CN216327530U - Wafer polishing equipment - Google Patents

Abstract

The utility model discloses a wafer polishing device, which at least comprises: a grinding table on which a wafer is placed; the polishing head is arranged on the polishing table, a groove is formed in one side of the polishing head, and the groove allows the wafer to be pressed in; the polishing component is fixed in the groove; and an assembly member removably coupled to the polishing assembly; wherein, polishing subassembly includes: the assembling ring is fixed in the groove; and the cushion pad is adhered to the working plane of the assembling ring and is concentrically arranged with the assembling ring. The utility model can improve the polishing stability of the silicon carbide wafer.

Description

Wafer polishing equipment

Technical Field

The utility model belongs to the technical field of wafer processing, and particularly relates to wafer polishing equipment.

Background

Silicon carbide materials are widely used in the fields of ceramic ball bearings, valves, semiconductor materials, gyroscopes, measuring instruments, aerospace and the like, and have become an irreplaceable material in many industrial fields. There are various polishing apparatuses for silicon carbide wafers, in which pressure is transmitted to a silicon carbide wafer by a polishing head in a chemical mechanical polisher for silicon carbide polishing. Since the polishing head is in direct contact with the wafer and is subjected to a certain pressure. Therefore, whether the polishing head assembly is assembled well or not is directly related to the processing quality of the wafer, and even influences whether the silicon carbide wafer is cracked during the polishing process.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a wafer polishing device which can improve the polishing stability of a silicon carbide wafer.

In order to solve the technical problems, the utility model is realized by the following technical scheme:

the utility model provides a wafer polishing device, which at least comprises:

the polishing device comprises a polishing table, a polishing device and a polishing device, wherein a wafer is placed on the polishing table;

the polishing head is arranged on the grinding table, a groove is formed in one side of the polishing head, and the groove allows the wafer to be pressed in;

the polishing component is fixed in the groove; and

a fitting removably coupled to the polishing assembly;

wherein the polishing assembly comprises:

the assembling ring is fixed in the groove; and

the blotter bonds on the working plane of fitting ring, the blotter crimping in the wafer, just the blotter with the concentric setting of fitting ring.

In an embodiment of the present invention, the assembly ring is circular, and an outer ring cylindrical surface of the assembly ring is attached to a groove surface of the groove.

In an embodiment of the present invention, the cushion pad is circular, and an inner ring cylindrical surface of the cushion pad is concentric with an inner ring cylindrical surface of the mounting ring.

In one embodiment of the utility model, the cushion is located within the footprint of the mounting ring.

In an embodiment of the utility model, the fitting member comprises a first fitting shaft, and the fitting ring is fitted on the first fitting shaft.

In an embodiment of the present invention, the assembly member includes a second assembly shaft, the second assembly shaft is fixedly connected to the first assembly shaft, and the cushion pad is sleeved on the second assembly shaft.

In an embodiment of the present invention, the first fitting shaft and the second fitting shaft are coaxial.

In an embodiment of the present invention, an axial diameter of the second assembling shaft is larger than an axial diameter of the first assembling shaft.

In an embodiment of the utility model, the buffer pad is pressed on the wafer.

In an embodiment of the utility model, a polishing pad is disposed on a table top of the polishing table, and the wafer is disposed on the polishing pad.

As described above, the present invention provides a wafer polishing apparatus, which can protect a wafer during polishing the wafer, so that the wafer is uniformly stressed, and the wafer is prevented from being broken due to non-uniform pressure transmitted from a polishing head to the wafer. Meanwhile, the polishing component and the product component are provided, so that the polishing head can be quickly and effectively assembled to ensure that the wafer is uniformly stressed, the assembly precision of the polishing component is improved, and the possibility that the wafer is broken due to the assembly error of the polishing component is reduced. The utility model provides a wafer polishing device, which improves the polishing stability of a silicon carbide wafer and effectively improves the polishing yield of the wafer.

Of course, it is not necessary for any product in which the utility model is practiced to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic front view of the polishing machine.

Fig. 2 is a schematic top view of the polishing machine.

Fig. 3 is an assembled view of the cushion (showing the work plane).

FIG. 4 is an assembled view of the cushion (showing the adhesive-backed plane).

