object of the present invention to provide an adhesive application device and an adhesive application method that enable a highly accurate rod lens array to be manufactured efficiently, inexpensively and stably.

  In order to achieve the above object, the inventor of the invention according to the present application has conducted various experiments and studies, and as a result, the rod lens is pressurized and embedded in an adhesive as a cause of a decrease in the optical performance of the rod lens array. The generation of an air layer at the time of pressurization such as when the substrate coated with adhesive or the substrate coated with adhesive is pressed and bonded to the rod lens arranged on the substrate, and the alignment accuracy of the rod lens due to adhesive thickness variation It has been found that there is a decrease, and the present invention has been made.

According to the present invention, there is provided an adhesive application device for applying an adhesive to a substrate or a rod lens arranged on the substrate, having an ejection port at a lower end portion, and the adhesive from the ejection port at a predetermined pressure. And a nozzle disposed below the nozzle so as to face the discharge port, and the adhesive discharged from the nozzle is attached to the outer peripheral surface, and the attached adhesive is arranged on the substrate or the substrate. A transfer roll for transferring to the rod lens, and a pressing mechanism, and the discharge port of the nozzle is formed of two base members arranged at a predetermined interval in the lower end portion, One end of the two base members is disposed in contact with the transfer roll by pressing of the pressing mechanism, and the other end of the two base members is kept at a certain distance from the transfer roll. It is located Te The nozzle includes a shim disposed between the two base members, and the shim includes a triangular notch that extends upward from the lower end to form a gap serving as an adhesive flow path in the lower portion. The inflow path of the adhesive passing through one of the base members opens near the apex of the notch of the shim triangle, and the adhesive is formed in the gap formed between the base members by the notch of the shim. An adhesive application device is provided, which is configured to enter the upper portion and be discharged toward the transfer roll from the lower end of the flow path .
According to such a configuration, the adhesive is applied to the substrate or the like with high accuracy.

According to the present invention, there is also provided an adhesive application device for applying an adhesive to a substrate, having a discharge port at a lower end, and discharging the adhesive at a predetermined pressure from the discharge port; comprising a substrate mounting surface having a gender, comprising: a substrate holding plate disposed below the discharge port of the nozzle, a driving mechanism for relatively moving the said substrate and said holding plate nozzle, a pressing mechanism, the The discharge port of the nozzle is formed of two base members that are spaced apart from each other at a predetermined interval at the lower end portion, and one tip of the two base members is pressed by the pressing mechanism. The other tip of the two base members is arranged so that the distance from the substrate is kept constant, and the nozzle is in contact with the surface of the substrate placed on the substrate placement surface. A shim disposed between the two base members. The shim includes a triangular notch that extends upward from the lower end of the shim to form a gap serving as an adhesive flow path, and an adhesive inflow passage that penetrates one of the base members. Opened in the vicinity of the apex of the notch of the shim triangle, and the adhesive enters the upper part of the gap formed between the base members by the notch of the shim and is discharged from the lower end of the flow path adhesive applying apparatus is provided which is characterized in that it is.
According to such a configuration, the adhesive is applied to the substrate with high accuracy.

According to the other preferable aspect of this invention, the said nozzle is provided with two base members spaced apart, and the height position of the front-end | tip of the said two base members differs. Note that the tip end of the base member positioned upstream in the transfer roll rotation direction is disposed below. Moreover, when apply | coating an adhesive agent directly to a board | substrate from a nozzle, the front-end | tip of the nozzle | cap | die member located in the downstream of an application direction is arrange | positioned below.
According to such a configuration, it is possible to accurately change the discharge amount of the adhesive by a simple operation of changing the relative height of the base member.

According to the other preferable aspect of this invention, the discharge pressure of the adhesive agent from the said nozzle exists in the range of 0.05-1 Mpa.
According to the other preferable aspect of this invention, the said slit width exists in the range of 50-500 micrometers.
According to another preferred embodiment of the present invention, the transfer rate of the adhesive from the transfer roll to the substrate or the rod lens disposed on the substrate or the nozzle to the substrate is in the range of 10 to 250 mm / sec. Is within.

According to another preferred embodiment of the present invention, the thickness of the adhesive transferred or applied to the substrate or the rod lens disposed on the substrate is in the range of 20 to 200 μm. The range of 20 to 100 μm is particularly preferable when manufacturing a one-stage rod lens array, and the range of 100 to 200 μm is particularly preferable when manufacturing a two-stage rod lens array.
According to another preferred embodiment of the present invention, the variation in the thickness of the adhesive transferred or applied to the substrate or the rod lens disposed on the substrate is within ± 5 μm.