Description of reference numerals: the polishing machine comprises a machine base 10, a polishing table 101, a polishing pad 102, a wafer 103, a support 20, a support plate 201, a slide rail 202, a slide hole 2021, a slide plate 30, a motor 40, a rotating shaft 401, a polishing head 50, a groove 501, a polishing component 60, a mounting ring 601, a working plane 6011, a cushion 602, a gum-backed plane 6021, a regulator 70, a diamond plate 701, a mounting part 80, a first mounting shaft 801, a second mounting shaft 802 and a catheter 90.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 and 2, the semiconductor device generally requires a nanoscale flatness to ensure uniform resistance and improve the photolithography precision. With the rapid growth in the semiconductor industry, electronic devices are shrinking in size, requiring wafer surface flatness on the order of nanometers, and global planarization is necessary when the minimum feature size reaches, for example, below 0.25 μm. Therefore, chemical mechanical polishing is the mainstream polishing method in the semiconductor industry, and by using the combination of chemical etching and mechanical force, a smooth polishing process is performed on the silicon wafer 103 or other substrate material, which can realize global wafer planarization with high precision.

Referring to fig. 1-4, the present invention discloses a wafer polishing apparatus 1, wherein the wafer polishing apparatus 1 includes a base 10, a polishing table 101, a polishing pad 102, a polishing head 50, a polishing assembly 60, a regulator 70, a fitting 80, and a liquid guide tube 90. Wherein the grinding table 101 is rotatably connected to the machine base 10. A polishing pad 102 is placed on the top of the polishing table 101, and a wafer 103 is placed on the polishing pad 102. A plurality of brackets 20 are fixed on the working surface of the machine base 10, a support plate 201 is connected between the plurality of brackets 20, and a motor 40 is slidably mounted on the support plate 201. The rotor end of the motor 40 is connected with a rotating shaft 401, and the other end of the rotating shaft 401 is connected to the polishing head 50. One side of the polishing head 50 is connected to the rotating shaft 401, and the other side is provided with a groove 501, the groove 501 is adapted to the wafer 103, and the polishing assembly 60 is fixed in the groove 501. While the adjuster 70 is used to adjust the position of the polishing pad 102 and the fitting 80 is used to assist in assembling and positioning the polishing assembly 60.

Referring to fig. 1 and 2, the polishing head 50, the catheter 90 and the regulator 70 are located within the area of the polishing pad 102. In the present embodiment, the polishing pad 102 covers the table top placed on the polishing table 101, the polishing head 50, the adjustor 70 and the liquid guiding tube 90 are located at eccentric positions on the table top of the polishing table 101, and the polishing head 50, the adjustor 70 and the liquid guiding tube 90 may be arranged in a triangular manner, so that during the rotation of the polishing table 101, along with the friction of the wafer 103, the polishing pad 102 is in a stable position and will not be greatly deviated on the polishing table 101. In other embodiments, the polishing head 50 and the regulator 70 may be symmetric about the axis of the polishing table 101, which also ensures that the polishing pad 102 is in a stable position and state during the polishing process of the wafer 103.

Referring to fig. 1 and 2, the number of the supporting frames 20 is even, and the supporting frames 20 are symmetrically fixed on both sides of the polishing table 101. In one embodiment of the utility model, the number of the holders 20 is, for example, 2, and then one holder 20 is fixed to each side of the grinding table 101, and in other embodiments of the utility model, the number of the holders 20 is, for example, 4 or, for example, 6, and then two or three holders 20 are fixed to each side of the grinding table 101. The supporting plate 201 is fixed between the brackets 20 at both sides of the grinding table 101. In the embodiment, the supporting plate 201 is fixed on one side of the machine base 10, the polishing table 101 is installed on the other side of the machine base 10, and the supporting plate 201 does not completely shield the polishing table 101, so as to facilitate replacing the polishing pad 102 or replacing the polishing liquid in the liquid guiding tube 90 during the polishing process of the wafer 103, and also facilitate adjusting the position of the polishing pad 102.

Referring to fig. 1 and fig. 2, in an embodiment of the present invention, a guide rail 202 is fixed on the supporting plate 201, the guide rail 202 includes a sliding hole 2021, the rotating shaft 401 is slidably connected in the sliding hole 2021, and a shaft wall of the rotating shaft 401 contacts with a hole wall of the sliding hole 2021. In this embodiment, the shape of the slide hole 2021 is not limited to an ellipse. When the slide hole 2021 is oval, the rotating shaft 401 can smoothly contact with the wall of the slide hole 2021 when the rotating shaft 401 slides in the slide hole 2021 and contacts with the edge, so that the impact caused by collision is reduced, and the operation of the equipment is protected. In the present embodiment, the slide rail 202 is slidably connected to the slide plate 30, the motor 40 is fixed on the slide plate 30, and the rotating shaft 401 penetrates through the slide plate 30. The sliding of the motor 40 on the support plate 201 facilitates removal of the polishing head 50 when replacing the polishing pad 102, facilitates replacement and maintenance of the polishing head 50, and facilitates assembly and disassembly of the polishing assembly 60. The sliding plate 30 slides on the sliding rail 202, the rotating shaft 401 plays a limiting role, and the sliding plate 30 can protect the motor 40 in the moving process of the motor 40.