According to another aspect of the present invention, there is provided an adhesive application method for applying an adhesive to a substrate or a rod lens arranged on the substrate, wherein the adhesive is discharged from a discharge port of a nozzle at a predetermined pressure. A step of adhering the adhesive discharged from the nozzle with a predetermined width and thickness to the outer peripheral surface of the roll rotating at a predetermined speed;
Transferring the adhesive adhered to the outer peripheral surface of the roll to a substrate lens or a rod lens disposed on the substrate at a predetermined speed,
Adhesive application how, characterized in that there is provided.

According to another aspect of the present invention, an adhesive coating method for applying the adhesive to the substrate, by relatively moving said holding plate and the nozzle while discharging the adhesives from the discharge port, wherein And a step of applying the adhesive to the surface of the substrate placed on a holding plate.

  According to the present invention, in the manufacturing process of the rod lens array, a high-precision rod lens array can be efficiently and inexpensively applied by applying a predetermined thickness of adhesive to the array substrate or the rod lens with high accuracy. An adhesive application device and an adhesive application method that enable stable production are provided.

  Hereinafter, with reference to the accompanying drawings, a configuration of an adhesive application device according to a first embodiment of the present invention will be described. FIG. 1 is a side view schematically showing the configuration of the adhesive application device 1 of the present embodiment.

  As shown in FIG. 1, the adhesive application device 1 includes an adhesive charging pot 2 in which an adhesive is accommodated, an adhesive discharge dispenser gun 4, and an adhesive discharge nozzle 6. The adhesive dispensing dispenser 4 communicates with the adhesive charging pot 2 and supplies the adhesive in the adhesive charging pot 2 to the adhesive discharging nozzle 6. The adhesive discharge nozzle 6 is disposed below the adhesive charging pot 2 with the discharge port 6a facing downward via the nozzle mounting plate 8.

A cylindrical transfer roll 10 is disposed immediately below the discharge port 6 a of the adhesive discharge nozzle 6. The discharge port 6 a of the adhesive discharge nozzle 6 is disposed so as to face the outer peripheral surface of the transfer roll 10.
Further, the transfer roll 10 is configured such that the tip of the adhesive discharge nozzle 6 always abuts the outer peripheral surface of the transfer roll 10 during application of the adhesive by a pressing mechanism such as a spring mechanism (not shown). Regardless of the processing accuracy, the adhesive can be uniformly applied to the outer peripheral surface of the transfer roll 10.

  The transfer roll 10 is configured to be rotationally driven by a speed adjusting drive mechanism (not shown). The transfer roll 10 adheres the adhesive discharged from the discharge port 6a of the adhesive discharge nozzle 6 to the outer peripheral surface, and is placed on the lower holding plate 12. The adhesive can be transferred to the arranged substrate 14 or a rod lens (not shown) arranged on the substrate 14. A plurality of suction holes (not shown) communicating with the vacuum suction device are provided on the upper surface of the holding plate, and the substrate 14 is held at a predetermined position on the substrate plate by vacuum suction through these suction holes.

  The outer peripheral surface of the transfer roll 10 is made of a material that can transfer the adhesive applied by the adhesive discharge nozzle 6 to the rod lens array substrate 14 or rod lenses arranged in parallel on the substrate 14. In this embodiment, the outer peripheral surface of the transfer roll 10 is formed of silicon rubber having excellent transferability.

  The transfer rate of the adhesive to the substrate 14 or the like is preferably in the range of 1 to 250 mm / sec, more preferably 10 to 100 mm / sec. If the transfer speed is too high, the adhesive applied to the transfer roll 10 may not be transferred to the substrate 14 or the rod lens disposed on the substrate 14. On the other hand, if the transfer speed is too slow, the efficiency is poor, and it takes time to manufacture the rod lens array, which is not preferable.

  Next, the structure of the adhesive discharge nozzle 6 will be described in detail. 2 is an exploded perspective view of the adhesive discharge nozzle 6. FIG. 3 is an enlarged cross-sectional view of the discharge port 6a of the adhesive discharge nozzle 6 of FIG. As shown in FIG. 2, the adhesive discharge nozzle 6 includes two base members 16, 18 and a shim 20 having a specific thickness disposed between the base members 16, 18. .

  As shown in FIG. 2, the base members 16 and 18 are both thick plate-like members whose lower ends taper in a wedge shape, and are arranged to face each other. The shim 20 is a rectangular plate-like member, and a triangular notch 20a extending upward from the lower end is formed in a lower portion thereof. The base members 16 and 18 are connected and integrated by a connection mechanism (not shown) with the shim 20 sandwiched therebetween.

  When the shim 20 is disposed between the two base members 16, 18, a gap 22 serving as an adhesive flow path is formed between the two base members 16, 18 by the notch 20 a. As is apparent from FIG. 2, the lower end of the gap (flow path) 22 forms an opening (slit) 22a of the discharge port 6a. In the present embodiment, the adhesive discharge nozzle 6 is arranged with respect to the transfer roll 10 so that the slit 22 a extends in parallel with the axis of the transfer roll 10. Therefore, the adhesive is applied to the transfer roll 10 in a strip shape with a width corresponding to the length of the slit 22a, that is, the length of the lower end of the notch 20a.

  The adhesive enters the upper part of the gap (adhesive flow path) formed between the base members 16 and 18 by the notch 20a of the shim 20 from the inflow path 16b that penetrates the base member 16, and opens the discharge port 6a. The ink is discharged from the portion toward the transfer roll 10.

In the present embodiment, by using shims 20 having different thicknesses, the discharge amount of the adhesive can be changed by changing the width d1 of the slit between the base members 16 and 18. .
The slit width d1 between the base members 16 and 18 is preferably in the range of 50 to 500 μm. If the width d1 is too wide, the discharge amount is not stable, and when the adhesive is adhered to the transfer roll 10, the thickness of the adhesive becomes non-uniform, which may cause unevenness in thickness. On the other hand, if the slit width d1 is too narrow, it may cause clogging of the adhesive.

  The shape of the shim 20 can be appropriately changed according to the application state of the adhesive, and when the shim 20 having the shape as shown in FIG. 2 is used, it corresponds to the length of the lower end of the notch 20a. The adhesive can be applied in the form of a strip having a width to be applied. Moreover, an adhesive agent can be apply | coated to multiple stripes by making the shape of the front-end | tip (lower end) of a shim into a slit shape. That is, a plurality of slits branched to the discharge port are formed by using a shim having a branched lower end, and an adhesive is applied to the transfer roll in a plurality of spaced stripes (or thin strips). It may be configured.

  In addition, in this invention, it is good also as a structure which maintains the width | variety d1 of a slit only by the nozzle | cap | die members 16 and 18 without aligning the shim 20 between the nozzle | cap | die members 16 and 18 which comprise the adhesive agent discharge nozzle 6. FIG. For example, when there is little change in the type of rod lens array to be manufactured, the thickness of the adhesive is not changed frequently, the rotational speed of the transfer roll 10, the discharge pressure of the adhesive from the adhesive discharge nozzle 6, etc. It is only necessary to finely adjust the coating thickness of the adhesive. In this case, a slit serving as a flow path for the adhesive may be formed by providing a step in the longitudinal direction inside the base member so as to have a preset slit width d1.

  In the present embodiment, as shown in FIG. 3, the two base members 16 and 18 are assembled so that the height positions of the tips (lower ends) differ by a level difference h1. Specifically, the lower end of the base member 18 disposed on the upstream side in the rotation direction of the transfer roll 10 contacts the outer peripheral surface of the transfer roll 10, and the lower end of the base member 16 disposed on the downstream side in the rotation direction of the transfer roll 10 is The base member 18 is configured to be located above the lower end of the base member 18 by a level difference h1.

  According to such a configuration, when the distance between the transfer roll 10 and the tip portion of the base member 16 that is not in contact with the transfer roll (that is, h1) is changed, the dimension (length in the vertical direction) of the discharge port 6a is changed. The pressure applied to the nozzle tip changes, and the amount of adhesive discharged from the discharge port 6a changes. For this reason, by changing the level difference h1, the amount of adhesive discharged from the discharge port 6a can be changed, and the thickness of the adhesive applied to the transfer roll can be adjusted.

  The level difference h1 is preferably 30 to 300 μm, more preferably 50 to 200 μm. If this level difference h1 is too large, the pressure applied to the nozzle tip will be small and the discharge will not be stable, and there will be a tendency for coating spots to occur. There is a case.

  Next, the adhesive application process by the adhesive application device of this embodiment will be described. First, a predetermined amount of moisture-curing adhesive is charged into the adhesive charging pot 2 and delivered into the adhesive dispensing dispenser gun 4.