Referring to fig. 1 and 2, in one embodiment of the utility model, the recess 501 and the wafer 103 are adapted, that is, the wall of the recess 501 and the wall of the wafer 103 can be attached. In other embodiments of the present invention, the wafer 103 may be connected in the groove 501, and there is a gap between the sidewall of the wafer 103 and the groove 501. Therefore, during polishing assembly, the wafer 103 and the central portion of the recess 501 are pressed together. Further, in the present embodiment, the wafer 103 is fixed by the polishing assembly 60. The groove surface of the groove 501 is a regular shape, in this embodiment, the groove 501 may be a cylindrical groove surface, and in other embodiments, the shape of the groove surface of the groove 501 may also be changed according to the specific requirements of the wafer 103, for example, the shape of the groove surface of the groove 501 is a cone, a truncated cone, or the like.

Referring to fig. 1 and 2, in one embodiment of the utility model, the polishing assembly 60 includes a mounting ring 601 and a cushion 602, wherein the mounting ring 601 is fixed in the recess 501, and the cushion 602 is adhered to the mounting ring 601. The cross section of the mounting ring 601 may be a circular ring shape, and the mounting ring 601 includes an outer ring cylindrical surface and an inner ring cylindrical surface. One side plane of the mounting ring 601 is fixedly connected to the bottom surface of the groove 501, and the other side plane is a working plane. The cross-section of the bumper pad 602 may be circular, and the bumper pad 602 also includes an outer annular cylindrical surface and an inner annular cylindrical surface. One side plane of the cushion pad 602 directly contacts the wafer 103 and is a compression joint, and the other side plane of the cushion pad 602 is an adhesive-backed plane coated with adhesive for adhering the cushion pad 602 and the mounting ring 601. The mounting ring 601 and the cushion 602 in the present invention are regular in shape, so as to facilitate assembly and facilitate uniform diffusion of pressure when the wafer 103 is pressed. The circular cross-section facilitates uniform pressure transfer to the wafer 103 when the cushion 602 is pressed against the wafer 103. The mounting ring 601 and the cushion 602 of the present invention are not limited to circular cross-sections, but in other embodiments, the cross-section may be elliptical in cross-section, subject to the conduction requirement of pressure.

Referring to fig. 1 and 2, in one embodiment of the present invention, the mounting ring 601 and the cushion 602 are concentrically disposed, and further, are concentrically disposed. That is, the inner annular cylindrical surfaces of the mounting ring 601 and the cushion 602 are coaxial to facilitate the fastening of the mounting ring 601 and the cushion 602. Since the cushion 602 is in direct contact with the wafer 103 and needs to transmit pressure to the wafer 103, the material may be a very soft material, such as foam. Since the thickness of the cushion pad 602 is extremely thin in the polishing process of the wafer 103, the attachment between the mount ring 601 and the cushion pad 602 requires extremely high flatness for the attachment therebetween in the case of manual assembly. Therefore, in the embodiment of the present invention, under the condition that the mounting ring 601 and the cushion pad 602 are concentric, the working plane and the adhesive-backed plane are bonded, which is beneficial to the smooth attachment of the cushion pad 602 and the mounting ring 601, so as to ensure the uniform pressure transmitted from the cushion pad 602 to the wafer 103, and avoid the condition that the surface of the cushion pad 602 has protrusions or recesses, so as to prevent the wafer 103 from being broken due to uneven stress. And the mounting ring 601 covers the cushion 602 so as to protect the cushion 602.

Referring to fig. 1-4, in one embodiment of the present invention, the assembly member 80 includes a first assembly shaft 801 and a second assembly shaft 802. The first fitting shaft 801 and the second fitting shaft 802 may be cylindrical, and an end surface of one end of the first fitting shaft 801 is parallel to a bottom surface of the groove 501, and the other end is fixedly coupled to one end of the second fitting shaft 802. The first assembly shaft 801 and the second assembly shaft 802 are concentric. The first assembling shaft 801 is fitted with the assembling ring 601, specifically, the shaft wall of the first assembling shaft 801 is connected with the inner ring cylindrical surface of the assembling ring 601, and the first assembling shaft 801 is coaxial with the inner ring cylindrical surface of the assembling ring 601. The second assembling shaft 802 is fitted with the cushion pad 602, specifically, the shaft wall of the second assembling shaft 802 is connected with the inner annular cylindrical surface of the cushion pad 602, and the second assembling shaft 802 is coaxial with the inner annular cylindrical surface of the cushion pad 602.