  Delivery of the adhesive to the dispenser gun 4 for discharging adhesive is performed by introducing compressed air, inert gas, or the like into the adhesive charging pot 2. In the adhesive application device 1 of the present embodiment, the pressure of the gas introduced into the adhesive charging pot 2 may be in a range that can maintain a predetermined discharge amount, preferably 0.05 to 1 MPa, more preferably 0. The range is from 10 to 0.7 MPa.

If this pressure is too high, the adhesive charging pot 2 or the like must be constructed of a pressure vessel, and in order to maintain a high pressure, it is necessary to install a compressor or the like. Cost increases due to a large structure or a large-scale device.
On the other hand, if the pressure is too low, it becomes difficult to maintain a predetermined discharge amount.

  In addition, since the viscosity of the adhesive is high and the adhesive may not be sufficiently delivered to the dispenser gun 4 for discharging the adhesive by simply pressurizing the adhesive charging pot 2, the adhesive charging pot 2, the adhesive The agent discharge dispenser gun 4, the adhesive discharge nozzle 6, and the nozzle mounting plate 8 are preferably configured to be heated appropriately.

  The dispenser gun 4 for discharging the adhesive is opened and closed by an air source (not shown) and supplies the adhesive to the adhesive discharge nozzle 6. Instead of the dispenser gun 4 for discharging the adhesive, a configuration may be used in which the adhesive is sent to the adhesive discharge nozzle 6 using a gear pump or the like.

  The adhesive supplied to the adhesive discharge nozzle 6 is discharged from the discharge port 6a and applied to the outer peripheral surface of the transfer roll 10 that rotates at a predetermined speed in a strip shape extending in the circumferential direction. In the adhesive application device 1 of the present embodiment, the rotation speed of the transfer roll 10 is set within a range of 10 to 250 mm / sec.

The band-shaped adhesive attached to the outer peripheral surface of the transfer roll 10 is transferred to the substrate 14 held on the holding plate 12 or the surface of the rod lens arranged on the substrate 14.
The transfer of the adhesive from the transfer roll 10 to the substrate 14 or the surface of the rod lens arranged on the substrate 14 has a structure in which the holding plate 12 is fed by the transfer roll 20, and the holding plate 12 is placed on the moving stage. A structure in which the holding plate 12 is moved and transferred, and a structure in which the holding plate 12 is fixed and the transfer roll 10 is arranged on a moving stage and the transfer roll 10 is moved and transferred can be adopted.

At this time, the thickness of the adhesive applied to the substrate 14 or the rod lens disposed on the substrate 14 is preferably in the range of 20 to 200 μm. If the thickness of the adhesive is too thick, there is a possibility that when the rod lens array is pressed, depending on the application accuracy of the resin layer between the substrate 14 and the rod lens, it may be a cause of uneven arrangement of the rod lenses. On the other hand, if the thickness of the adhesive is too thin, a gap is formed between the rod lens and the substrate, which becomes an air layer and contributes to a decrease in optical performance. Further, the thickness variation of the adhesive in the coating process is preferably within ± 5 μm.
In the case of manufacturing a one-stage rod lens array in which rod lenses are arranged in parallel between the substrates, it is particularly preferable that the thickness of the adhesive is in the range of 20 to 100 μm. For example, when manufacturing a two-stage rod lens array that is arranged in two stages in a stacked state, the thickness of the adhesive is particularly preferably in the range of 100 to 200 μm.

  As described above, the thickness of the adhesive applied (transferred) to the transfer roll 10 or the substrate 14 or the rod lens disposed on the substrate 14 depends on the discharge pressure from the adhesive discharge nozzle 6 and the adhesive discharge. Adjustment is made to change the slit width of the nozzle 6, the step h 1 at the tip of the two cap members 16, 18 of the adhesive discharge nozzle 6, or the rotational speed of the transfer roll 10.

According to the adhesive application device having such a configuration, the adhesive is not applied directly from the adhesive discharge nozzle to the substrate or the rod lens arranged on the substrate, so that the substrate or the rod lens is damaged. There is no. Further, by using the rotational movement of the transfer roll, the adhesive can be applied with high positional accuracy with a simpler structure than the linear movement.
Furthermore, by providing a step at the tips of the two base members of the adhesive discharge nozzle, the distance from the transfer roll can be kept constant, so that the adhesive can be applied with high accuracy.