Referring to fig. 1-4, in an embodiment of the present invention, an end surface of the first assembling shaft 801 is parallel to a bottom surface of the recess 501, and the first assembling shaft 801 is detachably connected to the bottom surface of the recess 501 by a bolt and a screw, a spring, or the like. When the polishing assembly 60 is assembled, the assembly ring 601 is sleeved outside the first assembly shaft 801, the cushion 602 is sleeved outside the second assembly shaft 802, and the working plane of the assembly ring 601 abuts against the end face of the second assembly shaft 802. While the cushion 602 slides along the surface of the second mounting shaft 802 with its adhesive-backed plane located on the side near the working plane. With the mounting ring 601 and the cushion 602 concentric, the attachment of the mounting ring 601 to the cushion 602 (the work plane and the adhesive backed plane) is accomplished. After the assembling ring 601 and the cushion 602 are bonded, the connection relationship between the first assembling shaft 801 and the groove 501 is released, and then the assembling member 80 is directly taken out of the polishing assembly 60, so that the process is convenient to assemble and disassemble. The mounting ring 601 is then secured within the recess 501, completing the installation of the polishing assembly 60. In other embodiments of the present invention, the end surface of the first fitting shaft 801 and the bottom surface of the groove 501 are parallel to each other, and the first fitting shaft 801 and the groove 501 are independent from each other. When the polishing assembly 60 is assembled, the assembly ring 601 and the buffer pad 602 are respectively sleeved outside the first assembly shaft 801 and the second assembly shaft 802, after the assembly of the assembly ring 601 and the buffer pad 602 is completed, the assembly member 80 is directly taken out of the polishing assembly 60, and then the polishing assembly 60 is assembled in the groove 501, so that the installation of the polishing assembly 60 is completed. This process facilitates precise assembly between the mounting ring 601 and the buffer pad 602, and is suitable for wafer polishing.

Referring to fig. 1-4, in one embodiment of the utility model, the assembly 80 and polishing assembly 60 are adapted for use with a variety of polishing heads 50 and a variety of series of wafers 103, such as 6 inch silicon carbide wafers 103. The radius of the first assembling shaft 801 is, for example, 60 to 63mm, and the machining tolerance thereof may be, for example, ± 0.05 mm. When processing, for example, a 6 inch silicon carbide wafer 103, the radius of the first assembly axis 801 is, for example, (61.80 ± 0.05) mm. The radius of the second assembling shaft 802 is, for example, 61-64 mm, and the machining error thereof may be, for example, ± 0.05 mm. When processing, for example, a 6 inch silicon carbide wafer 103, the radius of the second assembly axis 802 is, for example, (62.85 ± 0.05) mm. And the difference between the radii of the first assembling shaft 801 and the second assembling shaft 802 is, for example, 0.05-2 mm so as to satisfy the condition that the assembling ring 601 covers the cushion 602. When processing a 6 inch silicon carbide wafer 103, for example, the difference in radius between the first assembly axis 801 and the second assembly axis 802 may be (1.05 ± 0.05) mm, for example. In order to facilitate assembly, the height of the first assembly shaft 801 is, for example, 5-8 mm, and the height of the second assembly shaft 802 is, for example, 25-40 mm. And the height of the second assembling shaft 802 is, for example, 2 to 5 times the height of the first assembling shaft 801.

Referring to fig. 1-4, in one embodiment of the present invention, the thickness of the mounting ring 601 is greater than or equal to the height of the first mounting axis 801. The height difference between the thickness of the mounting ring 601 and the first mounting axis 801 is, for example, 0 to 3mm, specifically, 1mm, 1.5mm, or 2 mm. So that when the mounting ring 601 is sleeved outside the first mounting shaft 801, the end face of the mounting ring 601 can abut against the end face of the second mounting shaft 802 to further limit the mounting ring 601, and the working plane and the adhesive-backed plane are parallel, so as to move the cushion 602 to adhere the cushion 602 to the working plane of the mounting ring 601.

Referring to fig. 3 and 4, in an embodiment of the utility model, the first assembly shaft 801 and the second assembly shaft 802 may be made of stainless steel or other metal materials.