  Also, by applying an adhesive in strips or multiple stripes, when the rod lens is pressurized and embedded in the adhesive, or when the substrate coated with the adhesive is pressed and bonded to the rod lenses arranged on the substrate For example, the generation of an air layer can be suppressed. As a result, the rod lens array can be efficiently and stably manufactured at low cost without adding a temporary bonding process or a filling process.

  Next, an adhesive application device 51 according to a second embodiment of the present invention will be described. FIG. 6 is a side view schematically showing the configuration of the adhesive application device 51, and FIG. 7 is an enlarged sectional view of the discharge port of the adhesive discharge nozzle of the adhesive application device 51.

The basic configuration of the adhesive application device 51 is the same as that of the adhesive application device 1 of the first embodiment, except that the adhesive is directly applied to the substrate without using a transfer roll. It is.
Therefore, the configuration of the adhesive application device 51 will be described focusing on the differences.
As shown in FIG. 6, the adhesive application device 51 includes an adhesive charging pot 52 in which an adhesive is accommodated, an adhesive discharge dispenser gun 54, and an adhesive discharge nozzle 56.

  The adhesive discharge dispenser 54 communicates with the adhesive charging pot 52 and supplies the adhesive in the adhesive charging pot 52 to the adhesive discharging nozzle 56. The adhesive discharge nozzle 56 is disposed below the adhesive charging pot 52 with the discharge port 56a facing downward via the nozzle mounting plate 58.

The discharge port 56a of the adhesive discharge nozzle 56 is disposed so as to face a substrate holding surface (substrate mounting surface) 60a that is the upper surface of the holding plate 60 on which the substrate is mounted.
The substrate holding surface 60a is made of an elastic material. In the present embodiment, for example, a surface layer having a thickness of about 5 mm of the holding plate 60 including the holding and holding surface 60a is formed of a silicon rubber sheet, so that the substrate holding surface 60a has appropriate elasticity. The silicon rubber sheet is held on the plate main body by a convex portion formed on the upper surface of the plate main body located under the holding plate.

  A plurality of suction holes (not shown) communicating with the vacuum suction device are provided in the substrate holding surface 60a, and the substrate is held at a predetermined position on the substrate holding surface 60a by vacuum suction through these suction holes.

  Further, the adhesive application device 51 is a substrate in which the tip of the adhesive discharge nozzle 56 is placed and fixed on the substrate holding surface 60a during application of the adhesive by biasing a pressing mechanism (not shown) such as a spring mechanism. It is comprised so that it may contact | abut on the surface (application surface) of 14. FIG. For this reason, even when the substrate 14 has thickness unevenness, the adhesive is applied to the application surface of the substrate 14 with a uniform thickness.

  The adhesive application device 51 includes a drive mechanism (not shown) capable of adjusting the speed for moving the adhesive discharge nozzle 56 and the holding plate 60 relative to each other. As a drive mechanism, a drive mechanism for moving the moving stage on which the holding plate 60 is placed with respect to the stationary adhesive discharge nozzle 56, or an adhesive charging pot 52, an adhesive discharge dispenser gun 54, an adhesive A drive mechanism or the like is employed in which the discharge nozzle 56 and the like are attached to the moving stage and moved with respect to the stationary holding plate 60.

Next, the structure of the discharge port 56a of the adhesive discharge nozzle 56 will be described.
In the adhesive discharge nozzle 56 of the present embodiment, the two base members 62 and 64 are arranged so as to form a gap 66 having a width d2 between them by the same configuration as the discharge nozzle 6 of the first embodiment. The lower end of the gap 66 constitutes an opening (slit) 66a of the discharge port 56a. In the present embodiment, the slit 66 a is disposed so as to extend in a direction orthogonal to the relative movement direction of the substrate 14 and the adhesive discharge nozzle 56. Accordingly, the adhesive is applied to the substrate 14 in a band shape with a width corresponding to the length of the lower end of the slit 66a.

  As shown in FIG. 7, the two base members 62, 64 are assembled such that the height positions of the tips (lower ends) differ by a level difference h2. Specifically, the lower end (tip) of the base member 64 disposed on the downstream side in the application direction of the adhesive discharge nozzle 56 and the substrate 14 abuts on the application surface of the substrate 14 and is disposed on the upstream side in the application direction. The lower end (tip) of the base member 62 is configured to be positioned above the lower end (tip) of the base member 64 by a level difference h2.