Referring to fig. 1 and 2, in one embodiment of the present invention, the adjuster 70 may be a diamond adjuster, and the adjuster 70 includes a supporting end and a fixed end, the supporting end is fixed on the machine base 10, and the fixed end is connected to the polishing pad 102. And further, the fixing end rotates compared to the housing 10.

Referring to fig. 1 and 2, in one embodiment of the present invention, the liquid guide 90 contains an abrasive liquid, and the crystal polishing device is, for example, a chemical mechanical polishing device. The polishing liquid chemically reacts with the surface of the wafer 103, and the polishing head 50 is driven by the motor 40 to rotate, so that the surface of the wafer 103 rubs against the surface of the polishing pad 102, and the surface of the wafer 103 is polished flat.

Referring to fig. 3 and 4, in one embodiment of the utility model, cushion 602 is bonded to mounting ring 601 by a fitting 80. Firstly, the adhesive-backed plane of the cushion 602 faces upward and is sleeved into the cylinder of the second assembling shaft 802, and then the cushion 602 is moved to the interface between the first assembling shaft 801 and the second assembling shaft 802 (the contact plane between the second assembling shaft 802 and the assembling ring 601), but the cushion 602 is still kept sleeved in the second assembling shaft 802. The working plane of the assembly ring 601 is adjusted to face to one side of the adhesive-backed plane, and the assembly ring 601 is sleeved outside the cylinder of the first assembly shaft 801, so that the working plane and the adhesive-backed plane naturally contact. The cushion 602 is then lightly pressed onto the mounting ring 601 to initially stick it together. The polishing assembly 60 of the cushion 602 and the mounting ring 601 can then be removed and further secured against venting, etc., to precisely complete the concentric fit between the cushion 602 and the mounting ring 601.

Referring to fig. 1-4, in one embodiment of the utility model, the polishing pad 102 is placed on the polishing platen 101, the wafer 103 is placed on the polishing platen 101, specifically, engaged with the grooves 501, and the cushion pad 602 is pressed into contact with the wafer 103. After polishing starts, the polishing head 50 rotates, causing relative friction between the surface of the wafer 103 and the polishing pad 102. Meanwhile, the liquid guide tube 90 outputs different polishing liquids, and the polishing liquids chemically react with the surface of the wafer 103 (the side not in contact with the cushion pad 602), so that the surface of the wafer 103 is more easily polished. Through this process, polishing of the wafer 103 is completed.

In the description of the present specification, reference to the description of the terms "present embodiment," "example," "specific example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The embodiments of the utility model disclosed above are intended merely to aid in the explanation of the utility model. The examples are not intended to be exhaustive or to limit the utility model to the precise forms disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims (10)

1. A wafer polishing apparatus, characterized by comprising at least:

the polishing device comprises a polishing table, a polishing device and a polishing device, wherein a wafer is placed on the polishing table;

the polishing head is arranged on the grinding table, a groove is formed in one side of the polishing head, and the groove allows the wafer to be pressed in;

the polishing component is fixed in the groove; and

a fitting removably coupled to the polishing assembly;

wherein the polishing assembly comprises:

the assembling ring is fixed in the groove; and

the buffer pad is bonded on the working plane of the assembling ring, and the buffer pad and the assembling ring are concentrically arranged.

2. The wafer polishing apparatus as recited in claim 1, wherein the mounting ring is circular and an outer ring cylindrical surface of the mounting ring is fitted to a groove surface of the groove.

3. The wafer polishing apparatus as set forth in claim 1 wherein the cushion pad is circular in shape and the inner annular cylindrical surface of the cushion pad is concentric with the inner annular cylindrical surface of the mounting ring.

4. A wafer polishing apparatus as set forth in claim 1 wherein said cushion pad is located within the footprint of said mounting ring.

5. The wafer polishing apparatus as set forth in claim 1 wherein the fitting includes a first fitting shaft, the fitting ring being fitted over the first fitting shaft.

6. The wafer polishing apparatus as recited in claim 5, wherein the assembly member includes a second assembly shaft, the second assembly shaft is fixedly connected to the first assembly shaft, and the cushion pad is sleeved on the second assembly shaft.

7. The wafer polishing apparatus as set forth in claim 6 wherein the first fitting axis and the second fitting axis are coaxial.

8. The wafer polishing apparatus as set forth in claim 6 wherein the second fitting shaft has a larger shaft diameter than the first fitting shaft.

9. A wafer polishing apparatus as set forth in claim 1 wherein said cushion pad is crimped onto said wafer.

10. The wafer polishing apparatus as recited in claim 1, wherein a polishing pad is placed on a table of the polishing table, and the wafer is placed on the polishing pad.

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