  According to such a configuration, by changing the level difference h2, the dimension (length in the vertical direction) of the discharge port 56a changes, and the amount of adhesive discharged from the discharge port 56a, that is, the amount of applied adhesive changes. For this reason, by changing the level difference h2, it is possible to adjust the thickness of the adhesive applied to the substrate 14 by changing the amount of adhesive discharged from the discharge port 56a.

  In the present embodiment, the tip surface of the adhesive discharge nozzle 56 is coated with DLC (Diamond, Like, Carbon). With such a configuration, frictional heat is hardly generated even when the tip surface of the nozzle comes into contact with the substrate 14, so that the substrate 14 is prevented from being damaged by the frictional heat, and the contact causes the substrate 14 to Damage is also suppressed. Moreover, you may employ | adopt the structure etc. which form the tip surface of a nozzle with another low friction coating or a low friction material.

  In the adhesive application device 51 according to the present embodiment, the discharge port 56 a of the adhesive discharge nozzle 56 is pressed against the surface of the substrate 14 placed on the holding plate 60 and bonded from the discharge port 56 a of the adhesive discharge nozzle 56. While discharging the agent, the adhesive discharge nozzle 56 and the holding plate 60 are relatively moved, and the adhesive is sequentially applied to the surface of the substrate 14 from the upstream side to the downstream side in the application direction indicated by the arrow A in FIG. Apply.

  The relative movement speed of the adhesive discharge nozzle 56 and the holding plate 60 which is the application speed of the adhesive to the substrate 14 is preferably in the range of 1 to 250 mm / sec, more preferably 10 to 100 mm / sec. If the application speed is too high, the adhesive may not be applied to the substrate 14. On the other hand, if the coating speed is too slow, the efficiency is poor, and it takes time to manufacture the rod lens array, which is not preferable.

  When the adhesive is applied while the discharge port 56a of the adhesive discharge nozzle 56 is in contact with the surface of the substrate 14 as in this embodiment, the adhesive is applied with the substrate 14 placed on a plate having no elasticity. In this case, the adhesive discharge nozzle 56 biased toward the substrate jumps up, the thickness of the adhesive is not uniform, and application spots may occur. However, in this embodiment, since the substrate holding surface 60a has elasticity, the above-described jumping of the adhesive discharge nozzle 56 is prevented.

  Further, according to the adhesive application device of the present embodiment, by providing a step at the tip of the two base members of the adhesive discharge nozzle, the distance from the substrate can be kept constant, so that the adhesive is applied. It can be performed with high accuracy.

  Furthermore, according to the adhesive application device of this embodiment, since the adhesive is directly applied to the substrate, the application time can be shortened. Also, since there are few drive parts and wear parts, maintenance can be performed easily and costs can be reduced.

The present invention is not limited to the above-described embodiment, and various changes or modifications can be made within the scope of the matters described in the claims.
For example, in the above-described embodiment, a moisture curable adhesive is used as the adhesive. However, the present invention is not limited to the moisture curable adhesive, and the adhesive application apparatus and the adhesive using other adhesives are used. It is applicable also to the agent coating method.

Hereinafter, the present invention will be described specifically by way of examples.
Example 1
In the examples, a moisture-curing adhesive (manufactured by Sekisui Chemical Co., Ltd., trade name) was used as the adhesive material. The adhesive was charged into the adhesive charging pot 2, and air was sealed in the pot. Pressurized and held at 3 MPa, and the width of 26 mm, the length of 252 mm, and the thickness of 48 to 51 μm on the outer peripheral surface of the transfer roll 10 at a discharge pressure of 0.3 MPa from the six adhesive discharge nozzles 6 communicated with the adhesive charging pot 2 Six strip-shaped adhesives were applied at a 27.5 mm pitch.

  As shown in FIG. 2, the adhesive discharge nozzle 6 has a structure in which a shim 20 having a thickness of 200 μm is disposed between the base members 16 and 18, and the tip of the base member 18 protrudes 120 μm from the tip of the base member 16 ( h1 = 120 μm), and the transfer roll 10 was placed so that the tip of the cap member 16 was in contact with the transfer roll 10 as shown in FIG. The slit width d1 at this time was 200 μm, and the rotation speed of the transfer roll 10 was 65 mm / sec. Six of the adhesives attached to the transfer roll 10 were transferred onto the substrate 14 held on the holding plate 12 at a 27.5 mm pitch. The transfer speed at this time was 60 mm / sec, and the size of the substrate to be transferred was A4 size.

  The application unevenness (variation) of the adhesive of the example is ± 2 μm, and it can be seen that the adhesive can be applied with high accuracy.

  The substrate onto which the adhesive had been transferred was placed under a rod lens arranged in parallel on a grooved flat plate and pressed. The press was performed at a temperature of 75 ° C. for 1 minute, followed by 20 ° C. for 1 minute. After the press, a large number of rod lenses arranged in parallel fixed to the substrate were cured and cured for 12 hours.

  A large number of rod lenses arranged in parallel fixed on a cured and cured substrate are bonded to the substrate to which the adhesive produced in the same manner as above is bonded, and pressed under the same conditions as above to produce a rod lens array original plate. Then, curing for 24 hours was performed. Next, the original plate was cut in increments of 4.5 mm, and both end surfaces of the cut rod lens array were mirror-polished perpendicular to the optical axis to produce a rod lens array having a lens length of 4.4 mm.

And MTF which shows the resolution of a rod lens array was measured.
FIG. 4 shows an MTF measuring apparatus. This measuring apparatus includes a light source 30, a wavelength filter 32, a diffuser plate 34, a grating (test chart) 36, and a CCD line sensor 38 that are sequentially arranged. The grating 36 and the CCD line sensor 38 are separated by a predetermined conjugate length of the rod lens.
In the present embodiment, a grating 36 having a spatial frequency of 12 (line pair (Lp) / mm) is used. Spatial frequency refers to the number of lines in a width of 1 mm, where a combination of a transparent line and a light-shielding (black) line is one line.

表１から明らかなように、得られたロッドレンズアレイは、ロッドレンズの配列精度が高く、ＭＴＦが高く、そのバラツキも小さいものであった。
なお、表において、ＭＴＦ Ｃ．Ｖ．はＭＴＦのばらつきの指標となるものである。 For measurement, a rod lens array 40 is installed between the grating 36 and the CCD line sensor 38.
Then, the CCD line sensor 38 installed on the imaging plane measures the light quantity of the image of the grating 36, and measures the maximum value (iMAX) and minimum value (iMIN) of the measured light quantity as shown in FIG. It calculated | required by the following formula.
MTF (%) = ((iMAX−iMIN) / (iMAX + iMIN)) × 100
The results are shown in Table 1.

As is clear from Table 1, the obtained rod lens array had a high arrangement accuracy of the rod lenses, a high MTF, and a small variation.
In the table, MTF C.I. V. Is an indicator of MTF variation.

(Example 2)
In Example 2, the adhesive application device 51 in direct application has a structure in which five shim shapes are applied per application, and a belt-like adhesive having a width of 4.5 mm, a length of 252 mm, and a thickness of 48 to 51 μm is used. A rod lens array was prepared in exactly the same manner as in Example 1 except that it was applied directly to a total of 30 substrates 6 times at a pitch of 5.5 mm.

  As shown in FIG. 7, the adhesive discharge nozzle 56 has a 200 μm thick shim disposed between the base members 62 and 64, and the tip of one base member 64 protrudes 60 μm from the tip of the other base member 62. As shown in FIG. 7, the structure (h2 = 60 μm) was installed so that the tip of the base member 64 was in contact with the substrate 14. The width d2 of the slit 70 was 200 μm, and the adhesive application speed to the substrate of the coating apparatus was 100 mm / sec. The size of the substrate to be applied was A4 size.

  The application unevenness (variation) of the adhesive of Example 2 is ± 2 μm, and it can be seen that the adhesive can be applied with high precision as in Example 1.

表２から明らかなように、得られたロッドレンズアレイは、ロッドレンズの配列精度が高く、ＭＴＦが高く、そのバラツキも小さいものであった。 The rod lens array produced in Example 2 was measured for MTF by the same method as in Example 1. The results are shown in Table 2.

As is apparent from Table 2, the obtained rod lens array had a high arrangement accuracy of the rod lenses, a high MTF, and a small variation.

このように、一定間隔にてロッドレンズを配列した場合では、ロッドレンズの配列精度が低下しており、その結果、ＭＴＦが低く、そのバラツキも大きいものであった。 (Comparative example)
Next, a comparative example will be described.
A rod lens array was produced by the method disclosed in Japanese Patent Application Laid-Open No. 5-333217.
However, the rod lens arrangement jig is a grooved flat plate, and the adhesive material is an epiform (carbon black added to contain 0.5% by mass of carbon black. did. The MTF was measured for the rod lens array by the same method as in the example. The results are shown in Table 3.

Thus, when the rod lenses are arranged at regular intervals, the arrangement accuracy of the rod lenses is lowered, and as a result, the MTF is low and the variation is large.

It is drawing which shows typically the structure of the adhesive agent coating apparatus of the 1st Embodiment of this invention. It is a disassembled perspective view of the structure of the discharge nozzle of the adhesive agent coating apparatus of FIG. It is drawing which shows typically the structure of the front-end | tip of the discharge nozzle of FIG. It is a schematic block diagram of the measuring apparatus of the resolution (MTF) of a rod lens array. It is a graph which shows the measurement result of the bridge of a lattice image. It is drawing which shows typically the structure of the adhesive agent coating apparatus of the 2nd Embodiment of this invention. It is drawing which shows typically the structure of the front-end | tip of the discharge nozzle of the adhesive agent coating apparatus of FIG.

Explanation of symbols

1: Adhesive application device (roll transfer)
2: Adhesive charging pot 4: Adhesive discharge dispenser gun 6: Adhesive discharge nozzle 6a: Discharge port 6b: Inflow path 10: Transfer roll 12: Holding plate 14: Substrate 16: Base member 18: Base member 20: Shim 20a: Notch

Claims (4)

An adhesive application device for applying an adhesive to a substrate or a rod lens arranged on the substrate,
A nozzle having a discharge port at the lower end, and discharging an adhesive from the discharge port at a predetermined pressure;
Transfer that is arranged below the nozzle and facing the discharge port, and adheres the adhesive discharged from the nozzle to the outer peripheral surface and transfers the attached adhesive to a substrate or a rod lens arranged on the substrate. Roles,
And the pressing mechanism, equipped with a,
The discharge port of the nozzle is formed of two base members that are spaced apart from each other at a predetermined interval at the lower end portion,
One end of the two base members is disposed in contact with the transfer roll by pressing of the pressing mechanism, and the other end of the two base members is kept at a certain distance from the transfer roll. Arranged ,
The nozzle includes a shim disposed between the two base members,
The shim includes a triangular notch that extends upward from the lower end of the shim to form a gap serving as a flow path for the adhesive, and an inflow path for the adhesive passing through one of the base members is provided in the shim. Opening in the vicinity of the apex of the triangular notch, the adhesive enters the upper part of the gap formed between the cap members by the shim notch, and is discharged from the lower end of the flow path toward the transfer roll. Configured to,
An adhesive application device . An adhesive application device for applying an adhesive to a substrate,
A nozzle having a discharge port at a lower end, and discharging an adhesive at a predetermined pressure from the discharge port;
A substrate holding plate provided with a substrate mounting surface having elasticity, and disposed below the discharge port of the nozzle;
A drive mechanism for relatively moving the substrate holding plate and the nozzle;
Includes a pressing mechanism, the,
The discharge port of the nozzle is formed of two base members that are spaced apart from each other at a predetermined interval at the lower end portion,
One tip of the two base members is brought into contact with the surface of the substrate placed on the substrate placement surface by pressing of the pressing mechanism, and the other tip of the two base members is in contact with the substrate. Arranged so that the spacing is kept constant ,
The nozzle includes a shim disposed between the two base members,
The shim includes a triangular notch that extends upward from the lower end of the shim to form a gap serving as a flow path for the adhesive, and an inflow path for the adhesive passing through one of the base members is provided in the shim. Opened in the vicinity of the apex of the triangular notch, the adhesive enters the upper part of the gap formed between the base members by the notch of the shim and is discharged from the lower end of the flow path. ,
An adhesive application device. An adhesive application method for applying an adhesive to a substrate or a rod lens arranged on the substrate using the apparatus according to claim 1,
A discharge step of discharging the adhesive from the discharge port of the nozzle at a predetermined pressure;
Attaching the adhesive discharged from the nozzle to the outer peripheral surface of the roll rotating at a predetermined speed with a predetermined width and thickness;
Transferring the adhesive adhered to the outer peripheral surface of the roll to a substrate lens or a rod lens disposed on the substrate at a predetermined speed,
An adhesive coating method characterized by the above. An adhesive application method for applying an adhesive to a substrate using the apparatus according to claim 2, wherein the holding plate and the nozzle are relatively moved while discharging the adhesive from a discharge port, and the holding plate Applying the adhesive to the surface of the substrate placed on the substrate,
An adhesive coating method characterized by the above.

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